Electrocaloric refrigeration apparatus and device

Abstract

The application relates to the technical field of electronic equipment refrigeration, and discloses an electric card refrigeration device, which comprises an electric card module, a first heat exchange component and a second heat exchange component. The electric card module is connected with an external power supply to generate an electric card effect. The first heat exchange component is arranged on one side of the electric card module and is in heat conduction connection with the electric card module to exchange heat with the electric card module, transfer the heat of the electric card module and dissipate the heat of the electric card module. The second heat exchange component is arranged on the other side of the electric card module and is in heat conduction connection with the electric card module to transfer the cold energy of the electric card module. When the electric card module is powered off, the second heat exchange component is triggered to work, so that the cold energy generated by the electric card module in the electric card effect is transferred to the second heat exchange component to refrigerate. The electric card module generates cold energy when being powered off, and the second heat exchange component is triggered to work when the electric card module is powered off, so that the second heat exchange component transfers the cold energy generated by the electric card module outward, realizes separate utilization of the cold energy of the electric card module, and further realizes the purpose of industrialized mass production and application. The application further discloses an equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment refrigeration, for example, to an electric card refrigeration device and equipment. BACKGROUND

[0002] The new refrigeration technology based on the electric card effect does not need to use the compressor and refrigerant required by the common refrigeration device. When the electric field applied to or removed from the electric card material, the material will produce the phenomenon of heat absorption or heat release, that is, the electric card effect. However, at present, this refrigeration technology based on the electric card effect is only based on a single electric card material for testing in the laboratory. Although the electric card material can generate heat / cold through the application / removal of the electric field, it cannot effectively realize the separation of cold and heat, so as to realize the utilization of cold, and further industrialization and mass production application. SUMMARY

[0003] In order to have a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not a general review, nor is it intended to determine the key / important components or delineate the scope of protection of these embodiments, but as a prelude to the detailed description below.

[0004] The electric card refrigeration device and equipment provided by the embodiments of the present disclosure can effectively realize the separation of cold and heat, so as to realize the application of generated cold, and further industrialization and mass production application.

[0005] In some embodiments, the electric card refrigeration device comprises:

[0006] An electric card module, which is connected in heat conduction with an external power source to generate an electric card effect;

[0007] A first heat exchange component, which is arranged on one side of the electric card module and connected in heat conduction with the electric card module to exchange heat with the electric card module and transfer the heat generated by the electric card module to dissipate heat.

[0008] A second heat exchange component, which is arranged on the other side of the electric card module and connected in heat conduction with the electric card module to transfer the cold generated by the electric card module.

[0009] Wherein, the electric card module is triggered to work when the power is off, so that the cold generated by the electric card module in the electric card effect is transferred to the second heat exchange component to refrigerate.

[0010] In some embodiments, the first heat exchange component comprises:

[0011] A base connected in heat conduction with the electric card module to receive the heat generated by the electric card module;

[0012] An inflation plate connected in heat conduction with the base, and a flow path for the flow of heat transfer medium is formed in the inflation plate.

[0013] a fin group comprising a plurality of fins and being in thermal contact with the inflation plate;

[0014] wherein the base and the fin group are respectively arranged on two sides of the inflation plate, so that the base transfers heat to the inflation plate, and the heat transfer medium in the inflation plate is phase changed by the heat to transfer heat to the fin group for heat dissipation.

[0015] In some embodiments, the inflation plate comprises:

[0016] a main body configured with the flow path; and

[0017] a bending portion bent and extended from an edge of the main body in a first direction to strengthen the strength of the inflation plate.

[0018] In some embodiments, the inflation plate comprises:

[0019] an evaporation portion in thermal contact with the electric card module; and

[0020] a condensation portion arranged opposite to the evaporation portion and in thermal contact with the fin group;

[0021] wherein the flow path in the inflation plate communicates the evaporation portion and the condensation portion, so that the heat transfer medium in the evaporation portion is phase changed by the heat to move to the condensation portion, and is returned to the evaporation portion after being condensed by the condensation portion.

[0022] In some embodiments, the first heat exchange assembly further comprises:

[0023] a fan arranged at a side of the fin group, so that the air flow blown by the fan flows through the gap between adjacent fins of the fin group to dissipate heat from the fins.

