Glass substrate thermal chamfering method and device

Abstract

A method for thermally chamfering a glass substrate is provided. The edge of the glass substrate (100) is chamfered by applying a thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) from the edge of the glass substrate (100). The strip is cut at a predetermined point on the strip before the strip breaks due to its weight. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a cutting torch (300) to the predetermined point. The applying of the thermal shock includes bringing a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while bringing the heating element (210) into contact with the edge of the glass substrate (100).

Description

Background of the Invention

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the benefit of priority under patent law to Korean patent application serial number 10-2020-0177703 filed on December 17, 2020, the contents of which are relied upon and incorporated herein by reference in their entirety. Technical Field

[0004] The present disclosure relates to a method and apparatus for managing banding generated in thermal chamfering. Background Art

[0005] Thermal chamfering is a process of peeling a thin strip from a glass substrate by applying thermal shock to the edge of the glass substrate so that defects are removed from the edge of the glass substrate, thereby increasing the strength of the glass substrate.

[0006] However, there may be a limitation in that the strength of a glass substrate chamfered by the related art method may not increase as expected, which may be problematic. Summary of the Invention

[0007] Various aspects of the present disclosure provide a thermal chamfering method and apparatus that can further increase the strength of a glass substrate.

[0008] According to one aspect, a method for thermally chamfering a glass substrate may include: chamfering an edge of a glass substrate by applying a thermal shock to the edge of the glass substrate, thereby peeling a strip from the edge of the glass substrate; and cutting the strip at a predetermined point on the strip before the strip breaks due to its weight.

[0009] In some embodiments, the cutting may be performed by applying at least one of heat and a laser beam to a predetermined point to cut the strip.

[0010] In some embodiments, the cutting may be performed by applying a flame of a cutting torch to the predetermined point to cut the strip.

[0011] In some embodiments, the applying of the thermal shock can include contacting a heating element with a portion of a glass substrate, such as the edge of a glass substrate.

[0012] In some embodiments, the chamfering may include relatively moving the heating element along the edge of the glass substrate while bringing the heating element into contact with the edge of the glass substrate.

[0013] According to another aspect, a glass substrate thermal chamfering apparatus may include: a chamfering unit configured to chamfer an edge of a glass substrate by applying a thermal shock to the edge of the glass substrate, thereby peeling a strip from the edge of the glass substrate; and a cutting unit configured to cut the strip at a predetermined point on the strip before the strip breaks due to its weight.

[0014] In some embodiments, the cutting unit may cut the strip by applying at least one of heat and a laser beam to the predetermined point.

[0015] In some embodiments, the cutting unit may cut the strip by applying a flame to the predetermined point.

[0016] In some embodiments, the chamfering unit may include a heating element configured to apply a thermal shock to the edge of the glass substrate by contacting the edge of the glass substrate.

[0017] In some embodiments, the heating element may include a heating rod.

[0018] In some embodiments, the heating element may be heated by high frequency induction.

[0019] According to the embodiment, a method and apparatus for thermally chamfering a glass substrate capable of further increasing the strength of the glass substrate may be provided.

[0020] The methods and apparatus of the present disclosure have other features and advantages, which will become apparent from or be described in more detail in the accompanying drawings, the disclosure of which is incorporated herein and, together with the subsequent detailed description, serves to explain certain principles of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a side view illustrating thermal chamfering performed on a glass substrate in a method for thermal chamfering a glass substrate according to an embodiment;

[0022] Figure 2 is a plan view illustrating thermal chamfering performed on a glass substrate in a method for thermal chamfering a glass substrate according to an embodiment;

[0023] Figure 3 is a graph showing the relationship between the diameter of a heating element and the power;

[0024] Figure 4 Conceptually illustrates the cause of strength reduction that may be caused by thermal chamfering of a glass substrate;

[0025] Figure 5A process of cutting a ribbon in a method for thermally chamfering a glass substrate according to an embodiment is shown;

[0026] Figure 6 is an image showing a process of cutting a strip by applying a micro-flame to the strip;

[0027] Figure 7 is a side view of a glass article according to one or more embodiments; and

[0028] Figure 8 is a side view of a glass article according to one or more embodiments. DETAILED DESCRIPTION

[0029] Figure 1 The heat chamfering of a glass substrate in a method for heat chamfering a glass substrate according to an embodiment is shown, and Figure 2 is a plan view illustrating thermal chamfering performed on a glass substrate by a method of thermal chamfering a glass substrate according to an embodiment.

