Laser processing device

Abstract

A laser processing apparatus has a frame, a processing table, a portal, a processing head, a load / unload portal, an exhaust port, an external gas suction port, and a deflection portion. The frame is disposed on a floor and has a first surface orthogonal to a first direction and a second surface, a third surface orthogonal to a second direction and a fourth surface, and a fifth surface orthogonal to the third direction and opposite the floor. The portal has a column portion disposed on at least one of both sides of the processing table in the second direction, and a beam portion connected to the column portion and extending above the processing table in the second direction. The processing head is supported by the beam portion and emits laser light. The load / unload portal is disposed on the first surface. The exhaust port is disposed on the second surface and is connected to an exhaust portion that generates an air flow in the interior of the frame. The external gas suction port is disposed on an upper portion of the frame on the first surface side in the first direction compared to the processing head and suctions external gas. The deflection portion guides the external gas introduced from the external gas suction port toward the processing head. The processing head is present on the second surface side compared to the external gas suction port.

Description

Technical Field

[0001] This invention relates to a laser processing apparatus for processing workpieces by irradiating them with a laser. Background Technology

[0002] In laser processing apparatuses that process workpieces by irradiating them with a laser, techniques for removing dust generated at the processing point of the workpiece irradiated by the laser have been proposed. Patent Document 1 discloses a laser cutting apparatus comprising: a movable stage having a workpiece setting area for setting the workpiece to be cut; a laser oscillator disposed opposite to the workpiece setting area and having a laser emission surface for emitting laser light; a cover member covering the laser irradiation space between the laser emission surface and the workpiece setting area; and...

[0003] A dust collection pump. The cover component of the laser cutting device described in Patent Document 1 has an air intake and an exhaust port. The air intake is positioned closer to the workpiece area than the laser emitting surface on the side of the cover component. The exhaust port is positioned closer to the workpiece area than the laser emitting surface on the opposite side of the workpiece area, and is connected to a dust collection pump. During the processing of the workpiece, the dust collection pump is activated, thereby allowing air to flow from the air intake into the laser irradiation space inside the cover component, forming an exhaust airflow to horizontally discharge dust generated at the processing point on the surface side of the workpiece in the workpiece area. This prevents dust from adhering to the surface of the workpiece.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2008-23548 Summary of the Invention

[0005] However, in the laser cutting apparatus described in Patent Document 1, the workpiece being processed is a plate-shaped object, such as a semiconductor device, whose thickness is sufficiently small compared to its horizontal dimension. Therefore, when the workpiece is not plate-shaped but has a three-dimensional shape with uneven surfaces, it is difficult to install a large cover member that covers the processing position without interfering with the workpiece. Furthermore, installing an air intake and exhaust port on the cover member near the workpiece results in a large processing head including the cover member, making it difficult for the processing head to approach the uneven workpiece. To avoid the above situation, a method is considered whereby the entire processing table is covered by the cover member, and the entire interior of the cover member is vented. In the cover member described above, as in Patent Document 1, if a horizontal exhaust airflow is formed at the processing point near the processing table, the exhaust airflow becomes turbulent when the workpiece is three-dimensional, preventing the exhaust airflow from reaching the processing point and resulting in the inability to vent dust generated at the processing point.

[0006] The present invention was made in view of the above circumstances, and its object is to provide a laser processing apparatus that can form an exhaust gas flow that stably discharges dust generated at the processing point when processing a workpiece having a three-dimensional shape with concave and convex features by irradiating it with a laser.

[0007] To address the aforementioned issues and achieve the objectives, the laser processing apparatus of this invention comprises a frame, a processing worktable, a door-shaped structure, a processing head, a loading / unloading door, an exhaust port, an external gas intake port, and a deflection section. Three mutually orthogonal directions are designated as the first direction, the second direction, and the third direction. The frame is disposed on the floor of an interior space and has a first and second surface orthogonal to the first direction, a third and fourth surface orthogonal to the second direction, and a fifth surface orthogonal to the third direction and opposite to the ground. The processing worktable is disposed inside the frame and holds the workpiece, having a worktable surface parallel to the ground. The door-shaped structure has a column base provided on at least one side of the second direction of the processing worktable, and a beam connected to the column base and extending in the second direction above the processing worktable. The processing head is supported on the beam and emits laser light. The loading / unloading door is provided on the first surface and is used for loading and unloading the workpiece; it is a door that can be opened and closed. An exhaust port is located on the second surface and is connected to an exhaust section that generates airflow, i.e., airflow, within the frame. An external gas intake port is located on the upper part of the frame on the first surface side in the first direction, relative to the machining head, and draws in air from outside the frame, i.e., external gas. A deflector guides the external gas introduced from the external gas intake port toward the machining head. The machining head exists on the second surface side relative to the external gas intake port at all positions within its movable range.

[0008] The effects of the invention

[0009] The laser processing apparatus of the present invention has the following effect: when processing a workpiece with a three-dimensional shape having concave and convex features by irradiating it with a laser, it can form an exhaust gas flow that stably discharges the dust generated at the processing point. Attached Figure Description

[0010] Figure 1 This is a perspective view showing an example of the structure of the laser processing apparatus according to Embodiment 1.