[0024] In some embodiments, the second heat exchange assembly comprises:

[0025] a heat transfer element for being in thermal contact with the electric card module;

[0026] a heat exchanger for refrigeration;

[0027] a water pump assembly comprising a water pump and a pipeline communicating the heat transfer element and the heat exchanger, the water pump being arranged in the pipeline and controlling the opening and closing of the pipeline;

[0028] wherein the electric card module is powered off to trigger the water pump to work, so that the liquid in the pipeline is in a flowing state, and the electric card module is powered off to absorb heat, so as to refrigerate the liquid flowing through the heat transfer element and transfer cold energy to the heat exchanger through the liquid.

[0029] In some embodiments, the electric card module comprises:

[0030] An electric card assembly comprises an electric card element and a thin film electrode covering and adhering to opposite sides of the electric card element;

[0031] A heat conduction assembly comprises a first heat conduction element and a second heat conduction element arranged oppositely, and the first heat conduction element and the second heat conduction element are respectively connected in heat conduction with opposite sides of the electric card assembly to transfer heat with the electric card assembly;

[0032] The thin film electrode is connected with an external power supply, the electric card module generates heat when powered on, and the heat is transferred to the first heat exchange assembly through the first heat conduction element; the electric card module absorbs heat when powered off, and the cold is transferred to the second heat exchange assembly through the second heat conduction element.

[0033] In some embodiments, the first heat conduction element is connected in heat conduction with a base, and the second heat conduction element is connected in heat conduction with a heat transfer element;

[0034] The heat transfer element is detachably connected with the base.

[0035] In some embodiments, the electric card module is covered with a heat preservation layer in a circumferential direction to reduce the loss of heat or cold.

[0036] In some embodiments, the device comprises the electric card refrigeration device provided in the foregoing embodiments.

[0037] The electric card refrigeration device and the device provided by the embodiments of the present disclosure can achieve the following technical effects:

[0038] The heat generated by the electric card module is transferred to the first heat exchange assembly for heat dissipation and cooling, and the cold generated by the electric card module is transferred to the second heat exchange assembly and then to the associated device for refrigeration; when the electric card module is powered off, the cold is generated, and the second heat exchange assembly is triggered to work when the electric card module is powered off, so that the second heat exchange assembly transfers the cold generated by the electric card module outward, realizes the separate use of the cold of the electric card module, and further realizes the purpose of industrialized mass production application.

[0039] The foregoing general description and the following description are only exemplary and explanatory, and are not used to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0040] One or more embodiments are exemplarily illustrated by corresponding drawings, which do not constitute limitation on the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, the drawings do not constitute proportional limitation, and wherein:

[0041] Figure 1 is a frame schematic diagram of the electric card refrigeration device provided by the embodiments of the present disclosure;

[0042] Figure 2 is a schematic diagram of the change of heat / cold quantity of the electric card refrigeration device in the case of power on / off provided by the embodiments of the present disclosure;

[0043] Figure 3 is a structural schematic diagram of the electric card refrigeration device provided by the embodiments of the present disclosure;

[0044] Figure 4 is a structural schematic diagram of the first heat exchange assembly provided by the embodiments of the present disclosure;

[0045] Figure 5 is a structural schematic diagram of the first heat exchange assembly from another perspective provided by the embodiments of the present disclosure;

[0046] Figure 6 is a structural schematic diagram of the first heat exchange assembly from another perspective provided by the embodiments of the present disclosure.

[0047] Reference signs:

[0048] 10: electric card module; 101: electric card assembly; 102: first heat-conducting element; 103: second heat-conducting element; 20: first heat exchange assembly; 201: base; 202: blow-up plate; 203: main body; 204: bending part; 205: evaporation part; 206: condensation part; 207: fin group; 208: fan; 30: second heat exchange assembly; 301: heat transfer element; 302: heat exchanger; 303: water pump; 304: pipeline. DETAILED DESCRIPTION

[0049] In order to enable a more detailed understanding of the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings, which are only used for reference and do not limit the embodiments of the present disclosure. In the following technical description, in order to facilitate explanation, a plurality of details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, in order to simplify the drawings, well-known structures and devices can be simplified.

