Device for electronic component appearance inspection and packaging and method of using the same

Abstract

The present invention provides a device for visual inspection and packaging of electronic components and a method for using the device. The device can be used for visual inspection of electronic components. The device and the packaging device are interconnected, reducing space requirements while minimizing the impact of the device on the efficiency of the packaging device. The device comprises a loading mechanism, a visual inspection station, and a tape packaging station. The visual inspection station comprises a camera, the tape packaging station comprises a retractable device, the visual inspection station further comprises a reeling turntable, a tape turntable, and a first transfer mechanism. The tape packaging station further comprises a second transfer mechanism. The loading mechanism comprises an ejection mechanism. The reeling turntable and the tape turntable are each evenly provided with suction positions for sucking electronic components. The ejection mechanism is used to eject electronic components toward the suction positions of the reeling turntable. The first transfer mechanism is used to transfer electronic components on the reeling turntable to the suction positions of the tape turntable. The second transfer mechanism is used to transfer electronic components on the tape turntable to the tape.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component detection, and in particular to a device for electronic component appearance inspection and packaging and a method for using the device. Background Art

[0002] In a production line for batch testing and screening of electronic components such as capacitors, after the electronic components have passed the test of the testing equipment, the existing operation is to use a visual inspection device to inspect the electronic components to screen out defective products. After the inspection is completed, the batch of electronic components that have been inspected are transferred to a taping and packaging device for taping and packaging. The two are independent of each other, and the two devices occupy a large area, which is not convenient for connection. Moreover, when performing the appearance inspection, taking the six-sided appearance inspection of the electronic components as an example, one inspection method is to arrange the components in bulk on the periphery of a horizontally rotating transparent glass disk, and then have six cameras arranged around the disk observe the six-sided appearance of each component while it moves along the circle. However, the shooting angle and distance of each camera for each component will be different to a certain extent. The output of the components is usually in bulk form, and the subsequent taping and packaging needs to be reloaded and arranged, which will bring great inconvenience to the subsequent taping and packaging.

[0003] Another inspection method uses a carrier box that has already been loaded with components from a previous testing process. The components in the carrier box are first inspected facing upward. Then, a suction head array picks up a row of components from the carrier box and moves them linearly through three cameras for a three-sided inspection: two side surfaces and one bottom surface. The row of components is then returned to its original position in the carrier box. The same inspection is then repeated row by row in the carrier box. After each row is inspected, the carrier box moves to another station, where another suction head array picks up a column of components from the carrier box and moves them linearly through another two cameras for a two-sided inspection. At this point, the entire carrier box has undergone a six-sided appearance inspection and is then returned to its original carrier box. Because the movement of components between rows or columns is intermittent and slow, this affects the operating speed of the taping and packaging equipment. Summary of the Invention

[0004] In order to solve the problems that the traditional appearance inspection device and packaging device are independent of each other, resulting in a large area of ​​space, the output of bulk materials by the appearance inspection device affects the processing efficiency, and the intermittent operation of the appearance inspection device affects the running speed of the braiding packaging device, the present invention provides a device for appearance inspection and packaging of electronic components and a method of use thereof, which can be used for the appearance inspection of electronic components. At the same time, the appearance inspection device and the packaging device are interconnected, which reduces the space occupied and has little impact of the appearance inspection device on the efficiency of the packaging device.

[0005] The technical solution is as follows: a device for appearance inspection and packaging of electronic components, which includes a loading mechanism, an appearance inspection station and a braiding packaging station, the appearance inspection station includes a camera for photographing the appearance of electronic components, and the braiding packaging station includes a retracting device for retracting and releasing braids, characterized in that: the appearance inspection station also includes a vertical material retrieving turntable located above the loading mechanism, a horizontal braiding turntable located on one side of the material retrieving turntable, and a transfer mechanism 1, the braiding packaging station also includes a transfer mechanism 2, the loading mechanism includes an ejection mechanism, the camera includes a camera 1 located at the material retrieving turntable and a camera 2 located at the braiding turntable; adsorption positions for adsorbing electronic components are evenly arranged in the circumferential direction of the material retrieving turntable and the braiding turntable, the ejection mechanism is used to eject the electronic components toward the adsorption position of the material retrieving turntable, the transfer mechanism 1 is used to transfer the electronic components on the material retrieving turntable to the adsorption position of the braiding turntable, and the transfer mechanism 2 is used to transfer the electronic components on the braiding turntable to the braid.

