Powder supply management device for a laser shaping apparatus

Abstract

The technology disclosed in the present specification relates to a powder supply management device for a laser forming device that manages powder supply so as to supply a fixed amount of powder required for laser forming, the powder supply management device for a laser forming device disclosed in the present specification including: a hopper that discharges powder; a main sampling portion that guides a portion of the powder discharged from the hopper to a laser forming device and guides the remaining powder elsewhere to be discharged; and a discharge monitoring portion that calculates the amount of the remaining powder separated from the main sampling portion.

Description

Technical Field

[0001] This invention relates to a powder supply management device for a laser forming apparatus, and more particularly to a powder supply management device for a laser forming apparatus that manages the powder supply in order to supply a fixed amount of powder required for laser forming. Background Technology

[0002] The technology disclosed in this specification relates to a powder supply management device for laser forming apparatus, representative of which is laser-aided direct metal manufacturing (LAM). LAM employs laser cladding technology, using functional materials (such as metals, alloys, or ceramics) to precisely and directly perform laser welding based on three-dimensional digital image information stored in a computer, producing three-dimensional products or tools for product manufacturing in a very short time. Three-dimensional geometric information refers to 3D CAD data, medical CT (Computer Tomography) and MRI (Magnetic Resonance Imaging) data, and digital data measured by a 3D object digitizing system. Tools refer to mass production molds required for product manufacturing, such as dies or molds. Compared to traditional machining methods using CNC (Computerized Numerical Control) and other machining machinery for cutting, casting, etc., this technology can produce metal prototypes, mass-produced molds, complex-shaped final products, and various tools in an unparalleled short time. It is also suitable for restoration, remodeling, and repairing molds using reverse engineering. The basic concept of realizing physical shapes from CAD data is similar to that of a conventional printer. Just as a printer uses document data files stored in a computer to create documents by applying ink to precise locations on a two-dimensional paper plane, direct metal manufacturing uses three-dimensional CAD data to realize three-dimensional physical shapes by shaping the required amount of functional material at precise locations in three-dimensional space. This technology has been developed into 3D printers and has recently been commercialized in various directions based on the properties of materials such as plastics, ceramics, paper, and metals. In laser-assisted direct metal manufacturing, laser cladding technology is used to achieve physical shaping of two-dimensional planes.

[0003] The existing Korean Patent Publication No. 10-2017-0097420 (published on August 28, 2017, "An apparatus for manufacturing amorphous metal using a 3D metal printer and amorphous metal manufactured therefrom") includes: a laser irradiation unit that irradiates a sample with a laser to generate a molten pool; a powder supply unit that supplies metal powder to the generated molten pool; a control unit that controls the movement of the laser irradiation unit based on the thickness of the molten metal containing the metal powder and 3D CAD data; and a cooling unit that rapidly cools the molten metal into amorphous metal. The apparatus for manufacturing amorphous metal using a 3D metal printer may further include: an imaging unit that captures an image of the molten metal; and an image analysis unit that analyzes the captured image to measure the thickness of the molten metal. The control unit can calculate a tool path based on the 3D CAD data and move the laser irradiation unit along the calculated tool path when the thickness of the molten metal reaches a preset thickness. The cooling unit can use an inert gas to rapidly cool the molten metal into amorphous metal along the tool path at a preset thickness. The metal powder may include one or more of Ni, Ce, La, Gd, Mg, Y, Sm, Zr, Fe, Ti, Co, Al, Cu, Mo, Sn, Nb, and Si. The amorphous metal manufacturing apparatus using a three-dimensional metal printer may further include: a laser oscillation unit for oscillating the laser beam; and a laser focusing unit for focusing the oscillating laser beam. The laser irradiation unit can irradiate the sample with the focused laser beam. The control unit can control the movement of the laser irradiation unit to maintain the focal length of the laser beam during irradiation. The control unit can control the ejection speed of the metal powder supplied from the powder supply unit based on the moving speed of the laser irradiation unit. The amorphous metal according to the present invention can be manufactured using the amorphous metal manufacturing apparatus using a three-dimensional metal printer.

