A biased single-pass multi-stage gas resistance valve thermal diode and its processing method

Abstract

The present invention relates to the field of thermal diode technology, and in particular to a biased single-pass multi-stage gas resistance valve thermal diode and a processing method thereof. It comprises a tube body, one end of the tube body is a sealed end, and the other end is an open end, the open end is connected to a liquid filling tube, a single-pass multi-stage gas resistance valve is arranged inside the tube body, a liquid wick with a mesh structure is arranged outside the single-pass multi-stage gas resistance valve, the liquid wick is filled with liquid working medium, and the pores of the liquid wick are liquid channels; the single-pass multi-stage gas resistance valve comprises a cylinder body, a plurality of baffles are arranged inside the cylinder body, the inclination direction of the baffles is toward the sealed end of the tube body, a gap is arranged between the free end of the baffle and the inner wall of the cylinder body, and all the gaps are connected as steam channels, and the steam channels are S-shaped. The thermal diode can achieve the effect of one-way heat transfer under zero-gravity conditions; when the gas is flowing in the reverse direction, the staggered baffles are used to block the airflow pressure, which can effectively reduce the accumulation of airflow, weaken the airflow pressure, block the liquid reflux, and achieve the effect of reverse heat transfer.

Description

Technical Field

[0001] The invention relates to the technical field of thermal diodes, and in particular to a biased single-pass multi-stage gas resistance valve thermal diode and a processing method thereof. Background Art

[0002] As an efficient heat transfer element, heat pipes are widely used in the field of heat dissipation of electronic products. However, since common heat pipes can transfer heat in both directions, the transfer is based on the temperature difference direction, that is, from high temperature to low temperature. It is precisely because of this bidirectionality that when an accident occurs, the temperature of the heat dissipation section may be higher than the temperature of the electronic device, then the external heat will be transferred to the electronic device, causing damage to the device. Therefore, thermal diodes were invented and applied.

[0003] Thermal diodes, as the name implies, are heat pipes that only allow heat to flow in one direction, just like a diode, but not in the opposite direction. The working principle of thermal diodes is that the working fluid evaporates and vaporizes in the evaporation section under the action of gravity, acceleration pressure difference, etc., and releases heat in the condensation section to condense into liquid. The condensed liquid flows back to the evaporation section by gravity, acceleration pressure difference, etc., and then continues to evaporate and condense, thus realizing the transfer of heat from the evaporation section to the condensation section and the circulation of the working fluid in the tube.

[0004] Traditional one-way thermal diodes mainly rely on gravity to make the condensed droplets flow back to the evaporation section. Therefore, this type of heat pipe is placed vertically, that is, the evaporation section is located below the condensation end, and the applicable conditions are gravity fields. Under certain conditions where gravity does not act, it cannot play a role in heat transfer. In addition, the existing thermal diode technology for single-phase gas flow only designs a closed one-way valve in the middle position to block the airflow. When the airflow is blocked too much and the steam pressure is high, the steam will escape from the liquid channels on both sides of the valve to the back of the valve, and it will not play a role in blocking heat transfer. In addition, the valve in the middle position will accumulate airflow or liquid, affecting the heat transfer effect.

[0005] In order to solve the above problems, a thermal diode and a processing method thereof are proposed, which can reduce airflow accumulation, have good heat transfer effect, and cannot transfer heat in the reverse direction. Summary of the invention

[0006] The first object of the present invention is to provide a biased single-pass multi-stage gas resistance valve thermal diode, which can reduce airflow accumulation, has good heat transfer effect, and cannot transfer heat in the reverse direction. The second object of the present invention is to provide a processing method for the biased single-pass multi-stage gas resistance valve thermal diode.

