Jig and integrated ring body copper pillar structure manufactured using the same

Abstract

The present application discloses a jig and an integrated ring-copper pillar structure made by the jig. The jig comprises a carrier, a movable metal sheet and a powder leakage cover from bottom to top. Each mold cavity of the carrier is for a copper pillar. Powder can be filled into the mold cavity through the movable metal sheet from the powder leakage cover, and then an annular powder is filled on the outer surface of the copper pillar. Then, the copper pillar and the annular powder are sintered together through a heating process, and the annular powder becomes a sintered ring, and the copper pillar and the sintered ring are formed into an integrated ring-copper pillar structure without assembly gap. In this way, the combination tolerance of the copper pillar and the sintered ring is reduced, and the water accumulation problem caused by the assembly gap of the copper pillar and the sintered ring in the past technology or process is improved. The copper pillar and the sintered ring are expanded, cracked and separated from the column due to water accumulation and ice formation.

Description

Technical Field

[0001] This invention relates to a jig and its application, and more particularly to a jig and an integral ring-shaped copper column structure made by means of the jig. Background Technology

[0002] With the rapid advancement of the technology industry, the functions of electronic products are becoming increasingly sophisticated, resulting in more heat being generated during operation. If this heat cannot be dissipated in time and accumulates in the electronic components (such as processors) inside the electronic product, it will inevitably affect the overall operating performance of the electronic product due to excessive temperature, or even cause damage to the electronic components.

[0003] Generally speaking, the industry typically uses heat dissipation devices with heat sources that are in confined spaces or require a large area for heat dissipation, such as heat exchange plates, as heat conduction or temperature equalization.

[0004] It is well known that a heat spreader consists of an upper plate covering a lower plate, which together define a sealed chamber. The sealed chamber is in a vacuum state and is filled with a working fluid (such as pure water). The sealed chamber is also equipped with capillary structures and support columns, with the two ends of the support columns respectively abutting the inner sides of the upper and lower plates inside the sealed chamber.

[0005] However, a typical support column is a solid copper column, whose function is only to provide support and prevent thermal expansion of the heat spreader (the upper and lower plates expand outwards when heated, causing bulges or swelling). Because the outer surface of the copper column is smooth, it cannot provide any capillary force. As a result, the working fluid after evaporation and condensation can only be subjected to gravity or slowly flow back to the evaporation zone (lower plate) through the capillary structure of the condensation zone (upper plate). The return flow rate and process are too slow, which can easily cause the water to return to the evaporation zone too slowly, resulting in dry burning and poor heat transfer efficiency.

[0006] Therefore, manufacturers improved the support column, enabling it to not only provide support but also exert capillary force. This improved support column can be broadly categorized into two types. One type is a sintered support column, formed by directly sintering ordinary powder. The porous structure of the sintered support column allows the condensed liquid to flow back to the evaporation zone via capillary force. While this sintered support column possesses capillary force, it also presents several problems. Firstly, as a porous sintered structure, its density is lower than that of a solid copper column, resulting in weaker support strength. It is susceptible to breakage or collapse under high external pressure, and its pull-out force is also insufficient, easily causing bulging of the heat spreader.

[0007] Another type of support column involves attaching a ring-shaped structure made of sintered powder to the outside of a solid copper column. The porous nature of this ring structure generates capillary force, drawing the condensed liquid back to the evaporation zone, thus achieving a smooth vapor-liquid circulation effect. This ring-shaped structure is manufactured using a graphite mold with a cavity containing a central carbon rod. Powder is then filled into the cavity to form a ring-shaped powder ring surrounding the carbon rod. The mold is then placed in a sintering furnace for sintering. After cooling, the sintered ring-shaped body is removed from the cavity. Because the melting points of the graphite mold and carbon rod are relatively higher than those of the sintering powder, they can withstand the sintering temperature without melting and sintering together with the ring-shaped body. This allows the ring-shaped body to easily detach from the cavity and separate from the carbon rod.

