A micro-physics system suitable for manufacturing chip-scale atomic clocks

Abstract

The present application relates to the field of atomic clock manufacturing technology, specifically, to a micro-physical system suitable for chip-level atomic clock manufacturing, including a packaging component, a light source component, a micro-gas chamber component and a light detection component, wherein: the packaging component includes a getter, a ceramic cover and a ceramic seat; the light source component is located directly above the ceramic seat; the micro-gas chamber component is arranged directly above the light source component and is located at the center of the closed chamber; the light detection component is arranged directly above the micro-gas chamber component; the light detection component and the light source component are upper and lower buckled structures, which together cover the micro-gas chamber component in the middle. The various components inside the present application adopt a modular design and can be directly assembled by automated assembly equipment. The structure is simple, the manual assembly links are reduced, the production efficiency and consistency are improved, and the low-cost and batch manufacturing of chip-level atomic clock products is realized.

Description

Technical Field

[0001] The present application relates to the technical field of atomic clock manufacturing, and in particular to a micro-physical system suitable for chip-level atomic clock manufacturing. Background Art

[0002] An atomic clock is a timing tool that counts atomic seconds. It is currently the most accurate and stable timing tool in the world. It is widely used in time synchronization, navigation and positioning, missile and satellite positioning, astronomical observation, communication, network synchronization, geodesy, precision instrument calibration, power grid regulation, and high-speed traffic management. It plays an important role in social production, scientific research, and the military.

[0003] With the development of communication technology, the diversification of data communication applications, and the rapid advancement of science and technology, the amount of data transmitted has increased, and data transmission rates have accelerated. Time and frequency applications are moving towards mobility, which has also put forward requirements for atomic clocks to be miniaturized, low-power, and suitable for mobile application scenarios such as airborne, vehicle-mounted, and missile-mounted. Therefore, chip-scale atomic clocks will break through the limitations of size, power consumption, and price, and will also improve frequency stability and accuracy. They are particularly suitable for the use of high-precision frequency sources in devices with limited size and power consumption. They have huge application prospects in many fields such as aviation, aerospace, navigation and positioning, communications, and information detection.

[0004] Although the prototype of chip-level atomic clocks has been developed in China, due to various factors such as different design schemes and manufacturing processes, the manufacturing cost of the products is high, the production cycle is long, and the consistency is poor. So far, no chip-level atomic clock products that can be mass-produced and low-cost have been launched. Summary of the Invention

[0005] The present application provides a micro-physical system suitable for chip-level atomic clock manufacturing, which adopts modular components and can realize low-cost batch manufacturing of atomic clock products.

[0006] In order to achieve the above-mentioned purpose, the present application provides a micro-physical system suitable for the manufacture of chip-level atomic clocks, including a packaging component, a light source component, a micro-gas chamber component and a light detection component, wherein: the packaging component includes a getter, a ceramic cover and a ceramic seat, the ceramic cover is buckled on the top of the ceramic seat, forming a closed chamber inside, and the getter is fixed on the inner wall of the top of the ceramic cover; the light source component, the micro-gas chamber component and the light detection component are all arranged inside the closed chamber; the light source component is located directly above the ceramic seat; the micro-gas chamber component is arranged directly above the light source component and is located at the center of the closed chamber; the light detection component is arranged directly above the micro-gas chamber component; the light detection component and the light source component are a top-bottom buckled structure, which together cover the micro-gas chamber component in the middle.

[0007] Furthermore, the ceramic seat as a whole has a stepped groove structure.

[0008] Furthermore, the light source assembly includes a laser element, a first thermal insulation ring, a first support ring and a first conductive suspension, wherein: the first conductive suspension is integrally mounted directly above the stepped groove of the ceramic seat; the first thermal insulation ring is fixedly arranged on the upper surface of the first conductive suspension; the first support ring is fixedly arranged on the upper surface of the first thermal insulation ring; the laser element is arranged in the middle position of the upper surface of the first conductive suspension, and is integrally located in the middle position of the annular structure of the first thermal insulation ring and the first support ring.

[0009] Furthermore, the optical detection component includes an optical detection element, a second thermal insulation ring, a second support ring and a second conductive suspension, wherein: the second support ring is fixedly arranged above the first support ring, and is arranged opposite to the first support ring; the second thermal insulation ring is fixedly arranged on the upper surface of the second support ring; the second conductive suspension as a whole covers the upper surface of the second thermal insulation ring; the optical detection element is arranged in the middle position of the lower surface of the second conductive suspension, and is located as a whole in the middle position of the annular structure of the second thermal insulation ring and the second support ring; the optical detection element is arranged opposite to the laser element.

