A temperature control device and method for testing

Through the coordinated work of the thermostat and high thermal conductivity heating module and the temperature sensor, the temperature uneven problem caused by the heat of the measured module itself is solved, precise temperature control is achieved and frost and condensation is avoided, and the accuracy of the test results is improved.

CN116880603BActive Publication Date: 2025-07-08HUBEI CHANGJIANG WANRUN SEMICON TECH CO LTD
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Patent Information

Application Number
CN202310860745.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-07-13
Publication Date
2025-07-08
Estimated Expiration
2043-07-13

AI Technical Summary

Technical Problem

In the prior art In temperature testing, local temperature is uneven due to the heat generated by the module under test itself, which affects the accuracy of the test results, and frost and dew condensation are prone to occur during cooling.

Method used

The thermostat is used to provide the basic temperature, and the heating module with high thermal conductivity works in concert with the temperature sensor. The heating module is in contact with the module under test to dissipate heat or heat, achieving accurate temperature control.

Benefits of technology

The precise control of the temperature of the module under test is achieved, the accuracy of the test results is improved, and the phenomenon of frost and dew condensation is avoided.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a test temperature control device and method. The device includes: an incubator for providing a base temperature, where the base temperature is lower than the target temperature; a module under test placed in the incubator and generating heat by itself; a heating module in contact with the module under test and not working initially; a temperature sensor for detecting the temperature of the module under test. When the temperature of the module under test is higher than the target temperature, the incubator reduces the base temperature, the heating module does not work and acts as a radiator due to being in contact with the module under test. When the temperature of the module under test is lower than the target temperature, the heating module starts to work to heat the module under test until the temperature of the module under test reaches the target temperature and stops heating after the temperature of the module under test reaches the target temperature. When the temperature of the module under test is lower than the target temperature by a certain margin, the heating module continues to work to heat the module under test until the temperature of the module under test reaches the target temperature, and this process is repeated continuously. The temperature control of the present invention is more accurate.
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Description

Technical Field

[0001] The present invention belongs to the technical field of test temperature control, and particularly relates to a test temperature control device and method. Background Art

[0002] Testing includes temperature testing, such as temperature cycle testing, performance or function testing at different temperatures. In temperature-related tests, controlling the temperature around the module under test (chip or module) is a key technology. In the prior art, generally, the module under test is placed in an incubator, and the air circulation is used to maintain the temperature consistency in each space of the incubator; there is also a method of directly heating or cooling the test socket of the module under test. However, both have disadvantages. Using air as the heat conduction medium in the incubator has poor heat conduction efficiency, and there is a situation of too large local temperature difference. Using the test socket for heating is a relatively good method, but there is a situation of frosting and dew condensation during cooling.

[0003] During the test process related to the temperature of the module under test, it is necessary to accurately control the temperature around the module under test. Since the module under test itself will also generate heat, sometimes the heat is even very high. If it is not dissipated in time, the local temperature of the module under test will be too high, resulting in inaccurate test results. Summary of the Invention

[0004] The purpose of the present invention is to provide a test temperature control device and method to solve the problem of inaccurate test results caused by the heat generated by the module under test itself.

[0005] The technical solution of the present invention is as follows:

[0006] A test temperature control device, the device includes:

[0007] An incubator for providing a basic temperature, the basic temperature being lower than the target temperature;

[0008] A module under test placed in the incubator and generating heat by itself;

[0009] A heating module in contact with the module under test, and the heating module does not work at the beginning;

[0010] A temperature sensor for detecting the temperature of the module under test; when the temperature of the module under test is higher than the target temperature, the incubator reduces the basic temperature, the heating module does not work and acts as a radiator due to being in contact with the module under test; when the temperature of the module under test is lower than the target temperature, the heating module starts to work to heat the module under test until the temperature of the module under test reaches the target temperature and then stops heating. When the temperature of the module under test is lower than the target temperature by a certain amplitude, the heating module continues to work to heat the module under test until the temperature of the module under test reaches the target temperature, and this process is repeated continuously.

