A method for nanofluid infiltration at tool-chip interface based on electroosmotic effect
By machining microtextures and modifying nanoparticles on the tool surface, and using a self-excited electric field to drive the infiltration of nanofluids, the problem of low penetration efficiency of traditional cutting fluids is solved, and the high-efficiency cutting performance of difficult-to-machine materials is improved.
Patent Information
- Application Number
- CN202310514008.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-05-09
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2043-05-09
AI Technical Summary
In existing technologies, traditional pressure-driven dynamic capillary permeation methods for cutting fluid suffer from short capillary existence time, small size, and single driving force, making it impossible to achieve efficient and precise machining of difficult-to-machine materials.
The nanofluid infiltration method based on the electroosmosis effect at the tool-chip interface involves processing microtextures on the tool surface and modifying the electroosmotic properties of nanoparticles. The nanofluid infiltration is driven by the self-excited electric field of the friction interface during cutting, and the infiltration efficiency is improved by combining electroosmotic force and microtexture channels.
This technology enables the efficient penetration of nanofluids into the tool-chip interface, forming an effective lubricating film, reducing friction, improving cutting performance, and reducing tool wear and workpiece surface integrity.
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Figure CN116852167B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of cutting technology, and particularly relates to a method for nanofluid infiltration at the tool-chip interface based on electroosmosis effect. Background Technology
[0002] The high cutting temperatures and severe tool wear and breakage associated with machining difficult-to-machine materials such as nickel-based superalloys, titanium alloys, and stainless steel make cooling and lubrication technologies indispensable for their efficient and precision machining. Traditional industrial water-based and oil-based cutting fluids have poor thermal conductivity and lubrication properties, and low load-carrying capacity, making them unsuitable for the friction-reducing lubrication requirements of high-temperature environments. Nanofluids, formed by adding small amounts of nanoparticles (particle size less than 100nm), such as MoS2, SiO2, and Fe3O4, to a base carrier fluid, exhibit excellent thermal conductivity, lubrication properties, and can also perform film formation, ball bearing, repair, and polishing functions. Currently, nanofluid lubrication technology has been used to achieve drilling, milling, grinding, and turning machining of nickel-based superalloys.
[0003] Nanofluids possess excellent cooling, lubrication, and thermal conductivity, enabling them to rapidly transfer the high temperatures generated during cutting and alleviate tool wear. However, the addition of nanoparticles increases the fluid's viscosity, thereby weakening its flow. High nanoparticle content can easily lead to the formation of large aggregates, further hindering the nanofluid's penetration and resulting in a decrease in its anti-friction and lubrication effects. In traditional cutting processes, cutting fluid penetration occurs through capillary channels, but these capillaries are extremely short-lived and constantly undergo dynamic changes of "generation-disappearance-generation," making them highly unstable and unsuitable as long-term channels for cutting fluid penetration into the cutting interface. Furthermore, while cutting fluid can penetrate the slip zone of the tool-chip interface, capillary formation is difficult to achieve in the adhesive zone, preventing further penetration. Therefore, efficient penetration of nanofluids into the tool-chip interface has become a critical issue that urgently needs to be addressed in high-performance cutting of difficult-to-machine materials.
[0004] The process by which nanofluid cutting fluid penetrates the tool-chip interface to cool and lubricate the tool is highly complex, closely related to the fluid's wetting and spreading characteristics, the surface morphology of the interface, and interfacial friction behavior. Atmospheric pressure, fluid supply pressure, and capillary pressure are traditional driving forces for the penetration of cutting fluid into the tool-chip contact zone. Currently, common methods to improve nanofluid penetration at the tool-chip interface include electrostatic atomization micro-lubrication and high-pressure liquid jet technology. Electrostatic atomization micro-lubrication can increase its penetration depth in the cutting zone gap by reducing droplet size, but this method has a complex control process and high equipment requirements. High-pressure liquid jet technology uses external fluid supply pressure to achieve chip breaking and promote nanofluid penetration, but it does not reduce the amount of cutting fluid used and poses certain hazards to human health and the environment. Regardless of whether it is electrostatic atomization micro-lubrication or high-pressure liquid jet technology, the nanofluid penetrates into the tool-chip contact zone through dynamic capillary penetration generated by the micron-level roughness of the tool surface and the tilling effect. However, dynamic capillary penetration has disadvantages such as short duration, small size, and difficulty in quantitative characterization. Therefore, there is an urgent need to develop novel nanofluid transport methods for the tool-chip interface in cutting environments of difficult-to-machine materials. Summary of the Invention
[0005] Therefore, the technical problem to be solved by the present invention is to overcome the shortcomings of the existing technology based on the traditional pressure-driven dynamic capillary permeation method of cutting fluid, such as short single capillary existence time, small capillary size, and single driving force, which cannot guide the efficient and precise machining of difficult-to-machine materials.
