Electronic package and method of making same, and antenna module and method of making same

Abstract

The present application relates to an electronic package, a method for manufacturing the same, and an antenna module, a method for manufacturing the same. The antenna module includes a plurality of antenna structures and a shielding structure arranged on a board. The shielding structure is located between two adjacent antenna structures. The shielding structure includes a recess formed on the board and a dielectric material formed between the recess and the antenna structures to generate different impedance characteristics and improve antenna isolation.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging process, and more particularly to an electronic package with an antenna structure and its manufacturing method. Background Technology

[0002] With the evolution of semiconductor technology, semiconductor products have been developed in different packaging forms.

[0003] With the rapid development of wireless communication and the ever-increasing volume of network resources, the required wireless transmission bandwidth is also growing. As a result, the commercialization of 4G mobile communication technology has just begun, and the research and development of 5G mobile communication technology has already begun. In order to improve electrical quality, many semiconductor products (such as radio frequency modules) have shielding functions to prevent electromagnetic interference (EMI).

[0004] However, the demand for 5G antenna components in mobile devices is driving down their size due to miniaturization, which reduces the distance between antennas and results in a decrease in antenna gain.

[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Summary of the Invention

[0006] In view of the various shortcomings of the prior art, the present invention provides an electronic package and its manufacturing method and an antenna module and its manufacturing method, which can improve antenna isolation.

[0007] The antenna module of the present invention includes: a plate; a plurality of antenna structures arranged in an array on the plate; and a shielding structure disposed on the plate and located between two adjacent antenna structures, such that the plate, the plurality of antenna structures and the shielding structure form a substrate, wherein the shielding structure includes a recess disposed on the plate and a dielectric material located between the recess and the plurality of antenna structures.

[0008] The present invention also provides a method for manufacturing an antenna module, comprising: arranging a plurality of antenna structures in an array on a plate; and cutting a recess in the plate such that the recess is located between two adjacent antenna structures, and having a dielectric material between the recess and the plurality of antenna structures, so that the recess and the dielectric material serve as a shielding structure, thereby forming a substrate from the plate, the plurality of antenna structures and the shielding structure.

[0009] In the aforementioned antenna module and its manufacturing method, the depth of the recess is equal to the height of the plurality of antenna structures.

[0010] In the aforementioned antenna module and its manufacturing method, the depth of the recess is less than the height of the plurality of antenna structures. For example, the depth of the recess is greater than 1 / 3 of the height of the plurality of antenna structures.

[0011] In the aforementioned antenna module and its manufacturing method, the plate has multiple shielding structures, and the recesses of the multiple shielding structures are spaced apart and not connected, and the multiple shielding structures and the multiple antenna structures are arranged alternately. Alternatively, the plate has multiple shielding structures, and the recesses of the multiple shielding structures are connected to form a manifold-like trench, such that the trench defines multiple antenna receiving areas, so that at least one antenna structure is disposed in a single antenna receiving area. Furthermore, the recesses are connected to the side surface of the plate.

[0012] In the aforementioned antenna module and its manufacturing method, the width of the recess is designed to be wider on the outside and narrower on the inside.

[0013] In the aforementioned antenna module and its manufacturing method, the plate has a grounding trace exposed on the sidewall of the recess. For example, a metal layer is formed on the sidewall of the recess to electrically connect the grounding trace.

[0014] The aforementioned antenna module and its manufacturing method further include forming a full-area encapsulation material on the plate before forming the recess to cover the plurality of antenna structures, and forming a perforation on the full-area encapsulation material to form a resonant structure. Alternatively, it further includes providing a resonant structure with a perforation through which the perforation penetrates, and then pressing the resonant structure onto the plate to correspondingly cover the plurality of antenna structures, with the perforation corresponding to the recess so that the perforation connects to the recess.

[0015] In the aforementioned antenna module and its manufacturing method, the projection outline of the perforation and the projection outline of the recess are substantially superimposed.

[0016] In the aforementioned antenna module and its manufacturing method, the aperture projection profile of the perforation surrounds the aperture projection profile of the recess.

