An automatic preparation and uniform application device for polishing slurry in chemical mechanical polishing.

Abstract

This invention discloses an automatic preparation and uniform application device for polishing slurry in chemical mechanical polishing (CMP). It belongs to the field of polishing slurry supply technology for semiconductor processing; it includes a base, locking valve, pneumatic strut, support plate, support frame, ring force sensor, material cylinder, material cylinder cover, booster pump, touch panel, bearing cover, large gear, pressure rod, polishing head, polishing head lower plate, flow control plate, small gear, motor, solenoid valve, stirring cylinder, stirring cylinder cover, spring, large key, small key, sealing ring, moving ring seat, pressure spring, pressure ring, rotating ring, stationary ring, bearing seat, ball bearing, stationary pipe, oil chamber cover, stirrer, and gaskets, etc. This device can solve the problems of polishing slurry supply in CMP processes, such as polishing slurry preparation, stirring, conveying, and precise application, thereby simplifying manual operation procedures and improving work efficiency.

Description

Technical Field

[0001] This invention belongs to the field of polishing slurry supply technology for semiconductor processing, and relates to an automatic preparation and uniform application device for wafer polishing slurry; specifically, it relates to an automatic preparation and uniform application device for polishing slurry used in chemical mechanical polishing. Background Technology

[0002] In China, the technology and processing methods for preparing synthetic quartz glass substrates for wafers and related semiconductor materials such as gallium nitride and silicon wafers are relatively backward compared to those of technologically advanced countries. This results in the inability to achieve a large-scale, continuous, and stable supply of high-end semiconductor products. In particular, as wafer sizes increase, the technical indicators of quartz glass substrates, such as curvature, parallelism, flatness, and smoothness, are difficult to meet the requirements for use.

[0003] In recent years, with the development and progress of domestic technology, chemical mechanical polishing (CMP) has become a commonly used and effective technique in the domestic semiconductor processing field. CMP is a new technology that can provide comprehensive planarization in the manufacturing process of ultra-large-scale integrated circuits. This method can truly planarize the entire surface of semiconductor wafers such as silicon wafers and gallium nitride wafers. Moreover, this method has the advantages of simple processing and low processing cost.

[0004] In the practical application of this technology, the supply of polishing slurry is an essential and crucial technical step, and the flow rate of the polishing slurry is a parameter that needs to be strictly controlled in most experiments and production processes. Numerous experimental results show that the uniformity of the polishing slurry itself, as well as parameters such as the flow rate, volume, and actual utilization rate during application, have a vital impact on technical indicators such as the surface roughness and polishing rate. Therefore, the role of a fully functional polishing slurry supply device in promoting the development of chemical mechanical polishing (CMP) processes for wafers cannot be underestimated.

[0005] Regarding existing polishing slurry stirring devices on the market, for example, Chinese invention patent CN106422923A discloses a solution preparation system and method, which uses a metering pump to measure liquid for partially automated solution preparation. However, this system can only measure liquid solvents or additives; the addition of solid particles and powders still requires manual measurement. Chinese invention patent CN214051340U discloses a polishing slurry stirring tank with a simple T-shaped stirring mechanism. Such a simple mechanism is clearly insufficient to meet the stirring requirements of some poorly soluble substances and high liquid levels. Chinese invention patent CN113442058A discloses a polishing slurry delivery device and chemical mechanical polishing equipment. This device can only deliver the polishing slurry to the polishing disc, not to the area directly below the polishing head closer to the workpiece. This inevitably leads to greater polishing slurry loss, preventing the actual effect of the polishing slurry from being maximized. While these devices can play a certain role in practical work, their structure and function still have significant room for improvement. Currently, there are no commercially available polishing slurry supply mechanisms that integrate automatic preparation, thorough mixing, pressure regulation and delivery, precise application, and on-demand flow adjustment, and no results were found in the patent system. Therefore, based on the practical needs and shortcomings of existing equipment, this patent designs an automated polishing slurry supply device that integrates automatic preparation, thorough mixing, pressure regulation and delivery, precise application, and on-demand flow adjustment. Summary of the Invention

[0006] Purpose of the invention: The purpose of this invention is to provide an automated polishing slurry supply device that integrates automatic preparation, thorough mixing, pressure regulation and delivery, precise application, and on-demand flow adjustment; that is, an automatic polishing slurry preparation and uniform application device for chemical mechanical polishing.

[0007] Technical solution: The present invention provides an automatic preparation and uniform application device for polishing liquid for chemical mechanical polishing. The base (0) is located at the bottom of the machine body. A pneumatic support rod (2) is installed on one side of the upper wall of the base (0). A support plate (3) is installed at the upper end of the pneumatic support rod (2).

[0008] A locking valve (1) is installed on the pneumatic strut (2);

[0009] The support plate (3) is connected and installed directly above the base (0) via a pneumatic strut (2) with a locking valve (1).

[0010] Furthermore, a support frame (4) is installed on the upper wall of the support plate (3), and a leg is installed at each of the four corners of the lower wall of the support frame (4). Four limiting holes are provided on the outer periphery of the upper wall of the support plate (3).

[0011] The bottom ends of the four legs of the support frame (4) are inserted into the four limiting holes opened on the upper surface of the support plate (3).

[0012] Furthermore, several annular force sensors (5) are installed on the upper wall of the support frame (4).

[0013] At least four threaded holes are provided on the support frame (4), and the annular force sensor (5) is fixedly connected to the support frame (4) by four bolts (6) passing through the threaded holes;

[0014] Several material cylinders (7) are installed at the force sensing area at the center of the annular force sensor (5). A protruding support ring is installed on the outermost surface of the cylindrical part of the material cylinder (7) to support the material cylinder (7).

[0015] A material cylinder cover (8) is installed on the top of the material cylinder (7), and corresponding through holes are provided on both the material cylinder (7) and the material cylinder cover (8).

[0016] Furthermore, the bottom of the material cylinder (7) is designed with a slope and has a discharge port.