[0011] Figure 2 This is a cross-sectional view showing an example of the exhaust gas flow within the frame of the laser processing apparatus according to Embodiment 1.

[0012] Figure 3 This is a cross-sectional view showing another example of the exhaust gas flow within the frame of the laser processing apparatus according to Embodiment 1.

[0013] Figure 4This is a cross-sectional view showing an example of the configuration position of the external gas intake in the laser processing apparatus according to Embodiment 1.

[0014] Figure 5 This is a cross-sectional view showing another example of the structure of the laser processing apparatus according to Embodiment 1.

[0015] Figure 6 This is a cross-sectional view showing another example of the structure of the laser processing apparatus according to Embodiment 1.

[0016] Figure 7 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 2.

[0017] Figure 8 This is a cross-sectional view schematically illustrating the movement of the gate in the laser processing apparatus according to Embodiment 2.

[0018] Figure 9 This is a cross-sectional view schematically illustrating the movement of the gate in the laser processing apparatus according to Embodiment 2.

[0019] Figure 10 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 3.

[0020] Figure 11 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 4.

[0021] Figure 12 This is a diagram illustrating an example of the exhaust airflow inside the frame of a laser processing apparatus without a limiting section.

[0022] Figure 13 This is a diagram illustrating another example of the exhaust airflow inside the frame of a laser processing apparatus without a limiting section.

[0023] Figure 14 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 5.

[0024] Figure 15 This is a diagram illustrating an example of the exhaust gas flow around the processing head in the laser processing apparatus according to Embodiment 4.

[0025] Figure 16 This is a diagram illustrating an example of the exhaust gas flow around the processing head in the laser processing apparatus according to Embodiment 5.

[0026] Figure 17This is a cross-sectional view showing an example of the arrangement position of the limiting part in the laser processing apparatus according to Embodiment 5. Detailed Implementation

[0027] The laser processing apparatus according to embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0028] Implementation method 1.

[0029] Figure 1 This is a perspective view showing an example of the structure of the laser processing apparatus according to Embodiment 1. Figure 1 In this diagram, two orthogonal axes in the horizontal plane are designated as the X-axis and Y-axis, and the axis perpendicular to both the X-axis and Y-axis is designated as the Z-axis. Hereinafter, two relative positions along the X-axis are represented by "front and back," two relative positions along the Y-axis by "left and right," and two relative positions along the Z-axis by "up and down." Furthermore, the X-axis corresponds to the first direction, the Y-axis corresponds to the second direction, and the Z-axis corresponds to the third direction.

[0030] The laser processing apparatus 1 has a frame 10. The frame 10 has a hollow shape, having six surfaces: a front surface 11 and a rear surface 12 orthogonal to the X-axis, a left surface 13 and a right surface 14 orthogonal to the Y-axis, and a lower surface 15 and an upper surface 16 orthogonal to the Z-axis. In one example, the frame 10 is a hollow hexahedron. Hereinafter, we will take the case where the frame 10 is a hollow cuboid extending longer in the X-axis direction than in the Y-axis direction as an example. The front surface 11 corresponds to the first surface, the rear surface 12 corresponds to the second surface, the left surface 13 corresponds to the third surface, the right surface 14 corresponds to the fourth surface, and the upper surface 16 corresponds to the fifth surface. The front surface 11 serves as an openable / closable loading / unloading door 11a used for loading or unloading the workpiece 51. Figure 1 In this case, the entire front surface 11 becomes the loading / unloading door 11a, but it is also possible that a portion of the front surface 11 is composed of the loading / unloading door 11a.

[0031] The laser processing apparatus 1 shown in Embodiment 1 takes a portion of the workpiece 51 up to several meters in length as the processing object. Therefore, an example of the length of the processing worktable 21 is greater than or equal to 1m and less than or equal to 7m.

[0032] The laser processing apparatus 1 has a processing table 21, a processing head 22, and a gate 23 inside a frame 10. The processing table 21 is disposed on the lower surface 15 inside the frame 10, and holds the workpiece 51, which is the object to be laser processed. It has a worktable surface parallel to the lower surface 15. Here, the processing table 21, like the frame 10, is shaped to have a longer length in the X-axis direction than in the Y-axis direction. The processing table 21 is movable in the X-axis direction, which is the length direction. That is, a drive system (not shown) is provided to move the processing table 21 in the X-axis direction. The workpiece 51 is moved from the loading / unloading gate 11a disposed on the front surface 11 of the frame 10 onto the processing table 21 inside the frame 10.

[0033] The processing head 22 focuses the laser beam transmitted by a laser oscillator (not shown) onto the point where the workpiece 51 is processed, i.e., the processing point. The processing head 22 changes the relative position with the workpiece 51, thereby processing the workpiece 51 into an arbitrary shape.

[0034] When a CO2 laser is used as a laser oscillator, the transmission of laser light from the laser oscillator to the processing head 22 is typically achieved through multiple mirrors. Alternatively, when a fiber laser, disk laser, or direct diode laser that oscillates at a wavelength capable of transmission through an optical fiber is used as a laser oscillator, an optical fiber for optical transmission is typically employed.

