High and low frequency acoustic wave non-contact vibration glue control equipment for dipping line

Abstract

The present invention relates to a high- and low-frequency sound wave non-contact vibration glue control device for a glue dipping line, comprising a frame, a glue dipping pool being provided at the bottom of the frame; a low-frequency glue control mechanism, a high-frequency glue control mechanism, a heat drying mechanism, and a glue line guide mechanism being provided on the frame; the glue dipping pool, the low-frequency glue control mechanism, the high-frequency glue control mechanism, and the heat drying mechanism being arranged sequentially from bottom to top; the low-frequency glue control mechanism comprising a lower annular fixing frame and a low-frequency sound wave generator; the high-frequency glue control mechanism comprising an upper annular fixing frame, a rotating cylinder, and a high-frequency sound wave generator; and the heat drying mechanism comprising a heat drying cylinder. The present invention controls the glue on the glue dipping line by utilizing low- and high-frequency sound waves to perform non-contact vibration glue control on the glue dipping line. Vibration is used to cause excess glue to flow down, thereby avoiding undesirable phenomena such as uneven glue layer thickness, reduced roundness, and contamination caused by the original scraping glue, thereby ensuring product quality of the glue dipping line.

Description

Technical Field

[0001] The invention relates to the field of glue dipping line production equipment, and in particular to a high- and low-frequency sound wave non-contact vibration glue control device for a glue dipping line. Background Art

[0002] Butylpyridine latex is an important component of the skeleton material of rubber products such as tires, hoses, and belts, namely fiber cords, cord fabrics, and rope dipping adhesives. It is an important supporting material for bonding rubber and fibers. Its quality plays an important role in the bonding performance of the dipping skeleton material and the dipping process performance.

[0003] During the production and processing of the dipped wire, the wire needs to be immersed in butadiene pyrrolidone rubber, and the butadiene pyrrolidone rubber adheres to the periphery of the wire to form a ring-shaped rubber layer.

[0004] To improve product quality on dipping lines, existing technologies often utilize ultrasonic technology within the dipping tank, using sound waves to accelerate molecular motion within the dipping solution, thereby enhancing its uniformity and stability. This is exemplified by the technical solutions described in Chinese patents with publication numbers CN210100439U, CN204844571U, and CN101949094B.

[0005] Although the above-mentioned existing technology can achieve uniform and stable dipping liquid in the dipping tank through ultrasound, after the wire is dipped in glue and removed from the dipping tank, the excess glue on the surface of the wire needs to be scraped off to make the thickness of the glue within the design range and avoid the undesirable phenomenon of the glue layer being too thick.

[0006] However, in the scraping process, since the scraping roller is in direct contact with the dipping line, there will be friction between the scraping roller and the wire, resulting in uneven thickness and reduced roundness of the glue layer after partial scraping. At the same time, continuous use of the scraping roller may transmit impurities such as dust and hair into the glue layer of the dipping line, causing the glue layer to be contaminated. Summary of the Invention

[0007] The objects of the present invention are:

[0008] A high- and low-frequency sound wave non-contact vibration glue control equipment for the dipping line is invented. The equipment controls the glue on the dipping line that has been removed from the dipping pool and has completed the dipping operation. Low-frequency sound waves and high-frequency sound waves are used to perform non-contact vibration glue control on the dipping line. Vibration is used to make excess glue flow down, avoiding the undesirable phenomena such as uneven thickness of the glue layer, reduced roundness, and contamination caused by the original scraping glue, thereby ensuring the product quality of the dipping line.

[0009] In order to achieve the above object, the present invention provides the following technical solutions:

[0010] A high- and low-frequency sound wave non-contact vibration glue control equipment for a glue dipping line, comprising a frame, a glue dipping tank being provided at the bottom of the frame; a low-frequency glue control mechanism, a high-frequency glue control mechanism, a heat drying mechanism and a glue line guide mechanism being provided on the frame; the glue dipping tank, the low-frequency glue control mechanism, the high-frequency glue control mechanism and the heat drying mechanism being arranged in sequence from bottom to top; the low-frequency glue control mechanism comprising a lower annular fixing frame and a low-frequency sound wave generator, the low-frequency sound wave generator being located inside the annular fixing frame; the high-frequency glue control mechanism comprising an upper annular fixing frame, a rotating cylinder and a high-frequency sound wave generator, the rotating cylinder being movably connected to the upper annular fixing frame via a bearing, the high-frequency sound wave generator being located inside the rotating cylinder; the heat drying mechanism comprising a heat drying cylinder.