[0017] In the aforementioned antenna module and its manufacturing method, the perforation has a narrow opening on one side close to the plurality of antenna structures and a wide opening on one side away from the plurality of antenna structures and with a width greater than the width of the narrow opening. The opening projection profile of the narrow opening substantially overlaps with the opening projection profile of the recess, while the opening projection profile of the wide opening surrounds the opening projection profile of the narrow opening.

[0018] In the aforementioned antenna module and its fabrication method, the resonant structure comprises multiple dielectric layers. For example, the outermost dielectric layer of the resonant structure has the highest dielectric constant.

[0019] In the aforementioned antenna module and its manufacturing method, the resonant structure is a dielectric with a dielectric constant greater than 10.

[0020] The present invention also provides an electronic package, comprising: the aforementioned antenna module; and a package module electrically connected to the antenna module.

[0021] The present invention also provides a method for manufacturing an electronic package, comprising: providing a package module and a aforementioned antenna module; and electrically connecting the package module to the antenna module.

[0022] As can be seen from the above, in the electronic package and antenna module and manufacturing method of the present invention, the dielectric material and the recess are mainly formed between two adjacent antenna structures to generate different impedance characteristics through different media, so that the two adjacent antenna structures have a discontinuous impedance distribution, thereby improving the antenna isolation. Therefore, compared with the prior art, the electronic package of the present invention can still maintain good antenna signal after shrinking the size, and can improve antenna gain, thus significantly improving antenna operating performance. Attached Figure Description

[0023] Figures 1A to 1B This is a cross-sectional schematic diagram of a first embodiment of the manufacturing method of the electronic package of the present invention.

[0024] Figure 1C and Figure 1D for Figure 1B Cross-sectional schematic diagram of other embodiments.

[0025] Figures 2A to 2D for Figure 1B A partial downward-viewing plane diagram.

[0026] Figure 3A and Figure 3B for Figure 1B Cross-sectional schematic diagram of other embodiments.

[0027] Figure 4A and Figure 4B for Figure 1B Cross-sectional schematic diagram of other embodiments.

[0028] Figures 5A to 5B This is a cross-sectional schematic diagram of a second embodiment of the manufacturing method of the electronic package of the present invention.

[0029] Figure 6A , Figure 6B and Figure 6C for Figure 5B Cross-sectional schematic diagram of other embodiments.

[0030] Figure 7 This is a schematic diagram showing the change in antenna isolation between the antenna module of the present invention and a conventional antenna module during operation.

[0031] Explanation of main component symbols

[0032] 1,4,5 Electronic packages

[0033] 1a Package Module

[0034] 1b Antenna Module

[0035] 10,40 Line Structure

[0036] 10a First side

[0037] 10b Second side

[0038] 11 Electronic components

[0039] 12 Encapsulation Layer

[0040] 13 Conductive elements

[0041] 14,44 plates

[0042] 14a First Surface

[0043] 14b Second Surface

[0044] 14c Side View

[0045] 140 Dielectric Material

[0046] 15 Antenna Structure

[0047] 16,26 Shielding structure

[0048] 160,161,260 concave part

[0049] 17 Electronic connectors

[0050] 340 Grounding Traces

[0051] 341 Metal Layer

[0052] 58,68 resonance structure

[0053] 580, 680, 681 perforations

[0054] 68a, 68b dielectric layers

[0055] 681a Narrow Mouth

[0056] 681b Wide Mouth

[0057] A, A1, A2 Opening Projection Profile

[0058] B trench

[0059] Depth D,d

[0060] H height

[0061] Widths of R, R1, R2

[0062] t Distance

[0063] S Antenna Reception Area

[0064] S21 Antenna Isolation

[0065] L1, L2 curves

[0066] The difference between Z1 and Z2. Detailed Implementation

[0067] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0068] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0069] Figures 1A to 1B This is a cross-sectional schematic diagram of a first embodiment of the manufacturing method of the electronic package 1 of the present invention.

[0070] like Figure 1A As shown, a package module 1a and an antenna module 1b are provided. The package module 1a is a system-in-package (SiP) structure, which integrates multiple chips into a single package. Due to the operational requirements of multiple chips, at least one passive component such as a capacitor and an inductor is usually provided to quickly store energy and boost / buck voltage to ensure that power can be effectively and timely supplied to each chip. The antenna module 1b is an antenna substrate specification.

