Chip heat dissipation device and manufacturing method thereof

Abstract

The present invention provides a chip heat dissipation device and a manufacturing method thereof, the manufacturing method of the chip heat dissipation device comprising: step S1, obtaining a metal sheet, the thickness of the metal sheet being a thickness that can meet the stamping requirements thereof; step S2, stamping the metal sheet, cutting out a predetermined pattern to form a plurality of sheet-like heat dissipation sheets, the sheet-like heat dissipation sheets comprising a first type of sheet-like heat dissipation sheets and a second type of sheet-like heat dissipation sheets; step S3, selecting a certain amount of the first type of sheet-like heat dissipation sheets / the second type of sheet-like heat dissipation sheets according to the thickness of the heat dissipation sheets, respectively aligning and stacking them to form a first heat dissipation sheet / a second heat dissipation sheet, selecting a certain amount of the first heat dissipation sheets and the second heat dissipation sheets to be stacked in sequence; step S4, aligning and stacking the top plate, the heat dissipation plate and the bottom plate in sequence to form the chip heat dissipation device. The manufacturing method of the chip heat dissipation device of the present invention greatly shortens the processing time, has high efficiency, low cost and high adjustability.

Description

Technical Field

[0001] The present invention relates to the field of chips, and in particular to a chip heat dissipation device and a manufacturing method thereof. Background Art

[0002] Chips (CPU chips, graphics processing chips and IGBT chips) will generate a lot of heat during use, and the chips need to be cooled to ensure smooth operation of the chips.

[0003] Existing chip heat dissipation devices form coolant flow channels by sampling and cutting grooves on the surface of a metal plate. This customized machining method has low efficiency, high cost, and relatively low variability. Summary of the invention

[0004] In view of the above problems in the prior art, the object of the present invention is to provide a chip heat dissipation device and a manufacturing method thereof, which greatly shortens the processing time, has high efficiency, low cost and high adjustability.

[0005] In order to solve the above problems, the first aspect of the present invention provides a method for manufacturing a chip heat dissipation device, the method for manufacturing a chip heat dissipation device comprising:

[0006] Step S1, obtaining a metal sheet, wherein the thickness of the metal sheet is a thickness that can meet the stamping requirements thereof;

[0007] Step S2, stamping the metal sheet and cutting out a predetermined pattern to form a plurality of sheet-like heat dissipation sheets, wherein the sheet-like heat dissipation sheets include a first type of sheet-like heat dissipation sheets and a second type of sheet-like heat dissipation sheets.

[0008] Each of the sheet-like heat dissipation thin plates includes a frame, one or more partitions and multiple groups of partition bars. The partition bar is arranged in the area enclosed by the frame. The partition bar is arranged longitudinally, and at least one end of the partition bar in the longitudinal direction has a first gap with the lateral side wall of the frame. When there is one partition bar, the partition bar is arranged in the middle of the area enclosed by the frame. When there are multiple partition bars, multiple partition bars are arranged with spacing in the lateral direction. In the lateral direction, there is a second gap between the longitudinal side wall of the frame and the partition bar adjacent to it, and between two adjacent partition bars. Multiple groups of partition bars correspond to multiple second gaps one by one. Each group of partition bars includes multiple partition bars arranged with spacing in the longitudinal direction. The partition bars are flush with the upper surface / lower surface of the frame. The partition bars are arranged in the second gap, and the two lateral ends of the partition bars are respectively connected to the frame and the partition bar, or respectively connected to two adjacent partition bars.

[0009] The frame and the partition of each flaky heat dissipation sheet are in the same shape, and the inclination angles of the partitions of the first type of flaky heat dissipation sheet and the second type of flaky heat dissipation sheet relative to the longitudinal side wall of the frame are inconsistent;

[0010] Step S3, obtaining the number of layers of heat sinks required by the chip heat sink and the thickness of each layer of the heat sink, selecting a certain amount of first-type flaky heat sinks / second-type flaky heat sinks according to the thickness of the heat sink, and stacking them respectively to form a first heat sink / second heat sink, and selecting a certain amount of first heat sinks and second heat sinks according to the number of layers of the heat sink, and stacking them in sequence, wherein the heat sinks of two adjacent layers are the first heat sink and the second heat sink;

[0011] Step S4, obtaining a top plate and a bottom plate, wherein the outer edges of the top plate and the bottom plate are consistent with the outer edges of the frame, and a liquid inlet and a liquid outlet are respectively formed on both longitudinal sides of the top plate, and the top plate, the heat sink and the bottom plate are aligned and stacked in sequence to form the chip heat dissipation device.