[0010] Furthermore, a micro gas chamber assembly is arranged between the optical detection element and the laser element, including a 1 / 4 wave plate, an air chamber fixing seat and an atomic gas chamber, wherein: the upper end of the air chamber fixing seat is connected to the optical detection element, and the lower end is connected to the laser element, and is divided into a first fixing seat and a second fixing seat; the 1 / 4 wave plate and the atomic gas chamber are both arranged inside the air chamber fixing seat; the 1 / 4 wave plate is arranged at the bottom, above the laser element; the atomic gas chamber is arranged as a whole between the 1 / 4 wave plate and the optical detection element.

[0011] Furthermore, the materials of the first conductive suspension and the second conductive suspension are both ultra-thin flexible copper-clad polyimide materials.

[0012] Furthermore, the first support ring, the second support ring and the air chamber fixing seat are all manufactured by a metal precision casting process.

[0013] The present invention provides a micro-physical system suitable for manufacturing chip-level atomic clocks, which has the following beneficial effects:

[0014] The various components within this application adopt a modular design and can be assembled directly through automated assembly equipment. They have a simple structure, reduce manual assembly steps, improve production efficiency and consistency, and realize low-cost, mass-produced manufacturing of chip-level atomic clock products; moreover, the electrical connections of the light source components and light detection components within the system are all achieved through ultra-thin flexible copper-clad polyimide materials using chemical etching methods, avoiding the high-cost manufacturing process of using a coating method to plate a metal conductive layer on a polyimide film, thereby reducing the overall production difficulty and cost investment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings that constitute part of this application are used to provide a further understanding of this application and make other features, objects and advantages of this application more apparent. The illustrative embodiment drawings of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application. In the drawings:

[0016] Figure 1 This is a schematic structural diagram of a micro-physical system suitable for manufacturing a chip-scale atomic clock according to an embodiment of the present application;

[0017] Figure 2 is a schematic diagram of a packaging assembly provided according to an embodiment of the present application;

[0018] In the figure: 1-packaging assembly, 11-ceramic seat, 12-ceramic cover, 13-getter, 2-light source assembly, 21-laser element, 22-first thermal insulation ring, 23-first support ring, 24-first conductive suspension, 3-micro gas chamber assembly, 31-1 / 4 wave plate, 32-gas chamber fixing seat, 33-atomic gas chamber, 4-light detection assembly, 41-light detection element, 42-second thermal insulation ring, 43-second support ring, 44-second conductive suspension. DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0020] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0021] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0022] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0023] Additionally, the term "plurality" shall mean two or more.

[0024] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] like Figure 1-Figure 2 As shown, the present application provides a micro-physical system suitable for manufacturing chip-level atomic clocks, including a packaging component 1, a light source component 2, a micro-gas chamber component 3 and a light detection component 4, wherein: the packaging component 1 includes a desiccant 13, a ceramic cover 12 and a ceramic seat 11, the ceramic cover 12 is buckled on top of the ceramic seat 11, forming a closed chamber inside, and the desiccant 13 is fixed on the inner wall of the top of the ceramic cover 12; the light source component 2, the micro-gas chamber component 3 and the light detection component 4 are all arranged inside the closed chamber; the light source component 2 is located directly above the ceramic seat 11; the micro-gas chamber component 3 is arranged directly above the light source component 2 and is located at the center of the closed chamber; the light detection component 4 is arranged directly above the micro-gas chamber component 3; the light detection component 4 and the light source component 2 are a top-to-bottom buckled structure, which together cover the micro-gas chamber component 3 in the middle.

