Electrochromic device and manufacturing method thereof, terminal product
By setting through holes on the substrate and filling them with conductive material, the problem of damage to the sealing structure caused by electrode lead-out was solved, achieving high sealing and waterproof performance of the electrochromic device, and improving the reliability and aesthetics of the product.
Patent Information
- Application Number
- CN202310699604.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-13
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2043-06-13
AI Technical Summary
When the electrodes of existing electrochromic devices are led out, the integrity of the sealing structure is compromised, allowing moisture to enter and affecting the sealing performance and service life of the device.
By setting a first through hole and a second through hole on the substrate and filling the holes with conductive material to replace the traditional wires, the conductivity of the electrochromic layer is ensured while maintaining the integrity of the sealing structure.
It improves the sealing performance and waterproofing of electrochromic devices, reduces the difficulty and cost of sealant production, and enhances the reliability and aesthetics of the products.
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Figure CN116841098B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electrochromic technology, and in particular to an electrochromic device, a manufacturing method thereof, and a terminal product. BACKGROUND
[0002] Electrochromism is a phenomenon that the optical properties (reflectivity, transmittance, absorptivity, etc.) of a material change stably and reversibly under the action of an applied electric field, which is manifested as reversible changes in color and transparency in appearance. In recent years, electrochromic technology has been widely applied in products such as vehicle rearview mirrors, vehicle sunroofs, display devices, etc.
[0003] In the prior art, when the electrochromic device is electrode-extracted, a wire needs to pass through the side sealing structure to connect the electrochromic film layer inside the sealing structure and the external power supply outside the sealing structure. This electrode-extraction method will damage the integrity of the sealing structure, and water vapor will easily enter the inside of the electrochromic device through the sealing structure along the wire, thereby causing problems such as failure of the electrochromic material and damage to the electrochromic device. SUMMARY
[0004] The present application aims to provide an electrochromic device, a manufacturing method thereof, and a terminal product, to solve the technical problem of poor sealing performance of the electrochromic device in the related art.
[0005] In a first aspect, the present application provides an electrochromic device, comprising:
[0006] A substrate assembly comprising two substrates arranged at intervals along a first direction, a containing space being formed between the two substrates;
[0007] An electrochromic assembly arranged in the containing space, the electrochromic assembly comprising a first conductive layer, an electrochromic layer and a second conductive layer arranged in sequence along the first direction;
[0008] The substrate assembly is provided with a first through hole and a second through hole, the first through hole is filled with a first conductive material, the first conductive material is used to block the first through hole and is electrically connected with the first conductive layer, the second through hole is filled with a second conductive material, the second conductive material is used to block the second through hole and is electrically connected with the second conductive layer.
[0009] In one embodiment, the first conductive layer has a first connecting portion protruding from the electrochromic layer and the second conductive layer along a second direction perpendicular to the first direction, the first through hole at least partially overlaps the first connecting portion in the projection of the first conductive layer, and the first conductive material is electrically connected to the first connecting portion; the second conductive layer has a second connecting portion protruding from the electrochromic layer and the first conductive layer along the second direction, the second through hole at least partially overlaps the second connecting portion in the projection of the second conductive layer, and the second conductive material is electrically connected to the second connecting portion.
[0010] In one embodiment, the first conductive material also fills the accommodation space, and the first conductive material is connected to the first connecting portion.
[0011] In one embodiment, a first conductive member is arranged in the accommodation space, and the first conductive material is connected to the first connecting portion through the first conductive member.
[0012] In one embodiment, one end of the first conductive member abuts at the aperture of the first through hole and is used to close the first through hole, and the other end is connected to the first connecting portion.
[0013] In one embodiment, the first conductive material also fills the accommodation space, one end of the first conductive member is connected to the first connecting portion, and the other end is connected to the first conductive material in the accommodation space.
[0014] In one embodiment, the first conductive member is any one of a flexible circuit board, a copper sheet, and a conductive adhesive tape.
[0015] In one embodiment, the second conductive layer is coated with an insulating material near the end of the first connecting portion.
[0016] In one embodiment, the first through hole and the projection of the first conductive layer on the second conductive layer are at least 0.1 mm apart.
[0017] In one embodiment, the second conductive layer is provided with an etching line near one end of the first connecting portion, and the etching line is used to separate an insulating area near one end of the second conductive layer from the first through hole.
[0018] In one embodiment, along the second direction, the length of the first through hole is greater than the length of the first connecting portion, the projection of the first through hole on the first conductive layer partially overlaps the first connecting portion, and the other part overlaps the area of the first conductive layer outside the first connecting portion.
[0019] In one embodiment, the first through hole is arranged on the substrate away from the first conductive layer, and the second through hole is arranged on the substrate away from the second conductive layer.
[0020] In one embodiment, the first through hole and the second through hole are arranged on the substrate away from the first conductive layer.
[0021] In one embodiment, the second connecting part is provided with a channel opposite to and in communication with the second through hole, and the second conductive material is also filled in the channel, and the second connecting part away from the second through hole is provided with a second conductive part for closing the channel.
[0022] In one embodiment, the surface of the second connecting part is coated with a second conductive part, and the second conductive material is also filled in the accommodation space and connected with the second conductive part.
[0023] In one embodiment, the electrochromic device further comprises a sealing member arranged on the outer surface of the substrate and covering the orifices of the first through hole and the second through hole.
[0024] In the scheme provided in the present application, the lead-out mode and conductive structure of the electrochromic layer are changed. Specifically, a first through hole and a second through hole are arranged on the substrate, and a first conductive material electrically connected with the first conductive layer is filled in the first through hole, and a second conductive material electrically connected with the second conductive layer is filled in the second through hole. Since the first conductive material and the second conductive material have good conductive capacity, the first conductive material and the second conductive material are used to replace the traditional wire lead-out structure, which can ensure the integrity of the sealing structure of the electrochromic device under the premise of ensuring the conductive performance of the electrochromic layer, thereby improving the sealing performance and waterproof capacity of the electrochromic device.
[0025] In a second aspect, the present application provides a manufacturing method of an electrochromic device, which is used to manufacture the electrochromic device of the first aspect, and the manufacturing method comprises:
[0026] providing a substrate assembly, arranging a first through hole and a second through hole on the substrate assembly, and the substrate assembly comprising two substrates arranged at intervals;
[0027] providing an electrochromic assembly, and arranging the electrochromic assembly between the two substrates, and the electrochromic assembly comprising a first conductive layer, an electrochromic layer and a second conductive layer;
[0028] Fill the first conductive material into the first through hole, so that the first conductive material is electrically connected with the first conductive layer, and fill the second conductive material into the second through hole, so that the second conductive material is electrically connected with the second conductive layer.
[0029] The manufacturing method provided in the application can improve the integrity of the sealing structure of the electrochromic device by arranging the first through hole and the second through hole on the substrate, filling the first conductive material electrically connected with the first conductive layer into the first through hole, and filling the second conductive material electrically connected with the second conductive layer into the second through hole, thereby improving the sealing performance and waterproof capability of the electrochromic device.
[0030] In a third aspect, the application provides a terminal product, including the electrochromic device in the first aspect, wherein the terminal product includes any one of a rearview mirror, a curtain wall, an automobile sunroof, an automobile side window, an automobile windshield, a shell of an electronic product, glasses, a vehicle, and a display panel.
