Container for transporting and storing temperature sensitive contents using a solid state heat pump

Abstract

A temperature controlled system includes at least one temperature controlled chamber or package for containing temperature sensitive contents. The system includes at least one solid state heat pump in thermal communication with the temperature controlled chamber or package. The system can include a thermal energy storage system in thermal communication with the solid state heat pump, an electrical power source or electrical storage system for providing electrical power to the at least one solid state heat pump, an electrical controller / energy management system, and / or an input / output feature. The system maintains the temperature controlled chamber at a controlled temperature, and / or different chambers at different controlled temperatures. The package can be separable from a delivery system including the heat pump, thermal energy storage system, and / or electrical power source, wherein a heat transport element provides thermal communication between the package and the solid state heat pump when combined.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 115,277, filed November 18, 2020, entitled “Temperature Control Using DTPThermoelectrics,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The temperature-controlled transport and / or storage systems and devices disclosed herein relate to devices and systems configured to accommodate the transport and / or storage of temperature-sensitive materials and contents, and more specifically to temperature-controlled transport systems and devices including solid-state heat pumps, heat transfer elements, electrical energy storage systems and / or thermal energy storage systems configured to allow feasible temperature-controlled storage and transport of temperature-sensitive materials to the point of use location. Background Technology

[0004] Devices or systems for storing temperature-sensitive materials or contents are known. However, a problem with such existing equipment is that conventional coolers or freezers are not designed to operate to provide the low, controlled temperatures required by certain temperature-sensitive materials or contents. For example, when the first vaccines announced for use against COVID-19 needed to be stored and transported at -70°C, logistical problems were apparent because such conventional coolers and freezers could not be used. While specialized ultra-cold freezers and Stirling coolers exist and can be used at such temperatures, they do not scale well to smaller sizes and are generally very expensive. Ice packs are often used to provide inexpensive refrigerated packaging for smaller packages, but conventional ice packs cannot lower the temperature to the lower, controlled temperatures required by such temperature-sensitive materials or contents. Additionally, while dry ice can be used for smaller packages at lower temperatures, it lacks the ability to provide precise temperature control, and dry ice would be a limited cooling resource.

[0005] The need for compact, precise temperature control for transport and storage extends beyond COVID-19 vaccines. Many temperature-sensitive materials or contents require precise temperature control above and below ambient temperatures. Many temperature-sensitive materials also require the ability to provide long-term and recoverable temperature control beyond what dry ice or conventional ice packs can offer. Furthermore, there is a desire for increased flexibility in transport options for such temperature-sensitive materials or contents, which is impractical when using known refrigeration or freezing systems. For example, there is a desire to transport and deliver certain temperature-sensitive materials or contents to hard-to-reach areas, for instance, using manned or unmanned delivery vehicles (e.g., via aerial drones). To enable the transport and delivery of temperature-sensitive materials or contents, it will be desirable to minimize the weight and / or size of temperature-controlled packaging. Additionally, it may be desirable for such temperature-controlled packaging to be relatively inexpensive, for example, for transport and delivery by vehicles (e.g., drones), as it can be discarded after delivery.

[0006] Therefore, it is desirable for temperature-controlled systems to be specifically designed and configured to facilitate the storage and transport of temperature-sensitive materials or contents, while providing an enhanced degree of temperature control compared to conventional equipment and keeping the temperature below the control temperature provided by such conventional equipment. It is also desirable for such temperature-controlled systems to be designed to provide such controlled-temperature storage and transport at such low temperatures in a more efficient manner than conventional equipment. Furthermore, it is desirable for temperature-controlled systems to be configured to enhance the flexibility of storage and transport of such temperature-sensitive materials, enabling transport and delivery to remote locations, for example, via vehicles such as drones, as may be required for certain end-use applications. Summary of the Invention

[0007] The temperature-controlled system disclosed herein is configured for transporting and / or storing temperature-sensitive contents. In one example, the system includes at least one temperature-controlled chamber for accommodating the placement of temperature-sensitive contents therein. The system includes at least one solid-state heat pump in thermal communication with the at least one temperature-controlled chamber. In one example, the at least one temperature-controlled chamber is disposed within a housing, wherein the position of the housing is traceable. In one example, the system includes thermal insulation between the at least one temperature-controlled chamber and the housing. The thermal insulation may be selected from the group consisting of aerogels, vacuum, and combinations thereof. In one example, the housing includes extended surfaces or fins to dissipate thermal power to the external environment. In one example, the temperature-controlled system includes at least one of: a thermal energy storage system in thermal communication with the at least one solid-state heat pump; and an electrical energy or electrical storage system configured to provide electrical power to the at least one solid-state heat pump. In one example, at least a portion of the solid-state heat pump employs thermoelectric technology. In one example, at least a portion of the solid-state heat pump employs distributed transport characteristic thermoelectric technology. In one example, the at least one solid-state heat pump comprises a cascade of at least two solid-state heat pumps arranged in thermal series.

[0008] In one example, the temperature-controlled system includes a thermal energy storage system, wherein at least a portion of the thermal energy storage system comprises a phase change material. In another example, the temperature-controlled system includes two or more temperature-controlled chambers, wherein one of the temperature-controlled chambers is controlled to a temperature different from the controlled temperature of another temperature-controlled chamber. In yet another example, the temperature-controlled system is configured to control the temperature of at least one temperature-controlled chamber or to control the temperature of two or more temperature-controlled chambers above and / or below ambient temperature.

[0009] In one example, the temperature-controlled system is configured to receive an input command to change the temperature of the temperature-controlled chamber, for example, toward the external ambient temperature. In one example, the temperature-controlled system is configured to read barcodes or other types of input for setting control information. In one example, the temperature-controlled system is configured to program temperature control information. In one example, the temperature-controlled system includes an energy storage system, wherein the energy storage system may be in the form of at least one battery. In one example, the temperature-controlled system includes an electronic control system configured to record information about at least one of the following: the temperature history of contents placed in the at least one temperature-controlled chamber; accessibility retention of fault conditions experienced by the temperature-controlled system; the location of the temperature-controlled system; and the transmission of at least some of the information collected by the temperature-controlled system. In one example, the electronic control system is configured to receive and / or respond to external signals, transmit signals, and / or provide display information. In one example, the temperature-controlled system includes an electrical connector for accepting electrical power from a power source other than the energy storage system. In one example, the temperature-controlled system includes a thermal energy storage system, wherein the thermal energy storage system is removable or reusable. In one example, the at least one temperature-controlled chamber is disposed within the packaging, and the packaging is configured to be connected to and / or carried by a vehicle. In one example, the temperature-controlled system is configured to control humidity. In one example, the temperature-controlled system includes more than one temperature-controlled chamber, and the temperature-controlled system includes a distributed group of storage compartments configured to individually store and / or transport the temperature-controlled packaging.

[0010] In one example, the temperature-controlled system includes at least one separable temperature-controlled package and at least one separable solid-state heat pump in thermal communication with the at least one temperature-controlled chamber. In one example, the at least one temperature-controlled package includes a temperature-controlled chamber and a housing, wherein thermal insulation is provided between the temperature-controlled chamber and the housing. In one example, the temperature-controlled system further includes at least one of the following: a thermal energy storage system in thermal communication with the at least one separable solid-state heat pump; a separable electrical power source for providing electrical power to the at least one solid-state heat pump; a separable electronic controller / energy management system; and input / output features. In one example, the at least one temperature-controlled package is separable from one or more of the at least one solid-state heat pump, the electrical power source, the electronic controller / energy management system, and the input / output features. In one example, the at least one temperature-controlled package is configured to be stored and / or transported in a distributed group of storage compartments. In one example, at least some of the distributed group of storage compartments are configured to provide independent temperature control for the at least one temperature-controlled package. In one example, at least one of the at least solid-state heat pump, thermal energy storage system, electric power source, electronic controller / energy management system, and input / output features is part of a delivery system, wherein the delivery system is separable from the at least one temperature-controlled package, and wherein the at least one temperature-controlled package is disposable. In one example, the delivery system includes a distributed group of storage compartments, and wherein the at least one temperature-controlled package is separable from the distributed group of storage compartments. In one example, the at least one solid-state heat pump and electric power source are located outside the thermally controlled package, and wherein the at least one solid-state heat pump is in thermal communication with a temperature-controlled chamber within the at least one temperature-controlled package via at least one heat transfer element extending through a portion of the at least one temperature-controlled package into the temperature-controlled chamber.

[0011] The temperature-controlled system disclosed herein can be used to store or transport temperature-sensitive contents according to the following method, wherein the method includes: charging a thermal energy storage system and / or an electrical energy storage system; placing the temperature-sensitive contents in a temperature-controlled chamber of the temperature-controlled system including a housing; and directing electrical power from an electrical power source to at least a solid-state heat pump in thermal communication with the temperature-controlled chamber to maintain the temperature-controlled chamber at a controlled temperature, wherein the operational steps occur before or after the placement step. In one example, the method may include inputting temperature information into the temperature-controlled system including the controlled temperature. In one example, the method may include receiving information from the temperature-controlled system including at least one of the following: temperature history information of the temperature-controlled chamber, fault conditions of the temperature-controlled system, location information of the temperature-controlled system, and transmission information of at least some temperature-controlled system information. In one example, the method may include positioning the housing in contact with at least one heat transfer element in thermal communication with the at least one solid-state heat pump, wherein the at least one heat transfer element extends through a portion of the housing and reaches the temperature-controlled chamber.

[0012] The temperature-controlled systems disclosed herein are specifically designed and configured to store and / or transport temperature-sensitive materials or contents while providing an enhanced degree of temperature control compared to conventional equipment, and to keep the temperature below the control temperature provided by such conventional equipment. The temperature-controlled systems disclosed herein are designed and configured to provide such controlled-temperature storage and transport at such low temperatures in a more efficient manner than conventional equipment. Furthermore, the temperature-controlled systems disclosed herein are configured to enhance the flexibility of storing and / or transporting temperature-sensitive materials, enabling transport and delivery to remote locations, for example, via vehicles such as drone delivery, as may be required for certain end-use applications. Attached Figure Description

[0013] The features and advantages of the apparatus, systems, and methods disclosed herein will become more readily understood with reference to the specification, claims, and drawings, wherein:

[0014] Figure 1A This is a perspective side view of the first example temperature-controlled transport system disclosed in this article;

[0015] Figure 1B yes Figure 1A A cross-sectional side view of the first example temperature-controlled transportation system;

[0016] Figure 2A This is a cross-sectional side view of the second example temperature-controlled transport system disclosed herein;

[0017] Figure 2BThis is a cross-sectional side view of the third example temperature-controlled transport system disclosed in this article;

[0018] Figure 3A This is a cross-sectional side view of the fourth example temperature-controlled transport system disclosed in this article;

[0019] Figure 3B This is a cross-sectional side view of the fifth example temperature-controlled transport system disclosed in this article;

[0020] Figure 4 This is a cross-sectional side view of the sixth example temperature-controlled transport system disclosed in this article;

[0021] Figure 5 This is a cross-sectional side view of the seventh example temperature-controlled transport system disclosed in this article;

[0022] Figure 6 It is a cross-sectional side view of the eighth example temperature-controlled transport system disclosed in this article;

[0023] Figure 7 This is a cross-sectional side view of the ninth example temperature-controlled transport system disclosed in this article;

[0024] Figure 8 This is a schematic diagram of an example temperature-controlled transport system used in conjunction with a temperature-controlled transport system as disclosed herein;

[0025] Figure 9A This is a front view of the first example temperature-controlled transport and storage package disclosed herein;

[0026] Figure 9B yes Figure 9A The first example is a side view of a temperature-controlled transport package;

[0027] Figure 10A yes Figure 9A and Figure 9B A front cross-sectional view of the first example temperature-controlled transport package;

[0028] Figure 10B Is with Figure 9A , Figure 9B and Figure 10A A perspective view of an example heat dispersion device used in a first example temperature-controlled transport package;

[0029] Figure 11 It is used in conjunction with the first example temperature-controlled transport system disclosed herein. Figure 10A A front cross-sectional view of the first example temperature-controlled transport system;

[0030] Figure 12 It is used in conjunction with the second example temperature-controlled transport system disclosed herein. Figure 10A A front cross-sectional view of the second example temperature-controlled transport system;

[0031] Figure 13A This is a front cross-sectional view of a third example temperature-controlled transport system used in conjunction with the third example temperature-controlled transport system disclosed herein.

[0032] Figure 13B Is with Figure 13A A perspective view of an example heat dispersing device used in a third example temperature-controlled transport system;

[0033] Figure 14 This is a perspective view of an example temperature-controlled transport system, which includes multiple individual temperature-controlled transport packages, such as... Figure 11 , Figure 12 and Figure 13A Those shown;

[0034] Figure 15A This is a schematic diagram of a first example arrangement of heat pumps, thermal energy storage systems, and heat transfer elements for use with example temperature-controlled transport systems and devices disclosed herein;

[0035] Figure 15B This is a schematic diagram of a second example arrangement of heat pumps, thermal energy storage systems, and heat transfer elements for use with example temperature-controlled transport systems and devices disclosed herein;

[0036] Figure 16 An example thermocouple (TE) is schematically illustrated;

[0037] Figure 17 An example value of the Seebeck coefficient as a function of distance in the direction of current flow is schematically illustrated for an example distributed transmission characteristic (DTP) TE element.

[0038] Figure 18 This is a graph showing the variation of Seebeck coefficient, thermal conductivity, and resistivity in the direction of current flow in an example DTP TE element as a function of DT / TH.

[0039] Figure 19 These are graphs showing the temperature distribution within example CTE and DTP TE elements for various representative operating currents;

[0040] Figure 20 These are graphs depicting the temperature distribution at the center point of example CTE and DTP TE elements as a function of position along the element length for different operating currents.

[0041] Figure 21It is a graph depicting the cooling capacity of example CTE and DTP TE couples as a function of input current for representative DT and ZT (quality factor ZT = S2 / (λρ));

[0042] Figure 22 It is a graph depicting the relationship between COP and cooling capacity for example CTE and DTP TE components under typical operating conditions;

[0043] Figure 23 This is a graph comparing the design performance of a sample commercially available CTE component and a sample DTP TE component designed using commercially available TE materials;

[0044] Figure 24 This is a chart comparing the material usage of an example CTE TE element with that of an example DTP TE element operating under the same conditions;

[0045] Figure 25 It is a graph comparing the performance of two example CTE TE elements using the corresponding materials with the same two materials used to manufacture example DTP TE elements;

[0046] Figure 26 Example design options for DTP TE couplers are illustrated schematically;

[0047] Figure 27 The illustrations schematically depict example design options for DTP TE elements in a stacked configuration;

[0048] Figure 28 An example TE component cascade design is illustrated schematically;

[0049] Figure 29 Examples of graphs comparing the performance of CTE and DTP TE components as a function of the number of cascaded stages; and

[0050] Figure 30 This is a graph comparing example CTE and DTPTE elements for fixed size and different thermal loads and input power and temperature differences. Detailed Implementation

[0051] As disclosed herein, containers for transporting and storing heat-sensitive materials and contents using solid-state heat pumps are referred to in this specification as temperature-controlled transport systems. Temperature-controlled transport systems disclosed herein utilize solid-state heat pumps (e.g., thermoelectric, thermionic, electrothermal, or thermomagnetic devices) to control the temperature of temperature-sensitive materials or contents during transport and storage. Temperature-controlled transport systems disclosed herein are well-suited for the storage and transport of materials or contents, including but not limited to vaccines, pharmaceuticals, biological agents, temperature-sensitive materials such as solder paste, epoxy resins, perishable organic products, living organisms, and other materials that benefit from temperature control during transport or storage. Temperature-controlled transport systems disclosed herein provide heating or cooling temperature control of the material to be stored at a specific temperature within the system's operating capabilities. Temperature-controlled transport systems can be programmed to control to a first specified temperature under one operating condition and switch to one or more other temperatures under other specified operating conditions. Temperature-controlled transport systems disclosed herein include a temperature control system that can be programmed to operate over a wide temperature range. The temperature-controlled transport system disclosed herein includes one or more temperature-controlled chambers, and can be configured to control the temperature of such chambers to temperatures unattainable with water, ice, dry ice, liquid nitrogen, and other material systems currently used for portable temperature control. Furthermore, the temperature-controlled transport system disclosed herein can incorporate more than one temperature-controlled chamber, wherein the more than one temperature-controlled chamber can be simultaneously controlled to different temperatures. Temperature-controlled transport systems utilizing thermoelectric technology with distributed transport characteristics (DTP) are also described. The temperature-controlled transport system disclosed herein can be configured to operate under very cold conditions without the need for dry ice, liquid nitrogen, or other thermal energy storage materials. Furthermore, the temperature-controlled transport system can be designed for efficient control of temperatures above ambient temperature.

[0052] The temperature-controlled transport system disclosed herein can be used within existing refrigerators or freezers and provides a cold chamber for operation at temperatures such as -60°C or -70°C, much lower than the temperatures within the refrigerator or freezer. Furthermore, the use of the temperature-controlled transport system disclosed herein in refrigerators and freezers provides the ability to maintain a desired operating temperature during refrigerator or freezer failures, temporary power interruptions, or the time the temperature-controlled transport system takes to move from one refrigeration system to another. In the aforementioned and other cases, if the temperature deviates from the set temperature by a specified amount, the temperature-controlled transport system disclosed herein can provide temperature history and alarm outputs. The temperature-controlled transport system disclosed herein can be configured such that location, temperature distribution history, available remaining operating time, and other desired metrics related to status and / or performance can be transmitted wirelessly or by other means.