[0007] The present invention provides a biased single-pass multi-stage gas resistance valve thermal diode, comprising a tube body, one end of the tube body is a sealed section, and the other end is an open end, the open end of the tube body is connected to a liquid filling tube, a single-pass multi-stage gas resistance valve is arranged inside the tube body, and the horizontal distance between the single-pass multi-stage gas resistance valve and the sealed end of the tube body is greater than the horizontal distance between the single-pass multi-stage gas resistance valve and the open end of the tube body; a liquid wick with a mesh structure is arranged outside the single-pass multi-stage gas resistance valve, the liquid wick is filled with a liquid working medium, and the pores of the liquid wick are liquid channels;

[0008] The single-way multi-stage air-blocking valve comprises a cylinder, a plurality of baffles are arranged inside the cylinder along the length direction, the baffles are inclined toward the sealing end of the tube body, a gap is arranged between the free end of the baffle and the inner wall of the cylinder, all the gaps are connected as steam channels, and the steam channels are S-shaped.

[0009] Furthermore, the cylinder body includes a plurality of connected circular tubes, each of the circular tubes is provided with a blocking piece, and the blocking pieces in two adjacent circular tubes are arranged opposite to each other.

[0010] Furthermore, the cylinder body includes five circular tubes, and two adjacent circular tubes are clamped together.

[0011] Furthermore, one end of the circular tube is provided with a plurality of evenly distributed protrusions, and the other end of the circular tube is provided with corresponding grooves, and the protrusions of the circular tube are inserted into the grooves of the adjacent circular tubes.

[0012] Furthermore, the blade suction core adopts several layers of copper wire meshes which are intertwined with each other.

[0013] Furthermore, the copper wire mesh is a 200-mesh copper wire mesh.

[0014] The method for processing the above-mentioned offset single-pass multi-stage gas resistance valve thermal diode provided by the present invention comprises the following steps:

[0015] (1) A metal cylinder is milled inward along both sides of the circular surface by a milling process to form a round tube with a baffle, and a gap is left between one end of the baffle and the inner wall of the round tube, a groove is machined at one end of the round tube, and a protrusion is machined at a corresponding position at the other end of the round tube, the protrusion of one round tube is inserted into the groove of another round tube, and multiple round tubes are connected in sequence to obtain the single-pass multi-stage air resistance valve;

[0016] (2) interlacing and wrapping a plurality of layers of copper wire mesh around the periphery of the single-pass multi-stage air resistance valve and fixing them to complete the shaping of the liquid wick;

[0017] (3) putting the tube body on the outside of the liquid absorbent core, and fixing the liquid absorbent core at a position near the open end of the tube body;

[0018] (4) a liquid filling tube is provided at the open end of the tube body, and a liquid working medium is injected into the interior of the tube body through the liquid filling tube, and then a vacuum treatment is performed;

[0019] (5) After the vacuum treatment is completed, the pipe opening of the liquid filling pipe is sealed to obtain the single-pass multi-stage gas resistance valve thermal diode.

[0020] Furthermore, the material of the metal cylinder in step (1) is copper; the material of the liquid filling tube and the tube body in step (4) are both copper; and the liquid wick and the tube body in step (3) are interference fit.

[0021] Furthermore, the liquid-filling tube in step (4) is integrally formed with the tube body.

[0022] Furthermore, in step (4), the liquid-filled tube and the tube body are fixed by bonding with high-temperature resistant adhesive, welding or stamping and clamping.

[0023] In summary, the present invention has the following advantages compared with the prior art:

[0024] (1) The thermal diode provided by the technical solution of the present invention, when the steam flows in the forward direction, the sealed end of the tube body is the condensation section, and the open end is the evaporation section. The liquid in the evaporation section is heated and phase-changed into steam. The baffle is arranged to be inclined toward the sealed end. The steam enters from the large mouth of the steam channel and flows out from the small mouth of the steam channel, and obtains a certain acceleration effect. After the circulation is accelerated by multiple baffles, the steam circulation speed is much higher than the inlet speed. The steam can flow to the condensation section quickly and smoothly, thereby improving the forward heat transfer efficiency. When the steam flows in the reverse direction, the steam enters from the small mouth of the air-blocking valve. Since the inclination direction of the baffle is opposite to the flow direction of the airflow, the baffle occupies a larger proportion than the gap, and plays a blocking role. Most of the steam is blocked by the baffle, and only a small part of the steam enters from the small mouth. After being blocked by multiple baffles, the steam cannot flow smoothly to transfer heat, which plays a role in blocking the airflow, so that the gas cannot flow in the reverse direction, and the effect of reverse heat transfer is achieved.