[0006] To address the aforementioned technical problems, this invention provides a method for nanofluid infiltration at the tool-chip interface based on electroosmosis. Based on the principle of directional transport in surface microtextures, the self-excited electric field induced by triboelectric phenomena at the interface, and the principle of electroosmosis, a cutting fluid driving scheme combining "nanofluid | microtexture | self-excited electric field" is constructed. The triboelectric potential generated by the high-speed, high-pressure friction at the tool-chip interface during cutting acts on the escaping low-energy electrons in the capillary channels, forming a self-excited electric field in the micro-contact region of the interface. This self-excited electric field then drives the nanofluid to efficiently infiltrate at the tool-chip interface of the microtextured tool. From the perspective of increasing the electroosmotic force of the cutting fluid capillary infiltration, the infiltration of nanofluid into the cutting zone can be enhanced by controlling the microtexture structural parameters, the electroosmotic properties of the nanoparticles, and adjusting the cutting parameters.
[0007] The purpose of this invention is to provide a method for nanofluid infiltration at the blade-chip interface based on electroosmosis, comprising the following steps:
[0008] S1. Microtexture is fabricated on the rake face of a tool using dry etching-assisted laser technology to obtain a microtextured tool.
[0009] S2. Under stirring, a modifier is added to the nanoparticle suspension. After reaching adsorption equilibrium, the modified nanoparticles are obtained by centrifugation, washing, and drying. The modified nanoparticles are then made into powder, dissolved in water, and mixed to obtain the modified nanofluid cutting fluid.
[0010] S3. The modified nanofluid cutting fluid described in S2 is sprayed out through the cutting processing device, and the workpiece is cut using the microtextured tool of S1, thus completing the penetration of the modified nanofluid cutting fluid into the tool-chip contact area through microtexture.
[0011] In one embodiment of the present invention, in S1, the cutting tool is selected from ceramic cutting tools, diamond cutting tools, or cemented carbide cutting tools.
[0012] In one embodiment of the present invention, in S1, the dimensional parameters of the microtexture are: depth of 5μm-60μm, width of 10μm-50μm, and period of 50μm-200μm.
[0013] In one embodiment of the present invention, in S1, the direction of the microtexture is perpendicular to the main cutting edge.
[0014] In one embodiment of the present invention, in S1, the processing parameters of the laser technology are: power of 5W-20W, scanning speed of 50mm / s-500mm / s, pulse width of 1ns-5ns, and repetition frequency of 10kHz-50kHz.
[0015] In one embodiment of the present invention, in S1, the dry etching is either ion beam etching or plasma etching; the parameters of the ion beam etching are: ion energy of 100eV-1000eV, ion beam current of 100mA-500mA, neutralization current of 100mA-1000mA, and etching time of 50min-200min; the parameters of the plasma etching are: upper RF source power of 100W-500W, lower RF source power of 100W-500W, gas pressure of 1Pa-5Pa, etching temperature of 20℃-50℃, etching time of 30min-200min, and gas flow rate of 10sccm-100sccm.
[0016] In one embodiment of the present invention, in S2, the nanoparticles are selected from one or more of Fe3O4, SiO2, Al2O3 and graphene oxide; the particle size of the nanoparticles is 10nm-20nm.
[0017] In one embodiment of the present invention, in S2, the concentration of the nanoparticle suspension is 0.015 g / mL to 0.025 g / mL, and the pH is 2 to 6.
[0018] Furthermore, the pH adjuster is a 0.1M NaOH solution.
[0019] In one embodiment of the present invention, in S2, the modifier is selected from one or more of disodium lauryliminodipropionate, erucamide methylpiperazine propanesulfonate, and dodecyl dimethylammonium oxide, and the modifier has the effect of promoting electroosmosis. Generally, in order to precisely control the concentration of the modifier in the suspension system, the modifier is added in solution form.
[0020] In one embodiment of the present invention, in S2, the drying temperature is 95°C-105°C and the drying time is 18h-20h.
[0021] In one embodiment of the present invention, in S2, the modified nanofluid cutting fluid serves as a cooling and lubricating medium and has electroosmotic properties.
