Heat dissipation device and oxygen generator with same

Abstract

The application provides a heat dissipation device and an oxygen generator with the same. The heat dissipation device comprises a refrigeration assembly and a first heat dissipation fan, wherein the refrigeration assembly is located outside a compressor; an air inlet of the first heat dissipation fan is arranged towards the compressor, and an air outlet of the first heat dissipation fan is arranged towards the refrigeration assembly. The heat exchange of the refrigeration assembly removes the heat at the compressor, and the compressor is cooled; the hot air flow at the compressor is blown to the refrigeration assembly by the first heat dissipation fan to perform heat exchange, and the problem of low heat dissipation efficiency of the compressor in the prior art is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of oxygen generator, in particular to a heat dissipation device and an oxygen generator with the same. BACKGROUND

[0002] When the oxygen generator is working, the air compressor inside the oxygen generator will generate high temperature; due to the small internal space and compact structure of the oxygen generator, in order to reduce the vibration noise of the machine body, the internal space is usually sealed and soundproofed, so that the heat dissipation performance of the whole machine is poor. If the temperature inside the compressor is too high for a long time, it will affect the working efficiency and service life of the whole machine, so the oxygen generator usually has auxiliary heat dissipation measures.

[0003] In the prior art, a heat dissipation fan is usually installed on the oxygen generator, which uses the fan to drive air flow to dissipate heat and cool the air compressor. However, the efficiency of using the heat dissipation fan to dissipate heat of the compressor is low. SUMMARY

[0004] The main purpose of the present application is to provide a heat dissipation device and an oxygen generator with the same, so as to solve the problem of low heat dissipation efficiency of the compressor in the prior art.

[0005] In order to achieve the above purpose, according to one aspect of the present application, a heat dissipation device is provided for dissipating heat of a compressor, the heat dissipation device comprising: a refrigeration assembly, the refrigeration assembly being located outside the compressor to remove heat at the compressor through heat exchange of the refrigeration assembly to cool the compressor; a first heat dissipation fan, an air inlet of the first heat dissipation fan being arranged towards the compressor, and an air outlet of the first heat dissipation fan being arranged towards the refrigeration assembly, so that the first heat dissipation fan blows hot air flow at the compressor towards the refrigeration assembly for heat exchange.

[0006] Further, the refrigeration assembly comprises a refrigeration component, the refrigeration component being a semiconductor refrigeration device, the semiconductor refrigeration device comprising oppositely arranged refrigeration end and heating end; wherein the refrigeration end is located on the side of the heating end close to the air outlet of the first heat dissipation fan, so that the air flow blown by the first heat dissipation fan passes through the refrigeration end.

[0007] Further, the heat dissipation device further comprises: a temperature sensor arranged at the air inlet of the first heat dissipation fan and in communication connection with the refrigeration component, so as to detect the temperature at the air inlet of the first heat dissipation fan, and to control the refrigeration component to be turned on or off according to the detection result of the temperature sensor.

[0008] Further, the refrigeration assembly further comprises: a first heat dissipation component, the first heat dissipation component is arranged at one side of the refrigeration component close to the air outlet of the first heat dissipation fan; the first heat dissipation component has a plurality of first airflow channels, each first airflow channel is respectively communicated with the air outlet of the first heat dissipation fan and the refrigeration component, so that the airflow blown by the first heat dissipation fan flows to the refrigeration end through the plurality of first airflow channels.

[0009] Further, the extension direction of each first airflow channel is the air outlet direction of the air outlet of the first heat dissipation fan; and / or the air outlet of the first heat dissipation fan is a strip-shaped port, the distribution direction of the plurality of first airflow channels is the length direction of the air outlet of the first heat dissipation fan; and / or the air outlet of the first heat dissipation fan is a rectangular port, the air inlet of each first airflow channel is a rectangular port and opposite to the air outlet of the first heat dissipation fan, the length direction of the air inlet of the first airflow channel is the width direction of the air outlet of the first heat dissipation fan.

[0010] Further, the refrigeration end has a first length direction and a second length direction perpendicular to each other; the plurality of first airflow channels are distributed along the first length direction, the length direction of each first airflow channel is the same as the second length direction; and / or each first airflow channel has an air outlet opposite to the refrigeration component along the extension direction; and / or the plurality of first airflow channels are located within the annular surface where the outer circumferential surface of the refrigeration component is located.

