Display panel, manufacturing method thereof and display device with the same

Abstract

The application discloses a display panel, a manufacturing method thereof and a display device with the same. In the display panel, a first substrate is located on one side of a second substrate, a first area between the first substrate and the second substrate is arranged in a non-display area, a first part of a conductive layer is arranged in the first area, the first part is in contact with the second substrate, a second part of the conductive layer is arranged on a side of the first area away from the display area, the second substrate is electrically connected with a circuit board through the second part, a side of the conductive layer close to the first substrate has a first surface, a side of the conductive layer close to the second substrate has a second surface, a flexible material layer is arranged on a side of the first surface facing the first substrate and / or a side of the second surface facing the second substrate, part of the flexible material layer is arranged in the first area, and the remaining flexible material layer is arranged outside the first area. The display panel solves the problem that the display panel has a large frame size due to the influence of conductive adhesive in the process.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the same, and a display device having the same. Background Technology

[0002] Display panels are widely used due to their advantages such as high brightness, high contrast, and low cost. The inner surface of the color filter (CF) substrate in a display panel contains many electrical signals. These signals are typically conducted to the thin-film transistor (TFT) substrate via conductive adhesive, and then connected to the panel edge via metal traces on the TFT substrate side to form pins that are bonded to the flexible printed circuit (FPC). However, in the conductive adhesive dispensing process, deviations in the adhesive application position can lead to poor positional accuracy. To ensure that all signal lines are evenly covered by the conductive adhesive, the adhesive application area needs to be increased to avoid any uncovered signal lines in the edge areas of the CF substrate surface. This necessitates a further increase in the bezel width of the display panel along with the adhesive application area, resulting in a larger display panel size. Summary of the Invention

[0003] This application provides a display panel, a method for manufacturing the same, and a display device having the same, to solve the problem in the related art where the bezel size of the display panel is large due to the influence of conductive adhesive in the manufacturing process.

[0004] According to one aspect of this application, a display panel is provided, including a display area and a non-display area, the non-display area surrounding the display area. The display panel includes a first substrate, a second substrate, a flexible material layer, a conductive layer, and a circuit board, wherein:

[0005] The first substrate is located on one side of the second substrate. The non-display area has a first region located between the first substrate and the second substrate. There is a gap between the first substrate and the second substrate. The display area of ​​the display panel is located in the gap, and is used to set display elements such as display function layers.

[0006] The conductive layer extends along a first direction, and a first portion of the conductive layer is located in a first region. The first portion is in contact with the second substrate. A second portion of the conductive layer is located on the side of the first region away from the display area. The second substrate is electrically connected to the circuit board through the second portion. Since the circuit board is located outside the regions corresponding to the first substrate and the second substrate, a direct connection with the circuit board is achieved by placing a portion of the conductive layer outside the first region. Thus, the electrical connection between the second substrate and the circuit board is achieved through the conductive layer.

[0007] The conductive layer has a first surface on the side near the first substrate and a second surface on the side near the second substrate. A flexible material layer is located on the side of the first surface facing the first substrate and / or the side of the second surface facing the second substrate. The flexible material layer has a first projection area located in the first surface and / or the second surface. The first projection area at least partially overlaps with the first surface and / or the second surface. The flexible material layer is located in a non-display area. Part of the flexible material layer is located in the first area, and the remaining flexible material layer is located outside the first area. It is understood that the aforementioned flexible material layer can be located on the first surface of the conductive layer, or on the second surface of the conductive layer opposite to the first surface, or simultaneously on both the first and second surfaces. Since the aforementioned flexible material layer is located on at least one surface of the conductive layer, the conductive layer can be led out to the areas corresponding to the two opposing first and second substrates through the flexible material layer.

[0008] According to another aspect of this application, a method for manufacturing a display panel is provided, comprising the following steps:

[0009] A display panel motherboard is provided. The display panel motherboard includes a first initial substrate, a second initial substrate, an initial conductive layer, and an initial flexible material layer. The first initial substrate and the second initial substrate are disposed opposite to each other, and the initial conductive layer and the initial flexible material layer are located between the first initial substrate and the second initial substrate.

[0010] The display panel motherboard is cut in the first step to obtain multiple display panel units;

[0011] A second cut is made along the cutting line of the display panel unit to remove the area to be cut from the display panel unit, resulting in the aforementioned display panel.

[0012] The above-mentioned production method also includes:

[0013] Between the first and second cutting steps, at least the end of the second portion of the corresponding initial conductive layer of the second initial substrate is removed, so that the initial flexible material layer and the first initial substrate protrude from the second initial substrate. The second initial substrate is electrically connected to the circuit board through the second portion. After the second cutting step, the first initial substrate forms the first substrate in the display panel, the second initial substrate forms the second substrate in the display panel, the initial flexible material layer forms the flexible material layer in the display panel, and the initial conductive layer forms the conductive layer in the display panel; or

[0014] After the second cutting step, the end of the second portion of the conductive layer in the corresponding display panel of the second initial substrate is removed, and the remaining second initial substrate constitutes the second substrate in the display panel. The second substrate is electrically connected to the circuit board through the second portion.

[0015] According to another aspect of this application, a display device is also provided, including a display panel as described above.