[0017] A discharge pipe is provided at the lower end of each of the material cylinders (7), and a solenoid valve (24) is installed at each discharge pipe.

[0018] Four feed through holes of the same size are evenly distributed around the circumference on the agitator cover (23) corresponding to the discharge pipe. The discharge pipe is inserted into the feed through holes, and the inner diameter of the feed through holes is larger than the inner diameter of the discharge pipe.

[0019] The lower end face of the discharge pipe of the material cylinder (7) is also lower than the upper end face of the stirring cylinder cover (23);

[0020] Eight downward protruding fixing blocks are placed at the lower edge of the stirring cylinder cover (23), and eight fixing slots are opened at the upper edge of the stirring cylinder (22).

[0021] A stirring cylinder (22) is installed at the lower end of the stirring cylinder cover (23), and the stirring cylinder cover (23) covers the upper end of the stirring cylinder (22).

[0022] The eight fixing blocks installed at the lower edge of the stirring cylinder cover (23) match the eight fixing slots installed at the upper edge of the stirring cylinder (22).

[0023] Furthermore, a second motor (46) is installed inside the upper wall surface of the stirring cylinder cover (23). At least four threaded holes are provided on the stirring cylinder cover (23). The second motor (46) is fixedly installed at the center hole at the upper end of the stirring cylinder cover (23) by four bolts (45) engaging with the four threaded holes at the upper end of the stirring cylinder cover (23).

[0024] A stirrer (44) is also installed inside the stirring tank (22), and the stirrer (44) is installed at the lower end of the output shaft connected in the second motor (46);

[0025] The blades of the stirrer (44) are designed with multiple layers of oblique blades at a certain angle to the horizontal direction;

[0026] Three legs are installed at the bottom of the mixing cylinder (22), and three limiting holes are provided on the inner circumference of the upper end surface of the support plate (3). The bottom ends of the three legs of the mixing cylinder (22) are inserted into the corresponding three limiting holes on the upper end surface of the support plate (3).

[0027] A liquid outlet pipe is provided at the lower end of the stirring tank (22), and a solenoid valve (21) is installed at the outlet of the liquid outlet pipe.

[0028] Furthermore, a booster pump (9) is installed on the upper wall of the support plate (3). The booster pump (9) is fixed to the upper surface of the support plate (3) by four bolts (43) that pass through it and four corresponding threaded holes on the upper surface of the support plate (3).

[0029] The booster pump (9) is provided with an inlet and an outlet.

[0030] A static pipe (41) that penetrates the support plate (3) is connected to the lower end of the liquid outlet.

[0031] The outlet of the outlet pipe is connected to the inlet of the booster pump (9);

[0032] The outlet of the booster pump (9) is connected to the inlet of the static pipe (41);

[0033] A matching ring is fitted on the support plate (3) and the outer wall of the stationary tube (41). The stationary tube (41) is fixed by eight bolts (20) in the ring with eight circumferentially evenly distributed through holes that are correspondingly raised on the upper end face of the support plate (3).

[0034] Furthermore, a bearing cap (11) is installed on the outer wall of the lower end of the stationary tube (41).

[0035] The bottom end of the bearing cover (11) is movably connected to the stationary tube (41) by a bolt five (29);

[0036] A bearing seat (39) is installed inside the bearing cover (11). The bearing seat (39) is connected by eight pins installed on the lower end face and eight slots on the upper end face of the stationary tube shoulder of the stationary tube (41).

[0037] An annular groove with a semi-circular cross-section is provided on the upper end face of the bearing seat (39), and a number of balls (40) are placed in the annular groove. The balls (40) are evenly distributed in the annular groove.

[0038] A stationary ring (36) is also installed at the lower end of the stationary tube (41). The stationary ring (36) is connected to and fixed to the stationary tube (41) by eight bolts (37) and corresponding threaded holes on the lower end face of the stationary tube shoulder.

[0039] A sealing ring three (38) is installed between the stationary tube (41) and the stationary ring (36), and the sealing ring three (38) is placed between the contact surfaces of the stationary tube (41) and the stationary ring (36);

[0040] It also includes a polishing head (14), a first sealing ring (30), a rotating ring seat (31), at least eight pressure springs (32), a pressure ring (33), two second sealing rings (34), a rotating ring (35), and an oil chamber cover (42);

[0041] The moving ring seat (31) is fixed to the upper part of the polishing head (14) by eight bolts (47) and eight threaded holes corresponding to the upper surface of the shoulder of the polishing head (14);

[0042] Eight pressure springs (32) are fitted onto eight circumferentially evenly distributed hollow columns on the upper surface of the moving ring seat (31), and eight circumferentially evenly distributed through-hole columns on the lower surface of the pressure ring (33) are inserted into the corresponding pressure springs (32).

[0043] The eight limiting posts on the lower surface of the rotating ring (35) are inserted into the limiting post through holes on the corresponding pressure ring (33), the pressure spring (32), and the corresponding limiting hollow post holes on the moving ring seat (31);

[0044] Two sealing rings of different sizes (34) are pressed between the pressure ring (33) and the rotating ring (35);

[0045] The polishing head (14) is fixed to the bearing cover (11) by eight circumferentially evenly distributed bolts (29) and eight corresponding threaded holes on the lower end face of the outer wall of the bearing cover (11).

[0046] The center of the polishing head (14) is a hollow shaft, the hollow part of which is a pipe for the flow of polishing liquid. Four circumferentially evenly distributed tubular guide grooves are arranged at the bottom of the polishing head (14). The tubular guide grooves are connected to the hollow part. Four circumferentially evenly distributed through-hole columns for placing workpieces are also arranged at the bottom of the polishing head (14).

[0047] The sealing ring 1 (30) is pressed between the outer wall of the bearing cap (11) and the shoulder of the polishing head (14);

[0048] The oil chamber cover (42) is installed on the oblique threaded hole on the side wall of the bearing cover (11).

[0049] Furthermore, a large gear (12) is disposed between the bearing cover (11) and the polishing head (14).