[0004] The powder in the aforementioned prior art needs to be controlled together with the laser irradiation unit. A representative example is the existing Korean Patent Publication No. 10-2016-0124710 (published on October 28, 2016, "Vibrating Hopper Tank Device"), which is a vibrating hopper tank device for moving raw materials obtained through a large feeder and a small feeder vibrating hopper and a large feeder vibrating hopper installed in front of the large feeder and the small feeder vibrating hopper to the front and feeding them into a weighing unit. It includes: a supply unit, including a supply unit installed below the large feeder and the small feeder. The vibrating hopper comprises a first bottom, a first left side wall connected to the left end of the first bottom, a first right side wall connected to the right end of the first bottom, and a first rear wall connected to the rear end of the first bottom. It has an internal space enclosed by the first bottom, the first left side wall, the first right side wall, and the first rear wall, and is open at the front and top. It also includes large and small feed troughs that extend forward from the front end of the first bottom. The large and small feed troughs include a width contraction section whose rear end is connected to the front end of the supply section, and whose width narrows as the left and right edges move closer to the center. A small feed transfer section is connected to the front end of the width contraction section at its rear end and extends forward, but maintains a constant left and right width. The large feed trough, located below the large and small feed troughs, includes a second bottom mounted on top of the vibrating feeder for the large feed, a second left side wall erected with its lower end connected to the left end of the second bottom, a second right side wall erected with its lower end connected to the right end of the second bottom, and a second rear wall erected with its lower end connected to the rear end of the second bottom. It has an internal space enclosed by the second bottom, the second left side wall, the second right side wall, and the second rear wall, with openings at the front and top to receive material flowing down from the left and right edges of the width contraction section. The material is discharged to the metering section through the front edge of the second bottom. The front end of the small feed transfer section is located in front of the front end of the second bottom.

[0005] In addition, existing Korean Patent Publication No. 10-2016-0124710 (published on October 28, 2016, "Vibrating Hopper Groove Device") and other vibrating hoppers used in molding devices such as 3D printers move the supplied object (powder, etc.) obtained by the object supply device to the outside through vibration so that the supplied object is evenly spread out, and the amount discharged to the outside is constant according to the moving speed of the object. Summary of the Invention

[0006] The problem to be solved

[0007] In existing laser forming equipment, due to various reasons, the amount of powder supplied from the powder storage hopper to the laser forming equipment cannot be uniformly supplied to the laser forming equipment, which leads to the problem of defective formed products. Therefore, it is necessary to confirm whether the formed products are defective through a separate process.

[0008] Therefore, the purpose of the technology disclosed in this specification is to provide a powder supply management device for a laser forming apparatus that allows for the early determination of whether the formed product is defective, by controlling the flow of powder supplied from a hopper to a laser forming apparatus.

[0009] Problem Solution

[0010] In one embodiment, a powder supply management device for a laser forming apparatus is disclosed.

[0011] This specification discloses a powder supply management device for a laser forming apparatus, comprising: a hopper 100 for discharging powder; a main sampling unit 200 for guiding a portion of the powder discharged from the hopper 100 to the laser forming apparatus 1 and guiding the remaining powder to other locations for discharge; and a discharge monitoring unit 300 for calculating the amount of remaining powder separated from the main sampling unit 200.

[0012] This specification discloses a powder supply management device for a laser forming apparatus, which optionally further includes guiding a portion of the powder discharged from the main sampling unit 200 to the discharge monitoring unit 300 for discharge, and guiding the remaining powder to the sub-sampling unit 400 of the laser forming apparatus 1.

[0013] This specification discloses a powder supply management device for a laser forming apparatus, which optionally includes a storage monitoring unit 500 for photographing the powder storage status inside the hopper 100.

[0014] The main sampling unit 200 of a powder supply management device for a laser forming apparatus disclosed in this specification includes: a main cutter unit 210 connected to the hopper 100 and cutting the powder discharged from the hopper 100; a main first guide tube 220 connected to one side of the main cutter unit 210 and guiding the cut powder to the laser forming apparatus 1; and a main second guide tube 230 connected to the other side of the main cutter unit 210 and guiding the remaining cut powder to the discharge monitoring unit 300.

