A gas-liquid two-phase liquid cooling heat exchange device based on micro-rib structure
By designing a gas-liquid two-phase liquid cooling heat exchange device based on a micro-rib structure, and utilizing rhomboid columnar heat-conducting rods and staggered coolant inlets and outlets, the limitations of single-phase liquid cooling heat dissipation methods are overcome, achieving efficient and uniform temperature control for electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-05-31
- Publication Date
- 2026-04-07
AI Technical Summary
In existing technologies, single-phase liquid cooling is constrained by factors such as heat source distribution, flow channel direction, liquid supply flow rate and pressure, making it difficult to effectively meet the heat dissipation requirements of high heat flux density electronic components. The potential of gas-liquid two-phase liquid cooling technology has not been fully explored.
The design incorporates a gas-liquid two-phase liquid-cooled heat exchange device based on a micro-rib structure. It employs a rhomboid columnar heat-conducting rod and a staggered coolant inlet and outlet design to increase the heat exchange surface area, reduce flow resistance, rationally distribute the medium flow rate, and improve temperature uniformity and heat exchange efficiency.
It significantly improves the heat exchange capacity and temperature uniformity of electronic components, ensures the stability and efficiency of gas-liquid two-phase flow, and is suitable for temperature control in extreme environments.
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Figure CN116761391B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the technical field of heat dissipation devices for electronic devices, and specifically relates to a gas-liquid two-phase liquid cooling heat exchange device based on a micro-rib structure. Background Technology
[0002] As electronic devices become increasingly sophisticated and efficient, the heat flux density of electronic components increases, and heat dissipation technology gradually shifts from air cooling to liquid cooling.
[0003] Traditional liquid cooling typically uses a single-phase cooling medium. Leveraging the medium's high thermal conductivity, the high-speed flowing medium can absorb heat released by electronic components through convection and dissipate it promptly, thus achieving immediate cooling. However, the effectiveness of single-phase liquid cooling technology is often limited by several factors, such as heat source distribution, flow path, liquid supply flow rate, and pressure.
[0004] In comparison, two-phase liquid cooling technology has a theoretical advantage in the field of heat dissipation for electronic devices. The heat transfer efficiency of fluid boiling is much higher than that of single-phase medium convection heat transfer, and the temperature uniformity of the heat transfer surface is stronger. At the same time, the flow resistance of the two-phase medium is lower, and there are fewer limitations in terms of medium flow rate and driving capability.
[0005] Therefore, it is necessary to explore the application potential of gas-liquid two-phase liquid cooling technology and to design reasonable gas-liquid two-phase liquid cooling heat exchange devices for electronic components with local high heat flux density. Summary of the Invention
[0006] To address the aforementioned technical problems, this invention provides a gas-liquid two-phase liquid cooling heat exchange device based on a micro-rib structure. The micro-rib structure increases the extended area of the heat exchange surface, further enhancing the heat exchange capacity between electronic components and the cooling medium. The design of the rhomboid micro-rib structure fully considers the gas-liquid two-phase heat exchange mechanism, reduces the flow resistance of the gas-liquid two-phase flow between the ribs, rationally distributes the flow velocity of the medium between the ribs, and effectively improves the temperature uniformity of the inner surface of the device.
[0007] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: The gas-liquid two-phase liquid cooling heat exchange device based on micro-rib structure includes: a shell, a coolant inlet pipe and a coolant outlet pipe provided on the side wall of the shell, an opening provided on one side of the shell, a cover plate for sealing the opening provided at the opening, a heat-conducting plate provided on the cover plate, and a micro-rib structure provided inside the shell.
[0008] Preferably, the microrib structure consists of multiple equally spaced rhomboid columnar heat-conducting rods, with both ends of each heat-conducting rod connected to the inner wall of the housing and the cover plate, respectively.
[0009] Preferably, the length of the heat-conducting rod is twice the length of its short axis of symmetry.
[0010] Preferably, the heat-conducting rods are arranged in an equilateral triangle along the vertical direction.
[0011] Preferably, both the housing and the cover are vertically arranged.
[0012] Preferably, the coolant inlet pipe and the coolant outlet pipe are not on the same horizontal plane, and the axial height of the coolant inlet pipe is lower than the axial height of the coolant outlet pipe.
