A liquid cooling device for testing heat dissipation performance of a board card

Abstract

The application discloses a liquid cooling device for testing heat dissipation performance of a board card, and belongs to the technical field of liquid cooling heat dissipation. The application of the device can test the heat dissipation performance of a single board card respectively, and after heat exchange balance, the temperature of key components of the single board card can be measured by pasting a sensor or directly measured by using a thermal imager, so that the device is convenient, flexible, fast, reliable in structure, easy to operate, good in universality, and has the advantages of reusability.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling, and in particular to a liquid cooling device for testing the heat dissipation performance of circuit boards. Background Technology

[0002] As the integration of spaceborne electronic products increases and the functional performance requirements rise, the heat dissipation of circuit boards is also increasing. Therefore, verifying the heat dissipation performance of these boards has become a critical issue. A common method for heat dissipation performance testing is to mount the entire system onto a heat-dissipating surface, wait for heat exchange to reach equilibrium, and then check whether the temperatures of each key component meet the derating requirements.

[0003] This method requires placing the entire device in a specific environment to complete the heat dissipation performance test, which increases the difficulty of the test. Moreover, since different boards in the device have different power consumption, it is inconvenient to measure the temperature of each key component when testing the entire device. A large number of sensors are needed and intertwined inside the device, which often leads to interference between them. Summary of the Invention

[0004] In view of this, the present invention provides a liquid cooling device for testing the heat dissipation performance of circuit boards. This device allows for individual circuit board heat dissipation performance testing. After heat exchange equilibrium is reached, the temperature of key components on a single circuit board can be measured either by attaching sensors or directly using a thermal imager. This method is convenient, flexible, and fast. Furthermore, it is reliable in structure, easy to operate, versatile, and reusable.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A liquid cooling device for testing the heat dissipation performance of circuit boards includes a slide base plate and liquid cooling clamps located on the slide base plate. One side of the liquid cooling clamp is fixedly connected to the slide base plate, and the other side of the liquid cooling clamp is movably connected to the slide base plate through a T-slot. The distance between the two liquid cooling clamps is adjustable. A water cooling radiator and a liquid cooling pump are fixed to the slide base plate by screws. The liquid cooling clamp has a liquid cooling passage inside.

[0007] The upper liquid outlets of the two liquid cooling clamps are connected to the liquid inlet of the water cooling radiator via a first tee adapter; the liquid outlet of the water cooling radiator is connected to the liquid inlet of the liquid cooling pump, and the liquid outlet of the liquid cooling pump is connected to the lower liquid inlet of the two liquid cooling clamps via a second tee adapter.

[0008] Furthermore, the slide base plate has a T-slot, and the bottom of the liquid cooling fixture is provided with a T-block, with the T-slot and the T-block being compatible.

[0009] Further, each liquid cooling clamp comprises a U-shaped plate, a pressing strip, a guide rod and a spanner screw; the board card is located between the U-shaped plates of the two liquid cooling clamps, and the heat dissipation surfaces at both ends of the board card are in contact with the inner surfaces of the corresponding U-shaped plates; the pressing strip is located at the U-shaped opening of the U-shaped plate, and one side of the pressing strip is provided with a spanner screw connected with a bearing, the spanner screw penetrates through one side plate of the U-shaped plate and is in threaded connection with the side plate; in the use state, the board card is located between the other side plate of the U-shaped plate and the pressing strip.

[0010] Further, the pressing strip is further provided with a guide rod, the guide rod is located at the same side of the spanner screw on the pressing strip, and is in sliding connection with the side plate of the U-shaped plate at the same side.

[0011] Further, the guide rod is provided with two, and each guide rod is parallel to the spanner screw.

[0012] Further, the liquid cooling clamp is provided with a fluid connector at the liquid outlet and the liquid inlet.

[0013] The beneficial effects generated by the technical scheme of the present application are as follows:

[0014] 1. The T-shaped groove is used for horizontal adjustment of the liquid cooling clamp, the movement is stable, and the operation is simple.

[0015] 2. The present application only needs to be according to the model and size of the board card, and has good universality and high degree of reuse.

[0016] 3. The present application can complete the test of a single board card, facilitate the temperature measurement of components, and save the cost.

[0017] 4. The present application is suitable for most different types of board cards, has strong universality, and has high popularization value.

[0018] 5. The use of the present application can verify the heat dissipation performance of the board card in time, and find the problems in the engineering development process in time. DETAILED DESCRIPTION

[0019] Figure 1 is a structural schematic diagram of an embodiment of the present application

[0020] Figure 2 is a top view of Figure 1 ;

[0021] Figure 3 is a structural schematic diagram of a liquid cooling clamp in Figure 1 ;

[0022] Figure 4 is a side view of a slide way bottom plate in Figure 1 ;

[0023] Figure 5 is a side view of a slide way bottom plate in Figure 4a top view of the device.

[0024] In the figure: 1, slide bottom plate, 2, liquid cooling clamp, 3, water cooling row, 4, liquid cooling pump, 5, liquid cooling pipeline, 6, fluid connector, 7, three-way adapter, 8, batten, 9, guide rod, 10, wrench screw, 11, liquid cooling plate, 12, T-shaped groove. DETAILED DESCRIPTION

[0025] The application will be further described below in conjunction with the drawings and specific embodiments.