[0053] The temperature-controlled transport systems disclosed herein generally comprise a housing or enclosure having one or more temperature-controlled chambers exposed to and thermally insulated from the environment. The temperature-controlled chambers are configured to accommodate the placement, storage, and transport of temperature-sensitive materials or contents therein. Temperature-controlled transport systems disclosed herein may include heat pump technologies such as conventional solid-state thermoelectric, electrothermal, magnetocaloric, or thermionic devices or DTP thermoelectric technologies. DTP thermoelectric technologies with material structures can provide a larger temperature difference than conventional thermoelectric materials and can operate with a higher coefficient of performance (COP) and greater heat pump capacity than conventional thermoelectric materials. As a result, less electrical power is used per unit time, and the associated temperature-controlled transport system can operate for longer periods at some combination of higher or lower temperatures, or with a smaller power source. In one example, the temperature-controlled transport system disclosed herein uses one or more heat pumps, such as solid-state thermoelectric devices, to provide cooling to the temperature-controlled chambers. A heat transfer element or heat spreader (sometimes also called a radiator or vaporizer) may be inserted between the cooling side or surface of one or more heat pumps and the wall surface of the temperature-controlled chamber to achieve a desired temperature in the temperature-controlled chamber. The temperature-controlled transport system disclosed herein may optionally include a thermal energy storage system, such as a phase change material, disposed therein and positioned to receive thermal energy from one or more solid-state heat pumps. The thermal energy storage system can minimize the amount of electrical power directed to the heat pumps required to maintain the desired controlled temperature of the temperature-controlled chamber, thereby reducing energy consumption and enabling the temperature-controlled transport system to provide temperature-controlled transport and storage for extended periods. The temperature-controlled transport system disclosed herein may include an energy storage system, such as an energy storage system in the form of a battery, and may include an electronic controller / energy management system (EMS) and input / output (I / O) features or systems configured to control the power flow to the heat pump to maintain the temperature-controlled chamber and its contents at a desired control temperature, and may also be configured to receive input data such as temperature, and provide output information such as temperature history, location history, system performance data, etc. The temperature-controlled transport system disclosed herein is configured to operate at portable power and / or according to power supplied by an external power source. The temperature-controlled transport system disclosed herein is configured to optimize the ability of the electronic controller / EMS powering the solid-state heat pump to maintain the temperature of the temperature-controlled chamber for extended periods. In one example, the solid-state heat pump may be configured and / or controlled to allow the temperature of the temperature-controlled chamber to be controlled at a reduced temperature below about -60°C or -70°C.

[0054] The following patents are incorporated herein by reference in their entirety: PCT International Patent No. PCT / US2020 / 016247, filed January 31, 2020, entitled "Thermoelectric Elements and Devices with Enhanced Maximum Temperature Differences Based on Spatially Varying Distributed Transport Properties"; U.S. Provisional Patent Application No. 63 / 039,107, filed June 15, 2020, entitled "Increased Heat Pumping Capacity and Maximum Power Output from Using DTP Thermoelectrics"; and U.S. Patent Application No. 17 / 385,241, filed July 26, 2021, entitled "Thermoelectric Elements and Devices with Enhanced Maximum Temperature Differences based on Spatially Varying Distributed Transport Properties".

[0055] The following terms, as used in this document, are defined as follows:

[0056] Energy storage systems—including, but not limited to, batteries, fuel cells, supercapacitors, and any other suitable energy storage components or sources—provide transferable and portable electrical power.

[0057] Heat transfer elements or components—including, but not limited to, material systems that provide a good thermal connection between parts such as heat pumps and thermal energy storage systems, first heat pumps and second heat pumps, thermal energy storage systems and heat dissipation devices. They can also be any other material or material system that provides low thermal resistance coupling between temperature-controlled parts. These are material systems with high thermal conductivity, such as aluminum, copper, graphite, flat heat pipes, thermosiphons, vapor chambers, hot grease, hot gel, heating pads, and any other good heat transfer medium.

[0058] Heat dissipation devices—including, but not limited to, high thermal conductivity materials such as aluminum, copper, graphite, heat pipes, thermosiphons, vapor chambers, and / or any other suitable high thermal conductivity heat transfer media or systems. Heat dissipation devices are primarily used to distribute heat more broadly and uniformly from a heat source or radiator. The heat source or radiator can be a heat pump or thermal energy storage system. Heat dissipation devices are conduits used for temperature regulation in temperature-controlled chambers. Heat dissipation devices can also distribute heat power for more efficient heat dissipation.

[0059] Electronic controllers and I / O systems—including, but not limited to, controllers and systems for providing connectivity to other locations, tracking information, status of onboard systems (including temperature history, location, readiness status of stored thermal energy, and available capacity of the electrical power system), and other output functions useful for the operation, communication, readiness status, and control of the storage system. The system may also be designed to accept all forms of information, including barcode and magnetic stripe scanning, wireless communication, manual input, and input from any other communication tool. Furthermore, the system may be designed to perform control functions, including responding to changes in the external environment, received commands, removal and addition of stored material requiring temperature changes, and any other control functions designed into the system. The electronic controller can determine how much power the heat pump receives and whether one or more heat pumps in the system receive power. The electronic controller can also change the direction of the current supplied to the heat pump to reverse the direction of heat pump delivery (i.e., from cooling to heating or from heating to cooling). The electronic controller can recharge the electrical energy storage system while also supplying power to one or more heat pumps. The electronic controller receives power from the electrical energy storage system or electrical connectors.

[0060] Insulation – including but not limited to aerogels, vacuum, insulating fiber materials, foam insulation, highly reflective films or any other suitable high-efficiency thermal insulation materials or combinations thereof.

[0061] Temperature-controlled packaging—including, but not limited to, environmentally friendly packaging—is suitable for protecting and / or containing temperature-sensitive materials / contents, such as vaccines, complex organic compounds, frozen specimens, live organisms, or any other temperature-sensitive materials or contents. Temperature-controlled packaging may be designed to be reusable or disposable.

[0062] Thermal energy storage systems include, but are not limited to, any material system having a high heat of transformation or heat of phase change at a desired temperature or within one or more desired temperature ranges. Examples include: phase change media having a high heat of transformation from a first phase to a second phase (including changes between solid and liquid phases or between liquid and gas phases); storage media such as ice, which transforms into water at 0°C; water and water / salt solutions (or any other soluble compound that changes the freezing point of water or another liquid); waxes, which change phase substantially above 0°C. Dry ice is another example of thermal energy storage where the phase change is directly from a solid to a gas.

[0063] Heat pumps—including, but not limited to, solid-state systems and devices—move, pump, or transfer heat from one part (e.g., a side) of a device to another without any moving parts (such as compressors or two-phase refrigerants). Heat pumping allows the side of the device from which heat is removed to be below ambient temperature. For thermoelectric (TE) devices, heat can move in the opposite direction to its initial direction (i.e., from cooling to heating) if the direction of the current or the polarity of the power source is reversed. Heat pumps can be used to control temperature during transport and storage. Heat pump technology can be conventional TE, thermionic, or electrothermal devices, and in particular, they can be constructed using distributed transport characteristics (DTP) TE technology and materials.

[0064] Figure 1AThe illustration depicts a first example temperature-controlled transport system 100 as disclosed herein. The temperature-controlled transport system 100 includes a housing 102, which may be a molded material having a desired level of rigidity, strength, and durability, such as metal or plastic. In one example, the housing is formed from ABS plastic, polycarbonate plastic, or any other suitable material that can be used to manufacture a transportable housing. In one example, the housing 102 is configured to house elements, devices, and systems disclosed below. In this example, the housing is illustrated as having a generally rectangular shape; however, it should be understood that the housing may be formed or constructed differently than illustrated, and such different shapes or constructions are within the scope of this specification. In one example, the housing 102 may be configured to include a closed outer side surface 104 and a top cover or lid 106 movably attached to the housing and positioned on a top surface 108. In one example, the top cover 106 may be attached to the housing via hinges 110, etc., positioned along a common edge to allow the top cover 106 to move away from and toward the top surface 108 of the housing, with the aim of obtaining and restricting access within the housing 102. An attachment mechanism 112, in the form of a latch or similar device, can be used to secure the top cover 106 relative to the housing 102 in a closed position, and to secure the contents of the temperature-controlled transport system 100 within the housing 102. In one example, the top cover 106 may be formed of a material with a desired level of structural rigidity and may also be configured to include thermal insulation to help maintain temperature control within the temperature-controlled transport system 100. In one example, the housing 102 may include optional input / output (I / O) features 114 configured to enable user input and status output to the user for temperature control or other information such as that discussed below. The housing includes an electrical connector 116 configured to provide access to external electrical power so that the temperature-controlled transport system 100 can receive electrical power. The housing 102 may include optional labels or other types of markings 118 attached to the housing surface. These markings 118 may include information related to the temperature-controlled transport system 100, operating conditions, and / or its contents, such as temperature setpoints, the type of contents within the temperature-controlled transport system 100, the model of the temperature-controlled transport system, or other information that may be typical for technical equipment. The housing may include supports 120 attached to a housing surface, such as a bottom surface, for mounting or attaching the housing to a supporting surface.

[0065] Figure 1BThe illustration depicts a first example temperature-controlled transport system 100, showing various components, devices, and systems for transporting and storing temperature-sensitive materials therein. The temperature-controlled transport system 100 includes a temperature-controlled chamber 130 configured to have a desired volume for accommodating the transport and storage of heat-sensitive or temperature-sensitive contents. In one example, the temperature-controlled chamber 130 is surrounded by thermal insulation 132. In one example, the insulation 132 may be provided in the form of a first insulating member 133 surrounding the bottom and side surfaces of the inner chamber 130, and the second insulating member 134 positioned along the top portion of the inner chamber 130 and may be attached to or otherwise associated with a housing top cover 106, which may be movably attached to a housing via a hinge 110 and a latch 112. Constructed in this manner, the second insulating member 134 is separated from the first insulating member 133, thereby allowing access to the temperature-controlled chamber 130 by opening the housing top cover 106. The temperature-controlled transport system 100 includes a solid-state heat pump 136 configured to provide thermal power to control the temperature within the temperature-controlled chamber 130. The heat dissipation side (i.e., the exterior) of the heat pump 136 is in good thermal contact with the adjacent thermal energy storage system 140 of the temperature-controlled chamber, and a heat dissipation device 138 contacts the control surface (i.e., the inner surface) of the heat pump 136 and is inserted between the heat pump 136 and the temperature-controlled chamber 130. The heat dissipation device 138 is configured to transfer thermal power from the heat pump 136 to the temperature-controlled chamber 130 to produce a desired uniform temperature within the temperature-controlled chamber 130. In one example, the heat dissipation device 138 is sized to have a larger surface area than the surface area of ​​the heat pump control surface with which it is in good thermal contact and extends along the wall surface of the temperature-controlled chamber 130. In one example, the heat dissipation side of the heat pump 136 may be in good thermal contact with an optional thermal energy storage system 140 along a surface opposite the heat dissipation device 138. In one example, the thermal energy storage system 140 may include a phase change material having a high heat of change from one phase to a second phase (for example, between a solid and liquid phase or between a liquid and a gas phase) at a desired temperature. For example, the thermal energy storage system 140 may be an ice, water, and salt solution (or any other soluble compound that changes its freezing point) that transforms into water at 0°C, having a phase change temperature other than 0°C. In some cases, it may be desirable to have a mixture of sodium chloride and water as the thermal energy storage system 140, and a phase change temperature between 0°C and -20°C. Similarly, wax may be used for phase change temperatures above 0°C. More generally, the thermal energy storage system 140 may be any material system having a high heat of change at a desired temperature or over one or more desired temperature ranges. In one example, the thermal energy storage system 140 is disposed within a cavity 141 of insulation 133.The thermal energy storage system 140 can be fixed to the heat pump 136 in good thermal contact via the action of a compression member 142 positioned near the surface of the thermal energy storage system 140 opposite the heat pump 136 and configured to transfer pressure toward the heat pump 136 to the thermal energy storage system 140 to ensure good thermal contact between them. In one example, the temperature-controlled transport system 100 may include an optional access port 144 positioned along one side of the surface adjacent to the thermal energy storage system 140. The access port 144 is configured to allow access to the thermal energy storage system 140. Constructed in this way, when the thermal capacity of the thermal energy storage system 140 is depleted, it can be replaced with a new thermal energy storage system 140 or a thermal energy storage system 140 with a different capacity or phase change temperature. An insulating door 146 is disposed in the access port 144 and can be movably attached within the port via an optional pivot or hinge mechanism 148 and a latching mechanism 150. Constructed in this manner, when closed in inlet port 144, insulating door 146 contacts compression member 142 to secure the thermal energy storage medium 140 to the desired placement and ensure desired thermal contact with heat pump 136. Temperature-controlled transport system 100 may include optional seal 152 configured to provide, for example, a low-heat-loss movable interface between first insulating member 133 and second insulating member 134 for temperature control. Temperature-controlled transport system 100 includes electrical energy storage system 154 configured to provide electrical power to operate heat pump 136. In one example, electrical energy storage system 154 may be configured to provide electrical power to heat pump 136 from a remote power source such as a battery and / or from an external power source using one or more electrical conduits (not shown). The temperature-controlled transport system 100 may optionally include an electronic controller / energy management system (EMS) 156 configured to control the energy storage system 154, optionally receive user input from I / O feature 114, and optionally provide temperature-controlled transport system 100 information to optional I / O features, such as for display. The temperature-controlled transport system 100 may include an optional temperature sensor 158 comprising elements positioned within a temperature-controlled chamber 130 and configured to sense the temperature within the temperature-controlled chamber 130 and provide temperature information to the optional electronic controller / EMS 156. An electrical connector 116 is configured as a power inlet to provide access to external electrical power to the temperature-controlled transport system 100, thereby powering the heat pump 136 and / or charging the energy storage system 154. In one example, I / O feature 114 is configured to have mechanisms enabling a user to receive operational information and communicate with and control the operation of the temperature-controlled transport system 100.In one example, the electronic controller / EMS 156 may be configured to provide stored temperature information (such as that measured by temperature sensor 158) over time, the readiness status of the energy storage system 154, remaining energy storage time, and other information via I / O feature 114, through a display and / or wireless communication to an external device (not shown). In one example, the electronic controller / EMS 156 may be configured to store temperature setpoints and distributions that may be programmable by a user via I / O feature 114. Optional barcodes or other information-providing features (not shown) may enable the provision of desired temperature setpoints and distributions and may also be part of I / O feature 114.

[0066] Figure 2AThe illustration shows a second example temperature-controlled transport system 200 as disclosed herein, comprising a housing or enclosure 202 forming an outer surface, a top surface, and a bottom surface of the temperature-controlled transport system 200. Thermal insulation 204 is positioned to contact an inner surface of the housing 202 and is interposed between the housing 202 and one or more heat dissipation devices 206. Thermal insulation 204 is positioned to insulate the one or more heat dissipation devices 206 from heat loss to the external environment. In one example, the heat dissipation device 206 is configured and positioned to distribute or disperse waste heat power discharged from a heat pump 210. In one example, the heat dissipation device 206 may be made of a material with high thermal conductivity. In one example, the heat dissipation device 206 is in good thermal contact with the waste heat power discharge side / surface of one or more heat pumps 210. In one example, the heat dissipation device 206 is configured to have a surface area larger than the surface area of ​​the heat pump 210 surface in thermal contact with the heat dissipation device 206. In one example, the heat dissipation device 206 may be configured to extend along a large portion of the surface area. The temperature-controlled transport system 200 includes a temperature-controlled chamber 212 configured to accommodate the transport and storage of temperature-sensitive contents therein. In one example, the temperature-controlled chamber 212 includes opposing side, top, and bottom temperature-controlled outer walls 214, which are proportioned and positioned to provide a uniform temperature to the temperature-controlled chamber 212. In one example, the inner chamber temperature-controlled outer wall 214 extends integrally along the respective wall of the temperature-controlled chamber 212. In one example, the inner chamber temperature-controlled outer wall 214 may be made of a material with high thermal conductivity. A housing 202 is configured to have a top cover or lid (not shown) for access to the temperature-controlled chamber 212 as described in the example above. The temperature-controlled transport system 200 includes one or more heat pumps 210 inserted or positioned between the heat dissipation device 206 and the inner chamber temperature-controlled outer wall 214. In one example, the temperature-controlled transport system 200 includes two heat pumps 210, one located on one side of the temperature-controlled chamber 212 and the other on the other side. Each heat pump 210 has a first surface (e.g., a waste heat power generation surface) in good thermal contact with a corresponding heat dissipation device 206 and a second opposing surface (temperature control surface) in good thermal contact with a corresponding inner chamber temperature-controlled outer wall 214. Thermal insulation 204 is disposed within a cavity formed between the opposing surface of the heat dissipation device 206 and the inner chamber temperature-controlled outer wall 214 not occupied by the heat pumps 210. The temperature-controlled chamber 212 is controlled to a desired temperature T by the operation of the heat pumps 210. INT 217, to facilitate the transport and storage of temperature-sensitive contents or materials 218, such as vaccines, complex organic materials, frozen specimens, living organisms, or any other type of temperature-sensitive material or contents, disposed within a temperature-controlled chamber 212.

[0067] In one example, heat pump 210 receives electrical power from energy storage system 220 or an external power source (not shown) via electrical connector 222. In one example, energy storage system 220 is a high-power-density electrical energy source, such as a lithium battery. Temperature-controlled transport system 200 may have an electronic controller / EMS 224 configured to perform several functions, including controlling the power from energy storage system 220 to heat pump 210 to maintain a desired control temperature T within a range of external environmental conditions. INT 217. In one example, electrical connector 222 may be used to provide external electrical power to temperature-controlled transport system 200 under certain operating conditions further described below. Optionally, electronic controller / EMS 224 may be configured to control one or more of the heat pumps 210 to change the temperature T of temperature-controlled chamber 212 under specified conditions. INT The capability of 217. In one example, the electronic controller / EMS 224 can control the operation of the heat pump 210 to maintain all or part of the contents 218 of the temperature-controlled chamber 212 at a specified temperature. In another example, after maintaining the contents 218 at a specified temperature during a period of transport or storage, the electronic controller / EMS 224 can change the performance of the heat pump 210 to bring the contents 218 to a second desired temperature before use or removal of the contents 218.

