Wafer carrier apparatus

Abstract

The application discloses a wafer carrier device, comprising: a housing assembly in communication with an atmospheric environment, comprising a support plate; a rotating table assembly, comprising a support table and a pressing portion, the pressing portion being used for pressing a wafer to the support table; a first magnetic fluid shaft, comprising a rotatingly sealed first inner shaft and a first outer shaft, the first outer shaft being sealingly assembled to the support plate, the first inner shaft having a first end portion extending into the housing assembly and a second end portion extending out of the housing assembly, the second end portion being connected with the rotating table assembly; a lifting assembly, the lifting assembly comprising a main body portion and a lifting body, the main body portion being located in the housing assembly, the lifting body being slidingly sealed with the support plate or the first outer shaft, and the lifting body being capable of acting on the pressing portion; and a shielding assembly, comprising a baffle, the baffle being configured to be rotatably assembled to the support plate, so as to be switched between a first working position opposite to the rotating table assembly and a second working position staggered with the rotating table assembly.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, and more specifically to a wafer stage device. Background Technology

[0002] Ion beam etching and ion beam deposition are two common wafer fabrication processes. Ion beam etching uses ions with a certain energy to bombard the surface of the material, causing the material atoms to sputter, thereby achieving the etching purpose. It is a purely physical process. Ion beam deposition, on the other hand, uses an ion source to ionize the material to be deposited, and then, under the action of an electric field, it is directed onto the wafer surface to deposit a film layer. The purpose is to change the surface properties of the workpiece. It is a vapor phase deposition method.

[0003] In the process, the ion source is generally in a fixed position, and the processing position is adjusted by rotating the wafer, with the entire process taking place in a vacuum environment. Therefore, existing technologies include a stage device for supporting the wafer, which provides the driving force to meet the motion requirements of wafer processing.

[0004] During wafer fabrication, there is a pressing section for pressing the wafer. To facilitate wafer pressing and unloading, a lifting assembly is needed to control the displacement of the pressing section. However, the lifting assemblies used in existing stage devices are generally dedicated vacuum components. The entire equipment is configured and exposed to a vacuum environment, which is costly and not conducive to product maintenance. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer stage device that is easy to assemble and maintain, has a high degree of integration, a small size, and occupies less space. The configured shielding components can shield or avoid the wafer.

[0006] To address the aforementioned technical problems, the present invention provides a wafer stage device, comprising: a housing assembly in communication with the atmospheric environment, including a support plate; a rotary stage assembly, including a support platform and a pressing portion, the pressing portion being used to press the wafer against the support platform; a first magnetohydrodynamic shaft, including a first inner shaft and a first outer shaft with rotational sealing, the first outer shaft being sealed and assembled to the support plate, the first inner shaft having a first end extending into the housing assembly and a second end extending out of the housing assembly, the second end being connected to the rotary stage assembly; a lifting assembly, the lifting assembly including a main body and a lifting body, the main body being located within the housing assembly, the lifting body being slidably sealed to the support plate or the first outer shaft, and the lifting body being capable of interacting with the pressing portion; and a shielding assembly, including a baffle, the baffle being configured to be rotatably assembled to the support plate to switch between a first work position opposite to the rotary stage assembly and a second work position offset from the rotary stage assembly.

[0007] Using this approach, the housing assembly can isolate the external vacuum environment from the internal atmospheric environment. The main body of the lifting assembly can be assembled entirely within the housing assembly. This way, the lifting assembly only needs to use conventional components, resulting in lower costs and easier assembly and maintenance. The first magnetohydrodynamic shaft includes a first inner shaft and a first outer shaft with rotary seals. The first outer shaft can be sealed and assembled to the support plate to cooperate with the housing assembly in isolating the internal and external environments. The lifting body can slide and seal with the support plate or the outer shaft, enabling the power of the lifting assembly to be transmitted to the pressing part while isolating the internal and external environments. This allows the pressing part to move relatively closer to or away from the support platform, thereby facilitating tablet loading and pressing.