[0015] The main cutter section 210 of a powder supply management device for a laser forming apparatus disclosed in this specification includes a cutter guide section 212, which includes a pair of cutters 211 that are separated from each other to form a first channel space 10. Another cutter 211 is provided on the side of the cutter 211 to form a second channel space 20. The first channel space 10 and the second channel space 20 are connected to each other on one side and separated in different directions on the other side, covering the side of the cutter 211, so that powder moves to the first channel space 10 and the second channel space 20.

[0016] This specification discloses a first channel space 10 and a second channel space 20 formed by a pair of cutters 211 separated from each other in a powder supply management device for a laser forming apparatus, comprising: a vertical space 2 in a vertical direction; and a horizontal space 3 connected to the vertical space 2 and inclined in the horizontal direction.

[0017] This specification discloses a sub-sampling unit 400 for a powder supply management device for a laser forming apparatus, comprising: a sub-cutter unit 410 connected to the main sampling unit 200 and dividing and guiding the powder to the discharge monitoring unit 300; a sub-first guide tube 420 connected to one side of the sub-cutter unit 410 and guiding the divided powder to the laser forming apparatus 1; and a sub-second guide tube 430 connected to the other side of the sub-cutter unit 410 and guiding the remaining divided powder to the discharge monitoring unit 300.

[0018] Invention Effects

[0019] The powder supply management device for a laser forming apparatus disclosed in this specification can sample a portion of the powder supplied from the hopper 100 to the forming apparatus 1 via the main cutter unit 200, and determine whether the quantity is correct via the discharge monitoring unit 300. The powder supply management device for a laser forming apparatus allows operators to manage the flow of powder supplied from the hopper 100 to the laser forming apparatus 1 in order to determine whether the formed product is defective.

[0020] The foregoing provides only selective concepts in a brief form for the matters to be described in detail. This content is not intended to limit the essential or necessary features of the claims or the scope of the claims. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of an embodiment of the technology disclosed in this specification;

[0022] Figure 2 This is a schematic diagram of an example of the main sampling section disclosed in this specification;

[0023] Figure 3 for Figure 2An exploded view of a typical example of the main cutter section;

[0024] Figure 4 for Figure 2 Another exploded view of the main cutter section;

[0025] Figure 5 for Figure 2 Another exploded view of the main cutter section;

[0026] Figure 6 This is a schematic diagram of another embodiment of the technology disclosed in this specification;

[0027] Figure 7 This is another schematic diagram of the cutter section disclosed in this specification;

[0028] Figure 8 This is a schematic diagram of another embodiment disclosed in this specification. Detailed Implementation

[0029] The embodiments disclosed herein will now be described in detail with reference to the accompanying drawings. Unless otherwise stated, similar reference numerals in the drawings denote similar structures. The specific descriptions, drawings, and exemplary embodiments described in the claims are not limiting; other embodiments may be utilized, and other modifications may be made without departing from the technical concept or scope disclosed herein. Those skilled in the art will readily recognize the structures of this disclosure, i.e., the structures described and illustrated herein, through other arrangements, configurations, combinations, and representations of structures, which are obvious and constitute a part of this disclosure. In the drawings, to more clearly represent the layers (or films), regions, and shapes, the width, length, thickness, or shape of the structure may be exaggerated.

[0030] When described as a structure “set on” another structure, it includes not only the case where one structure is directly set on another structure, but also the case where there are additional structures between them.

[0031] When a structure is described as being "installed" on another structure, this includes not only the case where one structure is directly installed on another structure, but also the case where there are additional structures between them.

[0032] The disclosed technical content is merely an example to illustrate the structure or function, and therefore the scope of the disclosed technology should not be limited to the embodiments described herein. That is, the embodiments can be modified in various ways and have various forms; therefore, the scope of the disclosed technology should include equivalents that realize the technical idea.