[0035] The gantry type 23 is configured to span the machining table 21. The gantry type 23 has a pair of column legs 231 extending in a direction perpendicular to the lower surface 15, and a beam 232 connecting the ends of the pair of column legs 231 on the upper surface 16 side. The beam 232 extends above the machining table 21 in the Y-axis direction. A machining head 22 is mounted on the beam 232. The machining head 22 is connected to the beam 232 via a support member 24. In one example, the support member 24 movably supports the machining head 22 in both the Z-axis and Y-axis directions. That is, a drive system (not shown) for moving the machining head 22 in both the Z-axis and Y-axis directions is provided on the support member 24.

[0036] The laser processing apparatus 1 has an exhaust port 31 and an external gas intake port 32 in its housing 10. The exhaust port 31 is located on the rear surface 12 of the housing 10 and is connected to an exhaust section (not shown). In one example, the exhaust port 31 is located at approximately the same position as the upper surface of the processing table 21 in the Z-axis direction. The exhaust section generates airflow, i.e., an airflow, within the housing 10. The external gas intake port 32 is located on the upper part of the housing 10 on the front surface 11 side in the X-axis direction, relative to the processing head 22. That is, the processing head 22 exists on the rear surface 12 side at all positions within its movable range.Figure 1 In this example, the external gas intake port 32 is located at the end of the upper surface 16 of the frame 10 on the side of the loading / unloading door 11a, and draws in the external gas from outside the frame 10 into the frame 10. An example of such gas is air.

[0037] The laser processing apparatus 1 includes a deflector 41 and a light-shielding plate 42. The deflector 41 guides the external gas drawn into the interior of the housing 10 toward the processing head 22. The light-shielding plate 42 is located near the external gas intake 32 outside the housing 10 and is configured to surround the external gas intake 32 so that scattered light from the laser from the processing head 22 does not leak from the external gas intake 32, or sufficiently attenuates the scattered light from the laser that leaks from the external gas intake 32. In one example, the light-shielding plate 42 is a plate-shaped component that is vertically arranged at an angle perpendicular or nearly perpendicular to the upper surface 16 of the housing 10 on the front surface 11, left surface 13, and right surface 14 sides of the rectangular external gas intake 32.

[0038] In Embodiment 1, the relative positions of the processing head 22 and the workpiece 51 change as follows: The processing table 21, which supports the workpiece 51, moves or extends in the front-to-back direction, thereby changing the relative positions of the workpiece 51 and the laser-emitting processing head 22. Furthermore, to change the incident angle of the laser relative to the workpiece 51, the support member 24 that fixes the processing head 22 may have a rotation mechanism of one or more for rotating the processing head 22.

[0039] When the workpiece 51 is processed by irradiating with a laser, reflected or scattered laser light, or processing light from the processed material or plasma of the processing gas, is emitted from the processing point. Additionally, dust, composed of the raw materials constituting the workpiece 51, or melts or oxides of the raw materials, is generated from the workpiece 51 and floats in the air. Especially when the workpiece 51 is made of carbon fiber reinforced plastics (CFRP), the dust contains conductive fibers such as carbon fibers. If these floating, fine conductive fibers adhere to the electrical circuit boards of the laser processing apparatus 1 (not shown), such as control devices or power supply devices, a short circuit may occur on the electrical circuit boards, potentially causing malfunctions or damage to the laser processing apparatus 1. Therefore, it is particularly important that processing light or floating dust does not extend outside the laser processing apparatus 1. Therefore, in Embodiment 1, the processing worktable 21 containing the processing point, the processing head 22, the gate type 23, etc., are arranged to be completely covered inside the cover, i.e., the frame 10.

[0040] Furthermore, if the dust generated is still floating inside the frame 10 and the loading / unloading door 11a is opened, the dust may leak out of the frame 10. To recover the dust generated during processing, it is necessary to form an exhaust airflow that flows in one direction past the processing point towards the exhaust port 31. For example, if the external gas inlet 32 ​​is located on the upper surface 16 near the processing point, the airflow does not flow in one direction past the processing point, resulting in sediment formation at the processing point and becoming an airflow that expands within the frame 10. In the structure described above, dust diffuses within the frame 10 and deposits on the lower surface 15 inside the frame 10. In this case, dust may be stirred up when the workpiece 51 is placed on or removed from the processing table 21.

[0041] Figure 2 This is a cross-sectional view showing an example of the exhaust gas flow within the frame of the laser processing apparatus according to Embodiment 1. According to the structure of Embodiment 1, external gas is drawn into the frame 10 from the external gas intake port 32 on the upper surface 16 of the loading / unloading door 11a side. This gas flows through the processing point in one direction and becomes an airflow toward the exhaust port 31, forming an exhaust gas flow EF that is a downward-rushing airflow from the upper surface 16 toward the processing point. That is, the rear surface 12, opposite to the loading / unloading door 11a, is drawn toward the exhaust port 31 connected to the exhaust section. The external gas intake port 32 is located on the upper surface 16 near the loading / unloading door 11a side, compared to the processing point.