[0030] The edge of the glass substrate 100 can be thermally chamfered by applying a thermal shock to the edge of the glass substrate 100. In some embodiments, the thermal shock can be applied by contacting the heating element 210 with the edge of the glass substrate 100. In some of such embodiments, the edge of the glass substrate 100 can be thermally chamfered by relatively moving the heating element 210 along the edge of the glass substrate 100 while maintaining the heating element 210 in contact with the edge of the glass substrate 100. For the relative movement, only the glass substrate 100 can be moved, only the heating element 210 can be moved, or both the glass substrate 100 and the heating element 210 can be moved simultaneously.

[0031] The main plane of the glass substrate 100 may have a rectangular shape. However, the glass substrate 100 is not limited to having a specific shape and may have a polygonal shape, a circular shape, an elliptical shape, etc. In the present disclosure, the substrate is not limited to a thin substrate in which both the lateral length (e.g., the distance in the X-axis direction) and the longitudinal length (e.g., the distance in the Y-axis direction) of the main plane are relatively greater than the thickness (e.g., the distance in the Z-axis direction) of the main plane. However, the substrate is not limited to this and may have a variety of other shapes. For example, the substrate may be a thick block.

[0032] The glass substrate 100 according to the present disclosure may include a substrate of any glass material (eg, borosilicate glass).

[0033] In the case where the main plane of the glass substrate 100, referred to as the XY plane, has a rectangular shape, the heating element 210 can perform chamfering while relatively moving along the four edges of the glass substrate 100 in the X and Y directions and making contact with the four edges. The speed of relative movement can vary depending on the composition of the glass, temperature conditions, and the shape of the glass substrate 100 to be chamfered. Due to this chamfering, the strip 100a peels off from the edge. In some embodiments, the heating element 210 can perform chamfering while continuously making contact with the four edges of the glass substrate 100. For example, where the four edges of the glass substrate 100 are referred to as the first edge, the second edge, the third edge, and the fourth edge in a clockwise direction, the heating element 210 may chamfer all four edges of the glass substrate 100 while relatively moving along the first edge in the X direction to the corner between the first edge and the second edge and making contact with the first edge, relatively moving along the second edge in the Y direction to the corner between the second edge and the third edge and making contact with the second edge, relatively moving along the third edge in the X direction (i.e., in a direction opposite to the direction of movement along the first edge and making contact with the first edge) to the corner between the third edge and the fourth edge and making contact with the third edge, and then relatively moving along the fourth edge in the Y direction (i.e., in a direction opposite to the direction of movement along the second edge and making contact with the second edge) to the corner between the fourth edge and the first edge and making contact with the fourth edge.

[0034] Due to this chamfer, the thin strip 100 a is peeled off from the glass substrate 100 to remove defects on the edge of the glass substrate 100 and increase the strength of the glass substrate 100 .

[0035] In some embodiments, while chamfering is being performed, the glass substrate 100 may be positioned on the top surface of a cooling bed (not shown). The size of the cooling bed may be substantially the same as that of the glass substrate 100, or may be larger or smaller, depending on the environment in which the chamfering is being performed. A refrigerant circulation channel may be provided inside the cooling bed to maintain a constant temperature of the cooling bed. In addition, a suction port capable of fixing the glass substrate 100 by suction may be provided in the surface of the cooling bed. The suction port may be connected to a vacuum pump that provides a partial vacuum. When the surface of the glass substrate 100 is maintained by vacuum, it may not be necessary to provide a fixing tool on the side of the glass plate in order to fix the glass substrate 100 in place. Therefore, contact of the heating element 210 with the four edges of the glass substrate 100 can be easily performed.