[0016] In the display panel provided in this application embodiment, a first region is located between a first substrate and a second substrate in the non-display area. A portion of the conductive layer located in the first region is in contact with the second substrate, and the portion of the conductive layer located outside the display area and the first region is electrically connected to the circuit board. A flexible material layer is located on at least one side surface of the conductive layer. On the one hand, since a portion of the flexible material layer is located outside the first region, this portion of the flexible material layer can at least partially cover the conductive layer extending outside the first region. This protects the conductive layer and achieves a stable electrical connection between the conductive layer and the circuit board. Furthermore, the conductive layer enables the electrical connection between the second substrate and the circuit board in the display panel, allowing electrical signals in the second substrate to be directly conducted to the circuit board through the conductive layer. This design avoids the limitation of the display panel's bezel width, preventing the bezel width from increasing with the application area of ​​the conductive adhesive due to the poor positioning accuracy of the conductive adhesive used to conduct electrical signals through the bezel. This facilitates further reduction in bezel size. On the other hand, since a portion of the flexible material layer is located in the first region, a flexible material layer can be provided between the conductive layer and the second substrate. When the conductive layer bends towards the second substrate according to usage requirements, this flexible material layer can alleviate the stress generated by the bending of the conductive layer, improving the touch accuracy of the display panel. Furthermore, since the portion of the conductive layer outside the first region can be bent, this further reduces the bezel width of the display panel. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 This is a cross-sectional structural diagram of a display panel according to an embodiment of this application;

[0019] Figure 2 yes Figure 1 The diagram shows the positional relationship between the display area and the non-display area in the display panel.

[0020] Figure 3 yes Figure 1 The diagram shows the arrangement relationship between the conductive layer and the flexible material layer in the display panel.

[0021] Figure 4 yes Figure 1 The diagram shows a schematic of the conductor layer in the display panel.

[0022] Figure 5This is a cross-sectional structural diagram of another display panel provided according to an embodiment of this application;

[0023] Figure 6 yes Figure 5 The diagram shows the arrangement relationship between the conductive layer and the flexible material layer in the display panel.

[0024] Figure 7 yes Figure 5 The diagram shows the relationship between the edge region of the conductive layer and the flexible material layer in the display panel.

[0025] Figure 8 yes Figure 5 The diagram shows a cross-sectional structure of the conductor layer in the display panel after it has been bent.

[0026] Figure 9 yes Figure 8 The diagram shows the arrangement relationship between the conductive layer and the flexible material layer in the display panel.

[0027] Figure 10 This is a cross-sectional structural schematic diagram of another display panel provided according to an embodiment of this application;

[0028] Figure 11 This is a cross-sectional structural schematic diagram of another display panel provided according to an embodiment of this application;

[0029] Figure 12 This is a schematic diagram showing the positional relationship between a first substrate, a second substrate, and a flexible extension of a flexible material layer in a display panel according to an embodiment of this application.

[0030] Figure 13 This is a schematic diagram showing the positional relationship between the first substrate, the second substrate, and the flexible extension of the flexible material layer in another display panel according to an embodiment of this application.

[0031] Figure 14 This is a schematic diagram illustrating the positional relationship between the flexible extension of a flexible material layer in a display panel and a circuit board, according to an embodiment of this application.

[0032] Figure 15 This is a cross-sectional structural diagram of a display panel with a protective film according to an embodiment of this application;

[0033] Figure 16 This is a schematic cross-sectional view of a display area in a display panel according to an embodiment of this application;

[0034] Figure 17 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0035] Figure 18This is a flowchart illustrating another method for manufacturing a display panel according to an embodiment of this application;

[0036] Figure 19 This is a schematic diagram of a display device provided in an embodiment of this application.

[0037] The above figures include the following reference numerals:

[0038] 10. First substrate; 101. Display area; 102. Non-display area; 103. First region; 110. First substrate; 120. Driving array; 20. Second substrate; 210. Second substrate; 220. Color filter layer; 30. Flexible material layer; 310. First flexible layer; 320. Second flexible layer; 330. Flexible extension; 40. Conductor layer; 401. First surface; 402. Second surface; 403. Third surface; 404. Fourth surface; 405. Fifth surface Surface; 406, sixth surface; 407, seventh surface; 410, first conductive section; 420, first connecting section; 421, edge region; 430, second conductive section; 431, first conductive segment; 432, bent segment; 433, second conductive segment; 440, second connecting section; 450, third conductive section; 50, circuit board; 60, encapsulation layer; 610, main body; 620, protrusion; 70, electrode; 80, protective film; 90, liquid crystal layer; 10000, display device. Detailed Implementation

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0041] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0042] According to an embodiment of this application, a display panel is provided, including a display area and a non-display area, wherein the non-display area surrounds the display area. The display panel includes a first substrate, a second substrate, a flexible material layer, a conductive layer, and a circuit board, wherein:

[0043] The first substrate is located on one side of the second substrate. The non-display area has a first region located between the first substrate and the second substrate. There is a gap between the first substrate and the second substrate. The display area of ​​the display panel is located in the gap, and is used to set display elements such as display function layers.

[0044] The conductive layer extends along a first direction, and a first portion of the conductive layer is located in a first region. The first portion is in contact with the second substrate. A second portion of the conductive layer is located on the side of the first region away from the display area. The second substrate is electrically connected to the circuit board through the second portion. Since the circuit board is located outside the regions corresponding to the first substrate and the second substrate, a direct connection with the circuit board is achieved by placing a portion of the conductive layer outside the first region. Thus, the electrical connection between the second substrate and the circuit board is achieved through the conductive layer.

[0045] The conductive layer has a first surface on the side near the first substrate and a second surface on the side near the second substrate. A flexible material layer is located on the side of the first surface facing the first substrate and / or the side of the second surface facing the second substrate. The flexible material layer has a first projection area located on the first surface and / or the second surface. The first projection area at least partially overlaps with the first surface and / or the second surface. The flexible material layer is located in a non-display area. A portion of the flexible material layer is located in the first area, and the remaining flexible material layer is located outside the first area. It is understood that the aforementioned flexible material layer can be located on the first surface of the conductive layer, or on the second surface of the conductive layer opposite to the first surface, or simultaneously on both the first and second surfaces. Since the aforementioned flexible material layer is located on at least one side surface of the conductive layer, the conductive layer is led out to the areas corresponding to the two opposing first and second substrates through the flexible material layer.