[0011] Furthermore, the low-frequency glue control mechanism also includes a ball joint and a protective cone; the lower annular fixing frame is connected to the frame through a lower connecting frame, the lower annular fixing frame is in a circular ring shape, and the ball joint is specifically located between the lower annular fixing frame and the lower connecting frame; the protective cone is coaxially arranged above the lower annular fixing frame, and the opening of the protective cone faces downward.

[0012] Furthermore, the number of the low-frequency sound wave generators is several and they are arranged in a circular array on the inner ring surface of the lower annular fixing frame, and the lower annular fixing frame is located directly above the dipping tank.

[0013] Furthermore, the upper annular fixing frame is in the shape of a circular ring, and is connected to the frame via an upper connecting frame; the rotating cylinder is in the shape of a cylindrical cylinder, and the rotating cylinder coaxially passes through the upper annular fixing frame.

[0014] Furthermore, a convex ring is provided on the outer ring surface of the rotating cylinder, and the bearing is located between the convex ring and the upper annular fixing frame; the number of the high-frequency sound wave generators is several and distributed on the inner ring surface of the rotating cylinder.

[0015] Furthermore, the high-frequency sound wave generators are arranged in a spiral array with equal spacing along the inner annular surface of the rotating cylinder, and the number of heads of the spiral is 1 to 6; the central axis of the spiral is the same straight line as the central axis of the rotating cylinder.

[0016] Furthermore, the high-frequency glue control mechanism also includes a motor and a drive wheel. The motor is located on the upper connecting frame. The motor is specifically a low-speed motor. The drive wheel is coaxially connected to the rotating shaft of the motor. The drive wheel contacts the upper ring surface of the convex ring of the rotating cylinder.

[0017] Furthermore, the inner hole of the hot drying cylinder of the hot drying mechanism is arranged vertically and is coaxial with the rotating cylinder; the hot drying mechanism also includes a cooling nozzle, which is located on the top of the hot drying cylinder and is arranged in a circular array, and the nozzle of the cooling nozzle is inclined toward directly above the hot drying cylinder.

[0018] Furthermore, the glue line guide mechanism includes a dipping guide wheel and a top guide wheel; the dipping guide wheel is located in the dipping tank and specifically directly below the low-frequency glue control mechanism; the top guide wheel is located directly above the hot drying cylinder.

[0019] The beneficial effects of the present invention are: a high- and low-frequency sound wave non-contact vibration glue control equipment for a dipping line, which can perform two-step glue control on the dipping line that has been flushed out of the dipping pool and completed the dipping operation through the coordinated use of a low-frequency glue control mechanism, a high-frequency glue control mechanism, a heat drying mechanism and a guide mechanism, and respectively utilize low-frequency sound waves and high-frequency sound waves to perform non-contact vibration glue control on the dipping line in succession. The dipping line moves vertically upward, and the vibration principle of the low-frequency sound wave and the high-frequency sound wave drives the dipping line to vibrate laterally. The glue liquid that has not yet solidified on the outer part of the glue layer flows downward under the action of vibration and gravity, and the excess glue liquid is realized to flow down, thereby realizing non-contact glue control, avoiding the undesirable phenomena such as uneven thickness of the glue layer, reduced roundness and contamination caused by the original scraping glue, and ensuring the product quality of the dipping line. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional schematic diagram of the overall structure of a high- and low-frequency acoustic wave non-contact vibration glue control device for a glue dipping line according to the present invention.

[0021] Figure 2 This is a schematic diagram from another perspective of the overall structure of a high- and low-frequency acoustic wave non-contact vibration glue control device for a glue dipping line of the present invention.

[0022] Figure 3 This is a partial structural schematic diagram of a high- and low-frequency acoustic wave non-contact vibration glue control device for a glue dipping line according to the present invention.

[0023] Figure 4 The present invention is a schematic diagram of a low-frequency glue control mechanism, a high-frequency glue control mechanism and a heat drying mechanism of a high- and low-frequency acoustic wave non-contact vibration glue control device for a glue dipping line.

[0024] Figure 5 The figure is a schematic diagram of the low-frequency glue control mechanism of the high- and low-frequency acoustic wave non-contact vibration glue control equipment for a glue dipping line according to the present invention.

[0025] Figure 6 This is a schematic diagram of the high-frequency glue control mechanism of the high- and low-frequency acoustic wave non-contact vibration glue control equipment for a glue dipping line according to the present invention.