[0011] Further, both the heating module and the temperature sensor are placed on the module to be measured.

[0012] Further, the heating module and / or the temperature sensor is at least one.

[0013] Further, the material of the heating module has a higher thermal conductivity than air, and is preferably metal.

[0014] Further, when the temperature of the module to be measured is exactly equal to the target temperature, the incubator maintains the base temperature and the heating module does not work.

[0015] Further, before the test, the air in the chamber is dehumidified first.

[0016] A test temperature control method implemented by using the test temperature control device according to any one of the above, comprising the following steps:

[0017] Place the module to be measured and the heating module in the incubator and make them in contact with each other;

[0018] The incubator provides a base temperature, the module to be measured works and generates heat, and the heating module does not work;

[0019] After stabilization, use the temperature sensor to detect the temperature of the module to be measured;

[0020] When the temperature of the module to be measured is higher than the target temperature, the incubator reduces the base temperature, the heating module does not work and acts as a radiator due to its contact with the module to be measured; when the temperature of the module to be measured is lower than the target temperature, the heating module starts to work to heat the module to be measured until the temperature of the module to be measured reaches the target temperature and stops heating after the temperature of the module to be measured reaches the target temperature. When the temperature of the module to be measured is lower than the target temperature by a certain margin, the heating module continues to work to heat the module to be measured until the temperature of the module to be measured reaches the target temperature, and this process is repeated continuously.

[0021] Further, when the temperature of the module to be measured is exactly equal to the target temperature, the incubator maintains the base temperature and the heating module does not work.

[0022] Further, before the test, the air in the chamber is dehumidified first.

[0023] Further, the heating module stops heating after the temperature of the module to be measured reaches the target temperature by a certain margin.

[0024] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0025] The present invention uses a method of coarse adjustment plus fine adjustment to achieve the goal of precise temperature control: using the incubator to provide the base temperature as the temperature coarse adjustment, and using the heating module and the temperature module to work together as the temperature fine adjustment.

[0026] There are three heat sources in the device of the present invention, namely the incubator, the heating module, and the module under test. In the prior art, the heat source of the module under test is often not taken into account, or only air is used as the heat conduction medium, resulting in too large a temperature difference due to the self-heating of the module under test, which affects the accuracy of the test results. The present invention uses metal as the heat conduction medium, which has a higher thermal conductivity than air and enlarges the heat dissipation area, with high heat dissipation efficiency and more precise temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram of the test temperature control device of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] There are two types of prior art: one is the high and low temperature incubator solution, which uses air as the heat conduction medium, with poor heat dissipation efficiency and large local temperature differences; the other is the method of directly heating the top of the module under test, which has a good effect in high temperature control and may cause frosting or condensation in low temperature control.

[0030] The present invention provides a test temperature control device, which includes: an incubator, a module under test, a heating module, and a temperature sensor.

[0031] Among them, the incubator is used to provide a basic temperature, and the basic temperature needs to be lower than the target temperature. The basic temperature can be determined comprehensively based on the target temperature and the heat generation capacity of the module under test. The stronger the heat generation capacity of the module under test, the greater the difference between the basic temperature and the target temperature. It is also possible to directly subtract a fixed value from the target temperature to obtain the basic temperature.

[0032] The module under test is placed in the incubator and will generate heat by itself. After the module under test is placed in the incubator, it can start working directly so as to tend to be stable before subsequent temperature control.

[0033] The heating module is in contact with the module under test, and the heating module does not work at the beginning. Both the heating module and the temperature sensor can be placed on the module under test. The heating module and / or the temperature sensor are at least one, and can cover the module under test. When the temperature of the module under test is much lower than the target temperature, multiple heating modules can work together. The values sensed by multiple temperature sensors can be averaged to be used as the temperature of the module under test.

