Multi-main-line ultra-fine wire harness welding machine and welding method

Abstract

The present invention discloses a multi-main-line ultra-fine wire harness welding machine and welding method, belonging to the field of ultra-fine wire harness multi-main-line precision welding technology, including a positioning plate, a PCB board, an ultra-fine wire harness, a main line, a laser solder ball nozzle, an industrial CCD camera, a stereo light source, a solder point positioning display screen, a workbench and a guide rail, wherein the ultra-fine wire harness contains multiple main lines, the positioning plate is provided with three rows and three columns of positioning holes, the PCB board is provided with a plurality of pads with set angle differences, and the PCB board is placed under the positioning plate. Compared with the low efficiency of manual positioning and the errors and defects existing in manual welding, the positioning plate can be used to simultaneously position multiple main lines on multiple PCBs, greatly reducing the positioning time; the laser solder ball nozzle, the industrial CCD camera, and the stereo light source solder point positioning display screen can realize precise automatic welding, which is more convenient and quick, and significantly improves the welding efficiency and accuracy.

Description

Technical Field

[0001] The present invention belongs to the technical field of ultra-fine wire bundle (3) and multiple main wires (4) precision welding, and in particular relates to automatic positioning equipment and a welding method for a multiple main wire ultra-fine wire bundle welding machine. Background Art

[0002] With the widespread application of medical endoscopes in medical diagnosis and treatment, the characteristics of precision miniaturization, integration, customization and disposable endoscopes will become the future development trend of the industry. Among them, the welding of ultra-fine wire bundles (3) multiple main wires (4) and PCB boards (2) has become a technical barrier that urgently needs to be broken through. Since the PCB boards (2) to be welded in the prior art are small in size and of many types, it is difficult to locate and weld the solder joints and the ultra-fine wire bundles (3) multiple main wires (4).

[0003] Based on this, the present invention designs an automatic positioning device and a welding method for a multi-main-line ultra-fine wire harness welding machine to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that the positioning and welding of solder joints and multiple main wires (4) of ultra-fine wire bundles (3) are difficult due to the small size and variety of PCB boards (2) to be welded in the prior art, and to propose an automatic positioning device and welding method for a multi-main-wire ultra-fine wire bundle welding machine.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] An automatic positioning device and a welding method for a multi-main-line ultra-fine wire harness welding machine, comprising a positioning plate (1), a PCB board (2), an ultra-fine wire harness (3), multiple main wires (4), a laser solder ball nozzle (8), an industrial CCD camera (9), a stereoscopic light source (10), a soldering point soldering point positioning display screen (11), and a workbench (12); the ultra-fine wire harness (3) contains multiple main wires (4); the positioning plate (1) is provided with three rows and three columns of positioning holes (5); the PCB board (2) is provided with a plurality of solder pads (7) with set angle differences; and the PCB board (2) is placed below the positioning plate (1).

[0007] The positioning and welding method of a multi-main-line ultra-fine wire harness comprises the following steps: Step 1: On a workbench (12), after the insulating layer and the shielding layer on the ultra-fine wire harness (3) are peeled off, the head end of the ultra-fine wire harness (3) is passed through the positioning hole (5), and the positioning plate (1) and the PCB board (2) are overlapped to clamp the head end of the ultra-fine wire harness (3) to complete the fixed positioning. In the present invention, the ultra-fine wire harness (3) is clamped and positioned by using the positioning plate (1) and the PCB board (2), and the multi-main wires (4) are positioned and fixed by using the positioning scale (6) and the quick-drying glue. The plurality of main wires (4) correspond to the pads (7) on the PCB board (2) one by one, and the ultra-fine wire harness (3) is fixed in the positioning hole (5). The plurality of main wires (4) and the positioning plate (1) are positioned and bonded by using the quick-drying glue and the positioning scale (6), thereby completing the fixed positioning of the ultra-fine wire harness (3).

