Bump supply device and bump supply method

Abstract

A solder ball supply device is applied to a solder ball feeder having a feeder main body, a track member, a vibration device, and a chamber unit, and has a photographing unit and a determination unit. The track member is configured to be able to vibrate with respect to the feeder main body, and has a conveyance path that conveys a plurality of solder balls discharged from a housing. The vibration device applies vibration to the track member to convey the plurality of solder balls on the conveyance path to a supply area where the solder balls can be picked up by a component mounting machine. The chamber unit has a plurality of chambers in the supply area, and each of the chambers is configured to accommodate one of the plurality of solder balls conveyed to the supply area. The photographing unit causes a photographing device to photograph the chamber unit having the plurality of solder balls conveyed thereto. The determination unit performs image processing on image data of the chamber unit acquired by the photographing unit, and determines whether or not the plurality of chambers can pick up the solder balls by the component mounting machine, respectively.

Description

Technical Field

[0001] This specification discloses technology related to solder ball supply devices and solder ball supply methods. Background Technology

[0002] Patent Document 1 describes a conductive ball supply device comprising a ball container, a plate-shaped ball transport member, and a vibration imparting mechanism. The ball container holds conductive balls and has an opening at its lower part for the conductive balls to flow out. The ball transport member is positioned horizontally below the ball container, maintaining a predetermined gap relative to the opening. The vibration imparting mechanism imparts vibration to the ball transport member. The conductive ball supply device is configured to replenish the target container with conductive balls by imparting vibration to the ball transport member, transporting the conductive balls flowing out from the opening of the ball container, and causing them to fall into the target container.

[0003] The control unit described in Patent Document 2 determines whether the solder balls are fully installed in the openings of the mounting mask based on image information received by the imaging unit located on the upper part of the solder ball mounting device. Furthermore, if the control unit determines that the installation is incomplete and the solder balls are not fully installed, it tilts the mounting mask to install the solder balls in all the openings.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2002-084061

[0007] Patent document 2: Japanese Patent Application Publication No. 2014-027243. Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] Solder ball feeders vibrate a track component with a transport path to transport multiple solder balls along the path and store them in multiple chambers, allowing a component mounter to pick them up. However, in solder ball feeders, it is difficult to store solder balls in all chambers, and the component mounter may not always be able to pick up the solder balls.

[0010] In view of this situation, this specification discloses a solder ball supply device and a solder ball supply method capable of identifying a chamber containing solder balls that can be picked up by a component mounting machine.

[0011] Technical solutions for solving the problem

[0012] This specification discloses a solder ball supply device applied to a solder ball feeder. The solder ball feeder includes a feeder main body, a track component, a vibration device, and a chamber unit. The solder ball supply device also includes an imaging unit and a determination unit. The track component is configured to vibrate relative to the feeder main body and has a transport path for transporting multiple solder balls discharged from a housing. The vibration device vibrates the track component to transport the multiple solder balls along the transport path to a supply area that can be picked up by a component mounting machine. The chamber unit has multiple chambers in the supply area, and each chamber is designed to contain one of the solder balls transported to the supply area. The imaging unit causes the imaging device to capture images of the chamber unit carrying the multiple solder balls. The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit and determines whether each of the multiple chambers is suitable for picking up a solder ball by the component mounting machine.

[0013] Furthermore, this specification discloses a solder ball supply method applied to a solder ball feeder. The solder ball feeder includes a feeder main body, a track component, a vibration device, and a chamber unit. The solder ball supply method includes an imaging step and a judgment step. The track component is configured to vibrate relative to the feeder main body and has a transport path for transporting multiple solder balls discharged from a housing. The vibration device applies vibration to the track component to transport the multiple solder balls on the transport path to a supply area that can be picked up by a component mounting machine. The chamber unit has multiple chambers in the supply area, and each chamber should contain one of the solder balls transported to the supply area. The imaging step causes the imaging device to capture images of the chamber unit carrying the multiple solder balls. The judgment step performs image processing on the image data of the chamber unit acquired by the imaging step and determines whether each of the multiple chambers can be picked up by the component mounting machine.

[0014] Invention Effects

[0015] According to the solder ball supply device described above, it is possible to determine whether solder balls can be picked up by the component mounting machine in each of the multiple chambers, and to identify the chambers containing solder balls that can be picked up by the component mounting machine. The same applies to the solder ball supply method as described above for the solder ball supply device. Attached Figure Description

[0016] Figure 1 This is a top view showing an example of the structure of a component mounting machine.

[0017] Figure 2 This is a perspective view showing an example of a solder ball feeder.

[0018] Figure 3 It is a schematic representation Figure 2A side view of a portion of the solder ball feeder.

[0019] Figure 4 yes Figure 2 The top view is shown in the direction of arrow IV.

[0020] Figure 5 This is a 3D diagram representing an example of a transport path.

[0021] Figure 6 This is a three-dimensional diagram representing an example of a chamber unit.

[0022] Figure 7 This is a block diagram representing an example of a control block for a solder ball supply device.

[0023] Figure 8 This is a flowchart illustrating an example of the control process of a solder ball supply device.

[0024] Figure 9 This is a side view showing an example of the structure of the camera device.

[0025] Figure 10 This is a schematic diagram of an example of image data representing a region of a chamber unit. Detailed Implementation

[0026] 1. Implementation Method

[0027] 1-1. Structural Example of Component Mounting Machine 10

[0028] The component mounting machine 10 mounts multiple components 91 onto a substrate 90. Furthermore, the component mounting machine 10 can also supply multiple solder balls 92 to the substrate 90. Figure 1 As shown, the component mounting machine 10 includes a substrate handling device 11, a supply device 12, a transfer device 13, a component camera 14, a substrate camera 15, and a control device 20.

[0029] The substrate transport device 11, for example, is composed of a conveyor belt, and transports the substrate 90 along the transport direction (X-axis direction). The substrate 90 is a circuit board, forming electronic circuits, electrical circuits, magnetic circuits, etc. The substrate transport device 11 transports the substrate 90 into the component mounting machine 10, positioning the substrate 90 at a predetermined position within the machine. After the predetermined processing performed by the component mounting machine 10 is completed, the substrate transport device 11 removes the substrate 90 from the component mounting machine 10.

[0030] The supply device 12 supplies components 91. The supply device 12 can also supply solder balls 92. The supply device 12 includes multiple feeders 12b arranged along the transport direction (X-axis direction) of the substrate 90. Each of the multiple feeders 12b is detachably mounted in a slot 12a. The feeders 12b can be belt feeders, bulk feeders, solder ball feeders 30, etc.

[0031] A belt feeder provides interval feeding to a carrier belt containing multiple components 91, supplying the components 91 in a pick-up manner at the supply position. A bulk feeder supplies components 91 discharged from a housing in a pick-up manner, the housing containing the multiple components 91 in a bulk state (the multiple components 91 are in an irregular orientation). A solder ball feeder 30 supplies solder balls 92 discharged from a housing 70 in a pick-up manner, the housing 70 containing the multiple solder balls 92 in a bulk state (the multiple solder balls 92 are in an irregular orientation).