[0026] Specifically, a chip-level atomic clock mainly consists of two parts: a micro-physical system and a circuit system. Whether the micro-physical system can be manufactured at low cost and in batches is the most important factor restricting the batch and low-cost production of chip-level atomic clock products. It is also an important factor restricting whether chip-level atomic clocks can be more widely used. Whether the various components inside the micro-physical system can be modularly assembled, adopt low-cost manufacturing processes, and realize the manufacture of the physical system through automated assembly equipment is crucial to the future application market of chip-level atomic clock products. At present, in the manufacture of micro-physical systems of similar domestic products, key components generally adopt high-investment manufacturing process methods. At the same time, the various components inside the physical system are not modularized, resulting in complex assembly processes of the physical system, high costs, poor consistency, and difficulty in achieving batch production. The micro-physical system suitable for chip-level atomic clock manufacturing provided in the embodiment of the present application has modularized the structures of various components inside the system. The modular structural components can achieve large-scale batch production. Subsequently, the various modular structural components are directly assembled through automated equipment to achieve batch and low-cost manufacturing of chip-level atomic clock products, greatly improving production efficiency and consistency.Among them, the micro-physical system as a whole is divided into four modular structural components: packaging component 1, light source component 2, micro-air chamber component 3 and light detection component 4; packaging component 1 is mainly used for sealing the internal part of the overall system, and the ceramic seat 11 is set at the bottom, mainly used for supporting and installing each module, and conductive pins are set at the bottom of the ceramic seat 11 to electrically connect the electronic circuits of the internal components of the physical system with the external circuit system circuits; the ceramic cover 12 is integrally fastened on the ceramic seat 11 to form a closed chamber inside it to ensure the airtightness of the system; the getter 13 is fixedly installed on the top of the ceramic cover 12, mainly used to adsorb the gas released by the material in the closed chamber to maintain the vacuum environment inside the chamber. The internal components of the micro-physical system must work in a vacuum environment, so the packaging component 1 must complete the sealing welding in a vacuum environment to provide a vacuum environment for the components inside the physical system, and the getter 13 is between the ceramic cover 12 and the ceramic seat 11 It is activated by high temperature before sealing, and when the sealing is completed, the adsorption function of the getter 13 is used to enable the closed chamber to maintain a stable vacuum environment when the internal components of the physical system are working; the light source component 2 is located in the lower half of the closed chamber as a whole, and mainly provides a stable and reliable light source for the physical system; the light detection component 4 is located in the upper half of the closed chamber as a whole, and is mainly used to convert the detected light signal into an electrical signal and output it to the circuit system of the atomic clock; the light detection component 4 and the light source component 2 are arranged relative to each other up and down, and are generally the same in size and shape, with a symmetrical structure, and can be buckled together as a whole to wrap the micro-chamber component 3 in the middle position inside it, so as to support and protect the micro-chamber component 3; the micro-chamber component 3 is mainly used to convert the linearly polarized light emitted by the laser element 21 into circularly polarized light. After the circularly polarized light interacts with the alkali metal atom gas chamber 33 filled with buffer gas, a CPT phenomenon is generated to obtain the frequency discrimination signal required for atomic clock locking.

[0027] Furthermore, the ceramic base 11 has a stepped groove structure. The stepped groove on the inner upper surface of the ceramic base 11 is mainly designed to facilitate assembly with the light source assembly 2. In addition, the bottom groove of the stepped shape forms a vacuum insulation groove after vacuum packaging, which reduces the contact surface between the micro-air chamber assembly 3 and the ceramic base 11, further reducing heat conduction, thereby reducing the heating power consumption of the physical system and improving temperature stability.

[0028] Furthermore, the light source assembly 2 includes a laser element 21, a first thermal insulation ring 22, a first support ring 23 and a first conductive suspension 24, wherein: the first conductive suspension 24 is integrally mounted directly above the stepped groove of the ceramic seat 11; the first thermal insulation ring 22 is fixedly arranged on the upper surface of the first conductive suspension 24; the first support ring 23 is fixedly arranged on the upper surface of the first thermal insulation ring 22; the laser element 21 is arranged in the middle position of the upper surface of the first conductive suspension 24, and is integrally located in the middle position of the annular structure of the first thermal insulation ring 22 and the first support ring 23. The laser element 21 is mainly used to output stable linearly polarized light; the first conductive suspension 24 is mainly used for the electrical connection of the laser element 21, connecting the electrical interface of the laser element 21 to the ceramic base 11 through the conductive suspension, and then connecting to the external circuit system through the electrical interface of the ceramic base 11 to complete the transmission of electrical signals; the first thermal insulation ring 22 and the first conductive suspension 24 are fixed by soldering. On the one hand, the first thermal insulation ring 22 serves as a support structure for the first conductive suspension 24, and on the other hand, it can reduce the heat conduction between the light source assembly 2 and the outside world; the first support ring 23 is mainly used to support and protect the laser element 21 in the internal center.