[0050] A motor (18) is mounted on the lower wall of the support plate (3), and a pinion (17) is mounted at the lower end of the motor (18).

[0051] The large gear (12) is mounted on the main shaft of the polishing head (14) via a key (27), and the small gear (17) is mounted on the output shaft of the motor (18) via a key (28).

[0052] The motor (18) is fixed to the lower surface of the support plate (3) by four bolts (19); the small gear (17) meshes with the large gear (12) and under the drive of the motor (18), the small gear (17) drives the large gear (12) to rotate.

[0053] Furthermore, four support arms are evenly distributed on the outer wall of the polishing head (14), and pressure rods (13) are respectively installed on the four support arms. The four pressure rods (13) are installed on the corresponding four support arms on the polishing head (14).

[0054] A polishing head lower plate (15) is disposed on the lower wall of the polishing head (14), and the polishing head lower plate (15) and the polishing head (14) are connected together by bonding or welding.

[0055] Three liquid outlet holes are provided directly below the four guide grooves opened on the polishing head (14) on the lower plate (15) of the polishing head;

[0056] It also includes a flow control plate (16), which is connected to the polishing head lower plate (15) by four bolts (26) and four circumferentially evenly distributed threaded holes on the lower surface of the polishing head lower plate (15); the flow control plate (16) has three sets of holes similar to those on the polishing head lower plate (15);

[0057] A raised water-blocking ring is also provided on the upper surface of the flow control plate (16);

[0058] Four springs (25) are fitted on four bolts (26). The four springs (25) are fitted on four bolts (26) and pressed between the corresponding bolts (26) and the lower plate of the polishing head (15). A gasket (48) is also placed between the springs (25) and the lower plate of the polishing head (15).

[0059] Furthermore, a touch panel (10) is also provided on one side of the upper wall of the support plate (3);

[0060] A large hole is also provided on the base (0).

[0061] The device of this invention mainly includes a polishing slurry preparation section, characterized by multiple material cylinders equipped with solenoid valves and pressure sensors; a polishing slurry stirring section, characterized by a stirring cylinder with a solenoid valve; and a polishing slurry application section, characterized by a polishing head equipped with a pressure pump and a flow control plate. Furthermore, the functions of these three sections can be precisely coordinated and used in conjunction with existing control technologies. This device can solve the problems related to polishing slurry supply in chemical mechanical polishing processes, such as polishing slurry preparation, stirring, conveying, and precise application, thereby simplifying manual operation procedures and improving work efficiency.

[0062] Beneficial Effects: Compared with the prior art, the features of this invention are: 1. This liquid application device changes the current equipment's single function of conveying polishing liquid, enabling precise measurement and addition of each component of the polishing liquid, seamless integration of stirring and measurement / preparation functions, and automated operation. It can accurately deliver the polishing liquid after preparation, changing the current single-function status of existing equipment; 2. This device uses a ring force sensor and a solenoid valve in conjunction with existing automated control technology to accurately and automatically measure the various fluid solid powder and liquid components of the polishing liquid. The equipment replaces manual labor in the measurement work, reducing the possibility of errors and simplifying the manual workload of the process; 3. The liquid delivery pipeline is integrated... The device integrates with the polishing head, directly utilizing the internal slots on the polishing head for liquid delivery. Liquid can be delivered directly to the area directly below the polishing head. Compared to traditional application methods, this device brings the application point of the polishing liquid closer to the workpiece's surface, improving the actual utilization rate of the polishing liquid. 4. An adjustable flow control plate is added to the outlet of the polishing head, allowing for mechanical adjustment of the polishing liquid flow rate based on actual processing results. Simultaneously, a spring-loaded pressure system ensures close contact between the flow control plate and the lower plate of the polishing head, preventing lateral leakage of the polishing liquid. 5. The pressure bar that applies pressure to the workpiece has an enlarged design, increasing the pressure area at the bottom of the pressure bar to match the total pressure area of ​​the workpiece's surface. This design avoids the problem of uneven pressure concentration on the workpiece, resulting in more uniform machining of the workpiece surface; 6. A sliding seal design is used at the interface between the liquid delivery pipeline and the polishing head inlet, allowing the polishing head to rotate normally without affecting the liquid delivery function of its internal liquid delivery pipeline, while also achieving the function of central liquid delivery, making the liquid delivery more precise; 7. The agitator in the stirring module adopts a windmill-like structure design, which allows it to stir the liquid in the cylinder while also creating a certain "suction" effect on the objects above the stirring cylinder, promoting the smooth flow of solid powders with poor flowability in the cylinder when the corresponding solenoid valve is opened. Moreover, the agitator covers the entire stirring cylinder from top to bottom, making the stirring... 8. The mixing is more uniform and thorough; 9. A booster pump is used in the polishing liquid delivery process, making the delivery of the polishing liquid more thorough, and the pressure and flow rate can be adjusted according to existing booster pump technology; 10. The connection between the mixing tank cover and the mixing tank, the support frame and the support plate, and the mixing tank and the support plate are all made without fasteners and rely on gravity, making the structure simpler without affecting the function; 11. Air pressure balance holes are designed at the relevant positions of the mixing tank and the mixing tank cover. When the solution in the tank needs to be released, the balance hole can be "opened" to prevent the formation of negative pressure in the tank when the material in the tank flows down, which would affect the flow of the material. In other states, the balance hole can be "closed" to seal and preserve the material in the tank.