[0013] Preferably, the depth of the cavity formed between the housing and the cover plate does not exceed 4 mm.
[0014] Preferably, the coolant inlet pipe and the coolant outlet pipe are respectively disposed on two opposite sides of the housing, and are parallel to each other and perpendicular to the sides of the housing. Attached Figure Description
[0015] Figure 1 This is an isometric view of a gas-liquid two-phase liquid-cooled heat exchange device based on a micro-rib structure according to an embodiment of the present invention.
[0016] Figure 2 for Figure 1 The front and side views of the gas-liquid two-phase liquid-cooled heat exchange device are shown.
[0017] Figure 3 for Figure 2 The diagram shows a cross-sectional view of AA in the gas-liquid two-phase liquid-cooled heat exchange device.
[0018] Figure 4 for Figure 2 The diagram shows a cross-sectional view of BB in the gas-liquid two-phase liquid-cooled heat exchange device.
[0019] Figure 5 for Figure 4 Axonometric and front view of the rhomboid columnar structure inside the gas-liquid two-phase liquid-cooled heat exchange device shown;
[0020] Figure 6 for Figure 2 The flow field distribution cloud diagram of the cooling medium in the gas-liquid two-phase liquid-cooled heat exchange device with different rib structures is shown.
[0021] Figure 7 for Figure 2 The flow field distribution cloud diagrams of the cooling medium flow when different arrangements of micro-rib structures are used in the gas-liquid two-phase liquid cooling heat exchange device are shown.
[0022] The attached diagram lists the components represented by each number as follows:
[0023] 1. Shell; 2. Cover plate; 3. Heat-conducting fins; 4. Micro-rib structure; 5. Coolant inlet pipe; 6. Coolant outlet pipe. Detailed Implementation
[0024] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.
[0025] Currently, liquid cooling is commonly used for heat dissipation in electronic devices. Single-phase liquid cooling is highly versatile, using high-boiling-point coolants as the cooling medium. Leveraging the high thermal conductivity of the medium, the high-speed flow of the cooling medium can achieve a certain degree of temperature reduction for electronic components, ensuring the normal and stable operation of the electronic equipment. Two-phase liquid cooling has relatively lower versatility but offers more efficient heat exchange. Since the latent heat of vaporization of the cooling medium per unit mass is much higher than its sensible heat, two-phase liquid cooling can theoretically remove more heat from electronic devices while ensuring that the temperature of the medium itself does not rise significantly, possessing the potential for good temperature control of high heat flux density electronic components. At the same time, the cooling medium in the two-phase state has low flow resistance and is lightweight, playing a crucial role in temperature control of electronic equipment in extreme environments.
[0026] Example
[0027] like Figure 1-5 As shown, this embodiment provides a gas-liquid two-phase liquid-cooled heat exchange device based on a micro-rib structure, including: a shell 1, a cover plate 2, a heat-conducting plate 3, a micro-rib structure 4, a coolant inlet pipe 5, and a coolant outlet pipe 6. The coolant inlet pipe 5 and the coolant outlet pipe 6 are provided on the side wall of the shell 1. An opening is provided on one side of the shell 1, and a cover plate 2 is provided at the opening for sealing the opening. A heat-conducting plate 3 is provided on the cover plate 2. The heat-conducting plate 3 is made of diamond. The micro-rib structure 4 is provided inside the shell 1. The shell 1, the cover plate 2, and the micro-rib structure 4 are all made of copper.
[0028] It should be noted that the coolant used is R134a, a low-boiling-point refrigerant. This allows the coolant to fully absorb the heat released by the electronic components within the device, completing the transformation from liquid to gas and achieving effective two-phase flow heat transfer. The heat exchange efficiency between the coolant and the inner surface of the casing is significantly improved, effectively mitigating the temperature rise of the electronic components.
[0029] Preferably, the microrib structure 4 consists of multiple equally spaced rhomboid columnar heat-conducting rods, with both ends of each heat-conducting rod fixedly connected to the inner wall of the housing 1 and the cover plate 2, respectively.