[0031] The terminal product provided in the application can effectively improve the sealing performance and waterproof capability of the product by improving the structure of the electrochromic sealing device, in particular, by improving the electrode leading-out mode and conductive structure of the electrochromic layer in the electrochromic sealing device. BRIEF DESCRIPTION OF DRAWINGS
[0032] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0033] Figure 1 The structural schematic diagram of the electrochromic device provided in Embodiment One of the application;
[0034] Figure 2 The structural schematic diagram of the electrochromic device provided in Embodiment One of the application; Figure 1 The structural schematic diagram of the substrate side of the electrochromic device in the embodiment shown;
[0035] Figure 3 The structural schematic diagram of the substrate side of the electrochromic device in the embodiment shown; Figure 1 The structural schematic diagram of the substrate side of the electrochromic device in the embodiment shown;
[0036] Figure 4 The structural schematic diagram of the electrochromic device provided in Embodiment Two of the application;
[0037] Figure 5 The structural schematic diagram of the electrochromic device provided in Embodiment Three of the application;
[0038] Figure 6 A structural schematic diagram of an electrochromic device provided in Embodiment Four of the present application;
[0039] Figure 7 A structural schematic diagram of an electrochromic device provided in Embodiment Five of the present application;
[0040] Figure 8 A structural schematic diagram of a substrate side of an electrochromic device in the embodiment shown; Figure 7
[0041] Figure 9 A structural schematic diagram of an electrochromic device provided in Embodiment Six of the present application;
[0042] Figure 10 A structural schematic diagram of an electrochromic device provided in Embodiment Seven of the present application;
[0043] Figure 11 A structural schematic diagram of an electrochromic device provided in Embodiment Eight of the present application;
[0044] Figure 12 A structural schematic diagram of an electrochromic device provided in Embodiment Nine of the present application;
[0045] Figure 13 A structural schematic diagram of an electrochromic device provided in Embodiment Ten of the present application;
[0046] Figure 14 A structural schematic diagram of an electrochromic device provided in Embodiment Eleven of the present application;
[0047] Figure 15 A structural schematic diagram of an electrochromic device provided in Embodiment Twelve of the present application;
[0048] Figure 16 A flowchart of a manufacturing method of an electrochromic device provided in the present application.
[0049] 100、An electrochromic device;
[0050] 1、A substrate; 11、A first via hole; 12、A second via hole; 21、A first conductive layer; 211、A first connecting part; 22、An electrochromic layer; 23、A second conductive layer; 231、A second connecting part; 24、An etching line; 31、A first conductive material; 32、A second conductive material; 41、A photoresist layer; 42、A first flexible substrate; 43、A second flexible substrate; 5、A sealing member; 6、An insulating material; 71、A first conductive member; 72、A second conductive member; 73、A third conductive member; 8、A channel. DETAILED DESCRIPTION
[0051] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present application and should not be used to limit the present application.
[0052] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly or indirectly disposed on the other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the patent. The terms "first", "second" are merely for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.
[0053] In the present application, the reference "one embodiment", "some embodiments" or "embodiments" means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in other some embodiments" and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. In addition, in one or more embodiments, specific features, structures or characteristics can be combined in any suitable manner.
[0054] In a first aspect, the present application provides an electrochromic device.
[0055] With reference to Figure 1 The electrochromic device 100 includes a substrate assembly, an electrochromic assembly, a first conductive material 31 and a second conductive material 32. The substrate assembly includes two substrates 1 arranged at intervals along a first direction (e.g., the direction shown by Y in FIG. 1), and a receiving space is formed between the two substrates 1. The electrochromic assembly is arranged in the receiving space, and the electrochromic assembly includes a first conductive layer 21, an electrochromic layer 22 and a second conductive layer 23 arranged in sequence along the first direction. The substrate assembly is provided with a first through hole 11 and a second through hole 12, the first through hole 11 is filled with the first conductive material 31, the first conductive material 31 is used to block the first through hole 11 and is electrically connected to the first conductive layer 21, the second through hole 12 is filled with the second conductive material 32, and the second conductive material 32 is used to block the second through hole 12 and is electrically connected to the second conductive layer 23. Figure 1 The electrochromic device 100 includes a substrate assembly, an electrochromic assembly, a first conductive material 31 and a second conductive material 32. The substrate assembly includes two substrates 1 arranged at intervals along a first direction (e.g., the direction shown by Y in FIG. 1), and a receiving space is formed between the two substrates 1. The electrochromic assembly is arranged in the receiving space, and the electrochromic assembly includes a first conductive layer 21, an electrochromic layer 22 and a second conductive layer 23 arranged in sequence along the first direction. The substrate assembly is provided with a first through hole 11 and a second through hole 12, the first through hole 11 is filled with the first conductive material 31, the first conductive material 31 is used to block the first through hole 11 and is electrically connected to the first conductive layer 21, the second through hole 12 is filled with the second conductive material 32, and the second conductive material 32 is used to block the second through hole 12 and is electrically connected to the second conductive layer 23.
[0056] The electrochromic device 100 further comprises a frame glue, an optical glue layer 41, a first flexible substrate 42 and a second flexible substrate 43. The frame glue is arranged around the periphery of the substrate 1, used to connect two substrates 1 and seal the accommodation space. The optical glue layer 41 is arranged between the electrochromic assembly and the substrate 1, used to realize the fixed connection of the electrochromic assembly and the substrate 1, and the optical glue layer 41 can be OCA (Optically Clear Adhesive) optical glue or polyvinyl butyral resin (PVB), but is not limited thereto. The first flexible substrate 42 is arranged on one side of the first conductive layer 21, used to support the first conductive layer 21; the second flexible substrate 43 is arranged on one side of the second conductive layer 23, used to support the second conductive layer 23, and the first flexible substrate 42 and the second flexible substrate 43 can be polyethylene terephthalate (PET) or cyclic olefin copolymer, but are not limited thereto.
[0057] The first conductive material 31 and the second conductive material 32 are also used to connect the external power supply lead, so as to realize the electrical connection between the external power supply and the electrochromic layer 22. By using the external power supply, the voltage can be applied to the electrochromic layer 22 and the electrochromic layer 22 can be controlled to change color.
[0058] The electrochromic layer 22 comprises a color-changing material layer, an electrolyte layer and an ion storage layer which are sequentially stacked.
[0059] The first conductive layer 21 and the second conductive layer 23 are closely attached to the electrochromic layer 22, and at least one of the first conductive layer 21 and the second conductive layer 23 and the substrate 1 opposite thereto are transparent structures, used to display the optical property change of the electrochromic layer 22. The first conductive layer 21 and the second conductive layer 23 can be indium tin oxide, aluminum zinc oxide or nano silver wire, but are not limited thereto.
[0060] In the scheme provided in the present application, the lead-out mode and the conductive structure of the electrochromic layer 22 are changed. Specifically, the first through hole 11 and the second through hole 12 are arranged on the substrate 1, and the first conductive material 31 electrically connected to the first conductive layer 21 is filled in the first through hole 11, and the second conductive material 32 electrically connected to the second conductive layer 23 is filled in the second through hole 12. Since the first conductive material 31 and the second conductive material 32 have good conductive capacity, by using the first conductive material 31 and the second conductive material 32 to replace the traditional wire lead-out structure, the integrity of the sealing structure of the electrochromic device 100 can be ensured under the premise of ensuring the conduction performance of the electrochromic layer 22, so as to improve the sealing performance and waterproof ability of the electrochromic device 100.