[0012] Furthermore, a plurality of the sheet-like heat dissipation plates are stacked in sequence by a vacuum brazing method.

[0013] Furthermore, the angle between the partition bar and the longitudinal side wall of the frame is 60 degrees to 95 degrees, or the angle is 105 degrees to 120 degrees.

[0014] Furthermore, the angles of the partition bars of the first type of sheet-like heat dissipation thin plates and the second type of sheet-like heat dissipation thin plates and the longitudinal side walls of the frame are complementary.

[0015] Furthermore, the first figure formed by the spacers of the first type of sheet-like heat dissipation plates is axially symmetrical with the second figure formed by the spacers of the second type of sheet-like heat dissipation plates, and the axis of symmetry is formed in the horizontal middle of the second gap.

[0016] Further, according to the number of layers required for the heat sink being two, the first heat sink and the second heat sink are aligned and stacked; according to the number of layers required for the heat sink being three, the first heat sink, the second heat sink and the first heat sink are aligned and stacked in sequence, or the second heat sink, the first heat sink and the second heat sink are aligned and stacked in sequence.

[0017] Furthermore, in step S2, the metal sheet is punched once, twice or three times, and mounting holes for mounting chips are formed on the upper surface of the bottom plate and / or the upper surface of the top plate at positions corresponding to the frame of the heat sink and the partition, and one chip corresponds to one second gap, and in each of the second gaps, in each group of the partitions of each layer of the heat sink, the number of gaps between adjacent partitions corresponds to the amount of heat dissipation required by the chip corresponding to this group of partitions.

[0018] Furthermore, the step S4 further includes:

[0019] Obtain a liquid inlet joint and a liquid outlet joint, connect the liquid inlet joint to the liquid inlet, and connect the liquid outlet joint to the liquid outlet.

[0020] Furthermore, in step S2, when there are multiple partitions, among the adjacent partitions, the first longitudinal end of one partition and the connecting portion of the frame are punched, and the second longitudinal end of another partition and the connecting portion of the frame are punched to form the first gap, and the first longitudinal end and the second longitudinal end respectively face two opposite lateral side walls of the frame, or the connecting portions of both ends of two adjacent partitions and the frame are punched to form the first gap.

[0021] A first aspect of the present invention provides a chip heat dissipation device, wherein the chip heat dissipation device is manufactured by any of the manufacturing methods for a chip heat dissipation device.

[0022] Due to the above technical solution, the present invention has the following beneficial effects:

[0023] According to the manufacturing method of the chip heat sink of the present invention, a metal sheet is stamped to form a plurality of sheet heat sinks including a first type of sheet heat sink and a second type of sheet heat sink. According to the number of heat sink layers required by the chip heat sink and the required thickness of each heat sink, a certain amount of the first type of sheet heat sink / the second type of sheet heat sink is selected to be aligned and stacked respectively, and according to the number of layers of the heat sink, a certain amount of the first heat sink and the second heat sink are selected to be stacked in sequence, and then aligned and stacked with the top plate and the bottom plate, so as to form a chip heat sink. The chip heat sink is formed by the stamping process and stacking. Compared with the usual machining method to form the chip heat sink, the processing time is greatly shortened, the efficiency is high, and the cost is low, which meets the needs of mass processing. Even if a single sheet heat sink fails to be scrapped, the loss is low, which can reduce the cost. Moreover, the thickness of the heat sink can be easily adjusted by increasing or decreasing the number of heat sink layers, and the heat exchange area of ​​the chip heat sink can be easily adjusted by increasing or decreasing the number of heat sink layers, which has high adjustability and strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is a flow chart of a method for manufacturing a chip heat dissipation device according to an embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of manufacturing a sheet-shaped heat dissipation sheet from a metal sheet according to a first embodiment of the present invention;

[0027] Figure 3 is a schematic diagram of manufacturing a sheet-shaped heat dissipation sheet using a metal sheet according to a second embodiment of the present invention;

[0028] Figure 4 is a schematic diagram of assembling a sheet-like heat dissipation plate according to an embodiment of the present invention;

[0029] Figure 5 is an assembly diagram of a chip heat dissipation device according to an embodiment of the present invention;

[0030] Figure 6 It is a structural diagram of the chip heat dissipation device;

[0031] Figure 7 is a schematic diagram of the flow of cooling liquid inside the chip heat dissipation device according to the first embodiment of the present invention;

[0032] Figure 8 yes Figure 7 Enlarged view of area A in the middle;

[0033] Fig. 9 is a schematic diagram of the flow of cooling liquid inside a chip heat dissipation device according to a second embodiment of the present invention;

[0034] Fig.10 1 is a structural diagram of a sheet-like heat dissipation plate according to an embodiment of the present invention.