[0008] Step 2: The positioning plate (1) and the PCB board (2) are accurately attached and placed under the laser solder ball nozzle (8), the three-dimensional light source (10) illuminates the solder pad (7), the industrial CCD camera (9) collects the structured light image and position coordinates of the solder pad (7) and transmits them to the solder point positioning display screen (11) for identification and positioning, the solder point positioning display screen (11) controls the laser solder ball nozzle (8) to align with the solder pad (7) along the guide rail (13) according to the positioning data, and sprays high-temperature molten solder balls onto the solder pad (7), so that the ultra-fine wire bundle (3) is connected to the solder pad (7).

[0009] As a further description of the above technical solution:

[0010] Positioning scales (6) are provided on both sides of the positioning hole (5) for positioning the ultra-fine wire harness (3).

[0011] As a further description of the above technical solution:

[0012] The size of the positioning plate (1) is designed to be equal in length and width to the PCB board (2) and is used to fix the ultra-thin wire harness (3).

[0013] As a further description of the above technical solution:

[0014] Stamp lines are provided on both the upper and lower sides of the positioning hole (5), and the stamp lines are precisely arranged on the positioning plate (1).

[0015] As a further description of the above technical solution:

[0016] The number of the soldering pads (7) is six, and the six soldering pads (7) are evenly distributed on the PCB board (2) with a radial angle difference of 22.5°.

[0017] As a further description of the above technical solution:

[0018] The diameter of the welding pad (7) is 0.2 mm.

[0019] As a further description of the above technical solution:

[0020] The length of the ultra-fine wire bundle (3) is 760 mm, and the diameter of the main wire (4) is 0.1 mm.

[0021] As a further description of the above technical solution:

[0022] The PCB board (2) and the positioning board (1) are completely overlapped and clamped, and the center of the cross section of the main line (4) coincides with the center of the solder pad (7), which is used for positioning the main line (4).

[0023] As a further description of the above technical solution:

[0024] The stereoscopic light source (10) provides stereoscopic structured light, and provides stereoscopic structured light for collecting images and position coordinates of the welding pad (7).

[0025] As a further description of the above technical solution:

[0026] The industrial CCD camera (9) collects images and position coordinates of the welding pad (7) under the illumination of three-dimensional structured light.

[0027] As a further description of the above technical solution:

[0028] The laser solder ball nozzle (8) has a built-in solder ball with a diameter of 0.2 mm.

[0029] As a further description of the above technical solution:

[0030] The solder point positioning display screen (11) has built-in positioning recognition and control functions and is used to move the laser solder ball nozzle (8).

[0031] As a further description of the above technical solution:

[0032] The guide rail (13) is energized and magnetic, thereby facilitating the movement of the laser solder ball nozzle (8).

[0033] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0034] 1. In the present invention, the ultra-fine wire harness (3) is clamped, fixed and positioned by using a positioning plate (1) and a PCB board (2), and the multiple main wires (4) are positioned and fixed by using a positioning ruler (6) and quick-drying glue. Compared with the low efficiency of manual positioning, the positioning plate (1) is more convenient and faster to fix, greatly shortens the fixing time, and improves the positioning efficiency.

[0035] 2. In the present invention, the size of the positioning plate (1) is designed to be equal in length and width to the PCB board (2), so that the positioning plate (1) and the PCB board (2) are neatly fitted, which facilitates the fixation of the ultra-fine wire harness (3). At the same time, the size of the positioning plate (1) is the same as that of the PCB board (2), which greatly reduces the volume of the positioning plate (1) and facilitates the manufacture and use of the positioning plate (1).

[0036] 3. In the present invention, three rows and three columns of positioning holes (5) and a positioning scale (6) are designed on the positioning plate (1) to position and fix the ultra-fine wire harness (3), thereby avoiding positioning errors of the multiple main wires (4) and the pad (7) group caused by the inconsistency between the center of the ultra-fine wire harness (3) and the center of the multiple main wires (4), thereby achieving simultaneous positioning of the multiple main wires (4) on multiple PCBs.