[0050] The terms "first", "second", and the like in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0051] In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "back" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. In addition, in addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0052] In addition, the terms "set", "connected", "fixed" should be broadly understood. For example, "connected" can be fixedly connected, detachably connected, or integrally configured; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0053] Unless otherwise specified, the term "a plurality of" means two or more.

[0054] In the embodiments of the present disclosure, the character " / " represents an "or" relationship between the objects before and after it. For example, A / B means: A or B.

[0055] The term "and / or" is a description of the association between objects, which means that there can be three relationships. For example, A and / or B means: A or B, or, A and B, the three relationships.

[0056] It should be noted that the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0057] In combination Figures 1 to 6 As shown, the embodiments of the present disclosure provide an electric card refrigeration device, which comprises an electric card module 10, a first heat exchange assembly 20 and a second heat exchange assembly 30. The electric card module 10 generates an electric card effect by switching on and off with an external power supply. The first heat exchange assembly 20 is arranged on one side of the electric card module 10 and is in thermal conductive connection with the electric card module 10 to exchange heat with the electric card module 10 and transfer the heat of the electric card module 10 to dissipate heat. The second heat exchange assembly 30 is arranged on the other side of the electric card module 10 and is in thermal conductive connection with the electric card module 10 to transfer the cold of the electric card module 10. Wherein, the electric card module 10 triggers the second heat exchange assembly 30 to work by being powered off, so that the cold generated by the electric card effect of the electric card module 10 is transferred to the second heat exchange assembly 30 to refrigerate.

[0058] The electric card refrigeration device provided by the embodiment of the present disclosure is used, the heat generated by the electric card module 10 is transferred to the first heat exchange assembly 20 for heat dissipation and cooling, the cold energy generated by the electric card module 10 is transferred to the second heat exchange assembly 30, and is transferred to the associated equipment through the second heat exchange assembly 30 for refrigeration; wherein, the electric card module 10 generates cold energy when being powered off, the second heat exchange assembly 30 is triggered to work when the electric card module 10 is powered off, so that the second heat exchange assembly 30 transfers the cold energy generated by the electric card module 10 outward, realizing the separate use of the cold energy of the electric card module 10, and further realizing the purpose of industrialized mass production application.

[0059] The electric card module 10 is connected with an external power supply, the external power supply is periodically powered on and powered off with the electric card module 10, and the electric card module 10 thus realizes periodic heat release and heat absorption. The first heat exchange assembly 20 is fixedly and heat-conductively connected with the electric card module 10, and continuously works regardless of whether the electric card module 10 is powered on or powered off. In the case that the electric card module 10 is powered on and releases heat, the first heat exchange assembly 20 receives the heat generated by the electric card module 10 and performs heat dissipation and cooling. In the case that the electric card module 10 is powered off and absorbs heat, the second heat exchange assembly 30 works, and the cold energy generated by the electric card module 10 when absorbing heat is transferred to the second heat exchange assembly 30, and the cold energy is transferred to the corresponding device or equipment outside through the second heat exchange assembly 30, not only realizing the purpose of refrigeration, but also realizing effective separation of the heat and cold energy generated by the electric card module 10 in the electric card effect. In the case that the second heat exchange assembly 30 works, because the electric card module 10 generates cold energy when absorbing heat, the first heat exchange assembly 20 not only does not need to perform heat dissipation and cooling on the electric card module 10, but also can lower the temperature of the first heat exchange assembly 20 through the electric card module 10. In the case that the electric card module 10 is powered on and releases heat, because the temperature of the first heat exchange assembly 20 is low, the time for the temperature of the first heat exchange assembly 20 to rise is prolonged, thereby improving the heat dissipation effect on the electric card module 10.

[0060] Optionally, the first heat exchange assembly 20 comprises a base 201, an inflation plate 202 and a fin group 207, the base 201 is heat-conductively connected with the electric card module 10 to receive the heat generated by the electric card module 10; the inflation plate 202 is heat-conductively connected with the base 201, and a flow path for the flow of heat transfer medium is constructed in the inflation plate 202; the fin group 207 comprises a plurality of fins and is heat-conductively connected with the inflation plate 202; wherein, the base 201 and the fin group 207 are respectively arranged on two sides of the inflation plate 202, so that the heat of the base 201 is transferred to the inflation plate 202, and the heat transfer medium in the inflation plate 202 is phase-changed by heat to transfer the heat to the fin group 207 for heat dissipation and cooling.