[0035] Reference numerals:

[0036] 100, top plate; 110, liquid inlet; 120, liquid outlet; 130, mounting hole; 200, heat sink; 201, frame; 202, partition; 203, partition bar; 210, first heat sink; 210a, first type of sheet heat sink; 220, second heat sink; 220a, second type of sheet heat sink; 300, bottom plate; 410, liquid inlet connector; 420, liquid outlet connector; 500, metal sheet; 600, axis of symmetry. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0039] Next, a method for manufacturing a chip heat dissipation device according to an embodiment of the present invention is described.

[0040] like Figure 1 As shown, the manufacturing method of the chip heat dissipation device according to the embodiment of the present invention includes:

[0041] Step S1, obtaining a metal sheet 500, the thickness of the metal sheet being able to meet the stamping requirements.

[0042] That is to say, the material and thickness of the metal sheet 500 can be selected from the perspective of stamping equipment and stamping process to facilitate stamping. By replacing conventional thick aluminum plates or copper plates with the metal sheet 500, costs can be reduced.

[0043] Step S2, stamping the metal sheet 500 and cutting out a predetermined pattern to form a plurality of sheet-like heat dissipation sheets, the sheet-like heat dissipation sheets including a first type of sheet-like heat dissipation sheets 210a and a second type of sheet-like heat dissipation sheets.

[0044] Each sheet-like heat dissipation plate includes a frame 201, one or more partitions 202 and multiple groups of partition bars 203. The partitions 202 are arranged in the area surrounded by the frame 201. The partitions 202 are arranged longitudinally, and at least one end of the partitions 202 has a first gap with the lateral side wall of the frame 201. When there is one partition 202, the partition 202 is arranged in the middle of the area surrounded by the frame 201. When there are multiple partitions 202, the multiple partitions 202 are arranged in a lateral spaced relationship. In the lateral direction, the frame 201 is arranged at a distance of 1 / 200 mm from the frame 201. There is a second gap between the longitudinal side wall of 201 and the adjacent partition 202, and between two adjacent partitions 202. Multiple groups of partition bars 203 correspond to the multiple second gaps one by one. Each group of partition bars 203 includes multiple partition bars 203 arranged at intervals along the longitudinal direction. The partition bars 203 are flush with the upper surface / lower surface of the frame 201. The partition bars 203 are arranged in the second gap, and their two horizontal ends are respectively connected to the frame 201 and the partition 202, or respectively connected to two adjacent partitions 202.

[0045] The frame 201 and partition 202 of each flaky heat dissipating plate have the same shape, and the inclination angles of the partition bars 203 of the first type of flaky heat dissipating plate 210a and the second type of flaky heat dissipating plate 220a relative to the longitudinal side wall of the frame 201 are inconsistent.

[0046] like Figure 2 As shown, the metal sheet 500 can be punched through a first mold to form a first type of sheet-like heat dissipation sheet 210a, and the metal sheet 500 can be punched through a second mold to form a second type of sheet-like heat dissipation sheet 220a. The metal sheet 500 can also be punched through a third mold to simultaneously form the first type of sheet-like heat dissipation sheet 210a and the second type of sheet-like heat dissipation sheet 220a.

[0047] Compared with machining (CNC, etc.), stamping can greatly shorten the processing time and can form a sheet heat sink relatively quickly, with high production capacity and high efficiency. Even if a single sheet heat sink fails to be processed and is scrapped, the loss is relatively low, which can effectively reduce costs.

[0048] The shapes of the frame 201 and the partition 202 of the first type of sheet heat dissipation thin plate and the second type of sheet heat dissipation thin plate are consistent, and the inclination angles of the partition bars 203 of the first type of sheet heat dissipation thin plate 210a and the second type of sheet heat dissipation thin plate 220a relative to the longitudinal side wall of the frame 201 are inconsistent. After the first type of sheet heat dissipation thin plate 210a and the second type of sheet heat dissipation thin plate are subsequently stacked, the two will intersect because the inclination angles of the two relative to the longitudinal side wall of the frame 201 are inconsistent, and the coolant can flow from the first type of sheet heat dissipation plate 200 to the second type of sheet heat dissipation plate 200, or from the second type of sheet heat dissipation plate 200 to the first type of sheet heat dissipation plate 200 through this intersection.

[0049] According to the fact that only one or both ends of the partition 202 in the longitudinal direction have the first gap from the lateral side wall of the frame 201, there are two cases:

[0050] Case 1, such as Figure 2 As shown, the two longitudinal ends of the partition 202 have a first gap from the lateral side walls of the frame 201 .

