Electroplating apparatus, control method, device, and medium

Abstract

The present disclosure relates to the technical field of electroplating, and particularly relates to an electroplating device, a control method, equipment and a medium, the electroplating device comprises a power supply, a liquid receiving groove, a flow guiding unit, a flow guiding moving unit and a circulating unit; the flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly polar plate; the sealing flange comprises a flange overflow port, and the sealing flange is connected with the flow guiding assembly; the flow guiding assembly polar plate is arranged in the flow guiding assembly, and the flow guiding assembly polar plate is electrically connected with the power supply; the circulating unit is in conduction with the flow guiding assembly; and the flow guiding moving unit is connected with the flow guiding unit. The height of the electroplating device in the scheme will not be affected by the length of the plated part, that is, the height of the electroplating device can be low, which will not cause height constraints on the factory building, so that the purpose of automatically electroplating the inner cavity of the plated part in the factory building can be achieved, the electroplating cost is reduced, and the electroplating efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electroplating, and in particular to an electroplating device, a control method, equipment and a medium. BACKGROUND

[0002] In the related art, when the inner cavity of a plated part (for example, a long conductive rod) is electroplated, a local insulation vertical electroplating or brush plating scheme is usually adopted. The brush plating needs to be manually completed by an operator, and the local insulation vertical electroplating is achieved by immersing the plated part into a solution from above the liquid surface of the solution used for electroplating, so as to realize the purpose of automatic continuous production.

[0003] In the above scheme, although the inner cavity of the plated part can be automatically and continuously electroplated, when the length of the plated part is relatively long, the plated part cannot be immersed into the solution in a vertical state from above due to the restriction of the height of the factory building, so that the local insulation vertical electroplating scheme cannot be adopted, and only the manual brush plating operation can be adopted in the factory building to electroplate the inner cavity of the plated part, thereby increasing the electroplating cost, reducing the electroplating efficiency, and greatly fluctuating the electroplating quality. SUMMARY

[0004] In order to solve the problems in the related art, the present disclosure provides an electroplating device, a control method, equipment and a medium.

[0005] In a first aspect, an electroplating device is provided in the embodiments of the present disclosure, which comprises a power supply, a liquid receiving groove, a flow guiding unit, a flow guiding moving unit and a circulating unit;

[0006] The flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly electrode plate; the sealing flange comprises a flange overflow port, and the sealing flange is connected with the flow guiding assembly; the flow guiding assembly electrode plate is arranged in the flow guiding assembly, and the flow guiding assembly electrode plate is electrically connected with the power supply;

[0007] The circulating unit is in communication with the flow guiding assembly, and is used to move the solution from the liquid receiving groove to the flow guiding assembly, and make the solution flow out of the flow guiding assembly;

[0008] The flow guiding moving unit is connected with the flow guiding unit, and is used to move the flow guiding unit, so that the flow guiding assembly is inserted into the inner cavity of the plated part from the inner cavity opening of the plated part located above the liquid receiving groove, and the sealing flange is attached to the inner cavity opening, so that the solution in the inner cavity can flow out of the flange overflow port and flow into the liquid receiving groove.

[0009] In an embodiment of the present disclosure, the circulating unit comprises a circulating pump, a liquid storage groove and a flow guiding valve;

[0010] The liquid storage groove is arranged below the liquid receiving groove, the liquid receiving groove comprises a liquid receiving groove flow guiding port arranged on the bottom surface thereof, and the liquid storage groove is in communication with the liquid receiving groove flow guiding port through the flow guiding valve;

[0011] The circulating pump is in communication with the liquid storage tank, and is used to move the solution from the liquid storage tank to the flow guide assembly and to flow the solution out of the flow guide assembly.

[0012] In one embodiment of the present disclosure, the instantaneous flow rate of the solution flowing out of the flow guide assembly is greater than the instantaneous flow rate of the solution flowing out of the overflow port of the flange.

[0013] In one embodiment of the present disclosure, the flow guide unit further comprises a sealing ring made of an elastic material, one side of the sealing ring is in abutment with the sealing flange, and the other side of the sealing ring is used to abut against the opening end surface of the inner cavity of the plating piece when the flow guide assembly is inserted into the inner cavity of the plating piece.

[0014] In one embodiment of the present disclosure, the sealing flange is provided with a wiring seat on the side away from the flow guide assembly, the wiring seat is electrically connected with the power supply, and the polar plate of the flow guide assembly is electrically connected with the wiring seat.

[0015] In one embodiment of the present disclosure, the flow guide assembly comprises a flow guide assembly inner cavity, the flow guide assembly inner cavity is in communication with the circulating unit, and a plurality of through holes are provided on the inner wall of the flow guide assembly inner cavity, the through holes are used to guide the solution in the flow guide assembly inner cavity out.