[0042] An external gas inlet 32 ​​is located on the upper surface 16 of the frame 10. Therefore, even if reflected or scattered laser light from the workpiece 51, or processing light generated at the processing point, leaks from the external gas inlet 32, the reflected, scattered, or processing light will still reach the operator outside the frame 10 via the ceiling of the room containing the frame 10. That is, the reflected, scattered, or processing light is sufficiently attenuated until it reaches the operator's position from inside the frame 10 via the external gas inlet 32. Furthermore, by providing a simple structure with a light shield 42 around the external gas inlet 32 ​​outside the frame 10, the reflected, scattered, or processing light is attenuated by the light shield 42 through reflection and scattering. In other words, the reflected, scattered, or processing light can be effectively contained inside the frame 10, providing a safe environment for the operator working outside the frame 10. Furthermore, if the reflection and scattering of reflected light, scattered light, or processing light can be sufficiently attenuated from the processing point to the external gas inlet 32, the light shield 42 may not be required.

[0043] As described above, in Embodiment 1, the external gas inlet 32, which serves to both draw in external gas and shield light in the laser processing apparatus 1, can be configured with a simple shape.

[0044] like Figure 2 As shown, if the interior of the frame 10 is vented via the exhaust port 31 through the exhaust section (not shown), external gas is drawn into the interior of the frame 10 through the external gas intake port 32. The external gas drawn in from the external gas intake port 32 is bent in direction by the inclination of the deflection portion 41 provided on the upper surface 16 inside the frame 10. That is, the external gas flows toward the processing point of the workpiece 51 at the front end of the processing head 22. In addition, the airflow of the external gas in one direction relative to the processing point can discharge the dust generated at the processing point to the exhaust port 31 at the rear. Furthermore, as described above, the external gas intake port 32 is provided near the loading / unloading door 11a on the upper surface 16, so the exhaust airflow EF can be supplied to the processing point via a downward airflow. Thus, even when the workpiece 51 has a 3D shape, the shape of the workpiece 51 located on the loading / unloading door 11a side compared to the processing head 22 will not obstruct the exhaust airflow EF, and the dust generated at the processing point can be vented and recovered.

[0045] In one example, the deflection section 41 has a flat first portion 411 extending from the upper surface 16 toward the lower surface 15, and a flat second portion 412 extending from the end of the first portion 411 on the lower surface 15 side toward the processing head 22. The deflection section 41 can be made of a single plate or have a partially curved surface. The angle α between the inclined surface of the second portion 412 of the deflection section 41 and the upper surface 16 of the frame 10 is set, for example, to be greater than or equal to 25 degrees and less than or equal to 50 degrees, depending on the position of the deflection section 41 and the positional relationship between the processing area and the processing area. Alternatively, the deflection section 41 can be made of a portion of the inner surface of the frame 10, including the upper surface 16. The width of the deflection section 41 in the Y-axis direction only needs to be longer than the width of the external gas intake 32 in the Y-axis direction. Preferably, it is 10 percent longer than the width of the external gas intake 32 in the Y-axis direction. In addition, the deflection section 41 may not extend from the left surface 13 to the right surface 14 of the frame 10. The length of the deflection section 41 in the X-axis direction is only required to be longer than the length of the external gas inlet 32 ​​in the X-axis direction after the external gas introduced into the frame 10 through the external gas inlet 32 ​​expands within the frame 10 in order to reach the deflection section 41. That is, the projection portion of the deflection section 41 onto the upper surface 16 only needs to include the external gas inlet 32. In one example, it can be set to a length that is approximately several times the length of the external gas inlet 32 ​​in the X-axis direction. Furthermore, if the length of the deflection section 41 in the X-axis direction is long, the distance along the airflow becomes longer, thereby improving the controllability of the airflow direction toward the processing point.

[0046] In addition, Figure 1 In the example shown, the frame 10 is shaped as a cuboid, but the shape of the frame 10 in Embodiment 1 is not limited to a cuboid. The frame 10 can be substantially hexahedral in structure as long as it achieves the effects of Embodiment 1, that is, within the range where effective dust exhaust and recovery can be achieved. For example, the corners of the frame 10 can be rounded, or the corners of the frame 10 can be formed by curved surfaces. Protrusions or curved surfaces can be provided on the front surface 11, rear surface 12, left surface 13, right surface 14, or top surface 16 of the frame 10.

[0047] Next, the location of the external gas intake 32 provided on the upper surface 16 will be explained. If the external gas intake 32 is located relatively far from the processing point but close to the loading / unloading door 11a, the exhaust gas flow EF near the processing point will be a downdraft flow, but closer to horizontal. Figure 3 This is a cross-sectional view showing another example of the exhaust gas flow within the frame of the laser processing apparatus according to Embodiment 1. Figure 3 In, with Figure 2 Compared to the previous case, the position of the machining worktable 21 is different. Additionally, in... Figure 3 The image shows a laser processing apparatus 1 without a light-shielding plate 42. (Example) Figure 3 As shown, when the machining position in the workpiece 51 moves, the exhaust airflow EF near the machining point is also a downward-rushing airflow, but it is closer to horizontal. As described above, for the machining table 21 as a whole, the airflow can be set to face the exhaust port 31 in one direction.