[0051] Case 2: Figure 3 As shown, a longitudinal end of the partition 202 has a first gap from a lateral side wall of the frame 201 .

[0052] Step S3, obtaining the number of layers of heat sinks 200 and the thickness of each layer of heat sinks 200 required for the chip cooling device, selecting a certain amount of first-type sheet heat sinks 210a / second-type sheet heat sinks 220a according to the thickness of the heat sinks 200, and aligning and stacking them to form first heat sinks 210 / second heat sinks 220, and selecting a certain amount of first heat sinks 210 and second heat sinks 220 according to the number of layers of the heat sinks 200, and stacking them in sequence.

[0053] For example, Figure 4 As shown, the number of layers of heat sinks 200 required for the chip heat dissipation device is two, the thickness of each heat sink 200 is 6 mm, and the thickness of the sheet heat dissipation thin plate is 2 mm. Then three layers of the first type of sheet heat dissipation thin plates 210a are selected to be aligned and stacked to form the first heat sink 210, and three layers of the second type of sheet heat dissipation thin plates 220a are aligned and stacked to form the second heat sink 220. The first heat sink 210 and the second heat sink 220 are aligned and stacked to form the two layers of heat sinks 200 required for the chip heat dissipation device. Among them, the first heat sink, the second heat sink, the first heat sink... are stacked in sequence, and the adjacent two layers of heat sinks are the first heat sink and the second heat sink (the types of the adjacent two layers of heat sinks are inconsistent).

[0054] The heat dissipation plate 200 includes a first heat dissipation plate 201 and / or a second heat dissipation plate 202 .

[0055] Step S4, obtain the top plate 100 and the bottom plate 300, the outer edges of the top plate 100 and the bottom plate 300 are consistent with the outer edges of the frame 201, and the top plate 100 is respectively provided with a liquid inlet 110 and a liquid outlet 120 on both sides in the longitudinal direction. The top plate 100, the heat sink 200 and the bottom plate 300 are aligned and stacked in sequence to form a chip heat dissipation device.

[0056] like Figure 5 and Figure 6As shown, the top plate 100, the heat sink 200 and the bottom plate 300 are aligned and stacked in sequence to form a chip heat sink. A liquid inlet 110 and a liquid outlet 120 are respectively formed on both sides of the longitudinal direction of the top plate 100. The lower surface of the top plate 100 is in close contact with the lower surface of the heat sink 200 at the top layer. The upper surface of the bottom plate 300 is in close contact with the lower surface of the heat sink 200 at the bottom layer. The outer edge (outer edge) of the top plate 100 at least covers the inner edge (inner edge) of the frame 201. The outer edge of the bottom plate 300 at least covers the inner edge of the frame 201. The lower surface of the bottom plate 300 and / or the upper surface of the top plate 100 are used to connect with the chip. The coolant can flow into the chip heat sink through the liquid inlet 110, and the coolant can flow out of the chip heat sink through the liquid outlet.

[0057] For example, Figure 7 and Figure 8 As shown, the coolant flows horizontally from the liquid inlet 110 on one side of the longitudinal direction of the frame 201 to each first gap adjacent to the liquid inlet 110, and flows longitudinally into each second gap. In the second gap, the coolant overflows the lower gap (the lower gap formed by the adjacent partitions 203 of the lower heat sink 200 (second heat sink 202)), first flows along the extension direction of the lower gap, then flows to the cross pores (the upper gap and the lower gap have an intersection to form a cross pore), rises from the cross pores, then flows to the upper gap (the upper gap formed by the adjacent partitions 203 of the upper heat sink 200 (first heat sink 201)), flows along the extension direction of the upper gap, then flows to the cross pores, descends from the cross pores, then flows along the extension direction of the lower gap..., and finally flows to the liquid outlet on the other side of the longitudinal direction of the frame 201, and flows out of the chip heat dissipation device from the liquid outlet 120.