[0022] In one embodiment of the present invention, in S3, the workpiece is an alloy workpiece or an engineering ceramic workpiece.
[0023] In one embodiment of the present invention, in S3, the cutting parameters are: cutting speed of 100m / min-300m / min, feed rate of 0.1mm / rev-0.3mm / rev, and depth of cut of 0.1mm-0.5mm.
[0024] In one embodiment of the present invention, in S3, the tool-chip contact area of the microtextured tool is provided with a micron-scale texture (micron-scale ripple structure).
[0025] The technical solution of the present invention has the following advantages compared with the prior art:
[0026] The nanofluid infiltration method at the tool-chip interface described in this invention provides quantitatively characterizable and controllable microtextured channels (i.e., microchannels) on the tool surface through microtexturing, thus acting as capillaries. Furthermore, it modifies the surface electroosmotic properties of nanoparticles and utilizes the electro-osmotic effect induced by the self-excited electric field at the cutting zone friction interface during machining. By controlling the electric field characteristics, microtexture structure parameters, and nanofluid electroosmotic properties, electroosmotic force is further introduced on top of pressure-driven operation, which is beneficial for improving the cutting fluid's infiltration capacity in the cutting zone. This solves the problem of efficient cutting fluid infiltration in the micron-scale space of the cutting contact area. Efficient cutting fluid infiltration into the tool-chip / tool-workpiece contact area can form an effective lubricating film at the cutting zone friction interface, reducing interface friction and thus improving cutting performance such as cutting temperature, tool wear, and workpiece surface integrity. Compared to existing methods for driving cutting fluid infiltration into the cutting contact area, the self-excited electric field-assisted microtextured channel electroosmotic driving method has advantages such as low driving energy field strength, high efficiency, strong controllability, and simple structure. Attached Figure Description
[0027] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:
[0028] Figure 1 This is a schematic diagram of the nanofluid infiltration method at the blade-chip interface based on the electroosmosis effect of the present invention;
[0029] Figure 2 This invention relates to a dry etching-assisted laser micromachining method; wherein, (a) is a schematic diagram of the processing principle and the prepared microtexture morphology, (b) is the etching rate at different positions on the microgroove contour at the incident angle, and (c) is the evolution of the microgroove contour during the etching process.
[0030] Figure 3 This is a schematic diagram illustrating the electroosmotic property modification of the nanoparticles of the present invention;
[0031] Figure 4 This is a schematic diagram of the cutting processing device used in this invention;
[0032] Figure 5 The images show the SEM images of the wear area on the rake face of the tool in Test Example 1 of this invention and the corresponding Fe element composition analysis diagram; where (a) is a traditional diamond tool + traditional Fe3O4 nanofluid, (b) is a microtextured tool + traditional Fe3O4 nanofluid, and (c) is a microtextured tool + modified Fe3O4 nanofluid.
[0033] Figure 6 This is a schematic diagram of the electroosmotic flow of cutting fluids with different electroosmotic properties at the friction interface according to the present invention; wherein, (a) is deionized water without nanoparticles, and (b) is nanofluid containing negatively charged particles. Detailed Implementation
[0034] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.
[0035] In this invention, unless otherwise stated, the modifier (sodium lauryl iminodipropionate) solution in the examples also contains 0.001M NaCl as an electrolyte.
[0036] In this invention, unless otherwise stated, the two-step method described in the embodiments is currently the most widely used method for preparing nanofluids. First, the nanoparticles, nanofibers, nanotubes, or other nanomaterials used are prepared into dry powders using chemical or physical methods. Then, the nanoparticle powder is dispersed into a fluid and mixed uniformly using methods such as strong magnetic stirring, ultrasonic stirring, high-shear mixing, homogenization, and ball milling. The entire process is achieved in two steps.
[0037] Example 1: Machining difficult-to-machine ZrO2 engineering ceramics with single-crystal diamond tools
[0038] Reference Figure 1 As shown, a nanofluid infiltration method based on electroosmosis at the blade-chip interface specifically includes the following steps:
[0039] S1. Machining a microtexture onto the rake face of a single-crystal diamond tool, the specific steps are as follows:
[0040] S11. Pretreatment of single crystal diamond tools: Grind and polish the surface of the single crystal diamond tool, and clean it with ultrasonic cleaning in ethanol for 20 minutes to perform surface cleaning treatment.