[0061] The base 201 is in heat-conducting connection with the electric card module 10, and the heat generated by the electric card module 10 is transferred to the base 201, and then to the inflation plate 202, and then to the fin group 207 through the phase change of the heat transfer medium in the inflation plate 202, so as to quickly transfer the heat generated by the electric card module 10 outward, and improve the heat dissipation efficiency of the electric card module 10.

[0062] The inflation plate 202 is filled with heat transfer medium that can be phase-changed by heat, and the inflation plate 202 is configured with flow paths for the heat transfer medium to flow. The heat transfer medium flows along the flow paths so that the heat transfer medium is uniformly distributed in the inflation plate 202 to improve the uniformity of the inflation plate 202. In actual application, the inflation plate 202 is vertically arranged or obliquely arranged, the base 201 is located at the relatively low end of the inflation plate 202, and the fin group 207 is located at the relatively high end of the inflation plate 202. In this way, it can be ensured that the heat of the base 201 is transferred to the liquid heat transfer medium in the inflation plate 202, so that the liquid heat transfer medium is phase-changed by heat, and the heat transferred by the gaseous heat transfer medium in the inflation plate 202 is dissipated and cooled by the fin group 207, thereby improving the heat dissipation efficiency of the first heat exchange assembly 20.

[0063] It should be noted that the "inflation plate" in this paper can be understood as a plate structure with flow channels inside for the heat transfer medium to flow, and the heat transfer medium flows in the inflation plate to transfer heat. The "inflation plate" in this paper is not limited to the inflation structure, and other structures that can achieve the above purpose are also available.

[0064] The base 201 and the fin group 207 are respectively arranged on both sides of the inflation plate 202, the liquid heat transfer medium in the inflation plate 202 is phase-changed by heat to become gaseous heat transfer medium, and flows upward and to the opposite side along the flow paths, and flows to the end where the fin group 207 is located, and transfers heat to the fin group 207, and is dissipated and cooled by the fin group 207. After the gaseous heat transfer medium is dissipated and cooled, it condenses into liquid heat transfer medium and flows downward along the flow paths to the end where the base 201 is located, and performs the next heat dissipation cycle.

[0065] The fin group 207 includes a plurality of fins, and the fins are perpendicular to the inflation plate 202, so that each fin is in heat-conducting connection with the inflation plate 202 to improve the heat dissipation efficiency of the fin group 207 on the inflation plate 202. The fin group 207 can be an aluminum extrusion heat sink.

[0066] It should be noted that the heat transfer medium is a phase-changeable heat transfer working medium. For example, refrigerant, but not limited to refrigerant.

[0067] Optionally, the inflation plate 202 includes a main body 203 and a bending portion 204, the main body 203 is configured with flow paths; and the bending portion 204 is bent and extended from the edge of the main body 203 to a first direction to strengthen the strength of the inflation plate 202.

[0068] The inflation portion of the inflation plate 202 is located in the main body 203, and the heat transfer medium flows in the flow path in the main body 203. The bending portion 204 extends in a first direction from the edge of the main body 203, and the bending portion 204 is arranged along the circumference of the main body 203. The relative circumferential increase of the rib plate design improves the strength of the inflation plate 202, and can prevent the first heat exchange assembly 20 from being deformed and damaged during installation and transportation.

[0069] Optionally, the bending portion 204 bends from the main body 203 to the fin group 207. In this way, the bending portion 204 can be regarded as a fin, and the bending portion 204 and the fin group 207 together dissipate heat from the inflation plate 202.

[0070] Optionally, the inflation plate 202 includes an evaporation portion 205 and a condensation portion 206. The evaporation portion 205 is in thermal contact with the electric card module 10. The condensation portion 206 is arranged opposite to the evaporation portion 205 and is in thermal contact with the fin group 207. The flow path in the inflation plate 202 is connected to the evaporation portion 205 and the condensation portion 206, so that the heat transfer medium in the evaporation portion 205 changes phase after being heated, moves to the condensation portion 206, and returns to the evaporation portion 205 after being condensed by the condensation portion 206.

