Bias sputtering deposition apparatus

Abstract

The application discloses a bias sputtering coating device, which comprises a reaction container, a substrate bearing mechanism, a sputtering coating mechanism, a rotating mechanism and a vacuum exhaust mechanism. The reaction container has a vacuum cavity. The substrate bearing mechanism is arranged in the vacuum cavity. The substrate bearing mechanism comprises a main body part and a hanging plate part connected with each other, and the hanging plate part is arranged on the circumferential side of the main body part. The main body part comprises a first conductive part and a rotating support part connected with each other. The hanging plate part comprises a second conductive part electrically connected with the first conductive part and a bias block for placing a coating substrate. The bias block is made of conductive material and is electrically connected with the second conductive part. The sputtering coating mechanism is arranged in the vacuum cavity. The rotating mechanism is used for driving the main body part to rotate the hanging plate part. The rotating mechanism is connected with the rotating support part. The vacuum exhaust mechanism is communicated with the vacuum cavity and is used for exhausting and vacuumizing the vacuum cavity. The bias sputtering coating device provided in the specification can provide stable and reliable bias while meeting the high-speed rotation requirement of the coating process.

Description

Technical Field

[0001] This specification relates to the field of vacuum technology, and in particular to a bias sputtering coating apparatus. Background Technology

[0002] Sputtering is a coating technology that uses ions to bombard the surface of a target material, ejecting atoms from the target. The deposition of these sputtered atoms onto the substrate surface to form a film is called sputtering coating. Typically, gas discharge generates gas ionization, and the positive ions, under the influence of an electric field, bombard the cathode target at high speed, ejecting cathode target atoms or molecules that then fly onto the substrate surface to be coated and deposit as a thin film.

[0003] Bias sputtering coating is based on conventional sputtering coating equipment, but the potential on the substrate is set separately from the potential of the grounded anode in the vacuum chamber. A bias voltage of a certain magnitude is applied between the substrate and the plasma according to different requirements, thereby attracting part of the ion flow to the substrate surface. The microstructure and properties of the thin film are changed by changing the number and energy of charged particles incident on the substrate surface.

[0004] However, the substrate carrier of existing sputtering coating equipment rotates around its center, making it difficult to conveniently and safely apply bias voltage to the substrate. Summary of the Invention

[0005] In view of the shortcomings of the prior art, one object of this specification is to provide a bias sputtering coating apparatus that can provide a stable and reliable bias voltage while meeting the high-speed rotation requirements of the coating process.

[0006] To achieve the above objectives, this specification provides a bias sputtering coating apparatus, comprising:

[0007] A reaction vessel with a vacuum chamber;

[0008] The substrate support mechanism, disposed within the vacuum cavity for supporting the coated substrate, includes a main body and a mounting plate connected to each other. The mounting plate is disposed on the periphery of the main body. The main body includes a first conductive element and a rotating support element connected to each other. The mounting plate includes a second conductive element electrically connected to the first conductive element and a bias block for placing the coated substrate. The bias block is made of a conductive material and is electrically connected to the second conductive element.

[0009] A sputtering coating mechanism disposed within the vacuum chamber for sputtering coating the substrate includes a sputtering cathode disposed within the vacuum chamber and connected to the side wall of the vacuum chamber, and a target material mounted on the sputtering cathode, the target material being disposed facing the mounting plate portion;

[0010] A rotating mechanism for driving the main body to rotate the hanging plate, the rotating mechanism being connected to the rotating support member;

[0011] A vacuum exhaust mechanism connected to the vacuum chamber is used to exhaust air from the vacuum chamber and evacuate it.

[0012] In a preferred embodiment, the number of sputtering coating mechanisms is two, and the two sputtering coating mechanisms are symmetrically arranged about the substrate support mechanism.

[0013] In a preferred embodiment, the rotating support is cylindrical, with one end fixedly connected to the rotating mechanism and the other end fixedly connected to the first conductive element via an insulating component.

[0014] In a preferred embodiment, the first conductive element includes a receiving flange, and the insulating element includes an insulating flange.

[0015] In a preferred embodiment, the mounting plate includes:

[0016] The main body of the hanging plate has receiving holes;

[0017] The back plate ceramic is located on the side of the hanging plate body facing the rotating support member, and the second conductive element is located on the side of the back plate ceramic facing the rotating support member;

[0018] The clamping ceramic is located within the receiving hole and between the bias block and the back plate ceramic. The clamping ceramic is in contact with the hanging plate body, and the bias block is in contact with the clamping ceramic and the coating substrate, respectively.