[0033] In the absence of a clear distinction in the context, a singular description may contain the meaning of a plural. Terms such as "including" or "possessing" indicate the presence of the features, numbers, steps, actions, structures, components, or combinations thereof described in the specification, rather than pre-excluding the presence or additional possibility of one or more other features, numbers, steps, actions, structures, components, or combinations thereof.

[0034] Unless otherwise specified, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms that are generally used identically to those defined in dictionaries have the same meaning as in the context of the relevant art, and unless explicitly defined, do not have an ideal or excessive meaning in this application.

[0035] The appendix to this instruction manual Figure 1 This is a schematic diagram of an embodiment of the technology disclosed in this specification. Figure 2 This is a schematic diagram of an example of the main sampling unit disclosed in this specification. Figure 3 for Figure 2 An exploded view of an example of the main cutter section. Figure 4 for Figure 2 Another exploded view of the main cutter section. Figure 5 for Figure 2 Another exploded view of the main cutter section. Figure 6 This is a schematic diagram of another embodiment of the technology disclosed in this specification. Figure 7 This is another schematic diagram of the cutter section disclosed in this specification.

[0036] A powder supply management device for a laser forming apparatus, as shown in the accompanying drawings, generally includes: a hopper 100 for discharging powder; a main sampling unit 200 for guiding a portion of the powder discharged from the hopper 100 to the laser forming apparatus 1 and guiding the remaining powder to other locations for discharge; and a discharge monitoring unit 300 for calculating the amount of remaining powder separated from the main sampling unit 200.

[0037] This specification discloses a powder supply management device for a laser forming apparatus, which optionally further includes guiding a portion of the powder discharged from the main sampling unit 200 to the discharge monitoring unit 300 for discharge, and guiding the remaining powder to the sub-sampling unit 400 of the laser forming apparatus 1.

[0038] This specification discloses a powder supply management device for a laser forming apparatus, which optionally includes a storage monitoring unit 500 for photographing the powder storage status inside the hopper 100.

[0039] The main sampling unit 200 of a powder supply management device for a laser forming apparatus disclosed in this specification includes: a main cutter unit 210 connected to the hopper 100 and cutting the powder discharged from the hopper 100; a main first guide tube 220 connected to one side of the main cutter unit 210 and guiding the cut powder to the laser forming apparatus 1; and a main second guide tube 230 connected to the other side of the main cutter unit 210 and guiding the remaining cut powder to the discharge monitoring unit 300.

[0040] The main cutter section 210 of a powder supply management device for a laser forming apparatus disclosed in this specification includes a cutter guide section 212, which includes a pair of cutters 211 that are separated from each other to form a first channel space 10. Another cutter 211 is provided on the side of the cutter 211 to form a second channel space 20. The first channel space 10 and the second channel space 20 are connected to each other on one side and separated in different directions on the other side, covering the side of the cutter 211, so that powder moves to the first channel space 10 and the second channel space 20.

[0041] This specification discloses a first channel space 10 and a second channel space 20 formed by a pair of cutters 211 separated from each other in a powder supply management device for a laser forming apparatus, comprising: a vertical space 2 in a vertical direction; and a horizontal space 3 connected to the vertical space 2 and inclined in the horizontal direction.

[0042] This specification discloses a sub-sampling unit 400 for a powder supply management device for a laser forming apparatus, comprising: a sub-cutter unit 410 connected to the main sampling unit 200 and dividing and guiding the powder to the discharge monitoring unit 300; a sub-first guide tube 420 connected to one side of the sub-cutter unit 410 and guiding the divided powder to the laser forming apparatus 1; and a sub-second guide tube 430 connected to the other side of the sub-cutter unit 410 and guiding the remaining divided powder to the discharge monitoring unit 300.

[0043] The following is a detailed description with reference to the accompanying drawings.

[0044] Combination Figure 1 The powder supply management device for a laser forming apparatus shown in one embodiment generally includes a hopper 100, a main sampling unit 200, and a discharge monitoring unit 300.

[0045] The hopper 100 discharges powder. The hopper 100 may include a conventional hopper and a conventional feeder. The hopper 100 discharges a certain amount of powder required by the molding device 1.