[0006] It is further characterized by:

[0007] When the electronic components are placed in the carrier box, a placement slot for accommodating the electronic components is provided on the carrier box, the placement slot is open at the top and a through hole is provided at the bottom of the placement slot; the loading mechanism includes a displacement mechanism, the displacement mechanism is used to move the through holes of the placement slot one by one to the top of the ejection mechanism, and the ejection mechanism ejects the electronic components to the adsorption position through the through holes;

[0008] When the electronic components are in bulk, the feeding mechanism includes an arranging device, a feeding track and an ejection mechanism. A through hole is provided at the end of the feeding track. The ejection mechanism is located below the through hole. The ejection mechanism ejects the electronic components to the adsorption position through the through hole.

[0009] The adsorption position is a vacuum suction groove, which passes through the axial sides of the material retrieving turntable or the braiding turntable, and the bottom of the vacuum suction groove is provided with a suction port for adsorbing electronic components;

[0010] The transfer mechanism 1 includes a push rod 1 located on one axial side of the material-retrieving turntable, a support platform 1 located on the other axial side of the material-retrieving turntable, and a push rod 2, wherein the push rod 1 is used to push the electronic component onto the support platform 1, and the push rod 2 is used to push the electronic component on the support platform 1 into the vacuum suction groove of the braiding turntable; the transfer mechanism 2 includes a push rod 3 located above the braiding turntable, a support platform 2 located below the braiding turntable, and a push rod 4, wherein the push rod 3 is used to push the electronic component onto the support platform 2, and the push rod 4 is used to push the electronic component on the support platform 2 into the braid;

[0011] The first camera is located at least on one of the two axial sides and the outer side of the circumference of the material taking turntable; the second camera is located at least on one of the two axial sides and the outer side of the circumference of the tape turning disk, and the cameras are facing the surface of the electronic component to be inspected;

[0012] The outer side of the braiding turntable is also provided with a defective product drop position and a drop inspection position.

[0013] A method for using the above-mentioned device is characterized in that: electronic components are ejected in sequence into the vacuum suction groove at the lower end of the continuously rotating material-picking turntable by an ejection mechanism, one end face of the electronic component is adsorbed by the vacuum suction groove, the material-picking turntable rotates with the electronic component and performs appearance inspection on the exposed surface of the electronic component through a pair of cameras during the rotation; when the electronic component moves to a position close to the braiding turntable, the electronic component is transferred to the vacuum suction groove of the continuously rotating braiding turntable by a transfer mechanism one and the end face of the electronic component that has been visually inspected is adsorbed by the vacuum suction groove; the braiding turntable rotates with the electronic component and performs appearance inspection on the exposed surface of the electronic component through a second camera during the rotation; when the electronic component moves to a position close to the braiding, the electronic component is transferred to the braiding for packaging by a transfer mechanism two.

[0014] It is further characterized by:

[0015] When the electronic components are placed in the carrier box, the displacement mechanism controls the carrier box to move the through holes of the placement slots one by one to above the ejection mechanism; the electronic components in the placement slots are placed with the electrodes facing downwards;

[0016] Taking the electronic component at the time of ejection as a reference, six surfaces of the electronic component, namely the front, back, left, right, top and bottom, are inspected respectively; the material picking turntable absorbs the top of the electronic component and exposes the left, right and bottom surfaces of the electronic component, and the first camera is arranged to face the left, right and bottom surfaces of the electronic component during the rotation of the material picking turntable; the braiding turntable absorbs the bottom of the electronic component and exposes the front, back and top surfaces of the electronic component, and the second camera is arranged to face the front, back and top surfaces of the electronic component during the rotation of the braiding turntable.

[0017] Beneficial effects: The electronic components are moved by the mutually coordinated material picking turntable and the weaving turntable, and the appearance of the electronic components is inspected by camera 1 and camera 2 during the movement. After the inspection, they can be directly placed in the weaving tape for packaging, eliminating the loading mechanism of the packaging device and reducing the space occupied. At the same time, after the inspection, the materials will not be converted into bulk materials and then rearranged and loaded into the packaging device, thereby improving the processing efficiency. Moreover, the entire appearance inspection and packaging can be carried out continuously, ensuring the operation and processing speed of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1is a schematic diagram of the structure of the device when the electronic components are located in the carrier box;

[0019] Figure 2 for Figure 1 Side view of

[0020] Figure 3 This is a schematic diagram of the structure of the device when the electronic components are bulk materials;