[0016] In one embodiment of the present disclosure, the electroplating device further comprises a plating piece inner cavity plugging assembly, the plating piece inner cavity plugging assembly is used to be arranged on the edge of the plating area of the inner cavity, and is used to close the inner cavity.

[0017] In one embodiment of the present disclosure, the electroplating device further comprises a support and a moving device arranged below the support.

[0018] The power supply, the liquid receiving tank, the flow guide moving unit and the circulating unit are fixed on the support and can move back and forth in the horizontal direction under the driving of the moving device.

[0019] In one embodiment of the present disclosure, the electroplating device further comprises a plating piece height adjusting device, which is used to adjust the distance between the plating piece and the liquid receiving tank.

[0020] In one embodiment of the present disclosure, the plating piece height adjusting device comprises a rotating assembly, which is used to drive the plating piece to rotate in the radial direction during the electroplating process.

[0021] In one embodiment of the present disclosure, the liquid receiving tank is provided with a splash-proof device, which is used to prevent the solution from splashing out of the liquid receiving tank.

[0022] In one embodiment of the present disclosure, the splash-proof device comprises a first splash-proof assembly and a second splash-proof assembly, the first splash-proof assembly is arranged on the inner wall of the liquid receiving tank, and the second splash-proof assembly is arranged on the outer wall of the liquid receiving tank.

[0023] In one embodiment of the present disclosure, the first splash-proof assembly comprises a plurality of air injection ports.

[0024] And / or, the second anti-splashing assembly comprises a liquid receiving box and a brush, the liquid receiving box is arranged on the outer wall of the liquid receiving groove, and the brush is arranged on the side wall of the liquid receiving box close to one side of the liquid receiving groove.

[0025] In a second aspect, the disclosure provides a plating device control method, the method is used for controlling the plating device of any one of the first aspect, and the method comprises:

[0026] obtaining position information of the plating piece;

[0027] when it is determined according to the position information that the plating piece is located above the liquid receiving groove in the plating device, controlling a flow guide moving unit in the plating device to move a flow guide unit in the plating device, so that a flow guide assembly in the flow guide unit is inserted into an inner cavity of the plating piece from an inner cavity opening of the plating piece, and a sealing flange in the flow guide unit is used to close the inner cavity opening;

[0028] controlling a circulating unit in the plating device to move the solution from the liquid receiving groove to the flow guide assembly, and to make the solution flow out of the flow guide assembly.

[0029] In an embodiment of the disclosure, before the position information of the plating piece is obtained, the method further comprises:

[0030] controlling a moving device in the plating device to move, so that the liquid receiving groove moves to the lower side of the plating piece.

[0031] In a third aspect, the disclosure provides an electronic device, comprising a memory and a processor, wherein the memory is used to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the method of any one of the second aspect.

[0032] In a fourth aspect, the disclosure provides a computer readable storage medium, and the computer readable storage medium stores computer instructions, and the computer instructions are executed by a processor to implement the method of any one of the second aspect.

[0033] According to the technical scheme provided by the embodiment of the present disclosure, the electroplating device comprises a power supply, a liquid receiving groove, a flow guide unit, a flow guide moving unit and a circulating unit; the flow guide unit comprises a flow guide assembly, a sealing flange and a flow guide assembly polar plate; the sealing flange comprises a flange overflow port, and the sealing flange is connected with the flow guide assembly; the flow guide assembly polar plate is arranged in the flow guide assembly, and the flow guide assembly polar plate is electrically connected with the power supply; the circulating unit is in communication with the flow guide assembly, and is used for moving the solution from the liquid receiving groove to the flow guide assembly, and making the solution flow out of the flow guide assembly; the flow guide moving unit is connected with the flow guide unit, and is used for moving the flow guide unit, so that the flow guide assembly is inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece located above the liquid receiving groove, and the sealing flange is attached to the inner cavity opening, so that the solution in the inner cavity can flow out of the flange overflow port and flow into the liquid receiving groove. In this scheme, the plating piece can be conveniently arranged in the horizontal direction, and the flow guide assembly can be inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece in the horizontal direction, and the solution used in electroplating can be introduced into the inner cavity of the plating piece through the flow guide assembly, so that the inner cavity of the plating piece can be electroplated after the power supply is turned on. The height of the electroplating device in the above scheme is not affected by the length of the plating piece, that is, the height of the electroplating device can be relatively low, which does not restrict the height of the factory building, thereby achieving the purpose of automatically electroplating the inner cavity of the plating piece in the factory building, reducing the electroplating cost, and improving the electroplating efficiency.

[0034] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0035] Other features, objects, and advantages of the present disclosure will become more apparent from the following detailed description of the non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:

[0036] Figure 1 A schematic structural diagram of an electroplating device according to an embodiment of the present disclosure is shown.

[0037] Figure 2 A schematic longitudinal sectional view of a sealing flange according to an embodiment of the present disclosure is shown.