[0029] Furthermore, the optical detection component 4 includes an optical detection element 41, a second thermal insulation ring 42, a second support ring 43 and a second conductive suspension 44, wherein: the second support ring 43 is fixedly arranged above the first support ring 23, and is arranged opposite to the first support ring 23; the second thermal insulation ring 42 is fixedly arranged on the upper surface of the second support ring 43; the second conductive suspension 44 is entirely covered on the upper surface of the second thermal insulation ring 42; the optical detection element 41 is arranged in the middle position of the lower surface of the second conductive suspension 44, and is located as a whole in the middle position of the annular structure of the second thermal insulation ring 42 and the second support ring 43; the optical detection element 41 is arranged opposite to the laser element 21. The second support ring 43 is bonded and fixed above the first support ring 23; the optical detection element 41 is mainly used to detect changes in the optical signal transmitted through the atomic gas chamber 33, convert the optical signal into an electrical signal and input it into the control circuit system of the atomic clock, and finally lock the atomic clock through the control circuit system; the second conductive suspension 44 is mainly used for the electrical connection of the optical detection element 41, and the electrical interface of the optical detection element 41 is connected to the groove of the ceramic seat 11 through the conductive suspension / bonding gold wire, and then connected to the external circuit system through the electrical interface of the ceramic seat 11 to complete the transmission of the electrical signal; the second thermal insulation ring 42 and the second conductive suspension 44 are fixed by soldering. On the one hand, the second thermal insulation ring 42 serves as the support structure of the second conductive suspension 24, and on the other hand, it can reduce the heat conduction between the micro gas chamber assembly 3 and the outside world, and reduce the temperature sensitivity of the micro gas chamber assembly 3; the second support ring 43 is mainly used to support and protect the optical detection element 41 in the internal center.

[0030] Furthermore, the micro gas chamber assembly 3 is arranged between the optical detection element 41 and the laser element 21, including a 1 / 4 wave plate 31, an air chamber fixing seat 32 and an atomic gas chamber 33, wherein: the upper end of the air chamber fixing seat 32 is connected to the optical detection element 41, and the lower end is connected to the laser element 21, and is divided into a first fixing seat and a second fixing seat; the 1 / 4 wave plate 31 and the atomic gas chamber 33 are both arranged inside the air chamber fixing seat 32; the 1 / 4 wave plate 31 is arranged at the bottom, above the laser element 21; the atomic gas chamber 33 is arranged as a whole between the 1 / 4 wave plate 31 and the optical detection element 41. The gas chamber fixing seat 32 is mainly used to support and protect the internal atomic gas chamber 33. The upper and lower ends are respectively bonded and fixed to the light detection element 41 and the laser element 21. It includes a first fixing seat and a second fixing seat. The atomic gas chamber 33 and a 1 / 4 wave plate 31 are arranged inside the space formed by the first fixing seat, the second fixing seat, the light detection element 42 and the laser element 21; the 1 / 4 wave plate 31 is mainly used to convert the linearly polarized light emitted by the laser element 21 into circularly polarized light. Only when circularly polarized light acts on atoms will the CPT phenomenon occur; the atomic gas chamber 33 is filled with a certain proportion of buffer gas and alkali metal, which is mainly used to provide alkali metal atomic vapor that reacts with light. When the coherent laser irradiates the atomic gas chamber 33, the gaseous atoms inside the gas chamber will produce the CPT phenomenon under the action of laser of appropriate wavelength, providing a frequency discrimination signal for atomic clock locking.

[0031] More specifically, in the embodiment of the present application, by providing the first support ring 23 and the second support ring 43 and providing the air chamber fixing seat 32, the atomic air chamber 33 can be provided with dual support and protection, the support performance is significantly improved, the atomic air chamber 33 can be well fixed, and the influence of external vibration on the atomic air chamber 33 can be minimized. The atomic air chamber 33 contacts the air chamber fixing seat 32 on the left and right, and contacts the light source assembly 2 and the light detection assembly 4 on the top and bottom respectively; when the whole assembly is assembled, that is, when the upper light detection assembly 4 is buckled and covered with the lower light source assembly 2, the edges of the second conductive suspension 44 and the first conductive suspension 24 will be tightly closed, so that the second support ring 43 and the first support ring 23 will be pressed inwardly, and the air chamber fixing seat 32 is generally made of non-rigid material, so that the air chamber fixing seat 32 will produce a slight deformation under the action of pressure, thereby achieving elastic support for the internal atomic air chamber 33, which can greatly improve the reliability of the system and the adaptability to the mechanical environment.