[0036] In some embodiments, the heating element 210 may include a heating rod. In some embodiments, the end portion of the heating rod that contacts the glass substrate 100 may have a cylindrical shape. In some embodiments, the heating rod may be a metal rod. For example, a metal rod formed of MoSi2 may be used as a heating rod. However, the heating rod is not limited to this. At a specific point in time, the heating element 210 may be in point contact or line contact with the glass substrate 100 (for example, where the cylindrical portion of the heating element contacts the glass substrate 100), or in surface contact with the glass substrate 100 (for example, where the heating surface of a heating element having a heating surface contacts the glass substrate 100). In some embodiments, the contact line (in line contact) and the contact surface (in surface contact) may be parallel to the side surface (i.e., thickness surface) of the glass substrate 100. However, the present disclosure is not limited to this, and the contact line or contact surface may have a predetermined angle relative to the side surface.

[0037] In some embodiments, the heating element 210 can be heated by high-frequency induction heating. The heating element 210 can be heated by an induction coil 220 connected to a high-frequency induction heater. The heating element 210 can be heated by the induction coil 220 surrounding the outer portion of the heating element 210. Therefore, the heating element 210 can be positioned so as to extend through the center of the induction coil 220. In some embodiments, the induction coil 220 can be implemented using a copper (Cu) coil. Furthermore, for electrical safety, the outer surface of the induction coil 220 can be coated with a ceramic material. In some embodiments, cooling water can flow through the interior of the induction coil 220. The induction coil 220 can heat the heating element 210 to a temperature of approximately 1200°C to approximately 1300°C by applying power to the heating element 210. The high-frequency induction heater to be used is commercially available. The operating conditions of the high-frequency induction heater can vary depending on the conditions of the glass substrate 100 and the surrounding environment. For example, the operating conditions can be adjusted within the range of 100V to 200V, 60A to 70A, and 200Hz to 300Hz.

[0038] Figure 3 It shows Figure 2 A graph showing the relationship between the diameter of the heating elements 210, 210a and 210b and the power is shown.

[0039] Increasing the thickness of the heating elements 210, 210a, and 210b can reduce the amount of power consumption required to reach the process temperature (e.g., 1210° C.) Furthermore, high-temperature deformation of the shapes of the heating elements 210, 210a, and 210b (e.g., deformation that causes the heating elements 210, 210a, and 210b to bend) can be reduced.

[0040] Figure 4The reasons for the reduction in strength that may be caused by the thermal chamfering of the glass substrate 100 are conceptually shown. Figure 5 A process of cutting a ribbon in a method for thermally chamfering a glass substrate 100 according to an embodiment is shown, and Figure 6 are images showing a process of cutting a strip by applying a micro-flame to the strip.

[0041] While performing chamfering, the thin strip 100a is peeled off, which allows the glass substrate 100 to have a smooth edge. This is known to significantly increase the strength of the glass substrate 100.

[0042] However, the present inventors have found from research that despite such chamfering, the edge of the glass substrate 100 may still have local defects 100b, and the defects 100b may result in reduced strength of the glass substrate 100. Furthermore, unexpectedly, the present inventors have found that such defects may be caused by chamfering performed to increase strength. Figure 4 Conceptually shows the reasons why defects occur. Figure 4 As shown in FIG. , a significant issue with performing the chamfering process involves the behavior of the strip 100a being peeled off. As the chamfering is performed, the length of the strip 100a continues to increase, and the weight of the strip 100a increases with the length, potentially causing the strip 100a to break. The problem is that when the strip 100a breaks due to its weight, a defect 100b remains in the localized region of the edge of the glass substrate 100 where the strip 100a was disconnected, and the strength of this localized region is reduced to half its normal strength or less due to stress concentration in this localized region.

[0043] The present disclosure can prevent the above-mentioned problem by cutting the strip 100a at a specific point along its length before the strip 100a peeled from the edge of the glass substrate 100 by chamfering breaks due to its weight. In some embodiments, the length of the strip 100a can be detected while the straight section of the glass substrate 100 is being chamfered, and the strip 100a can be cut when the length of the strip 100a reaches a predetermined length (e.g., approximately 10 cm) or longer. In some other embodiments, the position of the heating element or the distance the heating element has moved can be detected while the straight section of the glass substrate 100 is being chamfered, and the strip 100a can be cut each time the edge of the glass substrate 100 is chamfered by a predetermined length. In some other embodiments, the strip 100a can be cut at a predetermined time period from the point in time when the chamfering of the straight section is started while the straight section of the glass substrate 100 is being chamfered. In some embodiments, the strip 100a may be cut immediately before the corner section is chamfered, even if the length of the strip has not yet reached a predetermined length. For example, the strip 100a may be cut when the distance between the heating element 210 and the corner of the edge reaches a predetermined length. Alternatively, the strip 100a may be cut when the time from the heating element 210 reaching the corner of the edge reaches a predetermined time.

