Optoelectronic co-packaged module for optical transmission

Abstract

The present application relates to a kind of photoelectricity co-encapsulation module for optical transmission, the photoelectricity co-encapsulation module (100) is arranged in optical fiber transmission bus (10), each photoelectricity co-encapsulation module (100) is connected between the optical fiber transmission bus (10) and a node terminal (20), the photoelectricity co-encapsulation module (100) includes upstream signal processing part (110) and downstream signal processing part (120), the upstream signal processing part (110) includes upstream optical signal receiver (111), upstream signal conversion amplification module (112), electrical signal replication module (113) and upstream optical signal transmitter (114), the downstream signal processing part (120) includes downstream optical signal receiver (121), downstream signal conversion amplification module (122), electrical signal superposition module (123) and downstream optical signal transmitter (124).

Description

Technical Field

[0001] This invention relates to an optoelectronic co-packaged module, and more particularly to an optoelectronic co-packaged module for switching between optical signals and electrical signals in an optical transmission system. Background Technology

[0002] As is well known, optical transmission is a technology that transmits optical signals between a sender and a receiver. Its main advantages include long transmission distance, high transmission efficiency, high transmission quality, strong anti-interference capability, and large transmission capacity. For example... Figure 1 As shown, in the prior art, the central control device 1 and the terminal device 2, as well as the terminal devices 2 and each other, are generally connected by electrical signal transmission wires 3. During operation, the electrical signal transmission wires 3 connect the various devices to transmit electrical signals. In practice, the electrical signal transmission wires 3 are made of metal wires, such as copper wires. However, when using the above signal transmission method for current industrial products, the specific application effects are far from ideal, as described below.

[0003] In the field of new energy electric vehicles, the most important component of an electric vehicle is the battery pack, which consists of several individual batteries. To simultaneously monitor the voltage, current, and physicochemical state of each battery, a battery management system (BMS) is required. Similarly, to achieve maximum efficiency from the battery pack, all batteries should be fully charged and discharged simultaneously at the same voltage, which also necessitates the involvement of the battery management system. Figure 2 The diagram shows the schematic of a battery management system. The system mainly includes a main controller 1a and several battery monitoring modules 2a, each corresponding to a battery 4a. Numerous signal transmission wires 3a connect the main controller 1a and the battery monitoring modules 2a. These wires are used for real-time electrical signal transmission between the main controller 1a and the battery monitoring modules 2a. Since the signal transmission wires 3a are generally made of copper wire, a large number of shielding structures are needed around them to isolate electromagnetic interference. However, this extensive shielding presents two main problems: first, it significantly increases the weight of the battery management system, thereby greatly increasing the vehicle's weight and energy consumption during operation; second, because the signal transmission wires 3a and the shielding structures are mostly made of copper, it significantly increases the overall material cost of the product.

[0004] like Figure 3As shown, in the field of intelligent robots, taking the hand of an intelligent robot as an example, to achieve a flexible hand, the intelligent robot's hand needs to mimic the human hand, consisting of five fingers, each with several finger joints 4b. To control each finger joint 4b and monitor its working status, each finger joint 4b needs to be connected to a monitoring module 2b. In practice, to coordinate the overall movement of each finger joint 4b, each monitoring module 2b needs to be connected to the hand's main controller 1b via signal wires 3b. Since signal wires 3b are generally made of copper wire, when a large number of signal wires 3b are placed in the intelligent robot's hand, it will greatly increase the overall weight of the hand. Looking at the entire intelligent robot, it needs to be composed of tens of thousands of node devices. Implementing the above signal transmission method, due to the need to set up a large number of signal wires 3b, the overall weight of the intelligent robot generally needs to increase several times, and at the same time, it will significantly increase the robot's manufacturing cost.

[0005] like Figure 4 As shown, to overcome the aforementioned shortcomings, some fields have adopted a method of replacing signal wires with optical fibers for signal transmission. The setup involves connecting several terminal node devices 2c to a main optical fiber 1c. Each terminal node device 2c contains an optical receiver and an optical transmitter. The optical transmitter is connected to an optical coupler in the main optical fiber 1c, while the optical receiver is connected to an optical splitter in the main optical fiber 1c, enabling communication between the multiple terminal node devices 2c and the main optical fiber 1c. This signal transmission method effectively replaces traditional signal wires with optical fibers, achieving weight reduction and electromagnetic interference isolation. However, in practical applications, the signal transmission effect is not ideal. In the field of optoelectronics, optical couplers and optical splitters are optical devices. While the above method theoretically enables the mutual transmission and reception of optical signals, it is practically impossible to implement. This is because each stage of optical transmission through an optical coupler or optical splitter results in optical power attenuation. After excessive attenuation, the distant terminal node device 2c often fails to receive the optical signal from the main optical fiber 1c, thus affecting its use. As mentioned above, these are the main drawbacks of the existing technology. Summary of the Invention

[0006] The technical solution adopted in this invention is as follows: an optoelectronic co-encapsulation module for optical transmission, characterized in that: the optoelectronic co-encapsulation module (100) is disposed in an optical fiber transmission bus (10), the bus optical signal (S) is transmitted in the optical fiber transmission bus (10), the bus optical signal (S) includes an uplink optical signal (S1) and a downlink optical signal (S2), the optical fiber transmission bus (10) is provided with several signal transmission nodes (11), each of the signal transmission nodes (11) is provided with an optoelectronic co-encapsulation module (100), each optoelectronic co-encapsulation module (100) is connected between the optical fiber transmission bus (10) and a node terminal (20), the optoelectronic co-encapsulation module (100) includes an uplink signal processing part (110) and a downlink signal processing part (120), in the optoelectronic co-encapsulation module (100) In the uplink optical signal (S1), the uplink optical signal is transmitted through the uplink signal processing section (110). In the optoelectronic co-package module (100), the downlink optical signal (S2) is transmitted through the downlink signal processing section (120). The uplink signal processing section (110) includes an uplink optical signal receiver (111), an uplink signal conversion and amplification module (112), an electrical signal replication module (113), and an uplink optical signal transmitter (114). The downlink signal processing section (120) includes a downlink optical signal receiver (121), a downlink signal conversion and amplification module (122), an electrical signal superposition module (123), and a downlink optical signal transmitter (124). The uplink signal processing section (110) and the downlink signal processing section (120) are both encapsulated in the optoelectronic co-package module (100).

