A cooling device for overflow method substrate glass molding and its use method

By setting rotatable inner and outer insulation layers on the water pipe assembly, the problems of inconvenient operation and inaccurate cooling of traditional cooling water pipes are solved, and efficient and precise glass cooling effect is achieved, which is suitable for high-generation substrate glass production.

CN116750959BActive Publication Date: 2025-09-30IRICO DISPLAY DEVICES CO LTD
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Patent Information

Application Number
CN202310728542.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-19
Publication Date
2025-09-30
Estimated Expiration
2043-06-19

AI Technical Summary

Technical Problem

Traditional cooling water pipes are inconvenient to operate and have imprecise cooling in the production of high-generation substrate glass, making it difficult to meet high quality requirements.

Method used

The water pipe body is covered with rotatable inner and outer insulation layers. The opening size and angle can be adjusted by rotation to achieve flexible control of the cooling effect and avoid deformation of the water pipe under high temperature conditions.

Benefits of technology

The pre-installed operation of the cooling device is realized, the intensity of high-temperature operation is reduced, the cooling accuracy and efficiency are improved, and the demand for high-quality glass production is met.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a cooling device for overflow-processed substrate glass molding and a method for using the same, belonging to the field of glass manufacturing technology. The present invention discloses a cooling device for overflow-processed substrate glass molding. The device is pre-installed in molding equipment before production. During production, the device can adjust the rotation of the heat insulation device according to the glass production status to control the insulation angle and opening size of the water pipe body, thereby achieving the purpose of lowering the temperature of the glass plate area. At the same time, the plugging and unplugging of the water pipe in a hot state can be avoided, which can greatly reduce the workload. The water pipe assembly can be pre-installed in multiple groups. In actual production, the combination can be adjusted according to the glass temperature adjustment requirements, that is, different opening sizes and different angles can be combined to cool different parts of the glass plate.
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Description

Technical Field

[0001] The invention belongs to the technical field of glass manufacturing, and in particular relates to a cooling device for overflow method substrate glass molding and a use method thereof. Background Art

[0002] In overflow production, when molten glass flows out from both sides of the overflow device and converges at the tip of the brick, the viscoelastic glass needs to be quickly cooled and shaped to form a glass plate with a smooth surface. Traditional technology is to add cooling water pipes on both sides of the glass plate according to the state of the glass plate for rapid cooling. However, with the development of high-generation substrate glass, the length of the molding equipment is getting longer and longer, the board feeding speed is getting faster and faster, and the quality requirements are getting higher and higher. The process of using traditional process cooling water pipes for cooling is as follows: Figure 1 As shown, the high-generation substrate glass plate is wide, and the corresponding forming equipment is long. When the molten glass flows down from the overflow brick 2, it needs to be quickly cooled and shaped. The traditional technology is to insert one or more groups of cooling water pipes 3 through the furnace body 4 during the glass descent. The cooling water pipes are generally metal pipes and are heavy. In addition, the on-site ambient temperature is high, and the operation is difficult. Frequent plugging and unplugging operations cause large fluctuations in the temperature field in the furnace, and the temperature field adjustment effect is poor. If pre-installed in advance, deformation will occur without cooling water, resulting in malfunction.

[0003] Traditional process cooling water pipes have the problem of increasing difficulty in on-site operations and inconvenient operation. Secondly, there is the problem of imprecise cooling area, which cannot meet high quality requirements. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a cooling device for overflow method substrate glass molding and a method of using the same, so as to solve the problems of inconvenient operation and inaccurate cooling caused by the existing cooling water pipes.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention discloses a cooling device for overflow method substrate glass molding, comprising a plurality of water pipe assemblies, wherein the plurality of water pipe assemblies pass through a furnace body and are arranged on both sides of an overflow brick;

[0007] The water pipe assembly includes a water pipe body and a rotatable heat insulation device; the water pipe body passes through the furnace body, and both ends of the water pipe body are fixed outside the furnace body; the heat insulation device partially or completely covers the outer surface of the water pipe body after rotation.