[0008] However, both the annular structure and the copper pillar are manufactured separately and then assembled. During the sintering process, it is difficult to ensure the uniformity of the annular structure's quality. This leads to inconsistencies in the center of the joint between the annular structure and the copper pillar, causing concentricity errors and assembly tolerances. Consequently, eccentricity and assembly gaps arise during assembly. (That is, if the inner diameter of the annular structure is excessively smaller than the outer diameter of the copper pillar, the annular structure cannot fit snugly onto the copper pillar. If the inner diameter of the annular structure is excessively larger than the outer diameter of the copper pillar, an assembly gap will form between the inner surface of the annular structure and the outer surface of the copper pillar, preventing a tight fit. This will cause the annular structure on the copper pillar to wobble and result in assembly gap problems.) This gap can cause water accumulation. When the heat spreader is not working and the external environment is at zero degrees Celsius, the accumulated water in this gap will freeze, causing the annular structure to expand (bulge), crack, or break, thereby reducing the heat exchange efficiency of the heat spreader or rendering it inoperable.

[0009] Therefore, how to solve the above-mentioned problems and defects is the direction that the inventors of this case and related manufacturers in this industry are eager to study and improve. Summary of the Invention

[0010] The purpose of this invention is to provide a jig that can solve the above-mentioned problems and an integral ring-shaped copper column structure made therefrom.

[0011] On one hand, the present invention provides a fixture comprising, from top to bottom, a carrier, a movable metal sheet, and a powder inlet cover. The carrier has a plurality of cavities. The movable metal sheet is disposed on the carrier and is reciprocating relative to it. The movable metal sheet has an upper surface and a lower surface and a plurality of powder inlet holes. Each set of powder inlet holes penetrates its upper and lower surfaces and communicates with the cavity. The powder inlet cover is disposed on the movable metal sheet and has a feeding area with a plurality of feeding ports, each feeding port corresponding to each set of powder inlet holes of the movable metal sheet.

[0012] In one embodiment of the fixture of the present invention, the carrier is located on a base, the movable metal sheet has a plurality of movable holes, the powder inlet cover has a plurality of first positioning holes, and the base has a settling area and a plurality of positioning pins. The settling area is for placing the carrier, and the plurality of positioning pins are for positioning the plurality of movable holes of the movable metal sheet and the plurality of first positioning holes of the powder inlet cover.

[0013] In a further embodiment of the fixture of the present invention, at least one fixed metal sheet is provided between the top surface of the carrier and the lower surface of the movable metal sheet. The fixed metal sheet is provided with a through hole corresponding to each mold cavity. A set of powder dropping holes is provided on the outside of each through hole to communicate with the mold cavity. The movable metal sheet can reciprocate relative to the fixed metal sheet so that each set of powder inlet holes is aligned or misaligned with each set of powder dropping holes of the fixed metal sheet.

[0014] In a further embodiment of the fixture of the present invention, the fixing metal sheet is provided with a plurality of second positioning holes and is positioned by a plurality of positioning pins.

[0015] In one embodiment of the fixture of the present invention, each mold cavity has a cavity bottom, the cavity bottom is provided with a fixing part, the fixing part is connected to a powder discharge hole, the powder discharge hole is located below the fixing part and penetrates into the bottom surface of the carrier; a protrusion is provided on one edge of the movable metal sheet.

[0016] On the other hand, the present invention provides an integral ring-shaped copper pillar structure, comprising a copper pillar and a sintered ring. The copper pillar has an upper end, a lower end, and an outer surface, the outer surface of which is covered by the sintered ring, and the sintered ring and the copper pillar are sintered together to form an integral structure without assembly gaps between them.

[0017] In one embodiment of the integrated ring-shaped copper pillar structure of the present invention, the upper end of the copper pillar is flush with or protrudes from the upper end of the sintered ring, and the lower end of the copper pillar protrudes from the lower end of the sintered ring.