[0046] It should be noted that the first region mentioned above only includes the space between the first substrate and the second substrate, and in a direction parallel to the second substrate, the first region extends along the edge of the second substrate toward the non-display area.

[0047] In the above embodiments, the non-display area has a first region located between the first substrate and the second substrate. A portion of the conductive layer within this first region contacts the second substrate, while the portion of the conductive layer outside the display area and the first region is electrically connected to the circuit board. A flexible material layer is located on at least one side surface of the conductive layer. On one hand, since a portion of the flexible material layer is located outside the first region, this portion can at least partially cover the conductive layer extending outside the first region. This protects the conductive layer, achieving a stable electrical connection between the conductive layer and the circuit board. Furthermore, the conductive layer enables the electrical connection between the second substrate and the circuit board in the display panel, allowing electrical signals in the second substrate to be directly conducted to the circuit board through the conductive layer without... Due to the limitation of the display panel's bezel width, the problem of conducting electrical signals through conductive adhesive on the bezel is avoided. However, the poor positioning accuracy of the conductive adhesive leads to an increase in the bezel width as the conductive adhesive application area increases, which is beneficial for further bezel reduction. On the other hand, since a portion of the flexible material layer is located in the first region, a portion of the flexible material layer can be present between the conductive layer and the second substrate. When the conductive layer bends towards the second substrate according to usage requirements, this portion of the flexible material layer can alleviate the stress generated by the bending of the conductive layer, improving the touch accuracy of the display panel. At the same time, since the portion of the conductive layer outside the first region can be bent, it is beneficial for further reduction of the display panel's bezel width.

[0048] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0049] In the display panel of this application embodiment, Figure 1 The image shows a cross-sectional structure of a display panel. Figure 1 The positional relationship between the display area and non-display area of ​​the central display panel is as follows: Figure 2As shown, a first substrate 10 and a second substrate 20 are disposed opposite to each other, and a portion of the first substrate 10 protrudes from the second substrate 20. A display area 101 is provided in the region between the first substrate 10 and the second substrate 20. A non-display area 102 surrounds the outer periphery of the display area 101. The region of the non-display area 102 located between the first substrate 10 and the second substrate 20 is a first region 103. Another portion of the non-display area 102 corresponds to the portion of the first substrate 10 that protrudes from the second substrate 20. A conductive layer 40 extends from the first region 103 to the region between the first substrate 10 and the second substrate 20 and then becomes electrically connected to the circuit board 50. The projection of the flexible material layer 30 on the surface of the conductive layer 40 at least partially overlaps with the surface of the conductive layer 40, which is used to simultaneously protect the conductive layer 40 located in the first region and the conductive layer 40 located outside the first region 103.

[0050] In some alternative implementations, such as Figure 1 and Figure 3 As shown, Figure 3 It shows Figure 1 The arrangement of the conductive layer and flexible material layer in the display panel is as follows: The conductive layer 40 includes a first conductive portion 410, a first connecting portion 420, and a second conductive portion 430 connected in sequence. The flexible material layer 30 includes a first flexible layer 310, which is located on the side of the second surface 402 facing the second substrate. The first conductive portion 410 and a portion of the first flexible layer 310 are located in the first region 103. The first conductive portion 410 is in contact with the second substrate 20, and the first connecting portion 420 is in contact with the first flexible layer 310. At least a portion of the second conductive portion 430 and the remaining portion of the first flexible layer 310 are also in contact. 0 is located outside the first region 103, and the second conductive part 430 is located on the side of the first flexible layer 310 away from the second substrate 20, so that the portion of the first flexible layer 310 located on the side of the second substrate 20 can be located between the first connecting part 420 and the second substrate 20. Since the first connecting part 420 is bent, the entire conductive layer 40 is bent. So when the conductive layer 40 is bent towards the side of the second substrate 20 according to the usage requirements, the first connecting part 420 can relieve the stress generated by the conductive layer 40 with the first connecting part 420 when it is bent by contacting the first flexible layer 310.

[0051] In the above optional implementations, such as Figure 3As shown, the conductive layer 40 may further include a second connecting portion 440 and a third conductive portion 450. The third conductive portion 450 is connected to the second conductive portion 430 through the second connecting portion 440. The third conductive portion 450 is located outside the first region 103, and the conductive layer 40 achieves electrical connection with the circuit board through the third conductive portion 450. Specifically, the first conductive portion 410, the first connecting portion 420, the second conductive portion 430, the second connecting portion 440, and the third conductive portion 450 can form a conductive layer 40 with a central recess, thereby allowing the first flexible layer 310 to be disposed in the recessed region. This can alleviate the stress generated when the conductive layer 40 bends in the middle. At the same time, both ends of the conductive layer 40 have surfaces that do not contact the first flexible layer 310, facilitating electrical connection between the second substrate and the circuit board through the two ends respectively. The third conductive portion 450 can be connected to the circuit board through conductive adhesive. The conductive adhesive can be anisotropic conductive film (ACF), but is not limited to the above types. Those skilled in the art can make reasonable selections according to actual needs.