[0007] The beneficial effects of this invention are as follows: First, by using the optoelectronic co-packaged module (100) and the optical fiber transmission bus (10) to replace the electrical signal transmission wires between node terminal devices in the prior art, and transmitting data information in the form of optical signals, this invention has the advantages of high transmission efficiency, high transmission quality, strong anti-interference ability, and large transmission capacity. Second, by using the optoelectronic co-packaged module (100) and the optical fiber transmission bus (10) to replace the electrical signal transmission wires between node terminal devices in the prior art, and transmitting data information in the form of optical signals, this invention can greatly reduce the physical weight of the signal transmission part, especially in the field of intelligent robots. Furthermore, this invention utilizes the optoelectronic co-encapsulation module (100) and the optical fiber transmission bus (10) to replace the electrical signal transmission wires between node terminal devices in the prior art, and transmits data information in the form of optical signals. This avoids electromagnetic interference and eliminates all electromagnetic shielding structures in the information transmission part of the prior art. In addition, this invention utilizes the optoelectronic co-encapsulation module (100) to perform optoelectronic signal conversion, replication, and superposition between the optical fiber transmission bus (10) and the node terminal (20), which can avoid optical signal attenuation in the optical fiber transmission bus (10). Theoretically, the technology of this invention can support the access of an unlimited number of node terminals (20). Attached Figure Description

[0008] Figure 1 This is a schematic diagram of signal transmission via electrical signal transmission wires in the prior art.

[0009] Figure 2 This is a schematic diagram of signal transmission via signal transmission wires in existing new energy electric vehicles.

[0010] Figure 3 This is a schematic diagram of how intelligent robot hands transmit signals via signal wires in existing technologies.

[0011] Figure 4 This is a schematic diagram of signal transmission via optical fiber in existing technology.

[0012] Figure 5 This is a connection diagram of the photoelectric signal switching module of the present invention.

[0013] Figure 6 This is a schematic diagram of the photoelectric signal switching module of the present invention.

[0014] Figure 7 This is a schematic diagram of the internal components of the photoelectric signal switching module of the present invention.

[0015] Figure 8 This is a schematic diagram of the Y-shaped silicon substrate in the electrical signal replication module of the present invention.

[0016] Figure 9This is a schematic diagram of the Y-shaped silicon substrate in the electrical signal superposition module of the present invention.

[0017] Figure 10 This is a schematic diagram of the uplink comparison error corrector of the present invention.

[0018] Figure 11 This is a schematic diagram illustrating the working principle of the uplink comparison error corrector of the present invention.

[0019] Figure 12 This is a schematic diagram of the downlink comparison error corrector of the present invention.

[0020] Figure 13 This is a schematic diagram illustrating the working principle of the downlink comparison error corrector of the present invention.

[0021] Figure 14 This is a schematic diagram of one embodiment of the photoelectric signal switching module of the present invention.

[0022] Figure 15 This is a schematic diagram of Embodiment 2 of the photoelectric signal switching module of the present invention.

[0023] Figure 16 This is an exploded view of Embodiment 2 of the photoelectric signal switching module of the present invention.

[0024] Figure 17 This is a connection diagram of Embodiment 3 of the photoelectric signal switching module of the present invention.

[0025] Figure 18 This is an exploded view of Embodiment 3 of the photoelectric signal switching module of the present invention.

[0026] Figure 19 This is a three-dimensional schematic diagram of a third embodiment of the photoelectric signal switching module of the present invention.

[0027] Figure 20 This is another three-dimensional schematic diagram of Embodiment 3 of the photoelectric signal switching module of the present invention. Detailed Implementation

[0028] like Figures 5 to 20 As shown, an optoelectronic co-encapsulation module (100) for optical transmission is provided in an optical fiber transmission bus (10). The bus optical signal (S) is transmitted in the optical fiber transmission bus (10). The bus optical signal (S) includes an uplink optical signal (S1) and a downlink optical signal (S2). The optical fiber transmission bus (10) is provided with several signal transmission nodes (11). Each of the signal transmission nodes (11) is provided with an optoelectronic co-encapsulation module (100). Each optoelectronic co-encapsulation module (100) is connected between the optical fiber transmission bus (10) and a node terminal (20).

[0029] The optoelectronic co-package module (100) includes an uplink signal processing section (110) and a downlink signal processing section (120). In the optoelectronic co-package module (100), the uplink optical signal (S1) is transmitted through the uplink signal processing section (110), and the downlink optical signal (S2) is transmitted through the downlink signal processing section (120). The uplink signal processing section (110) includes an uplink optical signal receiver (111), an uplink signal conversion and amplification module (112), an electrical signal replication module (113), and an uplink optical signal transmitter (114). The downlink signal processing section (120) includes a downlink optical signal receiver (121), a downlink signal conversion and amplification module (122), an electrical signal superposition module (123), and a downlink optical signal transmitter (124).

[0030] The uplink signal processing section (110) and the downlink signal processing section (120) are both encapsulated in the optoelectronic co-package module (100). That is, the optoelectronic co-package module (100) is used to switch between optical signals and electrical signals. In practice, the optical signal processing device and the electrical signal processing device are encapsulated together to form the electrical co-package module (100).

[0031] like Figure 5 , Figure 6As shown, when the uplink optical signal (S1) passes through each signal transmission node (11), the signal transmission is performed according to the following steps. Step A1: The uplink optical signal (S1) is transmitted to the photoelectric signal switching module (100). Step B1: The photoelectric signal switching module (100) converts the uplink optical signal (S1) into an uplink current signal (I1), which is between 0.1mA and 1.2mA. Step C1: The photoelectric signal switching module (100) converts the uplink current signal (I1) into a voltage signal and amplifies the voltage signal to obtain an internal uplink voltage signal (V), which is between 200 and 800mV. Step D1: The photoelectric signal switching module (100) replicates the internal uplink voltage signal (V) to obtain a transmission voltage signal (V1) and a replicated voltage signal (V2). 2) Between 100 and 400mV, the information of the transmission voltage signal (V1) and the replicated voltage signal (V2) is the same as the information of the uplink optical signal (S1). In step E1, the replicated voltage signal (V2) is transmitted to the node terminal (20). The photoelectric signal switching module (100) converts the transmission voltage signal (V1) into an uplink output current signal (I2). The uplink output current signal (I2) is between 5 and 20mA. In step F1, the photoelectric signal switching module (100) converts the uplink output current signal (I2) into the uplink optical signal (S1). In step G1, the photoelectric signal switching module (100) transmits the uplink optical signal (S1) to the optical fiber transmission bus (10), so that the uplink optical signal (S1) continues to be transmitted forward along the optical fiber transmission bus (10).