[0038] Figure 3 A schematic longitudinal sectional view of a flow guide assembly according to an embodiment of the present disclosure is shown.

[0039] Figure 4 A schematic structural diagram of a plating piece according to an embodiment of the present disclosure is shown.

[0040] Figure 5 A flow chart of an electroplating device control method according to an embodiment of the present disclosure is shown.

[0041] Figure 6 A structural block diagram of an electronic device according to an embodiment of the present disclosure is shown.

[0042] Figure 7 A structural diagram of a computer system suitable for implementing the method according to the embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0043] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so as to be easily carried out by one of ordinary skill in the art. Also, portions irrelevant to the description of the exemplary embodiments are omitted in the accompanying drawings for the sake of clarity.

[0044] In the present disclosure, it should be understood that terms such as "include" or "have" are intended to indicate that there are features, numbers, steps, actions, components, parts or combinations thereof disclosed in the specification, and do not exclude the possibility that one or more other features, numbers, steps, actions, components, parts or combinations thereof exist or are added.

[0045] It should also be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0046] In the present disclosure, if the operation of acquiring user information or user data or the operation of showing user information or user data to others is involved, the operation is an operation authorized, confirmed by the user, or actively selected by the user.

[0047] In the related art, when the inner cavity of a plated part is electroplated, a local insulation vertical electroplating scheme is usually adopted, that is, the plated part is immersed into the solution from above the liquid surface of the solution used for electroplating to perform electroplating, so as to realize the purpose of automatic continuous production.

[0048] In the above scheme, although the inner cavity of the plated part can be electroplated automatically and continuously, when the length of the plated part is relatively long, the plated part cannot be immersed into the solution in a vertical state from above due to the restriction on the height of the factory building, so that the local insulation vertical electroplating scheme cannot be adopted, and only a manual brush plating operation can be used to electroplate the inner cavity of the plated part in the factory building, thereby increasing the electroplating cost and reducing the electroplating efficiency.

[0049] To solve the above problems, the present disclosure provides an electroplating device, a control method, equipment and a medium.

[0050] According to the technical scheme provided by the embodiment of the present disclosure, the electroplating device comprises a power supply, a liquid receiving tank, a flow guiding unit, a flow guiding moving unit and a circulating unit; the flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly polar plate; the sealing flange comprises a flange overflow port, and the sealing flange is connected with the flow guiding assembly; the flow guiding assembly polar plate is arranged in the flow guiding assembly, and the flow guiding assembly polar plate is electrically connected with the power supply; the circulating unit is in communication with the flow guiding assembly, and is used for moving the solution from the liquid receiving tank to the flow guiding assembly, and making the solution flow out of the flow guiding assembly; the flow guiding moving unit is connected with the flow guiding unit, and is used for moving the flow guiding unit, so that the flow guiding assembly is inserted into the inner cavity of the plating part from the inner cavity opening of the plating part located above the liquid receiving tank, and the sealing flange is attached to the inner cavity opening, so that the solution in the inner cavity can flow out of the flange overflow port and flow into the liquid receiving tank. In this scheme, the plating part can be conveniently arranged in the horizontal direction, and the flow guiding assembly can be inserted into the inner cavity of the plating part from the inner cavity opening of the plating part in the horizontal direction, and the solution used in electroplating is introduced into the inner cavity of the plating part through the flow guiding assembly, so that the inner cavity of the plating part can be electroplated after the power supply is turned on. The height of the electroplating device in the above scheme is not affected by the length of the plating part, that is, the height of the electroplating device can be relatively low, which does not restrict the height of the factory building, so that the purpose of automatically electroplating the inner cavity of the plating part in the factory building can be achieved, the electroplating cost is reduced, and the electroplating efficiency is improved.

[0051] Figure 1 A schematic structural diagram of an electroplating device according to an embodiment of the present disclosure is shown. As shown in the figure, the electroplating device comprises a power supply, a liquid receiving tank 102, a flow guiding unit, a flow guiding moving unit 104 and a circulating unit 105; Figure 1

[0052] The flow guiding unit comprises a flow guiding assembly 106, a sealing flange 107 and a flow guiding assembly polar plate 108; the sealing flange 107 comprises a flange overflow port, and the sealing flange 107 is connected with the flow guiding assembly 106; the flow guiding assembly polar plate 108 is arranged in the flow guiding assembly 106, and the flow guiding assembly polar plate 108 is electrically connected with the power supply;

[0053] The circulating unit 105 is in communication with the flow guiding assembly 106, and is used for moving the solution from the liquid receiving tank 102 to the flow guiding assembly 106, and making the solution flow out of the flow guiding assembly 106;

[0054] The flow guiding moving unit 104 is connected with the flow guiding unit, and is used for moving the flow guiding unit, so that the flow guiding assembly 106 is inserted into the inner cavity 202 of the plating part 200 from the inner cavity opening 201 of the plating part 200 located above the liquid receiving tank 102, and the sealing flange 107 is attached to the inner cavity opening 201, so that the solution in the inner cavity 202 can flow out of the flange overflow port and flow into the liquid receiving tank 102.