[0052] For example, such as Figure 1 As shown, the first substrate 10 is located on one side of the second substrate 20, with a portion of the first substrate 10 protruding from the second substrate 20. A display area 101 is located in the region between the first substrate 10 and the second substrate 20. An electrode connected to the conductive layer 40 is disposed on the surface of the second substrate 20 near the first substrate 10. A non-display area 102 surrounds the outer periphery of the display area 101. The non-display area 102 has a first region 103 located between the first substrate 10 and the second substrate 20. The conductive layer 40 extends along a first direction A from the first region 103 beyond the region between the first substrate 10 and the second substrate 20 and then becomes electrically connected to the circuit board 50. Wherein, as... Figure 3 As shown, the conductive layer 40 includes a first conductive portion 410, a first connecting portion 420, a second conductive portion 430, a second connecting portion 440, and a second connecting portion 440 connected in sequence. The flexible material layer 30 includes a first flexible layer 310. The first conductive portion 410 and a portion of the first flexible layer 310 are located in the first region 103, and the first conductive portion 410 and a portion of the first flexible layer 310 have a projection area located in the second surface 402 of the second substrate 20. The first connecting portion 420 is in contact with the first flexible layer 310. The second conductive portion 430, the second connecting portion 440, the third conductive portion 450, and the remaining first flexible layer 310 are located outside the first region 103. The second conductive portion 430 is located on the side of the first flexible layer 310 away from the second substrate 20. The third conductive portion 450 is connected to the second conductive portion 430 through the second connecting portion 440. The conductive layer 40 achieves electrical connection with the circuit board 50 through the third conductive portion 450.

[0053] In the example above, Figure 1 The structure of the conductive layer in the display panel shown is as follows: Figure 4 As shown, the first conductive portion 410 may have a third surface 403 facing the second substrate 20, the second conductive portion 430 may have a fourth surface 404 adjacent to it, the third conductive portion 450 may have a fifth surface 405 bonded to the circuit board 50, and the first flexible layer 310 may have a sixth surface 406 facing away from the fourth surface 404. The third surface 403, the fifth surface 405, and the sixth surface 406 are coplanar. By ensuring the first conductive portion 410, the first flexible layer 310, and the third conductive portion 450 satisfy the above-described positional relationship, the first flexible layer 310 located between the conductive layer 40 and the second substrate 20 can have a uniform thickness. Therefore, when the conductive layer 40 bends towards the second substrate 20 according to usage requirements, the first flexible layer 310 can uniformly alleviate the stress generated by the bending of the conductive layer 40, thereby improving the touch accuracy of the display panel.

[0054] In some alternative implementations, Figure 5 This paper illustrates a cross-sectional structure of another display panel in an embodiment of this application. Figure 6 It shows Figure 5 The arrangement of the conductive layer and flexible material layer in the display panel is as follows: The conductive layer 40 includes a first conductive portion 410, a first connecting portion 420, and a second conductive portion 430 connected in sequence. The flexible material layer 30 includes a first flexible layer 310. The first conductive portion 410 and a portion of the first flexible layer 310 are located in the first region 103 and in contact with the second substrate 20. The first connecting portion 420 is in contact with the first flexible layer 310. At least a portion of the second conductive portion 430 and the remaining portion of the first flexible layer 310 are located outside the first region 103. The first flexible layer 310 is located on the side away from the second substrate 20, so that the portion of the first flexible layer 310 in contact with the second substrate 20 can be located between the first connecting portion 420 and the second substrate 20. Since the first connecting portion 420 is bent, the entire conductive layer 40 is bent. Thus, when the conductive layer 40 is bent toward the second substrate 20 according to the usage requirements, the first connecting portion 420 can relieve the stress generated when the conductive layer 40 with the first connecting portion 420 is bent by contacting the first flexible layer 310.

[0055] For example, such as Figure 5As shown, the first substrate 10 is located on one side of the second substrate 20, and a portion of the first substrate 10 protrudes beyond the second substrate 20. A display area 101 is located in the region between the first substrate 10 and the second substrate 20. An electrode connected to the conductive layer 40 is disposed on the surface of the second substrate 20 near the first substrate 10. A non-display area 102 surrounds the outer periphery of the display area 101. The non-display area 102 has a first region 103 located between the first substrate 10 and the second substrate 20. The conductive layer 40 extends from the first region 103 beyond the region between the first substrate 10 and the second substrate 20 and is electrically connected to the circuit board 50. Wherein, as... Figure 6 As shown, the conductive layer 40 includes a first conductive portion 410, a first connecting portion 420, and a second conductive portion 430 connected in sequence. The flexible material layer 30 includes a first flexible layer 310. The first conductive portion 410 and a portion of the first flexible layer 310 are located in the first region 103 and are in contact with the second substrate 20. The first connecting portion 420 and a portion of the second conductive portion 430 are located in the first region 103 and are in contact with the first flexible layer 310. Another portion of the second conductive portion 430 and the remaining first flexible layer 310 are located outside the first region 103. The first conductive portion 410 has a third surface 403 facing the second substrate 20. The second conductive portion 430 has a fourth surface 404 facing the first flexible layer 310 on the side near the second substrate 20. The conductive layer 40 achieves electrical connection with the circuit board through the second conductive portion 430. Since the first flexible layer 310 is located on one side surface of the second conductor portion 430, the first flexible layer 310 can cover one side surface of the conductor layer 40 outside the first region 103, thereby relieving the stress generated when the conductor layer 40 is bent at any position outside the first region 103.

[0056] In the above example, in order to make the conductor layer 40 electrically connected to the circuit board through the second conductor portion 430, the second conductor portion 430 and the circuit board can be connected by conductive adhesive. The conductive adhesive can be anisotropic conductive film (ACF), but is not limited to the above type. Those skilled in the art can make reasonable selections according to actual needs.

[0057] In the example above, Figure 5 The relationship between the edge area of ​​the conductive layer and the flexible material layer in the display panel is as follows: Figure 7As shown, the second conductive portion 430 has an edge region 421 located outside the first region 103. The first flexible layer 310 is in contact with at least a portion of the surface of the edge region 421. The second conductive portion 430 has a seventh surface 407 facing away from the fourth surface 404, and the seventh surface 407 is connected to the circuit board. By ensuring the second conductive portion 430 and the first flexible layer 310 satisfy the above-described positional relationship, the circuit board can be bonded to the side of the conductive layer 40 near the first substrate 10. This allows for effective utilization of the area between the portion of the first substrate 10 protruding from the first substrate 10 and the conductive layer 40, which is beneficial for reducing the package size of the display panel.