[0071] In this embodiment, the packaging module 1a includes a circuit structure 10, a plurality of electronic components 11 disposed on the circuit structure 10, and a packaging layer 12 disposed on the circuit structure 10 to cover the electronic components 11.

[0072] Furthermore, the method of manufacturing the antenna module 1b includes: arranging a plurality of arrayed antenna structures 15 on a plate 14, and then performing a half-cutting process to cut at least one recess 160 on the plate 14, such that the recess 160 is located between two adjacent antenna structures 15, and a dielectric material 140 is provided between the recess 160 and the antenna structure 15, so that the recess 160 and the dielectric material 140 serve as a shielding structure 16, and the plate 14, the plurality of antenna structures 15 and the shielding structure 16 form a substrate.

[0073] The circuit structure 10 is, for example, a packaging substrate with a core layer or a coreless carrier board, which forms multiple circuit layers on an insulating material, such as a fan-out redistribution layer (RDL).

[0074] In this embodiment, the material forming the circuit layer is copper, and the insulating material is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder resist such as green paint or ink.

[0075] Furthermore, the circuit structure 10 has opposing first sides 10a and second sides 10b, and a plurality of conductive elements 13 electrically connected to the circuit layer can be formed on the second side 10b of the circuit structure 10. For example, the conductive element 13 may be a spherical solder ball, or a columnar metal material such as a copper pillar or solder bump, or a stud conductor made by a wire bonding machine, but is not limited to these.

[0076] The electronic component 11 is disposed on the first side 10a of the circuit structure 10, and the electronic component 11 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0077] In this embodiment, the electronic component 11 can be electrically connected to the circuit layer of the circuit structure 10 via flip-chip bonding, wire bonding, direct contact with the circuit layer of the circuit structure, or other suitable methods, without any particular limitation.

[0078] The encapsulation layer 12 is disposed on the first side 10a of the circuit structure 10 to cover the electronic component 11.

[0079] In this embodiment, the encapsulation layer 12 is an insulating material, such as polyimide (PI), dry film, encapsulation colloid or molding compound such as epoxy resin, but is not limited to the above.

[0080] The plate 14 is the substrate of the antenna substrate, and has a first surface 14a and a second surface 14b opposite to each other, so that the plurality of antenna structures 15 and the plurality of shielding structures 16 are formed on the first surface 14a of the plate 14.

[0081] In this embodiment, the board 14 has a dielectric material 140 and a wiring layer (not shown), so that the board 14 can be a package substrate with a core layer and a circuit structure or a circuit structure without a core layer, but is not limited to the above.

[0082] The plurality of antenna structures 15 are formed on the first surface 14a of the plate 14, so that the first surface 14a of the plate 14 serves as the antenna signal transceiver surface of the antenna plate.

[0083] In this embodiment, the plurality of antenna structures 15 are arrayed on the first surface 14a, such as... Figure 2A As shown. For example, the antenna structure 15 includes multiple coupled antenna layers and can be a single-frequency antenna design or a multi-frequency antenna design with more than two bandwidths.

[0084] The shielding structure 16 is formed on the first surface 14a of the plate 14, such that the plurality of shielding structures 16 and the plurality of antenna structures 15 are all formed on the same side of the plate 14 and are arranged in an alternating (or interlaced) manner, and includes the recess 160 and the dielectric material 140 located between the two antenna structures 15, wherein the recess 160 is an air gap, and the dielectric material 140 is such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.

[0085] In this embodiment, the depth of the recess 160 can be designed to accommodate the height adjustment of the antenna structure 15. For example... Figure 1A The depth d of the recess 160 shown is less than the height H of the antenna structure 15. If the depth d of the recess 160 is greater than 1 / 3 of the height H of the antenna structure 15, the antenna isolation can be effectively improved. However, the preferred embodiment of the recess 160 is to completely fit the antenna structure 15, that is, the depth D of the recess 160 corresponds to the layer height of its adjacent antenna structure 15, such as... Figure 1C The depth D shown is equal to the height H of the antenna structure 15.