[0018] This invention enables the fabrication of an integrated ring-shaped copper column structure using this fixture. This improves upon the previous well-known techniques or processes where the column and ring structure were fabricated separately and then assembled, resulting in assembly tolerance issues, assembly eccentricity, assembly gaps, and water accumulation problems in the assembly gaps. These defects caused the copper column and sintered ring to expand (bulge) and detach from the column due to water accumulating and freezing. Attached Figure Description

[0019] Figure 1A A three-dimensional exploded view of the jig;

[0020] Figure 1B A schematic diagram showing the dissection of the jig;

[0021] Figure 1Cfor Figure 1B A partially enlarged schematic diagram of 1C;

[0022] Figures 2A to 2C A schematic diagram of another implementation of the fixture;

[0023] Figure 3 A flowchart illustrating the steps involved in creating an integrated ring-shaped copper column structure;

[0024] Figure 4 A schematic diagram showing the process before the copper pillar is placed into the mold cavity;

[0025] Figure 5 A schematic diagram and a magnified view of the copper pillar after it has been placed into the mold cavity;

[0026] Figure 6 A top-view schematic diagram of the implementation before the movable metal plate of the fixture is moved;

[0027] Figures 7(a) to 7(d) A schematic diagram illustrating the continuous action of filling powder into the mold cavity;

[0028] Figure 8 A top-view schematic diagram showing the movement of the movable metal plate of the fixture;

[0029] Figure 9 A flowchart illustrating the steps involved in fabricating an integrated ring-shaped copper column structure using another implementation fixture;

[0030] Figure 10 , Figure 11 , Figures 12(a) to 12(d) For another implementation fixture pairing Figure 9 A schematic diagram illustrating the implementation of each step;

[0031] Figure 13 A three-dimensional schematic diagram of an integrated ring-shaped copper column structure;

[0032] Figure 14 This is a partial schematic diagram of the integrated ring and column structure applied within a temperature distribution plate.

[0033] Explanation of icon numbers:

[0034] Fixture 10; Base 11; Positioning pin 1112; Sealing area 112; Carrier 12; Top surface 121; Bottom surface 122; Mold cavity 123; Cavity bottom 1231; Fixing part 1232; Fixing part depth d; Powder discharge hole 1233; Gap 1234; Fixing metal plate 13; Through hole 131; Powder discharge hole 132; Second positioning hole 134; Thickness t; Reserved gap 135; Movable metal plate 14; Upper surface 141; Lower surface 142; Inlet Powder hole 143; movable hole 144; protrusion 145; powder slug cover 15; material placement area 151; feeding port 152; first positioning hole 153; copper pillar 21; upper end 211; lower end 212; upper height difference h1; lower height difference h2; powder 20; annular powder / sintering ring 22; upper end 221; lower end 222; heat spreader 30; upper cover 301; lower cover 302; capillary structure 303; steps S1~S5 and S2a~S5a. Detailed Implementation

[0035] The above-mentioned objectives of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0036] like Figures 1A to 1C As shown, a jig 10 is used to manufacture an integral ring-shaped copper column structure. The jig 10 includes, from bottom to top, a carrier 12, a movable metal sheet 14, and a powder filter cover 15.

[0037] The carrier 12 has a top surface 121 and a bottom surface 122. The top surface 121 has a plurality of cavities 123. Each cavity 123 has a bottom 1231, and the bottom 1231 is provided with a fixing part 1232. The fixing part 1232 is shaped downward from the bottom 1231, and has a fixing part depth d defined between the bottom side of the fixing part 1232 and the bottom 1231. In addition, a powder discharge hole 1233 is provided on the bottom side of the fixing part 1232. The powder discharge hole 1233 penetrates the fixing part 1232 and the bottom surface 122 of the carrier 12 and communicates with the cavity 123.

[0038] Furthermore, a bevel is provided at the junction of the fixing part 1232 and the powder discharge hole 1233, which is used to guide excess powder to the powder discharge hole 1233. In this embodiment, the carrier 12 is preferably made of graphite, which has a higher melting point than the sintering powder and the copper pillar. It can withstand the sintering temperature and will not combine with the sintered ring and the copper pillar after sintering, making it easy to detach from the mold cavity 123.