[0058] In yet another example, Figure 5 The cross-sectional structure of the conductor layer in the display panel after bending is as follows: Figure 8 As shown, a first substrate 10 is located on one side of a second substrate 20, with a portion of the first substrate 10 protruding beyond it. A display area 101 is located in the region between the first substrate 10 and the second substrate 20. An electrode 70 connected to a conductive layer 40 is disposed on the surface of the second substrate 20 near the first substrate 10. A non-display area 102 surrounds the outer periphery of the display area 101. The non-display area 102 has a first region 103 located between the first substrate 10 and the second substrate 20. The conductive layer 40 extends from the first region 103 beyond the region between the first substrate 10 and the second substrate 20 and is electrically connected to the circuit board 50. Figure 8 The arrangement of the conductive layer and flexible material layer in the display panel is as follows: Figure 9 As shown, the conductive layer 40 includes a first conductive portion 410, a first connecting portion 420, and a second conductive portion 430 connected in sequence. The flexible material layer 30 includes a first flexible layer 310. The first conductive portion 410 has a third surface 403 facing the second substrate. The second conductive portion 430 includes a first conductive segment 431, a bent segment 432, and a second conductive segment 433 connected in sequence. The first conductive segment 431 is located on the side of the second substrate 20 near the first substrate 10. A portion of the first flexible layer 310 is located between the first conductive segment 431 and the second substrate 20. The bent segment 432, the second conductive segment 433, and the remaining first flexible layer 310 are located outside the first region 103. The circuit board is electrically connected to the second conductive portion 430. Compared to Figure 5 In this example, the conductive layer 40 is configured such that by having a bent section 432 in the conductive layer 40, one end of the conductive layer 40 can be led out to the top of the second substrate 20. This allows one end of the conductive layer 40 to be electrically connected to the circuit board above the display panel, which helps to reduce the horizontal packaging size of the display panel.

[0059] In the above example, in order to make the conductor layer 40 electrically connected to the circuit board through the second conductor portion 430, the second conductor portion 430 and the circuit board can be connected by conductive adhesive. The conductive adhesive can be anisotropic conductive film (ACF), but is not limited to the above type. Those skilled in the art can make reasonable selections according to actual needs.

[0060] In the above example, such as Figure 8 and Figure 9 As shown, the second conductive segment 433 is located on the side of the second substrate 20 away from the first substrate 10, and the remaining first flexible layer 310 is located between the second substrate 20 and the second conductive segment 433. Since the second conductive segment 433 has a seventh surface away from the second substrate 20, and the seventh surface is electrically connected to the circuit board 50, the second conductive segment 433 can be electrically connected to the circuit board on its bent upper surface, so that one end of the conductive layer 40 can be electrically connected to the circuit board above the display panel. This makes it easier to place the circuit board above the second substrate, which is beneficial to reduce the packaging size of the display panel in the horizontal direction.

[0061] In some alternative implementations, such as Figure 1 , Figure 10 As shown, the non-display area of ​​the display panel has a first region 103 located between the first substrate 10 and the second substrate 20. The flexible material layer 30 further includes a second flexible layer 320 located on the side of the first surface 401 facing the first substrate 10. The second flexible layer 320 has a second projection area on the first substrate 10, and the first surface 401 has a third projection area on the first substrate 10. The second projection area and the third projection area at least partially overlap. The display panel also includes an encapsulation layer 60 located in the first region 103 and in contact with the second flexible layer 320. The encapsulation layer 60 is used to seal the display element between the first substrate 10 and the second substrate 20. The encapsulated area between the two substrates contains the display element for imaging the display panel. For example, the display element may include a display functional layer, which can change the propagation direction of light from the light source under the action of an electric field to achieve imaging.

[0062] In the above optional implementations, such as Figure 11As shown, in a direction perpendicular to the second substrate 20, the encapsulation layer 60 has a fourth projection area on the second substrate 20, and the conductive layer has a fifth projection area on the second substrate 20, with the fourth and fifth projection areas overlapping. By arranging the encapsulation layer 60 in this manner, the encapsulation layer 60 can have a larger size in the horizontal direction, thereby not only improving the support of the encapsulation layer 60 for the upper substrate, but also preventing moisture from entering the interior of the display panel, thus reducing the impact of moisture on the performance of the display panel.

[0063] For example, such as Figure 1 As shown, the flexible material layer 30 includes a second flexible layer 320 covering the first surface 401. The encapsulation layer 60 includes a main body 610 and a protrusion 620. The main body 610 is located between the first substrate 10 and the second flexible layer 320. The second flexible layer 320 has at least one groove extending from the surface of the main body 610 to a first portion of the conductive layer 40. Since the protrusion 620 is located in the groove and connects the main body 610 and the first conductive layer 410, by creating a groove in the second flexible layer 320 and filling it with the encapsulation layer 60, moisture is prevented from entering the display panel from the outside through the second flexible layer 320, thus avoiding moisture erosion of the conductive layer 40. The number and size of the grooves extending through the second flexible layer 320 can be reasonably set according to the distance between the first substrate 10 and the second substrate 20 and the size of the encapsulation layer 60. This embodiment does not impose specific limitations.

[0064] It should be noted that the encapsulation layer 60 in this embodiment is not limited to the configuration shown in the above examples. In another example, the cross-sectional structure of a display panel provided in this embodiment is as follows: Figure 10 As shown, the first substrate 10 is located on one side of the second substrate 20, and a portion of the first substrate 10 protrudes from the first substrate 10. A display area 101 is provided in the region between the first substrate 10 and the second substrate 20. A non-display area 102 surrounds the outer periphery of the display area 101. The non-display area 102 has a first region 103 located between the first substrate 10 and the second substrate 20. A conductive layer 40 extends along the first direction A from the first region 103 to the region between the first substrate 10 and the second substrate 20 and is electrically connected to the circuit board 50. A flexible material layer 30 is located on both sides of the conductive layer 40. A portion of the encapsulation layer 60 is located between the first substrate 10 and the second flexible layer 320, and the remaining encapsulation layer 60 is located between the first substrate 10 and the conductive layer 40.

