A multi-flux test method for the phenomenon of strip warm shape change

Abstract

The application provides a multi-flux test method for the phenomenon of warm shape change of a strip, and belongs to the technical field of processing and forming of strip production. The strip is divided according to geometric parameters in the transverse direction, and a stress function of the strip is obtained according to the division result. The stress function is solved in a certain time, and the value is assigned to a strip component stress applying device group. A heating device is turned on, and the temperature of the strip clamped by the strip component stress applying device group under heating is obtained and compared with a preset temperature. The heating is stopped, and an electric heating or cooling element is turned on to obtain the temperature of the clamped strip and compare it with a temperature rise or drop history function. Finally, the organization performance of the strip is tested. The application releases the stress of the strip and causes the warm phase change by the two links of temperature rise and drop, promotes the warm shape change, integrates the stress change, temperature change and other history parameters of the strip in the prior art into a multi-flux test platform to simulate the production process, and finally obtains a strip test piece closer to the actual working condition, thereby saving steps and simplifying equipment.

Description

Technical Field

[0001] This invention relates to the field of processing and forming technology for sheet and strip production, and in particular to a multi-throughput test method for the phenomenon of temperature-induced shape change in sheet and strip. Background Technology

[0002] To meet the dimensional and mechanical property requirements of strip products and overcome production challenges related to work hardening and high-temperature phase transformation, continuous annealing in the early and middle stages of cold rolling and controlled cooling in the later stages of hot rolling are essential processes in strip production. The quality and added value of these processes directly determine the quality of the strip products. The temperature control media used in continuous annealing and controlled cooling differ; the former primarily uses radiative heat transfer in the furnace zone to raise the strip temperature, while the latter uses convective heat transfer in the cooling medium to control the strip temperature drop. The temperature control in both stages causes stress release and thermo-induced phase transformation in the strip, further contributing to micro-scale changes in strip shape. Therefore, a common mechanism exists between these stages: thermo-induced shape change. To explore the mechanism of thermo-induced shape change, various experimental platforms and research methods have been proposed in the industry.

[0003] In the field of continuous annealing, Ansteel Beijing Research Institute (patent number CN202110518977.2) and Meishan Iron & Steel (patent number CN202107743 U) have successively proposed continuous annealing simulation devices for strips based on uniaxial tension. These devices can apply tensile stress along the length of the strip with the help of two clamping devices and perform continuous annealing treatment on the strip. Baosteel first proposed a continuous annealing process simulation device for strip steel with multiple heating chambers arranged vertically (patent number CN 1804621A). Subsequently, considering the problem of poor sealing at the connection under the linear layout of the heating chambers, a disc structure device was further proposed (patent number CN 101092660A). Inner Mongolia University of Science and Technology proposed a laboratory simulation continuous annealing furnace device with roller conveyors connecting the furnace areas in series (patent number CN 208667789 U). In terms of controlled cooling, Meigang proposed a strip cooling experimental device for hot rolling after application of water cooling under unidirectional tension (patent number CN 108097726A); Wuhan Iron and Steel proposed a device for simulating the cooling process after hot rolling, with a two-section structure of "heating furnace-cooling platform" as the core (patent number CN 111822527A).

[0004] The aforementioned devices are all capable of studying the temperature-induced shape changes of strips, but each has its limitations and problems: The forces applied to the rolls by the continuous annealing experimental platforms are mainly tensile stresses along the length, and the specimen width is limited by the device size. However, in actual production, the width of continuously annealed strips varies greatly, ranging from a minimum of 600mm to a maximum of 2500mm. Simulation experiments with narrow strips struggle to represent the changes in size, shape, and microstructure during the continuous annealing process of wide strips. Controlled cooling experimental platforms also largely suffer from this problem of narrow strips failing to characterize actual production conditions. If the narrow strip in the continuous annealing or controlled cooling experimental platform is considered as a single element of a wide strip, the applied unidirectional tensile force is insufficient to represent the interaction between adjacent elements, resulting in poor experimental results. Therefore, there is an urgent need for a multi-throughput experimental platform and method for studying the temperature-induced shape changes of strips, to simulate the stress changes during continuous annealing or post-rolling controlled cooling while simultaneously constructing tension, to simulate the temperature control process of strip components, and ultimately obtain relevant samples for performance analysis. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a multi-throughput test method for the phenomenon of temperature-induced deformation of strips, so as to solve the technical problem that the limited size of the test platform in the prior art leads to the limitation of the specimen width, making it difficult to simulate the deformation and property change of the specimen, and the technical problem that the test platform in the prior art is unable to express the interaction between adjacent elements when applying unidirectional tensile force.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] A multi-throughput testing method for detecting temperature-induced deformation changes in strip materials is disclosed. The method utilizes a multi-throughput testing platform, which includes a chamber containing an insulation device and a heating device. The insulation device contains either a heating element group or a cooling element group, with the strip sample placed between the heating element group and the cooling element group. The strip sample is equipped with strip element stress application devices in both its transverse and longitudinal directions, capable of applying stress to the strip sample. A temperature sensor is also provided on each strip element stress application device.

[0008] The method includes the following steps:

[0009] S1. Obtain the geometric parameters of the strip sample, and divide the strip region laterally according to the geometric parameters of the strip sample to obtain the region division result of the strip sample.

[0010] S2. Obtain the stress function of the strip sample based on the region division result of the strip sample, and assign the stress function to the stress application device group of the strip component of the strip sample.

[0011] S3. Set the preset temperature for rapid temperature rise of the plate, drive the heating device to heat the plate and strip sample, turn on the temperature sensor on the plate and strip component stress application device group, obtain the temperature of the plate and strip sample at each clamping point of the plate and strip component stress application device group during heating, and compare the obtained temperature of the plate and strip sample at the clamping point with the preset temperature for rapid temperature rise of the plate.

[0012] S4. Obtain the temperature rise history function or temperature fall history function of the strip sample. The temperature rise history includes: turning off the heating device, turning on the electric heating element group, obtaining the temperature of the strip sample at the clamping point of each strip group element stress application device group at this time, and comparing the obtained temperature of the strip sample at the clamping point with the temperature rise history function of the strip sample.

[0013] The temperature drop process includes: turning off the heating device, turning on the cooling element group, obtaining the temperature of the strip sample at the clamping point of each strip group element stress application device group, and comparing the obtained temperature of the strip sample at the clamping point with the temperature drop process function of the strip sample.

[0014] S5. After the temperature rise process or the temperature drop process is completed, the heating element group or cooling element group is turned off, and the microstructure properties of the strip sample are tested.

[0015] Preferably, the box body includes an upper box body and a lower box body, the heat preservation device is a hollow box body structure and the size of the heat preservation device box body structure is adapted to the size of the inner cavity of the box body, and the heat preservation device includes an upper box body heat preservation device and a lower box body heat preservation device, which are respectively installed in the upper box body and the lower box body.

[0016] Preferably, the upper housing and the upper housing insulation device have corresponding holes of the same size at the same position on their corresponding surfaces, and the two holes overlap and are connected; the lower housing and the lower housing insulation device have corresponding holes of the same size at the same position on their corresponding surfaces, and the two holes overlap and are connected; the heating device includes an upper housing heating device and a lower housing heating device, the upper housing heating device is installed in the hole between the upper housing and the upper housing insulation device, and the lower housing heating device is installed in the hole between the lower housing and the lower housing insulation device.

[0017] Preferably, the upper and lower heating devices are provided with heating elements on one side of the box body opposite to the box body, and the upper and lower heating devices are provided with cooling elements on the side away from the box body.