[0061] In addition, the first through hole 11 and the second through hole 12 are arranged on the substrate 1 in a front lead-out structure, which is also conducive to reducing the manufacturing difficulty of the frame glue in the electrochromic device 100. Because when a traditional side lead-out structure is adopted, the electrochromic assembly is usually first placed between the two substrates 1, and then the frame glue (such as sealant, etc.) is arranged around the electrochromic assembly between the two substrates 1. At this time, at the position of the side lead-out structure, the lead-out structure still exists between the substrates 1, which divides the filling height of the sealant at this position into two parts, thereby reducing the filling height of the sealant. However, the sealant generally has a certain viscosity and limited flowability, so the filling process difficulty of the sealant at the position of the side lead-out structure is greatly increased. At the same time, in order to ensure that the sealant can be completely filled, the sealant is usually slightly over-provided, which causes the excess sealant to overflow from the side surface of the electrochromic device 100 after solidification. At this time, the excess sealant protruding from the edge can be seen from the front of the electrochromic device 100. Therefore, in order to ensure the appearance, the excess sealant needs to be manually scraped off with a knife. However, due to the design of the side lead-out structure, the lead-out structure is easily cut or broken when the excess sealant at the position of the lead-out structure is scraped off, thereby affecting the connection stability of the lead-out structure. In severe cases (when the lead-out structure is broken), the device cannot be led out, which causes the device to be scrapped. Therefore, the scraping operation at this position is particularly careful in production, which reduces the production efficiency.
[0062] Further, when the electrochromic device 100 is a rearview mirror product, the front lead-out structure is also conducive to reducing the curing difficulty of the frame glue in the electrochromic device 100. Because the two substrates 1 of the existing EC rearview mirror (Electro-Chromic Mirror) product are respectively provided with a reflective layer and a shielding ring located at the periphery, so that the frame glue can only be cured by UV light from the side. At this time, if the side lead-out structure is adopted, the lead-out structure is difficult to be arranged completely parallel to the plane of the substrate 1, but is arranged at a certain angle, thereby causing the inclined lead-out structure to partially block the UV light when the sealant is cured by UV light, so that the corresponding sealant cannot be cured, which affects the sealing performance of the sealant, thereby affecting the performance of the entire rearview mirror product. It can be understood that the above problem exists not only when the electrochromic device 100 is a rearview mirror product, but also when the electrochromic device 100 can only be cured by side UV curing of the sealant. At this time, the front lead-out structure provided by the present application can solve the above problem.
[0063] In the scheme provided by the present application, as shown in Figure 1 The electrochromic device 100 further includes a sealing member 5 arranged on the outer surface of the substrate 1 and covering the hole openings of the first through hole 11 and the second through hole 12.
[0064] The sealing member 5 can be a protective glue or a protective sticker, but is not limited thereto.
[0065] The sealing member 5 covers at least the first through hole 11 and the second through hole 12, and leaves an opening for the external power supply lead to pass through. It should be noted that the sealing member 5 can cover the first through hole 11 and the second through hole 12 before the external power supply lead is connected to the first conductive material 31 and the second conductive material 32, or can cover the first through hole 11 and the second through hole 12 after the external power supply lead is connected to the first conductive material 31 and the second conductive material 32. In some cases, the first conductive material 31 and the second conductive material 32 can overflow the through holes, and the sealing member 5 also needs to wrap the conductive materials that overflow the surface of the substrate 1.
[0066] With the above design, by arranging the sealing member 5, the sealing performance and waterproof capability of the electrochromic device 100 are further improved, and the first conductive material 31 and the second conductive material 32 are protected from corrosion by the external environment. Further, the sealing member 5 can be an insulating sealing member, so as to avoid unwanted electrical connection.
[0067] In the scheme provided in the present application, the first through hole 11 and the second through hole 12 can be circular holes, square holes or strip-shaped holes, but are not limited thereto. Optionally, in an embodiment, the first through hole 11 and the second through hole 12 are square holes, and in order to reduce the difficulty of filling and the resistance value of the first conductive material 31 and the second conductive material 32, the width (the size in the second direction) of the first through hole 11 and the second through hole 12 is not less than 2 mm, and the length is not less than 10 mm.
[0068] In the scheme provided in the present application, the first conductive material 31 and the second conductive material 32 can be conductive glue, conductive silver paste or conductive ink, but are not limited thereto. It can be understood that the first conductive material 31 and the second conductive material 32 are essentially a material that has the ability to conduct electricity, can flow and fill the through hole in a liquid state, and can seal the through hole after solidification.
[0069] It should be noted that the first conductive material 31 and the second conductive material 32 can be materials with sealing effect or materials without sealing effect. When the first conductive material 31 and the second conductive material 32 have sealing effect, since the first conductive material 31 is used to block the first through hole 11, that is, the first conductive material 31 fills the first through hole 11, the sealing at the first through hole 11 can be guaranteed, and similarly, the sealing at the second through hole 12 can also be guaranteed by the second conductive material 32; when the first conductive material 31 and the second conductive material 32 do not have sealing effect, the sealing at the second through hole 12 can be improved by setting the sealing member 5 covering the first through hole 11 and the second through hole 12. It can be understood that when the first conductive material 31 and the second conductive material 32 have sealing effect, a protective layer covering the first through hole 11 and the second through hole 12 can also be set to protect the first conductive material 31 and the second conductive material 32 from being corroded by the external environment, and further, the protective layer can be the sealing member 5, which is conducive to further improving the sealing performance and waterproof capability of the electrochromic device 100.
[0070] Optionally, in an embodiment, the first conductive material 31 and the second conductive material 32 are of the same material, both of which are conductive silver paste. The conductive silver paste has good conductivity and can be quickly solidified at low temperature, and using the conductive silver paste as the sealing and electrical connection structure has good effect, low cost and simple processing technology.
[0071] In the scheme provided in the present application, as shown in Figure 1 and Figure 2 , the first conductive layer 21 has a first connecting portion 211, the first connecting portion 211 protrudes from the electrochromic layer 22 and the second conductive layer 23 along a second direction perpendicular to the first direction (as shown by X in Figure 1 ), the projection of the first through hole 11 on the first conductive layer 21 at least partially overlaps the first connecting portion 211, and the first conductive material 31 is electrically connected with the first connecting portion 211. The second conductive layer 23 has a second connecting portion 231, the second connecting portion 231 protrudes from the electrochromic layer 22 and the first conductive layer 21 along the second direction, the projection of the second through hole 12 on the second conductive layer 23 at least partially overlaps the second connecting portion 231, and the second conductive material 32 is electrically connected with the second connecting portion 231.
[0072] Specifically, the lengths of the first conductive layer 21 and the second conductive layer 23 in the second direction are greater than the length of the electrochromic layer 22, the part of the first conductive layer 21 other than the first connecting portion 211 is flush with the electrochromic layer 22 away from one end of the first connecting portion 211, and the part of the second conductive layer 23 other than the second connecting portion 231 is flush with the electrochromic layer 22 away from one end of the second connecting portion 231, so that the first connecting portion 211 and the second connecting portion 231 protrude from the opposite ends of the electrochromic layer 22, respectively.
[0073] The first through hole 11 is opposite to the first connecting part 211, and the projection of the first conductive layer 21 in the first through hole 11 can completely fall into the first connecting part 211 or partially fall into the first connecting part 211. The second through hole 12 is opposite to the second connecting part 231, and the projection of the second conductive layer 23 in the second through hole 12 can completely fall into the second connecting part 231 or partially fall into the second connecting part 231.
[0074] With the above design, on the one hand, by forming a stepped surface structure at the end of the first conductive layer 21 and the electrochromic layer 22 and the second conductive layer 23 and the electrochromic layer 22, the first connecting part 211 and the second connecting part 231 can be exposed, thereby facilitating the design of the lead-out structure of the conductive layer; on the other hand, the opening positions of the first through hole 11 and the second through hole 12 at least partially coincide with the stepped surface structure, facilitating the electrical connection of the conductive material and the connecting part; on the other hand, the electrochromic assembly structure is reasonable, and the sealing space is efficiently utilized. The electrochromic layer 22 occupies a large proportion and can be completely exposed, thereby also ensuring the use effect of the electrochromic layer 22.
[0075] In the scheme provided in the present application, the connection mode between the first conductive material 31 and the first connecting part 211 is not unique.
