A protection circuit for preventing electrostatic breakdown of a low-temperature SQUID, an electronic product and a SQUID sensor

Abstract

The application provides a protection circuit for preventing electrostatic breakdown of a low-temperature SQUID, an electronic product and a SQUID sensor, and belongs to the technical field of superconducting quantum. The protection circuit comprises an input row pin, a relay module and an output row pin connected in sequence, the input row pin is connected with a signal pin of a SQUID chip, and the output row pin is used for being connected with a readout circuit; the relay module short-circuits a positive pin and a negative pin of the signal pin of the SQUID chip when the output row pin is not connected with the readout circuit; and the relay module connects the signal pin of the SQUID chip to a signal pin of the readout circuit respectively when the output row pin is connected with the readout circuit. The application can effectively solve the electrostatic breakdown problem of the SQUID chip during testing by applying the above circuit to the electronic product.

Description

Technical Field

[0001] This invention belongs to the field of superconducting quantum technology, and specifically relates to a protection circuit, electronic product and SQUID sensor for preventing electrostatic breakdown in low-temperature SQUID. Background Technology

[0002] With my country's sustained and rapid economic development, the demand for mineral resources has further expanded. Among these, resources such as iron ore, copper, and bauxite, which play a crucial role in economic development, are far below the world average, and also suffer from uneven distribution, small-scale deposits, and a high proportion of low-grade and difficult-to-process ores. To overcome this predicament, it is necessary to develop advanced measuring instruments and shift towards more complex deep mineral resource exploration. The emergence of superconducting transient electromagnetics effectively compensates for this deficiency. It transmits bipolar pulse signals and receives underground responses through superconducting quantum interference devices (SQUIDs). Further analysis of the SQUID output signals allows for the rapid location of low-resistivity ore bodies, offering advantages in both precision and depth.

[0003] Because SQUID is currently the most sensitive magnetic sensor known, with sensitivity reaching the fT level, it is the ideal signal receiver for transient electromagnetic signals. However, the SQUID chip itself transmits signals at the microampere level and cannot handle large currents. In dry winters, static electricity is frequent, and researchers often carry a lot of static charge. Inadvertently touching the chip pins or encountering static electricity during SQUID chip storage can damage the chip. Therefore, proper anti-static treatment is a crucial step in the storage and testing of SQUID chips.

[0004] SQUID is currently the most sensitive magnetic sensor known, but it is still in the research and testing phase. Regarding the phenomenon of electrostatic discharge (ESD) damaging the SQUID chip during winter experiments, current methods only include having researchers discharge static electricity before experiments using ESD devices, wearing ESD protective clothing, and wearing anti-static wrist straps during experiments. There is currently no effective method for preventing ESD in SQUID circuitry. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a protection circuit, electronic product and SQUID sensor for preventing electrostatic breakdown of low-temperature SQUID, so as to provide electrostatic protection for SQUID chips and improve the testing effect of SQUID chips.

[0006] To address the above problems, the present invention provides the following technical solution:

[0007] On one hand, the present invention provides a protection circuit for preventing electrostatic discharge (ESD) breakdown in low-temperature SQUID chips. The protection circuit includes an input pin header, a relay module, and an output pin header connected in sequence. The input pin header is connected to the signal pins of the SQUID chip, and the output pin header is used to connect to a readout circuit. When the output pin header is not connected to the readout circuit, the relay module short-circuits the positive and negative pins of the SQUID chip signal pins. When the output pin header is connected to the readout circuit, the relay module connects the SQUID chip signal pins to the corresponding signal pins of the readout circuit.

[0008] In the aforementioned protection circuit for preventing electrostatic discharge (ESD) in low-temperature SQUIDs, the relay module includes multiple identical solid-state relays. Each solid-state relay controls the short circuit of a set of signal pins of the SQUID chip itself and the connection / disconnection between the set of signals and the corresponding signal pins of the readout circuit.