[0026] Part numbers in the figure: 1, frame; 11, dipping tank;

[0027] 2. Low-frequency glue control mechanism; 21. Lower connecting frame; 22. Lower annular fixing frame; 23. Ball joint; 24. Low-frequency sound wave generator; 25. Protective cone;

[0028] 3. High-frequency glue control mechanism; 31. Upper connecting frame; 32. Upper annular fixing frame; 33. Rotating cylinder; 34. Bearing; 35. High-frequency sound wave generator;

[0029] 4. Hot drying mechanism; 41. Hot drying cylinder; 42. Cooling nozzle;

[0030] 5. Glue line guide mechanism; 51. Glue dipping guide wheel; 52. Top guide wheel. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0032] refer to Figures 1 to 6 A high- and low-frequency sound wave non-contact vibration glue control device for a dipping line includes a frame 1, a dipping pool 11 is provided at the bottom of the frame 1, and the dipping pool 11 contains dipping liquid for dipping wire; a low-frequency glue control mechanism 2, a high-frequency glue control mechanism 3, a hot drying mechanism 4 and a glue line guide mechanism 5 are provided on the frame 1; the dipping pool 11, the low-frequency glue control mechanism 2, the high-frequency glue control mechanism 3 and the hot drying mechanism 4 are arranged in sequence from bottom to top, and the wire passes through the dipping pool 11, the low-frequency glue control mechanism 2, the high-frequency glue control mechanism 3 and the hot drying mechanism 4 in sequence; the low-frequency glue control mechanism 2 is used to apply low-frequency sound waves to the dipping line and use the vibration generated by the sound waves to control the glue; the high-frequency glue control mechanism 3 is used to apply high-frequency sound waves to the dipping line and use the vibration generated by the sound waves to control the glue; the low-frequency glue control mechanism 2 includes The lower annular fixed frame 22 and the low-frequency sound wave generator 24, the low-frequency sound wave generator 24 is located on the inner side of the annular fixed frame 22, the low-frequency sound wave generator 24 is used to emit low-frequency sound waves, and the low-frequency sound wave generator is an existing mature product; the high-frequency glue control mechanism 3 includes an upper annular fixed frame 32, a rotating cylinder 33 and a high-frequency sound wave generator 35, the rotating cylinder 33 is movably connected to the upper annular fixed frame 32 through a bearing 34, and the rotating cylinder 33 can rotate relative to the upper annular fixed frame 32, the high-frequency sound wave generator 35 is located on the inner side of the rotating cylinder 33, the high-frequency sound wave generator 35 is used to emit high-frequency sound waves, and the low-frequency sound wave generator is an existing mature product; the hot drying mechanism 4 includes a hot drying cylinder 41, which is used to heat and dry the dipped glue line that has passed the glue control to achieve solidification of the glue layer.

[0033] The low-frequency glue control mechanism 2 also includes a ball joint 23 and a protective cone 25; the lower annular fixing frame 22 is connected to the frame 1 through the lower connecting frame 21, the lower annular fixing frame 22 is annular, and the glue dipping line vertically passes through the lower annular fixing frame 22, and the ball joint 23 is specifically located between the lower annular fixing frame 22 and the lower connecting frame 21, and the lower annular fixing frame 22 can be flipped relative to the lower connecting frame 21; the protective cone 25 is coaxially arranged above the lower annular fixing frame 22, and the opening of the protective cone 25 faces downward. The protective cone 25 is used to protect the lower annular fixing frame 22 and the low-frequency sound wave generator 24, and at the same time has a certain sound insulation and dustproof effect.

[0034] There are several low-frequency sound wave generators 24 and they are arranged in a circular array on the inner ring surface of the lower annular fixed frame 22, that is, they are arranged around the dipping line. The lower annular fixed frame 22 is located directly above the dipping pool 11. After the dipping line moves out of the dipping pool 11, it vertically passes through the lower annular fixed frame 22.

[0035] The upper annular fixing frame 32 is annular and is connected to the frame 1 through the upper connecting frame 31; the rotating cylinder 33 is cylindrical and coaxially passes through the upper annular fixing frame 32, and the dipping line passes vertically through the center of the rotating cylinder 33.

[0036] A convex ring is provided on the outer ring surface of the rotating cylinder 33. The convex ring is circular and coaxial with the rotating cylinder 33. The bearing 34 is located between the convex ring and the upper annular fixing frame 32. The bearing 34 is used to reduce rotational friction. There are several high-frequency sound wave generators 35 and they are distributed on the inner ring surface of the rotating cylinder 33, that is, the high-frequency sound wave generators 35 are arranged around the dipping line.

[0037] The high-frequency sound wave generators 35 are arranged in a spiral array with equal spacing along the inner annular surface of the rotating cylinder 33, and the number of heads of the spiral is 1 to 6. When the rotating cylinder 33 rotates, the high-frequency sound wave generators 35 arranged in a spiral array with equal spacing can form a follow-up high-frequency sound wave application to the dipping line; the central axis of the spiral is in the same straight line as the central axis of the rotating cylinder 33.