[0058] In the chip heat dissipation device formed above, the top plate 100, the multi-layer heat sink 200 and the bottom plate 300 are stacked in sequence, and the lower surface of the top plate 100, the frame 201 of the multi-layer heat sink 200 and the upper surface of the bottom plate 300 can form a cooling chamber for accommodating the coolant. The depth of the coolant is the total thickness of the multi-layer frame 201. The coolant can flow into the cooling chamber through the liquid inlet 110. The coolant can flow longitudinally in the second gap between the multi-layer partition 202 and the multi-layer frame 201, and between adjacent multi-layer partitions 202, and flow transversely in the first gap between the multi-layer partition 202 and the multi-layer frame 201. When the coolant flows longitudinally in the second gap, it can pass through the heat sink 200 on both sides. The flow channel formed by the upper gaps formed by the adjacent partitions 203 of the upper layer, the lower gaps formed by the adjacent partitions 203 of the lower layer, and the intersecting pores where the upper gaps and the lower gaps intersect, is a three-dimensional flow channel. The coolant can contact the inner wall of the frame 201 of each layer of the heat sink 200, the side walls of the partitions 203, the upper surface of the partitions 203 of the lower layer at the intersection of the upper gaps and the partitions 203 of the lower layer, and the lower surface of the partitions 203 of the upper layer at the intersection of the lower gaps and the partitions 203 of the upper layer, thereby increasing the heat exchange area and avoiding flowing at the intersection of the partitions 203, the lower surface / lower surface of the partitions 202 and the frame 201, reducing the cross-sectional area of ​​the coolant flow, increasing the flow rate, thereby increasing the heat exchange coefficient and increasing the heat exchange capacity.

[0059] In the above manufacturing method of the chip heat dissipation device, a metal sheet 500 is stamped to form a plurality of sheet heat dissipation sheets including a first type of sheet heat dissipation sheets and a second type of sheet heat dissipation sheets. According to the number of layers of the heat dissipation plates 200 required for the chip heat dissipation device and the required thickness of each layer of the heat dissipation plates 200, a certain amount of the first type of sheet heat dissipation sheets 210a / the second type of sheet heat dissipation sheets 220a are selected for alignment and stacking respectively, and according to the number of layers of the heat dissipation plates 200, a certain amount of the first heat dissipation plates 210 and the second heat dissipation plates 220 are selected for stacking in sequence, and then aligned and stacked with the top plate 100 and the bottom plate 300, so as to form a chip heat dissipation device. The chip heat dissipation device is formed by a stamping process and stacking. Compared with the conventional machining method to form the chip heat dissipation device, the processing time is greatly shortened, the efficiency is high, and the cost is low, which meets the needs of large-scale processing. Even if a single sheet heat dissipation plate fails in processing and is scrapped, the loss is low, which can reduce costs. Moreover, the thickness of the heat sink 200 can be conveniently adjusted by increasing or decreasing the number of sheet-like heat sinks, and the heat exchange area of ​​the chip heat sink can be conveniently adjusted by increasing or decreasing the number of layers of the heat sink 200, which has high adjustability and strong versatility.

[0060] In some embodiments of the present invention, a plurality of sheet-like heat dissipation plates are stacked in sequence by a vacuum brazing method.

[0061] For example, Figure 4 and Figure 5 As shown, three first-type sheet-like heat dissipation plates 210 a and three second-type sheet-like heat dissipation plates 220 a are stacked in sequence by vacuum brazing.

[0062] The vacuum brazing method can make the sheet-like heat dissipation plates tightly connected to avoid gaps between the sheet-like heat dissipation plates, and can also improve the corrosion resistance of the chip heat dissipation device.

[0063] In some embodiments of the present invention, the angle between the partition bar 203 and the longitudinal side wall of the frame 201 is 60 degrees to 95 degrees, or the angle is 105 degrees to 120 degrees.

[0064] The stacking of the sheet-like heat dissipation sheets can make the spacer 203 of the first heat dissipation plate 210 or the second heat dissipation plate 220 and the longitudinal side wall of the frame 201 have an angle of 60 degrees to 95 degrees, or an angle of 105 degrees to 120 degrees.

[0065] like Figure 2 and Figure 3 As shown, in two adjacent layers of heat dissipation plates 200 , the angle between the partition bars 203 of the first heat dissipation plate 210 and the longitudinal side wall of the frame 201 is α, and the angle between the partition bars 203 of the second heat dissipation plate 220 and the longitudinal side wall of the frame 201 is β.

[0066] Among them, α is 0.1 to 0.1 degrees, and β is 0.1 to 0.1 degrees. This angle makes the partition bar 203 closer to the horizontal line, so that more partition bars 203 can be arranged in the second gap to increase the heat exchange area.

[0067] Optionally, the angles of the partition bars 203 of the first type of sheet-like heat dissipation plates 210 a and the second type of sheet-like heat dissipation plates 220 a and the longitudinal side walls of the frame 201 are complementary.

[0068] That is, α and β complement each other, so that the overlapping rate between the partition bars 203 of the first heat sink 210 and the partition bars 203 of the second heat sink 220 can be increased, thereby further increasing the heat exchange area.