[0065] In some alternative implementations, Figure 12 This application illustrates the positional relationship between a first substrate, a second substrate, and a flexible extension of a flexible material layer in a display panel according to an embodiment of the present application. Figure 12As shown, the flexible material layer has a flexible extension 330 located outside the first region 103, and the flexible extension 330 at least partially covers the end of the second portion of the conductive layer. There can be multiple flexible extensions 330, such as... Figure 13 As shown. Specifically, in conjunction with Figure 1 The display panel shown illustrates the flexible extension 330 described above. The flexible extension 330 can be a portion of the flexible material layer located outside the first region. This portion of the flexible material layer wraps around the conductor layer and protrudes from the end of the second substrate 20, thereby providing protection for the conductor layer 40.

[0066] In the above optional embodiments, the first substrate 10 is provided to protrude from the second substrate 20, so that the portion of the first substrate 10 protruding from the second substrate 20 has a stepped surface. The projection of the flexible extension 330 on the first substrate 10 can be located in the stepped surface, so that the flexible material layer 30 does not protrude from the first substrate 10, but only extends above the first substrate 10, avoiding the waste caused by the large length of the flexible material layer in the horizontal direction.

[0067] In the above optional embodiments, the portion of the conductive layer extending outside the first region may have an enlarged structure. The enlarged structure includes multiple independent leads, each corresponding to a multiple second portion in the conductive layer. As previously described, each second portion refers to the portion of the conductive layer located outside the display area and the first region. In this case, the positions of the first substrate, the second substrate, and the flexible extension of the flexible material layer in another display panel provided by this application embodiment are related to... Figure 12 As shown, the flexible material layer may include multiple flexible extensions 330, and the conductive layer includes multiple second portions corresponding one-to-one with the flexible extensions 330. Each flexible extension 330 contacts a portion of the surface of the corresponding second portion, thereby ensuring that each second portion of the conductive layer has an area not covered by the flexible extension 330 for electrical connection with the circuit board. Since the multiple leads in the conductive layer generate stress individually when bent, by providing multiple flexible extensions 330, the stress generated by each lead can be alleviated one-to-one. The number of leads can be reasonably set according to actual needs, and this embodiment does not impose a specific limitation.

[0068] In the case where the conductive layer includes multiple second portions corresponding one-to-one with the flexible extension 330, the second substrate 20 achieves electrical connection with the circuit board through the multiple second portions in the conductive layer. These multiple second portions are enlarged structures extending from the conductive layer outside the first region. The enlarged structures include multiple independent leads, thereby improving signal transmission efficiency by ensuring that all leads are electrically connected to the circuit board. For example, the positional relationship between the flexible extension of the flexible material layer and the circuit board in a display panel provided in this application embodiment is as follows: Figure 14 As shown, the second substrate 20 achieves electrical connection with the same circuit board 50 by wrapping multiple second portions of the flexible extension 330.

[0069] In some alternative implementations, Figure 15 A cross-sectional structure of a display panel with a protective film is shown, such as... Figure 14 As shown, the display panel also includes a protective film 80, which contacts at least a portion of the surface of the flexible material layer 30 located outside the first region 103. The protective film 80 protects the flexible material layer 30 located outside the first region 103, thereby improving the reliability of the flexible material layer 30. Specifically, the protective film 80 may be located between the end of the conductive layer 40 outside the first region and the circuit board 50, such as between the end of the conductive layer 40 and the ACF adhesive disposed on the surface of the circuit board 50, to improve the durability and stability of the end of the conductive layer 40. The protective film 80 may be an organic polymer material, for example, it may be selected from any one of PET film, PEN film, PMMA film, PES film, PI film, and PC film, but is not limited to these types; this embodiment does not impose specific limitations.

[0070] The display panel in this embodiment can be a liquid crystal display panel, and the display functional layer in the liquid crystal display panel is a liquid crystal layer. The display area in the display panel of this embodiment is as follows: Figure 16 As shown, the first substrate 10 and the second substrate 20 are disposed opposite to each other, and the liquid crystal layer 90 is located within the sealed space formed by the first substrate 10 and the second substrate 20 through the outer periphery of the encapsulation layer 60, realizing image display under the action of an external electric field. It should be noted that the above-mentioned display panel in the embodiments of this application is not only applicable to liquid crystal display panels, but can also be applied to electrophoretic display panels, and this application does not make specific limitations.

[0071] For example, the first substrate described above is an array substrate. (e.g.) Figure 16As shown, the array substrate may include a first substrate and a driving array 120 formed on the first substrate 110, which generates a driving electric field that acts on the liquid crystal layer 90 under the action of a driving signal. The first substrate may also include multiple gate lines, multiple data lines, and multiple sub-pixels located on the first substrate. The gate lines and the data lines may extend in different directions, and the sub-pixels may be located in the intersection region of the gate lines and the data lines.

[0072] Furthermore, the arrangement directions of the gate lines and the data lines are respectively row-oriented and column-oriented, thus enabling multiple sub-pixels to be distributed in a multi-row, multi-column matrix. The same data line connects to sub-pixels located in the same column, and the same gate line connects to sub-pixels located in the same row. Each sub-pixel is provided with a pixel electrode and at least one display switching element, which can be a thin-film transistor (TFT). The gate of the TFT is connected to a corresponding gate line, the source of the TFT is connected to a corresponding data line, and the drain of the TFT is connected to a corresponding pixel electrode. The first substrate also includes a driving integrated circuit that transmits scan signals to each sub-pixel through the gate lines and data signals to each sub-pixel through the data lines.