[0046] like Figure 2As shown, the main sampling unit 200 guides a portion of the powder discharged from the hopper 100 to the laser forming apparatus 1, and guides the remaining powder to other locations for discharge. The main sampling unit 200 generally includes a main cutter unit 210, a main first guide tube 220, and a main second guide tube 230.

[0047] The main cutter section 210 is connected to the hopper 100 and cuts the powder discharged from the hopper 100. More specifically, the main cutter section 210 may generally include a cutter 211 and a cutter guide section 212.

[0048] like Figures 3 to 5 As shown, the cutter 211 can be used in pairs to separate two plates to form a first channel space 10.

[0049] Multiple cutters 211 may be provided. A second channel space 20 can be formed by placing another cutter 211 on the side of the cutter 211 that includes the first channel space 10. In this case, one side of the first channel space 10 and the second channel space 20 can be connected to each other. The other side can be separated in different directions.

[0050] As an example, such as Figure 3 As shown, the cutter 211 can be formed as a rectangular plate, and can cut vertically downwards from the top center to the bottom edge. The two plates cut by the cutter 211 can be separated to form a first channel space 10, which includes a vertical space 2 and a horizontal space 3 connected to the vertical space 2 and inclined horizontally. Another cutter 211 can be placed on the side of the cutter 211 containing the first channel space 10, but the cutting direction can be different. In this case, a second channel space 20 can be formed by the additionally installed cutter 211. When multiple cutters 211 are combined, the upper parts of the first channel space 10 and the second channel space 20 are interconnected, while the lower parts of the edge portions of the first channel space 10 and the second channel space 20 face different directions.

[0051] In addition, the cutter 211 can be formed into various shapes such as triangles or pentagons.

[0052] As another example, such as Figure 4As shown, the cutter 211 can be formed as a rectangular plate that can cut from the top center to the bottom edge. The two plates cut by the cutter 211 can be separated to form an inclined, straight first channel space 10. Another cutter 211 can be placed on the side of the cutter 211 containing the first channel space 10, but the cutting direction can be different. In this case, a second channel space 20 can be formed by the additionally installed cutter 211. When multiple cutters 211 are combined, the upper parts of the first channel space 10 and the second channel space 20 are interconnected, while the lower parts of the edge portions of the first channel space 10 and the second channel space 20 face different directions.

[0053] As yet another example, such as Figure 5 As shown, the cutter 211 can be formed as a rectangular plate, and can cut vertically downwards from the upper center, then to the lower edge, and finally vertically to the bottom. The two plates that the cutter 211 can separate from each other form a first channel space 10. This first channel space includes a vertical space 2 located at the upper center, a horizontal space 3 connected to the vertical space 2 and inclined horizontally, and another vertical space 2 connected to the horizontal space 3 and vertically downwards. Another cutter 211 can be placed on the side of the cutter 211 containing the first channel space 10, but the cutting direction can be different. In this case, a second channel space 20 can be formed by adding additional cutters 211. When multiple cutters 211 are combined, the upper parts of the first channel space 10 and the second channel space 20 are interconnected, while the lower parts of the edge portions of the first channel space 10 and the second channel space 20 face different directions.

[0054] In the cutter 211 described above, the upper sides of the first channel space 10 and the second channel space 20 are connected to each other. Powder discharged from the hopper 100 can flow into and freely into the first channel space 10 and the second channel space 20 from the upper sides of the first channel space 10 and the second channel space 20. Ultimately, the powder flowing into the upper part of the cutter 211 is separated from each other by the first channel space 10 and the second channel space 20 and guided in different directions for separation. Multiple cutters 211 can be provided, and the ratio of the first channel space 10 or the second channel space 20 can be easily adjusted. For example, a total of 10 cutters 211 can be combined, wherein there are 8 first passage spaces 10 and 2 second passage spaces 20. Here, 8 cutters 211 containing the first channel space 10 can be continuously combined, and 2 cutters 211 containing the second channel space 20 can be continuously combined on their sides.