[0018] Preferably, both the upper and lower box insulation devices are equipped with four sets of heating elements. The four sets of heating elements in the upper box insulation device are symmetrically arranged in four directions and can be connected in series with each other. The four sets of heating elements in the lower box insulation device are symmetrically arranged in four directions and can be connected in series with each other. The plate and strip sample is placed between the four sets of heating elements in the upper and lower box insulation devices.

[0019] Preferably, both the upper and lower box insulation devices are provided with four sets of cooling element groups. The upper box insulation device has four sets of cooling element groups symmetrically arranged in four directions and the four sets of cooling element groups can be connected in series with each other. The lower box insulation device has four sets of cooling element groups symmetrically arranged in four directions and the four sets of cooling element groups can be connected in series with each other. The plate and strip sample is placed between the four sets of cooling element groups of the upper and lower box insulation devices.

[0020] Preferably, the stress application devices for the strip components in the transverse direction of the strip sample are symmetrical to each other, and the stress application devices for the strip components in the longitudinal direction of the strip sample are symmetrical to each other; each set of stress application devices for the strip components is provided with a pull rod, and the box body is provided with a reserved hole, through which the pull rod can extend out of the box body and move within the reserved hole; the temperature sensor can obtain the temperature of the strip sample.

[0021] Preferably, a temperature equalization component is provided between the heating element group and the strip sample; the strip group stress application device group clamps the strip sample from four directions respectively, and the temperature sensor is installed at each clamping point between the strip group stress application device group and the strip sample, and can measure the temperature at the four clamping points of the strip sample.

[0022] Preferably, when the method is applied to the continuous annealing process of the strip sample, the heat preservation device is equipped with an electric heating element group;

[0023] S1 includes:

[0024] Obtain the width B of the strip sample. ca Plate thickness H ca and the length L of the single roll of the strip sample ca With plate width B ca and plate thickness H ca The transverse region of the strip sample is divided based on this:

[0025] If B ca / (H caIf (×1000)<0.5, then the width direction of the strip sample is divided into 24 equal segments in the transverse direction;

[0026] If 0.5 ca / (H ca If (×1000)<1, then the width direction of the strip sample is divided into 36 equal segments in the transverse direction.

[0027] If 1 ca / (H ca If (×1000), then the width direction of the strip sample is divided into 72 equal segments in the transverse direction.

[0028] Based on the continuous heat treatment process parameter table corresponding to the strip sample, the continuous annealing speed v of the strip sample is selected. ca Calculate the continuous unwinding time t of a single roll of the strip sample. ca The continuous unloading time t of the strip sample ca The calculation formula is formula (1):

[0029] t ca =L ca / v ca (1)

[0030] S2 includes:

[0031] Based on the region division results of the strip specimen, the transverse stress function and longitudinal stress function of the strip specimen are obtained;

[0032] The value obtained by the transverse stress function of the strip specimen is the transverse tensile stress required by the strip component stress application device group on the transverse side of the strip specimen. The pull rod of the strip component stress application device group on the transverse side of the strip specimen is driven to apply transverse tensile stress to the strip specimen and to stretch the strip specimen laterally.

[0033] The value obtained from the longitudinal stress function of the strip specimen is the longitudinal tensile stress required by the strip component stress application device group in the longitudinal direction of the strip specimen. The pull rod of the strip component stress application device group in the longitudinal direction of the strip specimen is driven to apply longitudinal tensile stress to the strip specimen, thereby longitudinally stretching the strip specimen.

[0034] S3 includes:

[0035] The preset temperature T for rapid temperature rise of the plate is set. ca-set The upper and lower heating devices are driven with the same current parameters, activating the temperature sensor in the clamping portion of the strip component stress application device assembly. During the heating process, the temperature sensor continuously monitors and acquires the temperature of each clamped location of the strip sample after heating, including T.​​ca-6-11 T ca-6-21 T ca-6-31 and T ca-6-41 The average temperature at the four clamping points of the strip sample is calculated using formula (2):

[0036]

[0037] The average temperature of the four clamped points of the strip sample is calculated and compared with the preset temperature T for rapid temperature rise of the strip. ca-set Compare:

[0038] like Then maintain the current parameters of the upper and lower heating devices and continue heating;

[0039] like Then reduce the current parameters of the upper and lower heating devices to 50% of their original values ​​and continue heating;

[0040] like Then reduce the current parameters of the upper and lower heating devices to 20% of their original values ​​and enter the heat preservation state;

[0041] S4 includes:

[0042] Based on the continuous heat treatment process parameter table corresponding to the strip sample, obtain the temperature rise history function T of the strip sample. ca(t) During the temperature rise process, the temperature sensor continuously monitors and acquires the temperature at each clamping point of the strip sample, including T. ca-6-12 T ca-6-22 T ca-6-32 and T ca-6-42 To calculate the average temperature of the four clamped points of the strip sample during the temperature rise process, the formula for calculating the average temperature of the four clamped points of the strip sample during the temperature rise process is formula (3).

[0043]

[0044] The average temperature of the four clamped locations of the strip sample during the calculated temperature rise process is compared with the temperature rise process function T of the strip sample. ca(t) Compare:

[0045] In t∈[0,t ca ] within, if If the actual temperature rise inside the box does not match the temperature rise history, the power parameters of the heating element group inside the upper box and the lower box will be increased to 120% of the original value.

[0046] In t∈[0,t ca ] within, if The actual temperature rise inside the chamber matches the temperature rise history well, maintaining the power parameters of the heating element group inside the upper and lower chambers.

[0047] Preferably, when the method is applied to the post-rolling cold production process of the strip sample, the heat preservation device is equipped with a cooling element group;

[0048] S101 includes:

[0049] Obtain the width B of the strip sample. ca Plate thickness H ca and the length L of the single roll of the strip sample ca With plate width B ca and plate thickness H ca The transverse region of the strip sample is divided based on this:

[0050] If B ca / (H ca If (×1000)<0.5, then the width direction of the strip sample is divided into 24 equal segments in the transverse direction;

[0051] If 0.5 ca / (H ca If (×1000)<1, then the width direction of the strip sample is divided into 36 equal segments in the transverse direction.

[0052] If 1 ca / (H ca If (×1000), then the width direction of the strip sample is divided into 72 equal segments in the transverse direction.

[0053] Based on the lamination process parameter table corresponding to the strip sample, the lamination speed v of the strip sample is selected. co Calculate the plate cooling time t of a single roll of the strip sample. co The plate-and-strip sample's cooling time t co The calculation formula is formula (4):

[0054] t co =L ca / v co (4)

[0055] S102 includes:

[0056] Based on the region division results of the strip specimen, the transverse stress function and longitudinal stress function of the strip specimen are obtained;

[0057] ​​The value obtained by the transverse stress function of the strip specimen is the transverse tensile stress required by the strip component stress application device group on the transverse side of the strip specimen. The pull rod of the strip component stress application device group on the transverse side of the strip specimen is driven to apply transverse tensile stress to the strip specimen and to stretch the strip specimen laterally.

[0058] The value obtained from the longitudinal stress function of the strip specimen is the longitudinal tensile stress required by the strip component stress application device group in the longitudinal direction of the strip specimen. The pull rod of the strip component stress application device group in the longitudinal direction of the strip specimen is driven to apply longitudinal tensile stress to the strip specimen, thereby longitudinally stretching the strip specimen.