[0073] For example, such as Figure 16 As shown, the second substrate 20 is a color filter substrate, including a second substrate 210 and a color filter layer 220 formed on the second substrate 210. Liquid crystal molecules in the liquid crystal layer 90 undergo state changes under the action of a driving electric field, blocking or allowing light to pass through the color filter layer 220 located above the liquid crystal layer, thus presenting different colors and grayscale levels to achieve image display. It should be noted that this embodiment does not specifically limit the location of the color filter layer. For example, the color filter layer can also be located on the first substrate, or no color filter layer may be provided. In the case where no color filter layer is provided in the display panel, the display panel only displays black and white images.

[0074] According to an embodiment of this application, a method for manufacturing a display panel is also provided, comprising the following steps:

[0075] A display panel motherboard is provided. The display panel motherboard includes a first initial substrate, a second initial substrate, an initial conductive layer, and an initial flexible material layer. The first initial substrate and the second initial substrate are disposed opposite to each other, and the initial conductive layer and the initial flexible material layer are located between the first initial substrate and the second initial substrate.

[0076] The display panel motherboard is cut in the first step to obtain multiple display panel units;

[0077] A second cut is made along the cutting line of the display panel unit to remove the area to be cut of the display panel unit, thereby obtaining the display panel provided in any of the above embodiments of this application;

[0078] The above-mentioned production method also includes:

[0079] Between the first and second cutting steps, at least the end of the second portion of the corresponding initial conductive layer of the second initial substrate is removed, so that the initial flexible material layer and the first initial substrate protrude from the second initial substrate. The second initial substrate is electrically connected to the circuit board through the second portion. After the second cutting step, the first initial substrate forms the first substrate in the display panel, the second initial substrate forms the second substrate in the display panel, the initial flexible material layer forms the flexible material layer in the display panel, and the initial conductive layer forms the conductive layer in the display panel; or

[0080] After the second cutting step, the end of the second portion of the conductive layer in the corresponding display panel of the second initial substrate is removed, and the remaining second initial substrate constitutes the second substrate in the display panel. The second substrate is electrically connected to the circuit board through the second portion.

[0081] In one example of this application, such as Figure 17 As shown, the manufacturing method of the above display panel includes:

[0082] S102, a display panel motherboard is provided. The display panel motherboard includes a first initial substrate, a second initial substrate, an initial conductive layer and an initial flexible material layer. The first initial substrate and the second initial substrate are disposed opposite to each other. The initial conductive layer and the initial flexible material layer are located between the first initial substrate and the second initial substrate.

[0083] S104, the display panel motherboard is cut for the first time to obtain multiple display panel units;

[0084] S106, remove the end of the second portion of the corresponding initial conductive layer of the second initial substrate so that the initial flexible material layer and the first initial substrate protrude from the second initial substrate. The second portion is used to electrically connect the second initial substrate to the circuit board in subsequent processes. After the second cutting step, the first initial substrate forms the first substrate in the display panel, the second initial substrate forms the second substrate in the display panel, the initial flexible material layer forms the flexible material layer in the display panel, and the initial conductive layer forms the conductive layer in the display panel.

[0085] S108, a second cut is made along the cutting line of the display panel unit to remove the area to be cut of the display panel unit, thereby obtaining the display panel provided in any of the above embodiments of this application.

[0086] In another example of this application, such as Figure 18 As shown, the manufacturing method of the above display panel includes:

[0087] S202, a display panel motherboard is provided. The display panel motherboard includes a first initial substrate, a second initial substrate, an initial conductive layer and an initial flexible material layer. The first initial substrate and the second initial substrate are disposed opposite to each other. The initial conductive layer and the initial flexible material layer are located between the first initial substrate and the second initial substrate.

[0088] S204, the display panel motherboard is cut for the first time to obtain multiple display panel units;

[0089] S206, Perform a second cut along the cutting line of the display panel unit to remove the area to be cut of the display panel unit;

[0090] S208, remove the end of the second portion of the conductive layer in the corresponding display panel of the second initial substrate to obtain the display panel provided in any of the above embodiments of this application. The remaining second initial substrate constitutes the second substrate in the display panel, and the second substrate is electrically connected to the circuit board through the second portion.

[0091] According to an embodiment of this application, a display device is also provided, which includes any of the display panels provided in the above embodiments.

[0092] For example, such as Figure 19 As shown, the display device 10000 provided in this application embodiment can be a mobile phone. The above-mentioned display device can also be any electronic product with display function, including but not limited to laptops, tablets, digital cameras, televisions, desktop monitors, smart bracelets, smart glasses, vehicle displays, industrial control equipment, medical displays, touch interactive terminals, etc. This application embodiment does not specifically limit it in this regard.

[0093] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0094] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area, the non-display area surrounding the display area. The display panel comprises a first substrate, a second substrate, a flexible material layer, a conductive layer, and a circuit board, wherein: The first substrate is located on one side of the second substrate, and the non-display area has a first region located between the first substrate and the second substrate; The conductive layer extends along a first direction, a first portion of the conductive layer is located in the first region, the first portion is in contact with the second substrate, a second portion of the conductive layer is located in the first region on the side away from the display area, and the second substrate is electrically connected to the circuit board through the second portion; The conductive layer has a first surface on the side near the first substrate and a second surface on the side near the second substrate. The flexible material layer is located on the side of the first surface facing the first substrate and / or the side of the second surface facing the second substrate. The flexible material layer has a first projection area located on the first surface and / or the second surface, the first projection area at least partially overlapping the first surface and / or the second surface. The flexible material layer is located in a non-display area, with a portion of the flexible material layer located in the first area and the remainder located outside the first area. The conductive layer includes a first conductive portion, a first connecting portion, and a second conductive portion connected in sequence. The first conductive portion is in contact with the second substrate. The flexible material layer includes a second flexible layer located on the first surface facing the first substrate. The display panel further includes an encapsulation layer located in the first region and in contact with the second flexible layer. The encapsulation layer includes a main body portion and a protrusion portion. The main body portion is located between the first substrate and the second flexible layer. The second flexible layer has at least one groove extending from the surface of the main body portion to the first portion of the conductive layer. The protrusion portion is located in the groove and connects the main body portion and the first conductive portion.