[0034] The material thermal conductivity of the heating module is higher than that of air and is preferably a metal, which can improve the heat conduction efficiency. When the heating module is not working, since it is in contact with the module under test, it acts as a radiator. In addition, the area of the heating module in contact with air is larger than the area in contact with the module under test, which is equivalent to expanding the heat dissipation area of the module under test.

[0035] A temperature sensor for detecting the temperature of the module under test; when the temperature of the module under test is higher than the target temperature, the temperature chamber reduces the base temperature, the heating module does not work and acts as a radiator due to its contact with the module under test; when the temperature of the module under test is exactly equal to the target temperature, the temperature chamber maintains the base temperature and the heating module does not work; when the temperature of the module under test is lower than the target temperature, the heating module starts to work to heat the module under test until the temperature of the module under test reaches the target temperature, and stops heating after the temperature of the module under test reaches the target temperature. When the temperature of the module under test is lower than the target temperature by a certain margin, the heating module continues to work to heat the module under test until the temperature of the module under test reaches the target temperature, and this process repeats continuously.

[0036] Furthermore, before the test, the air inside the chamber is dehumidified to prevent frosting or dew formation.

[0037] A test temperature control method implemented using the test temperature control device according to any one of the above, including the following steps:

[0038] Place the module under test and the heating module inside the temperature chamber and make them in contact.

[0039] The temperature chamber provides a base temperature, the module under test works and generates heat, and the heating module does not work.

[0040] After stabilization, use the temperature sensor to detect the temperature of the module under test.

[0041] When the temperature of the module under test is higher than the target temperature, the temperature chamber reduces the base temperature, the heating module does not work and acts as a radiator due to its contact with the module under test; when the temperature of the module under test is lower than the target temperature, the heating module starts to work to heat the module under test until the temperature of the module under test reaches the target temperature, and stops heating after the temperature of the module under test reaches the target temperature. When the temperature of the module under test is lower than the target temperature by a certain margin, the heating module continues to work to heat the module under test until the temperature of the module under test reaches the target temperature, and this process repeats continuously.

[0042] Furthermore, when the temperature of the module under test is exactly equal to the target temperature, the temperature chamber maintains the base temperature and the heating module does not work.

[0043] Furthermore, before the test, the air inside the chamber is dehumidified to prevent frosting or dew formation.

[0044] Furthermore, the heating module stops heating after the temperature of the module under test reaches a certain range above the target temperature, i.e., the temperature of the module under test is near the target temperature.

[0045] Specifically, as Figure 1 shown, the outer frame is a temperature chamber, the bottom one is the module under test, the square marked as R is the heating module, and the square marked as M is the temperature sensor. The heating module can heat, and secondly, if the temperature of the module under test is too high, it acts as a radiator and can dissipate heat. This is because the material of the heating module has a higher thermal conductivity than air, such as metal. The heat conduction system of metal is much higher than that of air (more than ten thousand times), and the heat is finally dissipated into the air. When the heating stops, it acts as a radiator (increasing the contact area between the module under test and the air). Since the ambient base temperature is lower than the target temperature, the heat is finally dissipated.

[0046] Among them, the external high and low temperature chamber is used to provide the base temperature for the operation of the module under test and is used for rough temperature adjustment.

[0047] The heating module (the square marked as R in the figure) is used for heating and heat dissipation.

[0048] The temperature sensor (the square marked as M in the figure) is used to collect temperature information.

[0049] The temperature control module is used for the coordinated control of the heating module and the temperature sensor. Simply put, it heats when the temperature is lower than the target temperature and dissipates heat when it is higher than the target temperature, and precisely controls the temperature within a certain range.

[0050] The temperature control method is as follows:

[0051] When high temperature is required, such as 60 degrees Celsius, the temperature chamber heats the base temperature to 55 degrees Celsius, and the remaining 5 degrees Celsius is achieved by the coordinated work of the heating module and the temperature monitoring module. When the heat generated by the heat source of the module under test itself is large and the monitored temperature exceeds 60 degrees, the base temperature of the temperature chamber is lowered; otherwise, the heating module is used for heating. When it is close to the target temperature, the heating stops, and when the temperature is lower than the target temperature by a certain range, heating continues. This method can be used to control the temperature above room temperature.