[0059] S103 includes:

[0060] The preset temperature T for rapid temperature rise of the plate is set. co-set The upper and lower heating devices are driven with the same current parameters, activating the temperature sensor in the clamping portion of the strip component stress application device assembly. During the heating process, the temperature sensor continuously monitors and acquires the temperature of each clamped location of the strip sample after heating, including T. co-6-11 T co-6-21 T co-6-31 and T co-6-41 The average temperature at the four clamping points of the strip sample is calculated using formula (5):

[0061]

[0062] The average temperature of the four clamped points of the strip sample is calculated and compared with the preset temperature T for rapid temperature rise of the strip. co-set Compare:

[0063] like Then maintain the current parameters of the upper and lower heating devices and continue heating;

[0064] like Then reduce the current parameters of the upper and lower heating devices to 50% of their original values ​​and continue heating;

[0065] like Then reduce the current parameters of the upper and lower heating devices to 20% of their original values ​​and enter the heat preservation state;

[0066] S104 includes:

[0067] Based on the laminar cooling process parameter table corresponding to the strip sample, obtain the temperature drop history function T of the strip sample.co(t) During the temperature drop process, the temperature sensor continuously monitors and acquires the temperature at each clamping point of the strip sample, including T. co-6-12 T co-6-22 T co-6-32 and T co-6-42 To calculate the average temperature of the four clamped points of the strip sample during the temperature drop process, the formula for calculating the average temperature of the four clamped points of the strip sample during the temperature drop process is formula (6).

[0068]

[0069] The average temperature of the four clamping points of the strip sample during the calculated temperature drop process is compared with the temperature drop process function T of the strip sample. co(t) Compare:

[0070] In t∈[0,t co ] within, if If the actual temperature drop inside the box does not match the temperature drop history, the cooling power parameter of the cooling element group inside the upper box and the lower box will be increased to 120% of the original value.

[0071] In t∈[0,t co ] within, if The actual temperature drop inside the box matches the temperature drop history well, maintaining the cooling power parameters of the cooling element group inside the upper and lower boxes.

[0072] Compared with the prior art, the present invention has at least the following beneficial effects:

[0073] The above scheme is based on electromagnetics, heat transfer, and mechanics, and takes the metal components of strip as the research object. It can simulate the stress and temperature field changes of strip components during continuous annealing or controlled cooling after rolling. The stress and temperature changes experienced by strip components in actual production are incorporated into the multi-throughput test platform for production process simulation. Finally, strip specimens that are closer to actual working conditions can be obtained, which is suitable for research on temperature-induced shape and performance changes of strip materials.

[0074] This invention mainly includes two functions: a shape change test function for strip during temperature rise and a shape change test function for strip during temperature drop. The shape change test function for temperature rise corresponds to simulating the continuous annealing process of strip; the shape change test function for temperature drop corresponds to simulating the controlled cooling process after strip rolling. The test platform structures for both functions are basically the same, with only local differences in the temperature control elements. This simplifies the steps and equipment structure, making it applicable to larger strip sizes and allowing for multi-directional stress application to ensure good interaction between adjacent strip elements. Attached Figure Description

[0075] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present disclosure and, together with the specification, further serve to explain the principles of the present disclosure and enable those skilled in the art to implement and use the present disclosure.

[0076] Figure 1 This is an overall structural diagram of a multi-throughput testing platform for a multi-throughput testing method for the temperature-induced shape change phenomenon of strips and plates according to an embodiment of the present invention.

[0077] Figure 2 This is an exploded view of the structure of a multi-throughput testing platform for a multi-throughput testing method for the temperature-induced deformation phenomenon of strips and plates, according to an embodiment of the present invention.

[0078] Figure 3 This is a partially enlarged view of the stress application device for the strip component of a multi-throughput test platform for a multi-throughput test method targeting the temperature-induced deformation change phenomenon of strip according to an embodiment of the present invention.

[0079] Figure 4 This is a schematic diagram of the upper and lower chamber structures of a multi-throughput test platform for a multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to an embodiment of the present invention.

[0080] Figure 5 This is a schematic diagram of the upper and lower chamber heating devices of a multi-throughput test platform for a multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates, according to an embodiment of the present invention.

[0081] Figure 6 This is a schematic diagram of the upper and lower box heating element group structure of a multi-throughput test platform for a multi-throughput test method for the temperature-induced deformation change phenomenon of strips and plates according to an embodiment of the present invention.

[0082] Figure 7 This is a schematic diagram of the upper and lower chamber temperature equalization plate structure of a multi-throughput test platform for a multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to an embodiment of the present invention.

[0083] Figure 8 This is a schematic diagram of the clamp of the stress application device for the strip component of a multi-throughput test platform for a multi-throughput test method for the temperature-induced deformation change phenomenon of strip according to an embodiment of the present invention.

[0084] Figure 9 This is a schematic diagram of a strip sample on a multi-throughput testing platform for a multi-throughput testing method for temperature-induced shape changes in strips, according to an embodiment of the present invention.

[0085] Figure 10This is a schematic diagram of the upper and lower cooling element groups of a multi-throughput test platform for a multi-throughput test method for detecting temperature-induced deformation changes in strips, according to an embodiment of the present invention.

[0086] [Figure Labels]

[0087] 1. Upper chamber induction heating device; 2. Upper chamber; 3. Upper chamber insulation cotton; 4. Upper chamber silicon carbide rod assembly; 5. Upper chamber uniform temperature copper plate; 6. Plate and strip component stress application device assembly; 7. Plate and strip sample; 8. Lower chamber uniform temperature copper plate; 9. Lower chamber silicon carbide rod assembly; 10. Lower chamber insulation cotton; 11. Lower chamber; 12. Lower chamber induction heating device; 6-1. First plate and strip component stress application device; 6-2. Second plate and strip component stress application device; 6-3. Third plate and strip component stress application device; 6-4. Fourth plate and strip component stress application device; 13. Upper chamber cooling radiator; 14. Lower chamber cooling radiator.

[0088] As shown in the figure, specific structures and devices are labeled in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation

[0089] The following describes in detail a multi-flux test method for addressing temperature-induced shape changes in strips provided by the present invention, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0090] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0091] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0092] It is understood that the meanings of “on”, “above” and “above” in this disclosure should be interpreted in the broadest sense, such that “on” means not only “directly on” something, but also includes something with an intermediary feature or layer, and that “above” or “above” means not only “on” something, but also includes something “above” or “above” without an intermediary feature or layer.

[0093] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0094] like Figures 1-10 As shown, this application provides a multi-throughput test method for the phenomenon of temperature-induced shape change in strips.

[0095] like Figures 1-10 As shown, the multi-throughput test platform used in the method for the temperature-induced shape change phenomenon of strip includes a box, which is divided into an upper box 2 and a lower box 11, both of which are hollow box structures. The box is equipped with a heat preservation device and a heating device. In this embodiment, the preferred heat preservation device includes upper box insulation cotton 3 and lower box insulation cotton 10, both of which are made of high-temperature resistant fireproof cotton. The heating device includes upper box induction heating device 1 and lower box induction heating device 12. After the upper box insulation cotton 3 and lower box insulation cotton 10 are compacted, they present a hollow box structure, and the size of their outer box structure corresponds to the size of the inner box cavity of the upper box 2 and the lower box 11, respectively. The upper box insulation cotton 3 is installed in the inner cavity of the upper box 2, and the lower box insulation cotton 10 is installed in the inner cavity of the lower box 11.