[0025] (2) The horizontal distance between the single-way multi-stage air-blocking valve and the sealed end of the tube body provided in the present invention is greater than the horizontal distance between the single-way multi-stage air-blocking valve and the open end of the tube body. The position of the single-way multi-stage air-blocking valve is biased toward the evaporation section in the forward operation and away from the condensation section in the forward operation. The purpose is to allow the steam to quickly pass through the single-way multi-stage air-blocking valve during the forward operation, thereby preventing the steam from condensing inside the single-way multi-stage air-blocking valve and quickly transferring the heat to the condensation section for condensation and reflux. During the reverse operation, since the single-way multi-stage air-blocking valve is close to the condensation section, the steam can be condensed inside the single-way multi-stage air-blocking valve, thereby further weakening its reverse reflux capacity and enhancing the reverse non-heat transfer effect.

[0026] (3) The one-way flow of gas controlled by the thermal diode provided by the present invention is spontaneously generated inside the thermal diode, does not require external stimulation, does not consume additional energy, is not affected by gravity, and can achieve one-way heat transfer in the horizontal direction and the anti-gravity direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 Schematic diagram of the internal structure of a thermal diode in an embodiment of the present invention;

[0029] Figure 2 A cross-sectional view of a single-pass multi-stage air resistance valve in an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the structure of a circular tube in an embodiment of the present invention;

[0031] Figure 4 Schematic diagram of the working principle of forward heat transfer of a thermal diode in an embodiment of the present invention;

[0032] Figure 5 Schematic diagram of the working principle of reverse heat transfer of the thermal diode in an embodiment of the present invention.

[0033] Explanation of the reference numerals: 1-tube body, 2-liquid absorption core, 3-single-way multi-stage air-blocking valve, 301-cylinder body, 302-circular tube, 3021-slot, 3022-protrusion, 303-blocking piece, 4-liquid filling tube. DETAILED DESCRIPTION

[0034] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0036] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Example

[0038] A biased single-pass multi-stage gas resistance valve thermal diode, such as Figure 1 shown.

[0039] One end of the tube body 1 is a sealed end, and the other end is an open end. The open end of the tube body 1 is connected to the liquid filling tube 4. A single-way multi-stage air resistance valve 3 is provided inside the tube body 1. A liquid absorbent core 2 with a mesh structure is provided outside the single-way multi-stage air resistance valve 3. The liquid absorbent core 2 is filled with liquid working medium. In this embodiment, the liquid working medium is pure water, and the pores of the liquid absorbent core 2 are liquid channels.

[0040] The single-pass multi-stage air resistance valve 3 includes a cylinder 301, such as Figure 2 As shown, a plurality of baffles 303 are fixed inside the cylinder 301 along the length direction. The cylinder 301 includes 5 circular tubes 302 connected in sequence. A baffle 303 is respectively provided in each circular tube 302. The baffles 303 inside two adjacent circular tubes 302 are arranged opposite to each other. The inclination direction of the baffles 303 is toward the sealing end of the tube body 1. A gap is provided between the free end of the baffle 303 and the inner wall of the cylinder 301. All the gaps are connected as steam channels, and the steam channels are S-shaped.

[0041] In this embodiment, the inclination angle of the baffle 303 with the horizontal plane is 152°, the horizontal distance between the fixed end of the baffle 303 and the gas inlet of the circular tube 302 (the end of the circular tube 302 close to the fixed end of the baffle 303) is 2.75mm, and the horizontal distance between the free end of the baffle 303 and the gas outlet (the end of the circular tube 302 close to the free end of the baffle 303) is 1.5mm, ensuring that the airflow channels have the same size when assembled, and the vertical distance between the free end of the baffle 303 and the inner wall of the circular tube 302 (i.e. the gap mentioned above) is 1.6mm, ensuring smooth passage of airflow. In addition, the asymmetric distance between the baffle 303 and the gas outlet and the gas inlet ensures that more gas flows in the forward direction and better blocks the reverse airflow.