[0032] When the downlink optical signal (S2) passes through each of the signal transmission nodes (11), it is transmitted in accordance with the following steps. Step A2: The downlink optical signal (S2) is transmitted to the photoelectric signal switching module (100). Step B2: The photoelectric signal switching module (100) converts the downlink optical signal (S2) into a downlink current signal (I3), which is between 0.1mA and 1.2mA. Step C2: The photoelectric signal switching module (100) converts the downlink current signal (I3) into a voltage signal and amplifies the voltage signal to obtain a downlink voltage signal (V3), which is between 100 and 400mV. Step D2: The feedback voltage signal (V4) generated by the feedback information from the node terminal (20) is transmitted to the photoelectric signal switching module (100), which is between 100 and 400mV. The photoelectric signal switching module (100) superimposes the downlink voltage signal (V3) and the feedback voltage signal (V4) to form a superimposed voltage signal (V5). The superimposed voltage signal (V5) is between 200 and 800mV. In step E2, the photoelectric signal switching module (100) converts the superimposed voltage signal (V5) into a downlink output current signal (I4), which is between 5 and 20mA. In step F2, the photoelectric signal switching module (100) converts the downlink output current signal (I4) into a superimposed downlink optical signal (S3). The information of the superimposed downlink optical signal (S3) consists of the information of the downlink optical signal (S2) and the feedback information of the node terminal (20). In step G2, the photoelectric signal switching module (100) transmits the superimposed downlink optical signal (S3) to the optical fiber transmission bus (10). In step H2, the superimposed downlink optical signal (S3) is used as the downlink optical signal (S2) of another photoelectric signal switching module (100) and transmitted to another photoelectric signal switching module (100). Step A2 is repeated, and so on.

[0033] like Figure 7As shown, in step B1, the uplink optical signal receiver (111) converts the uplink optical signal (S1) into the uplink current signal (I1). In step C1, the uplink signal conversion and amplification module (112) converts the uplink current signal (I1) into a voltage signal and amplifies the voltage signal to obtain the internal uplink voltage signal (V). In step D1, the electrical signal replication module (113) replicates the internal uplink voltage signal (V) to obtain the transmission voltage signal (V1) and the replicated voltage signal (V2). In step E1, the electrical signal replication module (113) transmits the replicated voltage signal (V2) to the node terminal (20) and converts the transmission voltage signal (V1) into the uplink output current signal (I2). In step F1, the uplink optical signal transmitter (114) converts the uplink output current signal (I2) into the uplink optical signal (S1).

[0034] In step B2, the downlink optical signal receiver (121) converts the downlink optical signal (S2) into the downlink current signal (I3). In step C2, the downlink signal conversion and amplification module (122) converts the downlink current signal (I3) into a voltage signal and amplifies the voltage signal to obtain the downlink voltage signal (V3). In step D2, the feedback voltage signal (V4) is transmitted to the electrical signal superposition module (123), which superimposes the downlink voltage signal (V3) and the feedback voltage signal (V4) to form the superimposed voltage signal (V5). In step E2, the electrical signal superposition module (123) converts the superimposed voltage signal (V5) into the downlink output current signal (I4). In step F2, the downlink optical signal transmitter (124) converts the downlink output current signal (I4) into the superimposed downlink optical signal (S3).

[0035] In practical implementation, the electrical signal replication module (113) and the electrical signal superposition module (123) can achieve their functions in an active or passive manner. In the passive case, there are various existing technologies that can achieve the functions of both, such as voltage divider circuits, voltage regulator ICs, LDOs, etc. A preferred implementation method is described below.

[0036] like Figure 8As shown, the electrical signal replication module (113) is provided with a Y-type silicon substrate (130). The Y-type silicon substrate (130) has a voltage input terminal (131), a first voltage output terminal (132) and a second voltage output terminal (133). The internal uplink voltage signal (V) is input into the Y-type silicon substrate (130) from the voltage input terminal (131). The transmission voltage signal (V1) is output from the first voltage output terminal (132) and converted into the uplink output current signal (I2) by the electrical signal replication module (113). The replication voltage signal (V2) is output from the second voltage output terminal (133) and transmitted to the node terminal (20).

[0037] like Figure 9 As shown, the electrical signal superposition module (123) includes a Y-type silicon substrate (130). The Y-type silicon substrate (130) has a voltage output terminal (134), a first voltage input terminal (135), and a second voltage input terminal (136). The downlink voltage signal (V3) is input to the Y-type silicon substrate (130) from the first voltage input terminal (135), and the feedback voltage signal (V4) is input to the Y-type silicon substrate (130) from the second voltage input terminal (136). The downlink voltage signal (V3) and the feedback voltage signal (V4) are... The superimposed voltage signals (V5) are formed by superimposing the voltage signals (V5) and output from the voltage output terminal (134). The basic principle of the Y-type silicon base (130) is based on the electromagnetic field transmission theory. The silicon in the Y-type silicon base (130) acts as a waveguide to transmit the electromagnetic field. It can distribute one voltage energy equally into two voltage energy outputs, or it can superimpose two voltage energys into one voltage energy output. It can reduce reflection loss. The design of the Y-type silicon base (130) is the most power-efficient, equivalent to the passive energy being divided into two.

[0038] In the active configuration, both the electrical signal replication module (113) and the electrical signal superposition module (123) require an external power supply. A preferred implementation is described below. The electrical signal replication module (113) and the electrical signal superposition module (123) are configured as operational amplifiers (Op-Amps), with appropriate models selected based on the actual signal frequency and power requirements. Configuring the operational amplifiers in voltage follower (buffer) mode enables the functionality of both. The functional principles of operational amplifiers are prior art and will not be elaborated here.