[0008] Furthermore, the shielding component can either shield or avoid the rotary table assembly. In the first shielding position, the baffle can be opposite the rotary table assembly to shield the wafer located on the assembly, effectively preventing damage from the ion beam and extending the lifespan of the support stage. In the second avoiding position, the baffle can be offset from the rotary table assembly to expose the wafer, thus facilitating wafer processing.

[0009] Optionally, the rotary table assembly further includes a rotating body, which includes the pressing part, the force transmission component, and the guide rod. The pressing part and the force transmission component are located on opposite axial sides of the support platform. The guide rod is slidably mounted on the support platform, and both ends of the guide rod are connected to the pressing part and the force transmission component, respectively. The lifting body can interact with the force transmission component.

[0010] Optionally, it also includes an elastic component disposed between the support platform and the force transmission component.

[0011] Optionally, the support platform is provided with a guide sleeve, and the guide rod passes through the guide sleeve.

[0012] Optionally, the force transmission component is further provided with a push pin, and the push pin and the guide rod are located on the same side of the force transmission component.

[0013] Optionally, the lifting assembly further includes a stop top located outside the housing assembly and connected to the lifting body.

[0014] Optionally, the main body includes a corrugated pipe, which is fitted onto the lifting body.

[0015] Optionally, the main body further includes a cylinder and a lifting plate, the cylinder having a piston rod connected to the lifting plate, and the lifting plate being equipped with a plurality of the lifting bodies.

[0016] Optionally, it further includes a first drive assembly located within the housing assembly, the first drive assembly having a first drive shaft that is drively connected to the first inner shaft.

[0017] Optionally, the first drive shaft and the first inner shaft are arranged in parallel.

[0018] Optionally, it further includes: a second magnetohydrodynamic shaft, comprising a second inner shaft and a second outer shaft with a rotary seal, the second outer shaft being sealed and fitted to the support plate, the second inner shaft having a third end extending into the housing assembly and a fourth end extending out of the housing assembly, the fourth end being connected to the baffle; and a second drive assembly located within the housing assembly, the second drive assembly having a second drive shaft being drively connected to the third end. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a specific embodiment of the wafer stage device provided by the present invention;

[0020] Figure 2 This is a structural schematic diagram of the lifting assembly;

[0021] Figure 3 This is a schematic diagram of the rotating main body.

[0022] Figures 1-3 The annotations in the accompanying drawings are explained as follows:

[0023] 1. Housing assembly; 11. Support plate; 12. First cover; 13. Second cover;

[0024] 2 Rotary table assembly, 21 Support platform, 22 Rotating body, 221 Pressing part, 222 Force transmission component, 223 Guide rod, 224 Guide sleeve, 225 Elastic component, 226 Ejector pin;

[0025] 3. First magnetohydrodynamic shaft, 31. First inner shaft, 32. First outer shaft;

[0026] 4 First drive assembly, 41 Motor, 42 First drive shaft, 43 Drive pulley, 44 Driven pulley, 45 Synchronous belt;

[0027] 5 Lifting assembly, 51 Main body, 511 Cylinder, 512 Piston rod, 513 Lifting plate, 514 Bellows, 52 Lifting body, 53 Top;

[0028] 6. Shielding assembly, 61. Baffle, 62. Connecting part;

[0029] 7. Second magnetohydrodynamic axis; 71. Second inner axis; 72. Second outer axis;

[0030] 8 Second drive assembly, 81 Rotary cylinder, 82 Second drive shaft, 83 Coupling. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] The term "several" as used in this article refers to a number of uncertain quantities, usually two or more; and when "several" is used to indicate the quantity of certain components, it does not indicate the quantitative relationship between these components.

[0033] The terms "first" and "second" used in this article are used only for the convenience of describing two or more structures or components that are identical or similar in structure and / or function, and do not indicate any special limitation on order and / or importance.