[0021] Figure 4 for Figure 3 Side view of

[0022] Figure 5 Schematic diagram of the structure of the transfer mechanism 1;

[0023] Figure 6 is a structural diagram of another transfer mechanism 1;

[0024] Figure 7 It is a structural diagram of the transfer mechanism 2;

[0025] Figure 8 It is a structural diagram of another transfer mechanism 2. DETAILED DESCRIPTION

[0026] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The device shown is for appearance inspection and packaging of electronic components, which includes a feeding mechanism, an appearance inspection station and a braid packaging station. The appearance inspection station includes a camera for photographing the appearance of the electronic component (taking six-sided inspection as an example, the cameras include cameras af respectively). The braid packaging station includes a retracting device for retracting and unretracting braid 4 (for example, a roller unwinds and retracts the braid by winding it around the roller, which is a common technical means). The appearance inspection station also includes a vertical material retrieving turntable 1 located above the feeding mechanism, a horizontal braiding turntable 2 located on one side of the material retrieving turntable 1, and a transfer mechanism 1. The two turntables rotate continuously or step by step under the action of a motor. The taping packaging station also includes a transfer mechanism 2, the loading mechanism includes an ejection mechanism (such as a pin that moves up and down or a nozzle that sprays air upward), and the camera includes a camera 1 (camera ac) located at the material retrieving turntable 1 and a camera 2 (camera df) located at the taping turntable 2; adsorption positions 3 for adsorbing electronic components are evenly arranged in the circumferential direction of the material retrieving turntable 1 and the taping turntable 2, and the ejection mechanism is used to eject the electronic components toward the adsorption position 3 at the bottom of the material retrieving turntable 1, the transfer mechanism 1 is used to transfer the electronic components on the material retrieving turntable 1 to the adsorption position 3 of the taping turntable 2, and the transfer mechanism 2 is used to transfer the electronic components on the taping turntable 2 to the tape 4.

[0027] In addition to the method of directly testing bulk electronic components on the market, there is also a method of loading electronic components into a carrier box for testing. For example, the electronic component testing equipment described in publication number CN210753855U, since the electronic components are in the carrier box after the previous test, the following method is used when performing appearance inspection without taking them out before performing appearance inspection, combined with Figure 1 、 Figure 2 When electronic components are placed in carrier box 8, carrier box 8 is provided with a placement slot for accommodating the electronic components. The placement slot has an opening at the top and a through-hole at the bottom. The loading mechanism includes a displacement mechanism (not shown in the figure) for moving the through-holes of the placement slots one by one above an ejection mechanism (e.g., an ejector pin that moves up and down or a nozzle that sprays air upward). The ejection mechanism ejects the electronic components into a suction position through the through-holes. The displacement mechanism can clamp the carrier box and drive it to move horizontally and vertically (e.g., a clamping platform connected to horizontal and vertical electric slides can be used. After the carrier box is clamped on the clamping platform, the horizontal and vertical movement of the carrier box is controlled by controlling the two electric slides). As a result, the placement slots can be placed one by one above the ejection mechanism, and the ejector pins can eject the electronic components into the suction position at the bottom, or the nozzle can spray the electronic components into the suction position at the bottom.

[0028] When the electronic components are bulk materials, such as Figure 3 、 Figure 4 The feeding mechanism shown includes an arranging device 9 (a vibrating feeding tray can be used to arrange electronic components), a feeding track 10 and an ejection mechanism. A through hole is opened at the end of the feeding track 10, and the ejection mechanism is located below the through hole. The ejection mechanism ejects the electronic components to the adsorption position through the through hole.

[0029] The above-mentioned adsorption position 3 is a vacuum suction groove, which passes through the axial sides of the corresponding material pick-up turntable 1 or the braiding turntable 2, so that the surface of the electronic component can be exposed and the electronic component can be pushed out through the transfer mechanism. The bottom of the vacuum suction groove is provided with a suction port for adsorbing electronic components, and vacuum is drawn through the suction port for adsorption. Of course, a suction cup can also be used as the adsorption port.