[0086] Furthermore, the width R of the recess 160 can be a constant value, which is related to the distance t between two adjacent antenna structures 15, such as... Figure 1A and Figure 2AAs shown. For example, the width R of the recess 160 is more than 10% but less than 100% of the distance t (because dielectric material 140 needs to be retained around the recess 160).

[0087] Or, such as Figure 1D As shown, the widths R1 and R2 of the recess 161 are non-fixed values, making the width R2 of the recess 161 narrower on the side near the second surface 14b of the plate 14, thus exhibiting a shape that is wider on the outside and narrower on the inside. For example, the recess 161 can be a stepped groove, such as... Figure 1D The top-narrowing and bottom-widening design allows the plate 14 to have more wiring (pattern layout) area inside. Furthermore, the width R1 of the wide side of the recess 161 is more than 15% but less than 100% of the distance t (because dielectric material 140 needs to be retained around the recess 160), while the width R2 of the narrow side of the recess 161 is more than 10% but less than 100% of the distance t, wherein the width R2 of the narrow side is smaller than the width R1 of the wide side.

[0088] Furthermore, the multiple recesses 160 of the multiple shielding structures 16 on the plate 14 are separate from each other and not connected, such as Figure 2A and Figure 2B As shown. In other embodiments, these recesses 260 are interconnected to form a manifold or tree-like groove B, such as Figure 2C and Figure 2D The trench, with its regular, interlaced, or fence-like (or irregular) shape, defines multiple antenna accommodating regions S, such that at least one antenna structure 15 is disposed in each individual antenna accommodating region S. This results in the shielding structure 26 integrally spaced with multiple antenna structures 15, thereby improving the shielding effect (i.e., better than...). Figure 2A and Figure 2B The shielding structure shown is 16).

[0089] Additionally, the recesses 160 and 260 can connect to the side surface 14c of the plate 14, such as... Figure 2B and Figure 2D As shown, this enhances the structural flexibility of the antenna module 1b, thereby improving the warpage condition of the antenna module 1b.

[0090] It should be understood that there are many ways to arrange the antenna structure 15 of the antenna module 1b, and it is not limited to the above.

[0091] like Figure 1B As shown, the encapsulation module 1a is attached to the second surface 14b of the plate 14 of the antenna module 1b via the conductive elements 13, so that the circuit structure 10 is electrically connected to the plate 14 via the conductive elements 13, and the electronic component 11 is electrically and communicatively connected to the antenna structure 15.

[0092] In this embodiment, the plate 14 may have a grounding trace 340 exposed on the sidewall of the recess 160, such as... Figure 3A As shown, this is to enhance antenna isolation. Further, as... Figure 3B As shown, a metal layer 341 can be electroplated on the sidewall of the recess 160 to electrically connect the grounding trace 340. Therefore, the configuration of the metal layer 341 not only increases the metal shielding area, making the shielding effect better, but also protects the wiring layer inside the board 14, so as to avoid the problem that moisture can easily penetrate and damage the wiring layer due to the increased surface area of ​​the board 14 caused by the recess 160, thus improving reliability.

[0093] Furthermore, the electronic package 1 can be configured with other components, such as an electronic connector 17, as needed. Figure 1B As shown, the electronic connector 17 can be coupled to the second surface 14b of the plate 14 of the antenna module 1b; or, as... Figure 4A As shown, the electronic connector 17 can be coupled to the circuit structure 40 of the package module 1a.

[0094] In addition, such as Figure 4B As shown, the packaging module 1a can omit the aforementioned circuit structure, allowing the electronic components 11 to be mounted on the board 44. This makes the board 44 a shared component for both the packaging module 1a and the antenna module 1b, meaning the electronic package 4 is a single-substrate specification. It should be understood that the single-substrate design of the board 44 increases the number of wiring layers, thus compared to... Figure 1B The dual-substrate configuration shown (a stack of a thinner circuit structure 10 and a thinner substrate 14) results in a higher manufacturing cost for the thicker plate 44 of the electronic package 4.