[0071] The evaporation portion 205 of the inflation plate 202 receives heat generated by the electric card module 10, and transfers the heat to the condensation portion 206 through the heat transfer medium in the evaporation portion 205. The gaseous heat transfer medium in the condensation portion 206 transfers heat to the fin group 207, and dissipates heat through the fin group 207. The condensed liquid heat transfer medium returns to the evaporation portion 205 under the action of gravity, and performs the next heat cycle. In this way, the heat of the inflation plate 202 is transferred from the evaporation portion 205 to the condensation portion 206 in a single direction and efficiently.

[0072] Optionally, the first heat exchange assembly 20 further includes a fan 208 arranged on the side of the fin group 207, so that the airflow blown by the fan 208 flows through the gap between adjacent fins of the fin group 207 to dissipate heat from the fins.

[0073] The fan 208 is arranged on the side of the fin group 207. When the electric card module 10 is powered on and generates heat, the fan 208 operates, and the airflow blown by the fan 208 flows through the fins of the fin group 207 and the inflation plate 202 to dissipate heat from the inflation plate 202 and the fins.

[0074] The airflow blown by the fan 208 flows in parallel with the fins of the fin group 207, so that the airflow flows through the gap between adjacent fins, blows heat away from the fins through the airflow, and thus reduces the temperature of the fins.

[0075] Optionally, the second heat exchange assembly 30 comprises a heat transfer element 301, a heat exchanger 302 and a water pump 303 assembly, the heat transfer element 301 is in heat conduction connection with the electrocaloric module 10; the heat exchanger 302 is used for refrigeration; the water pump 303 assembly comprises the water pump 303 and a pipeline 304 connecting the heat transfer element 301 and the heat exchanger 302, the water pump 303 is arranged in the pipeline 304 and controls the opening and closing of the pipeline 304; wherein the electrocaloric module 10 is powered off to trigger the water pump 303 to work, so that the liquid in the pipeline 304 is in a flowing state, the electrocaloric module 10 is powered off to absorb heat, the liquid cools the liquid flowing through the heat transfer element 301, and the cold energy is transferred to the heat exchanger 302 through the liquid.

[0076] The pipeline 304 of the second heat exchange assembly 30 is connected in series with the heat transfer element 301, the water pump 303 and the heat exchanger 302. The pipeline 304 flows with a heat transferable liquid. The pipeline 304 controls the flow of the liquid through the water pump 303. The heat transferable liquid can be water, refrigerant or other heat transfer medium that can be phase changed by heat.

[0077] In the case that the electrocaloric module 10 is powered off to absorb heat, the second heat exchange assembly 30 works, the heat transfer element 301 is in heat conduction connection with the electrocaloric module 10, and the water pump 303 in the water pump 303 assembly works to make the liquid in the pipeline 304 circulate and flow. The liquid in the pipeline 304 exchanges heat with the electrocaloric module 10 when flowing through the heat transfer element 301, the cold energy generated by the electrocaloric module 10 is transferred to the heat transfer element 301, and then continues to flow to transfer the cold energy to the heat exchanger 302, so as to transfer the cold energy and achieve the purpose of refrigeration.

[0078] The embodiment of the present disclosure adopts the intermittent fluid heat transfer mode to efficiently transfer the cold energy generated by the electrocaloric module 10 in the electrocaloric effect, and realizes the effective separation of the cold energy from the electrocaloric module 10.

[0079] Optionally, the heat transfer element can be a water cooling head. However, the heat transfer element is not limited to the water cooling head, for example, other elements with heat transfer function and internal liquid circulation function can also be used.

[0080] Optionally, the electrocaloric module 10 comprises: an electrocaloric assembly 101 comprising an electrocaloric element and a thin film electrode covering and adhering to opposite sides of the electrocaloric element; a heat conduction assembly comprising a first heat conduction element 102 and a second heat conduction element 103 arranged opposite to each other, the first heat conduction element 102 and the second heat conduction element 103 are respectively in heat conduction connection with the opposite sides of the electrocaloric assembly 101 to transfer heat with the electrocaloric assembly 101; wherein the thin film electrode is connected with an external power supply, the electrocaloric module 10 is powered on to release heat, the heat is transferred to the first heat exchange assembly 20 through the first heat conduction element 102, the electrocaloric module 10 is powered off to absorb heat, and the cold energy is transferred to the second heat exchange assembly 30 through the second heat conduction element 103.