[0011] Further, the first heat dissipation component comprises a plurality of first heat dissipation fins arranged in sequence and spaced apart, the gap between adjacent two first heat dissipation fins forms a first airflow channel; and / or the heat dissipation device further comprises a first heat conduction medium, the first heat conduction medium is coated between the first heat dissipation component and the refrigeration component, so as to enhance the heat exchange efficiency between the first heat dissipation component and the refrigeration component.

[0012] Further, the heat dissipation device further comprises: a second heat dissipation fan, the air outlet of the second heat dissipation fan is arranged towards the refrigeration component, so that the airflow blown by the second heat dissipation fan is used to dissipate heat and cool the heating end.

[0013] Further, the heat dissipation device further comprises: a second heat dissipation component, the second heat dissipation component is arranged between the air outlet of the second heat dissipation fan and the heating end, the second heat dissipation component has a plurality of second airflow channels, each second airflow channel is respectively communicated with the air outlet of the second heat dissipation fan and the refrigeration component, so that the airflow blown by the second heat dissipation fan flows to the heating end through the plurality of second airflow channels.

[0014] Further, the second heat dissipation fan is a centrifugal fan or an axial fan; and / or the heat dissipation device further comprises a second heat conduction medium coated between the second heat dissipation component and the refrigeration component to increase the heat exchange efficiency between the second heat dissipation component and the refrigeration component through the second heat conduction medium; and / or the second heat dissipation component comprises a plurality of second heat dissipation fins arranged in sequence and at intervals, and a gap between two adjacent second heat dissipation fins forms a second air flow channel.

[0015] Further, the compressor is arranged in the sealed shell, and the heat dissipation device further comprises a sound insulation component arranged around the refrigeration component, the sound insulation component being arranged on the sealed shell to make the heat generating end adhere to the inner wall of the sealed shell.

[0016] Further, the compressor is arranged in the sealed shell, and the sealed shell has a plurality of first mounting holes; the first heat dissipation fan is a centrifugal fan or an axial fan; and / or the first heat dissipation fan has a plurality of second mounting holes arranged in one-to-one correspondence with the plurality of first mounting holes to fix the first heat dissipation fan on the sealed shell through the first connecting piece passing through each second mounting hole and the corresponding first mounting hole.

[0017] Further, the refrigeration assembly comprises the refrigeration component, and the refrigeration component is a heat exchanger comprising a refrigeration channel and a heat exchange channel independent of each other, the refrigeration channel being located on the side of the heat exchange channel close to the air outlet of the first heat dissipation fan to make the fluid in the refrigeration channel absorb the heat of the air flow blown out by the first heat dissipation fan and exchange heat with the fluid in the heat exchange channel.

[0018] According to another aspect of the present application, there is provided an oxygen generator comprising a sealed shell and a compressor arranged in the sealed shell, and the oxygen generator further comprises the heat dissipation device, and the refrigeration assembly and the first heat dissipation fan of the heat dissipation device are respectively arranged on the inner wall of the sealed shell.

[0019] By applying the technical scheme of the present application, the present application provides a heat dissipation device comprising a refrigeration assembly and a first heat dissipation fan, wherein the refrigeration assembly is located on the outside of the compressor; the air inlet of the first heat dissipation fan is arranged towards the compressor, and the air outlet of the first heat dissipation fan is arranged towards the refrigeration assembly. The heat exchange effect of the refrigeration assembly removes the heat at the compressor to cool the compressor; the first heat dissipation fan blows the hot air flow at the compressor towards the refrigeration assembly to exchange heat, thereby solving the problem of low heat dissipation efficiency of the compressor in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings, which form a part of the present application, are used to provide further understanding of the present application, and the illustrative embodiments of the present application and their description serve the purpose of explaining the present application. The present application is not limited by the accompanying drawings.

[0021] Figure 1 Fig. 1 shows a first perspective view of a heat dissipation device in a sealed housing of an oxygen generator according to the present application;

[0022] Figure 2 Fig. 2 shows a second perspective view of a heat dissipation device in a sealed housing of an oxygen generator according to the present application;

[0023] Figure 3 Fig. 3 shows a third perspective view of a heat dissipation device in a sealed housing of an oxygen generator according to the present application;

[0024] Figure 4 Fig. 4 shows a fourth perspective view of a heat dissipation device in a sealed housing of an oxygen generator according to the present application;

[0025] Figure 5 Fig. 5 shows a first perspective view of a heat dissipation device outside a sealed housing of an oxygen generator according to the present application;

[0026] Figure 6 Fig. 6 shows a second perspective view of a heat dissipation device outside a sealed housing of an oxygen generator according to the present application;

[0027] Figure 7 Fig. 7 shows a third perspective view of a heat dissipation device outside a sealed housing of an oxygen generator according to the present application; and

[0028] Figure 8 Fig. 8 shows a heat exchange schematic diagram of a heat dissipation device of an oxygen generator according to the present application.