[0037] 4. In the present invention, the stereoscopic light source (10) provides stereoscopic structured light, thereby achieving the purpose of providing the solder pad (7) with stereoscopic structured light, facilitating the solder pad (7) group to be collected in a good visual environment, facilitating the industrial CCD camera (9) to collect images and position information of the solder pad (7) under the illumination of the stereoscopic light source (10), and facilitating the positioning and alignment of the laser solder ball nozzle (8) and the solder pad (7).

[0038] 5. In the present invention, the solder point positioning display screen (11) has a built-in positioning recognition and control function. The industrial CCD camera (9) collects the image and position information of the solder pad (7) under the illumination of the stereo light source (10). The laser solder ball nozzle (8) is moved along the guide rail (13) to align with the solder pad (7) and spray high-temperature molten solder balls, so that the ultra-fine wire bundle (3) is connected to the solder pad (7), thereby achieving the purpose of accurate and automatic welding of the tiny solder pad (7) and the ultra-fine wire bundle (3). BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A three-dimensional structural schematic diagram of an automatic positioning device and a welding method for a multi-main-line ultra-fine wire harness welding machine proposed by the present invention;

[0040] Figure 2 The invention proposes an automatic positioning device and welding method for a multi-main line ultra-fine wire beam welding machine Figure 1 The enlarged structural diagram at A in the middle;

[0041] Figure 3 A schematic diagram of the three-dimensional structure from another perspective of an automatic positioning device and a welding method for a multi-main-line ultra-fine wire beam welding machine proposed by the present invention;

[0042] Figure 4 The invention provides an automatic positioning device and welding method for a multi-main line ultra-fine wire beam welding machine. Figure 2 The enlarged schematic diagram at C in the middle is a schematic diagram of the structure of the positioning ruler (6);

[0043] Figure 5 The invention proposes an automatic positioning device and welding method for a multi-main line ultra-fine wire beam welding machine Figure 2 Schematic diagram of the enlarged structure at point B.

[0044] Legend:

[0045] 1. Positioning plate; 2. PCB board; 3. Ultra-fine wire harness; 4. Main line; 5. Positioning hole; 6. Positioning ruler; 7. Solder pad; 8. Laser solder ball nozzle; 9. Industrial CCD camera; 10. Stereo light source; 11. Solder point positioning display screen; 12. Workbench; 13. Guide rail. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] See also Figure 1-Figure 4 The present invention provides a technical solution: a positioning method for a multi-main-line ultra-fine wire harness, comprising a positioning plate (1), a PCB board (2) and an ultra-fine wire harness (3), wherein the ultra-fine wire harness (3) contains a plurality of main wires (4), the positioning plate (1) is provided with three rows and three columns of positioning holes (5), the PCB board (2) is provided with a plurality of pads (7) with set angle differences, and the PCB board (2) is placed below the positioning plate (1);

[0048] The positioning method of the multi-main line ultra-fine wire harness includes the following steps:

[0049] Step 1: After the insulating layer and the shielding layer on the ultra-fine wire harness (3) are peeled off, the head end of the ultra-fine wire harness (3) is passed through the positioning hole (5), and the positioning plate (1) and the PCB board (2) are overlapped to clamp the head end of the ultra-fine wire harness (3) to complete the fixed positioning, and the plurality of main wires (4) correspond to the pads (7) on the PCB board (2) one by one. The ultra-fine wire harness (3) is fixed in the positioning hole (5), and the plurality of main wires (4) and the positioning plate (1) are positioned and bonded by quick-drying glue and a positioning ruler (6), thereby completing the fixed positioning of the ultra-fine wire harness (3);

[0050] Step 2: The positioning plate (1) and the PCB board (2) are accurately attached and placed under the laser solder ball nozzle (8), the three-dimensional light source (10) illuminates the solder pad (7), the industrial CCD camera (9) collects the structured light image and position coordinates of the solder pad (7) and transmits them to the solder point positioning display screen (11) for identification and positioning, the solder point positioning display screen (11) controls the laser solder ball nozzle (8) to align with the solder pad (7) along the guide rail (13) according to the positioning data, and sprays high-temperature molten solder balls onto the solder pad (7), so that the ultra-fine wire bundle (3) is connected to the solder pad (7).