[0019] In a preferred embodiment, the back plate ceramic has a first through hole, and the clamping plate ceramic has a second through hole; the bias block has a conductive boss on the side facing the clamping plate ceramic, and the conductive boss passes through the second through hole and the first through hole and is connected to the second conductive element; the portion of the conductive boss other than the part connected to the second conductive element is fitted with an insulating sleeve.

[0020] In a preferred embodiment, the side of the bias block facing the ceramic clamp is provided with a positioning boss, and the side of the ceramic clamp facing the bias block is provided with a recess corresponding to the positioning boss.

[0021] In a preferred embodiment, the mounting plate body is provided with two receiving holes distributed in the vertical direction, and each mounting plate part is used to place two coating substrates.

[0022] In a preferred embodiment, the first conductive element and the second conductive element are electrically connected by a conductive portion, one end of which is connected to the first conductive element, and the other end of which includes two sub-ends distributed vertically and respectively connected to the two second conductive elements.

[0023] In a preferred embodiment, the rotating support member is provided with a first baffle at one end and a second baffle at the other end; the top surface of the second baffle is provided with a hinge, and the hanging plate part is connected to the main body part through the hinge; the ends of the first baffle and the second baffle away from the rotating support member are in contact with the hanging plate part; a portion of the conductive part passes through the second baffle and is connected to the first conductive member, and the remaining portion is located within the accommodating space formed by the first baffle, the second baffle, the rotating support member and the hanging plate part.

[0024] Beneficial effects:

[0025] The bias sputtering coating apparatus provided in this embodiment, by comprising a reaction vessel, a substrate support mechanism, a sputtering coating mechanism, a rotating mechanism, and a vacuum exhaust mechanism, enables sputtering coating of a substrate. The substrate support mechanism, by including a main body with a rotating support member, can transmit the rotational power of the rotating mechanism to the substrate support mechanism, achieving high-speed rotation required by the coating process. Simultaneously, the first conductive element of the main body and the second conductive element of the mounting plate are electrically connected, and the second conductive element of the mounting plate is electrically connected to the bias block, guiding the bias voltage from the first conductive element through the second conductive element and the bias block to the coating substrate, thereby providing a stable and reliable bias voltage.

[0026] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope as a result.

[0027] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0028] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1This is a schematic diagram of the structure of a bias sputtering coating apparatus provided in this embodiment;

[0031] Figure 2 This is a schematic diagram of the structure of a substrate support mechanism provided in this embodiment;

[0032] Figure 3 for Figure 2 Exploded view;

[0033] Figure 4 for Figure 2 A partial cross-sectional structural diagram;

[0034] Figure 5 This is a schematic diagram of the structure of a main body provided in this embodiment;

[0035] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure;

[0036] Figure 7 This is an exploded structural diagram of a hanging plate part provided in this embodiment;

[0037] Figure 8 This is a schematic cross-sectional view of a mounting plate portion provided in this embodiment;

[0038] Figure 9 This is a schematic diagram of the bias block provided in this embodiment.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Reaction vessel; 11. Vacuum chamber;

[0041] 2. Substrate support mechanism; 21. Main body; 211. First conductive component; 212. Rotating support component; 213. Insulating component; 214. First baffle; 215. Second baffle; 216. Hinge; 217. Accommodating space; 22. Hanging plate; 221. Second conductive component; 222. Bias block; 201. Conductive boss; 202. Positioning boss; 223. Hanging plate body; 203. Accommodating hole; 224. Back plate ceramic; 204. First through hole; 225. Clamping plate ceramic; 205. Second through hole; 206. Recess; 226. Insulating sleeve; 227. Pressure plate ceramic; 228. Fixing screw; 23. Conductive part; 231. Sub-end;

[0042] 3. Sputtering coating mechanism; 4. Vacuum exhaust mechanism; 5. Coating substrate. Detailed Implementation

[0043] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0044] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or may be interposed with another element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or may be interposed with another element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0046] Please see Figures 1 to 9 This application provides a bias sputtering coating apparatus, including a reaction vessel 1, a substrate support mechanism 2, a sputtering coating mechanism 3, a rotation mechanism (not shown) and a vacuum exhaust mechanism 4.