[0039] The movable metal sheet 14, such as a steel sheet, is disposed on the top surface 121 of the carrier 12 and can reciprocate relative to the carrier 12. The movable metal sheet 14 has an upper surface 141 and a lower surface 142, a plurality of powder inlet holes 143, and a plurality of movable holes 144. The lower surface 142 faces the top surface 121 of the carrier 12, and each set of powder inlet holes 14 penetrates the upper surface 141 and the lower surface 142. As the movable metal sheet 14 reciprocates relative to the carrier 12 (e.g., by being pulled or pushed back), each set of powder inlet holes 143 is aligned and connected with or misaligned and offset from the mold cavity 123 of the carrier 12. The aforementioned movable holes 144 are distributed at the four corners of the movable metal sheet 14, and a protrusion 145 protrudes from one edge of the movable metal sheet 14 to apply a reciprocating moving force thereon.

[0040] The powder inlet cover 15 is disposed on the movable metal sheet 14 and has a material placement area 151 and a plurality of first positioning holes 153. The plurality of first positioning holes 153 are, for example, but not limited to, located at the four corners of the powder inlet cover 15. The material placement area 151 is used to place powder (e.g., copper powder, titanium powder, or other metal or non-metal powders), and it has a plurality of feeding ports 152. As the movable metal sheet 14 reciprocates relative to the carrier 12, each feeding port 152 is aligned and connected to each set of powder inlet holes 143, or misaligned and not connected. When aligned and connected, each feeding port 152, each set of powder inlet holes 143, and the mold cavity 123 form a powder filling path from top to bottom.

[0041] In addition, such as Figures 2A to 2C As shown, the aforementioned carrier 12 can be optionally placed on a base 11, and a fixed metal sheet 13 is optionally provided between the top surface 121 of the carrier 12 and the lower surface 142 of the movable metal sheet 14. Thus, the fixture 10 includes, from bottom to top, a base 11, a carrier 12, a fixed metal sheet 13, a movable metal sheet 14, and a powder inlet cover 15.

[0042] The base 11 has a settling area 112 and a plurality of positioning pins 1112. The settling area 112 is for placing the aforementioned carrier 12. The plurality of positioning pins 1112 are, for example but not limited to, distributed at the four corners of the base 11, for corresponding positioning and matching of the plurality of movable holes 144 of the aforementioned movable metal sheet 14 and the first positioning hole 153 of the powder inlet cover 15.

[0043] The fixing metal sheet 13, such as a steel sheet, covers the top surface 121 of the carrier 12, and has a through hole 131 at the position corresponding to each mold cavity 123. Each through hole 131 has a set of powder discharge holes 132 on its outer side. Each set of powder discharge holes 132 corresponds to a mold cavity 123 connected to the carrier 12. A plurality of second positioning holes 134 are provided at the positioning pin 1112 corresponding to the base 11. These second positioning holes 134 are located at the four corners of the fixing metal sheet 13 and match the positioning pin 1112. By aligning and fitting the positioning pin 1112 with the plurality of second positioning holes 134, each positioning hole 131 and each set of powder discharge holes 132 of the fixing metal sheet 13 can be aligned with each mold cavity 123 of the carrier 12.

[0044] The aforementioned movable metal sheet 14 has multiple movable holes 144 (e.g., but not limited to elongated holes) that are respectively aligned with the positioning pins 1112 and are reciprocally movable on the fixed metal sheet 13. As the movable metal sheet 14 reciprocates relative to the fixed metal sheet 13 (e.g., by pulling and pushing back), each set of powder inlet holes 14 and each set of powder outlet holes 132 of the fixed metal sheet 13 are either aligned and connected or misaligned and not connected. When aligned and connected, each feeding port 152 of the powder funnel cover 15, each set of powder inlet holes 143 of the movable metal sheet 14, each set of powder outlet holes 132 of the fixed metal sheet 13, and the mold cavity 123 form a powder filling path from top to bottom.