[0096] like Figures 1-5As shown, the cavities of the upper box 2 and the upper box insulation cotton 3 face downwards, while the cavities of the lower box 11 and the lower box insulation cotton 10 face upwards; the top contact surfaces of the upper box 2 and the upper box insulation cotton 3 have holes of the same size and shape at the same position, and the two holes overlap and are connected; the bottom contact surfaces of the lower box 11 and the lower box insulation cotton 10 have holes of the same size and shape at the same position, and the two holes overlap and are connected; an upper box induction heating device 1 is installed in the through holes of the upper box 2 and the upper box insulation cotton 3, and a lower box induction heating device 12 is installed in the through holes of the lower box 11 and the lower box insulation cotton 10. A heating element is installed on one side of the upper box induction heating device 1 relative to the upper box 2, and a cooling element is installed on the side of the upper box induction heating device 1 away from the upper box 2; a heating element is installed on one side of the lower box induction heating device 12 relative to the lower box 11. In this embodiment, the heating element is preferably a vortex induction coil. A cooling element is installed on the side of the lower box induction heating device 12 away from the lower box 11. In this embodiment, the cooling element is preferably a coil and a water circuit. The vortex induction coil is made of hollow copper tube, and its outer side is energized to form induction heating. The water circuit is used to cool the copper tube, which can prevent the copper tube from melting during the induction heating process.

[0097] like Figures 6-7 As shown, the multi-throughput test platform has two functions: one for the continuous strip annealing production process and the other for the post-rolling cold production process of strip. When the multi-throughput test platform is used for the continuous strip annealing production process, it mainly uses furnace zone radiation heat exchange to promote the temperature rise of the strip. The upper box insulation cotton 3 and the lower box insulation cotton 10 are equipped with multiple sets of detachable electric heating elements. In this embodiment, four sets of electric heating elements are preferred. The preferred sets of electric heating elements in this embodiment are silicon carbide rod sets, namely upper box silicon carbide rod set 4 and lower box silicon carbide rod set 9. Four sets of upper box silicon carbide rod sets 4 are symmetrically arranged in four directions in the upper box insulation cotton 3 and are connected in series with each other. Four sets of lower box silicon carbide rod sets 9 are symmetrically arranged in four directions in the lower box insulation cotton 10 and are connected in series with each other. The four directional sections adopt multi-segment integrated silicon carbide rods, which can be controlled in series under the drive of external power supply. A strip sample 7 is placed between the four upper box silicon carbide rod groups 4 and the four lower box silicon carbide rod groups 9.

[0098] like Figures 6-7As shown, in this embodiment of the application, a temperature equalization component is provided between the heating element assembly and the strip sample 7. In this embodiment, the components are preferably an upper housing temperature equalization copper plate 5 and a lower housing temperature equalization copper plate 8. The upper housing silicon carbide rod assembly 4 is provided between the upper housing temperature equalization copper plate 5 and the strip sample 7, and the lower housing silicon carbide rod assembly 9 is provided between the lower housing temperature equalization copper plate 8 and the strip sample 7. The temperature equalization component is used for temperature equalization inside the device. The upper housing temperature equalization copper plate 5 and the lower housing temperature equalization copper plate 8 are provided with heat dissipation fins on the side near the strip sample 7. The fins adopt a long strip structure, and their material is also the same copper material as the temperature equalization copper plate to ensure that the fins and the copper plate have similar heat transfer capabilities.

[0099] like Figure 10 As shown, when the multi-throughput test platform is used for the cold production process of strip after rolling, the convective heat transfer of the cooling medium is used to control the temperature drop of the strip. Multiple sets of cooling elements can be detachably installed in both the upper box insulation cotton 3 and the lower box insulation cotton 10. In this embodiment, four sets of cooling elements are preferred. The preferred cooling element sets in this embodiment are cooling rows 13 in the upper box and 14 in the lower box. Four sets of upper box cooling rows 13 are symmetrically arranged in four directions in the upper box insulation cotton 3 and connected in series with each other. Four sets of lower box cooling rows 14 are symmetrically arranged in four directions in the lower box insulation cotton 10 and connected in series with each other. A strip sample 7 is placed between the four sets of upper box cooling rows 13 and lower box cooling rows 14.

[0100] like Figure 3 , Figures 8-9 As shown, the strip specimen 7 of the multi-throughput testing platform is equipped with strip component stress application device groups 6 in both the transverse and longitudinal directions, meaning that strip component stress application device groups 6 are provided in all four directions of the strip specimen 7. The longitudinal strip component stress application device group 6 of the strip specimen 7 includes a first strip component stress application device 6-1 and a fourth strip component stress application device 6-4, which are in the same corresponding position and symmetrical to each other. The transverse strip component stress application device group 6 of the strip specimen 7 includes a second strip component stress application device 6-2 and a third strip component stress application device 6-3, which are in the same corresponding position and symmetrical to each other. The four groups of strip component stress application device groups 6 clamp the strip specimen 7 from four directions, and a temperature sensor is provided at each of the four clamping points. At the clamping part of each group of strip component stress application device groups 6, multiple through holes are provided at equal intervals along the width direction, which correspond to the edge slots of the strip specimen 7, facilitating the installation of fixing bolts to ensure that the tensile force can be transmitted to the strip specimen 7. Temperature sensors are installed at the clamping head of the clamping part to monitor the temperature of each clamped part of the strip sample 7 in real time.

[0101] like Figure 9As shown, the strip specimen 7 is prepared using actual manufactured strip, with its width equal to its length, to ensure that the test process can simulate the stress state of the strip during production. The strip specimen 7 has multiple through holes in both its width and length directions, corresponding to the clamping through holes of the stress application device 6 for each strip component. During the test, stress loading and heating operations can be directly applied to the strip specimen 7. After the test is completed, according to Saint-Venant's principle, a square specimen from the central region of the strip specimen 7 is selected as the specimen for subsequent material property analysis, thus avoiding the influence of the openings at the edges of the strip specimen 7 on local force energy differences in the specimen.

[0102] like Figure 3 As shown, each set of strip component stress application device group 6 is equipped with a tie rod. The strip component stress application device group 6, which is aligned in four directions of the strip sample 7, can be driven by an external controller to form tensile stress in both the transverse and longitudinal directions, so as to simulate the biaxial stress of the strip component during the continuous annealing process or the cold production process after rolling.

[0103] like Figures 1-3 As shown, the four side mounting surfaces of the upper housing 2 and the lower housing 11 are provided with pre-drilled cylindrical grooves that match the tie rods. These grooves serve as the moving space for the tie rods of the strip component stress application device group 6. The tie rods can extend out of the housing through the pre-drilled holes and move within them. By pulling the tie rods of the strip component stress application device group 6, stress can be applied to the strip sample 7. Each group of silicon carbide rods has a pre-drilled hole in its central area that matches the tie rod. The size of this hole is the same as the size of the pre-drilled holes in the upper housing 2 and the lower housing 11, and both serve as the moving space for the tie rods of the strip component stress application device group 6.

[0104] like Figure 10 As shown, in the morphological change test function of the strip sample 7 during the temperature drop process, the upper chamber uniform temperature plate 5 and the upper chamber silicon carbide rod group 4, and the lower chamber uniform temperature copper plate 8 and the upper chamber silicon carbide rod group 9 in the multi-throughput experimental platform are replaced with the upper chamber cooling radiator 13 and the lower chamber cooling radiator 14, respectively. The structure of the rest of the device remains the same as the multi-throughput experimental platform device for the strip temperature rise process. The upper chamber cooling radiator 13 and the lower chamber cooling radiator 14 are wrapped with magnetic shielding material to prevent the cooling radiators from being inductively heated during the temperature drop process of the strip sample 7.

