A semiconductor device solderability testing machine

Abstract

This invention discloses a semiconductor device solderability testing machine, relating to the field of testing machine technology. It includes a base, a solder chamber mounted on the base, a solder side chamber connected to one side of the solder chamber, and the bottoms of the solder side chamber and the solder side chamber are connected; a flux chamber mounted on the base, a flux side chamber connected to the side of the flux chamber closest to the solder side chamber, and the bottoms of the flux side chamber and the flux side chamber are connected; and a drive mechanism including a mounting plate, an electric telescopic rod mounted on the lower side of the mounting plate, and a U-shaped connecting rod connected to the extended end of the electric telescopic rod. The two ends of the U-shaped connecting rod are respectively movable up and down through the lower walls of the solder side chamber and the flux side chamber, and both ends are connected to piston plates. During testing, the semiconductor device is in a static state, which avoids the phenomenon of liquid being shaken off due to movement of the semiconductor device, and prevents liquid splashing, thus improving the liquid loading effect on the semiconductor device.

Description

Technical Field

[0001] This invention relates to the field of testing equipment technology, and more specifically to a semiconductor device solderability testing machine. Background Technology

[0002] Welding is a process of joining metals. To achieve good welding results, the metal materials being welded must be solderable. With the full-scale promotion of lead-free soldering technology in the company, higher requirements have been placed on the solderability of components.

[0003] Currently, common methods for testing the solderability of electronic components include wetting force testing and visual inspection. Wetting force testing, due to its stringent requirements for testing equipment and long testing time, is not suitable for large-scale incoming component inspection. Currently, component inspection primarily uses visual inspection methods; however, the lack of clear specifications and corresponding tooling leads to inconsistent angles and immersion depths when components are immersed in the solder bath, resulting in large errors and low detection rates in solderability testing.

[0004] To address the aforementioned issues, patent application number 202210795735.2 discloses a solderability testing machine mechanism and method. This method incorporates a liquid level sensor and a soldering height sensor on the testing platform. The liquid level sensor measures the liquid level in the solder bath, while the soldering height sensor measures the height of the position to be soldered on the workpiece. A fixed clamp can move along a movable module. Once the immersion depth is determined, the controller uses the liquid level and the height of the position to be soldered to determine the descent height of the workpiece driven by the fixed clamp. This allows for precise control of the immersion depth, ensuring standardized solderability testing and improving the accuracy of the solderability test.

[0005] However, when the aforementioned mechanism immerses the semiconductor device in the liquid, it uses a clamp to move the semiconductor device up and down. Therefore, when the semiconductor device leaves the liquid surface, the clamp will cause the semiconductor device to move, resulting in a certain degree of shaking. This will cause a small amount of liquid to fall onto the liquid surface, causing splashing. This may result in uneven liquid loading onto the semiconductor surface, poor loading effect, and affect solderability testing. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor device solderability testing machine, solving the following technical problems:

[0007] How to improve the loading effect of flux and solder on semiconductor devices.

[0008] The objective of this invention can be achieved through the following technical solutions:

[0009] A semiconductor device solderability testing machine, comprising a base, characterized in that it further comprises:

[0010] A molten tin chamber is mounted on a base, and a molten tin side chamber is connected to one side of the molten tin chamber. The bottom of the molten tin chamber and the molten tin side chamber are in communication.

[0011] A flux chamber is provided on a base. The side of the flux chamber closest to the solder liquid side chamber is connected to a flux side chamber. The bottom of the flux chamber is connected to the bottom of the flux side chamber.

[0012] A driving mechanism includes a mounting plate located between the solder liquid side chamber and the flux side chamber; an electric telescopic rod is mounted on the lower side of the mounting plate, and a U-shaped connecting rod is connected to the extended end of the electric telescopic rod. The two ends of the U-shaped connecting rod are respectively movable up and down through the lower walls of the solder liquid side chamber and the flux side chamber, and both ends are connected to piston plates.

[0013] The film removal mechanism includes a support plate, which is disposed on the upper end of the molten tin chamber away from the molten tin side chamber, and a stirring plate is rotatably connected to the lower side of the support plate.

[0014] The transfer mechanism includes a linear motion mechanism connected to its upper end, and a lifting mechanism is connected to the movable end of the lifting mechanism. The movable end of the lifting mechanism is connected to a second micro motor, and the movable end of the second micro motor is connected to an electric gripper.