[0044] In some embodiments, the strip 100a can be cut by applying heat to specific points on the strip 100a. When a mechanical device is used to cut the strip 100a, vibrations generated during cutting can be transmitted through the strip 100a to the edge of the glass substrate 100, thereby causing a notch. Therefore, it can be advantageous to cut the strip 100a by applying heat to specific points on the strip 100a so as to reliably cut the strip 100a without causing mechanical shock to the edge of the glass substrate.

[0045] In some embodiments, the strip 100a can be cut by applying a flame 300a of a cutting torch 300 to a specific point on the strip 100a. The cutting torch 300 can use propane as fuel, but the present disclosure is not limited thereto. In some other embodiments, the strip 100a can be cut by irradiating a specific point on the strip 100a with a laser beam.

[0046] In some embodiments, a worker may perform at least one of chamfering and cutting the strip 100a while holding and moving at least one of the heating element 210 and the cutting torch 300. However, more accurate and reliable results may be achieved by automatically moving the heating element 210 and the cutting torch 300 using a mechanical device. For example, Figure 5As shown, the apparatus can be configured such that when chamfering a straight section of the edge of the glass substrate 100, the moving direction and speed of the heating element 210 can be set to be substantially the same as the direction and speed of the cutting torch 300, so that the cutting torch 300 can cut the strip 100a while following the movement of the heating element 210. Here, the relative position between the heating element 210 and the cutting torch 300 can be maintained constant.

[0047] Through research, the present inventors have discovered that controlling the flow rate of the flame 300a of the cutting torch 300 is a key variable in cutting the strip 100a. If the flow rate of the flame 300a is too slow, the strip 100a may melt, deform, and be blown away from the flame 300a. Consequently, the strip 100a may simply bend rather than be cut. On the other hand, if the flow rate of the flame 300a is too fast, the strip 100a may break due to physical pressure before being cut by the heat. This can cause defects on the edge of the glass substrate 100. Therefore, controlling the flow rate of the flame 300a is essential.

[0048] Furthermore, a sufficiently high temperature of the flame 300a is required. If the temperature of the flame 300a is low, the strip 100a may not be cut. In some embodiments, the temperature of the flame 300a may range from 1200°C to 1400°C, but the present invention is not limited thereto. In some embodiments, a hydrogen micro-flame may be used to cut the strip, which increases the temperature by as much as 2800°C. The micro-flame temperature may be 2000°C or higher. When a core flame is applied to the strip, the strip can be cut immediately.

[0049] In some embodiments, the flame 300a can be oriented parallel to the surface of the edge of the glass substrate 100. This can assist in cutting the strip 100a without applying heat to the glass substrate 100.

[0050] Furthermore, the present disclosure provides a glass substrate thermal chamfering device. The glass substrate thermal chamfering device may include: a chamfering unit for chamfering an edge of a glass substrate by applying a thermal shock to the edge of the glass substrate; and a cutting unit for cutting a strip peeled from the edge of the glass substrate by chamfering at a specific point before the strip breaks due to its weight.

[0051] In some embodiments, the chamfering unit may include a heating element that applies a thermal shock to the edge of the glass substrate by contacting the edge of the glass substrate.

[0052] The cutting unit may cut the strip by applying at least one of heat and a laser beam to a specific point on the strip. In some embodiments, the cutting unit may be a cutting torch that cuts the strip by applying a flame to a specific point on the strip.

[0053] Furthermore, in some embodiments, the glass substrate thermal beveling apparatus may include a transport unit that transports at least one of the glass substrate, the heating element, and / or the cutting unit. Furthermore, in some embodiments, the glass substrate thermal beveling apparatus may include a controller that controls at least one of the movement and operation of the glass substrate, the heating element, and / or the cutting unit.