[0105] A multi-flux test method for addressing the temperature-induced shape change phenomenon of strips and sheets, the method comprising the following steps:

[0106] For the continuous annealing production process of strip sample 7:

[0107] S1. Obtain the width B of the strip sample 7. ca Plate thickness H ca and the length L of the single roll of sheet metal sample 7 ca With plate width B caand plate thickness H ca Based on this, the transverse region of the strip sample 7 is divided:

[0108] If B ca / (H ca If (×1000)<0.5, then the width of the strip sample 7 is divided into 24 segments at equal intervals in the transverse direction;

[0109] If 0.5 ca / (H ca If (×1000)<1, then the width direction of the strip sample 7 is divided into 36 equal segments in the transverse direction.

[0110] If 1 ca / (H ca ×1000), then the width direction of the strip sample 7 is divided into 72 segments at equal intervals in the transverse direction;

[0111] Based on the continuous heat treatment process parameter table corresponding to the strip sample, the continuous annealing speed v of the strip sample is selected. ca Calculate the continuous unwinding time t for single-roll plate sample 7. ca The continuous unloading time t of the strip sample 7 ca The calculation formula is formula (1):

[0112] t ca =L ca / v ca (1)

[0113] S2. Obtain the transverse stress function p of the strip specimen 7 based on the region division results. ca-t (t) and longitudinal stress function p ca-l (t), where 0 <t<t ca ;

[0114] The so-called transverse stress function and longitudinal stress function are both input quantities of this multi-throughput testing method. The transverse stress distribution function can be understood as the transverse distribution of tensile stress, i.e., the total tension distributed across the strip cross-section in the form of a plate profile curve. The longitudinal stress function, on the other hand, is due to the uneven distribution of the total tension in the transverse direction, resulting in corresponding shear forces in each element of the strip. These shear forces manifest as longitudinal stress on the component strip. Therefore, the strip sample 7 involved in the multi-throughput testing platform of this application is always subjected to a biaxial stress state, namely transverse stress and longitudinal stress. This part belongs to the prior art and will not be elaborated further here.

[0115] ​​The transverse stress function of the strip specimen 7 is calculated to be the transverse tensile stress required by the second strip component stress application device 6-2 and the third strip component stress application device 6-3 in the transverse direction of the strip specimen 7. This drives the tie rods on the second strip component stress application device 6-2 and the third strip component stress application device 6-3, thereby applying transverse tensile stress to the strip specimen 7 and stretching the strip specimen 7 in the transverse direction.

[0116] The longitudinal stress function of the strip specimen 7 is calculated to be the longitudinal tensile stress required by the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 in the longitudinal direction of the strip specimen 7. The pull rods on the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 are driven to apply longitudinal tensile stress to the strip specimen 7, thus stretching the strip specimen 7 longitudinally.

[0117] S3, Set the board temperature for rapid heating to preset temperature T ca-set The upper chamber induction heating device 1 and the lower chamber induction heating device 12 are driven with the same current parameters to induction heat the strip sample 7. The temperature sensor of the clamping part of the strip component stress application device group 6 is activated. During the heating process, the temperature sensor continuously monitors and acquires the temperature of each clamping point of the strip sample 7 by the strip component stress application device group 6 after heating, including T. ca-6-11 T ca-6-21 T ca-6-31 and T ca-6-41 To calculate the average temperature at the four clamping points of the strip sample 7, the formula for calculating the average temperature at the four clamping points of the strip sample 7 is formula (2):

[0118]

[0119] The average temperature of the four clamped points of the strip sample 7 was calculated and compared with the preset temperature T for rapid temperature rise of the strip. ca-set Compare:

[0120] like Since the plate and strip sample 7 has not yet reached the preset temperature, the current parameters of the upper box induction heating device 1 and the lower box induction heating device 12 are maintained to continue heating.

[0121] like When the temperature of the plate and strip sample 7 is close to the preset temperature, reduce the current parameters of the upper box induction heating device 1 and the lower box induction heating device 12 to 50% of the original value and continue heating.

[0122] like If the plate and strip sample 7 reaches the preset temperature, the current parameters of the upper box induction heating device 1 and the lower box induction heating device 12 are reduced to 20% of the original value, and the sample enters the heat preservation state.

[0123] S4. Based on the actual production line conditions and the continuous heat treatment process parameter table corresponding to strip sample 7, obtain the temperature rise history function T of strip sample 7. ca(t) The temperature rise process includes: turning off the upper chamber induction heating device 1 and the lower chamber induction heating device 12, and turning on the upper chamber silicon carbide rod group 4 and the lower chamber silicon carbide rod group 9. During the temperature rise process, the temperature sensor continuously monitors and acquires the temperature of the strip sample 7 at the clamping point of each strip group element stress application device group 6, including T. ca-6-12 T ca-6-22 T ca-6-32 and T ca-6-42 To calculate the average temperature of the four clamped points of the strip sample 7 during the temperature rise process, the formula for calculating the average temperature of the four clamped points of the strip sample 7 during the temperature rise process is formula (3).

[0124]

[0125] The average temperature of the four clamped locations of the strip sample 7 during the calculated temperature rise process is compared with the temperature rise process function T of the strip sample 7. ca(t) Compare:

[0126] In t∈[0,t ca ] within, if The actual temperature rise inside the chamber is poorly matched with the temperature rise history, so the power parameters of the upper chamber silicon carbide rod group 4 and the lower chamber silicon carbide rod group 9 need to be increased to 120% of the original value.

[0127] In t∈[0,t ca ] within, if The actual temperature rise inside the chamber matches the temperature rise history well, and the power parameters of the upper chamber silicon carbide rod group 4 and the lower chamber silicon carbide rod group 9 are maintained and adjusted.

[0128] S5. After the temperature rise process is completed, close the upper chamber silicon carbide rod group 4 and the lower chamber silicon carbide rod group 9, disassemble the plate and strip unit stress application device group 6 and the plate and strip sample 7, and perform microstructure performance testing on the plate and strip sample 7.

[0129] For the cold production process of the strip sample 7 after rolling:

[0130] S101. Obtain the width B of the strip sample 7. ca Plate thickness H ca and single roll plate strip sample 7 length L ca With plate width B ca and plate thickness H ca Based on this, the transverse region of the strip sample 7 is divided:

[0131] If B ca / (H caIf (×1000)<0.5, then the width of the strip sample 7 is divided into 24 segments at equal intervals in the transverse direction;

[0132] If 0.5 ca / (H ca If (×1000)<1, then the width direction of the strip sample 7 is divided into 36 equal segments in the transverse direction.

[0133] If 1 ca / (H ca ×1000), then the width direction of the strip sample 7 is divided into 72 segments at equal intervals in the transverse direction;

[0134] Based on the lamination process parameter table corresponding to the strip sample, the lamination speed v of the strip sample is selected. co Calculate the cooling time t of the single-roll plate sample 7. co The cooling time t of plate and strip sample 7 co The calculation formula is formula (4):

[0135] t co =L ca / v co (4)

[0136] S102. Obtain the transverse stress function p of the strip specimen 7 based on the region division results. co-t (t) and longitudinal stress function p co-t (t), where 0 <t<t co ;

[0137] The transverse stress function of the strip specimen 7 is calculated to be the transverse tensile stress required by the second strip component stress application device 6-2 and the third strip component stress application device 6-3 in the transverse direction of the strip specimen 7. This drives the tie rods on the second strip component stress application device 6-2 and the third strip component stress application device 6-3, thereby applying transverse tensile stress to the strip specimen 7 and stretching the strip specimen 7 in the transverse direction.