[0047] The reaction vessel 1 includes a vacuum chamber 11. A substrate support mechanism 2 is disposed within the vacuum chamber 11 and is used to support the coating substrate 5. The substrate support mechanism 2 includes a main body 21 and a mounting plate 22 connected to each other, with the mounting plate 22 disposed around the periphery of the main body 21. The main body 21 includes a first conductive element 211 and a rotating support element 212 connected together. The mounting plate 22 includes a second conductive element 221 electrically connected to the first conductive element 211 and a bias block 222 for placing the coating substrate 5. The bias block 222 is made of a conductive material and is electrically connected to the second conductive element 221, so that the bias can be guided from the first conductive element 211 to the coating substrate on the mounting plate 22. A sputtering coating mechanism 3 is disposed within the vacuum chamber 11 and is used to perform sputtering coating on the coating substrate 5. The sputtering coating mechanism 3 includes a sputtering cathode disposed in the vacuum chamber 11 and connected to the side wall of the vacuum chamber 11, and a target material mounted on the sputtering cathode, with the target material facing the mounting plate portion 22. A rotation mechanism is used to drive the main body portion 21 to rotate the mounting plate portion 22. The rotation mechanism is connected to the rotation support member 212 to transmit the rotational power to the substrate carrying mechanism 2. The vacuum exhaust mechanism 4 is connected to the vacuum chamber 11 and is used to exhaust air from the vacuum chamber 11 and evacuate it.

[0048] The bias sputtering coating apparatus provided in this embodiment, by comprising a reaction vessel 1, a substrate support mechanism 2, a sputtering coating mechanism 3, a rotating mechanism, and a vacuum exhaust mechanism 4, enables sputtering coating of a substrate 5. The substrate support mechanism 2, by comprising a main body 21 with a rotating support member 212, can transmit the rotational power of the rotating mechanism to the substrate support mechanism 2 to meet the high-speed rotation requirements of the coating process. Simultaneously, the first conductive member 211 of the main body 21 and the second conductive member 221 of the mounting plate 22 are electrically connected, and the second conductive member 221 of the mounting plate 22 is electrically connected to the bias block 222, allowing the bias voltage to be guided from the first conductive member 211 through the second conductive member 221 and the bias block 222 to the coating substrate, thereby providing a stable and reliable bias voltage.

[0049] In this embodiment, such as Figure 1 As shown, there are two sputtering coating units 3, which are symmetrically arranged about the substrate support unit 2. The two sputtering coating units 3 can simultaneously coat the substrate 5, improving coating efficiency. Furthermore, the two sputtering coating units 3 can sputter targets with different refractive indices to meet different process requirements. Preferably, the substrate support unit 2 is located at the exact center of the vacuum chamber 11, that is, the center of the substrate support unit 2 coincides with the center of the vacuum chamber 11, for better coating of the substrate 5.

[0050] like Figure 5As shown, the rotating support 212 is preferably cylindrical to better transmit rotational power. One end of the rotating support 212 is fixedly connected to the rotating mechanism, and the other end is fixedly connected to the first conductive element 211 via an insulating element 213. Specifically, the first conductive element 211 can be a power receiving flange, and the insulating element 213 can be an insulating flange, using a flange structure to achieve a convenient and reliable connection. The power receiving flange is made of conductive material, preferably copper. The insulating flange is made of insulating material, preferably PEEK or polytetrafluoroethylene.

[0051] Preferably, such as Figure 6 As shown, the main body 21 extends vertically, the first conductive element 211 is located above the rotating support 212, and the lower part of the rotating support 212 is connected to the rotating mechanism, so that the bias voltage is introduced from the top and the rotation power is introduced from the bottom, making the division of labor of each part of the main body 21 clear and reasonable.

[0052] In this embodiment, such as Figure 7 As shown, the mounting plate portion 22 includes a mounting plate body 223, a back plate ceramic 224, and a clamping plate ceramic 225. The mounting plate body 223 has a receiving hole 203. The back plate ceramic 224 is located on the side of the mounting plate body 223 facing the rotating support member 212. The second conductive member 221 is located on the side of the back plate ceramic 224 facing the rotating support member 212, facilitating connection with the first conductive member 211. The clamping plate ceramic 225 is located within the receiving hole 203 and between the biasing block 222 and the back plate ceramic 224. The clamping plate ceramic 225 is in contact with the mounting plate body 223, and the biasing block 222 is in contact with both the clamping plate ceramic 225 and the coating substrate 5.

[0053] The mounting plate body 223 is made of metal, such as steel or aluminum. The back plate ceramic 224 and the clamping plate ceramic 225 are made of insulating ceramic material, preferably 99.5% sintered Al2O3 ceramic. The back plate ceramic 224 and the clamping plate ceramic 225 clamp the mounting plate body 223, separating the biasing block 222 from the mounting plate body 223 and preventing the mounting plate body 223 from becoming electrified. Preferably, the diameter of the biasing block 222 is smaller than the diameter of the clamping plate ceramic 225, and the diameter of the clamping plate ceramic 225 is equal to the diameter of the receiving hole 203, thereby preventing the periphery of the biasing block 222 from contacting the mounting plate body 223.