[0054] like Figure 7 As shown, another aspect of the present disclosure relates to a glass article 300. In one or more embodiments, the glass article includes a glass substrate 301, the glass substrate including a first major surface 310, a second major surface 320 opposite the first major surface, and a heat-chamfered edge 330 located between the first major surface and the second major surface. In one or more embodiments, the heat-chamfered edge 330 is formed according to one or more embodiments of the glass substrate heat-chamfering method described herein. In one or more embodiments, the glass article 300 includes at least one of a transparent conductive layer, a metal layer, and a polymer layer 400 disposed on the first major surface of the glass substrate. In one or more embodiments, the glass article includes a transparent conductive layer 500 disposed on the first major surface 320 (not shown), a metal layer 600 disposed on the transparent conductive layer 500, and a polymer layer 700 disposed on the metal layer. Each of the transparent conductive layer 500, the metal layer 600, and the polymer layer 700 forms a layer edge (510, 610, and 710, respectively). In one or more embodiments, as Figure 8 As shown, the layer edges 510, 610, and 710 are aligned with each other. In one or more embodiments, the layer edges 510, 610, and 710 are not aligned with each other (not shown).

[0055] In one or more embodiments, the thermally chamfered edge comprises a thickness of less than about 2 mm or less than about 1 mm (e.g., from about 0.01 mm to about 2 mm, from about 0.05 mm to about 2 mm, from about 0.1 mm to about 2 mm, from about 0.15 mm to about 2 mm, from about 0.2 mm to about 2 mm, from about 0.25 mm to about 2 mm, from about 0.3 mm to about 2 mm, from about 0.35 mm to about 2 mm, from about 0.4 mm to about 2 mm, from about 0.45 mm to about 2 mm, from about 0.5 mm to about 2 mm, from about 0.55 mm to about 2 mm, from about 0.6 mm to about 2 mm). m, from about 0.65 mm to about 2 mm, from about 0.7 mm to about 2 mm, from about 0.8 mm to about 2 mm, from about 0.9 mm to about 2 mm, from about 0.01 mm to about 1.9 mm, from about 0.01 mm to about 1.8 mm, from about 0.01 mm to about 1.7 mm, from about 0.01 mm to about 1.6 mm, from about 0.01 mm to about 1.5 mm, from about 0.01 mm to about 1.4 mm, from about 0.01 mm to about 1.3 mm, from about 0.01 mm to about 1.25 mm, from about 0.01 mm to about 1.2 mm, from about 0.01 mm to about 1.1 mm m or from about 0.01 mm to about 1.05 mm, from about 0.01 mm to about 1 mm, from about 0.05 mm to about 1 mm, from about 0.1 mm to about 1 mm, from about 0.15 mm to about 1 mm, from about 0.2 mm to about 1 mm, from about 0.25 mm to about 1 mm, from about 0.3 mm to about 1 mm, from about 0.35 mm to about 1 mm, from about 0.4 mm to about 1 mm, from about 0.45 mm to about 1 mm, from about 0.5 mm to about 1 mm, from about 0.55 mm to about 1 mm, from about 0.6 mm to about 1 mm, from about 0.65 mm to about 1 mm, from about 0. 7mm to about 1mm, from about 0.8mm to about 1mm, from about 0.9mm to about 1mm, from about 0.01mm to about 0.9mm, from about 0.01mm to about 0.8mm, from about 0.01mm to about 0.7mm, from about 0.01mm to about 0.6mm, from about 0.01mm to about 0.5mm, from about 0.01mm to about 0.4mm, from about 0.01mm to about 0.3mm, from about 0.01mm to about 0.25mm, from about 0.01mm to about 0.2mm, from about 0.01mm to about 0.1mm or from about 0.01mm to about 0.05mm).

[0056] In one or more embodiments, the heat-chamfered edge of the glass substrate comprises an edge strength of 600 MPa or greater. In one or more embodiments, the edge strength of the heat-chamfered edge is between about 600 MPa and about 1400 MPa, about 650 MPa and about 1400 MPa, about 700 MPa and about 1400 MPa, about 750 MPa and about 1400 MPa, about 800 MPa and about 1400 MPa, about 850 MPa and about 1400 MPa, about 900 MPa and about 1400 MPa, about 1000 MPa and about 1400 MPa, about 600 MPa and about 1350 MPa, about 600 MPa and about 1400 MPa. In one or more embodiments, the edge strength is measured by a two-point bend test.