[0015] A liquid level sensor is mounted on the lifting mechanism;

[0016] A control system, which is electrically connected to all electronic components.

[0017] In a further embodiment: a heating mechanism is provided outside the molten tin chamber, the heating mechanism includes a housing, a heating plate is provided inside the housing, and the bottom of the molten tin chamber is disposed on the heating plate.

[0018] In a further embodiment: the stirring plate is driven by a first micro motor, which is mounted on the upper side of the support plate, and the output end of the first micro motor passes through the support plate and its lower end is connected to the stirring plate.

[0019] In a further embodiment: the length of the stirring plate is 0.5 times the inner diameter of the molten tin chamber.

[0020] In a further embodiment: a liquid level sensing rod is installed inside the wall of the molten tin chamber, the height of the molten tin inside the molten tin chamber does not exceed the height of the liquid level sensing rod, and the stirring plate is located above the liquid level sensing rod.

[0021] In a further embodiment: a mounting frame is installed on the side of the base, the mounting frame including two horizontal plates of different lengths and a vertical plate connected to one end of the two horizontal plates, and a collection groove is installed on the lower horizontal plate.

[0022] In a further embodiment: the control system is mounted on the upper side of the horizontal plate located above the mounting bracket.

[0023] The beneficial effects of this invention are:

[0024] When performing solderability tests on semiconductor devices, the testing machine of this invention applies flux and molten solder upwards to immerse the semiconductor device during both the flux and molten solder application processes. This allows the flux and molten solder to overflow the semiconductor device, thus wetting it. After application, the flux and molten solder are removed from the semiconductor device by lowering their surfaces. Throughout the process, the semiconductor device remains stationary, preventing liquid from being shaken off due to movement and avoiding splashing. This results in better application of the flux and molten solder to the semiconductor device. Attached Figure Description

[0025] The invention will now be further described with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram of the structure of one embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the internal structure of one embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the drive mechanism in one embodiment of the present invention.

[0029] The labels in the diagram represent: 100, base; 101, groove; 102, mounting bracket; 103, collection tank; 200, solder liquid chamber; 201, solder liquid side chamber; 300, flux chamber; 301, flux liquid side chamber; 400, drive mechanism; 401, mounting plate; 402, electric telescopic rod; 403, U-shaped connecting rod; 404, piston plate; 500, film removal mechanism; 501, support plate; 502, stirring plate; 503, first micro motor; 600, heating mechanism; 601, outer shell; 602, heating plate; 700, transfer mechanism; 701, lifting mechanism; 702, second micro motor; 703, electric gripper; 800, liquid level sensor; 900, control system. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see Figure 1-3 As shown, this invention is a semiconductor device solderability testing machine, including a base 100. The bottom of the base 100 is provided with an anti-slip pad to enhance its anti-slip properties and make it more stable. A solder bath 200 is provided on the left end of the upper surface of the base 100. A solder side chamber 201 is connected to the right side of the solder bath 200, and the connection surface between the solder bath 200 and the solder side chamber 201 is the right side wall of the solder bath 200. A through hole is provided at the bottom of the base 100 to connect the solder liquid chamber 200 with the solder liquid side chamber 201; a flux chamber 300 is fixedly installed at the right end of the upper surface of the base 100, and the flux chamber 300 is connected to the left side of the flux chamber 300 with the flux liquid side chamber 301. A through hole is provided at the bottom end of the left side wall of the flux chamber 300, which is the connecting surface between the flux chamber 300 and the flux liquid side chamber 301, to connect the flux chamber 300 and the flux liquid side chamber 301.

[0032] The upper surface of the base 100 is also provided with a downward-facing groove 101. A drive mechanism 400 is arranged directly above the groove 101. The drive mechanism 400 includes a mounting plate 401. The two ends of the mounting plate 401 are respectively fixedly connected to the upper ends of the sides of the solder liquid side chamber 201 and the flux side chamber 301 that are close to each other. An electric telescopic rod 402 is fixedly installed at the center of the lower side of the mounting plate 401. The extended end of the electric telescopic rod 402, i.e., the lower end, is fixedly connected to... A U-shaped connecting rod 403 is provided, and a mounting base is fixedly sleeved at the center of the U-shaped connecting rod 403. The lower end of the electric telescopic rod 402 is fixedly connected to the mounting base. The two ends of the U-shaped connecting rod 403 can be movably inserted into the lower walls of the solder liquid side chamber 201 and the flux side chamber 301, respectively, and each end is connected to a piston plate 404. The two piston plates 404 can be moved up and down to movably fit against the inner walls of the solder liquid side chamber 201 and the flux side chamber 301.