[0029] Wherein, the above figures include the following reference signs:

[0030] 1, compressor; 2, refrigeration component; 21, refrigeration end; 22, heat generation end; 23, communication connection line; 3, first heat dissipation fan; 31, second mounting opening; 4, sealed housing; 5, first heat dissipation component; 51, first air flow passage; 52, first heat dissipation fin; 6, sound insulation component; 7, second heat dissipation fan; 8, second heat dissipation component; 81, second air flow passage; 82, second heat dissipation fin; 9, temperature sensor; 10, outer housing. DETAILED DESCRIPTION

[0031] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] Reference should be made to Figures 1 to 8This invention provides a heat dissipation device for cooling a compressor 1. The heat dissipation device includes a refrigeration component and a first cooling fan 3. The refrigeration component is located outside the compressor 1 to remove heat from the compressor 1 through heat exchange, thereby cooling the compressor 1. The air inlet of the first cooling fan 3 is arranged facing the compressor 1, and the air outlet of the first cooling fan 3 is arranged facing the refrigeration component, so that the hot air from the compressor 1 is blown towards the refrigeration component for heat exchange.

[0033] This invention provides a heat dissipation device, which includes a cooling component and a first cooling fan 3. The first cooling fan 3 blows hot air from the compressor 1 towards the cooling component, and the heat from the compressor 1 is removed through the heat exchange of the cooling component. By cooling the hot air from the compressor 1 and circulating the air around the compressor 1, the compressor 1 is cooled, thereby solving the problem of low heat dissipation efficiency of the compressor 1 in the prior art.

[0034] In the first embodiment:

[0035] like Figures 1 to 4 As shown, the refrigeration component in this embodiment includes a refrigeration component 2. In order to remove the heat from the compressor 1 through heat exchange, the refrigeration component 2 is a semiconductor refrigeration component, which includes a refrigeration end 21 and a heating end 22 arranged opposite to each other.

[0036] The cooling end 21 is located on the side of the heating end 22 near the air outlet of the first cooling fan 3, so that the airflow blown out by the first cooling fan 3 passes through the cooling end 21, thereby exchanging heat with the airflow blown out by the first cooling fan 3 through the cooling end 21, and thus cooling the airflow.

[0037] Specifically, the semiconductor cooling device also includes a communication connection line 23, which is used to connect to a power source to supply power to the semiconductor cooling device. When the semiconductor cooling device is powered on, the temperature of the cooling end 21 decreases and the temperature of the heating end 22 increases.

[0038] In particular, the thermoelectric cooling device is a thermoelectric cooling chip, and choosing a thermoelectric cooling chip has the following advantages:

[0039] 1) High efficiency and energy saving: Semiconductor cooling chips can have a high efficiency of cooling effect, and at the same time, they consume less energy compared to traditional compression cooling systems.

[0040] 2) High reliability: The semiconductor cooling chip has a simple composition and no mechanical moving parts, so it has high reliability and stability.

[0041] 3) Compact size: While ensuring cooling effect, it is small in size and light in weight.

[0042] 4) Easy to operate: easy to operate and maintain without professional personnel.

[0043] 5) Green and environmentally friendly: using semiconductor materials for refrigeration will not cause pollution.

[0044] Further, in order to facilitate the control of opening or closing the semiconductor refrigeration device, the heat dissipation device further comprises a temperature sensor 9, which is arranged at the air inlet of the first heat dissipation fan 3 and is in communication connection with the refrigeration component 2, so as to detect the temperature at the air inlet of the first heat dissipation fan 3, and control the refrigeration component 2 to open or close according to the detection result of the temperature sensor 9.

[0045] When the real-time temperature detected by the temperature sensor 9 is higher than the predetermined temperature, the semiconductor refrigeration device is controlled to be turned on; when the real-time temperature detected by the temperature sensor 9 is lower than the predetermined temperature, the semiconductor refrigeration device is controlled to be turned off.

[0046] In order to improve the heat exchange efficiency and increase the heat exchange area, the refrigeration assembly further comprises a first heat dissipation component 5 arranged on one side of the refrigeration component 2 close to the air outlet of the first heat dissipation fan 3; the first heat dissipation component 5 has a plurality of first airflow channels 51, each of which is in communication with the air outlet of the first heat dissipation fan 3 and the refrigeration component 2, so that the airflow blown out by the first heat dissipation fan 3 flows to the refrigeration end 21 after passing through the plurality of first airflow channels 51, thereby preventing the airflow from being blown out from the air outlet of the first heat dissipation fan 3 without passing through the refrigeration end 21, and improving the heat exchange efficiency.