[0038] The high-frequency glue control mechanism 3 also includes a motor 36 and a drive wheel 37. The motor 36 is located on the upper connecting frame 31. The motor 36 is specifically a low-speed motor. The drive wheel 37 is coaxially connected to the rotating shaft of the motor 36. The motor 36 is used to drive the drive wheel 37 to rotate at a low speed. The drive wheel 37 contacts the upper annular surface of the convex ring of the rotating cylinder 33, so that the drive wheel 37 drives the rotating cylinder 33 to rotate at a low speed.

[0039] The inner hole of the hot drying cylinder 41 of the hot drying mechanism 4 is arranged vertically and is coaxial with the rotating cylinder 33. The hot drying cylinder 41 is used to heat and dry the dipping line to accelerate the solidification of the rubber layer; the hot drying mechanism 4 also includes a cooling nozzle 42, which is located at the top of the hot drying cylinder 41 and is arranged in a circular array, and the nozzle of the cooling nozzle 42 is inclined toward the top of the hot drying cylinder 41. The cooling nozzle 42 is connected to the external air supply system through an air pipe and is used to spray cooling on the dipping line after hot drying.

[0040] The glue line guide mechanism 5 includes a dipping guide wheel 51 and a top guide wheel 52; the dipping guide wheel 51 is located in the dipping tank 11 and specifically located directly below the low-frequency glue control mechanism 2, and is used to guide the dipping line; the top guide wheel 52 is located directly above the hot drying cylinder 41, and is used to guide the dipping line.

[0041] The specific implementation method and principle of the present invention are as follows: a specific amount of butylpyridine latex dipping solution is poured into the dipping pool 11, and the liquid level of the dipping solution submerges the dipping guide wheel.

[0042] The wire enters the dipping tank 11 from the outside, specifically into the dipping liquid, and is guided by the dipping guide wheel 51. The wire then moves vertically upward out of the dipping tank 11. Since the outside of the wire is dipped in glue, i.e., a colloid layer, it becomes a dipping wire.

[0043] The dipping line moves vertically upward to reach the low-frequency glue control mechanism 2, and passes through the lower annular fixing frame 22 and the middle of the protective cone 25; the multiple low-frequency sound wave generators 24 on the inner ring surface of the lower annular fixing frame 22 can emit low-frequency sound waves individually or in multiples. The sound waves act on the dipping line to achieve lateral vibration of the dipping line. Part of the glue on the colloid layer outside the dipping line is accelerated to flow downward under the action of vibration, thereby removing part of the excess glue; the vibration amplitude of the dipping line can be adjusted by adjusting the frequency and power of the low-frequency sound wave generator 24.

[0044] At the same time, the vibration direction and amplitude of the dipping line can be adjusted by controlling the number of low-frequency sound wave generators 24 that sound at the same time, and the specific azimuth distribution of multiple low-frequency sound wave generators 24 that sound.

[0045] At the same time, due to the presence of the ball joint 23, the lower annular fixing frame 22 can be flipped relative to the horizontal plane, thereby adjusting the distance and relative position between the low-frequency sound wave generator 24 and the dipping line. Through this adjustment, the vibration direction and vibration amplitude of the dipping line can be adjusted.

[0046] After passing through the low-frequency glue control mechanism 2, the glue dipping line continues to move vertically upward to the high-frequency glue control mechanism 3.

[0047] The motor 36 of the high-frequency glue control mechanism 3 is powered on and drives the rotating cylinder 33 to rotate through the driving wheel 37, and the high-frequency sound wave generator 35 in the rotating cylinder 33 emits high-frequency sound waves; the glue line is vertically hung through the center of the rotating cylinder 33, and the high-frequency sound waves act on the glue line, realizing high-frequency lateral vibration of the glue line; since the high-frequency sound wave generator 35 is arranged in a spiral array with equal spacing along the inner annular surface of the rotating cylinder 33, when the glue line rises, the rotating cylinder 33 rotates, realizing vibration glue control of the glue line following the conveying direction.

[0048] The high-frequency sound wave generator 35 on the rotating cylinder 33 is electrically connected to the power supply system on the frame 1 through an electric slip ring; the vibration amplitude of the dipping line can be adjusted by controlling the frequency and power of the high-frequency sound wave generator 35; through high-frequency vibration, the excess glue on the dipping line that has not been removed by the low-frequency glue control mechanism 2 after low-frequency vibration glue control is further removed, so that the thickness of the glue layer on the outside of the wire is within the design range; the glue is controlled by a non-contact method, which avoids the undesirable phenomena such as uneven thickness of the glue layer, reduced roundness and contamination caused by scraping glue, thereby ensuring the product quality of the dipping line.