[0063] This device has many components, some of which are described in the invention description. Further potential gains can be explored by referring to the accompanying drawings, especially given the detailed and specific design of the sliding seal connection. Attached Figure Description

[0064] Figure 1 This is an overall structural diagram of the present invention;

[0065] Figure 2 yes Figure 1 A sectional view;

[0066] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0067] Figure 4 yes Figure 3 3D exploded view;

[0068] Figure 5 yes Figure 2 Enlarged view of point B in the middle;

[0069] Figure 6 yes Figure 5 3D exploded view;

[0070] Figure 7 yes Figure 1 Exploded views of parts marked with icons 4, 5, 6, 7, 8, and 24;

[0071] In the diagram: 0 is the base, 1 is the locking valve, 2 is the pneumatic strut, 3 is the support plate, 4 is the support frame, 5 is the ring force sensor, 6 is bolt one, 7 is the material cylinder, 8 is the material cylinder cover, 9 is the booster pump, 10 is the touch panel, 11 is the bearing cover, 12 is the large gear, 13 is the pressure rod, 14 is the polishing head, 15 is the polishing head lower plate, 16 is the flow control plate, 17 is the small gear, 18 is motor one, 19 is bolt two, 20 is bolt three, 21 is solenoid valve one, 22 is the mixing cylinder, 23 is the mixing cylinder cover, 24 is... 25 is solenoid valve 2, 26 is spring 4, 27 is large key, 28 is small key, 29 is bolt 5, 30 is sealing ring 1, 31 is moving ring seat, 32 is pressure spring, 33 is pressure ring, 34 is sealing ring 2, 35 is rotating ring, 36 is stationary ring, 37 is bolt 6, 38 is sealing ring 3, 39 is bearing seat, 40 is ball bearing, 41 is stationary pipe, 42 is oil chamber cover, 43 is bolt 7, 44 is agitator, 45 is bolt 8, 46 is motor 2, 47 is bolt 9, and 48 is gasket. Detailed Implementation

[0072] To more clearly illustrate the technical solution of the present invention, the technical solution of the present invention will be further described in detail below with reference to the accompanying drawings:

[0073] As shown in the figure, the present invention discloses an automatic preparation and uniform application device for polishing slurry in chemical mechanical polishing; comprising a base 0, a locking valve 1, a pneumatic strut 2, a support plate 3, a support frame 4, a ring force sensor 5, a bolt 6, a material cylinder 7, a material cylinder cover 8, a booster pump 9, a touch panel 10, a bearing cover 11, a large gear 12, a pressure rod 13, a polishing head 14, a polishing head lower plate 15, a flow control plate 16, a small gear 17, a motor 18, a bolt 2 19, a bolt 3 20, and a solenoid valve. 21. Stirring cylinder 22. Stirring cylinder cover 23. Solenoid valve 24. Spring 25. Bolt 4 26. Large key 27. Small key 28. Bolt 5 29. Sealing ring 1 30. Moving ring seat 31. Pressure spring 32. Pressure ring 33. Sealing ring 2 34. Rotating ring 35. Stationary ring 36. Bolt 6 37. Sealing ring 3 38. Bearing seat 39. Ball bearing 40. Stationary pipe 41. Oil chamber cover 42. Bolt 7 43. Stirrer 44. Bolt 8 45. Motor 2 46. Bolt 9 47. Gasket 48.

[0074] Furthermore, the base 0 is located at the bottom of the machine body, and the support plate 3 is connected and installed directly above the base 0 through a pneumatic strut 2 with a locking valve 1. The extension and locking of the pneumatic strut 2 are used to realize the vertical lifting and locking of the support plate 3 relative to the base 0.

[0075] The bottom ends of the four legs of the support frame 4 are inserted into the corresponding four limiting holes on the upper surface of the support plate 3, so as to fix the support frame 4 on the support plate 3 under the action of gravity.

[0076] The annular force sensor 5 is fixed to the corresponding four threaded holes on the upper surface of the support frame 4 by four bolts 6, so that the hole position of the annular force sensor 5 is coaxial with the corresponding through hole on the support frame 4.

[0077] The outermost surface of the cylindrical part of the material cylinder 7 has a protruding support ring that supports the material cylinder 7. The support ring of the material cylinder 7 is pressed against the force sensing area of ​​the annular force sensor 5.

[0078] The bottom of the material cylinder 7 is designed with a slope and is equipped with a discharge port so that the material can flow out under the action of gravity.

[0079] The material cylinder cover 8 is placed on the upper end of the material cylinder 7. The material cylinder 7 and the material cylinder cover 8 have corresponding through holes. Before dispensing the liquid, rotate the material cylinder cover 8 to align the through holes with the corresponding through holes on the material cylinder 7 to allow air to pass through and prevent negative pressure from forming inside the material cylinder when the material flows down, which would affect the further flow of the material. Under normal circumstances, the two holes can be offset from the aligned position to achieve the function of sealing and preserving the material.

[0080] The solenoid valve 24 is installed at the lower end of the material cylinder 7 discharge pipe, and is used in conjunction with the ring force sensor 5 to control the amount of material flowing out.

[0081] In addition, the support frame 4 is equipped with four units similar to those consisting of a ring force sensor 5, a bolt 6, a material cylinder 7, a material cylinder cover 8, and a solenoid valve 24, forming a solution preparation module. The aforementioned four units are designed with different storage capacities according to the different amounts of various materials used in actual use. Furthermore, the bottom outlet of the larger material cylinder 7 is designed with an eccentricity to avoid occupying the installation space of other material cylinders 7 above the stirring cylinder cover 23.

[0082] Furthermore, the bottom ends of the three legs of the stirring cylinder 22 are inserted into the corresponding three limiting holes on the upper surface of the support plate 3, so as to fix the stirring cylinder 22 on the support plate 3 under the action of gravity, so as to prevent the stirring cylinder 22 from shaking when its inner wall is subjected to circumferential friction.

[0083] The stirring cylinder cover 23 covers the upper end of the stirring cylinder 22. The lower edge of the stirring cylinder cover 23 has eight downward protruding fixing blocks. The eight fixing blocks match the eight fixing slots on the upper edge of the stirring cylinder 22 to prevent the stirring cylinder cover 23 from rotating when subjected to the circumferential reaction force transmitted by the liquid through the stirrer 44.

[0084] The motor 46 is installed and fixed at the center hole of the upper end of the stirring cylinder cover 23 by four bolts 45 and four threaded holes at the upper end of the stirring cylinder cover 23, providing power to the stirrer 44. The stirrer 44 is installed at the lower end of the output shaft of the motor 46.