[0047] Specifically, the first airflow channel 51 in the embodiment has the following implementation manners:

[0048] The first implementation manner is that the extension direction of each first airflow channel 51 is the air outlet direction of the air outlet of the first heat dissipation fan 3, so that the airflow blown out of the air outlet of the first heat dissipation fan 3 can flow out along the extension direction of the first airflow channel 51, and the airflow exchanges heat with the refrigeration end 21 during the flow process.

[0049] The second implementation manner is that the air outlet of the first heat dissipation fan 3 is a strip-shaped opening, and the distribution direction of the plurality of first airflow channels 51 is the length direction of the air outlet of the first heat dissipation fan 3, so that the airflow blown out of the air outlet of the first heat dissipation fan 3 can flow out of the plurality of first airflow channels 51, preventing a large amount of airflow from accumulating in the same first airflow channel 51, thereby preventing the local heat exchange pressure of the refrigeration end 21 from being too large, and improving the heat exchange efficiency.

[0050] The third implementation is that the air outlet of the first cooling fan 3 is a rectangular opening, the air inlet of each first airflow channel 51 is a rectangular opening and is opposite to the air outlet of the first cooling fan 3, and the length direction of the air inlet of the first airflow channel 51 is the width direction of the air outlet of the first cooling fan 3, so that the airflow blown out of the air outlet of the first cooling fan 3 enters the first airflow channel 51 through the air inlet of the first airflow channel 51.

[0051] The above three implementations can be combined with each other in the specific implementation.

[0052] Further, the specific installation mode between the refrigeration component 2 and the first cooling fan 3 in the embodiment is that:

[0053] The first installation mode is that the refrigeration end 21 has a first length direction and a second length direction perpendicular to each other; the plurality of first airflow channels 51 are distributed along the first length direction, and the length direction of each first airflow channel 51 is the same as the second length direction, so that the airflow exchanges heat with the refrigeration end 21 in the process of flowing along the second length direction.

[0054] The second installation mode is that each first airflow channel 51 has an air outlet opposite to the refrigeration component 2 along the extension direction, so that the airflow after heat exchange with the refrigeration end 21 flows out of the air outlet.

[0055] The third installation mode is that the plurality of first airflow channels 51 are located within the annular surface where the outer circumferential surface of the refrigeration component 2 is located, so as to facilitate the airflow passing through the first airflow channel 51 to exchange heat with the refrigeration end 21 of the refrigeration component 2 and improve the heat exchange efficiency.

[0056] The above three installation modes can be combined with each other in the specific implementation.

[0057] Specifically, the first cooling component 5 includes a plurality of first cooling fins 52 arranged in sequence and at intervals, and the gap between adjacent two first cooling fins 52 forms the first airflow channel 51. Preferably, the first cooling fin 52 is usually made of aluminum, and the first cooling fin 52 includes a cooling fin. Such a setting increases the heat exchange area while preventing the local temperature of the surface of the first cooling fin 52 from being too low to cause condensation.

[0058] In particular, in order to improve the heat conduction efficiency, the heat dissipation device in the embodiment further comprises a first heat conduction medium coated between the first heat dissipation component 5 and the refrigeration component 2 to enhance the heat exchange efficiency between the first heat dissipation component 5 and the refrigeration component 2. Preferably, the first heat conduction medium is a heat dissipation silicone grease, which is a heat conduction material for electronic equipment to improve the heat transfer efficiency of the semiconductor refrigeration component. The heat dissipation silicone grease is arranged between the first heat dissipation component 5 and the refrigeration component 2. The airflow flowing through the first heat dissipation component 5 is dissipated on the refrigeration component 2 through the heat conduction performance of the heat dissipation silicone grease, thereby improving the heat exchange efficiency. Such arrangement can effectively maintain the stability and reliability of the refrigeration component 2 during operation and prolong the service life of the refrigeration component 2.

[0059] Further, since the heating end 22 is continuously heated during the cooling process of the refrigeration end 21, it is necessary to cool the heating end 22. In order to dissipate heat and cool the heating end 22, the heat dissipation device further comprises a second heat dissipation fan 7, and the air outlet of the second heat dissipation fan 7 is arranged towards the heating end 22 of the refrigeration component 2 to dissipate heat and cool the heating end 22 through the airflow blown by the second heat dissipation fan 7, thereby prolonging the service life of the refrigeration component 2.