[0055] The cutter guide 212 can cover the side of the cutter 211 to allow powder to move into the first channel space 10 and the second channel space 20. Specifically, the cutter guide 212 can be formed as a plate. After multiple cutters 211 are interconnected, the cutter guide 212 can be connected to the side of the cutters 211 located at both ends. The cutter guide 212 can prevent powder from detaching from the side of the first channel space 10 and the second channel space 20 of the cutter 211.

[0056] As described above, the main cutter unit 210 receives powder flowing from the hopper 100 to the upper part and separates and discharges the incoming powder into the first channel space 10 and the second channel space 20. The main cutter unit 210 determines the powder separation ratio based on the number of cutters 211 and the ratio of the first channel space 10 to the second channel space 20. For example, by combining the main cutter unit 210, which includes eight cutters 211 in the first channel space 10 and two cutters 211 in the second channel space 20, 80% of the powder moves to the first channel space 10, while 20% of the powder is discharged into the second channel space 20.

[0057] The main first guide tube 220 is connected to one side of the main cutter section 210 and guides the segmented powder to the laser forming apparatus 1. The first guide tube 220 can be a conventional tube. One side of the first guide tube 220 is connected to the lower side of the main cutter section 210 where the first channel space 10 of the cutter 211 is located. The other side of the first guide tube 220 is connected to the forming apparatus 1. For example, in a main cutter section 210 that combines eight cutters 211 including the first channel space 10 and two cutters 211 including the second channel space 20, the first guide tube 220 is connected to the first channel space 10. That is, 80% of the powder discharged from the hopper 100 moves to the forming apparatus 1 through the first guide tube 220.

[0058] The second guide tube 230 is connected to the other side of the main cutter section 210 and guides the remaining segmented powder to the discharge monitoring section 300. The second guide tube 230 can be a conventional tube. One side of the second guide tube 230 is connected to the lower side of the main cutter section 210 where the second channel space 20 of the cutter 211 is located. The other side of the first guide tube 230 is connected to the discharge monitoring section 300. For example, in a main cutter section 210 that combines eight cutters 211 including the first channel space 10 and two cutters 211 including the second channel space 20, the second guide tube 230 is connected to the second channel space 20. That is, 20% of the powder discharged from the hopper 100 moves to the discharge monitoring section 300 through the second guide tube 230.

[0059] The main sampling unit 200 supplies a portion of the powder flowing in from the hopper 100 to the forming device 1, and supplies the remaining powder to the discharge monitoring unit 300. This allows for the sampling of a portion of the powder supplied to the forming device 1.

[0060] The discharge monitoring unit 300 calculates the amount of remaining powder separated from the main sampling unit 200. The discharge monitoring unit 300 may include a conventional ECT (Electrical Capacitance Tomography) sensor and an image analysis unit. The discharge monitoring unit 300 may be installed in the second guide tube 230. The second guide tube 230 can sense in real time and analyze the sensed image through the image analysis unit to calculate the amount of powder movement. For example, in a main cutter unit 210 that combines eight cutters 211 including a first channel space 10 and two cutters 211 including a second channel space 20, when the second guide tube 230 is connected to the second channel space 20, the discharge monitoring unit 300 may be installed based on the amount of powder discharged from the hopper 100 to confirm whether the amount of powder movement is greater than or less than 20%.

[0061] In addition, the discharge monitoring device 300 can be composed of a conventional weight or a conventional flow meter.

[0062] The powder supply management device for a laser forming apparatus described in conjunction with the embodiments can sample a portion of the powder supplied from the hopper 100 to the forming apparatus 1 through the main cutter unit 200, and determine whether the quantity is quantitative through the discharge monitoring unit 300. The powder supply management device for a laser forming apparatus allows the operator to manage the flow of powder supplied from the hopper 100 to the laser forming apparatus 1 in order to determine whether the formed product is defective.

[0063] like Figure 6 or Figure 7 The powder supply management device for a laser forming apparatus shown in conjunction with another embodiment optionally further includes guiding a portion of the powder discharged from the main sampling unit 200 to the discharge monitoring unit 300 for discharge from the discharge monitoring unit 300, and guiding the remaining powder to the sub-sampling unit 400 of the laser forming apparatus 1. The sub-sampling unit 400 generally includes a sub-cutter unit 410, a sub-first guide tube 420, and a sub-second guide tube 430. The sub-sampling unit 400 may have the same structure as the main sampling unit 200 as described above.