[0076] In some embodiments, as shown in Figure 1 The first conductive material 31 also fills in the accommodation space, and the first conductive material 31 and the first connecting part 211 are connected to each other.
[0077] When manufacturing the electrochromic device 100, the substrate assembly and the electrochromic assembly can be assembled first, and then the first conductive material 31 is injected into the first through hole 11 and the opposite accommodation space, and the second conductive material 32 is injected into the second through hole 12 and the opposite accommodation space, and the first conductive material 31 and the second conductive material 32 are extended from the through hole to the opposite connecting part.
[0078] With the above design, the first conductive material 31 is directly connected to the first connecting part 211, and the second conductive material 32 is directly connected to the second connecting part 231, which has good electrical connection effect and simple processing technology of the electrochromic device 100.
[0079] In some embodiments, a first conductive part 71 is arranged in the accommodation space, and the first conductive material 31 is electrically connected to the first connecting part 211 through the first conductive part 71.
[0080] With the above design, the first conductive part 71 has flexible structure design and is not prone to short circuit problem.
[0081] In the scheme provided in the present application, when the first conductive part 71 is arranged in the accommodation space, the structure of the first conductive part 71 is not unique.
[0082] In some embodiments, such as Figure 4 As shown, one end of the first conductive member 71 abuts against the opening of the first through hole 11 and is used to seal the first through hole 11, while the other end is connected to the first connecting part 211.
[0083] By adopting the above design, the first conductive element 71 closes the first through hole 11, which can prevent the first conductive material 31 in the first through hole 11 from flowing into the accommodating space. This helps to reduce the difficulty of injecting the first conductive material 31 and reduces the risk of short circuit of the electrochromic device 100 caused by the first conductive material 31 flowing into the accommodating space and simultaneously electrolytically contacting the first conductive layer 21 and the second conductive layer 23.
[0084] In some embodiments, such as Figure 5 As shown, the first conductive element 71 is connected to one end of the substrate 1 and also forms a bent structure. The first conductive element 71 includes a first part and a second part that are vertically connected. The first part abuts against the inner surface of the substrate 1 and the cross-sectional size of the first part is larger than that of the second part. The second part is also spaced apart from the ends of the electrochromic layer 22 and the second conductive layer 23 to avoid the first conductive element 71 being too close to the electrochromic layer 22 when the first conductive element 71 is set, thereby causing a certain amount of compressive stress, causing the electrochromic layer 22 to delaminate, and causing the electrochromic layer 22 to have edge failure.
[0085] The electrochromic device 100 also includes a photoresist layer 41 and a first flexible substrate 42. When one end of the first conductive element 71 is designed as a bent structure, a clearance space can be designed at the end of the photoresist layer 41 to accommodate the first part of the first conductive element 71.
[0086] By adopting the above design, the size of the first through hole 11 can be enlarged according to the structure of the first conductive element 71, which helps to reduce the difficulty of filling the first conductive material 31, increase the filling amount and cross-sectional area of the first conductive material 31 in the first through hole 11, and increase the contact area between the first conductive material 31 and the first conductive element 71. When the cross-sectional area and contact area are larger, the resistance of the first conductive material 31 will decrease accordingly, thereby improving the conductivity.
[0087] It is understandable that the first conductive element 71 can be bent to form a structure that is larger at the top and smaller at the bottom, or it may be a structure that is larger at the top and smaller at the bottom by itself.
[0088] In some embodiments, such as Figure 6 As shown, the first conductive material 31 is also filled in the accommodating space, one end of the first conductive member 71 is connected to the first connecting part 211, and the other end is connected to the first conductive material 31 in the accommodating space.
[0089] The first conductive member 71 has a length in the first direction smaller than the distance between the first connecting portion 211 and the first through hole 11, one end of the first conductive member 71 is connected to the first connecting portion 211, and the other end is connected to the first conductive material 31 filled in the accommodation space. The first conductive member 71 is also arranged apart from the end of the electrochromic layer 22 and the second conductive layer 23.
[0090] With the above design, the first conductive material 31 has good electrical conductivity with the first conductive member 71, and compared with directly connecting the first connecting portion 211 with the first conductive material 31, the first conductive member 71 can reduce the height of the accommodation space required to be filled by the first conductive material 31, thereby facilitating the production process and reducing the risk of short circuit of the electrochromic device 100.
[0091] In the scheme provided in the present application, the first conductive member 71 can be any one of a flexible circuit board, a copper sheet and a conductive adhesive tape, but is not limited thereto. It can be understood that the first conductive member 71 is essentially a material with electrical conductivity and solid state.
[0092] Optionally, in an embodiment, the first conductive member 71 is a flexible circuit board. The flexible circuit board has good deformation ability, high flexibility and simple processing technology.
[0093] To avoid the problem of internal short circuit of the electrochromic device 100 caused by the contact between the first conductive material 31 or the first conductive member 71 and the second conductive layer 23, in the scheme provided in the present application, an insulating material 6 can be coated on the end of the second conductive layer 23, or the distance between the first through hole 11 and the second conductive layer 23 in the second direction can be limited, or an insulating area can also be provided on the second conductive layer 23, so as to ensure the insulation of the first conductive material 31 and the first conductive member 71 from the second conductive layer 23.
[0094] In some embodiments, as shown in Figure 1 The second conductive layer 23 has an end coated with an insulating material 6 close to the first connecting portion 211. The insulating material 6 can be insulating glue or ion conductive layer material, but is not limited thereto.
[0095] The insulating material 6 is coated on the surface of the second conductive layer 23 exposed to the side of the first connecting portion 211, and covers at least the portion opposite to the first through hole 11. Optionally, in an embodiment, the insulating material 6 is insulating glue, and the insulating glue also covers the end of the electrochromic layer 22.
[0096] In this way, the first conductive material 31 / first conductive member 71 is separated from the second conductive layer 23 by the insulating material 6, which has good insulation effect and small limitation on the first conductive material 31 and the first conductive member 71, thereby facilitating the processing difficulty.
[0097] In some embodiments, the first through hole 11 and the second conductive layer 23 are spaced apart by at least 0.1 mm in the projection of the first conductive layer 21. Specifically, along the second direction, the first through hole 11 and the end of the second conductive layer 23 are spaced apart, and the spacing is not less than 0.1 mm.
[0098] In this way, the risk of contact between the first conductive material 31 / first conductive member 71 and the second conductive layer 23 is reduced, thereby reducing the risk of short circuit.
[0099] In some embodiments, as shown in Figure 3 The second conductive layer 23 is provided with an etching line 24 near one end of the first connecting portion 211, and the etching line 24 is used to separate an insulating area near one end of the second conductive layer 23 near the first through hole 11.
[0100] The second conductive layer 23 can be divided into two parts by the etching line 24, one part near the first through hole 11 and the other part near the second through hole 12, and the part near the second through hole 12 serves as a functional area for electrical connection with an external power supply.
[0101] Under the action of the etching line 24, the functional area of the second conductive layer 23 can be ensured to be insulated from the first conductive material 31 / first conductive member 71, thereby avoiding short circuit.
[0102] Optionally, the etching line 24 can be a U-shaped surrounding structure that can cover at least the length of the first through hole 11; or the etching line 24 can also be a one-dimensional structure, which can be designed according to actual conditions.
[0103] It can be understood that, due to the small thickness of the first conductive layer 21 and the second conductive layer 23, in some embodiments, in order to reduce the difficulty of production, the etching line 24 can also pass through the photoresist layer 41, the first flexible substrate 42 and the second flexible substrate 43.
[0104] In the scheme provided in the present application, along the second direction, the length of the first through hole 11 can be less than, equal to or greater than the length of the first connecting portion 211.