[0032] In this embodiment, the solder ball feeder 30 is equipped in a predetermined slot 12a among the plurality of slots 12a of the supply device 12 of the component mounting machine 10. The slot 12a for equipping the solder ball feeder 30 is determined in the production plan of the substrate products. For example, the slot 12a for equipping other feeders 12b such as tape feeders and bulk feeders, as well as the slot 12a for equipping the solder ball feeder 30, are determined in a way that makes the production volume of the component mounting machine 10 (the production volume of substrate products per unit time) reach or exceed a predetermined value.

[0033] The transfer device 13 includes a head drive device 13a, a moving stage 13b, a mounting head 13c, and a holding member 13d. The head drive device 13a is configured to move the moving stage 13b along the X-axis and Y-axis directions (directions orthogonal to the X-axis in the horizontal plane) via a linear motion mechanism. The mounting head 13c is detachably (replaceable) mounted on the moving stage 13b via a clamping member. The mounting head 13c, using at least one holding member 13d, picks up and holds the component 91 or solder ball 92 supplied by the supply device 12, and mounts the component 91 or solder ball 92 onto the substrate 90 positioned by the substrate transport device 11. The holding member 13d can be, for example, a nozzle, a chuck, or the like.

[0034] The component camera 14 and the substrate camera 15 can be captured using known imaging devices. The component camera 14 is fixed to the base of the component mounting machine 10 with its optical axis facing upward in a vertical direction (the Z-axis direction is orthogonal to the X-axis and Y-axis directions). The component camera 14 captures images of the component 91 or solder ball 92 held by the holding member 13d from below.

[0035] The substrate camera 15 is mounted on the moving stage 13b of the transfer device 13 with its optical axis pointing downwards in the vertical direction (Z-axis direction). The substrate camera 15 can capture images of the substrate 90, the chamber unit 50 (described later), etc., from above. The component camera 14 and the substrate camera 15 capture images based on control signals sent from the control device 20. Image data of the images captured by the component camera 14 and the substrate camera 15 are sent to the control device 20.

[0036] The control device 20 includes a known arithmetic and storage device, forming a control circuit. The control device 20 receives inputs such as information and image data from various sensors installed on the component mounting machine 10. Based on a control program and pre-set installation conditions, the control device 20 sends control signals to each device.

[0037] For example, the control device 20 causes the substrate camera 15 to capture images of the substrate 90 positioned by the substrate transport device 11. The control device 20 performs image processing on the images captured by the substrate camera 15 and identifies the positioning state of the substrate 90. Furthermore, the control device 20 causes the holding member 13d to pick up and hold the component 91 supplied by the supply device 12, and causes the component camera 14 to capture images of the component 91 held by the holding member 13d. The control device 20 performs image processing on the images captured by the component camera 14 and identifies the holding posture of the component 91.

[0038] The control device 20 moves the holding member 13d upward toward a predetermined mounting position preset by a control program, etc. Furthermore, the control device 20 corrects the predetermined mounting position and sets the actual mounting position of the component 91 based on the positioning state of the substrate 90 and the holding posture of the component 91. The predetermined mounting position and the actual mounting position include not only position (X-axis coordinates and Y-axis coordinates) but also rotation angle.

[0039] The control device 20 corrects the target position (X-axis and Y-axis coordinates) and rotation angle of the holding member 13d in accordance with the mounting position. At the corrected target position, the control device 20 lowers the holding member 13d by the corrected rotation angle to mount the component 91 onto the substrate 90. The control device 20 performs the mounting process of mounting multiple components 91 onto the substrate 90 by repeatedly performing the aforementioned pick-and-release cycle. Similar to the components 91, the control device 20 can also supply solder balls 92 to a predetermined area of ​​the substrate 90.

[0040] 1-2. Structural example of the ball feeder 30

[0041] The solder ball feeder 30 only needs to be able to supply solder balls 92, and various forms can be used. For example... Figures 2-6As shown, the ball feeder 30 of this embodiment includes a feeder main body 31, a receiving component 32, a bracket 33, a track component 34, a locking unit 35, a cover 36, a gate 37, a connecting component 38, an air supply device 39, a vibration device 40, a chamber unit 50, a feeder control device 60, and a housing 70.

[0042] like Figure 2 As shown, the feeder body 31 is formed in a flat, box-like shape. The feeder body 31 is detachably mounted in the slot 12a of the feeding device 12. A connector 31a and a plurality of pins 31b, 31b are formed on the front end side of the feeder body 31 in the direction of transport of the solder ball 92. The connector 31a is configured to communicate with the control device 20 when the feeder body 31 is mounted in the slot 12a. Furthermore, the solder ball feeder 30 is powered via the connector 31a. The plurality of pins 31b, 31b are inserted into guide holes provided in the slot 12a for positioning when the feeder body 31 is mounted in the slot 12a.

[0043] A housing 70 is detachably mounted on the feeder body 31 via a receiving member 32, and the housing 70 contains a plurality of solder balls 92 in a loose state. Figure 3 As shown, a discharge port 71 for discharging solder balls 92 is formed in the housing 70. In this embodiment, the housing 70 is an external device of the solder ball feeder 30. For example, the operator selects a housing 70 from a plurality of housings 70 that houses the solder balls 92 to be supplied to the substrate 90, and installs the selected housing 70 on the feeder body 31.

[0044] The receiving member 32 supports the housing 70, which is mounted on the feeder body 31, and is configured to vibrate relative to the feeder body 31. The receiving member 32 is provided in the receiving area Ar0, which receives solder balls 92 discharged from the housing 70. In this embodiment, the receiving member 32 includes an inclined portion 32a and a delivery portion 32b. The inclined portion 32a is a portion that slopes downward from the discharge port 71 of the housing 70. Solder balls 92 discharged from the discharge port 71 are guided downward. The delivery portion 32b is a portion that extends upward from the front end side of the inclined portion 32a. The front end side of the delivery portion 32b is open and communicates with the transport path Rd0 of the track member 34. The solder balls 92 guided downward by the inclined portion 32a are delivered upward in the delivery portion 32b by the air supply device 39 (described later) and delivered to the transport path Rd0 of the track member 34.

[0045] The bracket 33 is configured to vibrate relative to the feeder body 31. The bracket 33 is formed as a block extending along the transport direction of the solder ball 92 (corresponding to the Y-axis direction in the component mounting machine 10 when the feeder body 31 is mounted in slot 12a). A track member 34 is mounted on the upper surface of the bracket 33. The bracket 33 is supported by a support member 41 of the vibration device 40 (described later). A locking unit 35 secures the track member 34 while it is mounted on the bracket 33. When secured by the locking unit 35, the track member 34 can vibrate integrally with the feeder body 31 and the bracket 33. The track member 34 can be removed from the bracket 33 by releasing the locking unit 35.