[0055] ​In an implementation form of the present disclosure, the cathode plate of the flow guide assembly is electrically connected to the positive pole of the power supply, and the plating part is electrically connected to the negative pole of the power supply, so as to electroplate the inner cavity of the plating part.

[0056] In an implementation form of the present disclosure, the flow guide moving unit is connected to the flow guide unit, which can be understood as that the flow guide moving unit is connected to the sealing flange, and can be understood as that the flow guide moving unit is directly or indirectly connected to any other component in the flow guide unit.

[0057] In an implementation form of the present disclosure, the circulating unit can be a circulating pump or other device with a solution moving function. The circulating unit is in communication with the flow guide assembly, which can be that the circulating unit is directly in communication with the flow guide assembly through a pipeline, or that the circulating unit is in communication with the flow guide assembly through at least one device with a solution storage function or a flow guide function.

[0058] In an implementation form of the present disclosure, the electroplating device can further include a solution storage upper tank arranged above the liquid receiving tank, and the solution storage upper tank is in communication with the flow guide assembly; during electroplating, the solution pump moves the solution from the liquid receiving tank to the solution storage upper tank, so that the solution in the solution storage upper tank can move to the flow guide assembly under the action of gravity and flow out of the flow guide assembly.

[0059] According to the technical scheme provided by the embodiment of the present disclosure, the electroplating device comprises a power supply, a liquid receiving tank, a flow guide unit, a flow guide moving unit and a circulating unit; the flow guide unit comprises a flow guide assembly, a sealing flange and a flow guide assembly cathode plate; the sealing flange comprises a flange overflow port, and the sealing flange is connected to the flow guide assembly; the flow guide assembly cathode plate is arranged in the flow guide assembly, and the flow guide assembly cathode plate is electrically connected to the power supply; the circulating unit is in communication with the flow guide assembly, and is used to move the solution from the liquid receiving tank to the flow guide assembly and make the solution flow out of the flow guide assembly; the flow guide moving unit is connected to the flow guide unit, and is used to move the flow guide unit, so that the flow guide assembly is inserted into the inner cavity of the plating part located above the liquid receiving tank from the inner cavity opening of the plating part, and the sealing flange is attached to the inner cavity opening, so that the solution in the inner cavity can flow out of the flange overflow port and into the liquid receiving tank. In this scheme, the plating part can be conveniently arranged in the horizontal direction, and the flow guide assembly can be inserted into the inner cavity of the plating part from the inner cavity opening of the plating part in the horizontal direction, and the solution used in electroplating can be introduced into the inner cavity of the plating part through the flow guide assembly, so that the inner cavity of the plating part can be electroplated after the power supply is turned on. The height of the electroplating device in the above scheme is not affected by the length of the plating part, that is, the height of the electroplating device can be relatively low, which does not restrict the height of the factory building, so that the purpose of automatically electroplating the inner cavity of the plating part in the factory building can be achieved, the electroplating cost is reduced, and the electroplating efficiency is improved.

[0060] In an implementation form of the present disclosure, as shown in Figure 1 the circulating unit 105 comprises a circulating pump 115, a solution storage tank 125 and a flow guide valve.

[0061] The liquid storage tank 125 is arranged below the liquid receiving tank 102, and the liquid receiving tank 102 includes a liquid receiving tank flow guide opening 112 arranged on the bottom surface thereof. The liquid storage tank 102 is in communication with the liquid receiving tank flow guide opening 112 through a flow guide valve.

[0062] The circulating pump 115 is in communication with the liquid storage tank 125, and is configured to move the solution from the liquid storage tank 125 to the flow guide assembly 106 and make the solution flow out of the flow guide assembly 106.

[0063] According to the technical scheme provided by the embodiment of the present disclosure, the circulating unit includes a circulating pump, a liquid storage tank, and a flow guide valve. The liquid storage tank is arranged below the liquid receiving tank, and the liquid receiving tank includes a liquid receiving tank flow guide opening arranged on the bottom surface thereof. The liquid storage tank is in communication with the liquid receiving tank flow guide opening through the flow guide valve. The circulating pump is in communication with the liquid storage tank and is configured to move the solution from the liquid storage tank to the flow guide assembly and make the solution flow out of the flow guide assembly. By opening the flow guide valve, the solution in the liquid receiving tank can flow into the liquid storage tank, so as to store the solution in the liquid storage tank. When electroplating is needed, the solution in the liquid storage tank can be moved from the liquid storage tank to the flow guide assembly by the circulating pump, and the solution can flow out of the flow guide assembly, so as to electroplate the inner cavity of the plated part. The above scheme can ensure that enough solution is provided during electroplating by storing the solution in the liquid storage tank without affecting the normal electroplating function.