[0057] In one or more embodiments, the thermally chamfered edge is at an angle different from the normal to the first major surface. In one or more embodiments, the thermally chamfered edge is at an angle up to and including 30 degrees from the normal (e.g., from about 1 to about 30, from about 5 to about 30, from about 10 to about 30, from about 15 to about 30, from about 20 to about 30, from about 25 to about 30, from about 1 to about 25, from about 1 to about 20, from about 1 to about 15, from about 1 to about 10, and from about 1 to about 5).

[0058] In one or more embodiments, the thermally chamfered edge comprises one or more fissures or a plurality of fissures. In one or more embodiments, the fissures have a maximum length of 11 microns or less (e.g., from about 0.1 micron to about 11 microns, from about 0.1 micron to about 10 microns, from about 0.1 micron to about 9 microns, from about 0.1 micron to about 8 microns, from about 0.1 micron to about 7 microns, from about 0.1 micron to about 6 microns, from about 0.1 micron to about 5 microns, from about 0.1 micron to about 4 microns, from about 0.1 micron to about 3 microns, from about 0.1 micron to about 2 microns, from about 0.1 micron to about 1 micron, from about 0.5 micron to about 11 microns, from about 1 micron to about 11 microns, from about 2 microns to about 11 microns, from about 3 microns to about 11 microns, from about 4 microns to about 11 microns, from about 5 microns to about 11 microns, from about 6 microns to about 11 microns, from about 7 microns to about 11 microns, from about 8 microns to about 11 microns, or from about 9 microns to about 11 microns).

[0059] In one or more embodiments, Figure 7 and Figure 8 As shown, at least one of the transparent conductive layer, the metal layer, and the polymer layer forms a layer edge 410, and a distance 420 between the layer edge and the heat-chamfered edge of the glass is less than 200 microns. In one or more embodiments, the distance 420 between the layer edge and the heat-chamfered edge of the glass substrate is in a range of about 0 microns to about 200 microns, about 10 microns to about 200 microns, about 20 microns to about 200 microns, about 50 microns to about 200 microns, about 100 microns to about 200 microns, about 150 microns to about 200 microns, about 0 microns to about 150 microns, about 0 microns to about 100 microns, about 0 microns to about 50 microns, about 0 microns to about 20 microns, about 0 microns to about 10 microns, or from about 0 microns to about 1 micron.

[0060] Aspect (1) of the present disclosure relates to a method for thermally chamfering a glass substrate, comprising: chamfering the edge of the glass substrate by applying a thermal shock to the edge of the glass substrate, thereby peeling a strip from the edge of the glass substrate; and cutting the strip at a predetermined point on the strip before the strip breaks due to its weight.

[0061] Aspect (2) of the present disclosure relates to the glass substrate thermal chamfering method described in aspect (1), wherein the cutting cuts the strip by applying at least one of heat and a laser beam to the predetermined point.

[0062] Aspect (3) of the present disclosure relates to the method for thermally chamfering a glass substrate according to aspect (2), wherein the cutting is performed by applying a flame of a cutting torch to the predetermined point to cut the strip.

[0063] Aspect (4) of the present disclosure relates to the method for thermally chamfering a glass substrate described in aspect (3), wherein the applying of the thermal shock comprises: bringing a heating element into contact with the edge of the glass substrate, wherein when a straight section of the edge of the glass substrate is chamfered, the heating element and the cutting torch move in the same direction and at the same speed.

[0064] Aspect (5) of the present disclosure relates to the method for thermally chamfering a glass substrate described in aspect (4), wherein the flame of the cutting torch is oriented parallel to the surface of the edge of the glass substrate.

[0065] Aspect (6) of the present disclosure relates to the method for thermally chamfering a glass substrate as described in any one of aspects (2) to (5), wherein while chamfering a straight section of the edge of the glass substrate, the cutting cuts the strip when the length of the strip is equal to or greater than a predetermined length.