[0085] Four circumferentially evenly distributed feed holes of the same size are provided on the upper end of the stirring cylinder cover 23. The feed holes are slightly larger than the outer diameter of the discharge pipe of the material cylinder 7, so that the feed holes and the discharge pipe are coaxial but do not contact each other. In addition, the lower end face of the discharge pipe is lower than the upper section of the stirring cylinder cover 23. This allows the material flowing out of the material cylinder 7 to flow into the stirring cylinder 22 without damage, and the stirring cylinder cover 23 does not support the material cylinder 7. This allows the pressure of the material cylinder 22 to be applied to the annular force sensor 5 to achieve accurate measurement. Because there is a gap between the aforementioned feed holes and the discharge pipe, this gap can also help to balance the atmospheric pressure inside the stirring cylinder 22.

[0086] The blades of the agitator 44 are designed with multiple layers of oblique blades at a certain angle to the horizontal direction. This allows the uppermost blade to push the air flow near the lower end of the mixing cylinder cover 23 while stirring, thereby creating a certain negative pressure at the lower end of the feed inlet on the mixing cylinder cover 23. This, in turn, can "suck in" materials to a certain extent, promoting the flow of some relatively poor-flowing solid powders or other materials into the mixing cylinder 22.

[0087] The solenoid valve 21 is installed on the liquid outlet pipe at the lower end of the stirring cylinder 22.

[0088] Furthermore, the booster pump 9 is fixed to the upper end face of the support plate 3 by four bolts 43 and four corresponding threaded holes on the upper end face of the support plate 3; the solution input end and output end of the booster pump 9 are respectively connected to the liquid outlet pipe of the stirring tank 22 and the inlet end of the static pipe 41.

[0089] The stationary tube 41 is fixed by eight bolts 20 to the mounting ring with eight circumferentially evenly distributed through holes on the upper end face of the support plate 3.

[0090] The bearing housing 39 is connected by eight pins on its lower end face to eight slots on the upper end face of the shoulder of the stationary tube 41. The upper end face of the bearing housing 39 has an annular groove with a semi-circular cross-section. Several balls 40 are evenly distributed in the aforementioned groove.

[0091] The bearing cover 41 presses on the ball 40, and there is also a groove at the corresponding position to restrict the movement trajectory of the ball 40. There is a certain gap between the bearing cover 41 and the bearing seat, and the ball can perform relative movement without contact.

[0092] The stationary ring 36 is fixed to the stationary tube 41 by eight bolts 37 that are connected to the corresponding threaded holes on the lower end face of the stationary tube shoulder;

[0093] The sealing ring 38 is squeezed between the contact surfaces of the stationary pipe 41 and the stationary ring 36 to prevent lubricating oil from leaking into the pipe and the liquid in the pipe from leaking into the lubricating oil cavity.

[0094] The moving ring seat 31 is fixed to the upper part of the polishing head 14 by eight bolts 947 and eight threaded holes corresponding to the upper surface of the shoulder of the polishing head 14.

[0095] Eight pressure springs 32 are fitted onto eight circumferentially evenly distributed hollow vertical columns on the upper surface of the moving ring seat 31, and eight circumferentially evenly distributed through-hole vertical columns on the lower surface of the pressure ring 33 are inserted into the corresponding pressure springs 32.

[0096] The eight limiting posts on the lower surface of the rotating ring 35 are inserted into the limiting post through holes on the corresponding pressure ring 33, the pressure spring 32, and the corresponding limiting hollow post holes on the rotating ring seat 31.

[0097] A portion of the outer wall of the lower end of the stationary tube 41 near the rotating ring 35 was cut off to prevent the rotating ring 35 from contacting the stationary tube 41 and avoid unnecessary friction.

[0098] Two sealing rings 34 of different sizes are squeezed between pressure ring 33 and rotating ring 35, and have a similar function to sealing ring 38.

[0099] The polishing head 14 is fixed to the bearing cover 11 by eight circumferentially evenly distributed bolts 29 and eight corresponding threaded holes on the lower end face of the outer wall of the bearing cover 11. The polishing head 14 has a hollow shaft at its center, and the hollow part is a pipe for the flow of polishing fluid. There are also four circumferentially evenly distributed tubular guide grooves at the bottom of the polishing head 14, which are connected to the hollow part. In addition, there are four circumferentially evenly distributed through-hole columns at the bottom of the polishing head 14 for placing workpieces.

[0100] The sealing ring 30 is pressed between the outer wall of the bearing cap 11 and the shoulder of the polishing head 14;

[0101] The oil chamber cover 42 is installed on the oblique threaded hole on the side wall of the bearing cover 11;

[0102] After the above connection is completed, the rotating ring 36 will be in close contact with the stationary ring 35 under the strong extrusion of the pressure ring 33, and can produce a sliding seal effect with coaxial circumferential relative rotation and relative sliding end faces.

[0103] There is a tiny gap between the outlet end of the static tube 41 and the inlet of the polishing head 14, and they are coaxial, so that the liquid can flow smoothly from top to bottom without causing wear on the tube opening.

[0104] A lubricating oil cavity is formed between the bearing cover 11, the rotating ring 35, the stationary ring 36, etc., and lubricating oil can be added into the cavity through the hole at the installation location of the oil cavity cover 42; a raised thin wall is provided near the inner wall of the rotating ring 36, and a concave groove is provided at the corresponding stationary ring, and the thin wall does not contact the groove and will not generate friction.

[0105] Due to the height limitation of the lubricating oil port, the lubricating oil level in the cavity is always lower than the protruding thin wall on the rotating ring 36, which means that even if the lubricating oil leaks into the internal pipe at the sliding seal connection, it will not seep into the pipe.

[0106] The two sealing rings 34 are symmetrically arranged with respect to the center of the pressure spring 32, so that the pressure spring 32 can exert the pressure on the pressure ring 33 vertically upward, thereby making the sliding sealing contact surface more uniform and the sealing performance better.