2. The display panel according to claim 1, characterized in that, The flexible material layer includes a first flexible layer located on the side of the second surface facing the second substrate. A portion of the first flexible layer is located in the first region, and the remainder of the first flexible layer is located outside the first region. The first connecting portion is in contact with the first flexible layer, and the second conductive portion is located on the side of the first flexible layer away from the second substrate.

3. The display panel according to claim 2, characterized in that, The conductor layer further includes a third conductor portion and a second connecting portion. The third conductor portion is connected to the second conductor portion through the second connecting portion. The third conductor portion is located outside the first region and is electrically connected to the circuit board.

4. The display panel according to claim 3, characterized in that, The first conductive portion has a third surface facing the second substrate, the second conductive portion has a fourth surface close to the second substrate, the third conductive portion has a fifth surface bonded to the circuit board, the first flexible layer has a sixth surface facing away from the fourth surface, and the third surface, the fifth surface and the sixth surface are coplanar.

5. The display panel according to claim 2, characterized in that, The first conductive portion has a third surface facing the second substrate, and the second conductive portion has a fourth surface facing the first flexible layer on the side near the second substrate. The circuit board is electrically connected to the second conductive portion.

6. The display panel according to claim 5, characterized in that, The second conductive portion has an edge region located outside the first region, the first flexible layer wraps around the edge region, and the second conductive portion has a seventh surface opposite to the fourth surface, the seventh surface being connected to the circuit board.

7. The display panel according to claim 2, characterized in that, The first conductive portion has a third surface facing the second substrate. The second conductive portion includes a first conductive segment, a bent segment, and a second conductive segment connected in sequence. The first conductive segment is located on the side of the second substrate close to the first substrate. A portion of the first flexible layer is located between the first conductive segment and the second substrate. The bent segment, the second conductive segment, and the remaining first flexible layer are located outside the first region. The circuit board is electrically connected to the second conductive portion.

8. The display panel according to claim 7, characterized in that, The second conductive segment is located on the side of the second substrate away from the first substrate, and the remaining first flexible layer is located between the second substrate and the second conductive segment. The second conductive segment has a seventh surface away from the second substrate, and the seventh surface is electrically connected to the circuit board.

9. The display panel according to any one of claims 2 to 8, characterized in that, The second flexible layer has a second projection area on the first substrate, and the first surface has a third projection area on the first substrate, wherein the second projection area and the third projection area at least partially overlap.

10. The display panel according to claim 9, characterized in that, In a direction perpendicular to the second substrate, the encapsulation layer has a fourth projection region on the second substrate, and the conductive layer has a fifth projection region on the second substrate, wherein the fourth projection region and the fifth projection region at least partially overlap.

11. The display panel according to any one of claims 1 to 8, characterized in that, The flexible material layer has at least one flexible extension located outside the first region, the flexible extension at least partially wrapping the end of the second portion of the conductor layer.

12. The display panel according to claim 11, characterized in that, The first substrate protrudes from the second substrate, and the portion of the first substrate protruding from the second substrate has a stepped surface. The projection of the flexible extension on the first substrate is located in the stepped surface.

13. The display panel according to claim 11, characterized in that, The flexible material layer includes a plurality of flexible extensions, and the conductive layer includes a plurality of second portions corresponding one-to-one with the flexible extensions, with each flexible extension in contact with a portion of the surface of the corresponding second portion.

14. The display panel according to claim 13, characterized in that, The second substrate is electrically connected to the circuit board through a plurality of second portions.

15. The display panel according to claim 9, characterized in that, The display panel also includes a protective film that is in contact with at least a portion of the surface of the flexible material layer located outside the first region.

16. A method for manufacturing a display panel, characterized in that, Includes the following steps: A display panel motherboard is provided, the display panel motherboard including a first initial substrate, a second initial substrate, an initial conductive layer and an initial flexible material layer, the first initial substrate and the second initial substrate being disposed opposite to each other, and the initial conductive layer and the initial flexible material layer being located between the first initial substrate and the second initial substrate; The display panel motherboard is cut in the first step to obtain multiple display panel units; A second cut is made along the cutting line of the display panel unit to remove the area to be cut of the display panel unit, thereby obtaining the display panel as described in any one of claims 1 to 15; The manufacturing method further includes: Between the first cutting step and the second cutting step, at least the end of the second initial substrate corresponding to the second portion of the initial conductive layer is removed so that the initial flexible material layer and the first initial substrate protrude from the second initial substrate. The second initial substrate is electrically connected to the circuit board through the second portion. After the second cutting step, the first initial substrate forms the first substrate in the display panel, the second initial substrate forms the second substrate in the display panel, the initial flexible material layer forms the flexible material layer in the display panel, and the initial conductive layer forms the conductive layer in the display panel. or After the second cutting step, the end of the second portion of the second initial substrate corresponding to the conductive layer in the display panel is removed, and the remaining second initial substrate constitutes the second substrate in the display panel. The second substrate is electrically connected to the circuit board through the second portion.

17. A display device comprising a display panel, characterized in that, The display panel is the display panel as described in any one of claims 1 to 15, or the display panel is obtained by the manufacturing method described in claim 16.

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