[0081] The thin film electrode covers and adheres to the side of the electrocaloric element to form the electrocaloric assembly 101, which not only makes the electrocaloric element on-off, generates the electrocaloric effect, but also helps to make the surface of the electrocaloric assembly 101 flat, so that when the electrocaloric assembly 101 is in thermal contact with the heat conduction assembly, the effective contact area between the two can be guaranteed, and the heat transfer efficiency between the electrocaloric assembly 101 and the heat conduction assembly is improved. In addition, the electrocaloric module 10 is packaged by arranging the electrocaloric assembly 101 between the first heat conduction element 102 and the second heat conduction element 103, so that the electrocaloric assembly 101 can be packaged for use, thereby realizing the industrialized preparation and application of the electrocaloric module 10.

[0082] The electrocaloric element can be one or more. The number of electrocaloric elements can be selected according to actual needs, so that the electrocaloric module 10 achieves the purpose of controllable cold. In the case where the electrocaloric assembly 101 includes multiple electrocaloric elements, the multiple electrocaloric elements are arranged side by side and located in the same plane.

[0083] The thin film electrode covers and adheres to the side of the electrocaloric element to form the electrocaloric assembly 101, which not only makes the electrocaloric element on-off, generates the electrocaloric effect, but also helps to make the surface of the electrocaloric assembly 101 flat, so that when the electrocaloric assembly 101 is in thermal contact with the heat conduction assembly, the effective contact area between the two can be guaranteed, and the heat transfer efficiency between the electrocaloric assembly 101 and the heat conduction assembly is improved. In addition, the electrocaloric module 10 is packaged by arranging the electrocaloric assembly 101 between the first heat conduction element 102 and the second heat conduction element 103, so that the electrocaloric assembly 101 can be packaged for use, thereby realizing the industrialized preparation and application of the electrocaloric module 10.

[0084] The electrocaloric assembly 101 is in thermal contact with the heat conduction assembly, especially by arranging the electrocaloric assembly 101 between the first heat conduction element 102 and the second heat conduction element 103. In this way, in the case of heat release of the electrocaloric assembly 101, the heat released by the electrocaloric assembly 101 is transmitted to the first heat conduction element 102, and the heat is transmitted to the first heat exchange assembly 20 through the first heat conduction element 102 for heat dissipation. In the case of heat absorption of the electrocaloric assembly 101, the electrocaloric assembly 101 absorbs heat to produce cooling, and the generated cooling is transmitted to the second heat exchange assembly 30 through the second heat conduction element 103, and the cooling is transmitted outward through the second heat exchange assembly 30 to achieve the purpose of refrigeration.

[0085] Optionally, the first heat conduction element 102 can be a heat conduction sheet. Optionally, the second heat conduction element 103 can be a heat conduction sheet.

[0086] Optionally, the electrocaloric element can be a circular structure or a square structure. The specific size of the electrocaloric element is determined as needed. The electrocaloric element can be made of ferroelectric material powder by proportioning, ball milling, drying, grinding, tabletting and sintering. However, the material of the electrocaloric element is not limited to being made of ferroelectric material.

[0087] For the convenience of description and distinction, the thin film electrodes on both sides of the electric card element are defined as the first thin film electrode and the second thin film electrode. The first thin film electrode is in thermal conductive connection with the first thermal conductive element 102, and the second thin film electrode is in thermal conductive connection with the second thermal conductive element 103. The first thin film electrode and the second thin film electrode are respectively provided with pins for external connection of a power supply.

[0088] In actual application, in order to improve the thermal conductive efficiency and ensure safety, the first thermal conductive element 102 and the second thermal conductive element 103 are selected from high-thermal-conductive insulating materials, such as aluminum nitride, silicon carbide, gallium nitride, boron nitride, and aluminum oxide. In addition, the first thermal conductive element 102 and the second thermal conductive element 103 can have a certain thickness to store cold or heat.

[0089] Optionally, the opposite sides of the electric card element are coated with conductive paint to enable the electric card element to be attached to and in conductive connection with the thin film electrodes.

[0090] The opposite sides of the electric card element are coated with conductive paint, which not only enables the electric card element to be attached to and in conductive connection with the thin film electrodes, but also fills the uneven areas on the surface of the electric card element to keep the outer side of the electric card assembly 101 formed by the electric card element and the thin film electrodes flat. In the case where the electric card assembly 101 is in thermal conductive connection with the thermal conductive sheet assembly, the effective contact area between the side of the electric card assembly 101 and the side of the thermal conductive sheet is ensured, and the heat transfer efficiency is improved.