[0041] S12. Preparation of microtextures on the rake face of single-crystal diamond cutting tools: Controllable preparation of microtextures on the rake face of cutting tools using ion beam etching-assisted laser processing technology. Figure 2 The process steps are as follows:
[0042] S121, nanosecond laser direct writing modifies the substrate material, creating differences in chemical composition and lattice type between the modified and unmodified regions, thus creating differences in etching rates between the modified and unmodified regions. The laser processing parameters are: power 20W, scanning speed 400mm / s, pulse width 4ns, and repetition frequency 20kHz.
[0043] S122. Ion beam etching forms a pre-designed surface texture, with the following ion beam etching parameters: ion energy 400 eV, ion beam current 110 mA, neutralization current 130 mA, and etching time 50 min. A linear groove microtexture perpendicular to the main cutting edge is fabricated, with a depth of 50 μm, a width of 20 μm, and a period of 100 μm.
[0044] S2. The preparation of modified Fe3O4 nanofluid cutting fluid, the specific steps are as follows:
[0045] S21. Surface electroosmotic modification of Fe3O4 nanoparticles using adsorption: Fe3O4 nanoparticles with a particle size of 20 nm were dispersed in an aqueous solution at a concentration controlled at 0.015 g / mL, and the pH was adjusted to approximately 4 using 0.1 M NaOH. The nanoparticle suspension was first ultrasonically vibrated for 0.5 h, and then a modifier (disodium lauryl iminodipropionate) solution with a concentration of 0.15 mmol / L was added to the suspension under high-speed stirring. After adding the modifier, the mixture was magnetically stirred at room temperature for 24 h to reach adsorption equilibrium. The nanoparticles were then separated using high-speed centrifugation, washed multiple times with distilled water to remove unadsorbed modifier, and then dried in a vacuum drying oven at 100 °C for 18 h to obtain modified Fe3O4 nanoparticles. Figure 3 ).
[0046] S22. Preparation of modified Fe3O4 nanofluid cutting fluid: A two-step method was adopted, using deionized water as the base liquid to prepare a modified Fe3O4 nanofluid cutting fluid with a mass fraction of 0.1%.
[0047] S3. Perform machining on the ZrO2 engineering ceramic workpiece. The specific steps are as follows:
[0048] The modified Fe3O4 nanofluid cutting fluid was loaded into the cutting equipment. Figure 4 In the micro-lubrication device, the cutting fluid nozzle is aimed at the tool-chip contact area of the microtextured tool. The cutting device is turned on, and the modified Fe3O4 nanofluid cutting fluid is sprayed out through the micro-lubrication device to cut the ZrO2 engineering ceramic workpiece. The cutting parameters are: cutting speed 300m / min, feed rate 0.1mm / rev, and depth of cut 0.1mm. Under these cutting parameters, the cutting area can emit electrons with energy up to 1500eV, and an electric field of up to 1600V / cm can be formed in the micron-scale region of the tool-chip interface. Thus, an electroosmotic force is generated in the microtextured channel to act on the nanofluid cutting fluid, driving the modified Fe3O4 nanofluid cutting fluid to penetrate into the tool-chip contact area through the microtexture.
[0049] Example 2: Machining difficult-to-machine materials with ceramic cutting tools; solid solution strengthened high-temperature nickel-based alloys.
[0050] A nanofluid infiltration method based on electroosmosis at the blade-chip interface specifically includes the following steps:
[0051] S1. Microtexture is machined onto the front surface of the Al2O3 / TiC ceramic cutting tool. The specific steps are as follows:
[0052] Pretreatment of S11 and Al2O3 / TiC ceramic cutting tools: The surface of the Al2O3 / TiC ceramic cutting tools is ground and polished, and then ultrasonically cleaned in acetone for 10 minutes to perform surface cleaning treatment;
[0053] The preparation of microtextures on the surface of S12 and Al2O3 / TiC ceramic cutting tools was carried out using plasma etching-assisted laser processing technology. The process steps are as follows:
[0054] S121, nanosecond laser direct writing modifies the substrate material, creating differences in chemical composition and lattice type between the modified and unmodified regions, thus creating differences in etching rates between the modified and unmodified regions. The laser processing parameters are: power 10W, scanning speed 50mm / s, pulse width 5ns, and repetition frequency 30KHz.
[0055] S122. Inductively coupled plasma etching (ICP-C) is used to form a pre-designed surface texture. The plasma etching parameters are: upper RF source power 500W, lower RF source power 150W, gas pressure 3Pa, etching temperature 40℃, etching time 50min, gas flow rate 20sccm, and SF6 etching gas. A linear groove microtexture perpendicular to the main cutting edge is fabricated, with a depth of 6μm, a width of 35μm, and a period of 150μm.