[0138] The longitudinal stress function of the strip specimen 7 is calculated to be the longitudinal tensile stress required by the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 in the longitudinal direction of the strip specimen 7. The pull rods on the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 are driven to apply longitudinal tensile stress to the strip specimen 7, thus stretching the strip specimen 7 longitudinally.

[0139] S103, Set the preset temperature T for rapid board temperature rise co-set ​​The upper chamber induction heating device 1 and the lower chamber induction heating device 12 are driven with the same current parameters to induction heat the strip sample 7. The temperature sensor of the clamping part of the strip component stress application device group 6 is activated. During the heating process, the temperature sensor continuously monitors and acquires the temperature of each clamping point of the strip sample 7 by the strip component stress application device group 6 after heating, including T. co-6-11 T co-6-21 T co-6-31 and T co-6-41 To calculate the average temperature at the four clamping points of the strip sample 7, the formula for calculating the average temperature at the four clamping points of the strip sample 7 is formula (5):

[0140]

[0141] The average temperature of the four clamped points of the strip sample 7 was calculated and compared with the preset temperature T for rapid temperature rise of the strip. co-set Compare:

[0142] like Since the plate and strip sample 7 has not yet reached the preset temperature, the current parameters of the upper box induction heating device 1 and the lower box induction heating device 12 are maintained to continue heating.

[0143] like When the temperature of the plate and strip sample 7 is close to the preset temperature, reduce the current parameters of the upper box induction heating device 1 and the lower box induction heating device 12 to 50% of the original value and continue heating.

[0144] like If the plate and strip sample 7 reaches the preset temperature, the current parameters of the upper box induction heating device 1 and the lower box induction heating device 12 are reduced to 20% of the original value, and the sample enters the heat preservation state.

[0145] S104. Based on the actual production line conditions and the sheet cooling process parameter table corresponding to strip sample 7, obtain the temperature drop history function T of strip sample 7. co(t) The temperature drop process includes: turning off the upper chamber induction heating device 1 and the lower chamber induction heating device 12, and turning on the upper chamber cooling vent 13 and the lower chamber cooling vent 14. During the temperature drop process, the temperature sensor continuously monitors and acquires the temperature of the strip sample 7 at the clamping point of each strip component stress application device group 6, including T. co-6-12 T co-6-22 T co-6-32 and T co-6-42 To calculate the average temperature of the four clamped points of the strip sample 7 during the temperature drop process, the formula for calculating the average temperature of the four clamped points of the strip sample 7 during the temperature drop process is formula (6).

[0146]

[0147] The average temperature of the four clamped points of the strip sample 7 during the calculated temperature drop process is compared with the temperature drop process function T of the strip sample 7. co(t) Compare:

[0148] In t∈[0,t co ] within, if If the actual temperature drop inside the box does not match the temperature drop history, the cooling power parameters of the upper box cooling radiator 13 and the lower box cooling radiator 14 need to be increased to 120% of the original value.

[0149] In t∈[0,t co ] within, if The actual temperature drop inside the box matches the temperature drop history well. The cooling power parameters of the upper cooling radiator 13 and the lower cooling radiator 14 are maintained and adjusted.

[0150] S105. After the temperature drop process is completed, close the upper chamber cooling vent 13 and the lower chamber cooling vent 14, disassemble the strip component stress application device group 6 and the strip sample 7, and perform microstructure performance testing on the strip sample 7.

[0151] Example 1

[0152] S1. For the continuous annealing production process of strip sample 7, obtain the strip width B of strip sample 7. ca =1250mm, plate thickness H ca =4.3mm single roll plate with sample 7 length L ca =1000mm; Divide the plate and strip sample into 7 transverse regions, if B ca / (H ca ×1000)=0.291<0.5, therefore the strip sample 7 is divided into 24 segments at equal intervals in the transverse direction of its width; according to the continuous annealing speed v ca =30m / min, calculate the continuous unwinding time t for a single roll of plate and strip sample 7. ca =L ca / v ca = 33min.

[0153] S2. Based on the region division results of the strip specimen 7, obtain the transverse stress function pca-t(t) = -0.557t + 132.7 and the longitudinal stress function p of the strip specimen 7. ca-l (t) = 0.73t² - 15t + 207.3, where 0 <t<33min;

[0154] The transverse stress function of the strip specimen 7 is calculated to be the transverse tensile stress required by the second strip component stress application device 6-2 and the third strip component stress application device 6-3 in the transverse direction of the strip specimen 7. This drives the tie rods on the second strip component stress application device 6-2 and the third strip component stress application device 6-3, thereby applying transverse tensile stress to the strip specimen 7 and stretching the strip specimen 7 in the transverse direction.

[0155] The longitudinal stress function of the strip specimen 7 is calculated to be the longitudinal tensile stress required by the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 in the longitudinal direction of the strip specimen 7. The pull rods on the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 are driven to apply longitudinal tensile stress to the strip specimen 7, thus stretching the strip specimen 7 longitudinally.

[0156] S3, Set the board temperature for rapid heating to preset temperature T ca-set =370℃; with the same current parameters, the upper chamber induction heating device 1 and the lower chamber induction heating device 12 are driven to induction heat the strip sample 7; during the heating process, the temperature sensor constantly monitors and re-acquires the temperature at each clamping point of the strip sample 7 held by the strip component stress application device group 6 after heating, including T ca-6-11 T ca-6-21 T ca-6-31 and T ca-6-41 The average temperature of the four clamped points of the strip sample 7 was calculated and compared with the preset temperature T for rapid temperature rise of the strip. ca-set Compare.

[0157] Adjust for 3 minutes. If the preset temperature is reached, the current parameters of the upper chamber induction heating device 1 and the lower chamber induction heating device 12 need to be reduced to 20% of their original values, and the device should enter the heat preservation state.

[0158] S4. Based on the actual production line conditions, obtain the temperature rise history function T of the strip sample 7. ca (t)=1.68t 2 +15.9t+370; The upper chamber induction heating device 1 and the lower chamber induction heating device 12 are shut down, and the upper chamber silicon carbide rod group 4 and the lower chamber silicon carbide rod group 9 are turned on. During the temperature rise process, the temperature sensor constantly monitors and acquires the temperature of the strip sample 7 at the clamping point of each strip group element stress application device group 6, including T. ca-6-12 T ca-6-22 T ca-6-32 and T ca-6-42 The average temperature of the four clamped locations of the strip sample 7 during the temperature rise process is compared with the temperature rise process function T of the strip sample 7. ca(t) Compare.

[0159] Throughout the process, The actual temperature rise inside the chamber matches the temperature rise process well, and further adjustments can be made.

[0160] Step S5: After the temperature rise process is completed, shut down the upper chamber silicon carbide rod group 4 and the lower chamber silicon carbide rod group 9, and unload the plate and strip unit stress application device group 6. Disassemble and obtain the plate and strip specimen 7 for microstructure performance testing.

[0161] Example 2

[0162] For the cold production process of the strip sample 7 after rolling:

[0163] S101. Obtain the width B of the strip sample 7. ca =1250mm, plate thickness H ca =4.3mm and single roll plate strip sample 7 length L ca =1000mm; Divide the plate and strip sample into 7 transverse regions: If B ca / (H ca Since (×1000)=0.291<0.5, the strip sample 7 is divided into 24 equally spaced segments in the transverse direction of its width. Furthermore, the speed v of the cooling plate also needs to be considered. co =20m / s, calculate the continuous unwinding time t of a single roll of strip. co =L ca / v co =50s.