[0042] Two adjacent round tubes 302 are connected by clamping, such as Figure 3 As shown, one end of each circular tube 302 is provided with four evenly distributed protrusions 3022, and the other end of the circular tube 302 is provided with four corresponding grooves 3021. The protrusions 3022 of the circular tube 302 are inserted into the grooves 3021 of the adjacent circular tube 302, and are connected in sequence to form a single-pass multi-stage air resistance valve 3.

[0043] The horizontal distance between the single-pass multi-stage air-blocking valve 3 and the sealed end of the tube body 1 is greater than the horizontal distance between the single-pass multi-stage air-blocking valve 3 and the open end of the tube body 1. The single-pass multi-stage air-blocking valve 3 is close to the open end and far away from the sealed end. The position of the single-pass multi-stage air-blocking valve 3 is close to the evaporation section of the forward operation and far away from the condensation section of the forward operation. The purpose is to allow the steam to quickly pass through the single-pass multi-stage air-blocking valve 3 during forward operation, to prevent the influence of condensation inside the single-pass multi-stage air-blocking valve 3, and to quickly transfer the heat to the condensation section for condensation and reflux. During reverse operation, since the single-pass multi-stage air-blocking valve 3 is close to the condensation section, the steam can be condensed inside the single-pass multi-stage air-blocking valve 3, further weakening its reverse reflux capacity and enhancing the reverse non-heat transfer effect.

[0044] The liquid wick 2 uses several layers of copper wire mesh. In this embodiment, two layers of 200-mesh copper wire mesh are intertwined to form a mesh structure with capillary pressure, which serves as a liquid channel to transport the condensed liquid in the condensation section back to the evaporation section through capillary pressure to complete the gas-liquid circulation inside the thermal diode. To clearly show the internal structure of the thermal diode, Figure 1 , Figure 2 , Figure 4 and Figure 5 The mesh of the liquid-absorbing core 2 is omitted.

[0045] The diameter of the liquid filling tube 4 is smaller than that of the tube body 1. The liquid filling tube 4 is used to fill the liquid working medium and to draw a vacuum, thereby reducing the pressure inside the tube body 1, lowering the boiling point of the liquid, and making the liquid evaporate more easily, so that the thermal diode can work normally at a lower temperature.

[0046] The processing method of the above-mentioned biased single-pass multi-stage gas resistance valve thermal diode is as follows:

[0047] (1) The metal cylinder is milled inward along both sides of the circular surface by a milling process so that a baffle 303 with a certain inclination angle is formed in the middle, thereby obtaining a circular tube 302 with the baffle 303, and a gap is left between one end of the baffle 303 and the inner wall of the circular tube 302; four protrusions 3022 are processed on the outer cylindrical surface of one end of the circular tube 302, and each protrusion 3022 is 90 degrees apart; four concave grooves 3021 are processed at corresponding positions on the inner cylindrical surface of the other end of the circular tube 302; the five processed circular tubes 302 are connected and clamped in the order of small opening to large opening (the small opening is the end of the baffle 303 close to the gap, and the large opening is the end of the baffle 303 away from the gap) to form a single-pass multi-stage air-blocking valve 3, and the steam channel inside the single-pass multi-stage air-blocking valve 3 is S-shaped.

[0048] (2) The two layers of copper wire mesh are alternately wound around the cylinder 301 of the single-pass multi-stage air resistance valve 3 and fixed to complete the shaping of the liquid absorption core 2.

[0049] (3) The tube body 1 is put on the outside of the absorbent core 2, and the absorbent core 2 is fixed at a position of the tube body 1 close to the open end by using interference fit.

[0050] (4) A liquid filling tube 4 is provided on the tube body 1, and pure water is injected into the interior of the tube body 1 through the liquid filling tube 4, and then a vacuum treatment is performed to reduce the internal air pressure so that the liquid can be more easily vaporized.

[0051] (5) After the vacuum treatment is completed, the pipe mouth of the liquid filling pipe 4 is punched to deform it, and then the pipe mouth of the liquid filling pipe 4 is welded and sealed to obtain a single-pass multi-stage gas resistance valve thermal diode.

[0052] After the thermal diode is manufactured, a unidirectional heat transfer test must be performed to ensure that it can be used normally.