[0056] S2. The preparation of modified SiO2 nanofluid cutting fluid is carried out through the following steps:
[0057] S21. Surface electroosmotic modification of SiO2 nanoparticles using adsorption: SiO2 nanoparticles with a particle size of 10 nm were dispersed in an aqueous solution at a concentration controlled at 0.02 g / mL, and the pH was adjusted to approximately 4 using 0.1 M NaOH. The nanoparticle suspension was first ultrasonically vibrated for 0.5 h, and then a modifier solution (disodium lauryl iminodipropionate) with a concentration of 0.15 mmol / L was added to the suspension under high-speed stirring. After adding the modifier, the mixture was magnetically stirred at room temperature for 24 h to reach adsorption equilibrium. The nanoparticles were then separated using high-speed centrifugation, washed multiple times with distilled water to remove any unadsorbed modifier, and then dried in a vacuum drying oven at 100 °C for 18 h to obtain the modified SiO2 nanoparticles.
[0058] S22. Preparation of modified SiO2 nanofluid cutting fluid: A two-step method was adopted, using deionized water as the base liquid to prepare a modified SiO2 nanofluid cutting fluid with a mass fraction of 0.2%.
[0059] S3. Perform machining on the GH4169 high-temperature alloy workpiece. The specific steps are as follows:
[0060] The modified SiO2 nanofluid cutting fluid was loaded into the micro-lubrication device of the cutting apparatus. The cutting fluid nozzle was aimed at the tool-chip contact area of the microtextured tool. The cutting apparatus was turned on, and the modified SiO2 nanofluid cutting fluid was sprayed out through the micro-lubrication device to cut the GH4169 high-temperature alloy workpiece. The cutting parameters were: cutting speed 200 m / min, feed rate 0.2 mm / rev, and depth of cut 0.3 mm. Under these cutting parameters, when the coated tool rubs against the stainless steel material, it can emit electrons with energy up to 1500 eV, which can form an electric field of up to 1750 V / cm in the micron-scale region of the tool-chip interface. Thus, an electroosmotic force acting on the nanofluid cutting fluid is generated in the microtexture channel, driving the modified SiO2 nanofluid cutting fluid to penetrate into the tool-chip contact area through the microtexture.
[0061] Comparative Example 1: Traditional diamond cutting tool + traditional Fe3O4 nanofluid
[0062] The basic structure is the same as in Example 1, except that the cutting face of the tool has no microtexture and the nanofluid is not modified.
[0063] Comparative Example 2: Microtextured cutting tool + conventional Fe3O4 nanofluid
[0064] The process is basically the same as in Example 1, except that the nanofluid is not modified.
[0065] Test Example 1
[0066] The wear area on the rake face of the diamond tool during cutting ZrO2 engineering ceramics in Example 1 and Comparative Examples 1-2 was characterized and its elemental composition was analyzed. The results are as follows: Figure 5 As shown.
[0067] Figure 5 (a) shows a SEM image of the wear area on the rake face of a diamond tool without microtexture when cutting ZrO2 engineering ceramics, along with the corresponding Fe elemental composition analysis. It is evident that severe wear occurred on the tool rake face. Figure 5 As shown in (a), the EDS distribution diagram of Fe element reveals a very small amount of Fe on the tool rake face. Neither the tool material nor the workpiece material itself contains Fe; only the Fe3O4 nanofluid cutting fluid does. Therefore, the presence of Fe confirms the presence of the cutting fluid. Here, almost no Fe is detected in the wear area, indicating that even under minimal lubrication conditions, almost no cutting fluid penetrates into the tool-chip contact area of the non-microtextured tool.
[0068] Figure 5(b) shows the SEM image of the wear area on the rake face of a microtextured tool under conventional Fe3O4 nanofluid lubrication conditions, along with the corresponding Fe elemental composition analysis. It is evident that abrasive wear also exists in the wear area on the rake face. Figure 5 (b) The EDS surface distribution diagram of Fe element shows that a small amount of lubricant can penetrate into the tool-chip contact area of the microtextured tool. This is because the microtexture can provide a capillary effect during the process of cutting fluid penetrating into the tool-chip interface, thereby promoting the penetration of cutting fluid to a certain extent.