[0033] A film removal mechanism 500 is provided above the interior of the molten tin chamber 200. The film removal mechanism 500 includes a support plate 501. The mounting plate 401 is fixedly installed on the upper left side of the molten tin chamber 200 and extends to the right for a distance. A first micro motor 503 is rotatably connected to the lower side of the support plate 501.

[0034] A transfer mechanism 700 is provided above the solder bath 200 and flux bath 300. A linear movement mechanism is connected to the upper end of the transfer mechanism 700. The transfer mechanism 700 includes a lifting mechanism 701. A liquid level sensor 800 is installed on the side wall of the lifting mechanism 701 to detect the liquid level position. A second micro motor 702 is connected to the movable end of the lifting mechanism 701. An electric gripper 703 is connected to the movable end of the second micro motor 702. The second micro motor 702 can drive the control system 900 when it is started. The control system 900 is electrically connected to all electronic components. A mounting bracket 102 is installed on the side of the base 100. The mounting bracket 102 includes two horizontal plates of different lengths and a vertical plate connected to one end of the two horizontal plates. A collection groove 103 is installed on the lower horizontal plate. The control system 900 is installed on the upper side of the upper horizontal plate of the mounting bracket 102.

[0035] Specifically, when testing the solderability of semiconductor devices, the equipment is first calibrated, with the transfer mechanism 700 positioned at the far right of the linear motion mechanism. The semiconductor device is gripped by the electric gripper 703, and then the linear motion mechanism is activated, moving the transfer mechanism 700 to the left until it is directly above the flux chamber 300. At this point, the lifting mechanism 701 is activated, causing the electric gripper 703 to move downwards until the liquid level sensor 800 detects the liquid level in the flux chamber 300. The liquid level sensor 800 transmits the sensing signal to the control system 900, which then commands the lifting mechanism 701 to stop and the electric telescopic rod 402 to stop moving. The start-up mechanism drives the U-shaped connecting rod 403 to move downwards, which in turn drives the two piston plates 404 to move downwards respectively. This causes the liquid levels inside the solder liquid side chamber 201 and the flux side chamber 301 to decrease by a certain distance, which in turn causes the liquid levels inside the solder liquid chamber 200 and the flux chamber 300 to rise by a certain distance. At this time, the flux inside the flux chamber 300 flows upwards over the semiconductor device and stays for a period of time, allowing the semiconductor device to fully contact the flux. At the same time, the solder liquid inside the solder liquid chamber 200 flows upwards over the stirring plate 502. The stirring plate 502 rotates, thereby stirring the upper layer of the solder liquid, which can prevent the upper layer of the solder liquid from forming a film.

[0036] Subsequently, the electric telescopic rod 402 drives the piston plate 404 to reset, and the liquid levels inside the solder chamber 200 and flux chamber 300 are also reset. At the same time, the lifting mechanism 701 drives the electric gripper 703 and the semiconductor device to reset upward. The linear movement mechanism continues to drive the transfer mechanism 700 to continue to move to the left, so that the electric gripper 703 moves to directly above the solder chamber 200. At this time, the lifting mechanism 701 drives the second micro motor 702 to move downward until the liquid level sensor 800 senses the liquid level of the solder chamber 200. The liquid level sensor 800 transmits the sensing information to the control system 900. The control system 900 commands the electric telescopic rod 402 to move downward, thereby causing the liquid level of the flux chamber 300 to rise and overflow the semiconductor device by a certain distance, thereby tinning the semiconductor device. After being processed by the film removal mechanism 500 in the previous process, there is no film formation on the upper layer of the flux chamber 300.

[0037] It should be noted that during the above process, when the liquid level sensor 800 senses the liquid level position inside the solder liquid chamber 200 and the flux chamber 300, it can be set by the control system 900 to make the sensing distance of the liquid level the same twice, and at the same time make the movement distance of the electric telescopic rod 402 the same twice. That is, the solder liquid chamber 200 and the flux chamber 300 rise the same distance twice, thereby ensuring that the flux and solder liquid cover the semiconductor device by the same distance. This coverage distance can be determined by setting the sensing distance of the control system 900 and the driving distance of the electric telescopic rod 402.