[0034] Magnetofluid, also known as magnetic liquid or ferrofluid, is a colloidal material composed of two phases: a solid phase, which mainly refers to magnetic solid nanoparticles, and a liquid phase, which refers to the liquid that can carry the solid magnetic nanoparticles. Magnetofluid has the fluidity, lubricity, and sealing properties of a liquid carrier, while also possessing the strong magnetism and other properties of solid nanoparticles.

[0035] Magnetofluid seals use permanent magnets to fix a magnetofluid between an inner and outer shaft. Because the gap between the inner and outer shafts is very small and the magnetic field strength is exceptionally high, it can withstand significant thrust along the axial direction, thus achieving a sealing effect. The inner shaft, outer shaft, and the magnetofluid positioned between them can be collectively referred to as a magnetofluid shaft.

[0036] As described in the background section, the lifting components used in existing platform devices are mostly dedicated vacuum components. The entire equipment is configured and exposed to a vacuum environment, which is costly and not conducive to product assembly and maintenance.

[0037] To address this, this invention provides a wafer stage device that isolates the internal space (atmospheric environment) and external space (vacuum environment) of a housing assembly. The main body of the lifting assembly can be housed within the housing assembly, meaning that the lifting assembly can be almost entirely located in the atmospheric environment. This allows the lifting assembly to use only conventional components, resulting in lower costs and reduced assembly and maintenance difficulties.

[0038] Please refer to the details. Figures 1-3 , Figure 1 This is a schematic diagram of a specific embodiment of the wafer stage device provided by the present invention. Figure 2 This is a structural diagram of the lifting assembly. Figure 3 This is a schematic diagram of the rotating main body.

[0039] like Figure 1 As shown, the present invention provides a wafer stage device, comprising: a housing assembly 1, the internal space of which is connected to the atmospheric environment, that is, the internal space of the housing assembly 1 is the atmospheric environment, and the housing assembly 1 includes a support plate 11; a rotary stage assembly 2, including a support platform 21 and a pressing part 221, wherein the support platform 21 is used to support the wafer, and the pressing part 221 is used to press the wafer against the support platform 21 to ensure the reliability of wafer fixation, the pressing part 221 can be an integral ring structure, or it can include several parts distributed in the circumferential direction; a first magnetohydrodynamic shaft 3, including a first inner shaft 31 and a first outer shaft 32, with a magnetohydrodynamic shaft between them. The body (not shown in the figure) is used to achieve rotational sealing between the two. The first outer shaft 32 is sealed and assembled (the specific sealing method can be setting a sealing ring, sealing gasket, etc.) on the support plate 11 to serve as a fixed shaft. The first inner shaft 31 has a first end extending into the housing assembly 1 and a second end extending out of the housing assembly 1. The second end is connected to the rotary table assembly 2. The lifting assembly 5 includes a main body 51 and a lifting body 52. ​​The main body 51 is located inside the housing assembly 1. The lifting body 52 slides and seals with the support plate 11 or the first outer shaft 32 to isolate the internal and external environments. The lifting body 52 can interact with the pressing part 221 to drive the lifting body 52 to move.

[0040] Using this scheme, the housing assembly 1 can isolate the external vacuum environment from the internal atmospheric environment. The main body 51 of the lifting assembly 5 can be assembled entirely within the housing assembly 1. In this way, the lifting assembly 5 only needs to use conventional components, which can reduce costs and facilitate assembly and maintenance. The first magnetohydrodynamic shaft 3 includes a first inner shaft 31 and a first outer shaft 32 with a rotary seal. The first outer shaft 32 can be sealed and assembled to the support plate 11 to cooperate with the housing assembly 1 in isolating the internal and external environments. The lifting body 52 can slide and seal with the support plate 11 or the outer shaft 32, which can transmit the power of the lifting assembly 5 to the pressing part 221 under the condition of isolating the internal and external environments, so as to drive the pressing part 221 to move relatively closer to or away from the support table 21, thereby facilitating the loading and pressing of tablets.

[0041] In the above scheme, the first magnetohydrodynamic shaft 3 and the lifting component 5 are both assembled on the housing component 1, which can achieve a high degree of integration and a small size.