[0060] In addition, in order to improve the heat dissipation efficiency of the second heat dissipation fan 7 on the heating end 22, the heat dissipation device further comprises a second heat dissipation component 8 arranged between the air outlet of the second heat dissipation fan 7 and the heating end 22. The second heat dissipation component 8 has a plurality of second airflow channels 81, each of which is respectively communicated with the air outlet of the second heat dissipation fan 7 and the refrigeration component 2, so that the airflow blown by the second heat dissipation fan 7 flows to the heating end 22 through the plurality of second airflow channels 81, thereby exchanging heat with the heating end 22 during the airflow flowing through the plurality of second airflow channels 81, preventing the airflow from being blown out of the air outlet of the second heat dissipation fan 7 without passing through the heating end 22, and further increasing the heat exchange area and improving the heat exchange efficiency.

[0061] Optionally, the second heat dissipation fan 7 is a centrifugal fan, which has the following advantages: 1) stronger pressure capacity: the centrifugal fan has higher pressure capacity under the same size and speed; 2) wide range of air volume: the centrifugal fan is suitable for most air conveying requirements; 3) good anti-blocking performance: the internal structure of the centrifugal fan is not easy to be blocked or damaged by materials, and it has more advantages when processing gas containing particulate matter; 4) effective use of space: the centrifugal fan has lower requirements for installation space and can be arranged in a compact area, and the layout requirements can be met by changing the direction of the air inlet and air outlet; 5) good running stability: the centrifugal fan reduces the vortex effect caused by the interaction between the blades, so that the vibration and noise are small during operation.

[0062] Alternatively, the second heat dissipation fan 7 is an axial fan, which has the following advantages: 1) high energy efficiency: since the gas flowing through the axial fan can freely pass through the blades along the inlet and outlet, the resistance and vortex loss are reduced, so that the power consumption of the axial fan is lower under the same air volume and static pressure; 2) small size: the structure of the axial fan is simple and small in size; 3) good air pressure stability: the air pressure stability of the axial fan is better; 4) low maintenance cost: the structure of the axial fan is simple and easy to maintain, so that the maintenance cost is lower.

[0063] In particular, in order to improve the heat conduction efficiency, the heat dissipation device in the embodiment further comprises a second heat conduction medium coated between the second heat dissipation component 8 and the refrigeration component 2, so as to increase the heat exchange efficiency between the second heat dissipation component 8 and the refrigeration component 2 through the second heat conduction medium. Preferably, the first heat conduction medium is a heat dissipation silicone grease, which is a heat conduction material for electronic equipment to improve the heat transfer efficiency of the semiconductor refrigeration component. The heat dissipation silicone grease is arranged between the second heat dissipation component 8 and the refrigeration component 2, and the airflow flowing through the second heat dissipation component 8 is dissipated on the refrigeration component 2 through the heat conduction performance of the heat dissipation silicone grease, thereby improving the heat exchange efficiency. Such arrangement can effectively maintain the stability and reliability of the refrigeration component 2 during operation and prolong the service life of the refrigeration component 2.

[0064] Specifically, the second heat dissipation component 8 comprises a plurality of second heat dissipation fins 82 arranged in sequence and at intervals, and the gap between adjacent two second heat dissipation fins 82 forms a second airflow channel 81. Preferably, the second heat dissipation fin 82 is usually made of aluminum, and the second heat dissipation fin 82 comprises heat dissipation fins. Such arrangement increases the heat exchange area while preventing the local temperature of the surface of the second heat dissipation fin 82 from being too low to cause condensation.

[0065] Generally, the compressor 1 is arranged in the sealed shell 4, and the sealed shell 4 is made of a bent and spliced sheet metal part. In order to reduce the noise of the compressor 1 during operation, the heat dissipation device further comprises a sound insulation component 6 arranged on the inner wall of the sealed shell 4. However, since the sound insulation component 6 has a certain thickness, in the process of arranging the refrigeration component 2, the heat conduction efficiency of the heat generating end 22 of the refrigeration component 2 is prevented from being reduced due to the effect of the sound insulation component 6. Therefore, the sound insulation component 6 is removed from the installation part of the refrigeration component 2, so that the sound insulation component 6 is arranged around the refrigeration component 2, so that the heat generating end 22 is attached to the inner wall of the sealed shell 4. Such arrangement enables the heat generating end 22 and the sealed shell 4 to directly conduct heat, avoiding the reduction of heat conduction efficiency caused by the arrangement of the sound insulation component 6.