[0069] Figure 5 (c) shows the SEM image of the wear area on the tool rake face and the corresponding Fe elemental composition analysis when cutting with a microtextured tool under electroosmotic modified Fe3O4 nanofluid lubrication conditions. It can be seen that the wear on the tool rake face is slight. Furthermore, from... Figure 5 As shown in (c), the EDS distribution diagram of Fe element shows that a large amount of lubricant can penetrate into the tool-chip contact area of the microtextured tool under the action of the self-excited electric field. This is because when the self-excited electric field acts on the electroosmotic modified Fe3O4 nanofluid, the electroosmotic force is further introduced, and the cutting fluid can efficiently penetrate and flow in the microtextured channels, thereby promoting the formation of a lubricating film at the tool-chip interface.
[0070] This is because, regardless of whether it's dry friction or boundary lubrication, the contact interface undergoes intense scratching during the friction process between materials. The resulting triboelectric potential acts on the escaping low-energy electrons in the microchannel, forming triboelectric micro-plasma through electron avalanche, ultimately creating a self-excited electric field in the microscopic contact area. Studies have shown that within the micrometer scale of the cutting zone, the emitted charged particles can generate an axial electric field of approximately 1000 V / cm, the magnitude of which satisfies the electric field strength (150 V / cm) required to trigger the electrodynamic effect of the liquid in the capillary. Therefore, the cutting fluid capillary penetration zone at the tool-chip interface in machining meets the conditions for electroosmosis, generating a capillary electroosmotic force F. eos This improves the penetration ability of the cutting fluid.
[0071] According to the electroosmotic force F eos Equation: F eos =Eρ e V k Where E is the axial electric field strength and the net charge density of the cutting fluid is... Double layer volume V k =π(2Rr-r 2 From )×h, it can be seen that the factors influencing the magnitude of electroosmotic force include electric field strength, net charge density of the cutting fluid, and double layer volume. Adding negatively charged nanoparticles can increase the net charge density and double layer volume in the nanofluid, thereby increasing the potential in the solution, promoting electroosmotic flow, and increasing the flow potential accordingly. Figure 6 As shown.
[0072] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.
Claims
1. A method for nanofluid infiltration at the blade-chip interface based on electroosmosis, characterized in that, Includes the following steps, S1. Microtexture is fabricated on the rake face of a tool using dry etching-assisted laser technology to obtain a microtextured tool. S2. Under stirring, a modifier is added to the nanoparticle suspension. After reaching adsorption equilibrium, the modified nanoparticles are obtained by centrifugation, washing, and drying. The modified nanoparticles are then made into powder, dissolved in water, and mixed to obtain a modified nanofluid cutting fluid. The nanoparticles are selected from one or more of Fe3O4, SiO2, Al2O3, and graphene oxide. S3. The modified nanofluid cutting fluid described in S2 is sprayed out through the cutting processing device, and the workpiece is cut using the microtextured tool of S1, thus completing the penetration of the modified nanofluid cutting fluid into the tool-chip contact area through microtexture.
2. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S1, the dimensional parameters of the microtexture are: depth of 5μm-60μm, width of 10μm-50μm, and period of 50μm-200μm.
3. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S1, the processing parameters of the laser technology are: power of 5W-20W, scanning speed of 50mm / s-500mm / s, pulse width of 1ns-5ns, and repetition frequency of 10kHz-50kHz.
4. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S1, the dry etching is either ion beam etching or plasma etching; the parameters for ion beam etching are: ion energy of 100eV-1000eV, ion beam current of 100mA-500mA, neutralization current of 100mA-1000mA, and etching time of 50min-200min; the parameters for plasma etching are: upper RF source power of 100W-500W, lower RF source power of 100W-500W, gas pressure of 1Pa-5Pa, etching temperature of 20℃-50℃, etching time of 30min-200min, and gas flow rate of 10sccm-100sccm.
5. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S2, the particle size of the nanoparticles is 10nm-20nm.
6. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S2, the concentration of the nanoparticle suspension is 0.015 g / mL to 0.025 g / mL, and the pH is 2 to 6.
7. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S2, the modifier is selected from one or more of disodium lauryliminodipropionate, erucamide methylpiperazine propanesulfonate, and dodecyl dimethylammonium oxide.
8. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S2, the drying temperature is 95℃-105℃, and the drying time is 18h-20h.
9. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S3, the workpiece is an alloy workpiece or an engineering ceramic workpiece.
10. The method for nanofluid infiltration at the blade-chip interface based on electroosmosis according to claim 1, characterized in that, In S3, the cutting parameters are: cutting speed of 100m / min-300m / min, feed rate of 0.1mm / rev-0.3mm / rev, and depth of cut of 0.1mm-0.5mm.
Citation Information
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