[0053] The metal cylinder is made of copper, and the tube body 1 and the liquid-filled tube 4 are both made of copper. The tube body 1 and the liquid-filled tube 4 can be integrally formed, or can be fixed by bonding with high-temperature resistant adhesive, welding, or stamping and clamping.

[0054] The working principle of the thermal diode of the single-pass multi-stage gas resistance valve provided by the present invention is as follows:

[0055] In normal operation, the end of the tube body close to the liquid-filled tube is the evaporation section, which is in contact with the heating element in actual applications, such as the computer CPU; the middle section is the insulation section; the other end is the condensation section, which is in contact with the heat dissipation element in actual applications, such as the computer's cooling fan; the temperature of the evaporation section is higher than that of the condensation section, and the liquid in the evaporation section is heated to change into steam, and the steam flows to the condensation section through the steam channel in the middle, such as Figure 4The direction of steam flow. The direction of steam flow is also the direction in which the baffle is tilted. Steam will flow in from the large opening of the steam channel and out from the small opening, and obtain a certain acceleration effect. After experiencing the flow acceleration of the five airway ports, the outlet gas velocity is much higher than the inlet velocity, and the steam can quickly and smoothly reach the condensation section. In addition, the single-pass multi-stage air resistance valve is set closer to the evaporation section, so that the steam can quickly pass through the single-pass multi-stage air resistance valve and quickly transfer the heat to the condensation section. Since the temperature of the condensation section is relatively low, the steam changes phase when it is cooled and liquefies. The liquid absorption core inside the thermal diode is a porous medium structure, and there is less liquid in the evaporation section and more liquid in the condensation section. Therefore, the copper wire mesh in the evaporation section is relatively "dry" and the copper wire mesh in the condensation section is relatively "wet". The copper wire mesh has capillary pressure, which transports the liquid in the condensation section to the evaporation section (just like the function of paper towels or sponges to absorb water, the liquid will flow to the drier end through the porous structure of the copper wire mesh). Then the liquid is heated again and evaporates and changes phase into steam to flow to the condensation section, and so on. In the process of liquid evaporation absorbing heat and steam condensing releasing heat, the heat flow of the evaporation section is transferred to the condensation section, thus having a heat transfer effect.

[0056] When the steam flows in the reverse direction, the end of the pipe body close to the liquid-filled pipe is the condensation section, and the other end is the evaporation section. The liquid in the evaporation section is heated and changes into steam, and flows to the single-pass multi-stage air-blocking valve, that is, Figure 5 The direction of steam flow is opposite to the tilt direction of the baffle. Steam enters from the small opening of the single-pass multi-stage air-blocking valve. The baffle is larger than the gap, which plays a blocking role. Most of the steam is blocked by the baffle, and only a small part of the steam enters from the gap. After being blocked by five baffles, the steam cannot flow smoothly to transfer heat, which plays a role in blocking the passage of airflow, making it impossible for the gas to flow in the reverse direction. At this time, since the single-pass multi-stage air-blocking valve is close to the condensation section, most of the steam will be condensed into the single-pass multi-stage air-blocking valve to form liquid that cannot flow back, blocking the liquid reflux capacity, so that the heat will not be transferred to the condensation section. Therefore, basically the heat will not be transferred to the condensation end, which makes the thermal diode unable to transfer heat in the reverse direction, which can protect electronic products.