[0066] In addition, the outer wall of the sealed shell 4 is provided with a plurality of third mounting holes, and the second heat dissipation component 8 has a plurality of fourth mounting holes corresponding to the plurality of third mounting holes, so that the second heat dissipation component 8 is fixed on the outer wall of the sealed shell 4 by the second connecting pieces passing through each fourth mounting hole and the corresponding third mounting hole.

[0067] Further, the second heat dissipation fan 7 has a plurality of fifth mounting holes corresponding to the plurality of fourth mounting holes, so that the second heat dissipation fan 7 and the second heat dissipation component 8 are fixed on the outer wall of the sealed shell 4 by the second connecting pieces passing through each fifth mounting hole, each fourth mounting hole and the corresponding third mounting hole.

[0068] Specifically, the second connecting piece includes a bolt and a nut, one end of the bolt passes through the fifth mounting hole, the fourth mounting hole and the third mounting hole and is threadedly connected with the nut.

[0069] Preferably, the sound insulation component 6 is sound-absorbing cotton, which is attached to the inner wall of the sealed shell 4 to absorb the noise inside the sealed shell 4 through the sound-absorbing cotton.

[0070] In the second embodiment:

[0071] The refrigeration assembly includes a refrigeration component 2, which is a heat exchanger including a refrigeration channel and a heat exchange channel independent of each other, and the refrigeration channel is located on the side of the heat exchange channel close to the air outlet of the first heat dissipation fan 3, so that the fluid in the refrigeration channel absorbs the heat of the airflow blown out by the first heat dissipation fan 3 and exchanges heat with the fluid in the heat exchange channel. Selecting the heat exchanger to exchange heat with the airflow blown out by the air outlet of the first heat dissipation fan 3 can reduce energy consumption, and the refrigeration cooling is directly performed by exchanging heat between the fluid in the refrigeration channel and the airflow, so that the refrigeration process is more environmentally friendly.

[0072] Optionally, the first heat dissipation fan 3 is a centrifugal fan, which has the following advantages: 1) stronger pressure capacity: the centrifugal fan has higher pressure capacity under the same size and speed; 2) wide range of air volume: the centrifugal fan is suitable for most air conveying requirements; 3) good anti-blocking performance: the internal structure of the centrifugal fan is not easy to be blocked or damaged by materials, and it has more advantages when processing gas containing particulate matter; 4) effective use of space: the centrifugal fan has lower requirements for installation space and can be set in a compact area, and the layout requirements can be met by changing the direction of the air inlet and air outlet; 5) good running stability: the centrifugal fan reduces the vortex effect caused by the interaction between the blades, so that the vibration and noise are small during operation.

[0073] Alternatively, the first heat dissipation fan 3 is an axial fan, which has the following advantages: 1) high energy efficiency: since the gas flowing through the axial fan can freely pass through the blades along the inlet and outlet, the resistance and vortex loss are reduced, so that the power consumption of the axial fan is lower under the same air volume and static pressure; 2) small size: the axial fan has a simple structure and small size; 3) good air pressure stability: the axial fan has better air pressure stability; 4) low maintenance cost: the structure of the axial fan is simple and easy to maintain, so that the maintenance cost is low.

[0074] In addition, in order to arrange the first heat dissipation fan 3 on the inner wall of the sealed shell 4, the sealed shell 4 has a plurality of first mounting holes, and the first heat dissipation fan 3 has a plurality of second mounting holes 31 arranged in one-to-one correspondence with the plurality of first mounting holes, so as to fix the first heat dissipation fan 3 on the inner wall of the sealed shell 4 by the first connecting pieces passing through each second mounting hole 31 and the corresponding first mounting hole.

[0075] Specifically, the first connecting piece includes a bolt and a nut, one end of the bolt passes through the second mounting hole and the first mounting hole and is threadedly connected with the nut.

[0076] The application also provides an oxygen generator, which comprises a sealed shell 4 and a compressor 1 arranged in the sealed shell 4, and further comprises the heat dissipation device described above, and the refrigeration assembly and the first heat dissipation fan 3 of the heat dissipation device are respectively arranged on the inner wall of the sealed shell 4.

[0077] Specifically, the oxygen generator has an outer shell 10 made of plastic, and the sealed shell 4 is arranged in the outer shell 10 and is made of a bent and spliced sheet metal piece, the inner cavity of the sealed shell 4 is a closed space, the compressor 1 is arranged in the sealed shell 4, and the refrigeration component 2, the first heat dissipation fan 3 and the first heat dissipation component 5 are arranged in the sealed shell 4; the second heat dissipation fan 7 and the second heat dissipation component 8 are arranged between the sealed shell 4 and the outer shell 10, and the second heat dissipation component 8 is connected with the outer wall of the sealed shell 4.