[0091] Optionally, the conductive paint can be conductive silver paste. The conductive silver paste not only ensures the electrical conductivity between the electric card element and the thin film electrodes, but also ensures the thermal conductivity between the two. In addition, the conductive silver paste can fill the uneven areas on the surface of the electric card element to make the surface of the electric card element flat. The thin film electrodes can be attached to the electric card element through the conductive silver paste to realize the attachment and assembly of the two.

[0092] Optionally, the side of the electric card assembly 101 is provided with a thermal conductive medium to be in thermal conductive connection with the thermal conductive assembly.

[0093] The side of the electric card assembly 101 is provided with a thermal conductive medium, which can quickly transfer the heat or cold generated by the electric card effect of the electric card element to the thermal conductive assembly. In addition, the thermal conductive medium not only transfers the heat or cold from the electric card assembly 101 to the thermal conductive assembly, but also serves to fix and connect the electric card assembly 101 and the thermal conductive sheet assembly. The electric card assembly 101 is attached to the thermal conductive assembly through the thermal conductive medium.

[0094] The side of the electric card assembly 101, i.e. the surface of the thin film electrode. The surface of the thin film electrode can have uneven areas, which are filled by the thermal conductive medium to ensure the effective contact area between the electric card assembly 101 and the thermal conductive sheet, thereby ensuring the heat transfer efficiency between the two.

[0095] Optionally, the first heat-conducting element 102 is in heat-conducting connection with the base 201, and the second heat-conducting element 103 is in heat-conducting connection with the heat transfer element 301; wherein the heat transfer element 301 is detachably connected with the base 201.

[0096] The first heat-conducting element 102 is in heat-conducting connection with the base 201, and the heat transfer element 301 is detachably connected with the base 201. In this way, it is helpful for the structural stability and reliability. In addition, it can also ensure the effective contact area between the electric card module 10 and the first heat exchange assembly 20 and the second heat exchange assembly 30, so as to ensure the heat transfer efficiency between the electric card module 10 and the first heat exchange assembly 20 and the second heat exchange assembly 30.

[0097] Optionally, the electric card module 10 is covered with a heat preservation layer in the circumferential direction, so as to reduce the loss of heat or cold.

[0098] The electric card module 10 can not only reduce the loss of heat or cold to the surrounding air through the heat preservation layer covered in the circumferential direction, but also can realize the packaging of the electric card module 10, so as to ensure that the whole of the electric card assembly 101 and the heat-conducting assembly is in an integrated structure, so as to facilitate transportation and installation and use.

[0099] In combination with Figures 1 to 6 As shown in the drawings, the embodiment of the present disclosure provides an equipment, which comprises the electric card refrigeration device provided in the above-mentioned embodiments. The electric card refrigeration device comprises an electric card module 10, a first heat exchange assembly 20 and a second heat exchange assembly 30. The electric card module 10 is connected with an external power supply to generate an electric card effect. The first heat exchange assembly 20 is arranged on one side of the electric card module 10 and is in heat-conducting connection with the electric card module 10, so as to exchange heat with the electric card module 10 and transfer the heat of the electric card module 10 to dissipate heat. The second heat exchange assembly 30 is arranged on the other side of the electric card module 10 and is in heat-conducting connection with the electric card module 10, so as to transfer the cold of the electric card module 10. When the electric card module 10 is powered off, the second heat exchange assembly 30 is triggered to work, so that the cold generated in the electric card effect of the electric card module 10 is transferred to the second heat exchange assembly 30 to refrigerate.

[0100] By using the equipment provided by the embodiment of the present disclosure, the heat generated by the electric card module 10 is transferred to the first heat exchange assembly 20 to dissipate heat and cool down, and the cold generated by the electric card module 10 is transferred to the second heat exchange assembly 30 and then to the associated equipment to refrigerate. When the electric card module 10 is powered off, the second heat exchange assembly 30 is triggered to work, so that the second heat exchange assembly 30 transfers the cold generated by the electric card module 10 outward, realizes the separate use of the cold of the electric card module 10, and further realizes the purpose of industrialized mass production and application.