[0066] Aspect (7) of the present disclosure relates to the method for thermally chamfering a glass substrate as described in any one of aspects (2) to (6), wherein while chamfering a straight line segment of the edge of the glass substrate, the cutting cuts the strip within a predetermined time period from the point in time when chamfering of the straight line segment is started.

[0067] Aspect (8) of the present disclosure relates to the method for thermally chamfering a glass substrate as described in any one of aspects (2) to (7), wherein the cutting cuts the strip immediately before chamfering the corner section of the edge of the glass substrate.

[0068] Aspect (9) of the present disclosure relates to the method for thermally chamfering a glass substrate as described in any one of aspects (1) to (8), wherein the applying of the thermal shock comprises: bringing a heating element into contact with the edge of the glass substrate.

[0069] Aspect (10) of the present disclosure relates to the method for thermally chamfering a glass substrate described in aspect (9), wherein the chamfering includes: relatively moving the heating element along the edge of the glass substrate while bringing the heating element into contact with the edge of the glass substrate.

[0070] Aspect (11) of the present invention relates to the method for thermally chamfering a glass substrate as described in any one of aspects (9) to (10), wherein the heating element comprises a heating rod.

[0071] Aspect (12) of the present disclosure relates to the method for thermally chamfering a glass substrate as described in any one of aspects (9) to (11), wherein the heating element is heated by high-frequency induction.

[0072] Aspect (13) of the present disclosure relates to a glass substrate thermal chamfering device, comprising: a chamfering unit configured to chamfer the edge of the glass substrate by applying a thermal shock to the edge of the glass substrate, thereby peeling a strip from the edge of the glass substrate; and a cutting unit configured to cut the strip at a predetermined point on the strip before the strip breaks due to its weight.

[0073] Aspect (14) of the present disclosure relates to the glass substrate thermal chamfering device described in aspect (13), wherein the cutting unit cuts the strip by applying at least one of heat and a laser beam to the predetermined point.

[0074] Aspect (15) of the present disclosure relates to the glass substrate thermal chamfering device described in aspect (14), wherein the cutting unit cuts the strip by applying flame to the predetermined point.

[0075] Aspect (16) of the present disclosure relates to the glass substrate thermal chamfering device described in any one of aspects (13) to (15), wherein the chamfering unit includes a heating element, and the heating element is configured to apply the thermal shock to the edge of the glass substrate by contacting the edge of the glass substrate.

[0076] Aspect (17) of the present disclosure relates to a glass article comprising: a glass substrate comprising: a first major surface, a second major surface opposite the first major surface, and a thermally chamfered edge located between the first major surface and the second major surface; and at least one of a transparent conductive layer, a metal layer, and a polymer layer, the at least one of the transparent conductive layer, the metal layer, and the polymer layer being disposed on the first major surface of the glass substrate, wherein the thermally chamfered edge comprises a thickness of less than 1 mm, and wherein the thermally chamfered edge comprises an edge strength of 600 MPa or greater.

[0077] Aspect (18) of the present disclosure relates to the glass article of aspect (17), wherein the thermally chamfered edge forms an angle of up to and including 30 degrees with the first major surface.

[0078] Aspect (19) of the present disclosure relates to the glass article of aspect (17) or aspect (18), wherein the thermally beveled edge comprises one or more cracks, and the cracks have a maximum length of 5 microns or less.

[0079] Aspect (20) of the present disclosure relates to the glass article described in any one of aspects (17) to (19), wherein at least one of the transparent conductive layer, the metal layer, and the polymer layer forms a layer edge, and the distance between the layer edge and the thermally chamfered edge of the glass substrate is less than 200 microns.

[0080] Although the foregoing embodiments of the present disclosure have been described, the present disclosure is not limited thereto and may have various other embodiments. The scope of the present disclosure should be defined by the appended claims and their equivalents. Although the appended claims are formulated to avoid the format of multiple dependent claims as much as possible, the features described in the corresponding dependent claims may be implemented in combination with features described in the claims cited in the dependent claims as well as features described in claims not cited in the dependent claims, unless the context clearly indicates otherwise. Such combinations of features will be included within the scope of the present disclosure.