[0068] Figure 2B The illustration shows a third example temperature-controlled transport system 250 as disclosed herein, which is somewhat similar to the one described above. Figure 2A The second temperature-controlled transport system 200. With Figure 2A Unlike the previous example, this example temperature-controlled transport system 250 includes a thermal energy storage system 252 disposed therein. The thermal energy storage system 252 may be... Figure 1A and Figure 1B It is made of the same type of material as described. The thermal energy storage system 252 is disposed within a cavity formed between the heat transfer element 276 and the thermal insulation 256, with the thermal insulation 256 positioned adjacent to the inner surface of the housing or outer casing 258. The thermal energy storage system 252 is in good thermal contact with the heat transfer element 276. Figure 2ASimilar to the example, the temperature-controlled transport system 250 includes two heat transfer elements 276, each in good thermal contact with the heat exhaust side or surface of a corresponding heat pump 260, and positioned to disperse the heat power discharged from the heat pump 260 through thermal insulation 256 and to the housing or outer casing 258. The temperature-controlled transport system 250 includes a temperature-controlled chamber 262 configured to house a temperature-sensitive material or contents 260. In one example, the temperature-controlled chamber 262 includes one or more temperature-controlled outer walls 264, which are good thermal conductors and are sized and positioned to provide a uniform temperature within the temperature-controlled chamber 262. The temperature-controlled chamber 262 is controlled by the heat pump 260 to a desired temperature T. INT 268. In one example, an inner chamber temperature-controlled outer wall 264 surrounds a temperature-controlled chamber 262, and a heat pump 260 is disposed within a corresponding cavity formed between each inner chamber temperature-controlled outer wall 264 and an opposing heat transfer element 276. The cavity is filled with thermal insulation 256, except for the space occupied by the heat pump 260. In one example, the temperature-controlled chamber 262 can be maintained at a controlled temperature T. INT 268, for use in the transport and storage of temperature-sensitive materials such as vaccines, complex organic materials, frozen specimens, living organisms or any other temperature-sensitive materials or contents. 260.

[0069] Similar to the example temperature-controlled transport system of Figure 2, the heat pump 260 receives electrical power from the energy storage system 270 or an external power source (not shown) via the electrical connector 272, wherein the energy storage system 270 may be the same as described above. The electronic controller / EMS 274 may function and operate in the same manner as described above. The temperature-controlled transport system 250, including the heat storage system 252, is characterized in that, with Figure 2A Compared to the temperature-controlled transport system 200, it can operate to maintain the desired temperature T of the temperature-controlled chamber 262 for extended durations or with lower required electrical power consumption. INT 268.

[0070] Figure 3A The illustration shows a fourth example temperature-controlled transport system 300 disclosed herein, which is somewhat similar to... Figure 2AA temperature-controlled transport system 200. However, this example temperature-controlled transport system 300 is configured to include one or more first-stage heat pumps 302, which are in good thermal contact with one or more corresponding radiator assemblies 310. In one example, the one or more radiator assemblies 310 are formed of a thermally conductive material such as aluminum, copper, etc., and are configured to have a desired surface area to transfer thermal power from the one or more first-stage heat pumps 302 to the external environment. As illustrated, the first-stage heat pumps 302 are arranged in a stacked or cascaded configuration in good thermal contact with one or more second-stage heat pumps 308. In one example, the radiator assemblies 310 may be configured to surround the system or selectively positioned to maximize heat removal from the first-stage heat pumps 302. Each of the stacked first-stage heat pumps 302 and second-stage heat pumps 308 is disposed within a corresponding cavity formed between the corresponding radiator assembly 310 and an opposing temperature-controlled outer wall 312 of the temperature-controlled chamber 314. Thermal insulation 316 is disposed within each cavity to reduce heat transfer between each temperature-controlled outer wall 312 and the corresponding radiator assembly 310. Optionally, at locations where there is no heat conduction path in the radiator assembly 310, thermal insulation 318 may be positioned to reduce heat flow between the energy storage system 320 and the opposing temperature-controlled outer cavity wall 312. The temperature-controlled outer cavity wall 312 is in good thermal contact with the second-stage heat pump 308. The temperature-controlled outer wall 312 generally surrounds the temperature-controlled chamber 314. The temperature-controlled chamber 314 is controlled by the heat pump 308 at a desired temperature T. INT 322. The temperature-controlled chamber 314 is configured to contain temperature-sensitive materials or contents 324 for transport and storage. Similar to the example temperature-controlled transport system described above, the temperature-controlled transport system 300 is configured to have a top cover or opening (not shown) for access to the temperature-controlled chamber 314.

[0071] The first-stage heat pump 302 and the second-stage heat pump 308 receive electrical power from the energy storage system 320 or from an external power supply via an electrical connector 326, as described above for other examples. The example temperature-controlled transport system 300 includes an electronic controller / EMS 328 configured to perform several functions, including the control of electrical power from the energy storage system 320 to the first-stage heat pump 302 and / or the second-stage heat pump 308. Typically, the first-stage heat pump 302 has a similar design to the second-stage heat pump 308, but typically has a greater heat pumping capacity to provide sufficient heat pumping to generate temperature at the interface between the first-stage heat pump 302 and the second-stage heat pump 308, thereby optimizing overall heat pumping efficiency and / or maximizing the external environment and temperature. INTThe temperature difference between 322. The first-stage heat pump 302 must not only be able to dissipate the waste heat power it generates, but also the waste heat power from the second-stage heat pump 308. Such performance and design considerations are well known to those familiar with cascaded heat pump design.

[0072] Figure 3B The illustration shows a fifth example temperature-controlled transport system 350 as disclosed herein, which is somewhat similar to the one described above. Figure 3A Example shown in the diagram. (Compared to...) Figure 3A Unlike the example temperature-controlled transport system, this example temperature-controlled transport system, in addition to the first-stage heat pump 354 and the second-stage heat pump 356, also utilizes a thermal energy storage system 352 to increase temperature control capability over a longer period of time or with lower required stored electrical power consumption. The thermal energy storage system 352 and the heat pumps 354 and 356 are arranged to supplement all or part of the thermal energy exchanged with the thermal energy storage system 352. In one example, the temperature-controlled transport system 350 includes one or more first-stage heat pumps 354 in good thermal contact with one or more corresponding radiator assemblies 358 extending outward into the external environment. The radiator assemblies 358 are configured to transfer thermal power from the first-stage heat pumps 354 to the external environment. The control temperature side of one or more first-stage heat pumps 354 is in good thermal contact with one or more heat transfer elements 364. The radiator assemblies 358 and heat transfer elements 364 in contact with the opposing surfaces of the first-stage heat pumps 354 are made of a high thermal conductivity heat-dispersing material. The radiator assembly 358 may be positioned around the system or selectively to maximize the removal of heat power from the first-stage heat pump 354. Thermal insulation 366 is disposed within the cavity formed between the radiator assembly 358 and the heat transfer element 364 to reduce heat transfer between them. The amount of heat leakage between the radiator assembly 358 and the heat transfer element 364 can be reduced by substantially increasing the distance between adjacent radiator assemblies 358 and heat transfer elements 364, and by adding more or better-performing insulation 366 where other design considerations permit. Thermal insulation 378 is provided to reduce heat flow between the heat transfer element 374 and the thermally controlled outer chamber wall 370 of the temperature-controlled chamber 372.

[0073] Advantageously, the thermal energy storage system 352 includes a phase change material as disclosed above and is disposed in a cavity formed between heat transfer element 364 and opposing heat transfer element 374. In one example, the thermal energy storage system 352 is in good thermal contact with each of the heat transfer elements 364 and 374, and the heat transfer elements 364 and 374 are positioned to maintain a uniform temperature within a portion of the interior of the thermal energy storage system 352. Each heat transfer element 374 is in good thermal contact with the heat dissipation side or surface of the corresponding second-stage heat pump 356. Constructed in this way, the thermal energy storage system 352 receives waste heat power from the second-stage heat pump 356 via the heat transfer element 374 and receives heat power from the first-stage heat pump 354 via the heat transfer element 364. One or more temperature-controlled outer chamber walls 370 are in good thermal contact with the temperature-controlled side or surface of the corresponding second-stage heat pump 356 and are constructed and positioned to provide a uniform desired controlled temperature T to the temperature-controlled chamber 372. INT 376. Thermal insulation 378 is disposed within the cavity formed between the temperature-controlled outer chamber wall 370 and the opposing heat transfer element 374 to minimize the amount of heat transfer between them. The temperature-controlled transport system 350 includes an energy storage system 380, an electrical connector 382, ​​and may include an electronic controller / EMS 315, which operates in a manner similar to that described above for... Figure 3A The illustrated example of a temperature-controlled transport system is configured and operates in a manner that is publicly apparent. The operation of the first-stage heat pump 354 and the second-stage heat pump 356 is similar to that described above. Figure 3A The described operation.

[0074] Figure 4 The illustration shows a sixth example of a temperature-controlled transport system 400 disclosed herein, which is somewhat similar to the one disclosed above. Figure 3BExample temperature-controlled transport system 350 includes similar elements and components. In this example, temperature-controlled transport system 400 is configured to allow the thermal energy storage system 402 to be removed and replaced, for example, replaced with a thermal energy storage system 402 of similar shape. Replacement allows for the exchange of one thermal energy storage system 402 to be replaced by an alternative thermal energy storage system 402. As an example, a thermal energy storage system 402 comprising a first phase change material having a transition temperature can be replaced with a thermal energy storage system 402 comprising a second phase change material having a different transition temperature. Alternatively, a thermal energy storage system 402 having reduced, degraded, or depleted thermal storage capacity can be replaced with a fully charged or new thermal energy storage system 402. In one example, temperature-controlled transport system 400 may be configured to include a latching mechanism 404 and a hinge mechanism 406 attached to a radiator assembly 408 and a heat pump 412 to remove waste heat power. A thermal interface gasket 416 provides a high thermal conductivity path between the heat pump 412 and the radiator assembly 408. In one example, with the radiator assembly 408 in the open position, the first thermal energy storage system 402 can be removed from the temperature-controlled transport system 400 and replaced with a second thermal energy storage system 402. After such removal and replacement, the radiator assembly 408 can be moved back to the closed position, and the latching mechanism 404 re-engages to restore the high thermal conductivity path between the heat pump 412, the thermal interface gasket 416, and the radiator assembly 408. This is merely one example of how the temperature-controlled transport system 400, as disclosed herein, can be configured to allow easy removal and replacement of the thermal energy storage system 402, and it should be understood that other construction intentions for such temperature-controlled transport systems to provide the same purpose are within the scope of temperature-controlled transport systems disclosed herein.

[0075] Figure 5The illustration depicts a seventh example temperature-controlled transport system 500 disclosed herein, configured to include a plurality of individual temperature-controlled chambers 504, each configured to accommodate the temperature-controlled transport and storage of a corresponding temperature-sensitive material or contents 506. In one example, the temperature-controlled transport system 500 includes a housing or enclosure 502 as disclosed in other examples, and is configured to include a plurality of individual temperature-controlled chambers 504 positioned along a central region of the housing 502, each configured to accommodate a corresponding individual temperature-sensitive material or contents 506. In one example, a thermal energy storage system 508 is disposed in a cavity extending inwardly from thermal insulation 510 positioned along the inner surface (e.g., top surface, side surface (not shown), and bottom surface) of the housing 502 to thermal insulation 512 positioned along the opposing ends and sides (not shown) of each individual temperature-controlled chamber 504. Each temperature-controlled chamber 504 is configured to include two heat pumps 514, which are in good thermal contact with the opposing temperature-controlled outer chamber wall 516 of the temperature-controlled chamber 504 to receive controlled thermal power therefrom. A heat transfer element 518 is in good thermal contact with each corresponding heat pump 514 to receive waste heat power therefrom, such that each heat pump 514 is inserted between the inner chamber temperature-controlled outer chamber wall 516 and the corresponding heat transfer element 518. The heat transfer elements 518 are thermally insulated from each other by thermal insulation 512 and include opposing end portions 520 in good thermal contact with the thermal energy storage medium 508. In this manner, each temperature-controlled chamber 504 is adjacent to and separated from each other by the heat pumps 514, the heat transfer elements 518, and the thermal insulation 512. In one example, the temperature-controlled transport system 500 may further include a thermal energy storage system 509 located at or around each end of each temperature-controlled chamber 504, and may also include a thermal energy storage system 511 disposed between a heat transfer element 518 at each end and a thermal insulation 510 located at the opposite end of the housing 502. The temperature control portion of the heat pump 514 is in good thermal contact with a temperature-controlled outer chamber wall 516 that transfers thermal power to or from the temperature-controlled chamber 504. The temperature-controlled transport system 500 includes an electrical energy storage system 522, an electronic controller / EMS 524, and an electrical connector 526 that allows electrical power to be supplied from an external power source (not shown) to the heat pump 514 and other portions of the temperature-controlled transport system 500 as needed. In one example, the temperature-controlled chambers 504 of the temperature-controlled transport system 500 are at least partially thermally isolated from each other, allowing each to have a degree of independent thermal control.As an example, through independent thermal control, the first temperature-controlled chamber 504 can be controlled to a different temperature than the second temperature-controlled chamber 504, and the material or contents 506 in the second temperature-controlled chamber 504 can be heated or cooled to a second temperature before removal, while the material or contents 506 in the first temperature-controlled chamber 504 adjacent to the second temperature-controlled chamber 504 can be maintained at a constant temperature. These independent temperatures can each be higher than, equal to, or lower than the ambient temperature. Although an example temperature-controlled transport system 500 including a separate temperature-controlled chamber 504 capable of individual temperature control has been disclosed and illustrated, it should be understood that variations in construction may exist to achieve the same or similar purposes, and such variations are intended to be within the scope of temperature-controlled transport systems disclosed herein.

[0076] Figure 6 The illustration shows a seventh example temperature-controlled transport system 600 as disclosed herein, which has the same features as disclosed above. Figure 5The temperature-controlled transport system 500 has similar general features, such as including multiple individual temperature-controlled chambers 602, a heat pump 604, removable sections of thermal insulation 606 and 608, a removable thermal energy storage system 610 that may be located on or around the ends of the temperature-controlled chambers 602, and removable temperature-sensitive material or contents 614 disposed in the individual temperature-controlled chambers 602. In one example, the temperature-controlled transport system 600 includes a removable section of thermal insulation 606 positioned above or below each temperature-controlled chamber 602 to facilitate removal / replacement of the removable temperature-sensitive material or contents 614. In one example, the temperature-controlled transport system 600 includes a removable section of thermal insulation 608 positioned away from the temperature-controlled chambers 602 and adjacent to the thermal energy storage system 612 disposed below the section of thermal insulation 608, thereby facilitating removal / replacement of the thermal energy storage system 612. In one example, once the desired section of the thermal energy storage system 612 has been removed and replaced, the associated section of the thermal insulation 608 removed to access the thermal energy storage system 612 is reinstalled in its original functional position. In one example, for effective operation of the temperature-controlled transport system 600, the replacement thermal energy storage system 612 is preferably configured to provide good thermal contact with the associated heat pump 604. In one example, the temperature-controlled transport system 600 may include more than one thermal energy storage system 612 disposed between adjacent temperature-controlled chambers 602, which can be used to provide improved ability to maintain desired differences in controlled temperature conditions between adjacent temperature-controlled chambers 602, for example, in cases of significant temperature differences, or when a temperature-sensitive material or contents 614 in one temperature-controlled chamber 602 may require temperature changes that are not desired by the temperature-sensitive material or contents 614 in the adjacent temperature-controlled chambers 602. In one example, temperature control of the temperature-controlled chamber 602 may be directed by an I / O feature and an energy storage system 616, wherein the I / O feature 616 may include an electrical energy storage system 616, and wherein external electrical power may be supplied via an electrical connector 618 to power the heat pump 604. In one example, the temperature-controlled transport system 600 may be operable to change the temperature of the temperature-sensitive material or contents 614 in the temperature-controlled chamber 602 before removal. In one example, the temperature change process may begin by identifying the specific temperature-controlled chamber 602 containing the temperature-sensitive material or contents 614 to be removed, transmitting a specified sample temperature to the I / O feature 616 before removal, receiving timing information from the I / O feature 616, and receiving a message from the I / O feature 616 when the desired temperature change is complete.The temperature-controlled transport system 600 may be configured to include additional thermal insulation 606 and / or 608 and / or an additional thermal energy storage system 612 to help mitigate temperature changes experienced by the temperature-sensitive material or contents 614 in other chambers due to the removal process described above. In one example, the same design concept is applied to removing and replacing a sample of first temperature-sensitive material or contents 614 with a second temperature-sensitive material or contents 614 in the same temperature-controlled chamber 602. The first temperature-sensitive material or contents 614 may have one temperature, and the second temperature-sensitive material or contents 614 may have a different temperature. With the second temperature within the design limits of the temperature-controlled chamber 602, the second temperature-sensitive material or contents 614 may be inserted into the temperature-controlled chamber 602 and temperature-controlled to the desired temperature when stored temperature information is input to the I / O feature 616.