[0042] Here, the embodiments of the present invention do not limit the specific structural form of the lifting component 5. In practical applications, those skilled in the art can make selections as needed. For example, the lifting component 5 can be a driving element that can directly output linear displacement, such as a cylinder or hydraulic cylinder. In this case, the aforementioned lifting body 52 can be the piston rod of these driving elements. Alternatively, the lifting component 5 can also be a driving element that can directly output rotational displacement, such as a motor. In this case, it is also necessary to use a displacement conversion mechanism in the form of a gear and rack mechanism or a lead screw mechanism to convert the directly output rotational displacement into the required linear displacement. Taking a gear and rack mechanism as an example, the aforementioned lifting body 52 can be a rack.

[0043] exist Figure 2 In this embodiment, the lifting assembly 5 can use a standard cylinder. The main body 51 can include a cylinder 511 and a lifting plate 513. The cylinder 511 has a piston rod 512, which can extend and retract, thereby driving the lifting plate 513 to rise and fall. The aforementioned lifting body 52 can be installed on the lifting plate 513. With this structure, the lifting plate 513 is equivalent to a transition connector, on which multiple lifting bodies 52 can be installed. Thus, multi-point drive can be achieved by one cylinder 511. On the one hand, the number of cylinders 511 used can be reduced to save costs and avoid the problem of inconsistent action caused by using multiple cylinders 511. On the other hand, multi-point drive is also more conducive to ensuring the stability of the lifting of the pressing part 221.

[0044] It should be noted that the solution of using the lifting plate 513 for transitional connection to enable one cylinder 511 to generate multiple driving points is only a preferred solution of the present invention, but it does not mean that only one cylinder 511 can be used in practice. In fact, the number of cylinders 511 can also be multiple in order to generate greater driving force.

[0045] Furthermore, the main body 51 may also include a bellows 514. One end of the bellows 514 can be connected to the lifting plate 513, and the other end of the bellows 514 can be connected to the support plate 11 (when the lifting body 52 extends from the first outer shaft 32, the other end of the bellows 514 can also be connected to the first outer shaft 32). The bellows 514 can be sleeved onto the lifting body 52 to achieve a sealed assembly between the lifting body 52 and the support plate 11 (or the first outer shaft 32). Simultaneously, the bellows 514 has a certain elastic deformation capacity. When the cylinder 511 is inflated to drive the pressing part 221 upward, the bellows 514 can be compressed. When the cylinder 511 is deflated, the elastic force of the bellows 514 can be released to facilitate the rapid reset of the pressing part 221. Furthermore, the bellows 514 can also be used to limit the stroke of the cylinder 511.

[0046] It is understandable that the sliding seal method is not limited to the bellows 514, but can also be achieved by setting annular seals such as sealing rings.

[0047] The lifting body 52 can be directly connected to the pressing part 221, or the lifting body 52 can be indirectly connected to the pressing part 221 through other components, which is specifically related to the structural form of the rotary table assembly 2.

[0048] In the embodiments shown in the accompanying drawings, as Figure 1 and Figure 3 As shown, the rotary table assembly 2 may further include a rotating body 22, which may include a pressing part 221, a force transmission component 222, and a guide rod 223. The pressing part 221 and the force transmission component 222 may be located on opposite axial sides of the support platform 21, and the guide rod 223 is slidably mounted on the support platform 21, meaning that the guide rod 223 can slide relative to the support platform 21. Both ends of the guide rod 223 may be connected to the pressing part 221 and the force transmission component 222, respectively, so that the rotating body 22 and the support platform 21 can form an integral component, thereby improving integration. The lifting body 52 can interact with the force transmission component 222.

[0049] The support platform 21 may be provided with a through hole, and the guide rod 223 may be inserted into the through hole to realize the sliding of the guide rod 223 relative to the support platform 21. Alternatively, the rotating body 22 may also include a guide sleeve 224, which may be installed on the support platform 21, specifically on one axial side of the support platform 21 or inside the support platform 21; the guide rod 223 may also be inserted into the guide sleeve 224; the guide sleeve 224 is a special guide accessory with higher guiding accuracy, which is more conducive to ensuring the sliding direction of the guide rod 223, and is a preferred solution of the present invention.