[0030] The micro-rib structure 4 greatly expands the heat exchange surface area, further enhancing the heat exchange capacity between electronic components and the cooling medium. The diamond-shaped micro-rib structure 4 fully considers the gas-liquid two-phase heat exchange mechanism, reduces the flow resistance between the gas and liquid phases in the ribs, and rationally distributes the flow velocity of the medium between the ribs, effectively improving the temperature uniformity of the inner surface of the device. The vertical placement and diamond-shaped structure also help the continuous shedding of gas bubbles, ensuring the sustainability of gas-liquid two-phase liquid cooling heat exchange.
[0031] Preferably, the heat-conducting sheet 3 is screwed onto one side of the cover plate 2, and the other side of the cover plate 2 is welded to the housing 1, with the area between the two forming a closed cavity.
[0032] Preferably, the cavity depth between the housing and the cover plate does not exceed 4 mm, such as... Figure 3 As shown.
[0033] Preferably, the coolant inlet pipe 5 and the coolant outlet pipe 6 are located on two opposite sides of the shell 1, ensuring that the gas-liquid two-phase cooling medium is in full contact with the heat exchange surface within the cavity; the coolant inlet pipe 5 and the coolant outlet pipe 6 are parallel to each other and both perpendicular to the sides of the shell 1, such as... Figure 4 As shown.
[0034] Preferably, the coolant inlet pipe 5 and the coolant outlet pipe 6 are not on the same horizontal plane, and the axial height of the coolant inlet pipe 5 is lower than the axial height of the coolant outlet pipe 6. The advantage of this staggered design is that, due to the density difference, the gaseous cooling medium inside the casing 1 tends to flow towards the coolant outlet pipe 6, effectively preventing the accumulation and backflow of the gaseous cooling medium at the coolant inlet pipe 5. This is beneficial for the stable and efficient operation of the gas-liquid two-phase liquid-cooled heat exchange device. Figure 4 As shown.
[0035] Preferably, compared with common straight rib or round rib structures, rhomboid columnar structures are more conducive to improving the flow characteristics of the cooling medium in the shell 1 and enhancing the flow turbulence of the cooling medium.
[0036] This invention analyzes the flow state of the cooling medium under different rib structures through numerical simulation. Figure 6 The flow field distribution cloud maps of the cooling medium under the same flow rate are shown for both the circular rib structure and the rhomboid columnar structure. The flow field uniformity of the rhomboid columnar structure is significantly better than that of the circular rib structure. Thanks to the good flow field uniformity and flow turbulence, the gas-liquid two-phase liquid-cooled heat exchange device using the rhomboid columnar structure has better temperature uniformity and higher heat dissipation efficiency.
[0037] Specifically, the long axis of symmetry of the rhomboid columnar structure should be parallel to the vertical direction, and the short axis of symmetry should be parallel to the horizontal direction, such as... Figure 4 As shown. With a fixed rib spacing, increasing the vertical axis of symmetry of the rhomboid columnar structure 7 and decreasing its horizontal axis of symmetry can effectively adjust the width of the secondary channels in different directions inside the shell 1. Since the width of the secondary channels in the horizontal direction is smaller than that in the vertical direction, the flow resistance in the horizontal direction is greater than that in the vertical direction. After the cooling medium is diverted by the ribs, it tends to flow in the vertical direction, thus avoiding the flow field distribution of excessive cooling medium flow rate in a single secondary channel. At the same time, the gaseous cooling medium will be divided by the rhomboid columnar structure during its ascent in the channel, causing bubble bursting and detachment. A smaller division angle helps to reduce the bubble size, prevent local burn-out, and maintain the gas-liquid two-phase flow and heat exchange.
[0038] Considering the impact of secondary channel width on total flow resistance, the width of the secondary channel in the horizontal direction should not be too small. Therefore, in an embodiment of the present invention, the long axis of symmetry of the rhomboid columnar structure is set to be twice the short axis of symmetry.
[0039] Specifically, the heat-conducting rods are arranged in an equilateral triangle along the vertical direction to increase the turbulence of the gas-liquid two-phase flow within the cavity and hinder excessive bubble growth, such as... Figure 4 As shown. From a manufacturing process perspective, common microrib arrangements include square vertical arrangements and equilateral triangular arrangements. Figure 7 The flow field distribution of the cooling medium in microrib structures with different arrangements is shown under the same flow rate. When the rhomboid columnar structures are arranged in an equilateral triangle, the frequency of the flow velocity vector change of the cooling medium is higher, and the flow turbulence is better.