[0008] Furthermore, the rotatable thermal insulation device includes an inner thermal insulation layer and an outer thermal insulation layer; the inner thermal insulation layer is rotatably arranged on the outer surface of the water pipe body; the outer thermal insulation layer is rotatably arranged on the outer surface of the inner thermal insulation layer; the inner thermal insulation layer and the outer thermal insulation layer partially or completely cover the outer surface of the water pipe body after rotation.

[0009] Furthermore, the two ends of the water pipe body are fixed on the outside of the furnace body by an upper holding ring and a lower holding ring; the upper holding ring and the lower holding ring are fixed on the outside of the furnace body and form a ring, and the two ends of the water pipe body are fixed to the center of the ring by fixing nuts.

[0010] Furthermore, the inner heat insulation layer and the outer heat insulation layer pass through the furnace body, and both ends are rotatably arranged outside the furnace body through an inner rotating device and an outer rotating device respectively.

[0011] Furthermore, the inner rotation device includes an inner rotation handle and an inner rotation groove; the inner rotation groove is arranged outside the furnace body, and the inner rotation handle is inserted into the inner rotation groove and connected to the inner insulation layer.

[0012] Furthermore, an internal fixing nut is provided at one end of the inner rotating handle, and after the inner rotating handle is rotated to a specific position, the position is locked by the internal fixing nut.

[0013] Furthermore, the external rotation device includes an external rotation handle and an external rotation groove; the external rotation groove is arranged outside the furnace body, and the external rotation handle is inserted into the external rotation groove and connected to the external heat insulation layer.

[0014] Furthermore, an external fixing nut is provided at one end of the external rotating handle; after the external rotating handle is rotated to a specific position, the position is locked by the external fixing nut.

[0015] The present invention also discloses a method for using the above-mentioned cooling device for overflow-process substrate glass molding, comprising the following steps:

[0016] First, before the glass forming equipment heats up, several water pipe assemblies are passed through the furnace body and installed on both sides of the overflow brick; then the water pipe body is fixed to the outside of the furnace body, and the thermal insulation device is rotated to completely cover the outer surface of the water pipe body, and the thermal insulation device is locked; cooling water is introduced into the water pipe body. When the glass flows out from the molten glass outlet and flows down from the tip of the overflow brick, the thermal insulation device is rotated according to the actual temperature field requirements so that the water pipe body facing the glass is partially exposed, and heat is removed by heat exchange through the cooling water in the water pipe body to achieve the purpose of cooling.

[0017] Furthermore, the heat insulation device includes an inner heat insulation layer and an outer heat insulation layer; the inner heat insulation layer and the outer heat insulation layer are rotatably arranged by an inner rotation device and an outer rotation device arranged outside the furnace body; the inner rotation device includes an inner rotation handle and an inner rotation groove; one end of the inner rotation handle is provided with an inner fixing nut; the outer rotation device includes an outer rotation handle and an outer rotation groove; one end of the outer rotation handle is provided with an outer fixing nut;

[0018] The inner and outer insulation layers are rotated by turning the inner and outer rotating handles to completely cover the outer surface of the water pipe body, and the inner and outer insulation layers are locked by the inner and outer fixing nuts;

[0019] When the glass flows out from the molten glass outlet and flows down from the tip of the overflow brick, according to the actual temperature field requirements, the inner and outer insulation layers are rotated by turning the inner and outer rotating handles, so that the water pipe body is partially exposed facing the glass, and the cooling water in the water pipe body is used for heat exchange to remove heat and achieve the purpose of cooling.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention discloses a cooling device for overflow method substrate glass molding. The device is pre-installed in the molding equipment before production. At the same time, during production, the insulation angle and opening size of the water pipe body can be controlled by adjusting the rotation of the insulation device according to the glass production status, so as to achieve the purpose of lowering the temperature of the glass plate area, and at the same time avoid the plugging and unplugging of the water pipe in a hot state, which can greatly reduce the work intensity; the water pipe assembly can be pre-installed in multiple groups, and in actual production, the combination can be adjusted according to the glass temperature adjustment requirements, that is, different opening sizes and different angles can be combined to cool different parts of the glass plate.