[0039] like Figure 10 , Figure 11As shown, in a specific implementation, several optoelectronic co-packaged modules (100) are provided in the uplink signal transmission section (230), and an uplink comparison error corrector (210) is connected in the uplink signal transmission section (230). The uplink comparison error corrector (210) is used to correct the uplink optical signal (S1) in the uplink signal transmission section (230).

[0040] The uplink comparison and error correction unit (210) includes an uplink voltage acquisition module (211), an uplink storage module (212), and an uplink voltage comparison module (213). The uplink voltage acquisition module (211) is connected to the uplink signal conversion and amplification module (112) in the optoelectronic co-package module (100) at the very beginning and the very end of the uplink signal transmission segment (230), respectively. The uplink voltage acquisition module (211) acquires the internal uplink voltage signal (V) generated in the uplink signal conversion and amplification module (112) in the optoelectronic co-package module (100) at the very beginning and forms an uplink standard voltage signal. (Va), and simultaneously, the uplink voltage acquisition module (211) acquires the internal uplink voltage signal (V) generated in the uplink signal conversion and amplification module (112) in the last optoelectronic co-package module (100) and forms an uplink comparison voltage signal (Vb). The uplink voltage acquisition module (211) transmits the uplink standard voltage signal (Va) to the uplink storage module (212) for storage. At the same time, the uplink voltage acquisition module (211) transmits the uplink standard voltage signal (Va) and the uplink comparison voltage signal (Vb) to the uplink voltage comparison module (213) for comparison.

[0041] When the uplink standard voltage signal (Va) is equal to the uplink comparison voltage signal (Vb), the uplink comparison error corrector (210) does not work. When the uplink standard voltage signal (Va) is not equal to the uplink comparison voltage signal (Vb), the uplink storage module (212) transmits the uplink standard voltage signal (Va) to the uplink signal conversion and amplification module (112) of the last opto-co-package module (100), and generates the internal uplink voltage signal (V) of the last opto-co-package module (100) from the uplink standard voltage signal (Va), and continues to transmit it backward. In practice, the specific number of opto-co-package modules (100) in the uplink signal transmission segment (230) can be selected according to the transmission power and specific requirements, such as three to ten, so as to monitor the transmission quality of the uplink optical signal (S1) and correct errors in real time to ensure the transmission quality.

[0042] like Figure 12 , Figure 13As shown, in a specific implementation, several optoelectronic co-packaged modules (100) are provided in the downlink signal transmission section (240), and a downlink comparison error corrector (220) is connected in the downlink signal transmission section (240). The downlink comparison error corrector (220) is used to correct the downlink optical signal (S2) in the downlink signal transmission section (240).

[0043] The downlink comparison error corrector (220) includes a downlink voltage acquisition module (221), a downlink storage module (222), and a downlink voltage comparison module (223). The downlink voltage acquisition module (221) is connected to the downlink signal conversion and amplification module (122) in each opto-co-packaged module (100) of the downlink signal transmission segment (240). The downlink voltage acquisition module (221) acquires the downlink voltage signal (V3) generated in the downlink signal conversion and amplification module (122) of the foremost opto-co-packaged module (100) in the downlink signal transmission segment (240) and forms a downlink comparison voltage signal (Vc). Simultaneously, The downlink voltage acquisition module (221) acquires the downlink voltage signal (V3) from the downlink signal conversion and amplification module (122) in the other optoelectronic co-package modules (100) in the downlink signal transmission segment (240), and superimposes several downlink voltage signals (V3) to form a downlink standard voltage signal (Vd). The downlink voltage acquisition module (221) transmits the downlink standard voltage signal (Vd) to the downlink storage module (222) for storage. At the same time, the downlink voltage acquisition module (221) transmits the downlink standard voltage signal (Vd) and the downlink comparison voltage signal (Vc) to the downlink voltage comparison module (223) for comparison.

[0044] When the downlink standard voltage signal (Vd) is equal to the downlink comparison voltage signal (Vc), the downlink comparison error corrector (220) does not work. When the downlink standard voltage signal (Vd) is not equal to the downlink comparison voltage signal (Vc), the downlink storage module (222) transmits the downlink standard voltage signal (Vd) to the downlink signal conversion and amplification module (122) of the front-end optoelectronic co-package module (100), and generates the downlink voltage signal (V3) of the front-end optoelectronic co-package module (100) from the downlink standard voltage signal (Vd), and continues to transmit forward. In practice, the downlink comparison error corrector (220) can be set specifically. When there are key node devices in the downlink signal transmission segment (240), the downlink comparison error corrector (220) can be used to monitor the key node devices. In practice, the number of optoelectronic co-package modules (100) in the downlink signal transmission segment (240) is generally no more than five.

[0045] In practice, in order to facilitate the connection and assembly of the optoelectronic co-package module (100), the optoelectronic co-package module (100) can be configured in various forms. Some preferred implementation methods are described below.

[0046] like Figure 14 As shown in Embodiment 1, the optoelectronic co-packaged module (100) includes a first uplink optical port (141) and a second uplink optical port (142). The first uplink optical port (141) and the second uplink optical port (142) are connected to both sides of the optoelectronic co-packaged module (100). The optical fiber for transmitting the uplink optical signal (S1) is respectively disposed in the first uplink optical port (141) and the second uplink optical port (142). The optoelectronic co-packaged module (100) also includes a first downlink optical port (151). And a second downlink optical port (152), the first downlink optical port (151) and the second downlink optical port (152) are connected to both sides of the optoelectronic co-package module (100), and the optical fiber for transmitting the downlink optical signal (S2) is respectively disposed in the first downlink optical port (151) and the second downlink optical port (152). The optoelectronic co-package module (100) has a substrate, and the various devices of the uplink signal processing part (110) and the downlink signal processing part (120) are uniformly disposed on the substrate.

[0047] like Figures 15 to 16 As shown in Embodiment 2, in the battery management system of the new energy electric vehicle field, the optoelectronic co-package module (100) that monitors each battery (4a) can be configured in the following manner.