[0040] In one embodiment of the present invention, the dimensions of each part of the gas-liquid two-phase liquid-cooled heat exchange device are as follows:
[0041] The three-dimensional dimensions of the housing 1 are 70mm × 40mm × 7mm;
[0042] The three-dimensional dimensions of the cover plate 2 are 70mm × 40mm × 3mm;
[0043] The cavity depth between the housing 1 and the cover plate 2 is 4 mm;
[0044] The number of microribs in four vertical rows is 20;
[0045] The rib spacing of microrib structure 4 is 3mm;
[0046] The long and short symmetry axes of the rhomboid columnar heat-conducting rod structure are 2mm and 1mm, respectively.
[0047] Working principle:
[0048] The method of use is as follows: Electronic components requiring heat dissipation are fixed to the heat-conducting plate 3 via screw connections. A complete heat conduction path is formed between the electronic components, the heat-conducting plate 3, the cover plate 2, and the housing 1. Thus, the heat released by the electronic components can be conducted to the inner surface of the housing 1 and the extended surface of the micro-rib structure 4. Pure liquid coolant flows in through the coolant inlet pipe 5, and after entering the cavity, it fully exchanges heat with the inner surface of the housing 1 and the extended surface of the micro-rib structure 4, transforming into a gas-liquid two-phase flow. Under the action of driving force, gravity, and the elastic force of the micro-rib structure 4, the gas-liquid two-phase cooling medium gradually flows towards the coolant outlet pipe 6, carrying heat out of the device through the coolant outlet pipe 6. Pure liquid coolant continuously replenishes the interior of the housing 1 through the coolant inlet pipe 5, continuing to fully exchange heat with the re-wetted surface, forming a stable flow boiling heat exchange, thus effectively controlling the temperature of the electronic components.
[0049] Because the flow boiling heat transfer coefficient of the gas-liquid two-phase cooling medium is high, and the temperature of the gas and liquid phases is always maintained near the boiling point during the boiling process, the gas-liquid two-phase liquid cooling heat exchange device can stably maintain a high heat exchange efficiency, and the temperature uniformity of the heat exchange surface is maintained within 10°C.
[0050] In the description of this invention, it should be understood that the terms "center," "length," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "inner," "outer," "circumferential," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the system or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0051] In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0052] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A gas-liquid two-phase liquid-cooled heat exchange device based on a micro-rib structure, characterized in that, include: The housing (1) has a coolant inlet pipe (5) and a coolant outlet pipe (6) on its side wall. The housing (1) has an opening on one side and a cover plate (2) for sealing the opening. The cover plate (2) has a heat-conducting plate (3) and a micro-rib structure (4) inside the housing (1). The microrib structure (4) consists of multiple equally spaced rhomboid columnar heat-conducting rods, with both ends of each heat-conducting rod connected to the inner wall of the shell (1) and the cover plate (2), respectively; the length of the long axis of symmetry of the heat-conducting rod is twice the length of the short axis of symmetry; the heat-conducting rods are distributed in an equilateral triangle along the vertical direction; The housing (1) and the cover plate (2) are both vertically arranged; the coolant inlet pipe (5) and the coolant outlet pipe (6) are not on the same horizontal plane, and the axial height of the coolant inlet pipe (5) is lower than the axial height of the coolant outlet pipe (6); The heat-conducting sheet is made of diamond, while the shell, cover plate, and micro-rib structure are all made of copper. The coolant used is R134a, a low-boiling-point refrigerant, which allows the coolant to fully absorb the heat released by the electronic components within the device, completing the transformation from liquid to gas.
2. The gas-liquid two-phase liquid-cooled heat exchange device based on a micro-rib structure according to claim 1, characterized in that, The depth of the cavity formed between the housing (1) and the cover plate (2) does not exceed 4 mm.
3. The gas-liquid two-phase liquid-cooled heat exchange device based on a micro-rib structure according to claim 1, characterized in that, The coolant inlet pipe (5) and the coolant outlet pipe (6) are respectively disposed on two opposite sides of the housing (1), and are parallel to each other and perpendicular to the side of the housing (1).
Citation Information
Patent Citations
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