[0095] Therefore, the manufacturing method of the present invention mainly involves forming the dielectric material 140 and the recesses 160, 161, 260 between two adjacent antenna structures 15, so as to generate different impedance characteristics through different media (the air between the dielectric material 140 and the recesses 160, 161, 260), resulting in a discontinuous impedance distribution between the two adjacent antenna structures 15, thereby improving antenna isolation. Therefore, compared with the prior art, the electronic package 1 of the present invention can not only reduce its size as needed to meet miniaturization requirements, but also avoid mutual signal interference between the antenna structures 15 after size reduction, and improve antenna gain, thus significantly improving antenna performance. For example, when the frequency of the antenna structure 15 is 28 or 39 GHz, such as... Figure 7 As shown, the antenna isolation curve L1 of the present invention is superior to the antenna isolation curve L2 of the existing single-structure shielding medium (e.g., Figure 7 The difference between the changes shown is Z1, Z2), where, Figure 7 The vertical axis n shown is a non-zero integer.

[0096] Furthermore, the shielding structure 16,26 can further release the internal stress of the plate 14,44 through the recesses 160,161,260, so that the plate 14,44 can form a more flexible structure, thereby effectively improving the warping degree of the plate 14,44.

[0097] Furthermore, the grounding trace 340 is exposed on the sidewall of the recess 160 to enhance antenna isolation. Moreover, by forming the metal layer 341 on the sidewall of the recess 160, not only is the metal shielding area increased, resulting in better shielding, but the problem of moisture intrusion damaging the wiring layer within the board 14 can also be avoided, thus improving reliability.

[0098] Figures 5A to 5B This is a cross-sectional schematic diagram of a second embodiment of the manufacturing method of the electronic package 5 of the present invention. The difference between this embodiment and the first embodiment is that a resonant structure 58 is added to the antenna module 1b. Other processes and components are largely the same, so the similarities will not be described again below.

[0099] like Figure 5A As shown, a resonant structure 58 is formed on the first surface 14a of the plate 14, and the resonant structure 58 has a perforation 580 corresponding to the shielding structure 16 (recess 160).

[0100] In one embodiment, before the half-cutting process (making the recess 160) is performed, a full-area encapsulation material is formed on the first surface 14a of the plate 14 to cover the plurality of antenna structures 15. Then, the half-cutting process is performed to cut through the full-area encapsulation material to form a perforation 580, thereby forming the resonant structure 58.

[0101] In another embodiment, the process of manufacturing the resonant structure 58 first provides a resonant structure 58 having a through hole 580, and the through hole 580 penetrates the resonant structure 58. Then, the resonant structure 58 is pressed onto the plate 14 having a recess 160 to cover the antenna structure 15. The through hole 580 corresponds to the recess 160 so that the through hole 580 connects to the recess 160.

[0102] In this embodiment, the entire encapsulation material is a dielectric material, making the resonant structure 58 a dielectric with a dielectric constant (Dk) greater than 10. The perforation 580 and the recess 160 overlap vertically, and their projection outlines A and A2 substantially coincide. The width of the perforation 580 can be a fixed value, related to the distance t between two adjacent antenna structures 15. For example, the width of the perforation 580 is more than 10% but less than 100% of the distance t.

[0103] Furthermore, in other embodiments, such as Figure 6A As shown, the perforation 680 overlaps the recess 160 vertically, and the projection outline A1 of the perforation 680 can surround the projection outline A of the recess 160. For example, the width of the perforation 680 is more than 15% of the distance t, while the width of the recess 160 is more than 10% but less than 100% of the distance t, wherein the width of the perforation 680 is less than the width R1 of the recess 160.

[0104] Or, such as Figure 6B As shown, the width of the perforation 681 is not a fixed value, so that the width of the perforation 681 on the side close to the antenna structure 15 is narrower, serving as a narrow opening 681a, such that the opening projection profile A2 of the narrow opening is equal to the opening projection profile A of the recess 160, and the opening projection profiles A and A2 of the two substantially overlap. On the other side of the perforation 681 away from the antenna structure 15, it serves as a wide opening 681b, the width of which is greater than the width of the narrow opening 681a, and the opening projection profile A1 of which is greater than the opening projection profile A of the recess 160, so that the opening projection profile A1 of the wide opening 681b surrounds the opening projection profile A2 of the narrow opening 681a, thus presenting a shape that is wider on the outside and narrower on the inside. For example, the perforation 681 can be stepped, wider at the bottom and narrower at the top. Furthermore, the width of the recess 160 is more than 10% but less than 100% of the distance t, the width of the side of the wide opening 681b of the perforation 681 is more than 15% of the distance t, and the width of the side of the narrow opening 681a of the perforation 681 is more than 10% of the distance t. It can be understood that when the opening projection outline A2 of the narrow opening 681a surrounds the opening projection outline A of the recess 160, and the opening projection outline A1 of the wide opening 681b surrounds the opening projection outline A2 of the narrow opening 681a, the perforation and the recess can cooperate to form a three-layer stepped shape (not shown in the figure), which can be adjusted according to the electrical / flexibility requirements of the product and is not limited thereto.