[0048] The optoelectronic co-package module (100) includes an upper integrated board (161) and a lower integrated board (162). The upper integrated board (161) is connected to the top of the lower integrated board (162). The upper integrated board (161) and the lower integrated board (162) are parallel to each other. The uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are arranged on the upper integrated board (161). The uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) are arranged on the lower integrated board (162).

[0049] The optoelectronic co-package module (100) further includes a first uplink optical port (141), a second uplink optical port (142), a first downlink optical port (151), and a second downlink optical port (152). The first uplink optical port (141), the second uplink optical port (142), the first downlink optical port (151), and the second downlink optical port (152) are arranged at the bottom of the lower integrated board (162). The first uplink optical port (141), the second uplink optical port (142), the first downlink optical port (151), and the second downlink optical port (152) are parallel to each other. The uplink optical signal (S) is transmitted via a single optical port. 1) The optical fibers are respectively disposed in the first uplink optical port (141) and the second uplink optical port (142), and the optical fibers for transmitting the downlink optical signal (S2) are respectively disposed in the first downlink optical port (151) and the second downlink optical port (152). The first uplink optical port (141) is connected to the uplink optical signal receiver (111), the second uplink optical port (142) is connected to the uplink optical signal transmitter (114), the first downlink optical port (151) is connected to the downlink optical signal transmitter (124), and the second downlink optical port (152) is connected to the downlink optical signal receiver (121).

[0050] The optoelectronic co-package module (100) also includes an integrated fixture (170), which includes a battery fixing claw (171) and several optical port fixing claws (172). Several optical port fixing claws (172) are connected to the battery fixing claw (171) at the same time. The battery fixing claw (171) is fastened to the battery (4a). The first uplink optical port (141), the second uplink optical port (142), the first downlink optical port (151), and the second downlink optical port (152) are correspondingly fastened to the optical port fixing claw (172).

[0051] In practical implementation, a male latch plate (163) is provided below the upper integrated board (161), and a female latch plate (164) is provided above the lower integrated board (162) corresponding to the male latch plate (163). Several male pins (165) are arranged in parallel on the male latch plate (163), and several female pin holes (166) are provided on the female latch plate (164) corresponding to the several male pins (165). The several male pins (165) are correspondingly inserted into the several female pin holes (166) to complete the connection between the upper integrated board (161) and the lower integrated board (162), complete the connection between the uplink optical signal receiver (111) and the uplink signal conversion and amplification module (112), and complete the electrical connection. The signal replication module (113) is connected to the uplink optical signal transmitter (114), the downlink optical signal receiver (121) is connected to the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) is connected to the downlink optical signal transmitter (124). The back of the upper integrated board (161) is also provided with several module pins (167). The module pins (167) are connected to the electrical signal replication module (113) and the electrical signal superposition module (123) respectively. Several module pins (167) are plugged into the node terminal (20) to complete the fixed connection and electrical connection between the optoelectronic co-package module (100) and the node terminal (20).

[0052] In this embodiment, the node terminal (20) is a battery monitor for the battery (4a). In this embodiment, firstly, the uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are centrally arranged on the upper integrated board (161), and the uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) are centrally arranged on the lower integrated board (162). This method simplifies the production process and improves product quality. Simply put, it means that several signal processing modules are centrally arranged on the upper integrated board (161), while the various parts of the optical module are centrally arranged on the lower integrated board (162). Secondly, through several public plugs By inserting the pins (165) into several female pin holes (166), the upper integrated board (161) and the lower integrated board (162) can be connected, and the electrical connection of each module in the optoelectronic co-package module (100) can be realized. The connection method is simple. In addition, by using several module pins (167) and the integrated fixing device (170), the optoelectronic co-package module (100) can be fixed to the battery (4a) in one go by fixing it at the top and bottom respectively. The connection method is simple and reliable. Finally, by setting the first uplink optical port tube (141), the second uplink optical port tube (142), the first downlink optical port tube (151), and the second downlink optical port tube (152) at the bottom of the lower integrated board (162), the fiber optic cable routing can be facilitated, and the fiber optic cable collection, assembly, and subsequent maintenance can be facilitated.

[0053] like Figures 17 to 20 As shown in Embodiment 3, for a specific application in the field of intelligent robots, an intelligent robot consists of several motion joints (4c). For example, the index finger of an intelligent robot consists of three motion joints (4c). In order to monitor the state of each motion joint (4c), the optoelectronic co-package module (100) needs to be connected to each motion joint (4c). At the same time, several optoelectronic co-package modules (100) are connected together with optical fibers. At this time, several optoelectronic co-package modules (100) and optical fibers form a structure similar to blood vessels. In order to realize the application in this field, the optoelectronic co-package module (100) can adopt the following structure.

[0054] The optoelectronic co-packaged module (100) includes a frame integrated board (181) and a central integrated board (182). The central integrated board (182) is snapped into the frame integrated board (181). The uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are arranged on the back of the central integrated board (182). The uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) are arranged on the front of the frame integrated board (181). The optoelectronic co-packaged module (100) also includes a first uplink optical port tube (141) and a second uplink optical port tube (142). Optical port tube (142) is connected to the upper and lower ends of the optoelectronic co-package module (100). The optical fiber used to transmit the uplink optical signal (S1) is respectively disposed in the first uplink optical port tube (141) and the second uplink optical port tube (142). The optoelectronic co-package module (100) also includes a first downlink optical port tube (151) and a second downlink optical port tube (152). The first downlink optical port tube (151) and the second downlink optical port tube (152) are connected to the upper and lower ends of the optoelectronic co-package module (100). The optical fiber used to transmit the downlink optical signal (S2) is respectively disposed in the first downlink optical port tube (151) and the second downlink optical port tube (152). The first uplink optical port tube (141) and the first downlink optical port tube (151) are parallel to each other, and the second uplink optical port tube (142) and the second downlink optical port tube (152) are parallel to each other.

[0055] The first uplink optical port (141) is connected to the uplink optical signal receiver (111), the second uplink optical port (142) is connected to the uplink optical signal transmitter (114), the first downlink optical port (151) is connected to the downlink optical signal transmitter (124), and the second downlink optical port (152) is connected to the downlink optical signal receiver (121).