[0046] The track component 34 includes a transport path Rd0, a pair of side walls 34a, 34a, a front end 34b, an inlet 34c, at least one reference part 34d, and a guide part 34e. The guide part 34e can also be omitted. For example... Figure 4 and Figure 5 As shown, the track component 34 is configured to move along the transport direction of the solder ball 92. Figure 4 Extending in the left-right direction of the paper. In the width direction of track component 34 ( Figure 4 The two edges (in the vertical direction on the paper) have a pair of upwardly projecting sidewalls 34a, 34a. Multiple solder balls 92 are transported in the transport path Rd0. As already described, in this embodiment, multiple solder balls 92 are discharged from the housing 70 and conveyed to the transport path Rd0 via the receiving member 32.

[0047] The transport path Rd0 only needs to be able to transport multiple solder balls 92, and various forms can be used. For example... Figure 5 As shown, in this embodiment, the transport path Rd0 is formed in a groove shape by a pair of sidewalls 34a, 34a. Specifically, the pair of sidewalls 34a, 34a, together with the front end portion 34b of the track member 34, surround the periphery of the transport path Rd0, suppressing leakage of the plurality of solder balls 92 transported in the transport path Rd0. Furthermore, when the feeder body 31 is mounted in the slot 12a, at least a portion of the track member 34 is disposed in the supply area As0. The supply area As0 is the area in which the component mounting machine 10 can pick up the solder balls 92. Specifically, the supply area As0 is the area in which the holding member 13d supported by the mounting head 13c can pick up the solder balls 92, and is included in the movable range of the mounting head 13c.

[0048] A chamber unit 50 is provided in the supply area As0. Specifically, the chamber unit 50 is replaceably mounted on the track component 34. The chamber unit 50 has multiple ( Figure 4 and Figure 6In this configuration, there are 120 chambers 51, each of which is designed to house one of a plurality of solder balls 92 transported to the supply area As0. In other words, each of the 120 chambers 51 is designed to house one solder ball 92. Specifically, as... Figure 4 and Figure 6 As shown, a plurality of (120) chambers 51 are arranged in a matrix in the supply area As0. For example, the chamber unit 50 has a total of 120 chambers 51, with 12 arranged in the transport direction of the solder ball 92 and 10 arranged in the width direction of the transport path Rd0.

[0049] Multiple (120) chambers 51 each open above the transport path Rd0 and are capable of accommodating solder balls 92. Specifically, the opening of each chamber 51 is circular and set to a size slightly larger than the diameter of the solder ball 92. The depth of each chamber 51 is appropriately set according to the size of the solder ball 92 in a way that allows it to be accommodated. Furthermore, the number of chambers 51 is appropriately set considering the required number of chambers 51 and the density that may affect transportability.

[0050] Specifically, the number of chambers 51 in chamber unit 50 is set to be greater than the maximum number of solder balls 92 picked up in one pick-up and release cycle. Furthermore, the aforementioned maximum number corresponds to the number of retaining members 13d supported by mounting head 13c. For example, if mounting head 13c supports 24 nozzles, it is preferable to set the number of chambers 51 to be at least more than 24.

[0051] At least one reference portion 34d is provided in the supply area As0 for use in identifying the positions of the plurality of chambers 51 of the chamber unit 50. In this embodiment, a plurality of (e.g., two) reference portions 34d, 34d are provided on the upper surface of the front end portion 34b. The plurality of (two) reference portions 34d, 34d are circular markers and are arranged separately in the width direction of the track member 34. The guide portion 34e guides the plurality of solder balls 92 in a manner such that they are dispersed in the plurality of chambers 51 of the chamber unit 50 and thus transported. Figure 5 As shown, the guide portion 34e can, for example, use multiple plate-shaped components that extend upward from the bottom surface of the groove-shaped transport path Rd0.

[0052] The cover 36 is fixed to the track component 34 and covers the top of the transport path Rd0. Multiple vents 36a are formed on the upper surface of the cover 36. A mesh with seams smaller than the outer dimensions of the solder ball 92 is stretched over the vents 36a. The cover 36 can prevent the solder ball 92 from flying out of the transport path Rd0 and exhaust air to the outside through the vents 36a.

[0053] A gate 37 is disposed on the upper part of the track component 34 and can close the opening of the supply area As0. The solder ball feeder 30, by opening and closing the gate 37, can suppress the ejection of solder balls 92 and the entry of foreign matter into the supply area As0. In this embodiment, the gate 37 switches between an open state, a closed state, or an intermediate state through an opening and closing action. The closed state of the gate 37 is when the gate 37 is in contact with the track component 34, and the opening of the supply area As0 is completely closed. At this time, if... Figure 4 As shown by the dotted line, the gate 37 is located in the track component 34 at the base end side of the multiple (two) reference parts 34d, 34d in the transport direction of the solder ball 92, and the multiple (two) reference parts 34d, 34d can be seen and photographed when viewed from above.

[0054] The open state of gate 37 is when the opening of the supply area As0 is not closed and the chamber unit 50 is exposed. At this time, the retaining member 13d supported by the mounting head 13c can attempt to pick up the solder ball 92 from any of the multiple chambers 51 of the chamber unit 50. The intermediate state of gate 37 is a state between the closed and open states, where the gate 37 moves away from the track member 34 more than the amplitude of the vibration caused by the vibration device 40, thus restricting the solder ball 92 from flying out of the opening of the supply area As0. Gate 37 is opened and closed by a drive device, and its state (closed, open, or intermediate) depends on the drive state of the drive device.

[0055] The guide portion 34c of the track component 34 communicates with the delivery portion 32b of the receiving component 32, and delivers the solder ball 92 delivered from the delivery portion 32b to the transport path Rd0. Specifically, the front end of the guide portion 34c is open and connected to the front end of the delivery portion 32b via the connecting member 38. The connecting member 38 is formed in a tubular shape and connects the delivery portion 32b of the receiving component 32 and the guide portion 34c of the track component 34. In this embodiment, the connecting member 38 is a close-fitting helical spring and is flexible.

[0056] The connecting member 38 connects the feed section 32b of the receiving member 32 and the guide section 34c of the track member 34 in such a way that multiple solder balls 92 can flow between the receiving area Ar0 and the transport path Rd0. Furthermore, the connecting member 38 absorbs vibrations by deforming according to the vibrations of the receiving member 32 and the track member 34 relative to the feeder body 31. The connecting member 38 reduces or interrupts the vibrations transmitted between the independently vibrating receiving member 32 and track member 34.

[0057] Air supply device 39 supplies air (positive pressure air) from below the receiving area Ar0, allowing multiple solder balls 92 to flow from the receiving member 32 to the track member 34 via the connecting member 38. In this embodiment, air supply device 39 supplies externally supplied positive pressure air from below the receiving area Ar0 based on commands from the feeder control device 60 (described later). Air supply device 39 can also cut off the supply of positive pressure air based on commands from the feeder control device 60.