[0105] In addition, the resonant structure 68 includes multiple dielectric layers 68a, 68b, such as Figure 6C As shown. For example, the outermost dielectric layer 68a of the resonant structure 68 has the largest dielectric constant (Dk value) (e.g., Dk > 10), meaning that the dielectric constant of each inner dielectric layer 68b (e.g., Dk > 3.5) is smaller than the Dk value of the outermost dielectric layer 68a. Therefore, the design using multiple dielectric layers 68a and 68b not only allows for adjustment of the Dk value according to antenna gain requirements but also strengthens the adhesion between the resonant structure 68 and the metal material (e.g., antenna structure 15), thereby improving reliability.

[0106] like Figure 5B As shown, the encapsulation module 1a is connected to the antenna module 1b via the conductive elements 13.

[0107] Therefore, the present invention configures a resonant structure 58, 68 on the antenna module 1b to form a resonant cavity, thereby improving the antenna gain.

[0108] The present invention also provides an electronic package 1, 4, 5, which includes: an antenna module 1b and a package module 1a electrically connected to the antenna module 1b, wherein the antenna module 1b includes a plate 14, 44, a plurality of antenna structures 15 arrayed on the plate 14, 44, and shielding structures 16, 26 disposed on the plate 14, so that the plate 14, 44, the plurality of antenna structures 15 and the shielding structures 16, 26 form a substrate.

[0109] The shielding structures 16 and 26 are located between two adjacent antenna structures 15. The shielding structures 16 and 26 include a recess 160, 161, 260 formed on the plate 14, and a dielectric material 140 formed between the recess 160, 161, 260 and the antenna structure 15.

[0110] In one embodiment, the depth D of the recess 160 is equal to the height H of the antenna structure 15.

[0111] In one embodiment, the depth d of the recess 160 is less than the height H of the antenna structure 15. Further, the depth d of the recess 160 is greater than one-third of the height H of the antenna structure 15.

[0112] In one embodiment, the plate 14 has a plurality of shielding structures 16, such that the plurality of recesses 160 of the plurality of shielding structures 16 are separated from each other and not connected, and the plurality of shielding structures 16 are arranged in an alternating (or interlaced) manner with the plurality of antenna structures 15. Further, the recesses 160 are connected to the side surface 14c of the plate 14.

[0113] In one embodiment, the plate 14 has a plurality of shielding structures 26, such that the recesses 260 of the plurality of shielding structures 26 are connected to form a manifold-shaped trench B, such that the trench B defines a plurality of antenna receiving areas S, such that at least one antenna structure 15 is disposed in a single antenna receiving area S. Further, the recesses 260 are connected to the side surface 14c of the plate 14.

[0114] In one embodiment, the widths R1 and R2 of the recess 161 are designed to be wider on the outside and narrower on the inside.

[0115] In one embodiment, the plate 14 has a ground trace 340 exposed on the sidewall of the recess 160. For example, a metal layer 341 is formed on the sidewall of the recess 160 to electrically connect the ground trace 340.

[0116] In one embodiment, the electronic package 5 further includes resonant structures 58, 68 corresponding to the antenna structure 15, and the resonant structures 58, 68 have through holes 580, 680, 681 corresponding to the recess 160 and penetrating the resonant structures 58, 68, so that the through holes 580, 680, 681 communicate with the recess 160.

[0117] In one embodiment, the opening projection profile A of the perforation 580 and the opening projection profile A of the recess 160 are substantially superimposed.

[0118] In one embodiment, the aperture projection profile A1 of the perforation 680 surrounds the aperture projection profile A of the recess 160.