[0009] In the aforementioned protection circuit for preventing electrostatic discharge (ESD) in low-temperature SQUIDs, the solid-state relay includes one drive circuit and two working circuits. The drive circuit is activated when connected to the readout circuit. Each working circuit includes a moving contact, a first stationary contact, and a second stationary contact. The moving contact of the first working circuit is connected to the positive pin of the SQUID chip signal pin via an input header. The first stationary contact of the first working circuit is connected to the negative pin of the SQUID chip signal pin via an input header. The second stationary contact of the first working circuit is connected to the positive pin of the readout circuit signal pin via an output header. The moving contact of the second working circuit is connected to the negative pin of the SQUID chip signal pin. The first stationary contact of the second working circuit is unconnected. The second stationary contact of the second working circuit is connected to the negative pin of the readout circuit signal pin.

[0010] In the aforementioned protection circuit for preventing electrostatic discharge (ESD) in low-temperature SQUID, the relay module contains three solid-state relays, which respectively control the three types of signals of the SQUID chip.

[0011] In the aforementioned protection circuit for preventing electrostatic discharge (ESD) breakdown in low-temperature SQUIDs, the input pin header includes three sets of positive and negative pin headers, corresponding to the positive and negative pins of the three types of signals of the SQUID chip, respectively; the output pin header includes three sets of positive and negative pin headers and three drive signal pin headers, the three sets of positive and negative pin headers corresponding to the positive and negative pins of the three types of signals of the readout circuit, and the three drive signal pin headers corresponding to the drive signals of the readout current driving the three solid-state relay drive circuits.

[0012] In the aforementioned protection circuit for preventing electrostatic discharge in low-temperature SQUID, the output pin header also includes a grounding pin for connecting the grounding signal of the readout circuit.

[0013] In the above-mentioned protection circuit for preventing electrostatic discharge in low-temperature SQUID, the solid-state relay is an HFD4 series relay, preferably an HFD4 / 3 relay.

[0014] On the other hand, the present invention also provides an electronic product, the electronic product including a housing and a circuit board encapsulated in the housing, wherein the circuit board is soldered with the above-mentioned protection circuit for preventing electrostatic discharge in low-temperature SQUID.

[0015] In the aforementioned electronic products, the outer casing is a metal aluminum box.

[0016] In another aspect, the present invention also provides a SQUID sensor, including a SQUID chip and the electronic product described above, wherein the electronic product is inserted into and encapsulated with the SQUID chip.

[0017] Compared with existing technologies, this AI algorithm-based method for constructing a human-room topology model has the following advantages: it effectively avoids electrostatic discharge (ESD) damage to the SQUID chip when using circuits in SQUID chip storage; and it effectively avoids direct human contact with the SQUID chip pins during testing experiments, preventing ESD from being transferred into the SQUID chip and causing chip damage. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a protection circuit for preventing electrostatic breakdown in low-temperature SQUIDs according to an embodiment of the present invention. Detailed Implementation

[0019] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0020] Furthermore, the accompanying drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0021] To address the shortcomings of existing technologies, this invention provides a protection circuit, electronic product, and SQUID sensor for preventing electrostatic breakdown in low-temperature SQUIDs, thereby improving the testing performance of SQUID chips.

[0022] First see Figure 1 , Figure 1 A schematic diagram of a protection circuit for preventing electrostatic discharge in low-temperature SQUIDs according to an embodiment of the present invention is shown.

[0023] In this embodiment, the protection circuit includes an input header SQUID_IN, a relay module, and an output header SQUID_OUT connected in sequence. The relay module includes three solid-state relays, all of model HFD4 / 3, namely the first relay KB, the second relay KH, and the third relay KF.

[0024] The input header SQUID_IN is used to connect to the signal pins of the SQUID chip. It has 6 pins: b+, b-, h+, h-, f+, and f-. The output header SQUID_OUT is used to connect to the readout circuit. It has 10 pins: B+, B-, H+, H-, F+, F-, SQUID_B, SQUID_H, SQUID_F, and GND.