[0064] In one embodiment of the present disclosure, the instantaneous flow rate of the solution flowing out of the flow guide assembly is greater than the instantaneous flow rate of the solution flowing out of the flange overflow opening.

[0065] In one embodiment of the present disclosure, by setting the cross-sectional area of the outlet for guiding the solution in the flow guide assembly and the cross-sectional area of the flange overflow opening, it can be ensured that the solution inside the inner cavity of the plated part maintains a continuous flow and a relatively full state during electroplating, and the solution can be in a laminar flow state, so that the electroplating effect on the inner cavity is better.

[0066] In one embodiment of the present disclosure, Figure 2 A schematic longitudinal sectional view of the sealing flange according to an embodiment of the present disclosure is shown. As shown, Figure 2 The flow guide unit further includes a sealing ring 110 made of an elastic material. One side of the sealing ring 110 abuts against the sealing flange 107, and the other side of the sealing ring 110 is configured to abut against the inner cavity opening end surface of the plated part when the flow guide assembly 106 is inserted into the inner cavity of the plated part.

[0067] According to the technical scheme provided by the embodiment of the present disclosure, by arranging the sealing ring, the sealing effect of the sealing flange on the inner cavity opening can be better, and the solution can be prevented from leaking out between the sealing flange and the inner cavity opening end surface of the plated part.

[0068] In an embodiment of the present disclosure, the sealing flange is provided with a terminal seat on the side away from the flow guide assembly, the terminal seat is electrically connected with the power supply, and the flow guide assembly electrode plate is electrically connected with the terminal seat.

[0069] According to the technical scheme provided by the embodiment of the present disclosure, by arranging the terminal seat and electrically connecting the flow guide assembly electrode plate with the power supply through the terminal seat, the maintenance is facilitated, and the user experience is improved.

[0070] In an embodiment of the present disclosure, Figure 3 A schematic longitudinal sectional view of a flow guide assembly according to an embodiment of the present disclosure is shown. As Figure 3 shown, the flow guide assembly 106 includes a flow guide assembly inner cavity 116, which is in communication with the circulating unit, and a plurality of through holes 126 are arranged on the inner wall of the flow guide assembly inner cavity 116, which are used to guide the solution in the flow guide assembly inner cavity 116 out

[0071] According to the technical scheme provided by the embodiment of the present disclosure, by making the solution in the flow guide assembly inner cavity flow out from the plurality of through holes on the inner wall of the flow guide assembly inner cavity, the concentration of the solution in different regions of the flow guide assembly inner cavity can be made more uniform, thereby improving the electroplating effect.

[0072] In an embodiment of the present disclosure, Figure 4 A schematic structural view of a plated part according to an embodiment of the present disclosure is shown. As Figure 4 shown, the electroplating device further includes a plated part inner cavity plugging assembly 203, which is arranged on the edge of the plated area of the inner cavity 202 and is used to close the inner cavity 202.

[0073] According to the technical scheme provided by the embodiment of the present disclosure, it is considered that in some scenarios, local electroplating is required inside the plated part inner cavity, that is, only the part from the edge of the plated area of the plated part inner cavity to the inner cavity opening is electroplated. In order to meet this requirement, the plated part inner cavity plugging assembly is arranged on the edge of the plated area of the plated part inner cavity, so that the plated part inner cavity plugging assembly can close the edge of the plated area of the plated part inner cavity, thereby forming a relatively closed space in the inner cavity when the inner cavity opening is closed by the sealing flange, so as to avoid the solution from entering the inner cavity which does not need to be electroplated, and to avoid pollution and waste of the inner cavity.

[0074] In an embodiment of the present disclosure, as Figure 1 shown, the electroplating device further includes a support and a moving device 111 arranged below the support;

[0075] The power supply, the liquid receiving groove 102, the flow guide moving unit 104, and the circulating unit 105 are fixed on the support and can move back and forth in the horizontal direction under the driving of the moving device.

[0076] According to the technical scheme provided by the embodiment of the present disclosure, the power supply, the liquid receiving groove, the flow guiding moving unit and the circulating unit can be conveniently moved by setting the supporting member and the moving device arranged below the supporting member.

[0077] In one embodiment of the present disclosure, as shown in Figure 1 The electroplating device further comprises a plating member height adjusting device 120 for adjusting the distance between the plating member 200 and the liquid receiving groove 102.

[0078] In one embodiment of the present disclosure, the plating member height adjusting device can comprise a telescopic rod, a lifting screw rod, a threaded rod, etc., and the present disclosure does not limit the same. The plating member height adjusting device can be provided with multiple ones according to the length of the plating member for stably supporting the plating member in the horizontal direction.