[0069] Furthermore, the first figure formed by the spacers 203 of the first type of sheet-like heat dissipation plates 210a is axially symmetrical with the second figure formed by the spacers 203 of the second type of sheet-like heat dissipation plates, and the axis of symmetry 600 is formed in the horizontal middle of the second gap.

[0070] like Fig.10As shown, the symmetry axis 600 is the center line of the longitudinal side wall of the frame 201 and the longitudinal side wall of the partition 202 adjacent to the longitudinal frame 201, or the center line of the longitudinal side walls of two adjacent partitions 202. The first and second axially symmetrical figures can make the overlap rate of the partition bars 203 higher, significantly increase the heat exchange area, and the flow rate of the coolant on both sides of the symmetry axis 600 of the coolant is more uniform, which increases the uniformity of heat exchange. The symmetry axis 600 is in the horizontal middle of the second gap. The closer to the symmetry axis 600, the larger the heat exchange area. Corresponding to the fact that the heat in the middle of the chip is large and the heat around it is small, the heat dissipation in the middle of the chip can be concentrated, thereby improving the heat dissipation efficiency.

[0071] In some embodiments of the present invention, according to the number of layers required by the heat sink 200 being two layers, the first heat sink 210 and the second heat sink 220 are aligned and stacked; according to the number of layers required by the heat sink 200 being three layers, the first heat sink 210, the second heat sink 220 and the first heat sink 210 are aligned and stacked in sequence, or the second heat sink 220, the first heat sink 210 and the second heat sink 220 are aligned and stacked in sequence.

[0072] like Figure 5 As shown, the number of layers required for the heat sink 200 is two. When the number of layers required for the heat sink 200 is three, a second heat sink 220 can be stacked on the original first heat sink 210 on the basis of the two-layer heat sink 200, or a first heat sink 210 can be stacked on the original second heat sink 220, so that a three-layer heat sink 200 can be formed, and so on, a four-layer heat sink 200 or a five-layer heat sink 200 can be formed.

[0073] It should be noted that the above are only optional examples, and the number of layers of the heat sink 200 is not limited here, and can be seven layers, eight layers, etc., which should be understood to be within the scope of the present invention. In this way, a multi-layer heat sink 200 can be easily formed, and the coolant can pass through the multi-layer heat sink from the cross gap to increase the heat exchange area.

[0074] In some embodiments of the present invention, in step S2, the metal sheet 500 is punched once, twice or three times.

[0075] like Figure 2 and Figure 3 As shown, the metal sheet 500 can be stamped once to form a sheet-like heat dissipation sheet. Alternatively, the metal sheet 500 can be cut into multiple rectangular sheets that are consistent with the frame 201, and then the rectangular sheets are stamped to form a sheet-like heat dissipation sheet.

[0076] It should be noted that the above are only optional examples, and the number of stamping times is not limited here.

[0077] As shown in FIG. 5 , nine groups of mounting holes 130 are provided (corresponding to nine second gaps), each group of mounting holes 130 has four mounting holes, and fasteners can pass through the mounting holes 130 at the four corners of the chip, so that the chip fits tightly with the chip heat sink.

[0078] As shown in FIG. 7 , among the nine groups of spacers 203 (corresponding to nine second gaps), from right to left, the number of gaps between adjacent spacers 203 in each group of spacers 203 in the third second gap, the sixth second gap and the ninth second gap is relatively smaller than that in the others, and the chip corresponding to this second gap requires less heat dissipation, which reduces the flow of the coolant flowing through this second gap and reduces the heat exchange area in this second gap, so that more coolant can flow into other second gaps, and more heat can be dissipated for the chips corresponding to other second gaps, so that chips with different heat dissipation requirements can be efficiently and targetedly dissipated.

[0079] In some embodiments of the present invention, step S4 further includes obtaining a liquid inlet connector 410 and a liquid outlet connector 420 , connecting the liquid inlet connector 410 to the liquid inlet 110 , and connecting the liquid outlet connector 420 to the liquid outlet 120 .

[0080] like Figure 5 As shown, the liquid inlet 110 is connected to the liquid inlet pipe via the liquid inlet joint 410, and the liquid outlet 120 is connected to the liquid outlet pipe via the liquid outlet joint 420, which can increase the sealing performance and prevent the leakage of the coolant.

[0081] In some embodiments of the present invention, in step S2, when there are multiple partitions 202, among adjacent partitions 202, the connecting portion between the first longitudinal end of one partition 202 and the frame 201 is punched, and the connecting portion between the second longitudinal end of another partition 202 and the frame 201 is punched to form a first gap, and the first longitudinal end and the second longitudinal end respectively face two opposite lateral side walls of the frame 201, or the connecting portions between both ends of two adjacent partitions 202 and the frame 201 are punched to form the first gap.