[0025] The connection details for each solid-state relay are explained below:

[0026] Pin 1 of the first relay KB is connected to pin SQUID_B of the output header SQUID_OUT, used to receive one of the drive signals from the readout circuit; pin 2 of the first relay KB is the first stationary contact of its first working circuit, connected to pin b- of the input header SQUID_IN; pin 3 of the first relay KB is the moving contact of its first working circuit, connected to pin b+ of the input header SQUID_IN; pin 4 of the first relay KB is the second stationary contact of its first working circuit, connected to pin B+ of the output header SQUID_OUT; pin 5 of the first relay KB is the second stationary contact of its second working circuit, connected to pin B- of the output header SQUID_OUT; pin 6 of the first relay KB is the moving contact of its second working circuit, connected to pin b- of the input header SQUID_IN; pin 7 of the first relay KB is the first stationary contact of its second working circuit, not connected to any other pin; pin 8 of the first relay KB is its ground pin.

[0027] Pin 1 of the second relay KH is connected to pin SQUID_H of the output header SQUID_OUT, and is used to receive one of the drive signals from the readout circuit; pin 2 of the second relay KH is the first stationary contact of its first working circuit, and is connected to pin h- of the input header SQUID_IN; pin 3 of the second relay KH is the moving contact of its first working circuit, and is connected to pin h+ of the input header SQUID_IN; pin 4 of the second relay KH is the second stationary contact of its first working circuit, and is connected to pin H+ of the output header SQUID_OUT; pin 5 of the second relay KH is the second stationary contact of its second working circuit, and is connected to pin H- of the output header SQUID_OUT; pin 6 of the second relay KH is the moving contact of its second working circuit, and is connected to pin h- of the input header SQUID_IN; pin 7 of the second relay KH is the first stationary contact of its second working circuit, and is not connected to any other pin; pin 8 of the second relay KH is its ground pin.

[0028] Pin 1 of the third relay KF is connected to pin SQUID_F of the output header SQUID_OUT, used to receive one of the drive signals from the readout circuit; pin 2 of the third relay KF is the first stationary contact of its first working circuit, connected to pin f- of the input header SQUID_IN; pin 3 of the third relay KF is the moving contact of its first working circuit, connected to pin f+ of the input header SQUID_IN; pin 4 of the third relay KF is the second stationary contact of its first working circuit, connected to pin F+ of the output header SQUID_OUT; pin 5 of the third relay KF is the second stationary contact of its second working circuit, connected to pin F- of the output header SQUID_OUT; pin 6 of the third relay KF is the moving contact of its second working circuit, connected to pin f- of the input header SQUID_IN; pin 7 of the third relay KF is the first stationary contact of its second working circuit, not connected to any other pin; pin 8 of the third relay KF is its ground pin.

[0029] This embodiment uses three solid-state relays to control three types of signals of the SQUID chip, ensuring that all three signals are automatically short-circuited during storage. This eliminates the voltage difference across the SQUID chip, preventing electrostatic discharge (ESD) from damaging it. During SQUID chip testing, the three signals output from the readout circuit activate the corresponding solid-state relays, opening their normally closed terminals and closing their normally open terminals. This disconnects the previously short-circuited signal lines and connects them to the readout circuit. This automatically connects the SQUID transient electromagnetic signals to the readout circuit. This process eliminates the need for manual plugging and unplugging of SQUID pin signal lines, reducing direct contact between the user and the chip and effectively preventing ESD.