[0050] The crimping part 221 can crimp and fix the wafer by its own gravity.

[0051] Alternatively, an elastic component 225 can be configured, which can be disposed between the support platform 21 and the force transmission component 222. In this way, when the lifting assembly 5 generates a lifting force on the force transmission component 222 to drive the pressing part 221 relatively away from the support platform 21, the elastic component 225 can be compressed to accumulate elastic force; when the lifting force generated by the lifting assembly 5 disappears, the elastic force accumulated by the elastic component 225 can be released, which can drive the pressing part 221 to quickly reset; and the elastic component 225 can also improve the reliability of the pressing part 221 for wafer pressing and fixing.

[0052] Here, the embodiments of the present invention do not limit the specific structural form of the elastic component 225. In practical applications, those skilled in the art can configure it according to actual needs, as long as it meets the requirements of use. For example, the elastic component 225 can be an elastomer made of rubber material with certain elastic properties, or the elastic component 225 can also be a spring, bellows, etc. In the embodiments shown in the accompanying drawings, as... Figure 1 and Figure 3 As shown, the elastic component 225 can be a spring, which can be fitted onto the guide rod 223. In this embodiment, the guide rod 223 can also achieve radial positioning of the spring, so as to avoid radial movement of the spring during use and improve the stability of the spring.

[0053] Furthermore, the force transmission component 222 may also be provided with a ejector pin 226, and the ejector pin 226 and the guide rod 223 may be located on the same side of the force transmission component 222; and the axial dimension of the ejector pin 226 may be smaller than that of the guide rod 223, so that the support height of the guide rod 223 is higher than that of the ejector pin 226.

[0054] When the force transmission component 222 is driven to lift the guide rod 223 and the ejector pin 226, the guide rod 223 can first drive the pressing part 221 away from the support platform 21, and then the ejector pin 226 begins to contact the wafer and drive the wafer away from the support platform 21; when the force transmission component 222 is driven to lower the guide rod 223 and the ejector pin 226, the ejector pin 226 can first stably place the wafer on the support platform 21, and then the pressing part 221 will press against the wafer; this arrangement can better avoid interference problems between the wafer and the pressing part 221 during the operation process.

[0055] Please continue to refer to this. Figure 1 The lifting assembly 5 may also include a stop 53, which may be located outside the housing assembly 1 and connected to the lifting body 52; the lifting body 52 may specifically interact with the force transmission component 222 through the stop 53.

[0056] The structure of the abutment part 227 is not limited, as long as it can interact with the force transmission component 222. For example, the abutment part 227 can be an integral ring; or, the abutment part 227 can be a split structure and can include several parts distributed circumferentially. The number of each part can be consistent with the number of lifting bodies 52, and each part can be installed on each lifting body 52 in a one-to-one correspondence.

[0057] In addition to interacting with the force transmission component 222, the top 53 can also limit the stroke of the lifting assembly 5 by abutting against the support plate 11 (or the first outer shaft 32).

[0058] Furthermore, the wafer stage device provided by the present invention may further include a first driving component 4, which may also be located within the housing component 1. The first driving component 4 may have a first driving shaft 42, which is connected to a first inner shaft 31 for driving the first inner shaft 31 to rotate, thereby transmitting the rotational driving force to the support stage 21 to rotate the wafer. With this approach, the first driving component 4 operates in an atmospheric environment, thus requiring only conventional components, resulting in lower costs and easier assembly and maintenance.