[0048] In contrast, if the external gas intake 32 is located relatively close to the processing point and far from the loading / unloading door 11a, the angle α between the inclined surface of the second part 412 of the deflector 41 and the upper surface 16 is set to be, for example, large, greater than or equal to 70 degrees. As a result, the exhaust gas flow EF near the processing point becomes a downdraft with a greater inclination relative to the processing point. In this case, large deposits are formed on the surface of the workpiece 51 due to its surface shape, and part of the airflow flows toward the loading / unloading door 11a side, opposite to the exhaust port 31, causing some of the dust and other particles generated at the processing point to diffuse and deposit inside the frame 10. Therefore, for the workpiece 51, it is required that the exhaust gas flow EF be a downdraft with almost no inclination.

[0049] The effect of the position of the external gas inlet 32 ​​is shown in the results of numerical fluid analysis. Figure 4 This is a cross-sectional view showing an example of the configuration location of the external gas intake in the laser processing apparatus according to Embodiment 1. For example... Figure 4As shown, the external gas inlet 32 ​​is preferably located closer to the loading / unloading door 11a than the machining head 22, and on the loading / unloading door 11a side of the machining table 21. Furthermore, the external gas inlet 32 ​​is preferably located on the upper surface 16 of the loading / unloading door 11a side, where the angle A formed by the straight line L1 from the machining head 22 down to the machining table 21 and the straight line L2 connecting the point P where the straight line L1 intersects the surface of the machining table 21 to the external gas inlet 32 ​​is greater than or equal to 30 degrees. Moreover, by setting the external gas inlet 32 ​​to a position where the angle A is greater than or equal to 40 degrees, the angle between the inclination of the exhaust airflow EF relative to the machining point and the upper surface 16 can be suppressed to less than or equal to 50 degrees. As a result, large deposits will not form on the surface of the workpiece 51, and an airflow towards the exhaust port 31 can be formed relative to the entire machining table 21 inside the frame 10.

[0050] Figure 5 This is a cross-sectional view showing another example of the structure of the laser processing apparatus according to Embodiment 1. Figure 5 The position of the external gas inlet 32 ​​of the laser processing device 1 shown is... Figure 1 and Figure 2 Different. Figure 1 and Figure 2 In the middle, the external gas intake 32 is located on the upper surface 16 near the loading / unloading door 11a, but... Figure 5 In the middle, it is located at the position where it meets the ridge line between the upper surface 16 and the front surface 11 of the frame 10. For the position of the external gas intake 32 as described above, an exhaust gas flow EF is also formed in one direction from the processing point toward the exhaust port 31. Furthermore, other structures are due to... Figure 1 and Figure 2 Since they are the same, their description is omitted.

[0051] In the above description, the deflection section 41 is shown as a single component, but it can also be composed of multiple components. In this case, the multiple components are arranged parallel to each other in the X-axis direction in the region of the upper surface 16 inside the frame 10 that includes the external gas intake port 32. Figure 6 This is a cross-sectional view showing another example of the structure of the laser processing apparatus according to Embodiment 1. Figure 6 In this structure, the deflection section 41 is composed of three parts. The deflection section 41 has a pair of parts spaced apart in the X-axis direction along the Y-axis of the external gas intake 32, and a third part located near the center of the external gas intake 32 between the pair of parts. Furthermore, the three parts form a parallel flow path. Other structural features are related to… Figure 1 and Figure 2 The same, therefore its description is omitted. In this case, it is possible to be withFigure 1 and Figure 2 Compared to improving the directional accuracy of the exhaust airflow EF, this allows for more precise guidance of the airflow towards the machining point. Furthermore, in Figure 6 The diagram shows the case where the deflection section 41 has two parallel flow paths, but it can also have more than or equal to three parallel flow paths.

[0052] Furthermore, the above description shows the case where the deflection part 41 is disposed inside the frame 10, but it can also be disposed outside the frame 10, compared to the external gas intake 32. In this case, the deflection part 41 is disposed outside the external gas intake 32 at an angle between 25 degrees and 50 degrees relative to the upper surface 16 of the frame 10. This also achieves the same effect. As an example of the deflection part 41 in this case, compared to... Figure 1 , Figure 2 and Figure 6 Similarly, it can be composed of one or more components, or it can be a pipe connected to the external gas inlet 32 ​​of the frame 10. When a pipe is connected, the external gas introduced into the frame 10 can be configured to be blown into the frame 10 after passing through the pipe. Alternatively, a flow path with a desired inclination can be formed on the components of the upper surface 16.

[0053] The laser processing apparatus 1 of Embodiment 1 includes: a hexahedral frame 10 having a front surface 11, a rear surface 12, a left surface 13, a right surface 14, a lower surface 15, and an upper surface 16; a processing worktable 21 disposed within the frame 10; and a door-shaped 23 disposed within the frame 10, spanning the processing worktable 21, which movably supports the processing head 22. The front surface 11 of the frame 10 serves as an inlet / outlet door 11a. The frame 10 has an external gas intake 32 on the inlet / outlet door 11a side of the upper surface 16, and an exhaust port 31 connected to an exhaust section on the rear surface 12 opposite to the front surface 11. The upper surface 16 of the laser processing apparatus 1, near the external gas intake 32 inside the frame 10, has a deflection section 41 that guides external gas toward the vicinity of the processing point. The entire movable range of the processing head 22 exists on the rear surface 12 side compared to the external gas intake 32. With the structure described above, external gas can be supplied from the external gas inlet 32, which is located obliquely above the processing point, thus allowing the external gas to be supplied to the processing point without being blocked by the workpiece 51. That is, when processing the workpiece 51, which has a three-dimensional shape with concave and convex features, by irradiating it with a laser, an exhaust gas flow EF can be formed that stably discharges the dust generated at the processing point.