[0082] That is to say, it can be divided into two situations:

[0083] Case 1, such as Figure 2 As shown, in adjacent partitions 202, the connection parts between the two ends of two adjacent partitions 202 and the frame 201 are punched to form a first gap. The longitudinal ends of the partitions 202 have a first gap from the transverse side walls of the frame 201.

[0084] The flow of coolant in this chip cooling device is as follows Figure 7 shown.

[0085] Case 2: Figure 3As shown, in adjacent partitions 202, a first longitudinal end of one partition 202 and a connection portion of the frame 201 are punched, and a second longitudinal end of another partition 202 and a connection portion of the frame 201 are punched to form a first gap. A longitudinal end of the partition 202 has a first gap from a lateral side wall of the frame 201.

[0086] The flow of coolant in this chip cooling device is as follows Fig. 9 As shown. The coolant flows in from the liquid inlet 110, then flows longitudinally through each second gap in sequence to form a serpentine flow channel, and finally flows out from the liquid outlet 120. Compared with, Figure 7 As shown, the coolant flows through all the second gaps synchronously, and the cross-sectional area through which the coolant flows is relatively small. When the coolant inlet amount is fixed, the flow rate of the coolant increases, thereby increasing the heat exchange coefficient and improving the heat exchange capacity. Moreover, the retention of the coolant after heat exchange can be reduced, thereby improving the heat exchange efficiency.

[0087] The chip heat dissipation device according to an embodiment of the present invention is described below. The chip heat dissipation device is manufactured by any of the above-mentioned manufacturing methods of the chip heat dissipation device.

[0088] Can be formed as Figure 5 and 6 The chip heat dissipation device shown. The top plate 100, the multi-layer heat sink 200 and the bottom plate 300 are stacked in sequence, and the lower surface of the top plate 100, the frame 201 of the multi-layer heat sink 200 and the upper surface of the bottom plate 300 can form a cooling chamber for accommodating the coolant. The depth of the coolant is the total thickness of the multi-layer frame 201. The coolant can flow into the cooling chamber through the liquid inlet 110. The coolant can flow longitudinally in the second gap between the multi-layer partition 202 and the multi-layer frame 201, and between adjacent multi-layer partitions 202, and flow transversely in the first gap between the multi-layer partition 202 and the multi-layer frame 201. When the coolant flows longitudinally in the second gap, it can pass through the adjacent partitions of the upper layer of the heat sink 200 on both sides. The flow channel formed by the upper gap formed by the strips 203, the lower gap formed by the adjacent partitions 203 in the lower layer, and the cross pores where the upper gaps and the lower gaps intersect, is a three-dimensional flow channel. The coolant can contact the inner wall of the frame 201 of each layer of the heat sink 200, the side wall of the partition 203, the upper surface of the partition 203 of the lower layer at the intersection of the upper gap and the partition 203 of the lower layer, and the lower surface of the partition 203 of the upper layer at the intersection of the lower gap and the partition 203 of the upper layer, thereby increasing the heat exchange area and avoiding flowing at the intersection of the partitions 203, the lower surface / lower surface of the partition 202 and the frame 201, reducing the cross-sectional area of ​​the coolant flow, increasing the flow rate, thereby increasing the heat transfer coefficient and increasing the heat exchange capacity.

[0089] Moreover, the chip heat sink formed by stamping and laminating can greatly shorten the processing time compared with the conventional machining method, with high efficiency and low cost, and can meet the needs of mass processing. Even if a single sheet heat sink fails to be processed and is scrapped, the loss is low, which can reduce costs. Moreover, the thickness of the heat sink 200 can be easily adjusted by increasing or decreasing the number of heat sink layers, and the heat exchange area of ​​the chip heat sink can be easily adjusted by increasing or decreasing the number of layers of the heat sink 200, which has high adjustability and strong versatility.