[0107] The lower end of the stationary tube 41 adopts a design of first contraction and then release near the liquid inlet of the polishing head 14. The contraction makes the liquid flow faster when it flows through the adjacent part of the two tubes, while the release makes less liquid flow into the gap at the joint to a certain extent, further preventing the liquid in the tube from leaking into the lubricating oil cavity.

[0108] Furthermore, the beveled openings of the stationary tube 41 and the polishing head 14 make the gap beveled, and a portion of the stationary tube 41 extends into the polishing head 14, making it more difficult for the polishing fluid to leak.

[0109] Furthermore, the touchpad 10 is mounted on the left end of the support plate 3.

[0110] Furthermore, the large gear 12 is mounted on the main shaft of the polishing head 14 via a large key 27, and the small gear 17 is mounted on the output shaft of the motor 18 via a small key 28; the motor 18 is fixed to the lower surface of the support plate 3 by four bolts 19. The small gear 17 meshes with the large gear 12, and under the drive of the motor 18, the small gear drives the large gear to rotate.

[0111] Four pressure rods 13 are installed on the corresponding four arms on the polishing head 14, so that the pressure rods 13 can press against the four sample through holes on the polishing head 14. At the same time, the bottom of the pressure rods 13 has been optimized.

[0112] To facilitate manufacturing, the polishing head lower plate 15 and polishing head 14 are designed as separate units. During use, the polishing head lower plate 15 and polishing head 14 are connected as one unit by means of bonding or welding to avoid gaps in the connection that could cause the polishing fluid to leak.

[0113] The lower plate 15 of the polishing head has three liquid outlet holes directly below the four guide grooves on the polishing head 14, and the holes are designed to be larger at the top and smaller at the bottom to increase the liquid flow rate.

[0114] The flow control plate 16 is connected to the polishing head lower plate 14 by four bolts 26 and four circumferentially evenly distributed threaded holes on the lower surface of the polishing head lower plate 15. The flow control plate 16 has three sets of holes similar to those on the polishing head lower plate 15, and the holes on the lower surface of the flow control plate 16 are cut off to prevent the holes from being blocked when the flow control plate 16 comes into contact with other surfaces below, thus affecting the flow of polishing fluid. The upper surface of the flow control plate 16 also has a raised water-retaining ring, and the corresponding position of the polishing head lower plate 15 has a groove to match it, which to a certain extent prevents liquid from leaking along the joint gap.

[0115] Four springs 25 are fitted onto four bolts 26 and pressed between the corresponding bolts 26 and the lower plate of the polishing head 15. A washer 48 is also placed between the springs 25 and the lower plate of the polishing head 15.

[0116] There are four annular stepped holes corresponding to the mounting positions of bolts 26 on the lower surface of the flow control plate 16. The stepped holes ensure that the lower surface of bolts 26 does not exceed the lower surface of the flow control plate 16 after installation, while the annular shape allows the flow control plate 16 to rotate circumferentially relative to the lower plate 15 of the polishing head. A similar design is also used in the corresponding area below the sample hole pillars on the flow control plate 16 and the polishing head 14, so that bolts 26 and sample hole pillars on the polishing head 14 do not affect the circumferential rotation of the flow control plate 16 to a certain extent.

[0117] There are twelve raised anti-rotation blocks on the upper edge of the flow control disk 16, three in a group, and four groups of anti-rotation blocks are evenly distributed circumferentially on the upper surface of the flow control disk 16; correspondingly, there are twenty slots on the lower surface of the polishing head lower disk 15, five in a group, and four groups of slots are evenly distributed circumferentially on the lower surface of the polishing head lower disk 15.

[0118] The flow control plate 16 also has four circumferentially evenly distributed extended blocks on its side for manual force application. By manually applying force to the extended blocks, the flow control plate 16 is pressed and rotated so that the twelve anti-rotation blocks match twelve of the corresponding twenty slots. When different slots are matched, one of the three sets of liquid outlet holes on the flow control plate 16 corresponds to the liquid outlet hole on the lower plate 15 of the polishing head. Since the three sets of liquid outlet holes on the flow control plate 16 have different diameters, different flow rates can be adjusted.

[0119] All static components in the above-mentioned connections can be sealed and reinforced with appropriate waterproof adhesives according to actual usage requirements. All inner walls that come into contact with liquids during use are treated for corrosion resistance. Sliding contact surfaces are made of materials with low coefficient of friction and good wear resistance, such as silicon carbide.

[0120] Example:

[0121] like Figure 1 The present invention relates to a chemical mechanical polishing slurry preparation and application device, comprising a base 0, a locking valve 1, a pneumatic strut 2, a support plate 3, a support frame 4, a ring force sensor 5, a bolt 6, a material cylinder 7, a material cylinder cover 8, a booster pump 9, a touch panel 10, a bearing cover 11, a large gear 12, a pressure rod 13, a polishing head 14, a polishing head lower plate 15, a flow control plate 16, a small gear 17, a motor 18, a bolt 29, a bolt 30, a solenoid valve 1, a stirring cylinder 22, a stirring cylinder cover 23, and a solenoid valve 24.

[0122] like Figure 2 As shown, it includes large key 27, small key 28, bolt seven 43, stirrer 44, bolt eight 45, and motor two 46.

[0123] like Figure 3 As shown, it includes spring 25 and bolt 26.

[0124] like Figure 4 As shown, it includes gasket 48.

[0125] like Figure 5 As shown, it includes bolt 29, sealing ring 1 30, moving ring seat 31, pressure spring 32, pressure ring 33, sealing ring 2 34, rotating ring 35, stationary ring 36, bolt 6 37, sealing ring 38, bearing seat 39, ball 40, stationary pipe 41, and oil chamber cover 42.

[0126] like Figure 6As shown, this includes bolt 947.

[0127] Before starting work, open the material cylinder cover 8, store the corresponding material in the material cylinder 7 and several other material cylinders with similar structures but not specifically described, and close the material cylinder cover 8, and "open" the vent holes of the material cylinder 7 and the material cylinder cover 8; manually press down on the protruding pressing block on the flow control plate 16 and twist the flow control plate 16 until its corresponding liquid application hole group matches the liquid outlet hole group of the polishing head lower plate 15. During this process, the spring 25 will be compressed when pressing. After the hole groups match, release the pressing and the spring 25 will rebound and press the flow control plate 16 tightly under the polishing head lower plate 15; place the workpiece to be processed into the workpiece placement area on the polishing head 14.