[0030] Combine Figure 5 、 Figure 7The transfer mechanism 1 includes a push rod 11 located on one axial side of the material-retrieving turntable 1, a support platform 12 located on the other axial side of the material-retrieving turntable 1, and a push rod 2 13. The push rod 11 is used to push the electronic component 14 onto the support platform 12, and the push rod 2 13 is used to push the electronic component 14 on the support platform 12 into the vacuum suction groove of the braiding turntable 2; the transfer mechanism 2 includes a push rod 3 15 located above the braiding turntable 2, a support platform 2 16 located below the braiding turntable 2, and a push rod 4 17. The push rod 3 15 is used to push the electronic component 14 onto the support platform 2 16 under the action of gravity, and the push rod 4 17 is used to push the electronic component 14 on the support platform 2 16 into the braid 4. This method requires that the material-retrieving turntable and the braiding turntable, and the braiding turntable and the braid are staggered with each other, but due to the existence of the support platform, the matching accuracy between the above two can be reduced.

[0031] You can also use Figure 6 、 Figure 8 In another method shown, both ends of the electronic component 14 are made to protrude from the vacuum suction groove. By arranging push rods 18 on both sides, the electronic component can be directly pushed out and pushed into the next device. In this case, higher matching accuracy is required.

[0032] In addition, a defective product drop-out position 6 and a drop-out inspection position 7 are provided on the outside of the braiding turntable 2. The vacuum is turned off at the defective product drop-out position for electronic components that have been inspected on all six sides to remove them from the turntable. Subsequently, the drop-out inspection position at the rear verifies whether the defective electronic components have left the turntable to ensure that they have left the turntable. The measuring head 5 can be set up for additional measurement.

[0033] During use, the electronic components are ejected in sequence into the vacuum suction groove at the lower end of the continuously rotating material-picking turntable through the ejection mechanism, and one end face of the electronic component is adsorbed by the vacuum suction groove. The material-picking turntable rotates with the electronic components and performs appearance inspection on the exposed surface of the electronic components through camera one during the rotation. When the electronic components move to a position close to the weaving turntable, the electronic components are transferred to the vacuum suction groove of the continuously rotating weaving turntable through transfer mechanism one and the end face of the electronic component that has been visually inspected is adsorbed by the vacuum suction groove. The weaving turntable rotates with the electronic components and performs appearance inspection on the exposed surface of the electronic components through camera two during the rotation. When the electronic components move to a position close to the weaving tape, the electronic components are transferred to the weaving tape for packaging through transfer mechanism two.

[0034] Taking the electronic component at ejection as a reference, six surfaces are inspected: front, back, left, right, top, and bottom. The reeling turntable holds the top of the electronic component, exposing its left, right, and bottom surfaces. Camera 1 is positioned directly opposite the left, right, and bottom surfaces of the electronic component as the reeling turntable rotates, i.e., cameras a, b, and c are respectively used to inspect the bottom, left, and right surfaces of the electronic component. The taping turntable holds the bottom of the electronic component, exposing its front, back, and top surfaces. Camera 2 is positioned directly opposite the front, back, and top surfaces of the electronic component as the taping turntable rotates, i.e., cameras d, e, and f are respectively used to inspect the top, back, and front surfaces of the electronic component. Of course, electronic components don't necessarily have six surfaces, and the cameras can be arranged according to actual needs. Camera 1 is positioned at least on one of the two axial sides and the outer circumference of the reeling turntable, and camera 2 is positioned at least on one of the two axial sides and the outer circumference of the taping turntable. In this way, all exposed surfaces can be inspected using both turntables.

[0035] Furthermore, because tape packaging typically requires electronic components to be placed in the tape with their bottom electrodes facing the bottom of the carrier tape's receiving slots, components with electrodes located at their bottoms are required to be placed with the electrodes facing upward in the carrier. This device's front-end testing process also typically uses components with their electrodes facing upward in the carrier (facilitating probes pressing down to connect with the electrodes during testing). Therefore, after testing, the carrier can be directly placed in this device for visual inspection and tape packaging, making it well-suited for testers that utilize carriers.

[0036] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by anyone familiar with the art within the technical scope disclosed by the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A device for visual inspection and packaging of electronic components, comprising a loading mechanism, a visual inspection station, and a tape packaging station, wherein the visual inspection station includes a camera for photographing the appearance of the electronic components, and the tape packaging station includes a retractable device for retracting and releasing the tape, characterized in that: The appearance inspection station also includes a vertical material picking turntable located above the loading mechanism, a horizontal braiding turntable located on one side of the material picking turntable, and a transfer mechanism 1. The braiding packaging station also includes a transfer mechanism 2. The loading mechanism includes an ejection mechanism. The camera includes a camera 1 located at the material picking turntable and a camera 2 located at the braiding turntable. Adsorption positions for adsorbing electronic components are evenly arranged in the circumferential direction of the material picking turntable and the braiding turntable, respectively. The ejection mechanism is used to eject the electronic components toward the adsorption position of the material picking turntable. The transfer mechanism 1 is used to transfer the electronic components on the material picking turntable to the adsorption position of the braiding turntable. The transfer mechanism 2 is used to transfer the electronic components on the braiding turntable to the braid.