[0056] The frame integrated plate (181) has an assembly window (190), and the central integrated plate (182) is snapped into the assembly window (191). Several protruding pins (183) are provided on the side wall of the central integrated plate (182). The uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are respectively connected to the protruding pins (183). Corresponding to the several protruding pins (183), several pin slots (184) are recessed on the inner wall of the assembly window (190). The uplink optical signal receiver (111), the uplink optical signal transmitter (114), and the downlink optical signal receiver (111, 114, 115, 116, 117, 118 ... 121) and the downlink optical signal transmitter (124) are respectively connected to the pin slot (184), and several protruding pins (183) are correspondingly inserted into several pin slots (184) to complete the snap-fit ​​between the central integrated board (182) and the frame integrated board (181). At the same time, the connection between the uplink optical signal receiver (111) and the uplink signal conversion and amplification module (112) is completed, the connection between the electrical signal replication module (113) and the uplink optical signal transmitter (114) is completed, the connection between the downlink optical signal receiver (121) and the downlink signal conversion and amplification module (122) is completed, and the connection between the electrical signal superposition module (123) and the downlink optical signal transmitter (124) is completed.

[0057] Several connection pins (185) are also provided on the back of the central integrated board (182). These connection pins (185) are respectively connected to the electrical signal replication module (113) and the electrical signal superposition module (123). The several connection pins (185) are plugged into the action joint (4c) to complete the fixed connection and electrical connection between the optoelectronic co-package module (100) and the action joint (4c). In this embodiment, firstly, the uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are centrally arranged on the central integrated board (182). The method of centrally arranging the uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) on the frame integrated board (181) can simplify the production process and improve product quality. In short, it is Several signal processing modules are centrally located on the central integrated board (182), while the various parts of the optical module are centrally located on the frame integrated board (181). Secondly, the frame integrated board (181) and the central integrated board (182) can be connected by several protruding pins (183) corresponding to several pin slots (184), and the electrical connection of each module in the optoelectronic co-package module (100) can be realized. The connection method is simple. In addition, the fixed connection and electrical connection between the optoelectronic co-package module (100) and the action joint (4c) can be completed by several connection pins (185). The connection method is simple and reliable. Finally, after several optoelectronic co-package modules (100) and several action joints (4c) are connected in this embodiment, the optical fiber transmission bus (10) can be attached to several action joints (4c) to form a structure similar to blood vessels, which can facilitate the routing of optical fibers, and facilitate the collection, assembly and maintenance of optical fibers.

Claims

1. An optoelectronic co-packaged module for optical transmission, characterized in that: The optoelectronic co-package module (100) is disposed in the optical fiber transmission bus (10). The bus optical signal (S) is transmitted in the optical fiber transmission bus (10). The bus optical signal (S) includes an uplink optical signal (S1) and a downlink optical signal (S2). The optical fiber transmission bus (10) is provided with several signal transmission nodes (11). Each of the signal transmission nodes (11) is provided with the optoelectronic co-package module (100). Each optoelectronic co-package module (100) is connected between the optical fiber transmission bus (10) and a node terminal (20). The optoelectronic co-package module (100) includes an uplink signal processing section (110) and a downlink signal processing section (120). In the optoelectronic co-package module (100), the uplink optical signal (S1) is transmitted through the uplink signal processing section (110), and the downlink optical signal (S2) is transmitted through the downlink signal processing section (120). The uplink signal processing section (110) includes an uplink optical signal receiver (111), an uplink signal conversion and amplification module (112), an electrical signal replication module (113), and an uplink optical signal transmitter (114). The downlink signal processing section (120) includes a downlink optical signal receiver (121), a downlink signal conversion and amplification module (122), an electrical signal superposition module (123), and a downlink optical signal transmitter (124). The uplink signal processing section (110) and the downlink signal processing section (120) are both encapsulated in the optoelectronic co-package module (100). The electrical signal replication module (113) is provided with a Y-type silicon substrate (130), which has a voltage input terminal (131), a first voltage output terminal (132) and a second voltage output terminal (133). The electrical signal superposition module (123) is provided with a Y-type silicon substrate (130), which has a voltage output terminal (134), a first voltage input terminal (135) and a second voltage input terminal (136).