[0079] In one embodiment of the present disclosure, the plating member height adjusting device comprises a rotating assembly for driving the plating member to rotate in the radial direction during the electroplating process.

[0080] In one embodiment of the present disclosure, the rotating assembly can be arranged on the supporting surface of the plating member height adjusting device and used to contact the surface of the plating member so as to drive the plating member to rotate in the radial direction during the electroplating process. The structure of the rotating assembly can be, for example, a rotating bearing structure for driving the plating member to rotate through a rolling bearing or a sliding bearing, or can be a gear structure for driving the plating member to rotate through a driving motor driving a gear to rotate, and the present disclosure does not limit the specific structure of the rotating assembly.

[0081] According to the technical scheme provided by the embodiment of the present disclosure, the rotating assembly drives the plating member to rotate in the radial direction during the electroplating process, which can make the plating layer more uniform and avoid the situation that the local plating layer is too thick or too thin. In addition, the rotation of the plating member in the radial direction can also ensure that the plating area in the inner cavity of the plating member can be in contact with the solution, improve the coverage of the solution on the plating member, and further improve the electroplating quality.

[0082] In one embodiment of the present disclosure, a splash-proof device is arranged on the liquid receiving groove for preventing the solution from splashing out of the liquid receiving groove.

[0083] According to the technical scheme provided by the embodiment of the present disclosure, by arranging the splash-proof device for preventing the solution from splashing out of the liquid receiving groove, it can be ensured that the solution can flow smoothly into the liquid receiving groove after flowing out of the flange overflow port, the loss of the solution is reduced, the electroplating cost is reduced, and the workpiece outer surface can also be prevented from being contaminated.

[0084] In one embodiment of the present disclosure, the splash-proof device comprises a first splash-proof assembly and a second splash-proof assembly; the first splash-proof assembly is arranged on the inner wall of the liquid receiving groove, and the second splash-proof assembly is arranged on the outer wall of the liquid receiving groove.

[0085] Preferably, the first anti-splashing assembly comprises a plurality of air outlets.

[0086] And / or, the second anti-splashing assembly comprises a liquid receiving box and a brush, the liquid receiving box is arranged on the outer wall of the liquid receiving groove, and the brush is arranged on the side wall of the liquid receiving box close to one side of the liquid receiving groove.

[0087] In an implementation form of the present disclosure, the plurality of air outlets can be connected to a compressed air source through a compressed air flow channel, and the compressed air provided by the compressed air source is sprayed out of the air outlets through the flow channel and sprayed on the periphery of the plating area, forming an air curtain, which can prevent the solution from splashing to other areas outside the liquid receiving groove, help to reduce the loss of solution, and keep other areas outside the liquid receiving groove clean, reducing the cleaning work of the subsequent operator and improving the efficiency of electroplating.

[0088] In an implementation form of the present disclosure, the brush can make the splashed solution remain in the liquid receiving box, preventing the solution from splashing to other areas outside the liquid receiving groove,

[0089] According to the technical scheme provided by the embodiment of the present disclosure, by arranging the first anti-splashing assembly and the second anti-splashing assembly, the non-electroplating area of the plated part and other areas outside the liquid receiving groove can be protected, ensuring that the solution is effectively intercepted and collected, reducing the pollution caused by the splashing of the solution, and improving the efficiency and quality of electroplating.

[0090] Figure 5 A flow chart of a plating device control method according to an embodiment of the present disclosure is shown. The plating device control method is used to control any one of the plating devices in the embodiments of the present disclosure, such as Figure 5 As shown, the plating device control method comprises the following steps S101-S103:

[0091] In step S101, the position information of the plated part is acquired;

[0092] In step S102, when it is determined according to the position information that the plated part is located above the liquid receiving groove in the plating device, the flow guide moving unit in the plating device is controlled to move the flow guide unit in the plating device, so that the flow guide assembly in the flow guide unit is inserted into the inner cavity of the plated part from the inner cavity opening of the plated part, and the sealing flange in the flow guide unit closes the inner cavity opening;

[0093] In step S103, the circulating unit in the plating device is controlled to move the solution from the liquid receiving groove to the flow guide assembly, and make the solution flow out of the flow guide assembly.