[0032] Furthermore, the first conductive suspension 24 and the second conductive suspension 44 are both made of an ultra-thin, flexible, copper-clad polyimide material. The electrical connection between the light source assembly 2 and the light detection assembly 4 is achieved through the conductive suspension, which is preferably made of an ultra-thin, flexible, copper-clad polyimide material. This material offers consistent manufacturing, low cost, and ease of mass production. It avoids the complex manufacturing process of coating a polyimide film with a metal conductive layer using a coating method, facilitating integration with subsequent automated assembly processes.

[0033] Furthermore, the first support ring 23, the second support ring 43, and the air chamber fixing seat 32 are all manufactured using a metal precision casting process. Compared to traditional precision machining methods, the use of metal precision casting to manufacture the first support ring 23, the second support ring 43, and the air chamber fixing seat 32 has the advantages of low cost, high efficiency, good consistency, and ease of mass production.

[0034] More specifically, the embodiments of the present application mainly improve the internal structure of the chip-level atomic clock micro-physical system. The internal components adopt a modular design and can be directly assembled through automated assembly equipment. The structure is simple, the manual assembly process is reduced, the production efficiency and consistency are improved, and the low-cost and mass-produced manufacturing of chip-level atomic clock products is realized.

[0035] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A micro-physical system suitable for manufacturing chip-scale atomic clocks, characterized in that: It includes a packaging component, a light source component, a micro gas chamber component and a light detection component, wherein: The packaging assembly includes a getter, a ceramic cover and a ceramic base, wherein the ceramic cover is buckled on top of the ceramic base to form a closed chamber inside, and the getter is fixed on the inner wall of the top of the ceramic cover; The light source assembly, the micro air chamber assembly and the light detection assembly are all arranged inside the closed chamber; The light source assembly is located directly above the ceramic base; The micro air chamber assembly is arranged directly above the light source assembly and is located at the center of the closed chamber; The light detection component is arranged directly above the micro air chamber component; The light detection assembly and the light source assembly are in a buckled structure, and together they wrap the micro air chamber assembly in the middle; The light source assembly includes a laser element, a first thermal insulation ring, a first support ring, and a first conductive suspension, wherein: The first conductive suspension is integrally mounted directly above the stepped groove of the ceramic base; The first thermal insulation ring is fixedly arranged on the upper surface of the first conductive suspension; The first support ring is fixedly arranged on the upper surface of the first thermal insulation ring; The laser element is arranged in the middle position of the upper surface of the first conductive suspension, and is located as a whole in the middle position of the annular structure of the first thermal insulation ring and the first support ring; The optical detection assembly includes an optical detection element, a second thermal insulation ring, a second support ring, and a second conductive suspension, wherein: The second support ring is fixedly arranged above the first support ring and is arranged opposite to the first support ring; The second heat-insulating ring is fixedly arranged on the upper surface of the second supporting ring; The second conductive suspension entirely covers the upper surface of the second thermal insulation ring; The optical detection element is arranged at a middle position of the lower surface of the second conductive suspension, and is located as a whole at a middle position of the annular structure of the second thermal insulation ring and the second support ring; The optical detection element is arranged opposite to the laser element; The micro gas cell assembly is arranged between the optical detection element and the laser element, and includes a quarter wave plate, a gas cell fixing seat and an atomic gas cell, wherein: The upper end of the air chamber fixing seat is connected to the optical detection element, and the lower end is connected to the laser element, and is divided into a first fixing seat and a second fixing seat; The 1 / 4 wave plate and the atomic gas cell are both arranged inside the gas cell fixing seat; The quarter wave plate is arranged at the bottom, above the laser element; The atomic gas chamber is entirely arranged between the 1 / 4 wave plate and the optical detection element.

2. The micro-physical system suitable for manufacturing chip-scale atomic clocks according to claim 1, characterized in that: The ceramic seat as a whole is a stepped groove structure.

3. The micro-physical system suitable for manufacturing chip-scale atomic clocks according to claim 2, characterized in that: The first conductive suspension and the second conductive suspension are both made of ultra-thin flexible copper-clad polyimide material.

4. The micro-physical system suitable for manufacturing chip-scale atomic clocks according to claim 3, characterized in that: The first support ring, the second support ring and the air chamber fixing seat are all manufactured by a metal precision casting process.

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