2. The optoelectronic co-packaged module for optical transmission as described in claim 1, characterized in that: When the uplink optical signal (S1) passes through each of the optoelectronic co-packaged modules (100), the signal transmission is performed according to the following steps: Step A1: The uplink optical signal (S1) is transmitted to the optoelectronic co-package module (100). Step B1: The optoelectronic co-package module (100) converts the uplink optical signal (S1) into an uplink current signal (I1). Step C1: The optoelectronic co-package module (100) converts the uplink current signal (I1) into a voltage signal and amplifies the voltage signal to obtain the internal uplink voltage signal (V). Step D1: The optoelectronic co-package module (100) replicates the internal uplink voltage signal (V) to obtain a transmission voltage signal (V1) and a replicated voltage signal (V2). The information of the transmission voltage signal (V1) and the replicated voltage signal (V2) is the same as the information of the uplink optical signal (S1). Step E1: The replicated voltage signal (V2) is transmitted to the node terminal (20), and the optoelectronic co-package module (100) converts the transmitted voltage signal (V1) into an uplink output current signal (I2). Step F1: The optoelectronic co-package module (100) converts the uplink output current signal (I2) into the uplink optical signal (S1). Step G1: The optoelectronic co-package module (100) transmits the uplink optical signal (S1) to the optical fiber transmission bus (10), so that the uplink optical signal (S1) continues to be transmitted forward along the optical fiber transmission bus (10). When the downlink optical signal (S2) passes through each of the optoelectronic co-packaged modules (100), the signal transmission is performed according to the following steps: Step A2: The downlink optical signal (S2) is transmitted to the optoelectronic co-package module (100). Step B2: The optoelectronic co-package module (100) converts the downlink optical signal (S2) into a downlink current signal (I3). Step C2: The optoelectronic co-package module (100) converts the downlink current signal (I3) into a voltage signal and amplifies the voltage signal to obtain the downlink voltage signal (V3). Step D2: The feedback voltage signal (V4) generated by the feedback information of the node terminal (20) is transmitted to the optoelectronic co-package module (100). The optoelectronic co-package module (100) superimposes the downlink voltage signal (V3) and the feedback voltage signal (V4) to form a superimposed voltage signal (V5). Step E2: The optoelectronic co-package module (100) converts the superimposed voltage signal (V5) into a downlink output current signal (I4). Step F2: The optoelectronic co-package module (100) converts the downlink output current signal (I4) into a superimposed downlink optical signal (S3). The information of the superimposed downlink optical signal (S3) consists of the information of the downlink optical signal (S2) and the feedback information of the node terminal (20). Step G2: The optoelectronic co-package module (100) transmits the superimposed downlink optical signal (S3) to the optical fiber transmission bus (10). Step H2: The superimposed downlink optical signal (S3) is used as the downlink optical signal (S2) of another optoelectronic co-packaged module (100) and transmitted to the other optoelectronic co-packaged module (100), and the above step A2 is repeated. In step B1, the uplink optical signal receiver (111) converts the uplink optical signal (S1) into the uplink current signal (I1). In step C1, the uplink signal conversion and amplification module (112) converts the uplink current signal (I1) into a voltage signal and amplifies the voltage signal to obtain the internal uplink voltage signal (V). In step D1, the electrical signal replication module (113) replicates the internal uplink voltage signal (V) to obtain the transmission voltage signal (V1) and the replicated voltage signal (V2). In step E1, the electrical signal replication module (113) transmits the replicated voltage signal (V2) to the node terminal (20) and converts the transmission voltage signal (V1) into the uplink output current signal (I2). In step F1, the uplink optical signal transmitter (114) converts the uplink output current signal (I2) into the uplink optical signal (S1). In step B2, the downlink optical signal receiver (121) converts the downlink optical signal (S2) into the downlink current signal (I3). In step C2, the downlink signal conversion and amplification module (122) converts the downlink current signal (I3) into a voltage signal and amplifies the voltage signal to obtain the downlink voltage signal (V3). In step D2, the feedback voltage signal (V4) is transmitted to the electrical signal superposition module (123), which superimposes the downlink voltage signal (V3) and the feedback voltage signal (V4) to form the superimposed voltage signal (V5). In step E2, the electrical signal superposition module (123) converts the superimposed voltage signal (V5) into the downlink output current signal (I4). In step F2, the downlink optical signal transmitter (124) converts the downlink output current signal (I4) into the superimposed downlink optical signal (S3).

3. The optoelectronic co-packaged module for optical transmission as described in claim 2, characterized in that: Several of these optoelectronic co-packaged modules (100) are provided in the uplink signal transmission section (230), and an uplink comparison error corrector (210) is connected in the uplink signal transmission section (230). The uplink comparison and error correction unit (210) includes an uplink voltage acquisition module (211), an uplink storage module (212), and an uplink voltage comparison module (213). The uplink voltage acquisition module (211) is connected to the uplink signal conversion and amplification module (112) in the optoelectronic co-package module (100) at the very beginning and the very end of the uplink signal transmission segment (230), respectively. The uplink voltage acquisition module (211) acquires the internal uplink voltage signal (V) generated in the uplink signal conversion and amplification module (112) in the frontmost optoelectronic co-package module (100) and forms an uplink standard voltage signal (Va). Simultaneously, the uplink voltage acquisition module (211) acquires the internal uplink voltage signal (V) generated in the uplink signal conversion and amplification module (112) in the rearmost optoelectronic co-package module (100) and forms an uplink comparison voltage signal (Vb). The uplink voltage acquisition module (211) transmits the uplink standard voltage signal (Va) to the uplink storage module (212) for storage. Simultaneously, the uplink voltage acquisition module (211) transmits the uplink standard voltage signal (Va) and the uplink comparison voltage signal (Vb) to the uplink voltage comparison module (213) for comparison. When the uplink standard voltage signal (Va) equals the uplink comparison voltage signal (Vb), the uplink comparison error corrector (210) does not operate. When the uplink standard voltage signal (Va) is not equal to the uplink comparison voltage signal (Vb), the uplink storage module (212) transmits the uplink standard voltage signal (Va) to the uplink signal conversion and amplification module (112) of the final optoelectronic co-package module (100), and the uplink standard voltage signal (Va) generates the internal uplink voltage signal (V) of the final optoelectronic co-package module (100), which continues to be transmitted. Several of these optoelectronic co-packaged modules (100) are provided in the downlink signal transmission segment (240), and a downlink comparison error corrector (220) is connected in the downlink signal transmission segment (240). The downlink comparison error corrector (220) includes a downlink voltage acquisition module (221), a downlink storage module (222), and a downlink voltage comparison module (223). The downlink voltage acquisition module (221) is connected to the downlink signal conversion and amplification module (122) in each optoelectronic co-package module (100) of the downlink signal transmission segment (240). The downlink voltage acquisition module (221) acquires the downlink voltage signal (V3) generated in the downlink signal conversion and amplification module (122) of the frontmost opto-co-packaged module (100) in the downlink signal transmission segment (240) and forms a downlink comparison voltage signal (Vc). Simultaneously, the downlink voltage acquisition module (221) acquires the downlink voltage signals (V3) from the downlink signal conversion and amplification modules (122) of the remaining opto-co-packaged modules (100) in the downlink signal transmission segment (240), and superimposes several downlink voltage signals (V3) to form a downlink standard voltage signal (Vd). The downlink voltage acquisition module (221) transmits the downlink standard voltage signal (Vd) to the downlink storage module (222) for storage. At the same time, the downlink voltage acquisition module (221) transmits the downlink standard voltage signal (Vd) and the downlink comparison voltage signal (Vc) to the downlink voltage comparison module (223) for comparison. When the downlink standard voltage signal (Vd) is equal to the downlink comparison voltage signal (Vc), the downlink comparison error corrector (220) does not work. When the downlink standard voltage signal (Vd) is not equal to the downlink comparison voltage signal (Vc), the downlink storage module (222) transmits the downlink standard voltage signal (Vd) to the downlink signal conversion and amplification module (122) of the front-end optoelectronic co-package module (100), and generates the downlink voltage signal (V3) of the front-end optoelectronic co-package module (100) from the downlink standard voltage signal (Vd), and continues to transmit forward.