[0101] The above description and drawings suffice to fully enable one skilled in the art to practice the embodiments of the present disclosure. Other embodiments can include structural and other changes. The embodiments are merely representative of possible variations. Individual components and functions are optional unless explicitly required, and the order of operations can be varied. Portions and features of some embodiments can be included in, or substituted for, portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the drawings, and can be varied in a variety of ways. The scope of the present disclosure is limited only by the claims that follow.

Claims

1. A card-operated refrigeration device, characterized in that, include: The power card module generates a power card effect by switching on and off with an external power source; The first heat exchange component is located on one side of the card module and is thermally connected to the card module to exchange heat with the card module, transfer the heat of the card module, and dissipate heat from the card module. The first heat exchange component works continuously regardless of whether the card module is powered on or off. The second heat exchange component is located on the other side of the card module and is thermally connected to the card module to transfer the cooling capacity of the card module. Specifically, when the power is cut off from the electrical card module, the second heat exchange component is activated, so that the cooling energy generated by the electrical card module in the electrical card effect is transferred to the second heat exchange component for cooling. The first heat exchange component includes: The base is thermally connected to the card module to receive the heat generated by the card module; The blown plate is thermally connected to the base, and the blown plate has a flow path for the flow of heat transfer medium. The fin assembly includes multiple fins and is thermally connected to the blown plate; The base and the fin assembly are respectively disposed on both sides of the blown plate, so that the heat of the base is transferred to the blown plate, and the heat transfer medium in the blown plate undergoes a phase change upon heating, transferring the heat to the fin assembly for heat dissipation and cooling.

2. The electric card cooling device according to claim 1, characterized in that, The inflation plate includes: The main body is constructed with the aforementioned flow path; and, The bent portion extends from the edge of the main body in a first direction to strengthen the inflated plate.

3. The electric card cooling device according to claim 1, characterized in that, The inflation plate includes: The evaporation section is thermally connected to the card module; and, The condenser section is disposed opposite to the evaporator section and is thermally connected to the fin assembly; The flow path within the blown plate connects the evaporation section and the condensation section, so that the heat transfer medium in the evaporation section moves to the condensation section after being heated and undergoing a phase change, and then flows back to the evaporation section after being condensed in the condensation section.

4. The electric card cooling device according to claim 1, characterized in that, The first heat exchange component also includes: A fan is located on the side of the fin assembly so that the airflow blown by the fan flows through the gap between adjacent fins of the fin assembly to dissipate heat and cool the fins.

5. The electric card cooling device according to claim 1, characterized in that, The second heat exchange component includes: A heat transfer element is used for thermally conductive connection with the card module; Heat exchangers are used for refrigeration. A water pump assembly includes a water pump and a pipeline connecting the heat transfer element and the heat exchanger, wherein the water pump is located in the pipeline and controls the on / off state of the pipeline; The power-off of the electrical card module triggers the water pump to operate, so that the liquid in the pipeline is in a flowing state. The power-off of the electrical card module absorbs heat, cools the liquid flowing through the heat transfer element, and transfers the cooling energy to the heat exchanger through the liquid.

6. The electric card cooling device according to any one of claims 1 to 5, characterized in that, The electricity card module includes: An electronic card assembly includes an electronic card element and thin film electrodes covering and attached to opposite sides of the electronic card element; The heat-conducting component includes a first heat-conducting element and a second heat-conducting element disposed opposite to each other. The first heat-conducting element and the second heat-conducting element are respectively thermally connected to opposite sides of the card assembly to transfer heat with the card assembly. The thin-film electrode is connected to an external power source. When the power-on module is powered on, it releases heat, which transfers the heat to the first heat-conducting element and then to the first heat exchange component. When the power-off module is powered on, it absorbs heat and transfers the cold energy to the second heat exchange component via the second heat-conducting element.

7. The electric card cooling device according to claim 6, characterized in that, The first thermally conductive element is thermally connected to the base, and the second thermally conductive element is thermally connected to the heat transfer element; The heat transfer element is detachably connected to the base.

8. The electric card cooling device according to claim 6, characterized in that, The card module is covered with an insulation layer along the circumferential direction to reduce the loss of heat or cold.

9. A device, characterized in that, Includes the card cooling device as described in any one of claims 1 to 8.

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