[0051] Specifically, positioning scales (6) are provided on both sides of the positioning hole (5) for positioning the ultra-fine wire harness (3).

[0052] Specifically, the size of the positioning plate (1) is designed to be equal in length and width to the PCB board (2), and is used to fix the ultra-thin wire harness (3).

[0053] Specifically, stamp lines are provided on both the upper and lower sides of the positioning hole (5), and the stamp lines are precisely arranged on the positioning plate (1).

[0054] Specifically, the number of the soldering pads (7) is six, and the six soldering pads (7) are evenly distributed on the PCB board (2) with a radial angle difference of 22.5°.

[0055] Specifically, the diameter of the welding pad (7) is 0.2 mm.

[0056] Specifically, the length of the ultra-fine wire bundle (3) is 760 mm, and the diameter of the main wire (4) is 0.1 mm.

[0057] Specifically, the PCB board (2) and the positioning board (1) are completely overlapped and clamped, and the center of the cross section of the main line (4) coincides with the center of the solder pad (7), which is used for positioning the main line (4).

[0058] Specifically, the stereoscopic light source (10) provides stereoscopic structured light, which is used to collect images and position coordinates of the pad (7) to provide the stereoscopic structured light.

[0059] Specifically, the industrial CCD camera (9) collects images and position coordinates of the welding pad (7) under the illumination of three-dimensional structured light.

[0060] Specifically, the laser solder ball nozzle (8) has a built-in solder ball with a diameter of 0.2 mm.

[0061] Specifically, the solder point positioning display screen (11) has built-in positioning recognition and control functions, and is used to move the laser solder ball nozzle (8).

[0062] Specifically, the guide rail (13) is energized and magnetic, thereby facilitating the movement of the laser solder ball nozzle (8).

[0063] Working principle, when in use: by using the positioning plate (1) and the PCB board (2) to clamp and fix, and position the ultra-fine wire harness (3), and by using the positioning ruler (6) and quick-drying glue to position and fix the multiple main lines (4), compared with the low efficiency of manual positioning, using the positioning plate (1) to fix is ​​more convenient and quick, greatly shortens the fixing time, and improves the positioning efficiency. The size of the positioning plate (1) is designed to be equal in length and width to the PCB board (2), so that the positioning plate (1) and the PCB board (2) are neatly fitted, which is convenient for the ultra-fine wire harness ( The positioning plate (1) is designed to fix the ultra-fine wire harness (3), and the size of the positioning plate (1) is the same as the size of the PCB board (2), which greatly reduces the volume of the positioning plate (1) and facilitates the manufacture and use of the positioning plate (1). Three rows and three columns of positioning holes (5) and a positioning scale (6) are designed on the positioning plate (1) to locate and fix the ultra-fine wire harness (3), thereby avoiding the positioning error of the multiple main wires (4) and the pad (7) group caused by the inconsistency between the center of the ultra-fine wire harness (3) and the center of the multiple main wires (4), thereby realizing the simultaneous positioning of the multiple main wires (4) on multiple PCBs. The positioning plate (1) and the PCB board (2) are accurately attached and placed under the laser solder ball nozzle (8), and the three-dimensional light source (10) illuminates the solder pad (7) group to provide the solder pad (7) group with three-dimensional structured light, so that the solder pad (7) group is in a good visual environment, which is conducive to the industrial CCD camera (9) collecting the structured light image and position coordinates of the solder pad (7) group to the solder point positioning display screen (11) for identification and positioning. The solder point positioning display screen (11) controls the laser solder ball nozzle (8) to align with the solder pad (7) along the guide rail (13) according to the positioning data, and sprays high-temperature molten solder balls onto the solder pad (7). The ultra-fine wire bundle (3) is connected to the solder pad (7), so as to achieve the purpose of accurate and automatic welding of the tiny solder pad (7) and the ultra-fine wire bundle (3).