[0064] See Figure 7 The sub-sampling unit 400 may have the same structure as the main sampling unit 200 as described above.

[0065] The sub-cutter unit 410 is connected to the main sampling unit 200 and cuts the powder that is guided to the discharge monitoring unit 300. The sub-cutter unit 410 may have the same cutter 211 as the main cutter unit 210 described above.

[0066] The sub-first guide tube 400 may have the same structure as the main first guide tube 220 as described above. The sub-first guide tube 420 is connected to one side of the sub-cutter section 410 and guides the segmented powder to move to the laser forming apparatus 1. For example, when the sub-cutter section 410 combines eight cutters 211 including a first channel space 10 and two cutters 211 including a second channel space 20, the sub-first guide tube 420 is connected to the lower side of the sub-cutter section 410 where the first channel space 10 is located.

[0067] The sub-second guide tube 430 may have the same structure as the main second guide tube 230 as described above. The sub-second guide tube 430 is connected to the other side of the sub-cutter section 410 and guides the remaining segmented powder to the discharge monitoring section 300. For example, in the case where the sub-cutter section 410 combines eight cutters 211 including the first channel space 10 and two cutters 211 including the second channel space 20, the sub-second guide tube 430 is connected to the lower side of the sub-cutter section 410 where the second channel space 20 is located.

[0068] The sub-sampling unit 400 can further reduce the amount of powder required for calculation in the discharge monitoring unit 300 by further separating the powder that was separated into samples in the main sampling unit 200.

[0069] like Figure 6 The powder supply management device for a laser forming apparatus, illustrated in conjunction with another embodiment, may optionally include a storage monitoring unit 500 for capturing images of the powder storage status inside the hopper 100. The storage monitoring unit 500 may include a conventional ECT (Electrical Capacitance Tomography) sensor and an image analysis unit. The storage monitoring unit 500 captures images of the powder accumulation inside the hopper 100. It determines whether the powder inside the hopper 100 is stored in a state biased to one side. If the storage monitoring unit 500 confirms that the powder in the discharge monitoring unit 300 is not quantitatively measured, the status of the powder stored in the hopper 100 can be confirmed, thereby helping operators reduce causes of defects.

[0070] In addition, in such Figure 8In another embodiment shown, the main cutter section 210 may also be combined with main cutter sections 210 of different ratios of the first channel space 10 and the second channel space 20. In this case, a transfer section 600 for moving the main cutter section 210 may also be included. The transfer section 600 moves the main cutter section 210 to select the main cutter section 210 connected to the hopper 100. In this case, by ensuring that the cutters 211 of the further combined main cutter sections 210 all include the first channel space 10, various combinations can be achieved, thereby allowing for the elimination of sampling or modification of the powder amount required for sampling, etc.

[0071] The transfer unit 600 can be constructed using a conventional air pipe. The transfer unit 600 is integrated with the cutter 211 or the cutter guide 212. The transfer unit 600 expands and contracts depending on whether liquid or gas flows in. Based on the expansion and contraction of the transfer unit 600, the main cutter unit 210, or a further integrated main cutter unit 210, can be selectively connected to the hopper 100. Furthermore, it can also be selectively connected to the main first guide pipe 220 and the main second guide pipe 230. Additionally, the sub-cutter unit 410 can also be configured as described above to easily adjust the sampling rate. The transfer unit 600, constructed using an air pipe, has the effect of suppressing erroneous operation when powder, as part of fine ions, flows into the transfer unit 600. That is, it suppresses problems of powder wear and erroneous operation caused by the forward or backward movement of the device via gears or pistons.

[0072] On the other hand, the transfer unit 600 can contact the two end cutters 211 or cutter guides 212 of the main cutter unit 210 respectively. At this time, the transfer unit 600 can operate in a manner where one side expands while the other side contracts.

[0073] The transfer unit 600 may also be provided in the sub-cutter unit 410 as described above.