[0105] In some embodiments, along the second direction, the length of the first through hole 11 is greater than the length of the first connecting portion 211, and the projection of the first through hole 11 on the first conductive layer 21 coincides with the first connecting portion 211, and the other part coincides with the area outside the first connecting portion 211 on the first conductive layer 21.
[0106] In this way, the size of the first through hole 11 can be relatively increased, thereby facilitating the pouring of the first conductive material 31 into the first through hole 11, and increasing the pouring amount and cross-sectional area of the first conductive material 31 in the first through hole 11. When the cross-sectional area is larger, the resistance of the first conductive material 31 will be reduced accordingly, thereby improving the conduction effect.
[0107] In the scheme provided by the present application, the positions where the first through hole 11 and the second through hole 12 are arranged are not unique. The first through hole 11 and the second through hole 12 can be arranged on the same substrate 1 or on different substrates 1.
[0108] In some embodiments, as shown in Figure 1 , the first through hole 11 is arranged on the substrate 1 away from the first conductive layer 21 side of the electrochromic layer 22, and the second through hole 12 is arranged on the substrate 1 away from the second conductive layer 23 side of the electrochromic layer 22.
[0109] In this case, in order to facilitate manufacturing, the conductive structure at the first connecting part 211 and the conductive structure at the second connecting part 231 are generally the same, and the design of the end insulation structure of the first conductive layer 21 and the second conductive layer 23 is also the same, which will not be repeated here. It can be understood that the conductive structure at the first connecting part 211 and the conductive structure at the second connecting part 231 can also be designed differently according to actual conditions, for example, the conductive structure at the first connecting part 211 is only the first conductive material 31 (as shown in Figure 1 ), the conductive structure at the second connecting part 231 includes the second conductive material 32 and the third conductive part 73 (as shown in Figure 2 ), and other possible conditions will not be repeated here; similarly, the design of the end insulation structure of the first conductive layer 21 and the second conductive layer 23 can also be designed differently according to actual conditions.
[0110] In some embodiments, the first through hole 11 and the second through hole 12 are both arranged on the substrate 1 away from the first conductive layer 21 side of the electrochromic layer 22, or both arranged on the substrate 1 away from the second conductive layer 23 side of the electrochromic layer 22.
[0111] In this case, the conductive structure at the first connecting part 211 and the conductive structure at the second connecting part 231 are different, and the conductive structure at the second connecting part 231 is designed according to the structure of the second connecting part 231.
[0112] In the scheme provided by the present application, as shown in Figure 7 and Figure 8 , the first through hole 11 and the second through hole 12 are both arranged on the substrate 1 away from the first conductive layer 21 side of the electrochromic layer 22.
[0113] With the above design, the same-side electrode lead-out can be realized, thereby facilitating production, because only perforation needs to be performed on the same substrate 1, thereby reducing the inconvenience of alignment when the first through hole 11 and the second through hole 12 are arranged on different substrates 1. Meanwhile, the structure of the lead-out electrode is covered and shielded by the sealing member when the electrochromic device 100 is observed from the outside of the substrate 1 on the side close to the first conductive layer 21, thereby ensuring the aesthetic and visual effects on one side of the electrochromic device 100. Further, a ring-shaped shielding layer can be arranged on the outer peripheral edge of the substrate 1 on the side close to the first conductive layer 21 to shield the sealing member and the lead-out structure, thereby further improving the aesthetic and visual effects on one side of the electrochromic device 100.
[0114] In some embodiments, as shown in FIG. 2, the second connecting portion 231 is arranged on the second conductive layer 23 and is arranged to be opposite to the second through hole 12. Figure 7 As shown in FIG. 2, the second connecting portion 231 is arranged on the second conductive layer 23 and is arranged to be opposite to the second through hole 12. The second conductive material 32 is also filled in the channel 8. The second connecting portion 231 is arranged to be opposite to the second through hole 12. The second conductive member 72 is arranged on the side of the second connecting portion 231 away from the second through hole 12 and is used to close the channel 8.
[0115] The second conductive layer 23 and the substrate 1 are further arranged with an optical adhesive layer 41 and a second flexible substrate 43. The channel 8 also needs to pass through the optical adhesive layer 41 and the second flexible substrate 43.
[0116] With the above design, the second conductive member 72 is arranged at one end of the channel 8 and covers the bottom of the channel 8, thereby facilitating the pouring of the second conductive material 32. The second conductive material 32 will not leak out of the channel 8. The second conductive material 32 is in good contact with the second conductive layer 23, thereby facilitating the improvement of the electrical conductivity and the product yield.
[0117] In some embodiments, as shown in FIG. 2, the second connecting portion 231 is arranged on the second conductive layer 23 and is arranged to be opposite to the second through hole 12.
[0118] In some embodiments, as shown in FIG. 2, the second connecting portion 231 is arranged on the second conductive layer 23 and is arranged to be opposite to the second through hole 12. Figure 12 As shown in FIG. 2, the surface of the second connecting portion 231 is coated with the second conductive member 72. The second conductive material 32 is also filled in the accommodation space and is connected with the second conductive member 72.
[0119] Specifically, the second conductive layer 23 and the substrate 1 are further arranged with an optical adhesive layer 41 and a second flexible substrate 43. In order to ensure the electrical connection effect between the second conductive member 72 and the second connecting portion 231, at least the end portion of the optical adhesive layer 41 is designed to have a clearance, so that the second conductive member 72 can be coated on the surface of the second connecting portion 231.
[0120] Optionally, in an embodiment, the second conductive member 72 is coated on the surface of the second flexible substrate 43 and the second connecting portion 231, the thickness of the second conductive member 72 is less than the thickness of the optical adhesive layer 41, and the second conductive material 32 is filled in the gap between the second conductive member 72 and the substrate 1 provided with the second through hole 12.
[0121] With the above design, the conductive structure at the second connecting portion 231 has good conductive performance and simple processing technology.
[0122] It should be noted that in some embodiments, a partition layer or the like can also be designed on the second conductive layer 23 to realize the electrical connection between the second conductive layer 23 and the second conductive material 32 in the second through hole 12. For details, reference can be made to the structure design of single-sided lead-out disclosed in the Chinese invention patents with application publication numbers CN112394581A and CN114815431A, which are not limited herein.
[0123] In the scheme provided in the present application, the second conductive member 72 can be any one of a flexible circuit board, a copper sheet, a conductive clamp and a conductive adhesive tape, but is not limited thereto.
[0124] Optionally, in an embodiment, the second conductive member 72 is a flexible circuit board. The flexible circuit board has good deformation ability, high flexibility and simple processing technology.
[0125] The preferred embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0126] Embodiment One:
[0127] The present embodiment provides an electrochromic device 100, comprising a substrate assembly and an electrochromic assembly.
[0128] As shown in Figure 1 The substrate assembly comprises a first substrate 1a and a second substrate 1b arranged at intervals along a first direction, and a containing space is formed between the first substrate 1a and the second substrate 1b. The second substrate 1b is provided with a first through hole 11, and the first substrate 1a is provided with a second through hole 12.
[0129] The electrochromic assembly is arranged in the containing space and comprises a first conductive layer 21, an electrochromic layer 22 and a second conductive layer 23 arranged in sequence along the first direction. Along a second direction perpendicular to the first direction, the first conductive layer 21 has a first connecting portion 211 protruding from one end of the electrochromic layer 22 and the second conductive layer 23, and the second conductive layer 23 has a second connecting portion 231 protruding from one end of the electrochromic layer 22.
[0130] The first through hole 11 and the accommodating space opposite to the first through hole 11 are filled with a first conductive material 31, and the first conductive material 31 is directly connected to the first connecting part 211; the second through hole 12 and the accommodating space opposite to the second through hole 12 are filled with a second conductive material 32, and the second conductive material 32 is directly connected to the second connecting part 231.