[0022] Furthermore, the insulation device is set to have two layers, namely the inner insulation layer and the outer insulation layer, and both can rotate around the water pipe in the middle. By rotating, the opening size can be changed, and the opening direction can be changed to face or form a certain angle with the glass to achieve different cooling effects; when the glass plate does not need to be cooled, the cooling water pipe can be completely covered by rotating the inner and outer insulation boards to avoid deformation of the water pipe under high temperature conditions.

[0023] The present invention also discloses a method for using the above-mentioned cooling device for overflow method substrate glass forming. When in use, it can be pre-installed in the early stage of production. When the glass plate does not need to be cooled, the cooling water pipe is completely covered by rotating the inner and outer insulation plates to avoid deformation of the water pipe under high temperature conditions; at the same time, according to the actual temperature field requirements, the rotating insulation device can flexibly control the cooling effect. The method of use is simple to operate and has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of a cooling device in the prior art;

[0025] Figure 2 This is a schematic structural diagram of a cooling device for overflow method glass substrate molding according to the present invention;

[0026] Figure 3 This is a schematic diagram of the positions of the outer rotating handle and the inner rotating handle of the present invention;

[0027] Figure 4 It is a cross-sectional schematic diagram of the inner insulation layer, the outer insulation layer and the water pipe body;

[0028] Figure 5 This is a structural diagram showing the entire water pipe body being covered by rotating inner and outer insulation layers;

[0029] Figure 6 This is a schematic diagram of the structure when the inner and outer insulation layers are rotated so that the opening of the water pipe body facing the glass plate is maximized;

[0030] Figure 7 This is a schematic diagram of the structure when the inner and outer insulation layers are rotated so that the water pipe body faces the upper part of the glass plate;

[0031] Figure 8 This is a schematic diagram of the structure when the inner and outer insulation layers are rotated so that the water pipe body faces the middle of the glass plate;

[0032] Among them: 1-molten glass outlet; 2-overflow brick; 3-cooling water pipe; 4-furnace body; 5-external insulation layer; 6-inner insulation layer; 7-water pipe body; 51-external rotation groove; 52-external rotation handle; 53-external fixing nut; 61-inner rotation handle; 62-inner rotation groove; 63-inner fixing nut; 71-upper holding ring; 72-lower holding ring; 73-fixing nut. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0035] The present invention discloses a cooling device for overflow method substrate glass molding, comprising one or more water pipe assemblies, which can be pre-installed in the early stage of production, pass through a furnace body 4, and are distributed on both sides of a glass plate; wherein the water pipe assembly comprises a water pipe body 7 and a rotatable heat insulation device; the water pipe body 7 passes through the furnace body 4, and both ends of the water pipe body 7 are fixed outside the furnace body 4; the heat insulation device partially or completely covers the outer surface of the water pipe body 7 after rotation, locking the heat insulation device; cooling water is introduced into the water pipe body 7, and when the glass flows out of the molten glass outlet 1 and flows down from the brick tip of the overflow brick 2, the heat insulation device is rotated according to the actual temperature field requirements so that the water pipe body 7 is partially exposed facing the glass, and heat is removed by heat exchange through the cooling water in the water pipe body 7, thereby achieving the purpose of cooling.

[0036] Preferably, the rotatable thermal insulation device is composed of an inner thermal insulation layer 6 and an outer thermal insulation layer 5; the inner thermal insulation layer 6 is on the outer surface of the water pipe body 7 and can rotate around the water pipe body 7; the outer thermal insulation layer 5 is on the outer surface of the inner thermal insulation layer 6 and can rotate around the water pipe body 7; the inner thermal insulation layer 6 and the outer thermal insulation layer 5 form openings of different sizes on the outer surface of the water pipe body 7 after rotation, partially or completely covering the outer surface of the water pipe body 7 to achieve different cooling capacities; the inner and outer thermal insulation layers can rotate to form different angles, and can cool the glass plates in different areas.