[0054] Furthermore, in the laser cutting apparatus described in Patent Document 1, when an air intake is provided on one side of the cover member, countermeasures need to be implemented to prevent turbulence in the exhaust airflow inside the cover member and to prevent leakage of scattered laser light. Therefore, the shape of the light-shielding cover provided at the air intake becomes complex, requiring a large space for setting the cover.

[0055] On the other hand, in Embodiment 1, even if reflected light, scattered light, or processing light is emitted to the outside from the external gas intake 32, it will be scattered by the ceiling of the room where the frame 10 is installed and reach the operator outside the frame 10. However, by the time it reaches the operator, the reflected light, scattered light, or processing light has been sufficiently attenuated. Therefore, by not forming a complex shape on the frame 10 that has a light-shielding function for external gas intake on the external gas intake 32 side, leakage of reflected light, scattered light, or processing light can be prevented. In addition, since the frame 10 does not have a complex shape for light shielding, the loading and unloading door 11a for moving large workpieces 51 into and out of the processing area can be arranged in the frame 10.

[0056] Furthermore, in the laser cutting apparatus described in Patent Document 1, if an air intake is provided in the cover member in the width direction relative to the processing worktable which is rectangular in the horizontal direction, the air intake needs to extend along the length of the processing worktable. In the laser cutting apparatus described in Patent Document 1, a larger space is required for the air intake.

[0057] On the other hand, in Embodiment 1, an external gas intake 32 is provided on the upper surface 16 of the cuboid frame 10, and the exhaust gas flow EF flows along the length direction inside the frame 10. Therefore, unlike the laser cutting device described in Patent Document 1, it does not require a larger space for the external gas intake 32, and the dust generated by laser processing can be exhausted. In addition, even if the gate type 23 is provided, external gas is introduced from the upper surface 16 of the frame 10, so the gate type 23 will not interfere with the exhaust gas flow EF. Furthermore, the gate type 23 is provided in the direction spanning the width direction of the processing worktable 21, so it can be miniaturized compared to the case where it is provided in the direction spanning the length direction.

[0058] Implementation method 2.

[0059] In Embodiment 1, the machining table 21 moves or extends in the X-axis direction, thereby moving the workpiece 51 on the machining table 21 relative to the machining head 22. In Embodiment 2, the case where the gantry 23 supporting the machining head 22 moves will be described.

[0060] Figure 7This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 2. Furthermore, structural elements identical to those in Embodiment 1 are labeled with the same reference numerals and their descriptions are omitted. Additionally, in Embodiment 2, the case where the light-shielding plate 42 is not provided is shown. The gate type 23 of the laser processing apparatus 1 according to Embodiment 2 is movable in the X-axis direction. That is, a drive system (not shown) is provided in the gate type 23, and the gate type 23 is moved in the X-axis direction by the drive system. Figure 7 As shown, external gas from external gas inlet 32 ​​forms an exhaust gas flow EF that flows continuously in one direction from the surface of workpiece 51 to exhaust port 31 after reaching a predetermined position on the worktable 21.

[0061] Figure 8 and Figure 9 This is a cross-sectional view schematically illustrating the movement of the gate in the laser processing apparatus according to Embodiment 2. Figure 7 to Figure 9 As shown, the gate 23 moves, the position of the processing head 22 moves, and there is also a processing point in the exhaust airflow EF where the laser irradiates the workpiece 51. Therefore, in processing at any position, the dust generated at the processing point can be discharged.

[0062] In Embodiment 2, the gate type 23 is moved during processing. With the gate type 23 moved, there is no need to additionally ensure space within the frame 10 for moving the processing table 21. Therefore, the length of the frame 10 of the laser processing apparatus 1 relative to the processing table 21 in the X-axis direction can be shortened, or the length of the processing table 21 relative to the frame 10 in the X-axis direction can be lengthened. As a result, based on the effects of Embodiment 1, an effect that further improves space utilization efficiency can be obtained.

[0063] Implementation method 3.

[0064] In embodiments 1 and 2, the case where an external gas intake 32 is provided near the loading / unloading door 11a on the upper surface 16 of the frame 10 is described. In embodiment 3, the case where an external gas intake 32 is provided on the front surface 11 of the frame 10 is described.

[0065] Figure 10 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 3. In Embodiment 3, as... Figure 10 As shown, the external gas intake 32 is positioned above the loading / unloading door 11a on the front surface 11. Additionally, a deflection portion 41 is provided on the upper surface 16. Furthermore, structural elements identical to those in embodiments 1 and 2 are labeled with the same reference numerals, and their descriptions are omitted.

[0066] External gas is drawn into the interior of the frame 10 through the external gas intake 32. The airflow of the incoming external gas, i.e., the exhaust gas EF, flows along the upper surface 16, but... Figure 10 As shown, the deflection portion 41 provided on the upper surface 16 can guide the exhaust gas flow EF towards the processing point in the same way as in embodiments 1 and 2. As a result, dust generated at the processing point can be recovered, and external gas containing dust can be exhausted.