[0058] If the air supply device 39 supplies positive pressure air, the multiple solder balls 92 retained in the receiving area Ar0 are blown upward by the positive pressure air. The positive pressure air and the multiple solder balls 92 flow in the order of the delivery part 32b of the receiving component 32, the connecting component 38, and the inlet part 34c to reach the transport path Rd0 of the track component 34. The positive pressure air that reaches the transport path Rd0 is exhausted to the outside from the exhaust port 36a of the cover 36. The multiple solder balls 92 that reach the transport path Rd0 fall back to the transport path Rd0 of the track component 34 due to their own weight.

[0059] The vibration device 40 applies vibration to the track component 34 to transport multiple solder balls 92 on the transport path Rd0 to the supply area As0 that the component mounting machine 10 can pick up. The vibration device 40 can be of various forms as long as it can transport multiple solder balls 92 to the supply area As0. The vibration device 40 of this embodiment includes multiple (e.g., four) support components 41, multiple (e.g., four) vibrators 42, multiple (e.g., two) vibration sensors 43, and a power supply device 44. The multiple (four) support components 41 connect the feeder body 31 and the bracket 33 and support the bracket 33 and the track component 34.

[0060] Furthermore, the multiple (four) support members 41 include two types of support members 41: a forward support member 41a and a backward support member 41b. The forward support member 41a is used for forward transport control in transporting multiple solder balls 92 in the transport path Rd0 in the direction towards the chamber unit 50 (forward direction). The backward support member 41b is used for backward transport control in transporting multiple solder balls 92 in the transport path Rd0 in the direction towards the housing 70 (backward direction). The forward support member 41a and the backward support member 41b have different inclination directions relative to the vertical direction (Z-axis direction).

[0061] Specifically, one end of the forward support member 41a is connected to the feeder main body 31, and the other end is connected to the bracket 33. The forward support member 41a is inclined in the backward direction relative to the vertical direction (Z-axis direction). Similarly, one end of the backward support member 41b is connected to the feeder main body 31, and the other end is connected to the bracket 33. The backward support member 41b is inclined in the forward direction relative to the vertical direction (Z-axis direction).

[0062] Multiple (four) oscillators 42 are powered by a power supply device 44 and vibrate with a predetermined amplitude and frequency. The multiple (four) oscillators 42 can, for example, use piezoelectric elements and are attached to the support member 41. Furthermore, in this embodiment, the multiple (four) support members 41 include both a forward support member 41a and a backward support member 41b; therefore, the multiple (four) oscillators 42 include both a forward oscillator 42a disposed on the forward support member 41a and a backward oscillator 42b disposed on the backward support member 41b.

[0063] Vibration is imparted to the track component 34 via the bracket 33 by the vibration of at least one of the multiple (4) oscillators 42. Furthermore, the amplitude and frequency of the vibration imparted to the track component 34 vary according to the voltage and frequency of the AC power supplied to the oscillators 42. Multiple (two) vibration sensors 43 detect the vibration state of the track component 34 to which the vibration is applied by the vibration device 40. For example, the multiple (two) vibration sensors 43 can detect the amplitude, frequency, decay time, and vibration trajectory (the movement trajectory of a specific part associated with the vibration) of the track component 34. In this embodiment, the multiple (two) vibration sensors 43 are respectively provided on a pair of forward support members 41a and backward support members 41b.

[0064] Furthermore, if the vibration device 40 applies vibration to the track component 34, the track component 34 will undergo elliptical motion when viewed from the side. As a result, the plurality of solder balls 92 on the transport path Rd0 are subjected to an external force in the forward direction and upward or a force in the backward direction and upward, depending on the rotational direction of the elliptical motion of the track component 34. As a result, the plurality of solder balls 92 on the transport path Rd0 are transported in the forward or backward direction.

[0065] Based on the instructions of the feeder control device 60, the power supply device 44 adjusts the voltage and frequency of the AC power supplied to the oscillator 42. This adjusts the amplitude and frequency of the vibration imparted to the track component 34, defining the rotational direction of the elliptical motion of the track component 34. If the amplitude, frequency, and rotational direction of the elliptical motion based on the vibration of the track component 34 change, the transport speed, dispersion, and transport direction of the weld balls 92 being transported will also change.

[0066] The feeder control device 60 includes a known arithmetic and storage device, forming a control circuit. With the feeder body 31 mounted in slot 12a, the feeder control device 60 is powered via connector 31a, enabling it to communicate with the control device 20 of the component mounting machine 10. The feeder control device 60 drives the vibration device 40 to vibrate the track component 34, transporting multiple solder balls 92 along the transport path Rd0.

[0067] 1-3. Structural Example of Welding Ball Supply Device 80

[0068] The solder ball feeder 30 vibrates the track component 34, which has a transport path Rd0, to transport multiple solder balls 92 on the transport path Rd0 and accommodate the solder balls 92 in multiple chambers 51 respectively, so that the component mounting machine 10 can pick up the solder balls 92. However, in the solder ball feeder 30, it is difficult to accommodate the solder balls 92 in all chambers 51 of the chamber unit 50, and the component mounting machine 10 may not always be able to pick up the solder balls 92.

[0069] Therefore, in this embodiment, a solder ball supply device 80 is provided. The solder ball supply device 80 is applied to a solder ball feeder 30 that includes a feeder body 31, a track component 34, a vibration device 40, and a chamber unit 50. If the solder ball supply device 80 is considered a control block, it includes a camera unit 81 and a judgment unit 82. The solder ball supply device 80 may also include an indicator unit 83. The solder ball supply device 80 may also include a transport control unit 84. Figure 7 As shown, the solder ball supply device 80 of this embodiment includes a shooting unit 81, a judgment unit 82, an indicator unit 83, and a transport control unit 84.

[0070] The solder ball supply device 80 can be installed, for example, in the control device 20 of the component mounting machine 10. Furthermore, the solder ball supply device 80 can also be installed in a control device other than the component mounting machine 10. Moreover, the solder ball supply device 80 can also be installed in a cloud. Figure 7 As shown, the solder ball supply device 80 of this embodiment is provided in the control device 20 of the component mounting machine 10.

[0071] In addition, the solder ball supply device 80 according to Figure 8 The flowchart shown illustrates the execution control. The imaging unit 81 performs the processing shown in step S11. The judgment unit 82 performs the processing shown in step S12. The instruction unit 83 performs the processing shown in step S13. The transport control unit 84 performs the judgment shown in step S14 and the processing shown in step S15.

[0072] 1-3-1. Filming Section 81 and Judgment Section 82

[0073] The imaging unit 81 enables the imaging device CU0 to capture images of the chamber unit 50, which carries multiple solder balls 92. Figure 8 (Step S11 shown). The determination unit 82 performs image processing on the image data PD0 of the chamber unit 50 acquired by the imaging unit 81, and determines whether the component mounting machine 10 can pick up the solder ball 92 for each of the multiple chambers 51 (step S12).