[0049] Then the dipping line continues to rise and reaches the hot drying mechanism 4. The hot drying cylinder 41 heats the glue layer around the dipping line to make the glue layer solidify quickly; then the cooling nozzle 42 sprays gas toward the dipping line to achieve air cooling, thus completing the production of the dipping line.

[0050] In the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0051] The above embodiments are used to further illustrate the present invention, but the present invention is not limited to these specific embodiments. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be understood to be within the scope of protection of the present invention.

Claims

1. A high- and low-frequency acoustic wave non-contact vibration glue control device for a glue dipping line, comprising a frame (1), wherein a glue dipping tank (11) is provided at the bottom of the frame (1); characterized in that: The frame (1) is provided with a low-frequency glue control mechanism (2), a high-frequency glue control mechanism (3), a heat drying mechanism (4) and a glue line guide mechanism (5); the glue dipping pool (11), the low-frequency glue control mechanism (2), the high-frequency glue control mechanism (3) and the heat drying mechanism (4) are arranged in sequence from bottom to top; the low-frequency glue control mechanism (2) comprises a lower annular fixed frame (22) and a low-frequency sound wave generator (24), and the low-frequency sound wave generator (24) is located inside the annular fixed frame (22); the high-frequency glue control mechanism (3) comprises an upper annular fixed frame (32), a rotating cylinder (33) and a high-frequency sound wave generator (35), and the rotating cylinder (33) is movably connected to the upper annular fixed frame (32) through a bearing (34), and the high-frequency sound wave generator (35) is located inside the rotating cylinder (33); the heat drying mechanism (4) comprises a heat drying cylinder (41).

2. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 1, characterized in that: The low-frequency glue control mechanism (2) further comprises a ball joint (23) and a protective cone (25); the lower annular fixing frame (22) is connected to the frame (1) via a lower connecting frame (21); the lower annular fixing frame (22) is in the shape of a circular ring; the ball joint (23) is specifically located between the lower annular fixing frame (22) and the lower connecting frame (21); the protective cone (25) is coaxially arranged above the lower annular fixing frame (22), and the opening of the protective cone (25) faces downward.

3. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 2, characterized in that: The low-frequency sound wave generators (24) are multiple in number and are arranged in a circular array on the inner ring surface of the lower annular fixing frame (22). The lower annular fixing frame (22) is located directly above the dipping tank (11).

4. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 3, characterized in that: The upper annular fixing frame (32) is annular and is connected to the frame (1) via an upper connecting frame (31); the rotating cylinder (33) is cylindrical and coaxially passes through the upper annular fixing frame (32).

5. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 4, characterized in that: A convex ring is provided on the outer ring surface of the rotating cylinder (33), and the bearing (34) is located between the convex ring and the upper annular fixing frame (32); the number of the high-frequency sound wave generators (35) is several and distributed on the inner ring surface of the rotating cylinder (33).

6. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 5, characterized in that: The high-frequency sound wave generators (35) are arranged in a spiral array with equal spacing along the inner annular surface of the rotating cylinder (33), and the number of heads of the spiral is 1 to 6; the central axis of the spiral is the same straight line as the central axis of the rotating cylinder (33).

7. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 6, characterized in that: The high-frequency glue control mechanism (3) further comprises a motor (36) and a driving wheel (37). The motor (36) is located on the upper connecting frame (31). The motor (36) is specifically a low-speed motor. The driving wheel (37) is coaxially connected to the rotating shaft of the motor (36). The driving wheel (37) contacts the upper ring surface of the convex ring of the rotating cylinder (33).

8. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 7, characterized in that: The inner hole of the hot drying cylinder (41) of the hot drying mechanism (4) is arranged vertically and is coaxial with the rotating cylinder (33); the hot drying mechanism (4) also includes a cooling nozzle (42), which is located at the top of the hot drying cylinder (41) and is arranged in a circular array, and the nozzle of the cooling nozzle (42) is inclined toward the top of the hot drying cylinder (41).

9. The high- and low-frequency acoustic wave non-contact glue control equipment for a dipping line according to claim 8, characterized in that: The glue line guide mechanism (5) comprises a glue dipping guide wheel (51) and a top guide wheel (52); the glue dipping guide wheel (51) is located in the glue dipping pool (11) and specifically directly below the low-frequency glue control mechanism (2); the top guide wheel (52) is located directly above the hot drying cylinder (41).

Images