[0119] In one embodiment, the perforation 681 has a narrow opening 681a close to one side of the plurality of antenna structures 15, and a wide opening 681b away from the plurality of antenna structures 15 and wider than the width of the narrow opening 681a. The opening projection profile A1 of the narrow opening 681a substantially overlaps with the opening projection profiles A, A2 of the recess 160, while the opening projection profile A1 of the wide opening 681b surrounds the opening projection profile A2 of the narrow opening 681a.

[0120] In one embodiment, the resonant structure 68 includes a plurality of dielectric layers 68a, 68b. Furthermore, the outermost dielectric layer 68a of the resonant structure 68 has the largest dielectric constant.

[0121] In one embodiment, the resonant structure 58 is a single dielectric with a dielectric constant greater than 10.

[0122] In summary, the electronic package and its antenna module and manufacturing method of the present invention, by using dielectric material and recesses as shielding structures, create a discontinuous impedance distribution between adjacent antenna structures, thereby improving antenna isolation. Therefore, the electronic package of the present invention can simultaneously meet the requirements of miniaturization and good antenna operation.

[0123] Furthermore, the design of the recess can release the internal stress of the plate, making the plate form a more flexible structure, thus effectively improving the degree of warping of the plate.

[0124] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. An antenna module, comprising: plate body; Multiple antenna structures are arranged in an array on the plate. as well as A shielding structure is disposed on the plate and located between two adjacent antenna structures, so that the plate, the plurality of antenna structures, and the shielding structure form a substrate. The shielding structure includes a recess on the plate and a dielectric material located between the recess and the plurality of antenna structures. The upper and lower sides of the antenna structure are located inside the plate and exposed on the surface of the plate, respectively, and the upper and lower sides of the recess of the shielding structure are located inside the plate and flush with the surface of the plate, respectively.

2. The antenna module as described in claim 1, wherein, The depth of the recess is equal to the height of the plurality of antenna structures.

3. The antenna module as described in claim 1, wherein, The depth of the recess is less than the height of the plurality of antenna structures.

4. The antenna module as described in claim 3, wherein, The depth of the recess is greater than 1 / 3 of the height of the plurality of antenna structures.

5. The antenna module as described in claim 1, wherein, The plate has multiple shielding structures, and the multiple recesses of the multiple shielding structures are spaced apart from each other and not connected, and the multiple shielding structures and the multiple antenna structures are arranged alternately.

6. The antenna module as described in claim 1, wherein, The plate has multiple shielding structures, and the recesses of the multiple shielding structures are connected to form a manifold-shaped trench, which defines multiple antenna receiving areas, so that at least one antenna structure is arranged in a single antenna receiving area.

7. The antenna module as described in claim 5 or 6, wherein, The recess connects to the side of the plate.

8. The antenna module as described in claim 1, wherein, The width of the recess is designed to be wider on the outside and narrower on the inside.

9. The antenna module as claimed in claim 1, wherein, The plate has grounding traces exposed on the sidewall of the recess.

10. The antenna module as claimed in claim 9, wherein, A metal layer electrically connected to the grounding trace is formed on the sidewall of the recess.

11. The antenna module as claimed in claim 1, wherein, The antenna module also includes a resonant structure corresponding to the multiple antenna structures, and the resonant structure has a through hole corresponding to the recess and penetrating the resonant structure so that the through hole connects to the recess.

12. The antenna module as claimed in claim 11, wherein, The projection outline of the perforation is substantially superimposed on the projection outline of the perforation of the recess.

13. The antenna module as claimed in claim 11, wherein, The projection profile of the perforation surrounds the projection profile of the recess.

14. The antenna module as claimed in claim 11, wherein, The perforation has a narrow opening on one side close to the plurality of antenna structures and a wide opening on the other side away from the plurality of antenna structures, the width of which is greater than that of the narrow opening. The aperture projection profile of the narrow opening substantially overlaps with the aperture projection profile of the recess, and the aperture projection profile of the wide opening surrounds the aperture projection profile of the narrow opening.