[0052] When low temperature is required, such as -40 degrees Celsius, first the temperature in the temperature chamber is lowered to about -42 degrees, and then the heating module and the temperature monitoring module work together to control the surface temperature of the module under test at -40 degrees Celsius.

[0053] When the temperature is near 0 degrees to near room temperature, due to the presence of water vapor in the space, there may be frosting or dew condensation. At this time, the heating and cooling of the temperature chamber require a special process, such as first dehumidifying, then lowering to the target temperature, and then the heating module and the temperature monitoring module work together to control the temperature.

[0054] The present invention can control all heat sources within the device and increase the heat conduction efficiency. At the same time, by adopting the method of coarse temperature adjustment plus fine adjustment, the temperature of the module to be measured can be accurately controlled.

[0055] It should be noted that the sequence of the above steps in the embodiments does not mean the sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0056] It should be pointed out that according to the needs of implementation, each step / component described in the present application can be split into more steps / components, or two or more steps / components or partial operations of steps / components can be combined into new steps / components to achieve the purpose of the present invention.

[0057] Those skilled in the art can easily understand that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A test temperature control device, characterized in that, The device includes: An incubator for providing a base temperature, which is lower than the target temperature; A module under test placed inside the incubator and generating heat by itself; A heating module in contact with the module under test, and the heating module does not work initially; A temperature sensor for detecting the temperature of the module under test after the heat generated by the module under test stabilizes; when the temperature of the module under test is higher than the target temperature, the incubator reduces the base temperature, the heating module does not work and acts as a radiator due to its contact with the module under test; when the temperature of the module under test is lower than the target temperature, the heating module starts to work to heat the module under test until the temperature of the module under test reaches the target temperature, and stops heating after the temperature of the module under test reaches the target temperature. When the temperature of the module under test is lower than the target temperature by a certain margin, the heating module continues to work to heat the module under test until the temperature of the module under test reaches the target temperature, and this process repeats continuously.

2. The test temperature control device according to claim 1, wherein Both the heating module and the temperature sensor are placed on the module under test.

3. The test temperature control device according to claim 1, characterized in that, The heating module and / or the temperature sensor is at least one.

4. The test temperature control device according to claim 1, wherein The heating module is made of a metal material with a thermal conductivity higher than that of air.

5. The test temperature control device according to claim 1, characterized in that, When the temperature of the module under test is exactly equal to the target temperature, the incubator maintains the base temperature and the heating module does not work.

6. The test temperature control device according to claim 1, characterized in that, Before the test, the air inside the chamber is dehumidified first.

7. A test temperature control method implemented by using the test temperature control device according to any one of claims 1 to 6, characterized in that, It includes the following steps: Place the module under test and the heating module inside the incubator and make them in contact; The incubator provides the base temperature, the module under test works and generates heat, and the heating module does not work; After stabilization, use the temperature sensor to detect the temperature of the module under test; When the temperature of the module under test is higher than the target temperature, the incubator reduces the base temperature, the heating module does not work and acts as a radiator due to its contact with the module under test; when the temperature of the module under test is lower than the target temperature, the heating module starts to work to heat the module under test until the temperature of the module under test reaches the target temperature, and stops heating after the temperature of the module under test reaches the target temperature. When the temperature of the module under test is lower than the target temperature by a certain margin, the heating module continues to work to heat the module under test until the temperature of the module under test reaches the target temperature, and this process repeats continuously.

8. The test temperature control method according to claim 7, characterized in that When the temperature of the module under test is exactly equal to the target temperature, the incubator maintains the base temperature and the heating module does not work.

9. The test temperature control method according to claim 7, characterized in that, Before the test, the air inside the chamber is dehumidified first.

10. The test temperature control method according to claim 7, characterized in that, The heating module stops heating after the temperature of the module under test reaches the target temperature by a certain margin.

Citation Information

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