[0067] In addition, to shield reflected light, scattered light, or processing light from the processing point, a shielding device can be installed on the loading / unloading door 11a, such as... Figure 10 The light shield 42a is shown. The light shield 42a is positioned at an angle relative to the front surface 11 such that the projection portion of the light shield 42a onto the front surface 11 includes the external gas intake 32. Therefore, reflected light, scattered light, or processing light does not reach the operator outside the frame 10 via the upper surface 16 of the frame 10. Alternatively, if reflected light, scattered light, or processing light passes through the external gas intake 32, it reaches the operator outside the frame 10 via the ceiling, which is located at a higher position in the room where the light shield 42a and the laser processing apparatus 1 are located. However, during this process, the reflected light, scattered light, or processing light is further scattered and attenuated. In the above description, an example is shown where the external gas intake 32 is positioned above the loading / unloading door 11a, but the external gas intake 32 can also be provided on the loading / unloading door 11a. In one example, the external gas intake 32 is integrally formed on the upper part of the loading / unloading door 11a.

[0068] In addition, in embodiment 3, the processing worktable 21 can be moved or extended in the X-axis direction, and the gantry 23 with the processing head 22 can be moved in the X-axis direction.

[0069] In embodiment 3, the same effects as in embodiments 1 and 2 can also be obtained.

[0070] Implementation method 4.

[0071] In Embodiment 4, the case in which the ratio of the X-axis direction to the height direction of the frame 10 is increased compared to Embodiment 1 will be described.

[0072] Figure 11 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 4. Furthermore, regarding the embodiment 1... Figure 1 and Figure 2 Identical structural elements are labeled with the same number, and their descriptions are omitted. For example... Figure 11 As shown, the ratio of the length of the frame 10 in the X-axis direction to its height in the Z-axis direction is greater than that shown in Embodiment 1.Figure 2 Big. In Figure 11 and Figure 2 In this embodiment, if the height of the frame 10 is set to be the same, then Embodiment 4 is a method related to the laser processing apparatus 1 capable of processing workpieces 51 with longer shapes. Similar to Embodiment 1, the laser processing apparatus 1 in Embodiment 4 changes the relative position between the processing head 22 and the workpiece 51 by moving the processing table 21 or extending its length. For example, the value of the ratio of the length in the X-axis direction to the height in the Z-axis direction in Embodiment 1 is shown. Figure 2 The case is approximately 2.2, but it is shown in embodiment 4. Figure 11 The case is approximately 3.

[0073] like Figure 11 As shown, the length of the frame 10 in the X-axis direction is longer than that in Embodiment 1, thus increasing the distance between the processing head 22 fixed to the gate type 23 and the loading / unloading gate 11a. Correspondingly, compared to Embodiment 1, the angle α of the deflection portion 41 is adjusted to allow it to reach a more distant processing position. For example, the angle α between the upper surface 16 and the second portion 412 of the deflection portion 41 is less than or equal to 25 degrees. Furthermore, the laser processing apparatus 1 according to Embodiment 4 also has a limiting portion 43 between the upper surface 16 and the beam portion 232 of the gate type 23. This limiting portion 43 is a component that changes the direction of the exhaust gas flow EF downwards from the upper surface 16 towards the processing point. The limiting portion 43 is opposite to the space containing the external gas intake 32 and has a surface inclined relative to the upper surface 16. That is, the limiting portion 43 has an inclined surface on the side of the external gas intake 32.

[0074] According to the structure described above, after the external gas introduced into the frame 10 from the external gas inlet 32 ​​is supplied to the processing point at the front end of the processing head 22, it flows through the exhaust port 31, thereby enabling the exhaust of dust and the like.

[0075] Restriction section 43 Figure 11 The limiting part 43 is constructed from a flat plate arranged at an angle to the upper surface 16, but the connection portion to the upper surface 16 can also be curved. Alternatively, a columnar component with a conical surface on one side can be mounted on the upper surface 16 to form the limiting part 43, or the upper surface 16 can have a protrusion to form the limiting part 43. The width of the limiting part 43 in the Y-axis direction is longer than the width of the machining table 21. Preferably, the width of the limiting part 43 in the Y-axis direction is 10% longer than the width of the machining table 21. Furthermore, the width of the limiting part 43 in the Y-axis direction is preferably the length between the left surface 13 and the right surface 14 of the frame 10 in the Y-axis direction. As described above, if the width of the limiting part 43 is sufficiently increased, all airflow can be guided towards the machining point.

[0076] Next, the functions of the deflection part 41 and the limiting part 43 in the structure of the laser processing apparatus 1 according to Embodiment 4 will be explained. Figure 12 This is a diagram illustrating an example of the exhaust airflow inside the frame of a laser processing apparatus without a limiting section. Figure 12 The length of the frame 10 of the laser processing device 1 in the X-axis direction is... Figure 11 The angle α of the deflection portion 41 is the same as that shown in Embodiment 1. That is, the angle α formed by the second part 412 of the deflection portion 41 and the upper surface 16 of the frame 10 is greater than or equal to 25 degrees and less than or equal to 50 degrees. Figure 12 In this diagram, the machining table 21 is positioned at the rear to machine the front surface of the workpiece 51. Furthermore, the dashed line in the diagram extends along the inclined surface of the second portion 412 of the deflection section 41. Additionally, regarding Embodiment 1... Figure 1 and Figure 2 The same structural elements are labeled with the same number, and their descriptions are omitted.