[0054] like Figure 7 As shown, the backplate ceramic 224 has a first through hole 204, and the clamping plate ceramic 225 has a second through hole 205. The bias block 222 has a conductive boss 201 on the side facing the clamping plate ceramic 225. The conductive boss 201 passes through the second through hole 205 and the first through hole 204 and is connected to the second conductive element 221. Figure 8As shown, the conductive boss 201, except for the portion connected to the second conductive member 221, is fitted with an insulating sleeve 226. The insulating sleeve 226 isolates the bias block 222 from other components besides the second conductive member 221. The insulating sleeve 226 is made of insulating material, preferably PEEK or polytetrafluoroethylene.

[0055] like Figure 7 and Figure 9 As shown, the bias block 222 has a positioning boss 202 on the side facing the clamping ceramic 225, and the clamping ceramic 225 has a recess 206 corresponding to the positioning boss 202 on the side facing the bias block 222, so as to realize the rapid positioning of the bias block 222 and the clamping ceramic 225. The height of the positioning boss 202 is less than the height of the conductive boss 201.

[0056] In a preferred embodiment, the mounting plate body 223 is provided with two receiving holes 203 distributed in the vertical direction, so that each mounting plate part 22 can hold two coating substrates 5 to improve coating efficiency.

[0057] In this embodiment, such as Figure 2 and Figure 3 As shown, the first conductive element 211 and the second conductive element 221 are electrically connected via a conductive portion 23. One end of the conductive portion 23 is connected to the first conductive element 211, and the other end of the conductive portion 23 includes two sub-terminals 231 distributed vertically and respectively connected to the two second conductive elements 221, guiding the bias voltage from the first conductive element 211 to the two second conductive elements 221. The conductive portion 23 can be made of materials such as copper or aluminum sheets, preferably copper sheets.

[0058] like Figure 5 As shown, the rotating support 212 is fixedly connected to the rotating mechanism at one end with a first baffle 214 and at the other end with a second baffle 215. The top surface of the second baffle 215 is provided with a hinge 216. The hanging plate part 22 is connected to the main body part 21 through the hinge 216. The hinge 216 is closer to the first conductive member 211, which facilitates circuit connection, and the hinge 216 connection makes the installation and removal of the hanging plate part 22 more convenient.

[0059] like Figure 4As shown, the ends of the first baffle 214 and the second baffle 215 away from the rotating support 212 are in contact with the hanging plate portion 22. A portion of the conductive part 23 passes through the second baffle 215 and connects to the first conductive member 211, while the remaining portion is located within the receiving space 217 formed by the first baffle 214, the second baffle 215, the rotating support 212, and the hanging plate portion 22. The first baffle 214 and the second baffle 215 can protect the conductive part 23 to ensure that the bias sputtering coating apparatus can provide a stable and reliable bias voltage, while also enabling a more stable and reliable connection between the hanging plate portion 22 and the main body portion 21, preventing the hanging plate portion 22 from shaking during rotation and affecting the coating.

[0060] like Figure 8 As shown, the coated substrate 5 is fixedly placed on the surface of the bias block 222 facing away from the second conductive element 221. The bias block 222 is made of conductive material, preferably copper. The bias voltage is guided from the second conductive element 221 to the bias block 222 and then applied to the coated substrate 5. Specifically, the mounting plate 22 also includes a pressure plate ceramic 227 and a fixing screw 228. The pressure plate ceramic 227 presses the coated substrate 5 onto the surface of the bias block 222 facing away from the current receiving clamp, and then fixes it with the fixing screw 228.

[0061] The bias sputtering coating apparatus provided in this embodiment has a reliable mechanical structure and can meet the high-speed rotation requirements of the coating process. The bias circuit structure formed by the first conductive element 211, the conductive part 23, the second conductive element 221, and the bias block 222 is clear, has reliable insulation, and can provide a stable and reliable bias voltage.

[0062] It should be noted that in the description of this specification, the terms "first," "second," etc., are used only for descriptive purposes and to distinguish similar objects; there is no order between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this specification, unless otherwise stated, "a plurality of" means two or more.

[0063] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or the value of a process variable (e.g., temperature, pressure, time, etc.) is described as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1, etc. These are merely examples intended for explicit expression, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are similarly explicitly stated in this specification.