[0077] Figure 7The illustration depicts a ninth example temperature-controlled transport system 700, as disclosed herein, for storing and transporting temperature-sensitive materials or contents. The temperature-controlled transport system 700 includes a thermally insulating housing or body 702 extending along an external region of the system, and a temperature-controlled chamber 704 disposed within the housing and occupying an internal region of the system. In one example, a thermally insulating top cover 706 is disposed above an opening in the housing 702, for example, along the top surface of the housing 702, and is attached to the housing via a hinge mechanism 708 to allow the top cover 706 to be opened and closed relative to the housing 702. When the top cover 706 is in the closed position, a latching mechanism 710 can be used to hold the top cover 706 in place relative to the housing 702, thereby sealing the temperature-controlled chamber 704. In one example, a heat dissipation device 712 is disposed between an inner surface of the housing 702 and the internal chamber 704. In one example, the heat dissipation device 712 is configured as a heat distributor and extends along the side and bottom surfaces of the interior of the housing 702 to transfer heat to the temperature-controlled chamber 704. One or more first heat pumps 714 are disposed within a cavity of housing 702, and in one example, may be positioned below inner chamber 704 along the bottom portion of housing 702. A heat dissipation device 712 is in good thermal contact with the control side or surface of heat pump 714 for temperature control of temperature-controlled chamber 704. In one example, a thermal interface material 716 is inserted between the heat dissipation side or surface of heat pump 714 opposite to the control side of heat pump and heat pipe 718. In one example, heat pipe 718 is disposed in a region of housing 702 that extends below heat pump 714 and upward along the sidewall of housing 702 through the thermal insulation of housing 702. In one example, one or more second heat pumps 720 are positioned along the sidewall of housing 702 in a thermally insulated cavity and have a control side or surface in good thermal contact with heat pipe 718. In one example, a radiator assembly 722, formed of a thermally conductive metal material, is disposed along a side portion of the housing 702 and external thereto, and is in good thermal contact with the waste heat power side or surface of one or more second heat pumps 720. If desired, a thermal interface material 724 may be inserted between the radiator assembly 722 and the second heat pump 720 to ensure a desired level of good thermal contact between them. In one example, the temperature-controlled transport system 700 includes a thermal energy storage system 726 as disclosed in the examples above, disposed in a cavity within the housing below the first heat pump 714, and in good thermal contact with a heat pipe 718. In one example, the temperature-controlled transport system 700 includes an electrical energy storage system 728, an electronic controller / EMS and I / O 730, an electrical connector 732 positioned along the bottom portion of the housing 702, and a mounting element or support 734 positioned along the bottom surface of the housing 702. In one example, the general structure of the temperature-controlled transport system 700 is similar to that described above and in… Figure 1A and Figure 1B Example shown in the diagram. The temperature-controlled transport system 700 is designed with advantageous features suitable for operation in multiple environments, for which the combination of heat pipe 718, thermal energy storage system 726 and electrical energy storage system 728 interacts to provide uninterrupted temperature control capability, long operating time and optimized operating efficiency.

[0078] In a first operating mode, the temperature-controlled transport system 700 includes a heat-sensitive material or contents (not shown) for temperature control in an environment where external electrical power is available, and provides electrical power via an electrical connector 732 to maintain the temperature-controlled chamber 704 at a desired temperature, the thermal energy storage system 726 at full thermal capacity, and the electrical energy storage system 728 at full electrical capacity. In this operating mode, one or more first heat pumps 714 control the temperature in the temperature-controlled chamber 704 and transfer waste heat from their exhaust side to heat pipes 718. The waste heat is convection via heat pipes 718 to the control side of one or more second heat pumps 720, and is discharged from the system via radiator assembly 722. The thermal energy storage system 726, in parallel with the removal of heat power from the first or more heat pumps 714, is pumped via heat pipes 718 from the control side of the second or more heat pumps 720 to the radiator assembly 722 to maintain full thermal capacity. If the external electrical power to the temperature-controlled transport system 700 is interrupted, the thermal energy storage system 726 will combine with the electrical energy storage system 728 to provide temperature control capability to the first or more heat pumps 714, thereby not interrupting the temperature control of the temperature-controlled chamber 704. In an example where the desired temperature control in the temperature-controlled chamber 704 is lower than the external environment and the thermal energy storage system 726 is a phase change material with a phase change temperature between the desired temperature of the temperature-controlled chamber 704 and the environment, the orientation and vertical length of the heat pipe 718 can be designed to prevent significant heat transfer from the environment backward through the radiator assembly 722, the second or more heat pumps 720, and the heat pipe 718. The vertical height between the first heat pump 714 and the second heat pump 720, the temperature and fluid fill height, and the wicking characteristics of the heat pipe 718 material are parameters affecting the effectiveness of the design. The techniques used to design this performance are known to skilled heat pipe designers. In this operating state, in the event of a loss of external electrical power to the temperature-controlled transport system 700 for operating the second or more heat pumps 720, the heat pipe 718 can be designed to function / operate to isolate the second or more heat pumps 720 from the first or more heat pumps 714 without any added mechanical valves or other moving parts. Therefore, the heat pipe 718 can be designed to eliminate unwanted heat leakage paths in the temperature-controlled transport system 700. Upon restoration of external electrical power, the temperature-controlled transport system 700 automatically returns to its normal operating mode.

[0079] In the second operating mode, the temperature-controlled transport system 700 is located in a cooler or cold box (not shown) and is supplied with external electrical power via an electrical connector 732. If the temperature of the cooler or cold box is lower than the target control temperature in the temperature-controlled chamber 704, the heat pipe 718 operates to significantly reduce heat transfer from the cooler or cold box to the temperature-controlled chamber 704, and thereby prevents heat leakage (undesired cooling) through a second or more heat pumps 720.

[0080] In the third operating mode, the temperature-controlled transport system 700 transports goods under conditions where external electrical power is unavailable and the external temperature is higher than the target control temperature in the temperature-controlled chamber 704. Electrical power is supplied by the energy storage system 728 to one or more first heat pumps 714. The thermal energy storage system 726 absorbs waste heat from one or more first heat pumps 714. Depending on the state of charge of the energy storage system 728 and the temperature of the thermal energy storage system 726, electrical power may or may not be supplied to a second or more heat pumps 720. As an example, if the thermal energy storage system 726 has exhausted its thermal energy storage capacity, the temperature in the temperature-controlled chamber 704 has begun to rise, and there is still charge in the energy storage system 728, then in this case, the electronic controller / EMS and I / O 730 may be designed such that electrical power can be provided to the first heat pump 714, or electrical power can be provided to the first heat pump 714 and the second heat pump 720, until the energy storage system 726 is exhausted. Generally speaking, compared to eliminating the thermal energy storage system 726 and adding the electrical energy storage system 728, the combined source of stored thermal and electrical energy produces the most cost-effective and energy-efficient operation.

[0081] Figure 8 The illustration shows a schematic layout of an example temperature control system 800, which includes a functional controller, sensing system, power source, and I / O for a temperature-controlled transport system as disclosed herein, including those shown in Figures 1 to 12. Figure 7 and Figures 11 to 14 Those depicted in [the text]. For reference and explanation purposes, Figure 8An example temperature control system 800 is provided for a temperature-controlled transport system as disclosed herein, the temperature-controlled transport system comprising two temperature-controlled chambers 802 and 804 separated from each other by thermal insulation 806. A heat pump 808 is configured and positioned to provide thermal power to control and maintain the temperature of temperature-controlled chamber 802, and a heat pump 810 is configured and positioned to provide thermal power to control and maintain the temperature of temperature-controlled chamber 804. Heat pump 808 is in good thermal contact with a thermal energy storage system 812, and heat pump 810 is in good thermal contact with a thermal energy storage system 814. Thermal energy storage systems 812 and 814 are thermally insulated from each other. Heat pumps 808 and 810 may each be made of more than one heat pump module, and the number of heat pump components constituting heat pump 808 may differ from the number of heat pump components used in heat pump 810. A temperature sensor 816 is configured and positioned to monitor the temperature of temperature-controlled chamber 802, and a temperature sensor 818 is configured and positioned to monitor the temperature of temperature-controlled chamber 804. I / O features or system 820 receive information from temperature sensors 816 and 818, and temperature sensors 816 and 818, heat pumps 808 and 810 are in electrical communication with I / O system 820 via electrical conduit 822.

[0082] In the example temperature control system 800, the I / O system 820 is configured to function as both a power controller, an input / output system, and an energy management system (EMS). The I / O system 820 receives electrical power from one or more energy storage systems 824 and / or from an external power source 826 (such as an external power source supplied from a conventional wall socket (not shown)). The I / O system 820 is configured to regulate the electrical power to operate (e.g., individually) the heat pumps 808 and 810 in each of the temperature-controlled chambers 802 and 804 to a desired control temperature, which may have been input by a user to the I / O system 820 as described above. The I / O system 820 may be configured to provide state of charge and safety monitoring for the energy storage system 824. The I / O system 820 may be configured to have other capabilities, such as receiving information from an external source and / or providing or deriving information about the current temperature, location, and temperature history of the temperature-controlled chambers 802 and 804. The I / O system 820 may have an output function configured to provide other types of information, including but not limited to state of charge, remaining capacity, current consumption and voltage of the heat pump, estimated remaining operating time, faults related to the performance status of the aforementioned subsystems and components, tracking location information, temperature history and periodic status reports, and any other energy management I / O that can be collected, processed, stored, retrieved, and transmitted, as well as any other related functions known to a person skilled in control, sensing, communication, and monitoring systems. The I / O system 820 may be configured to provide such information remotely via wireless transmission, via a wired connection, and / or locally via a display, acoustic transmission, etc., mounted or otherwise connected to the I / O system 820.

[0083] Figure 9AThe illustration shows a front view of a temperature-controlled package 900 as disclosed herein, configured to have a temperature-controlled chamber (not shown) for containing a temperature-sensitive material or contents (not shown), including but not limited to vaccines, complex organic materials, frozen specimens, live organisms, etc. In one example, the temperature-controlled package 900 may have a lightweight construction and / or be compact in size. In one example, the temperature-controlled package 900 is configured to utilize one or more thermal management systems external to the temperature-controlled package 900 to provide a desired controlled temperature to the temperature-controlled chamber of the temperature-controlled package 900 and the contents within the temperature-controlled chamber. In one example, the temperature-controlled package 900 and the external thermal management system (not shown) may be configured to provide temperature control for a small dose of vaccine or any other temperature-sensitive material disposed within the temperature-controlled package 900. In one example, temperature-controlled packaging 900 includes a temperature-sensitive material or contents for which temperature is to be controlled, thermal insulation for maintaining the environment to keep the material at a controlled temperature, a cover for protecting the material, and optionally labels or other markings for identifying, storing temperature, shipping instructions, and providing other relevant information related to the material and / or the effective handling and delivery of the material. In one example, temperature-controlled packaging 900 includes a shell or body 902 formed of a material with a desired level of structural rigidity. In one example, the body may be formed of a material that may or may not be disposable, for example, to accommodate a single-use application of temperature-controlled packaging 900. In one example, body 902 may be formed of a foam material, such as rigid foam that may also have desired insulating properties. In examples where temperature-controlled packaging 900 is disposable after use, the material used to form body 902 may be biodegradable, such as biodegradable foam. In one example, the temperature-controlled packaging body 902 has a closed configuration, for example, having closed sides 904 and a closed bottom 906, and an opening 908 at the top for providing access to a temperature-controlled chamber 912. In one example, the temperature-controlled packaging 900 includes a top cover or lid 910 configured to fit over and cover the body opening 908. The top cover 910 may be made of the same or different material as the body 902. When the top cover 910 is positioned over the body opening 908, the top cover 910 operates with the body 902 to contain and protect temperature-sensitive material disposed therein for temperature control during storage and transport. In one example, the temperature-controlled packaging 900 may include a seal 912 for securing the top cover 910 to the body 902, and may be partially or completely positioned on the top cover 910 and extend over at least a portion of the body 902, for example, along the opposing closed sides 904.In one example, seal 912 prevents moisture penetration and may be a tamper-evident seal, which becomes torn or otherwise proves removal of cap 910 from body 902. In one example, seal 912 may also serve as a label providing information of the aforementioned form. In one example, temperature-controlled packaging 900 may be small and lightweight for delivery of pharmaceuticals, vaccines, and any other compact temperature-sensitive materials via means of transport (such as by using drones or other remotely controlled delivery vehicles or equipment). In this type of use, temperature-controlled packaging 900 may advantageously be disposable, recyclable, lightweight, and low-cost. In one example, temperature-controlled packaging body 902 and cap 910 may be made of biodegradable foam, a rigid plastic inner and outer shell with down or fiber filling, polystyrene foam, or any other lightweight construction / component providing an effective level of external protection and thermal insulation. In one example, temperature-controlled packaging 900 may be constructed and sized to meet the requirements of a particular end-use application. In an example, such as temperature-controlled packaging 900 used for the thermal storage and transport of drugs or vaccines, the body 902 may be configured to have a generally square shape with side surfaces, a top surface, and a bottom surface of the same size. Figure 9A In the example illustrated in the figure, body 902 may have a top surface, side surface, and bottom surface with similarly designed dimensions of about 5 to 10 cm. Although this example of construction and dimensions of temperature-controlled packaging 900 has been provided for reference purposes, it should be understood that temperature-controlled packaging may be constructed and / or sized differently from those illustrated and described, and this is intended to be within the scope of temperature-controlled packaging as disclosed herein.

[0084] Figure 9B The diagram shows Figure 9A A side view of a temperature-controlled package 900, comprising a body 902, a removable top cover or lid 910 disposed on an opening in the body 902, and a seal and / or label 912 applied to the top surface of the lid 910 and to the opposite side of the body 902. In one example, the temperature-controlled package 900 may be sized to fit a specific end-use application. For purposes of illustration and reference, Figure 9A The example temperature-controlled packaging shown in the illustration may have a side length of about 5 to 15 cm, but it should be understood that temperature-controlled packaging may be designed in different sizes and shapes, and all such different sizes and / or shapes are intended to be within the range of temperature-controlled packaging disclosed herein.

[0085] Figure 10A The diagram illustrates the process. Figure 9AThe image is a cross-sectional view of the temperature-controlled package 1000 disclosed herein, taken from an orthogonal section of the front view. The temperature-controlled package 1000 includes a body 1002 and a removable top cover or lid 1010 disposed on an opening in the body 1002. One or more heat dissipation devices 1020 may be disposed in the interior region of the body 1002, configured to distribute heat power to a temperature-controlled chamber 1021 disposed within the temperature-controlled package 1000. In one example, the heat dissipation device 1020 may be in good thermal contact with a wall surface or formed wall surface of the temperature-controlled chamber 1021 and may be configured to have a surface area larger than that of a heat transfer element used to provide heat energy, thereby ensuring a desired degree of temperature control of the temperature-controlled chamber 1021, thus providing a substantially uniformly controlled temperature-controlled chamber environment. The temperature-controlled package 1000 disclosed herein is characterized in that the device or system for generating thermal power to provide temperature control to the temperature-controlled chamber 1021 is located outside the temperature-controlled package 1000 and is not itself part of the temperature-controlled package 1000. Thus, in one example, the temperature-controlled package 1000 is configured to receive one or more heat transfer elements (not shown) configured to facilitate the transfer of thermal power from an external heat power generating device or system to an internal region of the temperature-controlled package 1000, thereby providing the desired temperature control to the temperature-controlled chamber 1021. In one example, the heat transfer element may be removably inserted into the temperature-controlled package 1000 to enable temperature control of the temperature-controlled chamber 1021 when it is installed therein, and to enable removal and portability of the temperature-controlled package 1000, for example, once the temperature-controlled package 1000 has been transported to a desired location (e.g., for use of temperature-sensitive materials or contents stored therein). In one example, the temperature-controlled package 1000 may be configured to include one or more openings or slots 1022 extending through a top cover or lid 1010 and configured to provide passage for receiving one or more external heat transfer elements (not shown) for access to the temperature-controlled package 1000 and for thermal contact with one or more heat dissipation devices 1020 disposed therein. In one example, the temperature-controlled package 1000 may be configured to include two openings or slots 1022 disposed through the top cover or lid 1010, such as... Figure 10A As illustrated in the figure. In one example, the opening or slot 1022 may include a distal end configured to ensure desired ease of registration and engagement with a corresponding external heat transfer element upon entry into the temperature-controlled package 1000.

[0086] Figure 10B The diagram illustrates the settings as follows: Figure 10AAn example heat dispersing device 1020 in a temperature-controlled package 1000 is illustrated in the figure. In one example, the heat dispersing device 1020 may be configured as an integral monolithic construction including an intermediate wall segment 1030 and two side wall segments 1032 and 1034 extending from opposite sides of the intermediate wall segment 1030. The heat dispersing device 1020 is configured in such a way as to provide a desired dispersion or distribution of heat power received from an external heat power source to a temperature-controlled chamber 1021. By being configured with three wall segments, the heat dispersing device 1020 is able to cover three corresponding wall surfaces of the temperature-controlled chamber 1021, thereby providing an enhanced degree of heat power transfer to the temperature-controlled chamber 1021. In one example, the temperature-controlled package 1000 may include Figure 10B Two of the heat dissipation devices 1020 are oriented facing each other. (See reference...) Figure 10A Example temperature-controlled packaging 1000 is constructed to include Figure 10B Two of the heat dispersing devices 1020 are shown in the figure. The heat dispersing devices 1020 are positioned opposite each other, with each intermediate wall segment 1030 extending outward toward the opposing portion of the body 1002, and side wall segments 1032 and 1034 of each heat dispersing device extending toward each other to surround a corresponding wall surface of the temperature-controlled chamber 1021 (where one side wall segment of each heat dispersing device 1020 is not shown in the cross-sectional view). In one example, the heat dispersing device 1020 includes a top wall segment 1036 that extends outward from the intermediate wall segment 1030 and is configured to have an inwardly deflected lip 1038. (Revisit) Figure 10A The inwardly deflected lip 1038 is configured to facilitate registration and engagement of the external heat transfer element, which passes downward through the slot 1022 in the top cover or lid 1010, to continue downward, thereby achieving good thermal contact with the intermediate wall section 1030 of the heat dispersing device 1020. In one example, the heat dispersing device 1020 is formed of a conductive material such as metal, and for lightweight and / or disposable temperature-controlled packaging applications, the heat dispersing device 1020 may be formed of a lightweight metal such as aluminum. In a particular example, the heat dispersing device 1020 may be formed of aluminum having a thickness from about 0.1 to 0.5 mm. As another example, the heat dispersing device 1020 may be a part or surface of a body 1002 with good thermal conductivity, such as an inner skin formed of a body construction material or a second additive material with good thermal power distribution characteristics. Although a heat dispersing device 1020 with a specific configuration has been disclosed and illustrated, it should be understood that the heat dispersing device may be configured differently for use in temperature-controlled packaging as disclosed herein, and all such different configurations are intended to be within the scope of this specification.