[0045] The plurality of second positioning holes 153 of the powder inlet cover 15 are respectively aligned with the positioning pins 1112 to fix the powder inlet cover 15 on the movable metal sheet 14. In this way, the fixed metal sheet 13, the movable metal sheet 14 and the powder inlet cover 15, which are successively placed on the carrier 12, can be vertically aligned with the carrier 12 at the same reference position.

[0046] The following describes the method and steps for fabricating an integrated powder ring copper column structure using the aforementioned fixture.

[0047] Please continue to refer to this. Figure 3 A flowchart outlining the steps involved in fabricating an integrated powder ring copper column structure. Figures 4 to 8 This is a combination Figure 3 The implementation diagrams for each step are shown below. The method for fabricating an integrated powder ring copper column structure includes the following steps:

[0048] Step A (S1): Place each copper pillar into each cavity of the carrier;

[0049] In this step, such as Figure 4 and Figure 5As shown, each pre-prepared copper pillar 21 is placed into each mold cavity 123. Each copper pillar 21 has an upper end 211, a lower end 212, and an outer surface 213. The lower end 212 of the copper pillar 21 placed in the mold cavity 123 is temporarily fixed to the fixing part 1232 at the bottom 1231 of the mold cavity 123, and the upper end 211 of the copper pillar 21 does not protrude from or is flush with the top surface 121 of the carrier 12. Furthermore, the inner diameter of the fixing part 1232 is larger than the outer diameter of the copper pillar 21, thereby forming a gap 1234 between the inner side of the fixing part 1232 and the outer surface of the lower end 212 of the copper pillar 21. The gap 1234 is located below the mold cavity 123 and above the powder discharge hole 1233 to facilitate the subsequent discharge of scattered powder from the mold cavity 123.

[0050] Step B (S2): Place the movable metal sheet and the powder inlet cover sequentially from bottom to top on the top surface of the carrier.

[0051] In this step, such as Figure 5 and Figure 6 As shown, after the copper pillar 21 is placed into the mold cavity 123, the movable metal sheet 14 is placed on the top surface 121 of the carrier 12, so that its powder inlet 143 connects to each mold cavity 123 of the carrier 12 below, while avoiding the copper pillar 21 inside the mold cavity 123. Then, the powder inlet cover 15 is placed on the upper surface 141 of the movable metal sheet 14 (as shown). Figure 4 ), so that its feeding port 152 is aligned with each group of powder inlet holes 143 of the movable metal sheet 14 before it moves, so that each group of powder inlet holes 143 is within the range below each feeding port 152 (e.g. Figure 6 ).

[0052] Step C (S3): Place the powder in the material placement area of ​​the powder funnel cover, let the powder enter the powder inlet through each feeding port, and fill the mold cavity from the powder inlet, thereby filling the outer surface of the copper pillar with a ring of powder.

[0053] In this step, as shown in Figure 7(a), pre-prepared powder 20 (e.g., copper powder, titanium powder, or other metal or non-metal powder) is placed in the feeding area 151 of the powder inlet cover 15. The powder 20 then enters the powder inlet 143 of the movable metal sheet 14 through each feeding port 152. The powder passing through the powder inlet 143 then fills the mold cavity 123. As the powder 20 continues to fill the mold cavity 123, it gradually fills the outer surface of the copper pillar 21 with annular powder 22. In some embodiments, the powder is fed into the mold cavity 123 by high-pressure gas or vibration, which allows the powder within the mold cavity 123 to be tightly packed and formed, preventing the formed annular powder 22 from becoming loose, thereby improving the yield of the finished product after subsequent sintering.

[0054] Step D(S4): Move the movable metal sheet relative to the carrier to misalign the powder inlet, the feeding port, and the mold cavity, thereby stopping the powder from continuing to fill the mold cavity.