[0037] Preferably, Figures 2 to 4 As shown, the water pipe body 7 is fixed by an upper holding ring 71 and a lower holding ring 72 arranged on the outside of the furnace body, and a fixing nut 73 is provided on the holding ring. The rotating handle 52 of the outer insulation layer 5 is fixed in the rotating groove 51, and a rear fixing nut 53 is provided on the outer handle. The rotating handle 61 of the inner insulation layer 6 is fixed in the inner rotating groove 62, and a rear fixing nut 63 is provided on the handle. When the insulation layer is rotated into place, the position is locked by the rear fixing nut 63.

[0038] The above-mentioned water pipe components can be pre-assembled in multiple groups, and in actual production, they can be combined and adjusted according to the glass temperature adjustment requirements, that is, combinations of different opening sizes and different angles can be made to cool different parts of the glass plate.

[0039] During use, first, before the glass forming equipment heats up, several water pipe assemblies are passed through the furnace body 4 and installed on both sides of the overflow brick 2; then the water pipe body 7 is fixed to the outside of the furnace body 4, and the inner insulation layer 6 and the outer insulation layer 5 are rotated by turning the inner rotating handle 61 and the outer rotating handle 52 to completely cover the outer surface of the water pipe body 7, and the inner insulation layer 6 and the outer insulation layer 5 are locked by the inner fixing nut 63 and the outer fixing nut 53; cooling water is introduced into the water pipe body 7, and when the glass flows out from the molten glass outlet 1 and flows down from the brick tip of the overflow brick 2, the inner insulation layer 6 and the outer insulation layer 5 are rotated by turning the inner rotating handle 61 and the outer rotating handle 52, so that the water pipe body 7 facing the glass is partially exposed, and heat is taken away by heat exchange with the cooling water in the water pipe body 7 to achieve the purpose of cooling.

[0040] The present invention is described in further detail below with reference to the accompanying drawings:

[0041] As a preferred embodiment, Figure 5 As shown, the inner insulation layer 6 and the outer insulation layer 5 are rotated to completely wrap the water pipe body 7, and the cooling water inside the water pipe will not affect the temperature field of the glass plate.

[0042] As a preferred embodiment, Figure 6 As shown, when the glass plate needs to be cooled as quickly as possible, the inner insulation layer 6 and the outer insulation layer 5 are rotated, and the inner insulation layer 6 is completely inserted into the outer insulation layer 5, so that the opening of the water pipe body 7 facing the glass plate is maximized to achieve the fastest cooling effect.

[0043] As a preferred embodiment, Figure 7 and Figure 8 As shown, according to the different areas of the glass plate that actually need to be cooled, the inner insulation layer 6 and the outer insulation layer 5 are rotated to change the angle between the opening and the glass plate to achieve the cooling effect on the glass plates in different areas (the dotted lines correspond to the parts 22 and 23 in the figure).