[0064] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A positioning and welding method using a multi-main-line ultra-fine wire harness welding machine, It is characterized in that Multi-main line ultra-fine wire harness welding machine includes: A positioning plate (1), a PCB board (2), an ultra-fine wire harness (3), a main wire (4), a laser solder ball nozzle (8), an industrial CCD camera (9), a stereoscopic light source (10), a solder point positioning display screen (11), a workbench (12) and a guide rail (13), wherein the ultra-fine wire harness (3) contains a plurality of main wires (4), the positioning plate (1) is provided with three rows and three columns of positioning holes (5), the PCB board (2) is provided with a plurality of solder pads (7) with set angle differences, the PCB board (2) is placed below the positioning plate (1), and positioning scales (6) are provided on both sides of the positioning holes (5) for positioning the ultra-fine wire harness (3); The method comprises the following steps: Step 1: On a workbench (12), after the insulating layer and the shielding layer on the ultra-fine wire harness (3) are peeled off, the head end of the ultra-fine wire harness (3) is passed through the positioning hole (5), and the positioning plate (1) and the PCB board (2) are overlapped to clamp the head end of the ultra-fine wire harness (3) to complete the fixed positioning, and the main line (4) is positioned and fixed by a positioning ruler (6) and quick-drying glue, and the plurality of main lines (4) correspond to the pads (7) on the PCB board (2) one by one, and the ultra-fine wire harness (3) is fixed in the positioning hole (5), and the plurality of main lines (4) and the positioning plate (1) are positioned and bonded by quick-drying glue and the positioning ruler (6), thereby completing the fixed positioning of the ultra-fine wire harness (3); Step 2: The positioning plate (1) and the PCB board (2) are accurately attached and placed under the laser solder ball nozzle (8), the three-dimensional light source (10) illuminates the solder pad (7), the industrial CCD camera (9) collects the structured light image and position coordinates of the solder pad (7) and transmits them to the solder point positioning display screen (11) for identification and positioning, the solder point positioning display screen (11) controls the laser solder ball nozzle (8) to align with the solder pad (7) along the guide rail (13) according to the positioning data, and sprays high-temperature molten solder balls onto the solder pad (7), so that the ultra-fine wire bundle (3) is connected to the solder pad (7).

2. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The size of the positioning plate (1) is designed to be equal in length and width to the PCB board (2), and is used to fix the ultra-thin wire harness (3).

3. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that Stamp lines are provided on both the upper and lower sides of the positioning hole (5), and the stamp lines are precisely arranged on the positioning plate (1).

4. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The number of the soldering pads (7) is six, and the six soldering pads (7) are evenly distributed on the PCB board (2) with a radial angle difference of 22.5°.

5. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The diameter of the welding pad (7) is 0.2 mm.

6. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The length of the ultra-fine wire bundle (3) is 760 mm, and the diameter of the main wire (4) is 0.1 mm.

7. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The stereo light source (10) provides stereo structured light, thereby providing good lighting conditions for collecting images and position coordinates of the pad (7).

8. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The industrial CCD camera (9) collects the pad image and position coordinates under the irradiation of the three-dimensional structured light.

9. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The laser solder ball nozzle (8) has a built-in solder ball with a diameter of 0.2 mm.

10. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The solder point positioning display screen (11) has built-in positioning recognition and control functions and is used to move the laser solder ball nozzle (8).

11. A positioning and welding method using a multi-main-line ultra-fine wire beam welding machine according to claim 1, It is characterized in that The guide rail (13) is energized and magnetic, which facilitates the movement of the laser solder ball nozzle (8).

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