[0055] In this step, as shown in Figure 7(b) and Figure 8 As shown, after the outer surface of the copper pillar 21 is filled with annular powder 22, the movable metal sheet 14 is moved relative to the carrier 12 (e.g., the movable metal sheet 14 is pulled out), causing its powder inlet 143 to move along the direction of the mold cavity 123 that avoids the carrier 12 (e.g., ...). Figure 8 (As indicated by the arrow), thus misaligning and disconnecting with the feeding port 152 above and the mold cavity 123 below (as shown in Figure 7(b)). Furthermore, the upper surface 141 and lower surface 142 of the movable metal sheet 14 respectively seal the feeding port 152 and the mold cavity 123, thereby stopping the powder 20 from continuing to fill the mold cavity 123 (as shown in Figure 7(b)). Moreover, some scattered powder 20 within the mold cavity 123 can be discharged from the mold cavity 123 through the powder discharge hole 1233 via the gap 1234.

[0056] Step E (S5): The carrier is heated to sinter the copper pillar and the annular powder in the mold cavity together, so that the annular powder becomes a sintered ring bonded to the outer surface of the copper pillar, and the two are an integral structure without assembly gaps.

[0057] In this step, as shown in Figures 7(c) and 7(d), the movable metal sheet 14 and the powder vent cap 15 are removed. Then, the carrier 12 and the copper pillar 21 with the annular powder 22 are fed into a heating furnace (e.g., a sintering furnace) for heating treatment, causing the granular powder 20 to bond together. After heating treatment, the annular powder 22 becomes a sintered ring 22, directly bonded to the outer surface 213 of the copper pillar 21. Then, the copper pillar 21 and the sintered ring 22 are removed from the mold cavity 123. Thus, the copper pillar 21 and the sintered ring 22 form a single, seamless structure. Since the sintered ring 22 is formed from powder through heating, it is a capillary structure (or capillary network) with porous structure capable of generating capillary forces.

[0058] Please continue to refer to this. Figure 9 In order to utilize the aforementioned Figures 2A-2C A flowchart illustrating the steps involved in fabricating an integrated powder ring copper column structure using a jig. Figure 10 , Figure 11 , Figures 12(a) to 12(d) This is a combination Figure 9 The implementation diagrams for each step are shown below. Most of the components and steps in this embodiment are the same as in the previous embodiment, and the same components and steps are represented by the same symbols. However, this embodiment differs from the previous embodiment in that:

[0059] Step B (S2a): Place the fixed metal sheet, the movable metal sheet, and the powder inlet cover sequentially from bottom to top on the top surface of the carrier.

[0060] In this step, such as Figure 10 and Figure 11 As shown, after the copper pillar 21 is placed into the mold cavity 123, the fixing metal sheet 13 is placed on the top surface 121 of the carrier 12, so that each set of powder-feeding holes 132 of the fixing metal sheet 13 is directly connected to each mold cavity 123 of the carrier 12 below. The through holes 131 of the fixing metal sheet 13 are aligned with the copper pillar 21 in each mold cavity 123 to position its upper end 211. In this way, the upper end 211 and the lower end 212 of the copper pillar 21 are temporarily fixed by the through holes 131 of the fixing metal sheet 13 and the fixing part 1232 of the bottom of the cavity 1231, respectively, so that it can stand vertically in the mold cavity 123 in a centered position, preventing tilting and reducing the bonding tolerance between the annular powder 22 subsequently filled on the outer surface of the copper pillar 21 and the copper pillar 21, thereby improving the concentricity of the two (i.e., the annular powder 22 and the copper pillar 21 are coaxial and the center point is not offset), and can keep the thickness of the annular powder 22 consistent and prevent uneven thickness problems. The movable metal sheet 14 is placed on the fixed metal sheet 13. Before the movable metal sheet 14 moves, each set of powder inlet holes 143 is aligned and connected to each set of powder drop holes 132, avoiding the copper pillars 21 in the mold cavity 123, so as to prevent the powder to be filled later from falling to the upper end 211 and forming residual powder, thus causing the problem that it cannot be completely combined with the inner side of the heat spreader.

[0061] Step C (S3a): Place the powder in the material placement area of ​​the powder funnel cover, let the powder enter the powder inlet through each feeding port, and fill the mold cavity through the powder drop hole from the powder inlet, thereby filling the outer surface of the copper pillar with a ring-shaped powder.