15. The antenna module as claimed in claim 11, wherein, The resonant structure contains multiple dielectric layers.

16. The antenna module as claimed in claim 15, wherein, The outermost dielectric layer of this resonant structure has the largest dielectric constant.

17. The antenna module as claimed in claim 11, wherein, The resonant structure is a dielectric material with a dielectric constant greater than 10.

18. An electronic package, comprising: The antenna module as described in claim 1; as well as An encapsulated module electrically connected to the antenna module.

19. A method for manufacturing an antenna module, comprising: Multiple antenna structures arranged in an array are configured on a single plate. as well as A recess is cut into the plate, positioned between two adjacent antenna structures, and a dielectric material is provided between the recess and the antenna structures to form a shielding structure. This allows the plate, the antenna structures, and the shielding structure to form a substrate. The upper and lower sides of the antenna structure are located inside the plate and exposed on the surface of the plate, respectively, and the upper and lower sides of the recess of the shielding structure are located inside the plate and flush with the surface of the plate, respectively.

20. The method for manufacturing an antenna module as described in claim 19, wherein, The depth of the recess is equal to the height of the plurality of antenna structures.

21. The method for manufacturing the antenna module as described in claim 19, wherein, The depth of the recess is less than the height of the plurality of antenna structures.

22. The method for manufacturing the antenna module as described in claim 21, wherein, The depth of the recess is greater than 1 / 3 of the height of the plurality of antenna structures.

23. The method for manufacturing the antenna module as described in claim 19, wherein, The plate has multiple shielding structures, and the multiple recesses of the multiple shielding structures are spaced apart from each other and not connected, and the multiple shielding structures and the multiple antenna structures are arranged alternately.

24. The method for manufacturing an antenna module as described in claim 19, wherein, The plate has multiple shielding structures, and the recesses of the multiple shielding structures are connected to form a manifold-shaped trench, which defines multiple antenna receiving areas, so that at least one antenna structure is arranged in a single antenna receiving area.

25. The method for manufacturing an antenna module as described in claim 23 or 24, wherein, The recess connects to the side of the plate.

26. The method for manufacturing the antenna module as described in claim 19, wherein, The width of the recess is designed to be wider on the outside and narrower on the inside.

27. The method for manufacturing an antenna module as described in claim 19, wherein, The plate has grounding traces exposed on the sidewall of the recess.

28. The method for manufacturing an antenna module as described in claim 27, wherein, A metal layer electrically connected to the grounding trace is formed on the sidewall of the recess.

29. The method for manufacturing the antenna module as described in claim 19, wherein, The manufacturing method also includes forming a full-area encapsulation material on the plate before forming the recess to cover the multiple antenna structures, and forming perforations on the full-area encapsulation material to form a resonant structure.

30. The method for manufacturing an antenna module as described in claim 19, wherein, The manufacturing method also includes providing a resonant structure with a perforation through which the perforation passes, and then pressing the resonant structure onto the plate to cover the plurality of antenna structures, wherein the perforation corresponds to the recess so that the perforation connects to the recess.

31. The method for manufacturing the antenna module as described in claim 30, wherein, The projection outline of the perforation is substantially superimposed on the projection outline of the perforation of the recess.

32. The method for manufacturing the antenna module as described in claim 30, wherein, The projection profile of the perforation surrounds the projection profile of the recess.

33. The method for manufacturing the antenna module as described in claim 30, wherein, The perforation has a narrow opening on one side close to the plurality of antenna structures and a wide opening on the other side away from the plurality of antenna structures, the width of which is greater than that of the narrow opening. The aperture projection profile of the narrow opening substantially overlaps with the aperture projection profile of the recess, and the aperture projection profile of the wide opening surrounds the aperture projection profile of the narrow opening.

34. The method for manufacturing the antenna module as described in claim 30, wherein, The resonant structure contains multiple dielectric layers.

35. The method for manufacturing the antenna module as described in claim 34, wherein, The outermost dielectric layer of this resonant structure has the largest dielectric constant.

36. The method for manufacturing the antenna module as described in claim 30, wherein, The resonant structure is a dielectric material with a dielectric constant greater than 10.

37. A method for manufacturing an electronic package, comprising: Provide a packaging module and an antenna module as described in claim 1; as well as Electrically connect the packaged module to the antenna module.

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