[0128] When the work begins, the corresponding material mass and other processing parameters are set on the touch panel 10. The touch panel will then command the solenoid valve 21 to close, thus sealing the lower end of the mixing cylinder 22. Simultaneously, the motor 46 is commanded to operate and drive the agitator 44 to rotate. Furthermore, the solenoid valve 24 at the material cylinder outlet is commanded to open, allowing the material to flow into the mixing cylinder 22. At the same time, the annular force sensor 5 remains operational and feeds back real-time detection data to the touch panel 10. When the touch panel 10 receives the difference between the real-time pressure data from the annular force sensor 5 and the initial pressure data, and this difference equals the set weight of the material, the solenoid valve 24 is commanded to close. Thus, the addition of one type of material is completed. The addition of other materials is done in the same way.

[0129] After the materials have been added, wait for the stirring unit to finish stirring the solution. Once the stirring is complete, the touch panel 10 will command the motor 46 to shut down and pop up a window to prompt you to confirm the process parameters and whether to start the polishing work, or start the polishing work directly according to the previous settings.

[0130] When the polishing work begins, the touch panel 10 commands the opening of the solenoid valve 21, the booster pump 9 operates according to the corresponding parameters, the motor 18 operates according to the corresponding parameters, and through the small gear 17 and the large gear 18, the polishing head 14 is rotated. The pressure rod 13 presses down to make the workpiece come into close contact with the polishing pad, and under the rotation of the polishing head 14, it generates relative motion with the polishing pad and rubs and polishes.

[0131] The polishing slurry flows out from the stirring tank 22 and, under the action of the booster pump 9 and gravity, flows through the solenoid valve 21, the booster pump 9, the static pipe 41, the groove inside the polishing head 14, and the liquid flow hole of the lower plate 15 of the polishing head. Finally, it flows out from the liquid application hole of the flow control plate 16 and flows to the position on the polishing pad closest to the bottom of the workpiece.

[0132] The sliding seal connection at the interface between the liquid outlet of the static tube 41 and the liquid inlet of the internal groove tube of the polishing head 14 has a relatively complex structure. Figure 6 The details have been shown above, so I won't go into them here.

[0133] It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of this invention should be considered within the scope of protection of this invention.

Claims

1. An automatic preparation and uniform application device for polishing slurry in chemical mechanical polishing, characterized in that: The base (0) located at the bottom of the machine body has a pneumatic strut (2) installed on one side of the upper wall of the base (0), and a support plate (3) installed at the upper end of the pneumatic strut (2). A locking valve (1) is installed on the pneumatic strut (2); The support plate (3) is connected and installed directly above the base (0) via a pneumatic strut (2) with a locking valve (1); It also includes a stirring cylinder (22), with three legs at the bottom of the stirring cylinder (22), and three limiting holes 2 are provided on the inner circumference of the upper end surface of the support plate (3). The bottom ends of the three legs of the stirring cylinder (22) are inserted into the corresponding three limiting holes 2 on the upper end surface of the support plate (3). A liquid outlet pipe is provided at the lower end of the stirring tank (22), and a solenoid valve (21) is installed at the outlet of the liquid outlet pipe. A booster pump (9) is installed on the upper wall of the support plate (3). The booster pump (9) is fixed to the upper surface of the support plate (3) by four bolts (43) that pass through it and four corresponding threaded holes on the upper surface of the support plate (3). The booster pump (9) is provided with an inlet and an outlet. A static pipe (41) that penetrates the support plate (3) is connected to the lower end of the liquid outlet. The outlet of the outlet pipe is connected to the inlet of the booster pump (9); The outlet of the booster pump (9) is connected to the inlet of the static pipe (41); A matching ring is fitted on the support plate (3) and the outer wall of the stationary tube (41). The stationary tube (41) is fixed by eight bolts (20) in the ring with eight circumferentially evenly distributed through holes that are correspondingly raised on the upper end face of the support plate (3). A bearing cap (11) is installed on the outer wall of the lower end of the static tube (41). The bottom end of the bearing cover (11) is movably connected to the stationary tube (41) by a bolt five (29); A bearing seat (39) is installed inside the bearing cover (11). The bearing seat (39) is connected by eight pins installed on the lower end face and eight slots on the upper end face of the stationary tube shoulder of the stationary tube (41). An annular groove with a semi-circular cross-section is provided on the upper end face of the bearing seat (39), and a number of balls (40) are placed in the annular groove. The balls (40) are evenly distributed in the annular groove. A stationary ring (36) is also installed at the lower end of the stationary tube (41). The stationary ring (36) is connected to the stationary tube (41) by eight bolts (37) and the corresponding threaded holes on the lower end face of the stationary tube shoulder of the stationary tube (41). A sealing ring three (38) is installed between the stationary tube (41) and the stationary ring (36), and the sealing ring three (38) is placed between the contact surfaces of the stationary tube (41) and the stationary ring (36); It also includes a polishing head (14), a first sealing ring (30), a rotating ring seat (31), at least eight pressure springs (32), a pressure ring (33), two second sealing rings (34), a rotating ring (35), and an oil chamber cover (42); The moving ring seat (31) is fixed to the upper part of the polishing head (14) by eight bolts (47) and eight threaded holes corresponding to the upper surface of the shoulder of the polishing head (14); Eight pressure springs (32) are fitted on eight circumferentially evenly distributed hollow columns on the upper surface of the moving ring seat (31), and eight circumferentially evenly distributed through-hole columns on the lower surface of the pressure ring (33) are inserted into the corresponding pressure springs (32). The eight limiting posts on the lower surface of the rotating ring (35) are inserted into the limiting post through holes on the corresponding pressure ring (33), the pressure spring (32), and the corresponding limiting hollow post holes on the moving ring seat (31); Two sealing rings of different sizes (34) are pressed between the pressure ring (33) and the rotating ring (35); The polishing head (14) is fixed to the bearing cover (11) by eight circumferentially evenly distributed bolts (29) and eight corresponding threaded holes on the lower end face of the outer wall of the bearing cover (11); The center of the polishing head (14) is a hollow shaft, the hollow part of which is a pipe for the flow of polishing liquid. Four circumferentially evenly distributed tubular guide grooves are arranged at the bottom of the polishing head (14). The tubular guide grooves are connected to the hollow part. Four circumferentially evenly distributed through-hole columns for placing workpieces are also arranged at the bottom of the polishing head (14). The sealing ring 1 (30) is pressed between the outer wall of the bearing cap (11) and the shoulder of the polishing head (14); The oil chamber cover (42) is installed on the oblique threaded hole on the side wall of the bearing cover (11).