[0057] The biased single-pass multi-stage gas resistance valve thermal diode provided by the present invention can only transfer heat in a specific heat transfer direction and cannot achieve heat transfer in the opposite direction. Different from traditional thermal diodes, it can not only achieve the effect of one-way heat transfer under zero-gravity conditions, but also can block the airflow pressure with staggered multi-stage baffles when the gas flows in the opposite direction, and can effectively reduce the accumulation of airflow and weaken the airflow pressure. The set single-pass multi-stage gas resistance valve can also block the reflux of liquid and achieve the effect of preventing heat transfer in the reverse direction. It can be used in the heat dissipation of equipment in the aerospace industry to protect important components.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A biased single-pass multi-stage gas resistance valve thermal diode, characterized in that: The invention comprises a tube body (1), wherein one end of the tube body (1) is a sealed end and the other end is an open end, the open end of the tube body (1) is connected to a liquid filling tube (4), a single-way multi-stage air-blocking valve (3) is arranged inside the tube body (1), and the horizontal distance between the single-way multi-stage air-blocking valve (3) and the sealed end of the tube body (1) is greater than the horizontal distance between the single-way multi-stage air-blocking valve (3) and the open end of the tube body (1); the position of the single-way multi-stage air-blocking valve (3) is biased toward the evaporation section working in the forward direction and is biased away from the condensation section working in the forward direction; a liquid wick (2) with a mesh structure is arranged outside the single-way multi-stage air-blocking valve (3), the liquid wick (2) is filled with a liquid working medium, and the pores of the liquid wick (2) are liquid channels; The single-way multi-stage air resistance valve (3) comprises a cylinder (301), a plurality of baffles (303) are arranged inside the cylinder (301) along the length direction, the baffles (303) are inclined toward the sealing end of the tube (1), a gap is arranged between the free end of the baffle (303) and the inner wall of the cylinder (301), all the gaps are connected to form a steam channel, and the steam channel is S-shaped; The cylinder (301) comprises a plurality of connected circular tubes (302), each of the circular tubes (302) being provided with a baffle (303), and the baffles (303) in two adjacent circular tubes (302) being arranged opposite to each other; the distances between the baffles (303) and the gas outlet and the gas inlet of the circular tube (302) are asymmetrical; The liquid absorbing core (2) is made of a plurality of layers of copper wire meshes which are intertwined with each other and are interlacedly wound on the cylinder (301) of the single-pass multi-stage air resistance valve (3); The cylinder (301) comprises five circular tubes (302), and two adjacent circular tubes (302) are clamped together; One end of the circular tube (302) is provided with a plurality of evenly distributed protrusions (3022), and the other end of the circular tube (302) is provided with a corresponding clamping groove (3021), and the protrusion (3022) of the circular tube (302) is inserted into the clamping groove (3021) of the adjacent circular tube (302).

2. The biased single-pass multi-stage gas resistance valve thermal diode according to claim 1, characterized in that: The copper wire mesh is 200 mesh copper wire mesh.

3. A method for processing a biased single-pass multi-stage gas resistance valve thermal diode according to any one of claims 1-2, characterized in that: The following steps are involved: (1) A metal cylinder is milled inwardly along both sides of a circular surface by a milling process to form a circular tube (302) with a baffle (303), and a gap is left between one end of the baffle (303) and the inner wall of the circular tube (302); a groove (3021) is machined at one end of the circular tube (302), and a protrusion (3022) is machined at a corresponding position at the other end of the circular tube (302); the protrusion (3022) of one circular tube (302) is inserted into the groove (3021) of another circular tube (302), and a plurality of circular tubes (302) are connected in sequence to obtain the single-pass multi-stage air resistance valve (3); (2) winding a plurality of layers of copper wire mesh alternately around the outer periphery of the single-pass multi-stage air resistance valve (3) and fixing them to complete the shaping of the liquid wick (2); (3) putting the tube body (1) on the outside of the absorbent core (2), and fixing the absorbent core (2) at a position close to the open end of the tube body (1); (4) a liquid filling pipe (4) is arranged at the open end of the tube body (1), and a liquid working medium is injected into the interior of the tube body (1) through the liquid filling pipe (4), and then a vacuum treatment is performed; (5) After the vacuum treatment is completed, the pipe opening of the liquid filling pipe (4) is sealed to obtain the single-pass multi-stage gas resistance valve thermal diode.

4. The processing method according to claim 3, characterized in that: The material of the metal cylinder in step (1) is copper; the material of the liquid filling tube (4) and the tube body (1) in step (4) are both copper; and the liquid wick (2) and the tube body (1) in step (3) are interference fit.

5. The processing method according to claim 3, characterized in that: In step (4), the liquid filling tube (4) and the tube body (1) are integrally formed.

6. The processing method according to claim 3, characterized in that: In step (4), the liquid-filled tube (4) and the tube body (1) are fixed by bonding with high-temperature resistant adhesive, welding or stamping and clamping.

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