[0064] Unless otherwise stated, all ranges include the endpoints and all numbers between them. The terms "approximately" or "about" used with ranges apply to both endpoints of the range. Thus, "approximately 20 to 30" is intended to cover "approximately 20 to approximately 30," including at least the specified endpoints.

[0065] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified elements, components, parts, or steps, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute included by “may” is optional.

[0066] Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The use of "a" or "an" to describe an element, component, part, or step does not imply the exclusion of other elements, components, parts, or steps.

[0067] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined by reference to the above description, but rather by reference to the appended claims and the full scope of their equivalents. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended as a waiver of that subject matter, nor should it be construed as an indication that the inventors have not considered that subject matter as part of the disclosed inventive subject matter.

Claims

1. A bias sputtering coating apparatus, characterized in that, include: A reaction vessel with a vacuum chamber; The substrate support mechanism, disposed within the vacuum cavity, for supporting the coated substrate, includes a main body and a mounting plate connected to each other. The mounting plate is disposed on the periphery of the main body. The main body includes a first conductive element and a rotating support element fixedly connected to each other. The first conductive element is used to introduce a bias voltage, and the rotating support element is used to transmit rotational power. The mounting plate includes a second conductive element electrically connected to the first conductive element, and a bias block for placing the coated substrate. The bias block is made of a conductive material and is electrically connected to the second conductive element. A sputtering coating mechanism disposed within the vacuum chamber for sputtering coating the substrate includes a sputtering cathode disposed within the vacuum chamber and connected to the side wall of the vacuum chamber, and a target material mounted on the sputtering cathode, the target material being disposed facing the mounting plate portion; A rotating mechanism for driving the main body to rotate the hanging plate, the rotating mechanism being connected to the rotating support member; A vacuum exhaust mechanism connected to the vacuum chamber is used to exhaust and evacuate the vacuum chamber; the first conductive element and the second conductive element are electrically connected through conductive parts; one end of the rotating support member, which is fixedly connected to the rotating mechanism, is provided with a first baffle, and the other end is provided with a second baffle; the top surface of the second baffle is provided with a hinge, and the hanging plate part is connected to the main body part through the hinge; the ends of the first baffle and the second baffle away from the rotating support member are in contact with the hanging plate part; a part of the conductive part passes through the second baffle and is connected to the first conductive element, and the remaining part is located in the accommodating space enclosed by the first baffle, the second baffle, the rotating support member, and the hanging plate part.

2. The bias sputtering coating apparatus according to claim 1, characterized in that, The number of sputtering coating mechanisms is two, and the two sputtering coating mechanisms are symmetrically arranged about the substrate support mechanism.

3. The bias sputtering coating apparatus according to claim 1, characterized in that, The rotating support is cylindrical, with one end fixedly connected to the rotating mechanism and the other end fixedly connected to the first conductive element through an insulating component.

4. The bias sputtering coating apparatus according to claim 3, characterized in that, The first conductive element includes a receiving flange, and the insulating element includes an insulating flange.

5. The bias sputtering coating apparatus according to claim 1, characterized in that, The mounting plate includes: The main body of the hanging plate has receiving holes; The back plate ceramic is located on the side of the hanging plate body facing the rotating support member, and the second conductive element is located on the side of the back plate ceramic facing the rotating support member; The clamping ceramic is located within the receiving hole and between the bias block and the back plate ceramic. The clamping ceramic is in contact with the hanging plate body, and the bias block is in contact with the clamping ceramic and the coating substrate, respectively.

6. The bias sputtering coating apparatus according to claim 5, characterized in that, The back plate ceramic has a first through hole, and the clamping plate ceramic has a second through hole; the bias block has a conductive boss on the side facing the clamping plate ceramic, and the conductive boss passes through the second through hole and the first through hole and is connected to the second conductive element; the remaining part of the conductive boss, except for the part connected to the second conductive element, is fitted with an insulating sleeve.

7. The bias sputtering coating apparatus according to claim 5, characterized in that, The biasing block has a positioning boss on the side facing the clamping plate ceramic, and the clamping plate ceramic has a recess corresponding to the positioning boss on the side facing the biasing block.

8. The bias sputtering coating apparatus according to claim 5, characterized in that, The main body of the mounting plate is provided with two receiving holes distributed in the vertical direction, and each mounting plate part is used to place two coating substrates.

9. The bias sputtering coating apparatus according to claim 8, characterized in that, One end of the conductive part is connected to the first conductive element, and the other end of the conductive part includes two sub-ends distributed in the vertical direction, which are respectively connected to two second conductive elements.

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