[0078] As shown in Figure 8 When the refrigeration component 2 is a semiconductor refrigeration component, the heat exchange of the heat dissipation device is as follows:

[0079] 1) in the sealed housing 4: the hot air flow generated at the compressor 1 enters from the air inlet of the first heat dissipation fan 3 under the action of the first heat dissipation fan 3, and is blown out from the air outlet of the first heat dissipation fan 3, when the real-time temperature of the air flow detected by the temperature sensor 9 is higher than the predetermined temperature, the control is opened to the semiconductor refrigeration piece; at this time, the air flow blown out from the air outlet of the first heat dissipation fan 3 flows through the first air flow channel 51 of the first heat dissipation component 5, and exchanges heat with the refrigeration end 21 of the semiconductor refrigeration piece, and then flows to the inside of the sealed housing 4 and further to the surroundings of the compressor 1.

[0080] 2) outside the sealed housing 4: due to the fact that the heating end 22 of the semiconductor refrigeration piece is attached to the inner wall of the sealed housing 4, the heat at the heating end 22 is transmitted from the sealed housing 4 to the outside of the sealed housing 4, at this time, under the action of the second heat dissipation fan 7, the air flow between the sealed housing 4 and the outer housing 10 is circulated, and the air flow blown out from the air outlet of the second heat dissipation fan 7 flows through the second air flow channel 81 of the second heat dissipation component 8, and exchanges heat with the heating end 22 of the semiconductor refrigeration piece, so as to dissipate heat and cool the sealed housing 4 attached to the heating end 22.

[0081] From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:

[0082] The present application provides a heat dissipation device, which comprises a refrigeration component and a first heat dissipation fan 3. Wherein, the refrigeration component is located outside the compressor 1; the air inlet of the first heat dissipation fan 3 is arranged towards the compressor 1, and the air outlet of the first heat dissipation fan 3 is arranged towards the refrigeration component. The hot air flow at the compressor 1 is blown towards the refrigeration component by the first heat dissipation fan 3, and the heat at the compressor 1 is taken away by the heat exchange effect of the refrigeration component, and the compressor 1 is cooled by cooling the hot air flow at the compressor 1 and circulating the air flow around the compressor 1, thereby solving the problem of low heat dissipation efficiency of the compressor 1 in the prior art.

[0083] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipating device for dissipating heat from a compressor (1), characterized in that, The heat dissipation device comprises: a refrigeration assembly located outside the compressor (1) to remove heat at the compressor (1) through heat exchange of the refrigeration assembly to cool the compressor (1); a first heat dissipation fan (3) with an air inlet facing the compressor (1) and an air outlet facing the refrigeration assembly to blow hot air at the compressor (1) to the refrigeration assembly through the first heat dissipation fan (3) for heat exchange; the refrigeration assembly comprises a refrigeration component (2) which is a semiconductor refrigerating element, the compressor (1) is arranged in a sealed shell (4), and the heat dissipation device further comprises: a sound insulation component (6) arranged around the refrigeration component (2), the sound insulation component (6) is arranged on the sealed shell (4) to make the heating end (22) of the semiconductor refrigerating element adhere to the inner wall of the sealed shell (4); or, the refrigeration assembly comprises a refrigeration component (2) which is a heat exchanger, the heat exchanger comprises a refrigeration channel and a heat exchange channel which are independent of each other, and the refrigeration channel is located on the side of the heat exchange channel close to the air outlet of the first heat dissipation fan (3) to make the fluid in the refrigeration channel absorb heat of the air blown out by the first heat dissipation fan (3) and exchange heat with the fluid in the heat exchange channel.

2. The heat dissipation device according to claim 1, wherein the semiconductor refrigerating element comprises a refrigeration end (21) and a heating end (22) arranged oppositely; the refrigeration end (21) is located on the side of the heating end (22) close to the air outlet of the first heat dissipation fan (3) to make the air blown out by the first heat dissipation fan (3) pass through the refrigeration end (21).

3. The heat dissipating device of claim 2, wherein The heat dissipation device further comprises: a temperature sensor (9) arranged at the air inlet of the first heat dissipation fan (3) and in communication connection with the refrigeration component (2) to detect the temperature at the air inlet of the first heat dissipation fan (3) to control the refrigeration component (2) to be turned on or off according to the detection result of the temperature sensor (9).