[0094] According to the technical scheme provided by the embodiment of the present disclosure, the position information of the plating piece is acquired; when it is determined according to the position information that the plating piece is located above the liquid receiving groove in the electroplating device, the flow guide moving unit in the electroplating device is controlled to move the flow guide unit in the electroplating device, so that the flow guide assembly in the flow guide unit is inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece, and the sealing flange in the flow guide unit is used to close the inner cavity opening; the flow guide unit in the electroplating device is controlled to move the solution from the liquid receiving groove to the flow guide assembly, and the solution flows out from the flow guide assembly. In the above scheme, the plating piece can be conveniently arranged in the horizontal direction, and the flow guide assembly can be inserted into the inner cavity of the plating piece along the horizontal direction from the inner cavity opening of the plating piece, and the solution used in electroplating is introduced into the inner cavity of the plating piece through the flow guide assembly, so that the inner cavity of the plating piece can be electroplated after the power is turned on. The height of the electroplating device in the above scheme is not affected by the length of the plating piece, that is, the height of the electroplating device can be relatively low, which does not restrict the height of the factory building, thereby achieving the purpose of automatically electroplating the inner cavity of the plating piece in the factory building, reducing the electroplating cost, and improving the electroplating efficiency.

[0095] In an embodiment of the present disclosure, before acquiring the position information of the plating piece, the method further comprises:

[0096] The moving device in the electroplating device is controlled to move, so that the liquid receiving groove moves to the lower side of the plating piece.

[0097] According to the technical scheme provided by the embodiment of the present disclosure, by controlling the moving device in the electroplating device to move, the relative position of the plating piece and the liquid receiving groove can be conveniently adjusted, which is convenient for subsequent electroplating process, and improves the user experience.

[0098] The present disclosure also discloses an electronic device, Figure 6 A structural block diagram of an electronic device according to an embodiment of the present disclosure is shown.

[0099] As Figure 6 shown, the electronic device includes a memory and a processor, wherein the memory is used to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the method according to the embodiment of the present disclosure.

[0100] Figure 7 A structural schematic diagram of a computer system suitable for implementing the method according to the embodiment of the present disclosure is shown.

[0101] As Figure 7As shown, the computer system includes a processing unit that can execute the various methods described above in the embodiments. The processing unit can be a general -purpose central processing unit (CPU), processor in application specific integrated circuits (ASICs), or any other processor of device. The computer system also includes memory or other article to store data. The memory is a read-and-write memory device. The ROM is a read-only memory device that stores static data and instructions that are needed by the processing unit and other modules of the computer system. The permanent storage device, on the other hand, can be a read-and-write memory device that stores instructions and data that are needed by the processing unit for example. Like the memory, the permanent storage device can also be a read-and-write memory device; however, it is a durable good, such as a ROM, EPROM, EEPROM, or floppy disk for example. The working memory, the ROM, and the permanent storage device are examples of articles of manufacture.

[0102] Connected to the I / O interface are an input portion, including an input device such as a keyboard, mouse, etc.; an output portion, including a display device such as a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker; a storage portion, including a hard disk, etc.; and a communication portion, including a network interface card, a modem, etc. The communication portion performs communication processes via a network, such as the Internet. A drive is also connected to the I / O interface as needed. A removable media, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed in the drive as needed, so that a computer program read out from the removable media is installed in the storage portion as needed. The processing unit can be implemented as a CPU, a GPU, a TPU, a FPGA, a NPU, etc.

[0103] In particular, the methods described above can be implemented as a computer software program according to embodiments of the present disclosure. For example, embodiments of the present disclosure include a computer program product comprising a computer program tangibly embodied on a machine readable medium, the computer program containing program code for executing the methods described above. In such embodiments, the computer program can be downloaded and installed from a network via the communication portion, and / or installed from a removable media.

[0104] The flow and block diagrams in the drawings show possible architectures, functional and operational, for systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flow and block diagrams can represent a module, a segment, or a portion of code that comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may

[0105] The units or modules described in the embodiments of the present disclosure can be implemented in the form of software, or can be implemented in the form of programmable hardware. The described units or modules can also be arranged in a processor, and the name of the unit or module does not constitute a limitation on the unit or module itself in some cases.

[0106] As another aspect, the present disclosure also provides a computer readable storage medium, which can be the computer readable storage medium contained in the electronic device or computer system in the above embodiments; or can exist independently and not be assembled into the device. The computer readable storage medium stores one or more programs, which are used by one or more processors to execute the method described in the present disclosure.

[0107] The above description is merely preferred embodiments of the present disclosure and a description of the principles of the technology used. Those skilled in the art should understand that the scope of the application involved in the present disclosure is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by the arbitrary combinations of the above technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by the mutual replacement of the above features and the technical features disclosed in the present disclosure (but not limited to) having similar functions.