[0030] In this embodiment, the electronic product according to an embodiment of the present invention includes a housing and a circuit board, wherein the circuit board is soldered with the aforementioned protection circuit for preventing electrostatic discharge (ESD) of low-temperature SQUIDs (located inside the housing and therefore not shown). The housing is constructed of a box and a cover plate. The circuit board is fixed to the box by resin encapsulation, and the cover plate is fixed to the box by screws. A pair of sides of the box have an input port and an output port for correspondingly mounting the input header SQUID_IN and the output header SQUID_OUT. Both the box and the housing are made of aluminum, which provides radio frequency protection.

[0031] Furthermore, this invention also provides a SQUID sensor, which includes a SQUID chip and the aforementioned electronic product. The electronic product is inserted into the pins of the SQUID chip and then sealed. For testing, simply connect the readout circuit to the SQUID_OUT port of the electronic product's output header. The readout circuit controls the activation of the solid-state relays inside the electronic product to connect the signal pins of the SQUID chip and the readout circuit.

[0032] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A protection circuit for preventing electrostatic discharge (ESD) breakdown in low-temperature squuid systems, characterized in that, The protection circuit includes an input pin header, a relay module, and an output pin header connected in sequence. The input pin header is connected to the signal pins of the SQUID chip, and the output pin header is used to connect to the readout circuit. When the output pin header is not connected to the readout circuit, the relay module short-circuits the positive and negative pins of the SQUID chip signal pins. When the output pin header is connected to the readout circuit, the relay module connects the SQUID chip signal pins to the corresponding signal pins of the readout circuit. The relay module includes multiple identical solid-state relays, each of which controls the short circuit of a set of signal pins of the SQUID chip and the connection / disconnection between the set of signals and the corresponding signal pins of the readout circuit. The solid-state relay includes a drive circuit, a first working circuit, and a second working circuit. The drive circuit is turned on when connected to the readout circuit. Each working circuit includes a moving contact, a first stationary contact, and a second stationary contact. The moving contact of the first working circuit is connected to the positive pin of the SQUID chip signal pin via an input header. The first stationary contact of the first working circuit is connected to the negative pin of the SQUID chip signal pin via an input header. The second stationary contact of the first working circuit is connected to the positive pin of the readout circuit signal pin via an output header. The moving contact of the second working circuit is connected to the negative pin of the SQUID chip signal pin. The first stationary contact of the second working circuit is unconnected. The second stationary contact of the second working circuit is connected to the negative pin of the readout circuit signal pin.

2. The protection circuit for preventing electrostatic discharge in low-temperature SQUIDs according to claim 1, characterized in that, The relay module contains three solid-state relays, each corresponding to one of the three types of signals controlling the SQUID chip.

3. The protection circuit for preventing electrostatic discharge in low-temperature SQUIDs according to claim 2, characterized in that, The input pin header includes three sets of positive and negative pin headers, which correspond to the positive and negative pins of the three types of signals of the SQUID chip, respectively. The output pin header includes three sets of positive and negative pin headers and three drive signal pin headers. The three sets of positive and negative pin headers correspond to the positive and negative pins of the three types of signals of the readout circuit, respectively. The three drive signal pin headers correspond to the drive signals of the readout current driving the three solid-state relay drive circuits.

4. The protection circuit for preventing electrostatic discharge in low-temperature SQUIDs according to claim 3, characterized in that, The output header also includes a ground pin for connecting the ground signal of the readout circuit.

5. The protection circuit for preventing electrostatic discharge in low-temperature SQUIDs according to claim 1, characterized in that, The solid-state relay mentioned is an HFD4 series relay.

6. An electronic product, characterized in that, The electronic product includes a housing and a circuit board encapsulated within the housing, wherein the circuit board is soldered with a protection circuit for preventing electrostatic discharge in low-temperature SQUID as described in any one of claims 1 to 5.

7. The electronic product according to claim 6, characterized in that, The outer casing is a metal aluminum box.

8. A SQUID sensor, characterized in that, Includes a SQUID chip and an electronic product as described in claim 6 or 7, wherein the electronic product is inserted into and encapsulated with the SQUID chip.

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