[0074] Additionally, the main cutter unit 210 may include a guide rail passing through the cutter 211. At one end of the guide rail, the cutter guide unit 212 may be fixed. The other end of the guide rail may include a pressure unit for pressurizing the cutter 211. That is, after the main cutter unit 210 inserts the necessary cutter 211 according to the worker's needs, the pressure unit is activated, and the cutter 211 moves towards the cutter guide unit 212 through the pressure unit, thereby being firmly pressurized and fixed. In this case, the pressure unit may also be constituted by the aforementioned transfer unit 600.

[0075] Furthermore, the cutter section 210, which includes a pressure unit and a guide rail, may also include a conventional vibrating element. The vibrating element can be mounted on the guide rail. The vibrating element operates when the pressure unit is deactivated. The cutter section 210, including the vibrating element, applies vibration to the depressurized cutters 211, thereby creating a gap between the cutters 211. This effectively removes powder and other contaminants trapped between the cutters 211 through the gap created by the vibrating element.

[0076] In addition, the vibrating element can also operate under pressure in the cutter section 210.

[0077] Alternatively, the cutter section 210 may include a plate without a channel space between the cutter 211 and another cutter 211 to provide the main cutter section 210 or the sub-cutter section 410.

[0078] The above embodiments are merely illustrative of this disclosure and not intended to limit it. Those skilled in the art should understand that modifications, variations, or equivalent substitutions can be made to this disclosure. All such modifications, variations, or equivalent substitutions should be covered within the scope of the claims of this disclosure without departing from its spirit and scope.

[0079] The above embodiments are merely illustrative of this disclosure and not intended to limit it. Those skilled in the art should understand that modifications, variations, or equivalent substitutions can be made to this disclosure. All such modifications, variations, or equivalent substitutions should be covered within the scope of the claims of this disclosure without departing from its spirit and scope.

Claims

1. A powder supply management device for a laser forming apparatus, comprising: a hopper discharging powder; a main sampling section guiding a portion of the powder discharged from the hopper to a laser forming apparatus and guiding the remaining powder elsewhere; and a discharge monitoring section calculating the amount of the remaining powder separated from the main sampling section, the main sampling section comprising: a main cutter section connected to the hopper and dividing the powder discharged from the hopper; a main first guide tube connected to one side of the main cutter section and guiding the divided powder to the laser forming apparatus; and a main second guide tube connected to the other side of the main cutter section and guiding the divided remaining powder to the discharge monitoring section, the main cutter section comprising a pair of cutters provided and separated from each other to form a first passage space, another cutter provided at a side of the cutters to form a second passage space, one side of the first passage space and the second passage space connected to each other, and the other side separated in different directions, the cutters provided in plural numbers, the separation ratio of the powder determined according to the number of the cutters and the ratio of the first passage space and the second passage space, the main cutter section comprising a cutter guide section covering the side of the cutters to move the powder to the first passage space and the second passage space.

2. The powder supply management apparatus for a laser forming apparatus according to claim 1, characterized by: further comprising a sub sampling section guiding a portion of the powder discharged from the main sampling section to the discharge monitoring section to be discharged to the discharge monitoring section and guiding the remaining powder to the laser forming apparatus.

3. The powder supply management apparatus for a laser forming apparatus according to claim 1, characterized by: further comprising a storage monitoring section photographing the powder storage state inside the hopper.

4. The powder supply management device for a laser forming apparatus according to claim 1, wherein: the first passage space and the second passage space formed by the pair of cutters separated from each other, comprising: a vertical space in a vertical direction; and a horizontal space connected to the vertical space and inclined in a horizontal direction.

5. The powder supply management device for a laser forming apparatus according to claim 2, wherein: the sub sampling section comprising: a sub cutter section connected to the main sampling section and dividing the powder guided to the discharge monitoring section; a sub first guide tube connected to one side of the sub cutter section and guiding the divided powder to the laser forming apparatus; and a sub second guide tube connected to the other side of the sub cutter section and guiding the divided remaining powder to the discharge monitoring section.

Images