[0090] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a chip heat dissipation device, characterized in that: The production method comprises: Step S1, obtaining a metal sheet, wherein the thickness of the metal sheet is a thickness that can meet the stamping requirements thereof; Step S2, stamping the metal sheet and cutting out a predetermined pattern to form a plurality of sheet-like heat dissipation sheets, wherein the sheet-like heat dissipation sheets include a first type of sheet-like heat dissipation sheets and a second type of sheet-like heat dissipation sheets. Each of the sheet-like heat dissipation thin plates includes a frame, one or more partitions and multiple groups of partition bars. The partition bar is arranged in the area surrounded by the frame. The partition bar is arranged longitudinally, and at least one end of the partition bar in the longitudinal direction has a first gap with the lateral side wall of the frame. When there is one partition bar, the partition bar is arranged in the middle of the area surrounded by the frame. When there are multiple partition bars, multiple partition bars are arranged with spacing in the lateral direction. In the lateral direction, there is a second gap between the longitudinal side wall of the frame and the partition bar adjacent to it, and between two adjacent partition bars. Multiple groups of partition bars correspond to multiple second gaps one by one. Each group of partition bars includes multiple partition bars arranged with spacing in the longitudinal direction. The partition bars are flush with the upper surface / lower surface of the frame. The partition bars are arranged in the second gap, and the two lateral ends of the partition bars are respectively connected to the frame and the partition bar, or respectively connected to two adjacent partition bars. The frame and the partition of each flaky heat dissipation sheet are in the same shape, and the inclination angles of the partitions of the first type of flaky heat dissipation sheet and the second type of flaky heat dissipation sheet relative to the longitudinal side wall of the frame are inconsistent; Step S3, obtaining the number of layers of heat sinks required by the chip heat sink and the thickness of each layer of the heat sink, selecting a certain amount of first-type flaky heat sinks / second-type flaky heat sinks according to the thickness of the heat sink, and stacking them respectively to form a first heat sink / second heat sink, and selecting a certain amount of first heat sinks and second heat sinks according to the number of layers of the heat sink, and stacking them in sequence, the heat sinks of two adjacent layers are the first heat sink and the second heat sink; Step S4, obtaining a top plate and a bottom plate, wherein the outer edges of the top plate and the bottom plate are consistent with the outer edges of the frame, and a liquid inlet and a liquid outlet are respectively formed on both longitudinal sides of the top plate, and the top plate, the heat sink and the bottom plate are aligned and stacked in sequence to form the chip heat dissipation device.

2. The method for manufacturing a chip heat dissipation device according to claim 1, wherein a plurality of the sheet-like heat dissipation thin plates are stacked in sequence by a vacuum brazing method.

3. The method for manufacturing a chip heat dissipation device according to claim 1, characterized in that: The angle between the partition bar and the longitudinal side wall of the frame is 60 degrees to 95 degrees, or the angle is 105 degrees to 120 degrees.

4. The method for manufacturing a chip heat dissipation device according to claim 3, characterized in that: The angles of the partition bars of the first type of sheet-like heat dissipation plates and the second type of sheet-like heat dissipation plates and the longitudinal side walls of the frame are complementary.

5. The method for manufacturing a chip heat dissipation device according to claim 4, characterized in that: The first figure formed by the spacers of the first type of sheet-like heat dissipation thin plates is axially symmetrical with the second figure formed by the spacers of the second type of sheet-like heat dissipation thin plates, and the axis of symmetry is formed in the horizontal middle of the second gap.

6. The method for manufacturing a chip heat dissipation device according to claim 1, characterized in that: According to the number of layers required for the heat sink, which is two layers, the first heat sink and the second heat sink are aligned and stacked. According to the number of layers required for the heat sink, which is three layers, the first heat sink, the second heat sink and the first heat sink are aligned and stacked in sequence, or the second heat sink, the first heat sink and the second heat sink are aligned and stacked in sequence.

7. The method for manufacturing a chip heat dissipation device according to claim 1, characterized in that: In the step S2, the metal sheet is punched once, twice or three times, and mounting holes for mounting chips are formed on the upper surface of the bottom plate and / or the upper surface of the top plate at positions corresponding to the frame of the heat sink and the partition, and one chip corresponds to one second gap. In each of the second gaps, in each group of the partitions of each layer of the heat sink, the number of gaps between adjacent partitions corresponds to the amount of heat dissipation required by the chip corresponding to this group of partitions.

8. The method for manufacturing a chip heat dissipation device according to claim 1, characterized in that: The step S4 further comprises: Obtain a liquid inlet joint and a liquid outlet joint, connect the liquid inlet joint to the liquid inlet, and connect the liquid outlet joint to the liquid outlet.

9. The method for manufacturing a chip heat dissipation device according to claim 1, characterized in that: In step S2, when there are multiple partitions, among the adjacent partitions, the first longitudinal end of one partition is punched and the connecting portion of the frame is punched, and the second longitudinal end of another partition is punched and the connecting portion of the frame is punched to form the first gap, and the first longitudinal end and the second longitudinal end respectively face two opposite lateral side walls of the frame, or the connecting portions of both ends of two adjacent partitions and the frame are punched to form the first gap.

10. A chip heat dissipation device, characterized in that: The chip heat dissipation device is manufactured by the manufacturing method of the chip heat dissipation device according to any one of claims 1 to 9.

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