[0087] Figure 11An example modular temperature-controlled transport system 1100 is illustrated, configured to include a temperature control device 1102 (e.g., a module) that is separate from a heat storage device or package 1104 (e.g., another module) and configured to be removably combined with the heat storage device or package 1104. In one example, the temperature-controlled transport system 1100 may be configured to transport a temperature-controlled package 1104 (such as those described above and...) Figure 9A , Figure 9B , Figure 10A and Figure 10B The temperature-controlled package (illustrated in the diagram) provides a transportable temperature controller and temperature control functionality. In one example, the modular temperature control device 1102 has an external support or protective structure 1106 configured to provide mounting or attachment support for multiple different components. In one example, structure 1106 is configured to accommodate the mounting or attachment of one or more heat pumps 1108, one or more heat transfer elements 1110, one or more heat dissipation devices 1109, mounting device 1112, and electrical connection 1114. In one example, the heat dissipation device 1109 is in good thermal contact with the temperature control side / surface of one or more heat pumps 1108, and the heat transfer element 1110 is in good thermal contact with the waste heat power discharge side / surface of one or more heat pumps 1108. In one example, the structural mounting device 1112 may be configured to facilitate mounting or attachment of the structure to a portion of an external object, such as a vehicle, or a mounting fixture. As illustrated, structure 1106 is configured to house the temperature control device 1102 and associated components for transferring heat power to a separate temperature-controlled package 1104. In one example, structure 1106 is configured to have a first structural member 1116 to which the aforementioned heat power generating and transferring elements are attached or mounted. In one example, structure 1106 is configured to include a pair of second structural members 1118 extending vertically from the first structural member 1116. In one example, the second structural members 1118 are spaced apart to form a docking space or port 1120 therebetween for placing a temperature-controlled package 1104 therein. In one example, the second structural members 1118 may be sized to extend a length or distance from the first structural member 1118 such that, when the temperature-controlled package 1104 is positioned within the docking port 1120 to receive heat power, this length or distance is sufficient to cover at least a portion (if not most or all) of the temperature-controlled package 1104. In one example, a heat dissipation device 1109 extends downward from the first structural member 1116 between the second structural members 1118.

[0088] In one example, temperature-controlled package 1104 is as described above and Figure 9A , Figure 9B and Figure 10AThe packaging illustrated in the figure is identical, including a top cover or lid 1140 disposed on an opening in the body 1122. The top cover or lid 1140 includes one or more slots 1124 extending through the opening in the top cover 1140 into an internal region of the body 1122, reaching one or more heat dissipation devices 1126, which are in good thermal contact with an inner chamber at least partially (if not completely) surrounded by the one or more heat dissipation devices 1126. In one example, the temperature-controlled packaging 1104 may include one or more thermal energy storage systems 1128 of the type previously described, which may be placed adjacent to and in good thermal contact with the heat dissipation device 1126, for example, against one or more wall sections of the heat dissipation device 1126. The one or more thermal energy storage systems 1128 may be maintained at full thermal capacity through good thermal contact with the heat dissipation device 1126. The thermal energy stored in the thermal energy storage system 1128 can prolong temperature control for a period of time after the temperature-controlled package 1104 is disconnected from the heat dissipation device 1109. The temperature-controlled package 1104 is positioned to receive thermal power from the temperature-controlled device 1102 by moving it upwards 1129 toward the structure 1102 between the second structural members 1118 to enter the docking port 1120. The second structural members 1118 may have ends 1130 configured with tapered surfaces that guide inwards toward each other to aid in the engagement and registration of the temperature-controlled package 1104 as it moves toward and enters the docking port 1120. As the temperature-controlled package 1104 moves upwards into the docking port 1120, the heat dissipation device 1109 engages and aligns with a corresponding slot 1124 in the top cover or lid 1140. The upward movement of the temperature-controlled package 1104 within the docking port 1120, or the relative movement of the temperature-controlled package 1104 into the docking port 1120, continues until the top surface 1132 of the temperature-controlled package top cover 1140 contacts the bottom surface 1134 of the first structural member 1116. This provides a physical indication that the temperature-controlled package 1104 is fully positioned within the docking port 1120, allowing the heat dissipation device 1109 to be positioned at a desired depth within the body's internal region to provide heat power transfer to the heat dissipation device 1126, thereby maintaining the inner chamber at a desired controlled temperature. In the event of power loss, system failure, or when the temperature-controlled package 1104 is removed from the docking port 1120 and separated from the temperature control device 1102 (e.g., separated from the heat power generated by the heat pump 1108) for a period of time, an optional thermal energy storage system 1128 can provide thermal control and a degree of temperature stability to the temperature-controlled chamber.Due to the modular design of the temperature control device 1102 (e.g., heat pump 1108, heat dissipation device 1109, and other temperature control components) separate from the temperature-controlled packaging 1104, parts of the system not associated with heat generation (i.e., the temperature-controlled packaging 1104, which can thus be transported independently) can be very inexpensive, extremely lightweight, biodegradable, and disposable. In one example, the structure 1106 of the temperature-controlled transport system 1100 may be attached to a frame member (not shown) that is in good thermal contact with the portion capable of discharging heat power from the heat pump 1108 and the temperature control system (not shown) for directing heat power to the heat pump 1108. As an example, the frame member may be part of a vehicle such as a drone, a chamber in a storage facility, a temperature-controlled storage box, a delivery van storage rack, or any other object having means for supplying electrical power and for storing packages to be distributed. In one example, electrical power may be supplied to the heat pump 1108 via an electrical conductor 1114. In one example, the power source for providing such electrical power may be a battery, supercapacitor, generator, landline, or any other suitable portable or stationary power source (not shown). In one embodiment where the temperature-controlled transport system 1100 is configured for use with a vehicle such as a delivery drone, the electrical power to the heat pump may be provided by the power source of such a vehicle, for example, the delivery drone (not shown). In one example, the temperature-controlled package 1104 may be orientation-independent. Orientation independence means that the temperature-controlled transport system 1100 can be inverted, placed on its side, or operated in any other orientation.

[0089] Figure 12 The illustration depicts an example modular temperature-controlled transport system 1200 including a temperature control component or system 1202 (e.g., a first module containing a heat pump to provide thermal temperature control), which is separate from and configured to be removably combined with a temperature-controlled package 1204 (e.g., a second module containing material to be temperature-controlled). In one example, the modular temperature-controlled transport system 1200 may be configured to transport a temperature-controlled package 1204 (such as those described above and...) Figure 9A , Figure 9B , Figure 10A , Figure 10B and Figure 11The temperature-controlled packaging illustrated in the figure provides a transportable temperature controller and temperature control functionality. In one example, the modular temperature-controlled transport system 1200 has an external support or protective structure 1201 configured to provide mounting or attachment support to a package 1204, which may have many different shapes, lengths, and temperature control settings. In one example, structure 1201 is configured to accommodate the mounting or attachment of one or more heat pumps 1206, one or more heat dissipation devices 1208, one or more heat transfer elements 1210, mounting device 1212, and electrical connection 1214. In one example, heat transfer element 1208 is in good thermal contact with the temperature control side / surface of one or more heat pumps 1206, and heat transfer element 1210 is in good thermal contact with the waste heat discharge side / surface of one or more heat pumps 1206. In one example, structural mounting device 1212 may be configured to facilitate the mounting or attachment of the structure to a portion of an external object, such as a frame member of a vehicle, or to a mounting fastener. As illustrated, structure 1202 is configured to transfer thermal power to a separate temperature-controlled package 1204. In one example, structure 1202 is configured to have a first structural member 1201 to which the aforementioned thermal power generating and transferring elements are attached or mounted. In one example, structure 1201 is configured to include a pair of second structural members 1216 extending generally vertically downward from the first structural member 1201. In one example, the second structural members 1216 are spaced apart, forming a mating space or port 1220 therebetween for placing the temperature-controlled package 1204 therein. In one example, the second structural members 1216 may be sized to extend a length or distance from the first structural member 1201 such that, when the temperature-controlled package 1204 is positioned within the mating port 1220 to receive thermal power, this length or distance is sufficient to cover at least a portion (if not most or all) of the temperature-controlled package 1204. In one example, the heat dispersing device 1222 is a continuation of the heat transfer element 1208 and extends downward from the heat transfer element 1208 of the structural member 1201.

[0090] In one example, temperature-controlled package 1204 is similar to the description above and Figure 10A , Figure 10B and Figure 11The package illustrated in Figure A includes a top cover or lid 1230 disposed on an opening in the body 1232. The top cover or lid 1230 includes one or more slots 1231 extending through the opening in the top cover 1230 into an internal region of the body 1232, reaching one or more heat dissipation devices 1234, which are in good thermal contact with a temperature-controlled chamber 1236 at least partially (if not completely) surrounded by the one or more heat dissipation devices 1234. In one example, the temperature-controlled package 1204 may include one or more thermal energy storage systems 1238 of the type previously described, which may be placed adjacent to and in good thermal contact with the heat dissipation devices 1234, for example, against one or more wall segments of the heat dissipation device 1236. When mated in structure 1202 and structure 1202 is controlling the temperature of the heat dissipation device 1234, the one or more thermal energy storage systems 1238 may be maintained at full thermal energy storage capacity. The temperature-controlled package 1204 is positioned to receive heat power from the temperature-controlled device 1202 by moving it upwards in the direction 1240 toward the structure 1202 between the second structural members 1216. As the temperature-controlled package 1204 moves upwards into the docking port 1220, the heat dissipation device 1222 engages and aligns with the outwardly folded ends of the heat dissipation devices 1231 and 1234. The upward movement of the temperature-controlled package 1204 within the docking port 1220, or the relative movement of the temperature-controlled package 1204 inwards into the docking port 1220, continues until the folded extension 1233 of the heat dissipation device 1231 of the temperature-controlled package 1204 forms good thermal contact with the heat dissipation device 1222. In the event of power loss, system failure, or when the temperature-controlled package 1204 is removed from docking port 1220 (e.g., separated from the heat power generated by heat pump 1206) for a period of time, the optional thermal energy storage system 1238 can provide thermal control and a degree of temperature stability to the temperature-controlled chamber. Due to the modular design of the temperature control devices 1202 (e.g., heat pump 1206, heat transfer element 1208, and heat dissipation device 1222, and other temperature control components) separate from the temperature-controlled package 1204, the portion of the system not associated with heat generation (i.e., the temperature-controlled package 1204, which can thus be transported separately) can be very inexpensive, extremely lightweight, biodegradable, and disposable. As an example, the frame member can be part of a vehicle such as a drone, a chamber in a storage facility, a temperature-controlled storage box, a delivery van storage rack, or any other object with means for supplying electrical power and for storing packages to be distributed. In one example, electrical power can be supplied to the heat pump 1206 via electrical conductor 1214.In one example, the power source for providing such electrical power may be a battery, supercapacitor, generator, landline, or any other suitable portable or stationary power source (not shown). In one embodiment where the temperature control system is configured for use with a vehicle such as a delivery drone, the electrical power to the heat pump may be provided by a power source (not shown) of such a vehicle, for example, the delivery drone. In one example, the temperature-controlled packaging may be orientation-independent. Orientation-independent means that the temperature-controlled transport system 1200 can be inverted, placed on its side, or operated in any other orientation.

[0091] Figure 13A The figure shows a cross-sectional view of a modular temperature-controlled transport system 1300, which includes components similar to those described above. Figure 10A The temperature-controlled package 1302 is illustrated in the figure. The temperature-controlled package 1302 includes a closed body 1304 having a top cover or lid 1306 disposed on a body opening, and a temperature-controlled chamber 1307 located in an internal region of the body 1304 accessible through the body opening. The temperature-controlled package 1302 includes a heat dissipation device 1308 disposed in the internal region of the body and configured to dissipate or distribute heat power into the temperature-controlled chamber 1307 by providing a desired controlled temperature. In one example, the top cover or lid 1306 is configured to include a slot 1310 extending through and from its placement into the internal region of the body. Figure 10A Unlike the example temperature-controlled package 1000 illustrated in the figure, in this example, a slot 1310 is located at or near the center of the top cover or lid 1306 and is configured to receive a removable input of a heat transfer element 1312 therein. The slot 1310 is configured to guide the heat transfer element 1312 downward into an internal region for good thermal contact with a heat dissipation device 1308. In one example, the temperature-controlled chamber 1307 is divided into two sections, and the heat transfer element 1312 is configured to transfer heat power to the heat dissipation device 1308, which is configured to disperse or distribute the received heat power to the two temperature-controlled chamber sections, thereby providing a substantially uniform controlled temperature in both temperature-controlled chamber sections and to the temperature-sensitive material or contents (not shown) disposed therein. If desired, the temperature-controlled package 1302 can optionally include a slot 1314 disposed through the top cover or lid 1306 and as described above. Figure 11 The configuration shown in Figure A allows the temperature-controlled package 1302 to be flexibly integrated with thermal energy storage systems of different configurations (e.g., those with...). Figure 13A The system shown in the figure has a single heat transfer element 1312, or has such a system. Figure 11 and Figure 12The system (shown in the figure) uses two heat dissipation devices 1209 together. The temperature-controlled transport system 1300 includes a temperature control system 1316, which is separate from the temperature-controlled package 1302, and includes one or more heat pumps 1318, wherein a heat transfer element 1312 is in good thermal contact with the control heat power side / surface of the heat pump 1318. A heat transfer element 1320 is in good thermal contact with the waste heat power side surface of the heat pump 1318 and is in contact with an external radiator 1322. In one example, the temperature-controlled transport system 1300 is configured similarly to those described above. Figure 12 As illustrated, the temperature control system 1316 may be attached to or otherwise connected to the frame or other support structure (not shown) of the object, and wherein electrical power is supplied to the heat pump 1318 via a suitable portable or stationary power source connected by an electrical connector. This power delivery may be controlled by an electrical controller configured to provide electrical power calculated to maintain the temperature-controlled chamber 1307 at a desired controlled temperature. Additionally, the temperature-controlled package 1302 is configured to be removably attached to and detached from the temperature control system 1316, thereby facilitating the transport or delivery of the temperature-controlled package 1302 for use of its temperature-sensitive materials or contents.

[0092] Figure 13B The diagram shows... Figure 13A The example heat dispersing device 1308 described and illustrated in the temperature-controlled package 1302 is shown in the figure. Advantageously, one or more heat dispersing devices 1308 can be made of low-cost, low-weight, high-thermal-conductivity materials, such as those described above for... Figure 10B The materials described in the heat dispersion device 1020 shown in the figure. Advantageously, Figure 13A The heat dissipation device 1308 and the temperature-controlled chamber 1307 are preferably designed such that the temperature within the temperature-controlled chamber 1307 is uniform, and the thermal power required to maintain the desired temperature is minimized for the shape factor of the material whose temperature is to be controlled. In one example, similar to the above description and in... Figure 10BThe heat dissipation device illustrated in the figure, heat dissipation device 1308, can be configured with an integrated, single-piece construction including an intermediate wall section 1330, two side wall sections 1332 and 1334 extending from opposite sides of the intermediate wall section 1330, and rear wall sections 1336 and 1338 extending from the respective side wall sections 1332 and 1334. Heat dissipation device 1308 is constructed in such a way as to provide a desired dispersion or distribution of heat power received from an external heat power source to a temperature-controlled chamber 1307. By being configured with five wall sections, heat dissipation device 1308 can cover, or alternatively form, five wall surfaces of the temperature-controlled chamber 1307, thereby providing an enhanced degree of heat power transfer to the temperature-controlled chamber 1307. In one example, Figure 13A Temperature-controlled packaging 1302 may include Figure 13B Two of the heat dissipation devices 1308 are oriented facing each other. (See reference...) Figure 13A Example temperature-controlled package 1302 is constructed to include Figure 13B Two of the heat dissipation devices 1308 are shown in the diagram. The heat dissipation devices 1308 are positioned opposite each other, with each intermediate wall segment 1330 facing outwards toward the opposing portion of the body 1302, and the rear wall segments 1336 and 1338 of each heat dissipation device 1308 positioned adjacent to each other, thereby forming two temperature-controlled chamber compartments, wherein the rear wall segments 1336 and 1338 of each heat dissipation device 1308 are positioned relative to... Figure 13A The heat transfer element 1312 is in good thermal contact. Alternatively, the heat dispersing device 1308 can be configured (not shown) to be positioned within a temperature-controlled package 1302, wherein the intermediate wall segment 1330 of each of the two heat dispersing devices 1308 is in direct contact with the heat transfer element 1312, with the rear wall segments 1336 and 1338 facing outwards toward the opposing portion of the body 1302. In one example, the heat dispersing device 1308 includes a top wall segment 1340 extending outwards from the intermediate wall segment 1330 and configured to have an inwardly deflected lip 1342. The inwardly deflected lip 1342 is configured to facilitate registration and engagement with an external heat transfer element passing downwards through a slot 1310 in the top cover or lid 1306, to facilitate contact with similar... Figure 12 It is used in conjunction with the heat transfer element 1312 as shown in the figure. Although a heat dispersing device 1308 with a particular configuration has been disclosed and illustrated, it should be understood that the heat dispersing device may be configured differently for use in temperature-controlled packaging as disclosed herein, and all such different configurations are intended to be within the scope of this specification.