[0044] The above content is only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A cooling device for overflow method substrate glass molding, characterized in that: It comprises a plurality of water pipe assemblies, wherein the plurality of water pipe assemblies pass through the furnace body (4) and are arranged on both sides of the overflow brick (2); The water pipe assembly comprises a water pipe body (7) and a rotatable heat insulating device; the water pipe body (7) passes through the furnace body (4), and both ends of the water pipe body (7) are fixed outside the furnace body (4); the heat insulating device partially or completely covers the outer surface of the water pipe body (7) after rotation; The rotatable heat-insulating device comprises an inner heat-insulating layer (6) and an outer heat-insulating layer (5); the inner heat-insulating layer (6) is rotatably arranged on the outer surface of the water pipe body (7); the outer heat-insulating layer (5) is rotatably arranged on the outer surface of the inner heat-insulating layer (6); the inner heat-insulating layer (6) and the outer heat-insulating layer (5) partially or completely cover the outer surface of the water pipe body (7) after rotation; The two ends of the water pipe body (7) are fixed to the outside of the furnace body (4) by an upper holding ring (71) and a lower holding ring (72); the upper holding ring (71) and the lower holding ring (72) are fixedly arranged on the outside of the furnace body (4) to form a ring shape, and the two ends of the water pipe body (7) are fixed to the center of the ring shape by fixing nuts (73); The inner heat insulation layer (6) and the outer heat insulation layer (5) pass through the furnace body (4), and both ends are rotatably arranged outside the furnace body (4) via an inner rotating device and an outer rotating device respectively; The inner rotation device comprises an inner rotation handle (61) and an inner rotation groove (62); the inner rotation groove (62) is arranged outside the furnace body (4), and the inner rotation handle (61) is inserted into the inner rotation groove (62) and connected to the inner heat insulation layer (6); The external rotation device comprises an external rotation handle (52) and an external rotation groove (51); the external rotation groove (51) is arranged outside the furnace body (4), and the external rotation handle (52) is inserted into the external rotation groove (51) and connected to the external heat insulation layer (5).

2. The cooling device for overflow glass substrate molding according to claim 1, characterized in that: An inner fixing nut (63) is provided at one end of the inner rotating handle (61), and after the inner rotating handle (61) is rotated to a specific position, the position is locked by the inner fixing nut (63).

3. The cooling device for overflow glass substrate molding according to claim 1, characterized in that: An external fixing nut (53) is provided at one end of the external rotating handle (52); after the external rotating handle (52) is rotated to a specific position, the position is locked by the external fixing nut (53).

4. The method for using the cooling device for overflow glass substrate molding according to claim 1, characterized in that: The following steps are involved: First, before the glass forming equipment is heated, several water pipe assemblies are passed through the furnace body (4) and installed on both sides of the overflow brick (2); then the water pipe body (7) is fixed to the outside of the furnace body (4), and the heat insulation device is rotated to completely cover the outer surface of the water pipe body (7), and the heat insulation device is locked; cooling water is introduced into the water pipe body (7), and when the glass flows out from the molten glass outlet (1) and flows down from the brick tip of the overflow brick (2), the heat insulation device is rotated according to the actual temperature field requirements so that the water pipe body (7) is partially exposed facing the glass, and heat is removed by heat exchange through the cooling water in the water pipe body (7), thereby achieving the purpose of cooling.

5. The method for using the cooling device for overflow glass substrate molding according to claim 4, characterized in that: The heat insulation device comprises an inner heat insulation layer (6) and an outer heat insulation layer (5); the inner heat insulation layer (6) and the outer heat insulation layer (5) are rotatably arranged by an inner rotation device and an outer rotation device arranged outside the furnace body (4); the inner rotation device comprises an inner rotation handle (61) and an inner rotation groove (62); an inner fixing nut (63) is arranged at one end of the inner rotation handle (61); the outer rotation device comprises an outer rotation handle (52) and an outer rotation groove (51); an outer fixing nut (53) is arranged at one end of the outer rotation handle (52); The inner heat insulation layer (6) and the outer heat insulation layer (5) are rotated by rotating the inner rotation handle (61) and the outer rotation handle (52) to completely cover the outer surface of the water pipe body (7), and the inner heat insulation layer (6) and the outer heat insulation layer (5) are locked by the inner fixing nut (63) and the outer fixing nut (53); When the glass flows out from the molten glass outlet (1) and flows down from the tip of the overflow brick (2), according to the actual temperature field requirements, the inner insulation layer (6) and the outer insulation layer (5) are rotated by rotating the inner rotation handle (61) and the outer rotation handle (52), so that the water pipe body (7) is partially exposed facing the glass, and the cooling water in the water pipe body (7) is used to carry away heat through heat exchange, thereby achieving the purpose of cooling.

Citation Information

Patent Citations

  • Cooling device for forming substrate glass by overflow method

    CN220245911U