[0059] The transmission connection method between the first drive shaft 42 and the first inner shaft 31 is not limited, as long as the rotational driving force of the first drive shaft 42 can be transmitted to the first inner shaft 31. In some embodiments, the first drive shaft 42 and the first inner shaft 31 can be coaxially arranged, in which case they can be connected by a coupling or other components. In other embodiments, such as Figure 1 As shown, the first drive shaft 42 and the first inner shaft 31 can be parallel to each other. In this case, the first drive assembly 4 can be located on the radial side of the first magnetohydrodynamic shaft 3, which also helps to reduce the axial space occupied by the platform device. The transmission connection between the first drive shaft 42 and the first inner shaft 31 includes, but is not limited to, gear transmission, sprocket transmission, and pulley transmission. Taking pulley transmission as an example, combined with... Figure 1 The first drive shaft 42 can be equipped with a drive wheel 43, and the first inner shaft 31 can be equipped with a driven wheel 45. The timing belt 45 can be fitted onto the drive wheel 43 and the driven wheel 44 to transmit the driving force of the drive wheel 43 to the driven wheel 44. Furthermore, by adjusting the radial dimensions of the drive wheel 43 and the driven wheel 44, the transmission ratio between the first drive shaft 42 and the first inner shaft 31 can also be adjusted.

[0060] Furthermore, the wafer stage device described above may also include a shielding component 6, which may include a baffle 61 configured to be rotatably mounted on the support plate 11.

[0061] The baffle 61 has a first station and a second station. In the first station, the baffle 61 can be opposite to the rotary table assembly 2 to shield the wafer located on the rotary table assembly 2, effectively preventing damage to the wafer from the ion beam and extending the service life of the support stage 21. In the second station, the baffle 61 can be offset from the rotary table assembly 2 to expose the wafer, thereby facilitating wafer processing.

[0062] The action of the baffle 61 can be manually controlled, that is, the operator can manually drive the baffle 61 to rotate and switch between the first station and the second station, so that the structure of the equipment can be relatively simple.

[0063] Alternatively, a dedicated drive structure can be provided to automatically drive the baffle 61 to rotate and switch between the first and second workstations, thus achieving a higher degree of automation. In this embodiment, the wafer stage device provided by the present invention may further include: a second magnetofluid shaft 7, similar in structure to the first magnetofluid shaft 3, the second magnetofluid shaft 7 may include a second inner shaft 71 and a second outer shaft 72, which are rotated and sealed by a magnetofluid. The second outer shaft 72 may be sealed and assembled to the support plate 11 as a fixed axis. The second inner shaft 71 has a third end extending into the housing assembly 1 and a fourth end extending out of the housing assembly 1. The fourth end may be connected to the baffle 61, either directly or by a connecting part 62 provided on the baffle 61, with the fourth end connected to the connecting part 62. A second drive assembly 8 may be located inside the housing assembly 1. The second drive assembly 8 may have a second drive shaft 82, which may be connected to the third end for transmission, thereby driving the baffle 61 to rotate through the third end.

[0064] With this approach, the second drive component 8 is also placed in the atmospheric environment, and only conventional components are needed for the second drive component 8, which can reduce costs and facilitate product assembly and maintenance; the second magnetohydrodynamic shaft 7 can isolate the internal and external environments to transmit the driving force of the second drive component 8 to the shielding component 6.

[0065] Here, the embodiments of the present invention do not limit the structural form of the second drive component 8. In specific practice, those skilled in the art can configure it according to actual needs, as long as it meets the requirements of use. For example, the second drive component 8 can use a motor, a rotary cylinder, etc. as the drive element; taking a rotary cylinder as an example, combined with... Figure 1 The second drive assembly 8 may include a rotary cylinder 81, which may have a second drive shaft 82. The second drive shaft 82 may be connected to the second inner shaft 71 for transmission. The specific transmission connection method can be referred to the description of the first drive shaft 42 and the first inner shaft 31 mentioned above. In the attached figure, the transmission is achieved by setting a coupling 83. The rotary cylinder 81 can realize the reciprocating rotation of the baffle 61 at a set angle.