4. The heat dissipating device of claim 2, wherein The refrigeration assembly further comprises: a first heat dissipation component (5) arranged on the side of the refrigeration component (2) close to the air outlet of the first heat dissipation fan (3); the first heat dissipation component (5) has a plurality of first air flow channels (51), each of the first air flow channels (51) is in communication with the air outlet of the first heat dissipation fan (3) and the refrigeration component (2) respectively to make the air blown out by the first heat dissipation fan (3) flow to the refrigeration end (21) after passing through the plurality of first air flow channels (51).

5. The heat dissipation device according to claim 4, wherein the extension direction of each of the first air flow channels (51) is the air outlet direction of the air outlet of the first heat dissipation fan (3); and / or The air outlet of the first heat dissipation fan (3) is a strip-shaped opening, and the distribution direction of the plurality of first airflow channels (51) is the length direction of the air outlet of the first heat dissipation fan (3); and / or The air outlet of the first heat dissipation fan (3) is a rectangular opening, the air inlet of each first airflow channel (51) is a rectangular opening and is opposite to the air outlet of the first heat dissipation fan (3), and the length direction of the air inlet of the first airflow channel (51) is the width direction of the air outlet of the first heat dissipation fan (3).

6. The heat dissipation device according to claim 4, characterized in that, The refrigeration end (21) has a first length direction and a second length direction perpendicular to each other; the plurality of first airflow channels (51) are distributed along the first length direction, and the length direction of each first airflow channel (51) is the same as the second length direction; and / or Each first airflow channel (51) has an air outlet opposite to the refrigeration component (2) along the extension direction; and / or The plurality of first airflow channels (51) are located within the annular surface where the outer circumferential surface of the refrigeration component (2) is located.

7. The heat dissipation device according to claim 4, characterized in that, The first heat dissipation component (5) comprises a plurality of first heat dissipation fins (52) arranged in sequence and spaced apart, and the gap between adjacent two first heat dissipation fins (52) forms the first airflow channel (51); and / or The heat dissipation device further comprises a first heat-conducting medium, which is coated between the first heat dissipation component (5) and the refrigeration component (2) to enhance the heat exchange efficiency between the first heat dissipation component (5) and the refrigeration component (2).

8. The heat dissipating device according to any one of claims 2 to 7, wherein, The heat dissipation device further comprises: A second heat dissipation fan (7), and the air outlet of the second heat dissipation fan (7) is arranged towards the refrigeration component (2) to dissipate heat from the heating end (22) by the airflow blown by the second heat dissipation fan (7).

9. The heat dissipating device according to claim 8, wherein The heat dissipation device further comprises: A second heat dissipation component (8) arranged between the air outlet of the second heat dissipation fan (7) and the heating end (22), and the second heat dissipation component (8) has a plurality of second airflow channels (81), each of which is in communication with the air outlet of the second heat dissipation fan (7) and the refrigeration component (2) respectively, so that the airflow blown by the second heat dissipation fan (7) flows to the heating end (22) through the plurality of second airflow channels (81).

10. The heat dissipation device according to claim 9, characterized in that, The second heat dissipation fan (7) is a centrifugal fan or an axial flow fan; and / or The heat dissipation device further comprises a second heat-conducting medium, which is coated between the second heat dissipation component (8) and the refrigeration component (2) to increase the heat exchange efficiency between the second heat dissipation component (8) and the refrigeration component (2) through the second heat-conducting medium; and / or The second heat dissipation component (8) comprises a plurality of second heat dissipation fins (82) arranged in sequence and at intervals, and gaps between adjacent two second heat dissipation fins (82) form the second airflow channel (81).

11. The heat dissipating device according to any one of claims 1 to 7, wherein The compressor (1) is arranged in a sealed shell (4), and the sealed shell (4) has a plurality of first mounting holes; The first heat dissipation fan (3) is a centrifugal fan or an axial flow fan; and / or The first heat dissipation fan (3) has a plurality of second mounting holes (31), and the plurality of second mounting holes (31) are arranged in one-to-one correspondence with the plurality of first mounting holes, so as to fix the first heat dissipation fan (3) on the sealed shell (4) through a first connecting piece penetrating through each second mounting hole (31) and the corresponding first mounting hole.

12. An oxygen generator comprising a sealed housing (4) and a compressor (1), said compressor (1) being arranged within said sealed housing (4), characterized in that, The oxygen generator further comprises: The heat dissipation device of any one of claims 1 to 11, wherein the refrigeration assembly and the first heat dissipation fan (3) of the heat dissipation device are respectively arranged on the inner wall of the sealed shell (4).

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