[0131] The ends of the first conductive layer 21 near the second connecting portion 231 and the ends of the second conductive layer 23 near the first connecting portion 211 are coated with insulating material 6.
[0132] The electrochromic device 100 provided in this embodiment improves the sealing and waterproof performance of the electrochromic layer 22 by improving the electrode lead-out method and conductive structure, while reducing the manufacturing difficulty of the frame adhesive in the electrochromic device 100. On the other hand, by improving the setting position of the first through hole 11 and the second through hole 12, directly connecting the first connecting part 211 with the first conductive material 31, and directly connecting the second connecting part 231 with the second conductive material 32, the processing and manufacturing difficulty of the electrochromic device 100 can also be reduced.
[0133] Example 2:
[0134] The difference between the solution provided in this embodiment and that in Embodiment 1 is that a first conductive element 71 and a third conductive element 73 are also provided within the accommodating space. Specifically, as shown... Figure 4 As shown, a first conductive element 71 is disposed between the first connecting portion 211 and the first through hole 11. One end of the first conductive element 71 is connected to the first connecting portion 211, and the other end abuts against the opening of the first through hole 11 on the second substrate 1b and is connected to the first conductive material 31. A second conductive element 72 is disposed between the second connecting portion 231 and the second through hole 12. One end of the second conductive element 72 is connected to the second connecting portion 231, and the other end abuts against the opening of the second through hole 12 on the first substrate 1a and is connected to the second conductive material 32.
[0135] The first conductive element 71 is spaced apart from the ends of the second conductive layer 23 and the electrochromic layer 22, and the third conductive element 73 is spaced apart from the ends of the first conductive layer 21 and the electrochromic layer 22. The ends of the first conductive layer 21 and the second conductive layer 23 may not be coated with insulating material 6.
[0136] The third conductive element 73 can be any one of a flexible circuit board, a copper sheet, and conductive tape, but is not limited to these. Optionally, in this embodiment, the third conductive element 73 is a flexible circuit board. Flexible circuit boards have good deformability, high flexibility, and simple processing technology.
[0137] The electrochromic device 100 provided by the embodiment is advantageous in reducing the difficulty of filling the first conductive material 31 and the second conductive material 32, and reducing the risk of short circuit of the electrochromic device 100 caused by the first conductive material 31 / second conductive material 32 flowing into the accommodation space and simultaneously electrically contacting the first conductive layer 21 and the second conductive layer 23.
[0138] Embodiment three:
[0139] The difference between the scheme provided by the embodiment and the scheme provided by the embodiment two is that one end of the first conductive member 71 and the third conductive member 73 is designed as a bending structure. Specifically, as shown in Figure 5 the first conductive member 71 has a bending portion at the end close to the second substrate 1b, the first conductive member 71 includes a first portion and a second portion connected vertically, the cross-sectional size of the first portion is larger than that of the second portion, the first portion is abutted to the second substrate 1b and partially clamped into the gap between the second flexible substrate 43 and the second substrate 1b, and the second portion is connected to the first connecting portion 211 and is spaced apart from the end portion of the second conductive layer 23. The third conductive member 73 is similar to the first conductive member 71 in structure, and details are not described herein.
[0140] The electrochromic device 100 provided by the embodiment improves the structure of the first conductive member 71 and the third conductive member 73, facilitates the expansion of the size of the first through hole 11 and the second through hole 12, thereby being advantageous in reducing the difficulty of filling the first conductive material 31 and the second conductive material 32, and improving the filling amount and cross-sectional area of the first conductive material 31 and the second conductive material 32, so as to increase the contact area of the first conductive material 31 with the first conductive member 71 and the contact area of the second conductive material 32 with the third conductive member 73. When the cross-sectional area and the contact area are larger, the resistance of the first conductive material 31 and the second conductive material 32 will be reduced accordingly, thereby also being able to improve the conduction effect.
[0141] Embodiment four:
[0142] The difference between the scheme provided by the embodiment and the scheme provided by the embodiment one is that the first conductive material 31 and the second conductive material 32 are also filled in the accommodation space, and the first conductive member 71 and the third conductive member 73 are arranged in the accommodation space. Specifically, as shown in Figure 6 the first conductive member 71 is arranged between the first connecting portion 211 and the first through hole 11, one end of the first conductive member 71 is connected to the first connecting portion 211, and the other end is connected to the first conductive material 31 filled in the accommodation space; the second conductive member 72 is arranged between the second connecting portion 231 and the second through hole 12, one end of the second conductive member 72 is connected to the second connecting portion 231, and the other end is connected to the second conductive material 32 filled in the accommodation space.
[0143] The electrochromic device 100 provided by the embodiment has the conductive material and the conductive part jointly acting, good conductive performance, and is conducive to reducing the short circuit risk of the electrochromic device 100; meanwhile, the filling difficulty of the first conductive material 31 and the second conductive material 32 is reduced.
[0144] Embodiment five:
[0145] The electrochromic device 100 provided by the embodiment includes a substrate assembly and an electrochromic assembly.
[0146] As shown in Figure 7 The substrate assembly includes the first substrate 1a and the second substrate 1b arranged at intervals along the first direction, and a containing space is formed between the first substrate 1a and the second substrate 1b. The second substrate 1b is provided with the first through hole 11 and the second through hole 12.
[0147] The electrochromic assembly is arranged in the containing space and includes the first conductive layer 21, the electrochromic layer 22 and the second conductive layer 23 arranged in sequence along the first direction. Along the second direction perpendicular to the first direction, the first conductive layer 21 has the first connecting part 211 protruding from one end of the electrochromic layer 22 and the second conductive layer 23, and the second conductive layer 23 has the second connecting part 231 protruding from one end of the electrochromic layer 22.
[0148] The first through hole 11 and the containing space opposite to the first through hole 11 are filled with the first conductive material 31, and the first conductive material 31 is directly connected to the first connecting part 211. The second connecting part 231 and the light adhesive layer 41 and the second flexible substrate 43 between the second connecting part 231 and the second substrate 1b are provided with the channel 8 opposite to the second through hole 12 and in communication, the second through hole 12 and the channel 8 are filled with the second conductive material 32, and the second connecting part 231 is provided with the second conductive part 72 away from one side of the second through hole 12 and the second conductive part 72 is used for closing the channel 8.
[0149] The end of the second conductive layer 23 close to the first connecting part 211 is coated with the insulating material 6.
[0150] The electrochromic device 100 provided by the embodiment, on the one hand, improves the sealing performance and waterproof performance of the electrochromic device 100 by improving the electrode leading-out mode and the conductive structure of the electrochromic layer 22; on the other hand, the first through hole 11 and the second through hole 12 are arranged on the same substrate 1, which is convenient for manufacturing and is conducive to hiding the circuit, ensuring the aesthetic degree and visibility of one side of the electrochromic device 100.
[0151] Embodiment six:
[0152] The difference between the scheme provided by the embodiment and the embodiment five is that Figure 9As shown, the first conductive member 71 is arranged between the first connecting portion 211 and the first through hole 11, one end of the first conductive member 71 is connected to the first connecting portion 211, and the other end is arranged at the aperture of the first through hole 11 on the second substrate 1b and connected to the first conductive material 31. The first conductive member 71 is arranged in a spaced manner with the end portion of the second conductive layer 23.
[0153] The electrochromic device 100 provided by the embodiment is connected to the first conductive material 31 and the first conductive layer 21 by the first conductive member 71, which is conducive to reducing the difficulty of filling the first conductive material 31 and reducing the risk of short circuit of the electrochromic device 100 caused by the first conductive material 31 flowing into the accommodation space and simultaneously contacting the first conductive layer 21 and the second conductive layer 23.