[0093] Figure 14The illustration depicts a temperature-controlled transport system 1400 configured to accommodate multiple individual and removable temperature-controlled packages 1402. In one example, the temperature-controlled transport system 1400 includes a housing structure 1404 comprising a set of storage compartments or drawers 1406 that can be arranged in rows and columns. Each of the storage compartments 1406 is configured to accommodate or contain a temperature-controlled package 1402. In one example, the temperature-controlled package 1402 may be used in conjunction with the above-described and Figure 9A , Figure 9B , Figure 10A , Figure 10B , Figure 11 , Figure 12 , Figure 13A and Figure 13B The same or similar to those shown in the diagram. Each temperature-controlled package 1402 may be provided in a thermal connection port or socket 1408 of the storage compartment 1406, for the purpose of connecting the temperature-controlled package 1402 to a heat power generation and transfer system for temperature control, storage, and transport of temperature-sensitive materials or contents within the temperature-controlled chamber of the temperature-controlled package 1402. In one example, the connection port 1408 includes thermal connections to a heat pump 1410 and a heat transfer element 1412, such as... Figure 11 , Figure 12 and Figure 13AThe electronic controllers, power supply units, and heat pumps may be located at the center of the housing structure 1404 and within or connected to the housing structure 1404, or may be distributed among the storage compartments 1406. In one example, the temperature-controlled transport system 1400 has an electrical connector 1414 to provide electrical power from an external power source to the housing structure 1404 and provides thermal and / or electrical power distribution, controllers, monitoring systems, I / O systems, displays, etc., via one or more electronic controllers 1416, as is well known to designers and users of traceable environmental control systems. The electronic controllers 1416 may also provide electrical and / or thermal power to each temperature-controlled package 1402. In one example, the temperature-controlled transport system 1400 may be designed with comprehensive I / O capabilities. Each storage compartment 1406 may be temperature-controlled independently, sections of storage compartment 1406 may be temperature-controlled independently, or groups of storage compartments 1406 may be set to a specified temperature. In one example, thermal insulation 1418 and spacing may be provided between individual storage compartments 1406, and may be designed and / or sized to achieve an appropriate degree of thermal isolation between adjacent storage compartments 1406, depending on the desired level of temperature control. In one example embodiment, storage compartments 1406 may be provided and surrounded by thermal insulation 1418 adapted to maintain each temperature-controlled package 1402 at a temperature dependent on the specific temperature-sensitive material or contents disposed in each package 1402. In one example, temperature-controlled transport system 1400 may be designed and / or configured to have the ability to maintain the temperature of each individual storage compartment 1406 at a setpoint above or below ambient temperature. Temperature-controlled transport system 1400 including such a distributed temperature control system provides more precise temperature control with higher energy efficiency over a wider temperature range. In one example, each temperature-controlled package 1402 can be removed from the temperature-controlled transport system 1400 and the associated thermal control system used to transport the temperature-controlled package 1402, for example, to the next stage / journey of the package's journey connected to another thermal control system for temperature control during that transport stage. Transport may include vehicles such as drones, airplanes, cars, trucks, vans, bicycles, or any other form of delivery to its next destination. In one example, each temperature-controlled package 1402 may include its own means of tracking or traceability, such as via barcodes, enabling the thermal control system used for temperature control during that stage of transport to identify the temperature-controlled package 1402 and provide information such as package temperature distribution, temperature set point, package destination, package contents, tracking information, humidity, and any other relevant information useful for the package's journey.

[0094] Figure 15AThis is a schematic diagram 1500 of a combination of a heat pump, a heat transfer component (which may be a heat transfer element, a heat dissipation device, or a heat pipe), and a thermal energy storage system (or a thermal energy storage medium), wherein the heat pump and the thermal energy storage system are thermally connected in a series-parallel relationship. Specific combinations of thermally connected heat pumps, heat transfer components, and thermal energy storage systems are advantageous and depend on the function and environment in which the temperature-controlled chamber is designed to operate. The diagram shows some, but not all, representative combinations of possible structures. Figure 15A and Figure 15B Figure 1 to Figure 7 and Figure 9 to Figure 14 Combinations and configurations of heat pumps, heat transfer components, and thermal energy storage systems, not shown herein, are intended to be part of temperature-controlled transport systems and / or devices as disclosed herein. For example, configurations involving multiple heat pumps and / or heat transfer components and / or thermal energy storage systems are not shown but are intended to be part of temperature-controlled transport systems and / or devices as disclosed herein.

[0095] Reference Figure 15A Schematic diagram 1500 depicts a heat pump 1502 thermally connected to a thermal energy storage system 1506. The waste heat discharge side 1504 of the heat pump 1502 is connected to the thermal energy storage system 1506 via a heat transfer member 1508. The temperature control side 1510 of the heat pump 1502 is connected to the heat transfer member 1512 of the heat pump 1518, the thermal energy storage system 1514, and the waste heat discharge side 1516. Similarly, the temperature control side 1520 of the heat pump 1518 is connected to the thermal energy storage system 1522 via a heat transfer member 1524. The heat transfer members 1508, 1512, and 1524 form good thermal contact with the sides / surfaces of the heat pump and thermal energy storage system to which they are connected. Configuration 1526 is applicable to the above-described and in... Figure 1B , Figure 2B , Figure 5 and Figure 6 The illustration shows an example design for a temperature-controlled transport system. Construction 1528 is applicable to the above-described and... Figure 3A , Figure 3B and Figure 7 The illustration shows an example design of a temperature-controlled transport system. Construction 1530 is applicable to the above-described and... Figure 11 and Figure 12 The illustration shows an example design of a temperature-controlled transportation system.

[0096] Figure 15B A similar schematic diagram 1550 is shown, illustrating a combination of a heat pump, heat transfer components, and a thermally connected thermal energy storage system (or thermal energy storage medium). This schematic diagram 1550 represents a second set of possible structures. Examples may be shown in Figures 1 to 1550. Figure 7 and Figure 9 to Figure 14The specific constructions of one or more of the temperature-controlled transport systems and / or equipment illustrated in the diagram are identified therein. In one example, Figure 15B The diagram shows a series connection between the heat pump and the thermal energy storage system, which is consistent with... Figure 15A The series-parallel connection is reversed in the diagram. Schematic diagram 1550 depicts a heat pump 1552 connected to a thermal energy storage system 1554. The waste heat discharge side 1556 of the heat pump 1552 is connected to the thermal energy storage system 1554 via a heat transfer member 1558, and the temperature control side 1560 of the heat pump 1552 is connected to the thermal energy storage system 1562 via a heat transfer member 1564. The heat transfer member 1566 connects the waste heat discharge side 1568 of the heat pump 1570 to the thermal energy storage system 1562. The heat transfer member 1572 connects the temperature control side 1574 of the heat pump 1570 to the thermal energy storage system 1562.

[0097] In one example, construction 1576 is available as described above and Figure 2A , Figure 11 , Figure 12 , Figure 13A and Figure 14 The illustration shows an example design for a thermally controlled transport system. In one example, configuration 1578 is applicable to the above and in... Figure 4 The illustration shows an example design of a thermally controlled transport system.

[0098] For purposes of explanation and reference, Figure 15A and Figure 15B Limited example variations of the construction depicting the thermal connections between heat pumps, heat exchangers, heat transfer components, and thermal energy storage systems are described. However, the intention is that, within the scope of temperature-controlled transport systems as disclosed herein, various heat exchangers and thermal energy storage systems can be positioned such that they are thermally connected along the same heat transfer components. Figure 15A and Figure 15B In locations not explicitly shown in the text. As an example, Figure 7 The temperature-controlled transport system 700 illustrated in the diagram depicts a thermal energy storage system 726 connected to a heat pipe 718 at three locations: to the left, directly below, and to the right of the heat pump 714. Similarly, in Figure 15A In this structure, all horizontal portions of the heat transfer member 1512 are excellent heat conductors, so any thermal connection along the length of the heat transfer member 1512 creates an equivalent thermal path, and is therefore functionally equivalent to Figure 7 Description of the 718 heat pipe. Due to the existence of vertical sections of the 718 heat pipe that deviate from the heat transfer medium, it operates under conditions where it is a very good heat conductor. Figure 7The description of the temperature-controlled transport system 700 illustrated in the middle explains this unusual characteristic of the heat pipe so as not to confuse this situation with the general characteristics of heat transfer components.

[0099] Figure 15A and Figure 15B The locations of heat dissipation devices, heat collecting fins, and heat dissipation fins relative to the heat transfer components, heat pump, and thermal energy storage system are not explicitly shown. However, dashed lines 1580 and 1582 indicate typical locations of heat transfer components, which can be configured as heat dissipation devices, heat collecting fins, and / or heat dissipation fins. (Described above and shown in Figures 1 to...) Figure 7 and Figure 9 to Figure 14 The specific examples shown in the illustrations may indicate concrete locations, but these examples are sufficient to allow design engineers to use them. Figure 15A and Figure 15B The design principles shown herein are used to develop other related connections between functional parts as appropriate, wherein all such related connections are understood to be within the scope of temperature-controlled transport systems and heat generation and storage systems as disclosed herein.

[0100] Furthermore, as presented in this paper, it may be advantageous to develop a more comprehensive description than previously available of the processes and characteristics affecting the performance of TE devices in order to design more efficient and higher-capacity thermoelectric (TE) systems. As background, Figure 16 An example CTE couple 1600 is schematically illustrated, comprising a p-type element 1601 and an n-type element 1602, a cold-side electrode 1603, and a hot-side electrode 1604. When a voltage is applied, a power supply device 1608 connected to the cold-side electrode 1603 at positions 1606 and 1607 generates an electron flow 1609 in the indicated direction. Each element has a length x0 1615. When the TE system 1600 is in operation, at temperature T... H The hot side at 1612 and at temperature T C The cold side at 1613 generates a temperature distribution T(x)1616 in branches 1601 and 1602 under a temperature difference DT 1614, and extracts heat power Q at the cold side. C 1611 and heat Q discharged at the hot side H 1610.

[0101] The TE system 1600 is the basic model used in this paper to describe CTE and DTP TE systems.

[0102] To address performance-influencing factors beyond those present in the design and computational models used in traditional CTE TE system design, this paper presents newly developed comprehensive fundamental equations governing DTP TE system design. Solutions to these equations are used to develop designs for new DTP TE devices with improved performance. In the following discussion, the performance of the new DTP TE systems is compared to that of CTE designs taught in literature and commercial product application notes.

[0103] In some examples, this DTP thermoelectric system design is based on new material design considerations that are considered fundamentally different from those resulting from CTE material system designs.

[0104] The basis for improving the performance of thermoelectric equipment can be best understood by considering the fundamental one-dimensional transport equation that governs the performance of thermoelectric equipment:

[0105]

[0106] In Equation 1, x is the main direction of current flow (as opposed to other directions of current flow, such as diffusion), λ(x) is the thermal conductivity of the TE material that varies with position x, T(x) is the temperature in the TE element as a function of x, j(x) is the current density, S(x) is the Seebeck coefficient as a function of x, and ρ(x) is the resistance as a function of x. Figure 17 The schematic diagram illustrates the components including TE elements 1701 and 1702, and the hot-side T... H 1703, Cold Side T C Example DTP TE couple 1700 with electron flow 1704 and electron flow 1705. Position x 1706 is the distance from the cold side T. C The distance is 1704. In this example, for illustrative purposes, it is assumed that both the n-type TE element 1701 and the p-type element 1702 have equal lengths and constant widths and thicknesses. Here and throughout the rest of this analysis (unless otherwise stated), the characteristics vary only with x. For a non-limiting example construction of the DTP TE couple 1700, see International Patent Application No. PCT / US2020 / 016247, filed January 31, 2020, entitled “Thermoelectric Elements and Devices with Enhanced Maximum Temperature Differences Based on Spatially Varying Distributed Transport Properties,” the entire contents of which are incorporated herein by reference. In some examples, the DTP TE couple 1700 can be used in heat pump systems, as described in more detail elsewhere herein, for example, with reference to Figures 1 through 15.

[0107] In the CTE TE system, the same TE material is used throughout the entire length of each TE element. Therefore, the Thompson term in equation (1) The value becomes zero because the Seebeck coefficient S for the same material is constant and does not change with position x. Since almost all existing textbooks and supplier literature covering TE device design assume uniformity, the Thompson term will not appear in the initial equations in the statements deriving the TE equations. See, for example, Angrist, Direct Energy Conversion, 4th ed., Boston: Allyn and Bacon, Inc. (1982), the entire contents of which are incorporated herein by reference. The simpler expressions for COP, maximum DT, and temperature distribution obtained therefrom, and other derived expressions used herein, are referred to as the CTE solution.

[0108] In the DTP dominance equations presented in this paper, the Thompson term is retained, and the transport characteristics change in the dominant direction of current flow x according to the favorable design rules derived from the more comprehensive DTP formula. These newly proposed equations form the basis for a more complete and useful set of solutions to equation (1), and the solutions to these equations provide and enable designs that improve device performance.

[0109] If the terms in equation (1) are rearranged, then as the current flows, the Thompson term and the Joule heating term are seen to partially cancel each other out:

[0110]

[0111] The Thompson term is a linear function of the current density j, while the Joule heating term contains the square of the current density (j(x)). 2 ρ(x)), therefore it can be understood that at zero current density and at non-zero current density, these terms completely cancel each other out at every location x. At all other current densities, these terms will partially cancel each other out.

[0112] As provided in this document, Thompson term values ​​can be selected (limited by physical material constraints) to offset the Joule heating term and / or optimize COP and / or optimize any other desired operating metrics or combinations of desired operating metrics. Under the condition that ZT is constant throughout the TE element, where ZT refers to the thermoelectric quality factor (ZT = S... 2 / (λρ)), at the optimal TE efficiency, the best performance can be achieved in the DTP system, and the temperature distribution within the TE element is:

[0113]

[0114] Where T CIt is the cold end temperature, T H This is the hot-end temperature, x0 is the length of the TE component, and... And transmission characteristics. S(x), λ(x), and ρ(x) vary continuously with position along the length of the element in the following way:

[0115] in

[0116] in

[0117]

[0118] in

[0119] As presented herein, the temperature distribution presented in equation (3) can be used to design and achieve the optimal distribution within a TE element with a constant ZT. Furthermore, equations (4), (5), and (6) can be used in the design of thermoelectric elements, for example, to select appropriate material properties within the thermoelectric branch that change in the direction of current flow, providing the closest possible solution to these equations within constraints such as material system constraints and cost constraints in the real world, as described elsewhere in this document.

[0120] Figure 17 The illustrations schematically depict example (e.g., optimal) Seebeck distributions 1708 and 1710 as a function of distance from the cold end 1704. In some examples, thermal conductivity and resistivity may have similar distributional forms, i.e., they increase smoothly in magnitude towards the hot end 1703 in a non-linear manner.

[0121] Figure 18 It is as DT / T H Example of a function: a graph showing the variation of the Seebeck coefficient, thermal conductivity, and resistivity in a DTP TE element with respect to the direction of current flow. More specifically, Figure 18 A coordinate graph 1800 shows the ratio of the hot-to-cold-end transport characteristics derived from equations (4), (5), and (6). Figure 18 In the middle, horizontal axis 1803 represents the temperature difference (DT) between the hot and cold sides and the temperature of the hot side (T). H The ratio of DT / T HThe vertical axis 1802 represents the ratio of the hot side to the cold side for each of the three transport characteristics. The ratio 1804 for Seebeck coefficient and thermal conductivity is the same. The ratio 1803 for resistivity is lower. Ratios for several example values ​​of ZT in the range from ZT = 0.5 (curve 1805) to ZT = 5.0 (curve 1806) are presented. The horizontal line 1807 indicates the ratio at 2.0 and represents the ratio achievable for some example TE material systems. As an example, the horizontal line 307 intercepts the ZT curve 1805 at point 1809 with a resistivity ratio of 1803. Therefore, the maximum DT / T that achieves optimal DTP performance is obtained under the condition that the maximum achievable resistivity ratio is 2.0. H 1803 is approximately 0.07. Similarly, ZT = 0.5. 1805 intercepts the horizontal line 1808 at point 1810, and therefore, for an achievable resistivity ratio of 3.0, the maximum DT / T for optimal TE performance can be achieved at 1803. H 1803 is approximately 0.11. The achievable transmission ratio 1804 corresponding to points 1811 and 1812 leads to other limitations. To fully express the capabilities of DTP and achieve the assumed optimal performance, all three transmission characteristics must adhere to these relationships. Therefore, in a manufacturable (real-world) TE system, the transmission characteristics of the TE design should approximate the ideal DTP value as closely as possible, within the limits of production and material considerations, cost, and usage.

[0122] The importance of controlling transmission characteristics and thus generating DTP TE elements in TE couplers can be seen from the reference. Figure 19 To show, Figure 19 Examples include, for instance Figure 16 CTE 1600 and Figure 17The typical temperature distribution of the DTP TE element 1700 at several operating currents is shown in the temperature distribution coordinate graph 1900. The graph has a horizontal axis x / x0 1901 (position in the direction of current flow) and a vertical axis (TE element temperature 1902). In this example, the TE element cold junction temperature 1903 is 220 K, and the hot junction temperature 1904 is 300 K. A graph for ZT = 0.51905 is presented, where dashed curves 1908 and 1909 show the temperature distribution at zero current 1908 and the current producing the highest efficiency 1909. Similarly, curves 1910, 1911, 1912, 1913, and 1914 present example DTP TE element temperature distributions for currents ranging from zero (i.e., ε = 0) to twice the current producing the best efficiency (ε = 2ε0). The vertical line 1906 marks the midpoint along the length 1901 of the TE element. For example, point 1907 indicates that the temperature of the CTE TE element at its midpoint is 260K. The distribution at zero current is linear because the CTE characteristics do not change with position or temperature. As the current increases, Joule heating adds a parabolic component to the distribution. The distribution at the optimal COP (i.e., when i = i0) 1909 indicates the amount of temperature distribution distortion when a typical current flows through the TE element. For the DTP TE element, and the assumption that the transfer characteristics are independent of temperature (but dependent on position), the distribution at zero current 1910 is not linear because the thermal conductivity of the TE material varies along the element length in a programmed manner. At small values ​​of the current ε, the Thompson term dominates, and the temperature distribution 1911 becomes increasingly undistorted, and at the optimal operating current ε0, the temperature distribution 1912 becomes an ideal document according to equation (3) and slightly concave upwards. Under this condition, the Thompson term and the Joule heating term cancel each other out, making the distribution optimal. At the larger currents 1913 and 1914, the temperature distribution becomes concave downwards because Joule heating dominates.