2. The device for appearance inspection and packaging of electronic components according to claim 1, characterized in that: When the electronic components are placed in the carrier box, a placement slot for accommodating the electronic components is provided on the carrier box, the top of the placement slot is open and a through hole is provided at the bottom of the placement slot; the loading mechanism includes a displacement mechanism, which is used to move the through holes of the placement slot one by one to the top of the ejection mechanism, and the ejection mechanism ejects the electronic components to the adsorption position through the through holes.

3. The device for appearance inspection and packaging of electronic components according to claim 1, characterized in that: When the electronic components are bulk materials, the loading mechanism includes an arranging device, a loading track and an ejection mechanism. A through hole is opened at the end of the loading track. The ejection mechanism is located below the through hole. The ejection mechanism ejects the electronic components to the adsorption position through the through hole.

4. The device for appearance inspection and packaging of electronic components according to claim 2 or 3, characterized in that: The adsorption position is a vacuum suction groove, which passes through the axial sides of the material-taking turntable or the braiding turntable. The bottom of the vacuum suction groove is provided with a suction port for adsorbing electronic components.

5. The device for appearance inspection and packaging of electronic components according to claim 4, characterized in that: The transfer mechanism 1 includes a push rod 1 located on one axial side of the material-retrieving turntable, a support platform 1 located on the other axial side of the material-retrieving turntable, and a push rod 2. The push rod 1 is used to push the electronic components onto the support platform 1, and the push rod 2 is used to push the electronic components on the support platform 1 into the vacuum suction groove of the braiding turntable; the transfer mechanism 2 includes a push rod 3 located above the braiding turntable, a support platform 2 located below the braiding turntable, and a push rod 4. The push rod 3 is used to push the electronic components onto the support platform 2, and the push rod 4 is used to push the electronic components on the support platform 2 into the braid.

6. The device for appearance inspection and packaging of electronic components according to claim 5, characterized in that: The camera 1 is at least located on one of the two axial sides and the outer side of the circumference of the material taking turntable; the camera 2 is at least located on one of the two axial sides and the outer side of the circumference of the braiding turntable, and the camera is facing the surface of the electronic component to be inspected for appearance.

7. The device for appearance inspection and packaging of electronic components according to claim 1, characterized in that: The outer side of the braiding turntable is also provided with a defective product drop position and a drop inspection position.

8. A method for using the device for electronic component appearance inspection and packaging according to any one of claims 5 to 7, characterized in that: The electronic components are ejected in sequence into the vacuum suction groove at the lower end of the continuously rotating material picking turntable by the ejection mechanism, and one end face of the electronic component is adsorbed by the vacuum suction groove. The material picking turntable rotates with the electronic components and performs appearance inspection on the exposed surface of the electronic components through camera one during the rotation. When the electronic components move to a position close to the weaving turntable, the electronic components are transferred to the vacuum suction groove of the continuously rotating weaving turntable by transfer mechanism one and the end face of the electronic components that has been visually inspected is adsorbed by the vacuum suction groove. The weaving turntable rotates with the electronic components and performs appearance inspection on the exposed surface of the electronic components through camera two during the rotation. When the electronic components move to a position close to the weaving tape, the electronic components are transferred to the weaving tape for packaging by transfer mechanism two.

9. The method for using the device for appearance inspection and packaging of electronic components according to claim 8, characterized in that: When the electronic components are placed in the carrier box, the displacement mechanism controls the carrier box to move the through holes of the placement slots one by one to above the ejection mechanism; the electronic components in the placement slots are placed with the electrodes facing downward.

10. The method for using the device for electronic component appearance inspection and packaging according to claim 8, characterized in that: Taking the electronic component at the time of ejection as a reference, six surfaces of the electronic component, namely the front, back, left, right, top and bottom, are inspected respectively; the material picking turntable absorbs the top of the electronic component and exposes the left, right and bottom surfaces of the electronic component, and the first camera is arranged to face the left, right and bottom surfaces of the electronic component during the rotation of the material picking turntable; the braiding turntable absorbs the bottom of the electronic component and exposes the front, back and top surfaces of the electronic component, and the second camera is arranged to face the front, back and top surfaces of the electronic component during the rotation of the braiding turntable.

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