Claims

1. An electroplating apparatus characterized by comprising: The electroplating device comprises a power supply, a liquid receiving groove, a flow guiding unit, a flow guiding moving unit and a circulating unit. The flow guiding unit comprises a flow guiding assembly, a sealing flange and a flow guiding assembly polar plate; the sealing flange comprises a flange overflow port, and the sealing flange is connected with the flow guiding assembly; the flow guiding assembly polar plate is arranged in the flow guiding assembly, and the flow guiding assembly polar plate is electrically connected with the power supply; The circulating unit is in communication with the flow guiding assembly, and is used to move the solution from the liquid receiving groove to the flow guiding assembly, and make the solution flow out of the flow guiding assembly; The flow guiding moving unit is connected with the flow guiding unit, and is used to move the flow guiding unit, so that the flow guiding assembly is inserted into the inner cavity of the plating piece from the inner cavity opening of the plating piece above the liquid receiving groove, and the sealing flange is attached to the inner cavity opening, so that the solution in the inner cavity can flow out of the flange overflow port and into the liquid receiving groove; The electroplating device further comprises a plating piece inner cavity plugging assembly, which is arranged at the edge of the plating area of the inner cavity, and is used to close the inner cavity. The flow guiding assembly comprises a flow guiding assembly inner cavity, which is in communication with the circulating unit; a plurality of through holes are arranged on the inner wall of the flow guiding assembly inner cavity, and the through holes are used to guide the solution in the flow guiding assembly inner cavity out.

2. The electroplating apparatus of claim 1, wherein The circulating unit comprises a circulating pump, a liquid storage groove and a flow guiding valve; The liquid storage groove is arranged below the liquid receiving groove; the liquid receiving groove comprises a liquid receiving groove flow guiding port arranged on the bottom surface thereof; the liquid storage groove is in communication with the liquid receiving groove flow guiding port through the flow guiding valve; The circulating pump is in communication with the liquid storage groove, and is used to move the solution from the liquid storage groove to the flow guiding assembly, and make the solution flow out of the flow guiding assembly.

3. The electroplating apparatus of claim 1, wherein The instantaneous flow rate of the solution flowing out of the flow guiding assembly is greater than the instantaneous flow rate of the solution flowing out of the flange overflow port.

4. The electroplating apparatus of claim 1, wherein The flow guiding unit further comprises a sealing ring composed of elastic material; one side of the sealing ring is in abutment with the sealing flange, and the other side of the sealing ring is used to abut against the inner cavity opening end surface of the plating piece when the flow guiding assembly is inserted into the inner cavity of the plating piece.

5. The electroplating apparatus of claim 1, wherein The side of the sealing flange away from the flow guiding assembly is provided with a terminal seat, the terminal seat is electrically connected with the power supply, and the flow guiding assembly polar plate is electrically connected with the terminal seat.

6. The electroplating apparatus of any one of claims 1-5, wherein, The electroplating device further comprises a support and a moving device arranged below the support; The power supply, the liquid receiving groove, the flow guiding moving unit and the circulating unit are fixed on the support, and can move back and forth in the horizontal direction under the driving of the moving device.

7. The electroplating apparatus of any one of claims 1-5, wherein, The electroplating device further comprises a plating piece height adjusting device, which is used to adjust the distance between the plating piece and the liquid receiving groove.

8. The electroplating apparatus of claim 7, wherein The plating piece height adjusting device comprises a rotating assembly, which is used to drive the plating piece to rotate in the radial direction during electroplating.

9. The electroplating apparatus of any one of claims 1-5, wherein, A splash-proof device is arranged on the liquid receiving groove, and is used to prevent the solution from splashing out of the liquid receiving groove.

10. The electroplating apparatus of claim 9, wherein The splash-proof device comprises a first splash-proof assembly and a second splash-proof assembly; the first splash-proof assembly is arranged on the inner wall of the liquid receiving groove, and the second splash-proof assembly is arranged on the outer wall of the liquid receiving groove.

11. The electroplating apparatus of claim 10, wherein The first splash-proof assembly comprises a plurality of air injection ports; And / or, the second splash-proof assembly comprises a liquid receiving box and a brush, the liquid receiving box is arranged on the outer wall of the liquid receiving groove, and the brush is arranged on the side wall of the liquid receiving box close to one side of the liquid receiving groove.

12. A plating apparatus control method characterized by comprising: The method is used for controlling the electroplating device of any one of claims 1-6, comprising: acquiring position information of the plated part; when it is determined according to the position information that the plated part is located above the liquid receiving groove in the electroplating device, controlling a flow guiding moving unit in the electroplating device to move a flow guiding unit in the electroplating device, so that a flow guiding assembly in the flow guiding unit is inserted into an inner cavity of the plated part from an inner cavity opening of the plated part, and a sealing flange in the flow guiding unit closes the inner cavity opening; controlling a circulating unit in the electroplating device to move solution from the liquid receiving groove to the flow guiding assembly, and make the solution flow out from the flow guiding assembly.

13. The method of claim 12, wherein, Before the acquiring position information of the plated part, the method further comprises: controlling a moving device in the electroplating device to move, so that the liquid receiving groove moves to below the plated part.

14. An electronic device, comprising: comprising a memory and a processor; wherein the memory is used to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the method steps of claim 12 or 13.

15. A computer readable storage medium having stored thereon computer instructions, wherein, The computer instructions are executed by the processor to implement the method steps of claim 12 or 13.

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