2. The automatic preparation and uniform application device for polishing slurry for chemical mechanical polishing according to claim 1, characterized in that: A support frame (4) is installed on the upper wall of the support plate (3), and a leg is installed at each of the four corners of the lower wall of the support frame (4). Four limiting holes are provided on the outer periphery of the upper wall of the support plate (3). The bottom ends of the four legs of the support frame (4) are inserted into the four limiting holes opened on the upper surface of the support plate (3).

3. The automatic preparation and uniform application device for polishing slurry for chemical mechanical polishing according to claim 2, characterized in that: Several ring-shaped force sensors (5) are installed on the upper wall of the support frame (4). At least four threaded holes are provided on the support frame (4), and the annular force sensor (5) is fixedly connected to the support frame (4) by four bolts (6) passing through the threaded holes; Several material cylinders (7) are installed at the force sensing area at the center of the annular force sensor (5). A protruding support ring is installed on the outermost surface of the cylindrical part of the material cylinder (7) to support the material cylinder (7). A material cylinder cover (8) is installed on the top of the material cylinder (7), and corresponding through holes are provided on both the material cylinder (7) and the material cylinder cover (8).

4. The automatic preparation and uniform application device for polishing slurry in chemical mechanical polishing according to claim 3, characterized in that: The bottom of the material cylinder (7) is designed with a slope and has a discharge port. Each of the material cylinders (7) has a discharge pipe at its lower end, and a solenoid valve (24) is installed at each discharge pipe. Four feed through holes of the same size are evenly distributed around the circumference on the agitator cover (23) corresponding to the discharge pipe. The discharge pipe is inserted into the feed through holes, and the inner diameter of the feed through holes is larger than the inner diameter of the discharge pipe. The lower end face of the discharge pipe of the material cylinder (7) is also lower than the upper end face of the stirring cylinder cover (23); Eight downward protruding fixing blocks are placed at the lower edge of the stirring cylinder cover (23), and eight fixing slots are opened at the upper edge of the stirring cylinder (22). A stirring cylinder (22) is installed at the lower end of the stirring cylinder cover (23), and the stirring cylinder cover (23) covers the upper end of the stirring cylinder (22). The eight fixing blocks installed at the lower edge of the stirring cylinder cover (23) match the eight fixing slots installed at the upper edge of the stirring cylinder (22).

5. The automatic preparation and uniform application device for polishing slurry in chemical mechanical polishing according to claim 4, characterized in that: A second motor (46) is installed inside the upper wall surface of the stirring cylinder cover (23). At least four threaded holes are provided on the stirring cylinder cover (23). The second motor (46) is fixedly installed at the center hole of the upper end of the stirring cylinder cover (23) by four bolts (45) engaging with the four threaded holes. A stirrer (44) is also installed inside the stirring tank (22), and the stirrer (44) is installed at the lower end of the output shaft connected in the second motor (46); The blades of the stirrer (44) are designed with multiple layers of oblique blades at a certain angle to the horizontal direction.

6. The automatic preparation and uniform application device for polishing slurry for chemical mechanical polishing according to claim 1, characterized in that: A large gear (12) is disposed between the bearing cover (11) and the polishing head (14). A motor (18) is mounted on the lower wall of the support plate (3), and a small gear (17) is mounted on the lower end of the motor (18). The large gear (12) is mounted on the main shaft of the polishing head (14) via a key (27), and the small gear (17) is mounted on the output shaft of the motor (18) via a key (28). The motor (18) is fixed to the lower surface of the support plate (3) by four bolts (19); the small gear (17) meshes with the large gear (12) and under the drive of the motor (18), the small gear (17) drives the large gear (12) to rotate.

7. The automatic preparation and uniform application device for polishing slurry for chemical mechanical polishing according to claim 1, characterized in that: Four support arms are evenly distributed on the outer wall of the polishing head (14), and pressure rods (13) are respectively installed on the four support arms. The four pressure rods (13) are installed on the corresponding four support arms on the polishing head (14). A polishing head lower plate (15) is disposed on the lower wall of the polishing head (14), and the polishing head lower plate (15) and the polishing head (14) are connected together by bonding or welding. Three liquid outlet holes are provided directly below the four guide grooves opened on the polishing head (14) on the lower plate (15) of the polishing head; It also includes a flow control plate (16), which is connected to the lower plate of the polishing head (15) by four bolts (26) and four circumferentially evenly distributed threaded holes on the lower surface of the polishing head (15); the flow control plate (16) has three sets of holes similar to those on the lower plate of the polishing head (15); A raised water-blocking ring is also provided on the upper surface of the flow control plate (16); Four springs (25) are fitted on four bolts (26). The four springs (25) are fitted on four bolts (26) and pressed between the corresponding bolts (26) and the lower plate of the polishing head (15). A gasket (48) is also placed between the springs (25) and the lower plate of the polishing head (15).

8. The automatic preparation and uniform application device for polishing slurry for chemical mechanical polishing according to claim 1, characterized in that: A touch panel (10) is also provided on one side of the upper wall of the support plate (3). A large hole is also provided on the base (0).

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