4. The optoelectronic co-packaged module for optical transmission as described in claim 3, characterized in that: The number of the opto-co-packaged modules (100) in the downlink signal transmission segment (240) is less than five, and the number of several opto-co-packaged modules (100) in the uplink signal transmission segment (230) is more than three.

5. The optoelectronic co-packaged module for optical transmission as described in claim 1, characterized in that: The optoelectronic co-package module (100) further includes a first uplink optical port (141) and a second uplink optical port (142). The first uplink optical port (141) and the second uplink optical port (142) are connected to both sides of the optoelectronic co-package module (100). The optical fibers used to transmit the uplink optical signal (S1) are respectively disposed in the first uplink optical port (141) and the second uplink optical port (142). The optoelectronic co-package module (100) includes a first downlink optical port (151) and a second downlink optical port (152). The first downlink optical port (151) and the second downlink optical port (152) are connected to both sides of the optoelectronic co-package module (100). The optical fibers for transmitting the downlink optical signal (S2) are respectively disposed in the first downlink optical port (151) and the second downlink optical port (152). The optoelectronic co-package module (100) has a substrate on which the uplink signal processing section (110) and the downlink signal processing section (120) are disposed.

6. The optoelectronic co-packaged module for optical transmission as described in claim 1, characterized in that: The optoelectronic co-package module (100) includes an upper integrated board (161) and a lower integrated board (162), with the upper integrated board (161) connected to the top of the lower integrated board (162). The uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are arranged on the upper integrated board (161). The uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) are arranged on the lower integrated board (162). The optoelectronic co-package module (100) also includes a first uplink optical port (141), a second uplink optical port (142), a first downlink optical port (151), and a second downlink optical port (152). The first uplink optical port (141), the second uplink optical port (142), the first downlink optical port (151), and the second downlink optical port (152) are arranged at the bottom of the lower integrated board (162). The optical fibers used to transmit the uplink optical signal (S1) are respectively disposed in the first uplink optical port (141) and the second uplink optical port (142), and the optical fibers used to transmit the downlink optical signal (S2) are respectively disposed in the first downlink optical port (151) and the second downlink optical port (152). The first uplink optical port (141) is connected to the uplink optical signal receiver (111), the second uplink optical port (142) is connected to the uplink optical signal transmitter (114), the first downlink optical port (151) is connected to the downlink optical signal transmitter (124), and the second downlink optical port (152) is connected to the downlink optical signal receiver (121).

7. The optoelectronic co-packaged module for optical transmission as described in claim 6, characterized in that: A male snap plate (163) is provided below the upper integrated plate (161), and a female snap plate (164) is provided above the lower integrated plate (162) corresponding to the male snap plate (163). Several male pins (165) are arranged in parallel on the male snap plate (163), and several female pin holes (166) are provided on the female snap plate (164) corresponding to the several male pins (165). Several male pins (165) are correspondingly inserted into several female pin holes (166) to complete the connection between the upper integrated board (161) and the lower integrated board (162), to complete the connection between the uplink optical signal receiver (111) and the uplink signal conversion and amplification module (112), to complete the connection between the electrical signal replication module (113) and the uplink optical signal transmitter (114), to complete the connection between the downlink optical signal receiver (121) and the downlink signal conversion and amplification module (122), and to complete the connection between the electrical signal superposition module (123) and the downlink optical signal transmitter (124). The back of the upper integrated board (161) is also provided with several module pins (167), which are connected to the electrical signal replication module (113) and the electrical signal superposition module (123) respectively, and the several module pins (167) are plugged into the node terminal (20).

8. The optoelectronic co-packaged module for optical transmission as described in claim 1, characterized in that: The optoelectronic co-package module (100) includes a frame integrated board (181) and a central integrated board (182), the central integrated board (182) being snapped into the frame integrated board (181). The uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are arranged on the back of the central integrated board (182). The uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) are arranged on the front of the integrated frame (181). The optoelectronic co-package module (100) further includes a first uplink optical port (141) and a second uplink optical port (142). The first uplink optical port (141) and the second uplink optical port (142) are connected to the upper and lower ends of the optoelectronic co-package module (100). The optical fibers used to transmit the uplink optical signal (S1) are respectively disposed in the first uplink optical port (141) and the second uplink optical port (142). The optoelectronic co-package module (100) further includes a first downlink optical port (151) and a second downlink optical port (152). The first downlink optical port (151) and the second downlink optical port (152) are connected to the upper and lower ends of the optoelectronic co-package module (100). The optical fibers used to transmit the downlink optical signal (S2) are respectively disposed in the first downlink optical port (151) and the second downlink optical port (152). The first uplink optical port (141) is connected to the uplink optical signal receiver (111), the second uplink optical port (142) is connected to the uplink optical signal transmitter (114), the first downlink optical port (151) is connected to the downlink optical signal transmitter (124), and the second downlink optical port (152) is connected to the downlink optical signal receiver (121).

9. The optoelectronic co-packaged module for optical transmission as described in claim 8, characterized in that: The frame integrated panel (181) has an assembly window (190), and the central integrated panel (182) is snapped into the assembly window (190). Several protruding pins (183) are provided on the side wall of the central integrated panel (182). The uplink signal conversion and amplification module (112), the electrical signal replication module (113), the downlink signal conversion and amplification module (122), and the electrical signal superposition module (123) are respectively connected to the protruding pin (183). Corresponding to several of these protruding pins (183), several pin slots (184) are recessed on the inner wall of the mounting window (190). The uplink optical signal receiver (111), the uplink optical signal transmitter (114), the downlink optical signal receiver (121), and the downlink optical signal transmitter (124) are respectively connected to the pin slot (184). Several protruding pins (183) are correspondingly inserted into several pin slots (184) to complete the snap-fit ​​connection between the central integrated board (182) and the frame integrated board (181), thereby completing the connection between the uplink optical signal receiver (111) and the uplink signal conversion and amplification module (112), completing the connection between the electrical signal replication module (113) and the uplink optical signal transmitter (114), completing the connection between the downlink optical signal receiver (121) and the downlink signal conversion and amplification module (122), and completing the connection between the electrical signal superposition module (123) and the downlink optical signal transmitter (124). Several connection pins (185) are also provided on the back of the central integrated board (182), which are connected to the electrical signal replication module (113) and the electrical signal superposition module (123) respectively.

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