[0123] Figure 20 This is a graph depicting the midpoint temperature of the TE element as a function of current. The horizontal axis 2001 represents the ratio of both CTE and DTP currents to their corresponding currents that produce peak efficiency (COP). The vertical axis 2002 is for... Figure 19 The temperature at the midpoint between the example CTE and DTP TE elements in the model, i.e. Figure 19 The temperature on line 1906. The dashed line temperature chart 2004 presents the midpoint temperature for the CTE TE element (at the same point as...). Figure 19(Under associated conditions). Similarly, the solid curve 2006 is a graph for DTP components. Points 2005 and 2008 are the temperatures 2004 and 2007 for example CTE 2003 and DTP 2007TE components at zero current, respectively. As the current 2001 increases, the CTE midpoint temperature 2004 increases due to Joule heating, while the DTP midpoint temperature 2006 decreases due to the advantage of the Thompson effect on Joule heating, reaching a minimum and optimal temperature distribution at a current 2001 value of 1.0 at 2009. As the current increases, the distortion of the DTP distribution 2006 relative to the ideal distribution becomes smaller. Compared to the CTE distribution 2004, the large distortion of the DTP distribution 2006 occurs at higher currents 2001, therefore the DTP TE component can operate efficiently at higher currents 2001. As a result, the cooling capacity can be higher with increasing input current. Furthermore, at any current, the CTE distribution 2005 does not reach the optimal midpoint temperature 2009 of the DTP. Therefore, the efficiency of the CTE TE element will be lower, and thus the DTP efficiency will be higher than that of the CTE system. Although Figure 19 and Figure 20 These are specific examples, but they more generally represent the relative characteristics of CTE and DTP systems, and illustrate that for an ideal CTE and DTP system, the DTP system will have a higher peak efficiency (COP) and a higher cooling capacity.

[0124] The fundamental transport equations for CTE and the new transport equations for DTP govern the efficiency and cooling capacity of the corresponding thermoelectric systems they describe. In CTE devices, the cooling capacity as a function of current is:

[0125]

[0126] The maximum cooling capacity it results in is:

[0127]

[0128] Maximum COP can be expressed as:

[0129]

[0130] Furthermore, COP as a function of current i can be expressed as:

[0131]

[0132] in:

[0133]

[0134] In a DTP system, the newly developed equation for cooling capacity as a function of current is:

[0135]

[0136] Note that for DTP, there is no theoretical maximum cooling capacity because the current ε is unbounded. However, in real-world feasible designs, there will be a practical maximum value, which is limited by the limits of Seebeck's range and other transfer characteristics available for high ZT, such as... Figure 18 As discussed in the discussion.

[0137] The newly developed DTP cooling system has a peak COP:

[0138]

[0139] COP as a function of current can be expressed as:

[0140]

[0141] in:

[0142]

[0143] Figure 21 The coordinate graph 2100 is presented, where the horizontal axis 2101 represents the ratio of both CTE and DTP currents to their corresponding peak efficiency currents (COP), and the vertical axis 2102 represents the ratio of currents such as CTE and DTP to their corresponding peak efficiency currents (COP). Figure 16 The cooling capacity Q of the example CTE 1600 and example DTPTE 1700 C The CTE cooling capacity is shown by curve 2103, and the DTP cooling capacity curve is shown by curve 2104. Results are shown for several ZT values. These curves represent TE systems operating near the maximum DT. CTE curve 2104 shows the cooling capacity 2102 of the CTE system as a function of current. Similarly, DTP curve 2105 shows the cooling capacity for the same DT and ZT values. Calculations show that the DTP 2105Q for operating current 2101 is... C The value range is always higher than the CTE 2104 value. Similarly, for ZT = 0.5 2107, the DTP 2109Q of the operating current 2101. C The value is always higher than the CTE 2108 value. In this specific design case, the CTE 2108 value is always less than zero, meaning that no cooling power Q is generated under this condition. C 2102. In contrast, the corresponding DTP 2109TE device generates a positive cooling power Q. C 2102. This result proves that the DTP system has higher performance.

[0144] Figure 22 Depicting something different from, for example Figure 16The graph shows the characteristics of the CTE system (CTE couple 1600) and the DTP system (DTP couple 1700). This graph represents a specific example of descriptive operating conditions. The horizontal axis 2201 represents the cooling capacity Q. C And the vertical axis 2202 is COP. The CTE operating range is represented by curve 2203, and the DTP operating curves are 2204 and 2205, representing the performance options for the DTP TE system. Curve 2206 for the CTE system generates positive Q. C COP of all currents and Q C A graph showing the relationship between them. It is evident that curve 2206 is a curve with a peak COP at point A1 2207 and a peak Q at point B1 2208. C The closed loop. The CTE device operates anywhere on curve 2206. Similarly, for the DTP TE system, loop curve 2209 has a peak COP at point A2 2210 and a peak Q at point B2 2211. C However, unlike CTE curve 2206, DTP systems can have transfer characteristics that vary with location (but only one set of such transfer characteristics produces the optimal COP), and therefore can produce other performance curves, such as loop curve 2212. In loop curve 2212, the peak COP point A3 is lower than the corresponding point A2 2210 for loop curve 2209, and the peak cooling capacity 2201 at point B3 2214 is greater than the peak Q for loop curve 2209. C (Point B2 2211). In summary, a wide range of loop curves are possible, each with a peak COP 2202 and a peak Q. C A compromise between 2201 and 2212. If maximum efficiency is the primary objective, the design of loop curve 2209 is preferred over loop curve 2212, and if cooling capacity is paramount, loop curve 2212 will be preferred. Therefore, within the property constraints of the TE material, the performance of the DTP system can be tailored to best meet the functional requirements of a specific cooling application. (The last sentence appears to be incomplete and possibly refers to a different topic.) C The ability to select design relationships between different devices is a significant feature of DTP design, which is new to the field of TE equipment design.

[0145] Figure 23 This paper presents calculations describing the relative performance of an example high-performance commercially available TE CTE coupler and an example DTP TE coupler designed with the same TE material (which optimizes COP through a DTP design). The example high-performance commercially available TE CTE coupler comprises different TE materials from each other, wherein the p-type branch comprises a single homogeneous TE material, and the n-type branch comprises a different single homogeneous material. The coordinate graph 2300 shows the horizontal axis cooling capacity Q. C2301 and vertical axis 2302 COP. Loop curve 2303 represents the calculated performance of one of the CTE material systems. Loop curve 2304 is a similar curve for the highest-performing material. For loop curve 2304, point A2305 represents the highest achievable value of COP 2302, and point B2308 represents the highest Q. C 2301. The loop curve 2306 illustrates the characteristics of an optimal DTP design operating under the same conditions using the best commercially available TE material. Loop curve 2306 has a peak COP at point C 2307 and a peak Q at point D 2309. C 2301. Comparing the peak COP 2302 from the CTE loop curve 2304 with the DTP loop curve 2306, the gain is plotted at point E 2310, and the peak Q... C The gain of 2301 is plotted at point F2311. Coordinate plot 2300 shows the difference in performance between DTP and CTE. As an example, for DTP system 2306, the maximum COP 2302 shown at point C2307 is approximately 0.060, while for CTE system 2304 at point A2305, the maximum COP 2302 is approximately 0.042. Therefore, the COP for DTP system 2306 is greater than the COP for CTE system 2305, as readily observed as the difference between the COP 2302 value at point A2305 and the DTP curve value at point E2310. Similarly, for DTP system 2306, the maximum Q is shown at point D2309. C 2301 is approximately 14.0, while the maximum Q of the CTE system 2304 at point B 2308 is... C 2301 is approximately 9.4. Therefore, the Q of the DTP system 2306 is... C The value of 2301 is greater than the value of 2305 in the CTE system, such as Q at point B 2305. C The difference between the 2301 value and the DTP curve value at point F 2311 is readily observable.

[0146] Figure 24 This describes the conditions for both the CTE 2405 system and the DTP 2406TE system at DT=30℃, 2403, and Q. C =40W, with a horizontal axis 2401 representing input power and a vertical axis 2402 representing TE mass. Coordinate graph 2400 is a specific example of the relative weight requirements of TE materials for two system designs, each operating at the same hot and cold side temperatures, each constructed from commercially available TE materials, and each producing the same Q. CHere, the relevant difference compared to DTP 2406 is CTE 2405. Curve 2407 represents the weight of the TE material required for the CTE system, and curve 2408 represents the weight for the corresponding DTP system. As an example, consider a design power input of 90 watts at point 2409, where the cooling output Q... C =40W 2404. CTE curve 2408 requires the amount of TE material indicated by point 2410, and similarly, point 2411 indicates the amount of DTP material required. Therefore, in this particular example, achieving the same performance with DTP material as with CTE material requires approximately 15% less TE material. For example, the reduction in material can result in requiring 15% less TE element of the same size and weight. Accordingly, in addition to the reduction in material usage, the DTP system provides a beneficial reduction in size and weight compared to the CTE system. Other operating conditions will also show the range of material usage for the DTP system, some showing small reductions and others showing much larger reductions.

[0147] The ability to reduce the mass of thermoelectric material used for a given thermal power output is a valuable property of DTP devices. For example, this reduction in mass is beneficial for conserving and expanding limited resources, such as the amount of tellurium contained in conventional bismuth telluride TE material systems and other TE material systems that contain other expensive, hard-to-obtain, or rare materials.

[0148] Figure 25 This is another example of a significant difference between CTE couples and DTP TE couples. Coordinate plot 2500 has a horizontal axis representing the hot-side temperature 2501 and a vertical axis representing the maximum temperature difference (Max DT) 2502. In this example, CTE material system A 2503 is a commercially available TE material that exhibits the highest Max DT for a material designed to operate with its hot side below room temperature. CTE material B 2505 exhibits the highest Max DT for a material designed to operate at a high hot-side temperature profile 2506. Using DTP design principles, material A / B 2507, designed from materials A 2503 and B 2505, yields the Max DT profile 2508. In coordinate plot 2500, the conditions are: each of the three system designs operates in the same environment, at the same hot-side temperature, consists of TE elements of the same height, and the TE elements have the same contact resistance at the termination. Coordinate plot 2500 shows that by using the same TE material in the optimal DTP construction, the Max DT for DTP profile 2508 is larger throughout the operating range. Therefore, by adopting DTP teaching, the same TE material can produce greater maximum DT performance under a wide range of operating conditions.

[0149] To illustrate some of the degrees of freedom in the design of DTP components Figure 26This is a schematic diagram of a TE coupler 2600, which includes a TE element with a varying cross-sectional area in the direction of current flow, and said element comprises different TE materials. The TE coupler 2600 has its own temperature T. H Hot-side electrodes 2601 and 2603 are located below electrode 2602. Electrode 2603 is depicted with a thickness different from that of electrode 2602. Cold-side electrode 2605 is located at temperature Tc 2606. n-type TE element 2607 includes n-type TE material segments 2608, 2609, and 2610. p-type TE element 2611 includes p-type TE material segments 2612, 2613, 2614, and 2615. Power source 2616 is connected to hot-side electrode 2601 via connection 2617 and to hot-side electrode 2603 via connection 2618. In operation, when power is applied to cause electrons 2619 to flow in the indicated direction, cold electrode 2605 absorbs thermal power Q. C 2620 discharges heat Q through hot-side electrodes 2601 and 2603. H 2621 and 2622. Advantageously, the three n-type TE materials 2608, 2609, and 2610 comprising the n-type TE element 2607 each have a Seebeck coefficient, thermal conductivity, and resistivity that gradually increase in magnitude toward the hot end 2602. Thus, although the TE material within each individual TE segment 2608, 2609, and 2610 has unchanging conventional TE material properties, the entire n-type TE element 2607 serves as a DTP TE element. A similar description applies to the p-type TE element 2611.

[0150] Simulations demonstrate that if the transport characteristics vary continuously, sufficient Thompson effect generated at the boundaries of the segment connections can produce a significant portion of the DTP effect. For further details, see the following references written by the inventors, the entire contents of which are incorporated herein by reference: Crane and Bell, “Maximum temperature difference in a single-stage thermoelectric device through distributed transport properties,” International Journal of Thermal Sciences 154:106404, pp. 1–9 (2020); and Bell, “Optimally distributed transport properties can produce highest performance thermoelectric systems,” Phys. Status Solidi A:1900562, pp. 1–7 (2019). As demonstrated, more segments can produce heat pumping performance closer to that of an element with continuously varying transport characteristics. For example, a TE element typically comprising five or more segments can have nearly identical performance to a TE element manufactured from the same TE material system but with continuously varying transport characteristics.

[0151] refer to Figure 25 Material system A / B is an example of a segmented DTP TE couple. In this embodiment, the DTP couple is designed using two segments (materials A and B) in each branch of the couple. Although the resulting maximum DT is greater than the maximum DT of material A or B alone, higher performance can be exhibited if several segments with characteristics between those of A and B are used in its design.

[0152] Figure 27 A DTP TE couple arranged in a stacked configuration is depicted. The stacked TE schematic 2700 has a P-type TE element 2701 including segments 2702 and 2703. The TE element 2701 has electrical and thermal contact with a hot-side electrode 2704 at temperature 2705, and electrical and thermal contact with an electrode 2706 at temperature 2707 on the cold side. Advantageously, the interface resistance between the thermal and electrical contacts is less than 2% of the TE element resistance. In some examples, the n-type TE element 2708 is a monolithic DTP TE element. The TE element 2708 has good electrical and thermal contact with a hot-side electrode 2709 at a hot-side temperature 2710, and good electrical and thermal contact with a cold-side electrode 2706 at a cold-side temperature 2707.

[0153] For illustrative purposes, and to demonstrate the range of design freedoms available for optimizing the DTP TE couple design, the TE DTP couple 2700 is depicted as having a complex design. The P-type TE element 1701 is shown as having a conical shape and mating with a cylindrical segment 2703. Further discussion of the effect of area variation in the direction of current flow on DTP performance can be found in the following reference written by the inventors, the entire contents of which are incorporated herein by reference: Crane and Bell, “Maximum temperature difference in a single-stage thermoelectric device through distributed transport properties,” International Journal of Thermal Sciences 154:106404, pp. 1–9 (2020). (As an example, cross-sectional area variation can be used to modify the relationship between thermal resistance and electrical resistance to better optimize DTP performance.) As described above, the N-type TE element 2708 has a DTP structure. At its cold end, it has a slot 2712 extending downward into the body of the N-type TE element 2708 to change the cross-sectional area at the cold end.

[0154] Advantageously, the cold electrode 2706 is made of a material with high electrical and thermal conductivity, such as copper or silver. The depicted hollow cold-side electrode 2706 can provide a temperature-controlled environment for samples, electronic circuits, laser systems, sensors, and any other items of suitable size requiring temperature control.

[0155] The stacked design 2700 has the same characteristics as... Figure 16 The thermocouples are designed with different mechanical and thermal loss characteristics. Advantageously, compressive loads are applied to the thermoelectrodes 2704 and 2709, causing the system to operate under compressive loads. Some TE materials, such as bismuth telluride, are physically weak and can fail under moderate tensile or shear loads, and therefore benefit from appropriate compressive loading. Furthermore, the stack design 2700 provides better control over parasitic losses, including those from thermal conduction and convection, resistance, and cold-side radiative heating.

[0156] Figure 28A TE cascade 2800 is depicted, comprising a first TE array 2801 having a hot side 2802 and a cold side 2803 in good thermal contact with a substrate 2804. A second TE array 2805 has a hot side 2806 in good thermal contact with a substrate 2804. The hot side 2807 of the TE array 2805 is in good contact with a substrate 2808. Similarly, a third TE array 2809 having a hot side 2810 is in good thermal contact with a substrate 2808. The cold side 2811 of the TE array 2809 is in good contact with a cold-side substrate 2812. TE arrays 2801, 2805, and 2809 are constituted by n-type and p-type TE couplers 2815 electrically connected in series or in series-parallel arrangement, wherein the hot sides 2802, 2806, and 2810 of the couplers are on the bottom side of each array, and the cold sides 2803, 2807, and 2811 are on the top side of each array. Therefore, cooling Q... C The electrical power (not shown) input to array 2809, plus 2813, is discharged from the hot side of array 2809 and absorbed by the cold side of array 2805. Similarly, the thermal power from the hot side of array 2809 plus the electrical power (not shown) input to array 2805 is discharged at the hot side of array 2805 and absorbed by the cold side of array 2801. This thermal power plus the electrical power (not shown) input to array 2801 is discharged to the hot side 2802.

[0157] TE Cascade 2800s are commercially available from several sources. Their primary purpose is to produce a DT exceeding the maximum DT of a single-stage CTE unit or exceeding the cooling capacity of a single-stage CTE unit at the required DT. Up to six arrays of Cascade 2800s are commercially available. Generally, each additional array provides a progressively smaller contribution to the DT. Importantly, due to the efficiency limitations of each CTE array, the COP is very low for several cascaded stages.