[0038] After the tinning is completed, the drive mechanism 400 resets, the liquid level in the flux chamber 300 returns to its original position, the lifting mechanism 701 drives the electric gripper 703 to move upwards to its original position, and then the linear movement mechanism drives the transfer mechanism 700 to move to the left a certain distance. The second micro motor 702 starts and drives the electric gripper 703 to rotate, allowing the staff to fully observe the semiconductor device, thereby realizing the solderability test of the semiconductor device. After the test is completed, the electric gripper 703 lowers the semiconductor device into the collection tank 103.

[0039] Furthermore, a heating mechanism 600 is provided outside the molten tin chamber 200. The heating mechanism 600 includes a housing 601, and a heating plate 602 is provided inside the housing 601. The bottom of the molten tin chamber 200 is disposed on the heating plate 602.

[0040] The heating plate 602 can heat the molten solder inside the molten solder chamber 200, thereby ensuring that the molten solder is in a liquid state and preventing the molten solder from solidifying and affecting the soldering process.

[0041] Furthermore, the stirring plate 502 is driven by the first micro motor 503, which is mounted on the upper side of the support plate 501. The output end of the first micro motor 503 passes through the support plate 501 and its lower end is connected to the stirring plate 502. The length of the stirring plate 502 is 0.5 times the inner diameter of the molten tin chamber 200.

[0042] When the first micro motor 503 is started, it can be rotated to stir the upper layer of the molten tin. Since the length of the stirring plate 502 is only 0.5 times the inner diameter of the molten tin chamber 200, when tinning semiconductor devices, the stirring plate 502 can be rotated to the left of the upper end of the molten tin chamber 200, so it will not hinder the tinning.

[0043] Furthermore, a liquid level sensing rod is provided inside the wall of the molten tin chamber 200. The height of the molten tin inside the molten tin chamber 200 does not exceed the height of the liquid level sensing rod, and the stirring plate 502 is located above the liquid level sensing rod, which can avoid the stirring plate 502 affecting the molten tin under normal conditions.

[0044] Working principle of the invention:

[0045] When testing the solderability of semiconductor devices, the equipment is first calibrated, with the transfer mechanism 700 positioned to the far right of the linear motion mechanism. The semiconductor device is gripped by the electric gripper 703, and then the linear motion mechanism is activated, moving the transfer mechanism 700 to the left until it is directly above the flux chamber 300. At this point, the lifting mechanism 701 is activated, causing the electric gripper 703 to move downwards until the liquid level sensor 800 detects the liquid level in the flux chamber 300. The liquid level sensor 800 transmits the sensing signal to the control system 900. The control system 900 commands the lifting mechanism 701 to stop and commands the electric telescopic rod 402 to activate, causing the U-shaped connecting rod 403 to move downwards. Rod 403 drives the two piston plates 404 to move downwards, thereby lowering the liquid levels in the solder molten side chamber 201 and the flux side chamber 301 by a certain distance. This, in turn, causes the liquid levels in the solder molten chamber 200 and the flux side chamber 300 to rise by a certain distance. At this time, the flux in the flux side chamber 300 flows upwards over the semiconductor device and stays for a period of time, allowing the semiconductor device to fully contact the flux. Simultaneously, the solder molten in the solder molten chamber 200 flows upwards over the stirring plate 502. The stirring plate 502 then rotates, stirring the upper layer of the solder molten, which can prevent film formation on the upper layer of the solder molten. Subsequently, the electric telescopic rod 402 drives the piston plates 404 to return to their original positions, and the liquid levels in the solder molten chamber 200 and the flux side chamber 301 then rise. The liquid level inside the flux chamber 300 is reset. Simultaneously, the lifting mechanism 701 drives the electric gripper 703 and the semiconductor device to reset upwards. The linear movement mechanism continues to drive the transfer mechanism 700 to move to the left, causing the electric gripper 703 to move directly above the solder chamber 200. At this point, the lifting mechanism 701 drives the second micro motor 702 to move downwards until the liquid level sensor 800 senses the liquid level in the solder chamber 200. The liquid level sensor 800 transmits the sensing information to the control system 900. The control system 900 commands the electric telescopic rod 402 to move downwards, thereby causing the liquid level in the flux chamber 300 to rise and overflow the semiconductor device a certain distance, thus tinning and fluxing the semiconductor device. After the film removal mechanism 500 processes the liquid chamber 300 in the preceding process, there is no film formation on the upper layer. In the above process, when the liquid level sensor 800 senses the liquid level position inside the solder liquid chamber 200 and the flux liquid chamber 300, it can be set by the control system 900 to make the sensing distance of the liquid level the same in two steps, and at the same time make the movement distance of the electric telescopic rod 402 the same in two steps. That is, the solder liquid chamber 200 and the flux liquid chamber 300 rise the same distance in two steps. This ensures that the flux and solder liquid cover the semiconductor device by the same distance. This coverage distance can be determined by setting the sensing distance of the control system 900 and the driving distance of the electric telescopic rod 402.After tinning is completed, the drive mechanism 400 resets, the flux level in the flux chamber 300 returns to its original position, and the lifting mechanism 701 drives the electric gripper 703 upward to its reset position. Subsequently, the linear motion mechanism drives the transfer mechanism 700 to move a short distance to the left, and the second micro motor 702 starts, causing the electric gripper 703 to rotate. This allows the operator to comprehensively observe the semiconductor device, thereby achieving solderability testing of the semiconductor device.