[0074] The imaging device CU0 only needs to be able to photograph the chamber unit 50, and any known imaging device can be used. For example, the imaging device CU0 can use a substrate camera 15. The substrate camera 15 photographs at least a portion of the chambers 51 contained in the chamber unit 50 from above. When it is difficult to photograph all the chambers 51 contained in the chamber unit 50 at once, the substrate camera 15 can divide the chamber unit 50 into multiple regions and photograph at least one chamber 51 in each of the divided regions.

[0075] Furthermore, as already described, at least one reference portion 34d (in this embodiment, multiple (two) reference portions 34d, 34d) is used when the positions of the multiple chambers 51 of the identification chamber unit 50 are provided in the supply area As0. The multiple (two) reference portions 34d, 34d can be viewed and photographed when the gate 37 is closed. Therefore, the imaging unit 81 instructs the feeder control device 60 to close the gate 37. Thus, the substrate camera 15 can photograph the multiple (two) reference portions 34d, 34d from above.

[0076] The imaging unit 81 moves the substrate camera 15 above the plurality of (two) reference sections 34d, 34d, and the substrate camera 15 captures images of the plurality of (two) reference sections 34d, 34d. The determination unit 82 performs image processing on the image data PD0 of the chamber unit 50 acquired by the imaging unit 81, and identifies the position of the supply area As0 inside the component mounting machine 10 based on the positions of the plurality of (two) reference sections 34d, 34d and the position of the substrate camera 15 when the plurality of (two) reference sections 34d, 34d are captured.

[0077] Before the component mounting machine 10 picks up the solder balls 92, the control device 20 instructs the solder ball feeder 30 to transport the solder balls 92. Thus, the solder ball feeder 30 discharges the solder balls 92 from the housing 70 as needed and allows the solder balls 92 to flow to the track component 34. Furthermore, the solder ball feeder 30 maintains the gate 37 in an intermediate state and transports multiple solder balls 92 to the supply area As0 in the transport path Rd0. Thus, multiple solder balls 92 are transported to the chamber unit 50.

[0078] With the gate 37 open, the multiple chambers 51 of the chamber unit 50 can be viewed and photographed. Therefore, when the substrate camera 15 photographs the chamber unit 50 carrying multiple solder balls 92, the imaging unit 81 instructs the feeder control device 60 to open the gate 37. As a result, the substrate camera 15 can photograph the chamber unit 50 from above.

[0079] Furthermore, multiple (two) reference sections 34d, 34d are often configured to be identifiable by illumination from incident light, while solder balls 92 are easily identifiable by illumination from oblique light. Therefore, as Figure 9 As shown, in this embodiment, the substrate camera 15, which serves as the imaging device CU0, includes a reference light source 15a, an incident light conversion unit 15b, and a solder ball light source 15c. The reference light source 15a is the light source that illuminates the reference section 34d. The incident light conversion unit 15b converts the illumination light emitted from the reference light source 15a into incident light and illuminates the reference section 34d from above in the vertical direction (Z-axis direction).

[0080] The solder ball light source 15c illuminates a plurality of solder balls 92 in the obliquely upward illumination chamber unit 50 at a predetermined angle relative to the vertical direction (Z-axis direction). This predetermined angle is the angle at which the solder balls 92 can be identified and can be preset based on simulation, actual machine verification, etc. Furthermore, the reference light source 15a and the solder ball light source 15c can, for example, use known light-emitting diodes (LEDs), and the wavelength of the illuminated light is not limited. Additionally, the incident light conversion unit 15b can, for example, use a semi-transparent mirror.

[0081] The reference light source 15a illuminates the incident light conversion unit 15b (arrow L11). The illumination light from the reference light source 15a is reflected by the incident light conversion unit 15b and travels towards the reference unit 34d (arrow L12). The reflection angle is set to 90 degrees. The illumination light reflected from the reference unit 34d travels towards the lens 15d (arrow L13). The illumination light reaching the lens 15d passes through the lens 15d and reaches the imaging element 15e (arrow L14).

[0082] Furthermore, the solder ball light source 15c illuminates the plurality of solder balls 92 from an obliquely upward angle relative to the vertical direction (Z-axis direction) (arrow L21). The illumination light reflected from the plurality of solder balls 92 travels toward the lens 15d (arrow L22). The illumination light reaching the lens 15d passes through the lens 15d and travels toward the imaging element 15e (arrow L23).

[0083] In this way, the imaging unit 81 acquires image data PD0 of the reference section 34d, which is illuminated by the reference section light source 15a and the incident light conversion unit 15b, and image data PD0 of the multiple solder balls 92, which is illuminated by the solder ball light source 15c. In this case, the determination unit 82 can identify the multiple solder balls 92 of the chamber unit 50 based on the image data PD0 of the reference section 34d and the image data PD0 of the multiple solder balls 92, with the reference section 34d as a reference, and determine whether the solder balls 92 can be picked up.

[0084] The determination unit 82 can determine from various perspectives whether the component mounter 10 can pick up the solder ball 92. For example, the determination unit 82 can determine whether the component mounter 10 can pick up the solder ball 92 based on the presence or absence of the solder ball 92. In this case, the determination unit 82 can determine that the chamber 51 containing the solder ball 92 is a chamber 51 that can be picked up by the component mounter 10, and determine that the chamber 51 that does not contain the solder ball 92 is a chamber 51 that cannot be picked up by the component mounter 10.

[0085] The determination unit 82 can also determine whether the solder ball 92 can be picked up by the component mounter 10 based on whether the solder ball 92 is properly housed in the chamber 51. In this case, the determination unit 82 can determine that the chamber 51 in which the solder ball 92 is properly housed is a chamber 51 in which the component mounter 10 can pick up the solder ball 92, and determine that the chamber 51 in which the solder ball 92 is not properly housed is a chamber 51 in which the component mounter 10 cannot pick up the solder ball 92.

[0086] For example, the determination unit 82 performs image processing on the image data PD0 of the chamber unit 50 to identify the solder ball 92. The determination unit 82 determines whether the solder ball 92 is properly housed in the chamber 51 by comparing the identification area of ​​the solder ball 92 identified in the image data PD0 with a predetermined area in the image data PD0 where the solder ball 92 should be identified. Specifically, the determination unit 82 determines that the solder ball 92 is properly housed in the chamber 51 when it determines that a specific amount (e.g., at least one of the area, outer perimeter length, shape, etc.) of the identification area of ​​the solder ball 92 is within the allowable range of the specific amount of the predetermined area.

[0087] When the determination unit 82 determines that the solder ball 92 is not properly housed in the chamber 51 if a specific quantity in the identification area of ​​the solder ball 92 is not within the allowable range of a specific quantity in the predetermined area, the determination unit 82 determines that the solder ball 92 is not properly housed in the chamber 51. In addition, the determination unit 82 determines the presence or absence of the solder ball 92 in each of the multiple chambers 51. It can also determine whether the solder ball 92 can be picked up by the component mounting machine 10, relative to the chamber 51 that is determined to contain the solder ball 92.