[0158] Because DTP TE systems can improve the efficiency and heat pumping capacity of TE systems, DTP TE cascade designs exhibit important performance characteristics not found in CTE cascades. Figure 29A performance comparison between CTE and DTP cascaded TE system designs is presented. Coordinate graph 2900 shows the TE cascade stage 2901 as the horizontal axis and the maximum DT 2902 as the vertical axis. CTE cascade system curve 2903 and DTP curve 2904 are graphs of the maximum DT achievable in commercially available CTE and DTP cascade designs using existing TE materials operating on the hot side at 300K. As an example, the vertical line 2905 (performance of a 3-stage CTE and DTP cascade) intersects the CTE curve 2903 at point 2906, corresponding to a maximum DT of approximately 122K. Line 2906 intersects the DTP TE curve 2904 at point 2907, corresponding to a maximum DT of approximately 156K. The 156K value is unattainable for commercially available CTE cascades with up to 6 stages. These design results demonstrate the increased COP and Q from DTP TE designs in cascade applications. C The potential compound benefits.

[0159] Figure 30 The input power Q of the DT 3001 on the horizontal axis and the input power Q on the vertical axis are depicted. IN The coordinate graph of 3002 is 3000. The solid line 3003 represents DTP, and the dashed line 3004 represents CTE characteristics. For a CTE module with a fixed TE quality and module physical dimensions, the dashed curve 3005 shows the electrical power input 3002 and the cooling power output Q that can produce 20W. C The relationship between the maximum DT3001 of 3006. Similarly, the solid line DTP curve 3007 shows the electrical power input 3002 and the cooling power output Q that can produce 20W for a DTP module with the same fixed TE quality. C The relationship between the maximum DT of 3006 and 3001. As an example, with a power input Q of 30W... IN Point 3008 on the CTE curve at 3002, at point 3005, will produce Q at the maximum DT of point 3001 at approximately 17K points. C =20W cooling power 3006. Similarly, point 3009 on the DTP curve 3007 has the same input power Q. IN =30W 3002, and will generate 20W of cooling power at a higher maximum DT 3001 of approximately 21K. Therefore, under the same input power and module size constraints, the DTP module can operate at approximately 23% larger DT 3001. Similarly, for Q C =10W3010, Q C =5W 3011 and Q C =1W 3012, DTP module Q at all power input levels INA larger maximum DT 3001 is provided under 3002. As another example, for 17K DT 3001 and Q... C =20W output 3006, the CTE module operating at point 3008 on curve 3005 will require 30W power input Q. IN A DTP module of the same size operating at point 3013 on curve 3007 would require approximately 22W of power input Q. IN 3002. Therefore, in this example, the power input Q used in operation is different from that of the CTE module. IN The amount of 3002 was reduced by approximately 27% for the DTP module.

[0160] The DTP module also boasts capabilities exceeding those of a CTE module of the same size in terms of temperature difference, input power, and output power Q. C Under these combined conditions, the DTP module can operate at point 3009 of DT 3001 at approximately 22K, under which the CTE module (curve 3005) cannot operate at any power level Q. IN Operating at 3002°C. Compared to CTE, these properties of DTP provide further evidence of the flexibility to design thermoelectric devices with less input power and thermoelectric material quality for each temperature difference and heat load.

[0161] Compared to CTE elements produced from a single material, the transport characteristics of segmented DTP TE elements, which vary along the direction of current flow, can be more advantageously manufactured using different processes or new processes for TE element fabrication. Some potentially useful manufacturing techniques and methods are described in this paper.

[0162] In segmented DTP components made of discrete segments, each segment may be metallized at both ends, and these segments are soldered together. One or more solders may be conventional solders used in electronics or other industries, or solders tailored to meet the performance requirements of a specific DTP TE system. For example, it may be advantageous to use solder and flux formulated to reduce interface heat and electrical losses at the ends of the TE element to less than 2% of the resistance of the TE element itself, so that the interface resistance is small compared to the resistance of the TE material portion of the element, and the performance is not degraded below an acceptable level. Additionally, it may be advantageous to use a solder system or TE material surface treatment such that the solder does not wick along the TE branch in the direction of current flow, and by controlling the wicking, short circuits caused by wetting on the element side are reduced to an acceptable level. Furthermore, solders with mechanical properties that provide stress reduction due to thermal expansion coefficient (CTE) mismatch at the interface between the segments and the ends of the TE element may be used.

[0163] The bonding of dissimilar materials (such as sections of organic TE material adjacent to sections of inorganic TE material) can benefit from solder bonding. Similarly, if the CTE mismatch is relatively large (which is possible in organic / inorganic TE material interfaces), the bonding of materials can benefit from bonding through low-rigidity porous metal interfaces or other conductive material interface systems such as conductive epoxy resins.

[0164] Alternatively, the DTP TE material segments can be made from partially consolidated material powder, which is layered to form DTP segments and spark-sintered for bonding and consolidation. As another alternative, the TE material can be co-extruded and manufactured into TE elements or systems using current production methods or methods developed for DTP TE device components. These processes can produce segmented elements with reduced or eliminated interfacial resistance. Alternatively, the TE segments can be bonded by compression bonding under pressure, time, and temperature without degrading the properties of the TE material. For some material systems, it may be advantageous to treat or otherwise prepare the surface by adding intermediary materials to improve bonding quality or by special surface treatments that improve joint characteristics, reduce interfacial losses, or increase mechanical strength and durability.

[0165] As an alternative, TE material can be manufactured using additive manufacturing (AM), screen printing, or other printing processes. These processes can be used to produce DTP TE segmented components with reduced or eliminated interface resistance. Furthermore, AM, screen printing, or printing processes can be used to construct DTP TE components with thin layers that are bonded together to form DTP components consisting of as few as two segments to as many as five segments. Using these methods, bonding can be performed without the use of any interface solders, adhesives, or other components that may increase undesirable interface resistance.

[0166] DTP TE elements with continuously varying characteristics can be produced by growing TE material from melt, similar to one of the methods used to manufacture CTE elements, but this method is adapted to provide suitable DTP characteristics by changing the melt composition in the direction of material growth.

[0167] Another approach to modifying the DTP properties within a TE element is selective doping, where ion implantation with varying density and depth is used to adjust the Seebeck coefficient, resistivity, and / or thermal conductivity of the TE element in the direction of current flow. Implantation can be particularly beneficial for reducing the interface resistance at the boundaries of TE segments and the ends of TE elements. Implantation can also be beneficial for altering the Seebeck coefficient at the device ends and interfaces to change the Thompson effect at such locations and reduce interface losses. Whether in combination with or alone, DTP TE elements and segments can benefit from thermally induced diffusion of the dopant, which is controlled in a manner that produces variations in one or more transport properties to produce higher-performance DTP TE elements or segments.

[0168] Another way to modify the properties of DTP is to subject certain TE materials, such as BiSb-based materials, to magnetic fields and magnetic field gradients. For example, the Seebeck coefficient can vary with magnetic field strength at temperatures between 50 K and 200 K (Goldsmid, Electronic Refrigeration, 1986). Figure 4 .22). In this embodiment, the TE material itself may not have compositional variation along the entire length or a portion of the length of the DTP TE element, and the magnetic field gradient may produce a change in transmission characteristics that can be adjusted to produce a DTP TE device.

[0169] As provided herein, any combination of the above-described processes, material modifications, segmented connection methods and connection material systems, and environmental exposure can be combined to produce DTP TE elements. Also see the following references written by the inventors, the entire contents of which are incorporated herein by reference: Crane and Bell, “Maximum temperature difference in a single-stage thermoelectric device through distributed transport properties,” International Journal of Thermal Sciences 154:106404, pp. 1–9 (2020).

[0170] Heating operation

[0171] exist Figure 16 , Figure 26 and Figure 27 The descriptions of the TE couples 1600, 2600, and 2700 are based on their cooling capacity. As an example, heat power is extracted from the cold side (1603 and 1605) and heat is dissipated from the hot side (1604). The heat dissipation on the hot side is Q. H1610. In steady-state operation, energy conservation requires:

[0172] Q H = Q C + Q IN (15),

[0173] Among them, Q IN This is the power supplied by the electrical power input 108 and all other power sources acting on the TE coupler 1600. For illustrative purposes, in this discussion of heating operation, it is assumed that the power supplied by the electrical power input 108 is Q. IN The only source. Then, divide equation (15) by Q. IN get:

[0174] COP H = COP C + 1 (16),

[0175] Among them, COP H It's heating efficiency, and COP. C It refers to cooling efficiency. To date, COP (Cooling Performance) has... C It has always been labeled as COP. It's important to note that in steady-state operation, because the two differ by a constant, regardless of how the design process and operating conditions maximize COP... C They also maximize COP H In a steady state, attributed to Figure 16 , Figure 26 and Figure 27 The performance optimization of the cold-side cooling power of the TE couple is suitable for the hot-side thermal output Q. H 2610. These performance characteristics are a direct result of equation (16).

[0176] If heating output is the design objective, then, in addition to or instead of cooling, the hot side of a DTP design can provide higher heating efficiency and heat pumping capacity than a CTE system. Consequently, in steady-state operation, the heat pump performance obtained by utilizing the heat power (heat output) from the hot side of the DTP system can be superior to that of a comparable CTE system, just as its cooling efficiency and cooling capacity can be superior. However, and to further clarify the performance capabilities of a DTP-TE system, if in steady-state operation… Figure 16 The electron flow shown is reversed, causing the hot side 1604 to cool down (heat power absorption) and the cold sides 1603 and 1605 to heat up (heat power dissipation), thus affecting the COP of the DTP system. H The COP of the lower-than-comparable (reference) CTE system H .

[0177] The differences in COP and Qc between CTE and DTP TE couples, modules, and devices (parts) are functions of the ratio between the DT of the measurement conditions and the maximum DT of the CTE part. This functional relationship is discussed and described in the following references written by the inventors: Crane and Bell, “Maximum temperature difference in a single-stage thermoelectric device through distributed transport properties,” International Journal of Thermal Sciences 154:106404, pp. 1-9 (2020); and Bell, “Optimally distributed transport properties can produce highest performance thermoelectric systems,” Phys. Status Solidi A:1900562, pp. 1-7 (2019). For clarity, when comparing COP and Qc between CTE and DTP parts in this document and without specifying a particular temperature difference, the ratio DT / (maximum DTcte) is 0.9, where maximum DTcte is relative to the temperature measurement conditions of comparable CTE parts. Furthermore, measurements are performed within the design operating temperature range of the TE parts. This limitation of measurement conditions applies to the COP and Q of the CTE and DTP systems compared in this paper. C The claims. These conditions also apply to the conditions. Figure 23 The loop curves 2303, 2304 and 2306 in the figure.

[0178] It will be recognized that one or more DTP TE materials, components, or couplers (such as references) with any suitable DTP design Figures 16 to 30 The heat pump system described herein may be used in any suitable heat pump system, such as the temperature-controlled transport system described above with reference to Figures 1 through 15. The heat pump system disclosed herein may additionally or alternatively include one or more CTE materials, components, or couplers.

[0179] It should be understood that any corresponding feature / example of each of the aspects and embodiments of this disclosure may be implemented together in any appropriate combination, and any feature / example from any one or more of these aspects may be implemented together to obtain the benefits described herein.

[0180] All references described above are cited in their entirety and incorporated herein by reference.

[0181] While various illustrative examples have been described above, it will be apparent to those skilled in the art that various changes and modifications may be made therein without departing from the invention. The appended claims are intended to cover all such changes and modifications that fall within the true spirit and scope of the invention.

Claims

1. A temperature controlled system for storing, transporting and / or delivering temperature sensitive contents, the temperature controlled system comprising: at least one temperature controlled package comprising an insulated body and a top cover forming at least one insulated temperature controlled chamber within the at least one temperature controlled package, at least one opening or slot defined through the insulation of the insulated body or the top cover to provide access to an interior region of the at least one temperature controlled package when the top cover is coupled to the body to form the at least one insulated temperature controlled chamber; at least one solid state heat pump mounted to a vehicle; and at least one heat transport element in thermal communication with the at least one solid state heat pump and mounted to the vehicle, the at least one heat transport element being insertable into the at least one temperature controlled package to thermally contact the interior region by extending through the at least one opening or slot and through the insulation of the insulated body or top cover when the top cover is coupled to the body to form the at least one insulated temperature controlled chamber, and thereby thermally coupling the at least one insulated temperature controlled chamber to the at least one solid state heat pump and coupling the at least one insulated temperature controlled chamber to the vehicle for transport, the at least one heat transport element being removable from the insulated body and the top cover of the at least one temperature controlled package via the at least one opening or slot when the top cover is coupled to the body to form the at least one insulated temperature controlled chamber, thereby thermally decoupling the insulated body and the top cover of the at least one insulated temperature controlled chamber from the at least one solid state heat pump and decoupling the at least one insulated temperature controlled chamber from the vehicle for delivery; and at least one of: at least one electrical energy storage system for providing electrical power to the at least one solid state heat pump; at least one electrical connector for accepting electrical power from a source of electrical power other than the at least one electrical energy storage system to provide electrical power to the at least one solid state heat pump; at least one thermal energy storage system within the at least one temperature controlled package; at least one electronic control / energy management system for controlling the at least one solid state heat pump; and at least one input / output feature for controlling the at least one solid state heat pump. The at least one solid state heat pump comprises a thermoelectric device.

2. The temperature controlled system of claim 1, wherein, The at least one solid state heat pump comprises a distributed transport property thermoelectric device.

3. The temperature controlled system of claim 1, wherein, The at least one solid state heat pump comprises a cascade of at least two solid state heat pumps arranged in thermal series.

4. The temperature controlled system of claim 1, wherein, The at least one thermal energy storage system comprises a phase change material.

5. The temperature controlled system of claim 1, wherein the system comprises the at least one thermal energy storage system located within the at least one temperature controlled package, and wherein, The at least one insulated temperature controlled chamber comprises a first temperature controlled chamber and a second temperature controlled chamber, wherein the first and second temperature controlled chambers are controllable to at least one of:

6. The temperature controlled system of claim 1, wherein, different temperatures from each other; at different times, different from each other in being below and / or above ambient temperature; or at the same time, the same as each other in being below and / or above ambient temperature. ​ 7. The temperature controlled system of claim 1, comprising said at least one electronic control / energy management system for controlling said at least one solid state heat pump, wherein said at least one electronic control / energy management system configured to record information regarding at least one of: a temperature history of contents placed in said at least one insulated temperature controlled chamber; an accessible record of failure conditions experienced by said temperature controlled system; a location of said temperature controlled system; and a transmission of at least some information collected by said temperature controlled system. said at least one electronic control / energy management system configured to perform at least one of the following through said at least one input / output feature:

8. The temperature controlled system of claim 7, further comprising means for controlling the at least one input / output characteristic of the at least one solid state heat pump, wherein, receive and / or respond to an external signal; receive an input command to change a temperature of said insulated temperature controlled chamber; send a signal; or display information.

9. The temperature controlled system of claim 1, further comprising said at least one input / output feature for controlling said at least one solid state heat pump, configured to at least one of: read a bar code or other type of input for setting control information; or allow temperature control information input to be programmable. said temperature controlled system comprising said at least one thermal energy storage system located within said at least one temperature controlled package, and wherein said at least one thermal energy storage system is removable from said at least one temperature controlled package or is reusable.

10. The temperature controlled system of claim 1, wherein, said at least one temperature controlled package is separable from one or more of:

11. The temperature controlled system of claim 1, wherein, said at least one electrical energy storage system, said at least one electronic control / energy management system, and said at least one input / output feature. said at least one temperature controlled package comprises a plurality of packages, and wherein said system further comprises a distributed set of storage compartments for storing and / or transporting respective ones of said plurality of packages.

12. The temperature controlled system of claim 1, wherein, at least some of said storage compartments of said distributed set of storage compartments are configured to provide independent temperature control of respective ones of said plurality of packages stored and / or transported therein.

13. The temperature controlled system of claim 12, wherein, said at least one temperature controlled package is disposable.

14. The temperature controlled system of claim 1, wherein, said at least one of said solid state heat pump, said thermal energy storage system, said electrical energy storage system, said electronic control / energy management system and said input / output feature is part of said delivery system, and wherein said at least one temperature controlled package is separable from said distributed set of storage compartments.

15. The temperature controlled system of claim 1, further comprising a delivery system comprising a distributed set of storage compartments, wherein, said at least one temperature controlled package comprises at least one internal heat spreading device located within said top cover or said insulated body, said at least one internal heat spreading device being in thermal contact with said at least one heat transport element when said at least one heat transport element is inserted into said at least one temperature controlled package.

16. The temperature controlled system of claim 1, wherein, said at least one temperature controlled package comprises at least one internal thermal energy storage system located within said top cover or said insulated body, said at least one internal thermal energy storage system being in thermal contact with said at least one heat transport element when said at least one heat transport element is inserted into said at least one temperature controlled package.

17. The temperature controlled system of claim 1, wherein, ​ 18. The temperature controlled system of claim 1, wherein, The at least one solid state heat pump comprises a cascade of at least one of: at least two solid state heat pumps arranged in thermal series; or at least one solid state heat pump and at least one thermal energy storage system arranged in thermal series.

19. The temperature controlled system of claim 16, wherein, The at least one internal heat spreading device is located on or in thermal contact with an internal wall of the at least one insulated temperature controlled chamber.

20. The temperature controlled system of claim 1, wherein, At least two openings or slots are defined through the insulated body or the top cover, and at least two heat transport elements are in thermal communication with the at least one solid state heat pump and are insertable into the at least one temperature controlled package to thermally contact the interior region and thereby thermally couple the at least one insulated temperature controlled chamber to the at least one solid state heat pump by extending through the at least two openings or slots and through the insulation of the insulated body or top cover.

21. The temperature controlled system of claim 1, wherein, The at least one opening or slot is defined through the top cover.

22. The temperature controlled system of claim 1, wherein, The heat transport elements are elongate.

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