[0062] In this step, as shown in Figure 12(a), powder 20 enters the powder inlet 143 of the movable metal sheet 14 through each feeding port 152. Then, the powder 20 passing through the powder inlet 143 continues to pass through the powder outlet 132 of the fixed metal sheet 13, and then fills the mold cavity 123 from the powder outlet 132, filling the outer surface of the copper pillar 21 with annular powder 22.

[0063] Step D (S4a): Move the movable metal sheet relative to the fixed metal sheet to misalign the powder inlet, the feeding port, and the powder discharge hole to prevent the powder in the material placement area from falling onto the fixed metal sheet and stop the powder from continuing to fill the mold cavity;

[0064] In this step, as shown in Figure 12(b), after filling the outer surface of the copper pillar 21 with annular powder 22, the movable metal plate 14 is moved relative to the fixed metal plate 13 (e.g., Figure 8This causes the powder inlet 143 to move along the direction of the fixing hole 13 that avoids the fixing metal sheet 13, thereby causing it to be misaligned and disconnected with the feeding port 152 above it and the powder dropping hole 13 below it. Furthermore, the upper surface 141 and the lower surface 142 of the movable metal sheet 14 respectively block the feeding port 152 and the powder dropping hole 132 to prevent the powder 20 in the feeding port 152 of the material placement area 151 from falling onto the fixing metal sheet 13, and thus stop the powder 20 from continuing to fill the mold cavity 123 (as shown in Figure 12(b)).

[0065] Furthermore, continue to refer to Figure 10 , Figure 11 , Figures 12(a) to 12(b) As shown, the fixing metal plate 13 has a thickness t that can be adjusted according to the height of the copper pillar 21, so that the upper end 211 of the copper pillar 21 protruding into the positioning hole 131 does not exceed the thickness t of the fixing metal plate 13. For example, if the copper pillar 21 is taller (i.e., longer axially), the thickness t of the fixing metal plate 13 is thicker; if the copper pillar 21 is shorter (i.e., shorter axially), the thickness t of the fixing metal plate 13 is thinner. In some embodiments, the thickness t can be adjusted according to the height of the copper pillar 21 by using a single fixing metal plate 13 of different thicknesses, or by stacking multiple fixing metal plates 13 of the same or different thicknesses to adjust the total thickness t. And by ensuring that the thickness t of the fixing metal plate 13 is greater than the length of the upper end 211 of the upper surface 121 of the copper pillar 21 protruding from the carrier 12, a reserved gap 135 is formed between the upper end 211 of the copper pillar 21 and the lower surface 142 of the movable metal plate 14 (e.g., ...). Figure 11 (Enlarged schematic diagram). The reserved gap 135 prevents the upper end 211 of the copper pillar 21 from touching the lower surface 142 of the movable metal sheet 14. Therefore, when the movable metal sheet 14 moves, it will not touch the upper end 211 of the copper pillar 21, allowing it to be centrally and stably set upright in the mold cavity 123.

[0066] Step E (S5a): The carrier is heated to sinter the copper pillar and the annular powder in the mold cavity together, so that the annular powder becomes a sintered ring bonded to the outer surface of the copper pillar, so that the two form an integral structure without assembly gaps.

[0067] In this step, as shown in Figures 12(c) and 12(d), the fixed metal sheet 13, the movable metal sheet 14, and the powder inlet cover 15 are removed. Then, the carrier 12 and the copper pillar 21 with the annular powder 22 are fed into a heating furnace (e.g., a sintering furnace) for heating. The annular powder 22 becomes a sintered ring 22 bonded to the outer surface 213 of the copper pillar 21, thus making the two an integral structure without assembly gaps. Alternatively, in other embodiments, the carrier 12 and the base 11 can be fed into the heating furnace together for heating. The material of the base 11 can be selected to be the same as that of the carrier 12 to withstand the sintering temperature.

[0068] The following is an example of the application of this integrated annular copper column structure in a two-phase flow device.