[0046] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0047] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0048] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A semiconductor device solderability testing machine, comprising a base (100), characterized in that, Also includes: A molten tin chamber (200) is disposed on a base (100), and a molten tin side chamber (201) is connected to one side of the molten tin chamber (200), and the bottom of the molten tin chamber (200) is connected to the molten tin side chamber (201); A flux chamber (300) is provided on a base (100). The side of the flux chamber (300) near the solder side chamber (201) is connected to the flux side chamber (301). The bottom of the flux chamber (300) is connected to the bottom of the flux side chamber (301). A driving mechanism (400) includes a mounting plate (401) located between the solder melt side chamber (201) and the flux side chamber (301). An electric telescopic rod (402) is mounted on the lower side of the mounting plate (401). A U-shaped connecting rod (403) is connected to the extended end of the electric telescopic rod (402). The two ends of the U-shaped connecting rod (403) are respectively movably inserted into the lower walls of the solder melt side chamber (201) and the flux side chamber (301), and both ends are connected to piston plates (404). The two piston plates (404) are respectively movably moved up and down to fit against the inner walls of the solder melt side chamber (201) and the flux side chamber (301). The film removal mechanism (500) includes a support plate (501), which is disposed on the upper end of the molten tin chamber (200) away from the molten tin side chamber (201), and a stirring plate (502) is rotatably connected to the lower side of the support plate (501). The transfer mechanism (700) is connected to a linear motion mechanism at its upper end. The transfer mechanism (700) includes a lifting mechanism (701). The movable end of the lifting mechanism (701) is connected to a second micro motor (702). The movable end of the second micro motor (702) is connected to an electric gripper (703). A liquid level sensor (800) is mounted on the lifting mechanism (701); A control system (900) is electrically connected to all electronic components.

2. The semiconductor device solderability testing machine according to claim 1, characterized in that, A heating mechanism (600) is provided outside the molten tin chamber (200). The heating mechanism (600) includes a housing (601) and a heating plate (602) is provided inside the housing (601). The bottom of the molten tin chamber (200) is located on the heating plate (602).

3. The semiconductor device solderability testing machine according to claim 1, characterized in that, The stirring plate (502) is driven by a first micro motor (503), which is mounted on the upper side of the support plate (501). The output end of the first micro motor (503) passes through the support plate (501) and its lower end is connected to the stirring plate (502).

4. The semiconductor device solderability testing machine according to claim 3, characterized in that, The length of the stirring plate (502) is 0.5 times the inner diameter of the molten tin chamber (200).

5. The semiconductor device solderability testing machine according to claim 4, characterized in that, The tin liquid chamber (200) is equipped with a liquid level sensing rod inside the chamber wall. The height of the tin liquid inside the tin liquid chamber (200) does not exceed the height of the liquid level sensing rod, and the stirring plate (502) is located above the liquid level sensing rod.

6. The semiconductor device solderability testing machine according to claim 1, characterized in that, The base (100) is equipped with a mounting bracket (102) on its side. The mounting bracket (102) includes two horizontal plates of different lengths and a vertical plate connected to one end of the two horizontal plates. A collection groove (103) is installed on the lower horizontal plate.

7. The semiconductor device solderability testing machine according to claim 6, characterized in that, The control system (900) is mounted on the upper side of the horizontal plate above the mounting bracket (102).

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