Claims

1. A method for thermally chamfering a glass substrate, comprising: chamfering the edge of the glass substrate by applying a thermal shock to the edge of the glass substrate thereby peeling a strip from the edge of the glass substrate; as well as The strip is cut at predetermined points on the strip before it breaks due to its weight. 2 . The glass substrate thermal chamfering method according to claim 1 , wherein the cutting cuts the strip by applying at least one of heat and a laser beam to the predetermined point. 3 . The method for thermally chamfering a glass substrate according to claim 2 , wherein the cutting is performed by applying a flame of a cutting torch to the predetermined point to cut the strip.

4. The method for thermally chamfering a glass substrate according to claim 3, wherein the applying of the thermal shock comprises: bringing a heating element into contact with the edge of the glass substrate, When the straight section of the edge of the glass substrate is chamfered, the heating element and the cutting torch move in the same direction and at the same speed. 5 . The method for thermally chamfering a glass substrate according to claim 4 , wherein the flame of the cutting torch is oriented parallel to a surface of the edge of the glass substrate. 6 . The glass substrate thermal chamfering method according to claim 2 , wherein the cutting cuts the strip when a length of the strip is equal to or greater than a predetermined length while chamfering a straight section of the edge of the glass substrate.

7. The method for thermally chamfering a glass substrate according to any one of claims 2 to 5, wherein the cutting cuts the strip at a predetermined time period from a point in time when chamfering the straight line section of the edge of the glass substrate is started. 8 . The method for thermally chamfering a glass substrate according to claim 2 , wherein the cutting cuts the strip immediately before chamfering a corner section of the edge of the glass substrate.

9. The method for thermally chamfering a glass substrate according to any one of the preceding claims, wherein the applying of the thermal shock comprises: A heating element is brought into contact with the edge of the glass substrate.

10. The method for thermally chamfering a glass substrate according to claim 9, wherein the chamfering comprises: The heating element is relatively moved along the edge of the glass substrate while being brought into contact with the edge of the glass substrate. 11 . The method for thermally chamfering a glass substrate according to claim 9 , wherein the heating element comprises a heating rod. 12 . The method for thermally chamfering a glass substrate according to claim 9 , wherein the heating element is heated by high-frequency induction.

13. A glass substrate thermal chamfering device, comprising: a chamfering unit configured to chamfer the edge of the glass substrate by applying a thermal shock to the edge of the glass substrate, thereby peeling a ribbon from the edge of the glass substrate; as well as A cutting unit is configured to cut the strip at a predetermined point on the strip before the strip breaks due to its weight. 14 . The glass substrate thermal chamfering apparatus according to claim 13 , wherein the cutting unit cuts the strip by applying at least one of heat and a laser beam to the predetermined point. 15 . The glass substrate thermal chamfering apparatus according to claim 14 , wherein the cutting unit cuts the strip by applying flame to the predetermined point. 16 . The glass substrate thermal chamfering apparatus according to claim 13 , wherein the chamfering unit comprises a heating element configured to apply the thermal shock to the edge of the glass substrate by contacting the edge of the glass substrate.

17. A glass product comprising: a glass substrate comprising a first major surface, a second major surface opposite the first major surface, and a thermally chamfered edge between the first major surface and the second major surface, wherein the thermally chamfered edge is produced by the method according to claim 1; and at least one of a transparent conductive layer, a metal layer, and a polymer layer, wherein the at least one of the transparent conductive layer, the metal layer, and the polymer layer is disposed on the first major surface of the glass substrate, wherein the thermally chamfered edge comprises a thickness of less than 1 mm, and Wherein the thermally chamfered edge comprises an edge strength of 600 MPa or greater.

18. The glass article of claim 17, wherein the thermally beveled edge forms an angle of 1 to 30 degrees with the first major surface.

19. The glass article of claim 17, wherein the thermally beveled edge comprises one or more fissures, and wherein the fissures have a maximum length of 5 micrometers or less.

20. The glass article according to any one of claims 17 to 19, wherein at least one of the transparent conductive layer, the metal layer, and the polymer layer forms a layer edge, and a distance between the layer edge and the thermally chamfered edge of the glass substrate is less than 200 microns.

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