[0026] A liquid cooling device for testing the heat dissipation performance of a board card, comprising a slide bottom plate and liquid cooling clamps located on the slide bottom plate, wherein one side of the liquid cooling clamps is fixedly connected with the slide bottom plate, and the other side of the liquid cooling clamps is movably connected with the slide bottom plate through a T-shaped groove, and the spacing between the two liquid cooling clamps is adjustable; a water cooling row and a liquid cooling pump are fixed on the slide bottom plate through screws; a liquid cooling passage is arranged in the liquid cooling clamp;

[0027] The upper liquid outlet of the two liquid cooling clamps is connected with the liquid inlet of the water cooling row through a first three-way adapter; the liquid outlet of the water cooling row is connected with the liquid inlet of the liquid cooling pump, and the liquid outlet of the liquid cooling pump is connected with the lower liquid inlet of the two liquid cooling clamps through a second three-way adapter.

[0028] Further, the slide bottom plate is provided with a T-shaped groove, and the bottom of the liquid cooling clamp is provided with a T-shaped block, and the T-shaped groove and the T-shaped block are matched.

[0029] Further, each liquid cooling clamp comprises a U-shaped plate, a batten, a guide rod and a wrench screw; the board card is located between the U-shaped plates of the two liquid cooling clamps, and the heat dissipation surfaces at both ends of the board card are in contact with the inner surfaces of the corresponding U-shaped plates; the batten is located at the U-shaped opening of the U-shaped plate, one side of the batten is provided with a wrench screw connected with a bearing, the wrench screw penetrates one side plate of the U-shaped plate and is threadedly connected with the side plate; in the use state, the board card is located between the other side plate of the U-shaped plate and the batten.

[0030] Further, the batten is further provided with a guide rod, the guide rod and the wrench screw are located on the same side of the batten, and the guide rod is slidably connected with the side plate of the U-shaped plate on the same side.

[0031] Further, the guide rod is provided with two guide rods, and each guide rod is parallel to the wrench screw.

[0032] Further, the upper liquid outlet and the liquid inlet of the liquid cooling clamp are each provided with a fluid connector.

[0033] The following is a more specific embodiment:

[0034] Reference Figures 1-5The embodiment includes a slide base plate, a liquid cooling clamp, a water cooling row, a liquid cooling pump, a liquid cooling pipeline, a fluid connector, a three-way adapter, a pressing strip, a guide rod, a plum handle screw, a liquid cooling plate, and a T-shaped groove.

[0035] The slide base plate is a stainless steel part, which mainly plays a supporting role and a role in stabilizing the center of gravity.

[0036] The liquid cooling row is used to cool the circulating liquid.

[0037] The liquid cooling pump is used to provide power for liquid circulation.

[0038] The T-shaped groove is used for horizontal adjustment of the liquid cooling clamp and is used to adapt to different models of board cards.

[0039] The plum handle screw is used to adjust the pressing strip to press the board card, and the guide rod keeps the pressing strip horizontal and does not deviate.

[0040] As shown in Figure 1 and Figure 4 , the liquid cooling clamp 2 is moved along the T-shaped groove 12 in a straight line, and the distance between the two liquid cooling clamps is adjusted to match the board card to be tested.

[0041] As shown in Figure 3 , the plum handle screw 10 is adjusted, and the pressing strip 8 is pressed against the board card to be tested under the guidance of the guide rod 9.

[0042] As shown in Figure 2 , after the device is powered on, the water cooling row 3 and the liquid cooling pump 4 start working, the liquid starts circulating in the liquid cooling pipeline 5, and at this time the board card can start to be tested for heat dissipation performance.

Claims

1. A liquid cooling device for testing the heat dissipation performance of a board card, characterized in that, The device comprises a slide bottom plate and liquid cooling clamps on the slide bottom plate, wherein one side of the liquid cooling clamps is fixedly connected with the slide bottom plate, and the other side of the liquid cooling clamps is movably connected with the slide bottom plate through a T-shaped groove, and the spacing between the two liquid cooling clamps is adjustable; a water cooling row and a liquid cooling pump are fixed on the slide bottom plate through screws; and a liquid cooling passage is arranged in the liquid cooling clamp. The upper liquid outlet of the two liquid cooling clamps is connected with the liquid inlet of the water cooling row through a first three-way adapter; the liquid outlet of the water cooling row is connected with the liquid inlet of the liquid cooling pump, and the liquid outlet of the liquid cooling pump is connected with the lower liquid inlet of the two liquid cooling clamps through a second three-way adapter; Each liquid cooling clamp comprises a U-shaped plate, a pressing strip, a guide rod and a key handle screw; a plate card is arranged between the U-shaped plates of the two liquid cooling clamps, and the heat dissipation surfaces at both ends of the plate card are in contact with the inner surfaces of the corresponding U-shaped plates; the pressing strip is arranged at the U-shaped opening of the U-shaped plate, one side of the pressing strip is provided with a key handle screw connected with the pressing strip bearing, the key handle screw penetrates one side of the U-shaped plate and is threadedly connected with the side plate; in the use state, the plate card is located between the other side plate of the U-shaped plate and the pressing strip; The pressing strip is further provided with a guide rod, the guide rod and the key handle screw are located on the same side of the pressing strip, and the guide rod is slidably connected with the side plate of the U-shaped plate on the same side. 2.The liquid cooling device for testing the heat dissipation performance of a board card according to claim 1, wherein, The slide bottom plate is provided with a T-shaped groove, and the bottom of the liquid cooling clamp is provided with a T-shaped block, and the T-shaped groove and the T-shaped block are matched. 3.The liquid cooling device for testing the heat dissipation performance of a board card according to claim 1, wherein, The guide rod is provided with two guide rods, and each guide rod is parallel to the key handle screw.

4. The liquid cooling device for testing the heat dissipation performance of a board card according to claim 1, characterized in that, The upper liquid outlet and the lower liquid inlet of the liquid cooling clamp are each provided with a fluid connector.

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