[0069] Please continue to refer to this. Figure 13 and Figure 14 As shown, please refer to the following: Figures 12(a) to 12(d) As shown, this integrated annular copper pillar structure can be applied within a heat spreader 30. The upper end 211 of the copper pillar 21 is flush with or slightly protrudes from the upper end 221 of the sintered ring 22. In this embodiment, it means that the upper end 211 of the copper pillar 21 protrudes from the upper end 221 of the sintered ring 22, forming an upper height difference h1 (as shown in Figure 12(d)). Furthermore, by means of the fixing part depth d of the fixing part 1232, the lower end 212 of the copper pillar 21 slightly protrudes from the lower end 222 of the sintered ring 22, forming a lower height difference h2 (as shown in Figure 12(d)). The upper and lower height differences h1 and h2 between the two ends of the copper pillar 21 and the two ends of the sintered ring 22 can be used to match the thickness of a capillary structure 303 on the inner surface of an upper cover 301 and a lower cover 302 of the heat spreader 30. The upper end 211 and lower end 212 of the copper pillar 21 are connected to the inner surfaces of the upper cover 301 and the lower cover 302, respectively. The upper end 221 and lower end 222 of the sintered ring 22 can contact or connect with the capillary structure 303 on the inner surfaces of the upper cover 301 and the lower cover 302, respectively. The copper pillar 21 serves as a support pillar to help the heat spreader 30 resist external pressure or withstand internal gas pressure. The sintered ring 22 serves as a reflux capillary structure for the vapor-liquid circulation of the working liquid within the heat spreader 30.

[0070] As described above, the integrated ring-shaped copper pillar structure completed using the above-mentioned fixture and steps has a copper pillar 21 and a sintered ring 22 as a single unit without any assembly gaps. This can improve the problem of water accumulation caused by assembly gaps in previous technologies or processes, which would otherwise cause the copper pillar and sintered ring to expand (bulge) and detach from the pillar due to water accumulation and freezing.

[0071] The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent variations and modifications made in accordance with the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A jig for fabricating an integral ring-shaped copper column structure, characterized in that: include: A carrier has a top surface and a bottom surface. The top surface has a plurality of cavities, each cavity having a bottom. The bottom of the cavity is provided with a fixing part for positioning the lower end of a copper pillar. The fixing part is shaped downward from the bottom of the cavity and has a fixing part depth d defined between the bottom side of the fixing part and the bottom of the cavity. A movable metal sheet has an upper surface and a lower surface and a plurality of powder inlet holes. Each set of powder inlet holes penetrates the upper surface and the lower surface. The movable metal sheet is disposed above the carrier and can reciprocate relative to it, so that each set of powder inlet holes and the mold cavity of the carrier are aligned or misaligned due to the reciprocating movement. A powder inlet cover is disposed above the movable metal sheet and has a material feeding area. The material feeding area has a plurality of feeding ports. Each feeding port is aligned or misaligned with each set of powder inlet holes when the movable metal sheet moves back and forth. At least one fixed metal plate is provided between the top surface of the carrier and the lower surface of the movable metal plate. The fixed metal plate has a through hole at each mold cavity. The through hole is used to align the copper pillar in the mold cavity to position its upper end. A set of powder inlet holes is provided on the outside of each through hole to connect to the mold cavity. The movable metal plate can move back and forth relative to the fixed metal plate so that each set of powder inlet holes is aligned or misaligned with each set of powder inlet holes of the fixed metal plate.

2. The fixture as described in claim 1, characterized in that: The carrier is located on a base. The movable metal sheet has a plurality of movable holes, the powder inlet cover has a plurality of first positioning holes, and the base has a settling area and a plurality of positioning pins. The settling area is for placing the carrier, and the plurality of positioning pins are for positioning the plurality of movable holes of the movable metal sheet and the plurality of first positioning holes of the powder inlet cover.

3. The fixture as described in claim 1, characterized in that: The fixed metal plate is provided with a plurality of second positioning holes and is positioned by a plurality of positioning pins.

4. The fixture as described in claim 1, characterized in that: The fixing part is connected to a powder discharge hole, which is located below the fixing part and extends through the bottom surface of the carrier; a protrusion is provided on one edge of the movable metal sheet.

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