[0154] Embodiment Seven
[0155] The difference between the solution provided by the embodiment and the sixth embodiment is that one end of the first conductive member 71 is designed as a bending structure. Specifically, as shown in Figure 10 The end of the first conductive member 71 close to the second substrate 1b has a bending portion, the first conductive member 71 includes a first portion and a second portion connected vertically, the cross-sectional size of the first portion is larger than that of the second portion, the first portion is arranged on the second substrate 1b and partially inserted into the gap between the second flexible substrate 43 and the second substrate 1b, and the second portion is connected to the first connecting portion 211 and arranged in a spaced manner with the end portion of the second conductive layer 23.
[0156] The electrochromic device 100 provided by the embodiment improves the structure of the first conductive member 71, facilitates the expansion of the size of the first through hole 11, thereby being conducive to reducing the difficulty of filling the first conductive material 31, improving the filling amount and cross-sectional area of the first conductive material 31, and increasing the contact area of the first conductive material 31 and the first conductive member 71. When the cross-sectional area and the contact area are larger, the resistance of the first conductive material 31 will be reduced accordingly, thereby also improving the conduction effect.
[0157] Embodiment Eight
[0158] The difference between the solution provided by the embodiment and the fifth embodiment is that the first conductive material 31 is also filled in the accommodation space, and the first conductive member 71 is also arranged in the accommodation space. Specifically, as shown in Figure 11 The first conductive member 71 is arranged between the first connecting portion 211 and the first through hole 11, one end of the first conductive member 71 is connected to the first connecting portion 211, and the other end is connected to the first conductive material 31 filled in the accommodation space.
[0159] The electrochromic device 100 provided by the embodiment has the first conductive material 31 and the first conductive member 71, which have good conductive performance and are conducive to reducing the short circuit risk of the electrochromic device 100; meanwhile, the filling difficulty of the first conductive material 31 and the second conductive material 32 is reduced.
[0160] Embodiment Nine
[0161] The electrochromic device 100 provided by the embodiment includes a substrate assembly and an electrochromic assembly.
[0162] As shown in Figure 12 The substrate assembly includes the first substrate 1a and the second substrate 1b which are arranged at intervals along the first direction, and a containing space is formed between the first substrate 1a and the second substrate 1b. The second substrate 1b is provided with the first through hole 11 and the second through hole 12.
[0163] The electrochromic assembly is arranged in the containing space and includes the first conductive layer 21, the electrochromic layer 22 and the second conductive layer 23 which are sequentially stacked along the first direction. Along the second direction perpendicular to the first direction, the first conductive layer 21 has the first connecting part 211 which protrudes from one end of the electrochromic layer 22 and the second conductive layer 23, and the second conductive layer 23 has the second connecting part 231 which protrudes from one end of the electrochromic layer 22.
[0164] The first conductive material 31 is filled in the first through hole 11 and the containing space opposite to the first through hole 11, and the first conductive material 31 is directly connected to the first connecting part 211. The surface of the second connecting part 231 is covered by the second conductive member 72, the second conductive material 32 is filled in the second through hole 12, and the second conductive material 32 is also filled in the containing space and connected to the second conductive member 72.
[0165] The light adhesive layer 41 between the second conductive layer 23 and the second substrate 1b is further provided with a avoiding space, so that the second conductive member 72 can be covered on both sides of the second connecting part 231.
[0166] The end of the second conductive layer 23 close to the first connecting part 211 is coated with the insulating material 6.
[0167] The electrochromic device 100 provided by the embodiment has the following advantages. On the one hand, the electrode leading mode and the conductive structure of the electrochromic layer 22 are improved, so that the sealing performance and the waterproof performance of the electrochromic device 100 are improved. On the other hand, the first through hole 11 and the second through hole 12 are arranged on the same substrate 1, which is convenient for manufacturing and conducive to hiding the circuit, so that the appearance and the visibility of one side of the electrochromic device 100 are ensured. On the other hand, the second conductive material 32 and the second conductive member 72 jointly act, which has reasonable structure and good conductive performance.
[0168] Embodiment ten
[0169] The embodiment provides a scheme different from that of embodiment nine. As shown in Figure 13 the first conductive member 71 is arranged between the first connecting portion 211 and the first through hole 11, one end of the first conductive member 71 is connected to the first connecting portion 211, and the other end is abutted on the aperture of the first through hole 11 on the second substrate 1b and connected to the first conductive material 31. The first conductive member 71 is arranged in a spaced manner with the end portion of the second conductive layer 23.
[0170] The electrochromic device 100 provided by the embodiment is connected to the first conductive material 31 and the first conductive layer 21 by the first conductive member 71, which is conducive to reducing the difficulty of filling the first conductive material 31 and reducing the risk of short circuit of the electrochromic device 100 caused by the first conductive material 31 flowing into the accommodation space and simultaneously being in electrical contact with the first conductive layer 21 and the second conductive layer 23.
[0171] Embodiment eleven
[0172] The embodiment provides a scheme different from that of embodiment ten. One end of the first conductive member 71 is designed as a bent structure. Specifically, as shown in Figure 14 the first conductive member 71 has a bent portion at one end close to the second substrate 1b, the first conductive member 71 includes a first portion and a second portion connected vertically, the cross-sectional size of the first portion is larger than that of the second portion, the first portion is abutted on the second substrate 1b and partially clamped into the gap between the second flexible substrate 43 and the second substrate 1b, and the second portion is connected to the first connecting portion 211 and arranged in a spaced manner with the end portion of the second conductive layer 23.
[0173] The electrochromic device 100 provided by the embodiment improves the structure of the first conductive member 71, facilitates the expansion of the size of the first through hole 11, thereby being conducive to reducing the difficulty of filling the first conductive material 31 and improving the filling amount and cross-sectional area of the first conductive material 31 to increase the contact area of the first conductive material 31 and the first conductive member 71. When the cross-sectional area and the contact area are larger, the resistance of the first conductive material 31 will be reduced accordingly, thereby also being able to improve the conduction effect.
[0174] Embodiment twelve
[0175] The embodiment provides a scheme different from that of embodiment nine. The first conductive material 31 is also filled in the accommodation space, and the first conductive member 71 is also arranged in the accommodation space. Specifically, as shown in Figure 15 the first conductive member 71 is arranged between the first connecting portion 211 and the first through hole 11, one end of the first conductive member 71 is connected to the first connecting portion 211, and the other end is connected to the first conductive material 31 filled in the accommodation space.
[0176] The electrochromic device 100 provided by the embodiment has the first conductive material 31 and the first conductive member 71 jointly acting, and has good conductive performance and is conducive to reducing the short circuit risk of the electrochromic device 100; meanwhile, the filling difficulty of the first conductive material 31 and the second conductive material 32 is reduced.
[0177] To sum up, the electrochromic device 100 provided by the application improves the sealing performance and waterproof performance of the electrochromic device 100 by improving the electrode leading-out mode and conductive structure of the electrochromic layer 22, and by arranging the first through hole 11 and the second through hole 12 on the substrate 1, that is, by using the front leading-out structure, it is also conducive to reducing the manufacturing difficulty of the frame glue of the electrochromic device 100.
[0178] In a second aspect, the application provides a manufacturing method of an electrochromic device, which is used to manufacture the electrochromic device 100 in the first aspect. As shown in Figure 1 and Figure 16 The manufacturing method comprises the following steps:
[0179] S1, providing a substrate assembly, arranging the first through hole 11 and the second through hole 12 on the substrate assembly, and the substrate assembly comprising two substrates 1 arranged at intervals.
[0180] The substrate assembly comprises two substrates 1 arranged at intervals, and a containing space is formed between the two substrates 1.