[0088] Figure 10An example of image data PD0 showing a portion of the chamber unit 50 is shown. This figure illustrates an example of the housing state of solder balls 92 in 18 chambers 51, arranged in three in the transport direction of the solder balls 92 and six in the width direction of the transport path Rd0. For ease of explanation, the chamber 51 on the far left and top of the page in this figure is designated as the chamber 51 in the first row and first column. For example, as with the chamber 51 in the first row and first column, a chamber 51 exists where a specific amount (e.g., area) of the identification area of ​​the solder balls 92 is within an allowable range of a specific amount of a predetermined area, thus appropriately housing the solder balls 92. In this case, the determination unit 82 determines that the component mounting machine 10 can pick up the solder balls 92.

[0089] As with chambers 51 in the second row and fourth column and chambers 51 in the second row and fifth column, there are chambers 51 in which a plurality of solder balls 92 overlap. In this case, a certain amount (e.g., area) of the identification area of ​​the solder balls 92 is greater than the allowable range of a certain amount of the predetermined area. Furthermore, as with chambers 51 in the first row and third column, chambers 51 in the second row and first column, and chambers 51 in the third row and third column, there are chambers 51 in which no solder balls 92 are contained. In any of the above cases, the determination unit 82 determines that the component mounting machine 10 cannot pick up the solder balls 92.

[0090] Furthermore, the determination unit 82 is only required to determine whether the component mounting machine 10 can pick up the solder ball 92, and the image processing method for the image data PD0 is not limited. In this embodiment, the chamber unit 50 is colored with a black color (e.g., black). In this case, the white solder ball 92 can be easily identified through binarization processing. Therefore, the determination unit 82 performs binarization processing on the image data PD0 of the chamber unit 50 acquired by the imaging unit 81 to identify the white solder ball 92 and determine whether the solder ball 92 can be picked up.

[0091] in addition, Figure 10 For ease of illustration, the chamber unit 50 is shown in white. Furthermore, even when the chamber unit 50 is not colored in a black color, the determination unit 82 can still binarize the image data PD0 of the chamber unit 50 to identify the solder ball 92 and determine whether the solder ball 92 can be picked up. In this case, compared to when the chamber unit 50 is colored in a black color, the threshold for binarization is lowered.

[0092] 1-3-2. Instruction Unit 83 and Transport Control Unit 84

[0093] The indicator unit 83 causes the component mounting machine 10 to pick up the solder ball 92 contained in the chamber 51a that is determined by the determination unit 82 to be capable of picking up the solder ball 92, thus enabling the pick-up of the solder ball 92 in chamber 51a. Figure 8 Step S13 (as shown).

[0094] Figure 10 In the example shown, the pick-up chamber 51a includes chambers 51 appropriately housing solder balls 92, such as the chambers 51 in the first row and first column, the chambers 51 in the first row and second column, the chambers 51 in the first row and fourth column, the chambers 51 in the first row and fifth column, and the chambers 51 in the first row and sixth column. Pick-up chambers 51a are also included in the chambers 51 in the second and third rows. The indicator unit 83 causes the component mounting machine 10 to pick up the solder balls 92 housed in these chambers 51.

[0095] Specifically, the mounting head 13c supports multiple holding members 13d (nozzles) capable of picking up (adsorbing) a solder ball 92. The indicator 83 directs the holding members 13d to sequentially pick up (adsorb) the solder balls 92 housed in the pick-up chamber 51a. Thus, the component mounter 10 can pick up only the solder balls 92 housed in the pick-up chamber 51a, thereby suppressing solder ball 92 pickup failures and increasing the productivity of the component mounter 10. Furthermore, the solder balls 92 picked up by the holding members 13d are supplied to a predetermined area of ​​the substrate 90. This predetermined area, for example, includes the mounting area of ​​components 91 mounted via solder balls 92, such as components 91 in a BGA (Ball Grid Array).

[0096] If the number of unpickable chambers 51b that the determination unit 82 determines cannot pick up solder balls 92 exceeds a predetermined allowable number, the transport control unit 84 changes the transport control of multiple solder balls 92 in the transport path Rd0 (yes in step S14 and step S15). Then, control is temporarily terminated. If the number of unpickable chambers 51b is less than the allowable number (no in step S14), the process shown in step S15 is not executed, and control is temporarily terminated.

[0097] Figure 10 In the example shown, the non-pickup chamber 51b includes chambers 51 such as chambers 51 in row 2, column 4 and 2, column 5, where multiple solder balls 92 are overlapped in one chamber. If the number of non-pickup chambers 51b with multiple solder balls 92 overlapping in one chamber exceeds the allowable number, the component mounter 10 may be able to pick up fewer solder balls 92 than required, potentially reducing the production output of the component mounter 10.

[0098] In this case, it is assumed that the number of solder balls 92 transported to chamber unit 50 is greater than the appropriate number. The transport control that transports multiple solder balls 92 in the direction towards chamber unit 50 along transport path Rd0 is designated as forward transport control. If the forward transport control time is shortened compared to the original transport control, it is easier to reduce the number of solder balls 92 transported to chamber unit 50. Furthermore, the transport control that transports multiple solder balls 92 in the direction towards housing 70 along transport path Rd0 is designated as backward transport control. If the backward transport control time is longer than the original transport control, it is easier to reduce the number of solder balls 92 transported to chamber unit 50.

[0099] Therefore, it is preferable that the transport control unit 84 is modified to either a transport control that shortens the forward transport control time compared to the previous one, or a transport control that lengthens the backward transport control time compared to the previous one. As a result, the solder ball feeder 30 can reduce the number of solder balls 92 transported to the chamber unit 50 compared to the previous transport control, thereby optimizing the number of solder balls 92 transported to the chamber unit 50.

[0100] also, Figure 10 In the example shown, the non-pickup chambers 51b include chambers 51 that do not contain solder balls 92, such as chambers 51 in the first row and third column, chambers 51 in the second row and first column, and chambers 51 in the third row and third column. If the number of non-pickup chambers 51b that do not contain solder balls 92 exceeds the allowable number, the component mounting machine 10 may be able to pick up fewer solder balls 92 than required, potentially reducing the production output of the component mounting machine 10.

[0101] In this situation, it is assumed that the number of solder balls 92 transported to chamber unit 50 is less than the appropriate number. If the forward transport control time is longer than before the change in transport control, it is easy to increase the number of solder balls 92 transported to chamber unit 50. Furthermore, if the backward transport control time is shorter than before the change in transport control, it is easy to increase the number of solder balls 92 transported to chamber unit 50.

[0102] Therefore, it is preferable that the transport control unit 84 is modified to either a transport control that makes the forward transport control time longer than before the modification, or a transport control that makes the backward transport control time shorter than before the modification. As a result, the solder ball feeder 30 can increase the number of solder balls 92 transported to the chamber unit 50 compared to before the modification of the transport control, thereby optimizing the number of solder balls 92 transported to the chamber unit 50.