[0164] S102. Obtain the transverse stress function p of the strip specimen 7 based on the region division results. co-t (t) = -0.007t + 48.1 and longitudinal stress function p co-t (t)=0.0035t 2 -0.73t+75.6, where 0 <t<50s;

[0165] The transverse stress function of the strip specimen 7 is calculated to be the transverse tensile stress required by the second strip component stress application device 6-2 and the third strip component stress application device 6-3 in the transverse direction of the strip specimen 7. This drives the tie rods on the second strip component stress application device 6-2 and the third strip component stress application device 6-3, thereby applying transverse tensile stress to the strip specimen 7 and stretching the strip specimen 7 in the transverse direction.

[0166] The longitudinal stress function of the strip specimen 7 is calculated to be the longitudinal tensile stress required by the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 in the longitudinal direction of the strip specimen 7. The pull rods on the first strip component stress application device 6-1 and the fourth strip component stress application device 6-4 are driven to apply longitudinal tensile stress to the strip specimen 7, thus stretching the strip specimen 7 longitudinally.

[0167] S103, Set the preset temperature T for rapid board temperature rise co-set =900℃, with the same current parameters, the upper chamber induction heating device 1 and the lower chamber induction heating device 12 are driven to induction heat the strip sample 7; during the heating process, the temperature sensor constantly monitors and re-acquires the temperature of each clamping point of the strip sample 7 held by the strip component stress application device group 6 after heating, including T co-6-11 T co-6-21 T co-6-31 and T co-6-41 The average temperature of the four clamped points of the strip sample 7 was calculated and compared with the preset temperature T for rapid temperature rise of the strip. co-set Compare;

[0168] S104. Based on the actual production line conditions, obtain the temperature drop history function T of the strip sample 7. co(t) =-23.6t+900; Turn off the upper chamber induction heating device 1 and the lower chamber induction heating device 12, and turn on the upper chamber cooling vent 13 and the lower chamber cooling vent 14. During the temperature drop process, the temperature sensor constantly monitors and acquires the temperature of the strip sample 7 at the clamping point of each strip component stress application device group 6, including T co-6-12 T co-6-22 T co-6-32 and T co-6-42 The average temperature of the four clamped points of the strip sample 7 during the temperature drop process is calculated and compared with the temperature drop process function T of the strip sample 7. co(t) Compare.

[0169] The actual temperature drop inside the chamber matches the temperature drop history well, and further adjustments can be made.

[0170] S105. After the temperature drop process is completed, shut down the upper chamber cooling radiator 13 and the lower chamber cooling radiator 14, and unload the plate and strip component stress application device group 6. Disassemble and obtain the plate and strip specimen 7 for structural performance testing.

[0171] The technical advantage of this invention is that, based on electromagnetics, heat transfer, and mechanics, and taking the metal components of strip as the research object, it can simulate the stress and temperature field changes of strip components during continuous annealing or controlled cooling after rolling. It incorporates the stress and temperature changes experienced by strip components in actual production into a multi-throughput test platform for production process simulation, ultimately obtaining strip specimens that are closer to actual working conditions. This invention is suitable for research on temperature-induced shape and performance changes of strip materials.

[0172] This invention mainly includes two functions: a shape change test function for strip during temperature rise and a shape change test function for strip during temperature drop. The shape change test function for temperature rise corresponds to simulating the continuous annealing process of strip; the shape change test function for temperature drop corresponds to simulating the controlled cooling process after strip rolling. The test platform structures for both functions are basically the same, with only local differences in the temperature control elements. This simplifies the steps and equipment structure, making it applicable to larger strip sizes and allowing for multi-directional stress application to ensure good interaction between adjacent strip elements.

[0173] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary confusion regarding the nature of the invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0174] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A multi-flux test method for the temperature-induced shape change phenomenon of strips, characterized in that, The method utilizes a multi-throughput testing platform, which includes a chamber containing an insulation device and a heating device. The insulation device contains either a heating element group or a cooling element group, with a strip sample placed between the heating element group and the cooling element group. The strip sample is equipped with strip element stress application devices in both its transverse and longitudinal directions, which can apply stress to the strip sample. A temperature sensor is also provided on the strip element stress application devices. The method includes the following steps: S1. Obtain the geometric parameters of the strip sample, and divide the strip region laterally according to the geometric parameters of the strip sample to obtain the region division result of the strip sample. S2. Obtain the stress function of the strip sample based on the region division result of the strip sample, and assign the stress function to the stress application device group of the strip component of the strip sample. S3. Set the preset temperature for rapid temperature rise of the plate, drive the heating device to heat the plate and strip sample, turn on the temperature sensor on the plate and strip component stress application device group, obtain the temperature of the plate and strip sample at each clamping point of the plate and strip component stress application device group during heating, and compare the obtained temperature of the plate and strip sample at the clamping point with the preset temperature for rapid temperature rise of the plate. S4. Obtain the temperature rise history function or temperature fall history function of the strip sample. The temperature rise history includes: turning off the heating device, turning on the electric heating element group, obtaining the temperature of the strip sample at the clamping point of each strip group element stress application device group at this time, and comparing the obtained temperature of the strip sample at the clamping point with the temperature rise history function of the strip sample. The temperature drop process includes: turning off the heating device, turning on the cooling element group, obtaining the temperature of the strip sample at the clamping point of each strip group element stress application device group, and comparing the obtained temperature of the strip sample at the clamping point with the temperature drop process function of the strip sample. S5. After the temperature rise process or the temperature drop process is completed, the heating element group or cooling element group is turned off, and the microstructure properties of the strip sample are tested.

2. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 1, Its features are, The box body includes an upper box body and a lower box body. The insulation device is a hollow box body structure and the size of the insulation device box body structure is adapted to the size of the inner cavity of the box body. The insulation device includes an upper box body insulation device and a lower box body insulation device, which are respectively installed in the upper box body and the lower box body.

3. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 2, characterized in that, The upper housing and the upper housing insulation device have holes of the same size at the same position on their corresponding surfaces, and the two holes overlap and are connected; the lower housing and the lower housing insulation device have holes of the same size at the same position on their corresponding surfaces, and the two holes overlap and are connected; the heating device includes an upper housing heating device and a lower housing heating device, the upper housing heating device is installed in the hole between the upper housing and the upper housing insulation device, and the lower housing heating device is installed in the hole between the lower housing and the lower housing insulation device.

4. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and sheets according to claim 3, characterized in that, Heating elements are provided on one side of the upper and lower heating devices opposite to the housing, and cooling elements are provided on the side of the upper and lower heating devices away from the housing.

5. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 2, characterized in that, Both the upper and lower box insulation devices are equipped with four sets of heating elements. The upper box insulation device has four sets of heating elements symmetrically arranged in four directions, and the four sets of heating elements can be connected in series. The lower box insulation device has four sets of heating elements symmetrically arranged in four directions, and the four sets of heating elements can be connected in series. The plate and strip sample is placed between the four sets of heating elements in the upper and lower box insulation devices.

6. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 2, characterized in that, Both the upper and lower insulation devices are equipped with four sets of cooling elements. The upper insulation device has four sets of cooling elements symmetrically arranged in four directions, and these four sets of cooling elements can be connected in series. The lower insulation device also has four sets of cooling elements symmetrically arranged in four directions, and these four sets of cooling elements can be connected in series. The plate and strip sample is placed between the four sets of cooling elements in the upper and lower insulation devices.

7. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 2, characterized in that, The transverse stress application devices of the strip sample are symmetrical to each other, and the longitudinal stress application devices of the strip sample are symmetrical to each other; each set of stress application devices is provided with a pull rod, and the box is provided with a reserved hole, through which the pull rod can extend out of the box and move within the reserved hole; the temperature sensor can obtain the temperature of the strip sample.

8. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 1, characterized in that, A temperature equalization component is provided between the heating element group and the strip sample; the strip group stress application device group clamps the strip sample from four directions respectively; the temperature sensor is installed at each clamping point between the strip group stress application device group and the strip sample, and can measure the temperature at the four clamping points of the strip sample.

9. The multi-throughput test method for the temperature-induced shape change phenomenon of strips and plates according to claim 7, characterized in that, When the method is applied to the continuous annealing process of the strip sample, the heat preservation device is equipped with an electric heating element group. S1 includes: Obtain the width of the strip sample. , plate thickness and the length of the strip sample in a single roll Based on board width and plate thickness The transverse region of the strip sample is divided based on this: like / ( If (×1000)<0.5, then the width direction of the strip sample is divided into 24 equal segments in the transverse direction; If 0.5 < / ( If (×1000)<1, then the width direction of the strip sample is divided into 36 equal segments in the transverse direction. If 1 < / ( If (×1000), then the width direction of the strip sample is divided into 72 equal segments in the transverse direction. Based on the continuous heat treatment process parameter table corresponding to the strip sample, the continuous annealing speed of the strip sample is selected. Calculate the continuous unwinding time of a single roll of the strip sample. The continuous unloading time of the strip sample The calculation formula is formula (1): = / （1） S2 includes: Based on the region division results of the strip specimen, the transverse stress function and longitudinal stress function of the strip specimen are obtained; The value obtained by the transverse stress function of the strip specimen is the transverse tensile stress required by the strip component stress application device group on the transverse side of the strip specimen. The pull rod of the strip component stress application device group on the transverse side of the strip specimen is driven to apply transverse tensile stress to the strip specimen and to stretch the strip specimen laterally. The value obtained from the longitudinal stress function of the strip specimen is the longitudinal tensile stress required by the strip component stress application device group in the longitudinal direction of the strip specimen. The pull rod of the strip component stress application device group in the longitudinal direction of the strip specimen is driven to apply longitudinal tensile stress to the strip specimen, thereby longitudinally stretching the strip specimen. S3 includes: Set the preset temperature for rapid temperature rise of the plate. The upper and lower heating devices are driven with the same current parameters, activating the temperature sensor in the clamping portion of the strip component stress application device assembly. During the heating process, the temperature sensor continuously monitors and acquires the temperature of each clamped location of the strip sample after heating, including... , , and Calculate the average temperature at the four clamping points of the strip sample. The formula for calculating the average temperature at the four clamping points of the strip sample is formula (2): （2） The average temperature of the four clamped points of the strip sample is calculated and compared with the preset temperature for rapid temperature rise of the strip. Compare: like If the temperature exceeds 10℃, maintain the current parameters of the upper and lower heating devices and continue heating. If 5℃ < If the temperature is below 10℃, reduce the current parameters of the upper and lower heating devices to 50% of their original values ​​and continue heating. like If the temperature is below 5℃, the current parameters of the upper and lower heating devices are reduced to 20% of their original values ​​to enter the heat preservation state. S4 includes: Based on the continuous heat treatment process parameter table corresponding to the strip sample, obtain the temperature rise history function of the strip sample. During the temperature rise process, the temperature sensor continuously monitors and acquires the temperature at each clamping point of the strip sample, including... , , and , calculate the average temperature of the four clamped points of the strip sample during the temperature rise process. The formula for calculating the average temperature of the four clamped points of the strip sample during the temperature rise process is formula (3). （3） The average temperature of the four clamping points of the strip sample during the calculated temperature rise process is compared with the temperature rise process function of the strip sample. Compare: In t∈[0, ] within, if If the temperature rise is greater than 10℃, the actual temperature rise inside the chamber does not match the temperature rise history, so the power parameters of the heating element group inside the upper chamber and the lower chamber are increased to 120% of the original value. In t∈[0, ] within, if If the actual temperature rise inside the chamber is less than 10℃, the temperature rise history matches well, thus maintaining the power parameters of the heating element group inside the upper and lower chambers.

10. The multi-throughput testing method for the temperature-induced shape change phenomenon of strips and plates according to claim 7, characterized in that, When the method is applied to the post-rolling cold production process of the strip sample, the heat preservation device is equipped with a cooling element group. S101 includes: Obtain the width of the strip sample. , plate thickness and the length of the strip sample in a single roll Based on board width and plate thickness The transverse region of the strip sample is divided based on this: like / ( If (×1000)<0.5, then the width direction of the strip sample is divided into 24 equal segments in the transverse direction; If 0.5 < / ( If (×1000)<1, then the width direction of the strip sample is divided into 36 equal segments in the transverse direction. If 1 < / ( If (×1000), then the width direction of the strip sample is divided into 72 equal segments in the transverse direction. Based on the lamination process parameter table corresponding to the strip sample, the lamination speed of the strip sample is selected. Calculate the plate cooling time of a single roll of the strip sample. The plate-and-strip sample's cooling time The calculation formula is formula (4): = / （4） S102 includes: Based on the region division results of the strip specimen, the transverse stress function and longitudinal stress function of the strip specimen are obtained; The value obtained by the transverse stress function of the strip specimen is the transverse tensile stress required by the strip component stress application device group on the transverse side of the strip specimen. The pull rod of the strip component stress application device group on the transverse side of the strip specimen is driven to apply transverse tensile stress to the strip specimen and to stretch the strip specimen laterally. The value obtained from the longitudinal stress function of the strip specimen is the longitudinal tensile stress required by the strip component stress application device group in the longitudinal direction of the strip specimen. The pull rod of the strip component stress application device group in the longitudinal direction of the strip specimen is driven to apply longitudinal tensile stress to the strip specimen, thereby longitudinally stretching the strip specimen. S103 includes: Set the preset temperature for rapid temperature rise of the plate. The upper and lower heating devices are driven with the same current parameters, activating the temperature sensor in the clamping portion of the strip component stress application device assembly. During the heating process, the temperature sensor continuously monitors and acquires the temperature of each clamped location of the strip sample after heating, including... , , and The average temperature at the four clamping points of the strip sample is calculated using formula (5). （5） The average temperature of the four clamped points of the strip sample is calculated and compared with the preset temperature for rapid temperature rise of the strip. Compare: like If the temperature exceeds 10℃, maintain the current parameters of the upper and lower heating devices and continue heating. If 5℃ < If the temperature is below 10℃, reduce the current parameters of the upper and lower heating devices to 50% of their original values ​​and continue heating. like If the temperature is below 5℃, the current parameters of the upper and lower heating devices are reduced to 20% of their original values ​​to enter the heat preservation state. S104 includes: Based on the laminar cooling process parameter table corresponding to the strip sample, obtain the temperature drop history function of the strip sample. During the temperature drop process, the temperature sensor continuously monitors and acquires the temperature at each clamping point of the strip sample, including... , , and To calculate the average temperature of the four clamped points of the strip sample during the temperature drop process, the formula for calculating the average temperature of the four clamped points of the strip sample during the temperature drop process is formula (6). （6） The average temperature of the four clamping points of the strip sample during the calculated temperature drop process is compared with the temperature drop process function of the strip sample. Compare: In t∈[0, ] within, if If the temperature drops above 5°C, the actual temperature drop inside the chamber does not match the temperature drop history well, so the cooling power parameters of the cooling element groups inside the upper and lower chambers are increased to 120% of their original values. In t∈[0, ] within, if If the actual temperature drop inside the chamber is less than 5℃, the temperature drop history matches well, thus maintaining the cooling power parameters of the cooling element group inside the upper and lower chambers.

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