[0181] The first through hole 11 and the second through hole 12 can be arranged on the same substrate 1, or can also be arranged on different substrates 1 respectively.
[0182] S2, providing an electrochromic assembly, arranging the electrochromic assembly between the two substrates 1, and the electrochromic assembly comprising a first conductive layer 21, an electrochromic layer 22 and a second conductive layer 23.
[0183] The electrochromic layer 22 comprises a color-changing material layer, an electrolyte layer and an ion storage layer arranged in sequence.
[0184] The first conductive layer 21 and the second conductive layer 23 are closely attached to the electrochromic layer 22, and at least one of the first conductive layer 21 and the second conductive layer 23 and the substrate 1 opposite to it is a transparent structure for displaying the optical property change of the electrochromic layer 22. The first conductive layer 21 and the second conductive layer 23 are made of the same material, which can be indium tin oxide, aluminum zinc oxide or nano silver wire, but is not limited thereto.
[0185] S3, filling the first conductive material 31 into the first through hole 11, so that the first conductive material 31 is electrically connected with the first conductive layer 21, and filling the second conductive material 32 into the second through hole 12, so that the second conductive material 32 is electrically connected with the second conductive layer 23.
[0186] The first conductive material 31 and the second conductive material 32 are also used to connect external power supply leads, so as to realize electrical connection between the external power supply and the electrochromic layer 22. By using the external power supply, voltage can be applied to the electrochromic layer 22 and the electrochromic layer 22 can be controlled to change color.
[0187] The first conductive material 31 is used to block the first through hole 11, that is, the first conductive material 31 fills the first through hole 11, meeting the sealing requirement. Similarly, the second conductive material 32 fills the second through hole 12.
[0188] The manufacturing method provided in the present application can improve the integrity of the sealing structure of the electrochromic device 100 by arranging the first through hole 11 and the second through hole 12 on the substrate 1, filling the first conductive material 31 electrically connected with the first conductive layer 21 in the first through hole 11, and filling the second conductive material 32 electrically connected with the second conductive layer 23 in the second through hole 12, thereby improving the sealing performance and waterproof capability of the electrochromic device 100.
[0189] In a third aspect, the present application provides a terminal product, which comprises the electrochromic device 100 in the first aspect. The terminal product comprises any one of a rearview mirror, a curtain wall, an automobile sunroof, an automobile side window, an automobile windshield, a shell of an electronic product, glasses, a vehicle, and a display panel.
[0190] It can be understood that, according to the type of the terminal product, the substrate 1 can be a glass substrate, a plastic substrate, or a resin substrate, etc.
[0191] For example, when used for manufacturing an anti-dazzling rearview mirror, the substrate 1 can be a transparent glass substrate, the optical adhesive layer 41 can be OCA glue, the first flexible substrate 42 and the second flexible substrate 43 can be PET materials, and the first conductive layer 21 and the second conductive layer 23 can be indium tin oxide materials. The electrochromic device 100 further comprises a reflective layer, a shielding ring, etc. The design of this part can refer to the existing design, which will not be described here.
[0192] The terminal product provided in the present application can effectively improve the sealing performance and waterproof capability of the product by improving the structure of the electrochromic sealing device, specifically, by improving the electrode leading-out mode and the conductive structure of the electrochromic layer 22 in the electrochromic sealing device.
[0193] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.
Claims
1. An electrochromic device, characterized in that, The application relates to a substrate assembly and an electrochromic assembly. The substrate assembly comprises two substrates arranged in a first direction and a space formed between the two substrates. The electrochromic assembly comprises a first conductive layer, an electrochromic layer and a second conductive layer arranged in a first direction, the first conductive layer has a first connecting part protruding from the electrochromic layer and the second conductive layer in a second direction perpendicular to the first direction, the second conductive layer has a second connecting part protruding from the electrochromic layer and the first conductive layer in the second direction, at least one of the first conductive layer and the second conductive layer and the substrate opposite to the at least one of the first conductive layer and the second conductive layer are transparent structures. The substrate assembly is provided with a first through hole and a second through hole, the first through hole is at least partially overlapped with the first connecting part in the projection of the first conductive layer, the first through hole is filled with a first conductive material, the first conductive material is used for sealing the first through hole and electrically connected with the first connecting part of the first conductive layer, the second through hole is at least partially overlapped with the second connecting part in the projection of the second conductive layer, the second through hole is filled with a second conductive material, the second conductive material is used for sealing the second through hole and electrically connected with the second connecting part of the second conductive layer.
2. The electrochromic device of claim 1, wherein, The first conductive material is also filled in the space and the first conductive material is connected with the first connecting part.
3. The electrochromic device of claim 1, wherein, The first conductive material is connected with the first connecting part through the first conductive part.
4. The electrochromic device of claim 3, wherein, One end of the first conductive part abuts at the aperture of the first through hole and is used for closing the first through hole, and the other end is connected with the first connecting part.
5. The electrochromic device of claim 3, wherein, The first conductive material is also filled in the space, one end of the first conductive part is connected with the first connecting part, and the other end is connected with the first conductive material in the space.
6. The electrochromic device of claim 3, wherein, The first conductive part is any one of a flexible circuit board, a copper sheet and a conductive adhesive tape.
7. The electrochromic device of claim 1, wherein, The second conductive layer is coated with an insulating material near the end of the first connecting part.
8. The electrochromic device of claim 1, wherein, The first through hole and the second conductive layer are at least spaced 0.1 mm in the projection of the first conductive layer.
9. The electrochromic device of claim 1, wherein, The second conductive layer is provided with an etching line near one end of the first connecting part, the etching line is used for separating an insulating area in the second conductive layer near one end of the first through hole.
10. The electrochromic device of claim 1, wherein, In the second direction, the length of the first through hole is greater than the length of the first connecting part, the projection of the first through hole in the first conductive layer is partially overlapped with the first connecting part, and the other part is overlapped with the area outside the first connecting part on the first conductive layer.
11. The electrochromic device according to any one of claims 1-10, wherein, The first through hole is arranged on the substrate away from the first conductive layer, and the second through hole is arranged on the substrate away from the second conductive layer.
12. The electrochromic device according to any one of claims 1-10, wherein, The first through hole and the second through hole are arranged on the substrate away from the first conductive layer.
13. The electrochromic device of claim 12, wherein, The second connecting part is provided with a channel opposite to and communicated with the second through hole, the second conductive material is also filled in the channel, and a second conductive member is arranged on the side of the second connecting part away from the second through hole and used for closing the channel.
14. The electrochromic device of claim 12, wherein, The surface of the second connecting part is covered with a second conductive member, the second conductive material is also filled in the accommodating space and connected with the second conductive member.
15. The electrochromic device according to any one of claims 1-10, wherein, The electrochromic device further comprises a sealing member arranged on the outer surface of the substrate and covering the orifices of the first through hole and the second through hole.
16. A method of fabricating an electrochromic device, the method comprising: A method for manufacturing the electrochromic device as claimed in any one of claims 1-15, the manufacturing method comprising: providing a substrate assembly on which a first through hole and a second through hole are arranged, the substrate assembly comprising two substrates arranged in a spaced manner; providing an electrochromic assembly arranged between the two substrates, the electrochromic assembly comprising a first conductive layer, an electrochromic layer and a second conductive layer; filling a first conductive material into the first through hole so that the first conductive material is electrically connected with the first conductive layer, and filling a second conductive material into the second through hole so that the second conductive material is electrically connected with the second conductive layer.
17. A terminal product, characterized in that The electrochromic device as claimed in any one of claims 1-15, wherein the end product comprises any one of a rearview mirror, a curtain wall, an automobile sunroof, an automobile side window, an automobile windshield, a housing of an electronic product, glasses, a vehicle and a display panel.
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