[0103] Furthermore, in any given situation, the allowable number of non-pickup chambers 51b and the percentage increase or decrease in vibration time can be predetermined through methods such as simulation or actual machine verification. For example, if the number of non-pickup chambers 51b exceeds a certain limit, the production output of the component mounting machine 10 is likely to decrease. Therefore, the allowable number of non-pickup chambers 51b can be set to match the number of non-pickup chambers 51b when the production output of the component mounting machine 10 begins to fall below the allowable value.

[0104] Furthermore, if the maximum number of solder balls 92 picked up in a single pick-and-release cycle cannot be guaranteed due to the increase in the number of non-pick-up chambers 51b, the production rate of the component mounting machine 10 is likely to decrease. Therefore, the allowable number of non-pick-up chambers 51b can be set to match the number of non-pick-up chambers 51b when the maximum number of solder balls 92 picked up in a single pick-and-release cycle cannot be guaranteed at the beginning.

[0105] As already described, the vibration device 40 includes a forward support member 41a, a backward support member 41b, a forward vibrator 42a, and a backward vibrator 42b. The forward support member 41a is used in the forward transport control of moving multiple solder balls 92 in the transport path Rd0 towards the chamber unit 50, and supports the track member 34. The backward support member 41b is used in the backward transport control of moving multiple solder balls 92 in the transport path Rd0 towards the housing 70, and supports the track member 34. The forward vibrator 42a is disposed on the forward support member 41a. The backward vibrator 42b is disposed on the backward support member 41b.

[0106] In this configuration, the transport control unit 84 modifies the transport control by increasing or decreasing at least one of the vibration time of the forward oscillator 42a and the vibration time of the backward oscillator 42b compared to the previous configuration. Specifically, when the transport control unit 84 modifies the transport control to a configuration where the forward transport control time is shorter than before, it shortens the vibration time of the forward oscillator 42a. When the transport control unit 84 modifies the transport control to a configuration where the backward transport control time is longer than before, it lengthens the vibration time of the backward oscillator 42b.

[0107] Furthermore, when the transport control unit 84 changes to a transport control that increases the forward transport control time compared to the previous one, it also increases the vibration time based on the forward oscillator 42a compared to the previous one. When the transport control unit 84 changes to a transport control that shortens the backward transport control time compared to the previous one, it also shortens the vibration time based on the backward oscillator 42b compared to the previous one.

[0108] 2. Solder ball supply method

[0109] The same applies to the solder ball supply method as described for the solder ball supply device 80. Specifically, the solder ball supply method is applied to a solder ball feeder 30 that includes a feeder body 31, a track component 34, a vibration device 40, and a chamber unit 50, and includes an imaging process and a judgment process. The imaging process corresponds to the control performed by the imaging unit 81. The judgment process corresponds to the control performed by the judgment unit 82. The solder ball supply method may also include an indication process. The indication process corresponds to the control performed by the indication unit 83. The solder ball supply method may also include a transport control process. The transport control process corresponds to the control performed by the transport control unit 84.

[0110] 3. An example of the effect of the implementation method

[0111] According to the solder ball supply device 80, it is possible to determine whether each of the multiple chambers 51 can be picked up by the component mounting machine 10, and it is possible to identify the chamber 51 containing solder balls 92 that can be picked up by the component mounting machine 10. The same applies to the solder ball supply method as described in the solder ball supply device 80.

[0112] Explanation of reference numerals in the attached figures

[0113] 10... Component mounting machine; 12... Supply device; 12a... Slot; 15a... Reference light source; 15b... Spectrophotometer conversion unit; 15c... Solder ball light source; 30... Solder ball feeder; 31... Feeder body; 34... Track component; 34d... Reference unit; 40... Vibration device; 41a... Forward support component; 41b... Reverse support component; 42a... Forward vibrator; 42b... Reverse vibrator; 50... Chamber unit; 51... Chamber; 51a... Pickable chamber; 51b... Non-pickable chamber; 70... Housing; 80... Solder ball supply device; 81... Imaging unit; 82... Judgment unit; 83... Indicator unit; 84... Transport control unit; 92... Solder ball; As0... Supply area; Rd0... Transport path; CU0... Imaging device; PD0... Image data; Z-axis direction... Vertical direction.

Claims

1. A welding ball supply device, applied to a welding ball feeder, The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; A vibration device applies vibration to the track component to transport the plurality of solder balls on the transport path to a supply area that can be picked up by the component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The welding ball supply device includes: The imaging unit enables the imaging device to capture images of the chamber unit carrying the plurality of solder balls; The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit, and determines whether the solder ball can be picked up by the component mounting machine for each of the multiple chambers; and The indicator unit causes the component mounting machine to pick up the solder ball housed in the pick-up chamber, which is determined by the determination unit to be capable of picking up the solder ball. The component mounting machine supports multiple holding components capable of picking up one of the solder balls. The indicator causes the holding component to sequentially pick up the solder balls contained in the pickable chamber.

2. The welding ball supply device according to claim 1, wherein, The system includes a transport control unit that, when the number of unpickable chambers exceeds a predetermined allowable number, changes the transport control of the plurality of solder balls on the transport path. The unpickable chambers are those determined by the determination unit to be unable to pick up the solder balls.

3. The welding ball supply device according to claim 1, wherein, The solder ball feeder is installed in a predetermined slot among the multiple slots of the supply device of the component mounting machine.

4. A welding ball supply device, applied to a welding ball feeder, The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; vibration applying means for applying vibration to the track member to carry the plurality of solder balls on the carrying path to a supply area where the solder balls can be picked up by a component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The welding ball supply device includes: The imaging unit enables the imaging device to capture images of the chamber unit carrying the plurality of solder balls; The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit, and determines whether the solder ball can be picked up by the component mounting machine for each of the multiple chambers; and The transport control unit, when the number of unpickable chambers exceeds a predetermined allowable number, modifies the transport control of the plurality of solder balls on the transport path. The unpickable chambers are those determined by the determination unit to be incapable of picking up the solder balls. When the transport control that moves the plurality of solder balls along the transport path in the direction towards the chamber unit is used as forward transport control, and the transport control that moves the plurality of solder balls along the transport path in the direction towards the housing is used as backward transport control, If the number of unpickable chambers in which a plurality of the solder balls overlap exceeds the allowable number, the transport control unit is changed to at least one of a transport control that shortens the time of the forward transport control compared to the previous one and a transport control that lengthens the time of the backward transport control compared to the previous one.

5. The welding ball supply device according to claim 4, wherein, The device includes an indicator unit that causes the component mounting machine to pick up the solder ball housed in a pickable chamber, the pickable chamber being a chamber determined by the determination unit to be capable of picking up the solder ball.

6. The welding ball supply device according to claim 4, wherein, The solder ball feeder is installed in a predetermined slot among the multiple slots of the supply device of the component mounting machine.