[0066] Similarly, the embodiments of the present invention are not limited to the structural form of the housing assembly 1, as long as the corresponding technical effect can be achieved. Figure 1 In the embodiment shown, the housing assembly 1 may include a support plate 11, a first cover 12 and a second cover 13. The second cover 13 may be provided with a notch for communicating with the external environment. Furthermore, the second cover 13 may also be connected to a revolution axis (not shown in the figure). In specific applications, the revolution axis can drive the wafer stage device to rotate as a whole in order to adjust the support direction of the support stage 21.

[0067] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A wafer stage device, characterized in that, include: The housing assembly (1) that is in communication with the atmospheric environment includes a support plate (11). The rotary table assembly (2) includes a support platform (21) and a pressing part (221) for pressing the wafer against the support platform (21). The first magnetohydrodynamic shaft (3) includes a first inner shaft (31) and a first outer shaft (32) with a rotation seal. The first outer shaft (32) is sealed and fitted to the support plate (11). The first inner shaft (31) has a first end that extends into the housing assembly (1) and a second end that extends out of the housing assembly (1). The second end is connected to the rotary table assembly (2). The lifting assembly (5) includes a main body (51) and a lifting body (52). The main body (51) is located inside the housing assembly (1). The lifting body (52) is slidably sealed with the support plate (11) or the first outer shaft (32). The lifting body (52) can interact with the pressing part (221). The shielding assembly (6) includes a baffle (61) configured to be rotatably mounted on the support plate (11) for switching between a first station opposite to the rotary table assembly (2) and a second station offset from the rotary table assembly (2).

2. The wafer stage apparatus according to claim 1, characterized in that, The rotary table assembly (2) further includes a rotating body (22), which includes the pressing part (221), the force transmission component (222), and the guide rod (223). The pressing part (221) and the force transmission component (222) are located on opposite sides of the support platform (21). The guide rod (223) is slidably mounted on the support platform (21), and both ends of the guide rod (223) are connected to the pressing part (221) and the force transmission component (222), respectively. The lifting body (52) can interact with the force transmission component (222).

3. The wafer stage apparatus according to claim 2, characterized in that, It also includes an elastic component (225) disposed between the support platform (21) and the force transmission component (222).

4. The wafer stage apparatus according to claim 2, characterized in that, The support platform (21) is provided with a guide sleeve (224), and the guide rod (223) is inserted through the guide sleeve (224).

5. The wafer stage apparatus according to claim 2, characterized in that, The force transmission component (222) is also provided with a push pin (226), and the push pin (226) and the guide rod (223) are located on the same side of the force transmission component (222).

6. The wafer stage apparatus according to claim 2, characterized in that, The lifting assembly (5) also includes a stop (53), which is located outside the housing assembly (1) and is connected to the lifting body (52).

7. The wafer stage apparatus according to any one of claims 1-6, characterized in that, The main body (51) includes a bellows (514), which is sleeved on the lifting body (52).

8. The wafer stage apparatus according to any one of claims 1-6, characterized in that, The main body (51) also includes a cylinder (511) and a lifting plate (513). The cylinder (511) has a piston rod (512) connected to the lifting plate (513). The lifting plate (513) is equipped with a plurality of lifting bodies (52).

9. The wafer stage apparatus according to any one of claims 1-6, characterized in that, It also includes a first drive assembly (4), which is located inside the housing assembly (1) and has a first drive shaft (42) that is connected to the first inner shaft (31).

10. The wafer stage apparatus according to claim 9, characterized in that, The first drive shaft (42) and the first inner shaft (31) are arranged in parallel.

11. The wafer stage apparatus according to any one of claims 1-6, characterized in that, Also includes: The second magnetohydrodynamic shaft (7) includes a second inner shaft (71) and a second outer shaft (72) with a rotary seal. The second outer shaft (72) is sealed and fitted to the support plate (11). The second inner shaft (71) has a third end that extends into the housing assembly (1) and a fourth end that extends out of the housing assembly (1). The fourth end is connected to the baffle (61). The second drive assembly (8) is located inside the housing assembly (1) and has a second drive shaft (82) which is connected to the third end via a transmission connection.

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