7. A welding ball supply device, applied to a welding ball feeder, The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; vibration applying means for applying vibration to the track member to carry the plurality of solder balls on the carrying path to a supply area where the solder balls can be picked up by a component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The welding ball supply device includes: The imaging unit enables the imaging device to capture images of the chamber unit carrying the plurality of solder balls; The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit, and determines whether the solder ball can be picked up by the component mounting machine for each of the multiple chambers; and If the number of unpickable chambers exceeds a predetermined allowable number, the transport control unit adjusts the transport control of the plurality of solder balls on the transport path. The unpickable chambers are those determined by the determination unit to be unable to pick up the solder balls. When the transport control that moves the plurality of solder balls along the transport path in the direction towards the chamber unit is used as forward transport control, and the transport control that moves the plurality of solder balls along the transport path in the direction towards the housing is used as backward transport control, If the number of uncollectible chambers that do not contain the solder balls exceeds the allowable number, the transport control unit is changed to at least one of the transport control that makes the forward transport control time longer than before the change and the transport control that makes the backward transport control time shorter than before the change.

8. The welding ball supply device according to claim 7, wherein, The device includes an indicator unit that causes the component mounting machine to pick up the solder ball housed in a pickable chamber, the pickable chamber being a chamber determined by the determination unit to be capable of picking up the solder ball.

9. The welding ball supply device according to claim 7, wherein, The solder ball feeder is installed in a predetermined slot among the multiple slots of the supply device of the component mounting machine.

10. A welding ball supply device, applied to a welding ball feeder, The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; A vibration device applies vibration to the track component to transport the plurality of solder balls on the transport path to a supply area that can be picked up by the component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The welding ball supply device includes: The imaging unit enables the imaging device to capture images of the chamber unit carrying the plurality of solder balls; The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit, and determines whether the solder ball can be picked up by the component mounting machine for each of the multiple chambers; and The transport control unit, when the number of unpickable chambers exceeds a predetermined allowable number, changes the transport control of the plurality of solder balls on the transport path. The unpickable chambers are those determined by the determination unit to be unable to pick up the solder balls. The vibration-inducing device includes: A forward support component is used in the forward transport control of moving the plurality of welding balls along the transport path toward the chamber unit, and supports the track component. A reversible support component is used in the reversible transport control of transporting the plurality of welding balls in the direction toward the housing along the transport path, and supports the track component. A forward-moving oscillator is disposed on the forward-moving support member; and A retractable vibrator is mounted on the retractable support component. The transport control unit alters the transport control by increasing or decreasing at least one of the vibration time of the forward oscillator and the vibration time of the backward oscillator compared to the previous time.

11. The welding ball supply device according to claim 10, wherein, The device includes an indicator unit that causes the component mounting machine to pick up the solder ball housed in a pickable chamber, the pickable chamber being a chamber determined by the determination unit to be capable of picking up the solder ball.

12. The welding ball supply device according to claim 10, wherein, The solder ball feeder is installed in a predetermined slot among the multiple slots of the supply device of the component mounting machine.

13. A welding ball supply device, applied to a welding ball feeder, The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; vibration applying means for applying vibration to the track member to carry the plurality of solder balls on the carrying path to a supply area where the solder balls can be picked up by a component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The welding ball supply device includes: The imaging unit enables the imaging device to capture images of the chamber unit carrying the plurality of solder balls; and The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit, and determines whether the component mounting machine can pick up the solder ball for each of the multiple chambers. At least one reference portion is provided in the supply area for use in identifying the position of the plurality of chambers of the chamber unit. The imaging device includes: A reference light source illuminates the reference section; The incident light conversion unit converts the illumination light emitted from the light source of the reference unit into incident light, thereby illuminating the reference unit from above in the vertical direction; and A solder ball light source illuminates the plurality of solder balls of the chamber unit from an oblique upward angle at a predetermined angle relative to the vertical direction. The imaging unit acquires image data of the reference unit captured by illuminating the reference unit using the reference unit light source and the incident light conversion unit, and image data of the plurality of solder balls captured by illuminating the plurality of solder balls using the solder ball light source. The determination unit identifies the plurality of solder balls in the chamber unit based on the image data of the reference unit and the image data of the plurality of solder balls, using the reference unit as a reference, and determines whether the solder balls can be picked up.

14. The welding ball supply device according to claim 13, wherein, The device includes an indicator unit that causes the component mounting machine to pick up the solder ball housed in a pickable chamber, the pickable chamber being a chamber determined by the determination unit to be capable of picking up the solder ball.

15. The welding ball supply device according to claim 13, wherein, The system includes a transport control unit that, when the number of unpickable chambers exceeds a predetermined allowable number, changes the transport control of the plurality of solder balls on the transport path. The unpickable chambers are those determined by the determination unit to be unable to pick up the solder balls.

16. The welding ball supply device according to claim 13, wherein, The solder ball feeder is installed in a predetermined slot among the multiple slots of the supply device of the component mounting machine.

17. A welding ball supply device, applied to a welding ball feeder, The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; A vibration device applies vibration to the track component to transport the plurality of solder balls on the transport path to a supply area that can be picked up by the component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The welding ball supply device includes: The imaging unit enables the imaging device to capture images of the chamber unit carrying the plurality of solder balls; and The determination unit performs image processing on the image data of the chamber unit acquired by the imaging unit, and determines whether the component mounting machine can pick up the solder ball for each of the multiple chambers. The chamber unit is colored in a black color scheme. The determination unit performs binarization processing on the image data of the chamber unit acquired by the imaging unit to identify the white solder balls, thereby determining whether the solder balls can be picked up.

18. The welding ball supply device according to claim 17, wherein, The device includes an indicator unit that causes the component mounting machine to pick up the solder ball housed in a pickable chamber, the pickable chamber being a chamber determined by the determination unit to be capable of picking up the solder ball.

19. The welding ball supply device according to claim 17, wherein, The system includes a transport control unit that, when the number of unpickable chambers exceeds a predetermined allowable number, changes the transport control of the plurality of solder balls on the transport path. The unpickable chambers are those determined by the determination unit to be unable to pick up the solder balls.

20. The welding ball supply device according to claim 17, wherein, The solder ball feeder is installed in a predetermined slot among the multiple slots of the supply device of the component mounting machine.

21. A method for supplying solder balls, applied to a solder ball feeder. The welding ball feeder includes: The main body of the feeder; The track component is configured to vibrate relative to the feeder body and has a transport path for transporting multiple welding balls discharged from the housing; A vibration device applies vibration to the track component to transport the plurality of solder balls on the transport path to a supply area that can be picked up by the component mounting machine; and A chamber unit, comprising multiple chambers in the supply area, wherein each chamber is designed to contain one of the multiple solder balls transported to the supply area. The solder ball supply method comprises: The imaging process involves the imaging device capturing images of the chamber unit containing the plurality of welding balls. The determination process involves processing the image data of the chamber unit obtained by the shooting process to determine whether the solder ball can be picked up by the component mounting machine for each of the multiple chambers. and The instruction process causes the component mounting machine to pick up the solder ball housed in the pick-up chamber, the pick-up chamber being the chamber determined by the determination process to be capable of picking up the solder ball. In the indicated process, the holding components of the component mounting machine, which support multiple holding components capable of picking up one of the solder balls, sequentially pick up the solder ball housed in the pickable chamber.

Images