[0077] Relative to the position of the machining table 21, the exhaust airflow EF formed by the external gas drawn in from the external gas inlet 32 ​​collides with the end face 21a on the side of the loading / unloading door 11a of the machining table 21, and part of it returns to the loading / unloading door 11a side, failing to supply sufficient exhaust airflow EF to the machining point. That is, the angle of the deflection part 41 is insufficient, therefore, it is necessary to make the angle α of the deflection part 41 point towards the direction of the more distant machining head 22.

[0078] Figure 13 This is a diagram illustrating another example of the exhaust airflow inside the frame of a laser processing apparatus without a limiting section. Figure 13 and Figure 12 Similarly, a diagram is shown as an example of the exhaust gas flow EF inside the frame 10 of the laser processing apparatus 1 without the limiting part 43. Figure 13 The length of the frame 10 of the laser processing device 1 in the X-axis direction is... Figure 11 Same. Additionally, the angle α was adjusted so that the inclined surface of the second part 412 of the deflection section 41, i.e., the extension line of the second part 412, is closer to the machining point. Furthermore, regarding Embodiment 1... Figure 1 and Figure 2 The same structural elements are labeled with the same number, and their descriptions are omitted.

[0079] like Figure 13As shown, when the angle α is adjusted so that the position of the extension line of the inclined surface of the second part 412 of the deflection section 41 is closer to the processing point, the distance between the exhaust gas flow EF and the upper surface 16 becomes shorter, and the angle between the direction of the exhaust gas flow EF and the upper surface 16 is less than or equal to 20 degrees, nearly parallel. Therefore, as the exhaust gas flow EF enters the downstream, it is pulled by the upper surface 16 through the wall adhesion effect described later, becoming an airflow along the upper surface 16. As a result, as... Figure 13 As shown, the exhaust airflow EF passes above the processing point and under the gate type 23, and cannot exhaust dust and other particles generated at the processing point.

[0080] The wall-attachment effect, as described in Japanese Patent Publication No. 2007-505283, was a phenomenon discovered in 1910 during aerial experiments conducted by Romanian engineer Enri Coanda. The wall-attachment effect is the property that, when an air jet is positioned close enough to a surface such as a ceiling, the air jet is attracted to the surface and continues to flow while in contact with it. The wall-attachment effect is also called the surface effect. This phenomenon is caused by the property that the air jet is drawn in by the surrounding air it is in contact with and mixes with it, thus diffusing. Regardless of the surface it is near, the surrounding air is drawn in by the surface. As a result, the pressure between the airflow and the surface decreases, making it easier for the air jet to be attracted to the surface.

[0081] In contrast, such as Figure 11 As shown, in the structure of the laser processing apparatus 1 of Embodiment 4, where a limiting part 43 is arranged between the deflection part 41 on the upper surface 16 inside the frame 10 and the processing head 22, the exhaust gas flow EF is deflected by the deflection part 41 and then pulled by the upper surface 16, flowing along the upper surface 16. Then, the exhaust gas flow EF bends again along the limiting part 43. As a result, the exhaust gas flow EF is separated from the upper surface 16, and can be guided towards the processing point. Therefore, in the frame 10, which has a shape extending in the moving direction of the processing table 21, the exhaust gas flow EF from the external gas intake 32 provided on the upper surface 16 near the loading / unloading door 11a is also guided to the processing point, thereby enabling the recovery of dust and other particles generated at the processing point that flow through the exhaust port 31.

[0082] In Embodiment 4, the laser processing apparatus 1 has a limiting portion 43 between the deflection portion 41 on the upper surface 16 inside the frame 10 extending in the moving direction of the processing table 21 and the processing head 22. As a result, external gas flowing into the frame 10 from the external gas inlet 32 ​​flows along the upper surface 16, but is directed towards the processing point by the limiting portion 43. Therefore, exhaust gas flow EF is also guided towards the processing point inside the frame 10 extending in the moving direction of the processing table 21, achieving the same effect as in Embodiment 1.

[0083] Implementation method 5.

[0084] In Embodiment 4, a limiting part 43 provided inside the frame 10 extending in the moving direction of the processing table 21 is disposed on the upper surface 16 at an angle not perpendicular to the upper surface 16 of the frame 10. In Embodiment 5, a laser processing apparatus 1 that can guide exhaust gas flow EF to the processing point inside the frame 10 extending in the moving direction of the processing table 21 by means of a different method than in Embodiment 4 will be described.

[0085] Figure 14 This is a cross-sectional view showing an example of the structure of the laser processing apparatus according to Embodiment 5. In Embodiment 4, as... Figure 11 As shown, the limiting part 43 is formed by having an inclined surface relative to the upper surface 16 of the frame 10 on the side of the external gas inlet 32. In embodiment 5, the limiting part 43 is as follows: Figure 14 As shown, it has a surface perpendicular to the upper surface 16. Furthermore, regarding Embodiment 1... Figure 1 and Figure 2 The same structural elements are labeled with the same number, and their descriptions are omitted.

[0086] The exhaust airflow inside the frame 10 of the laser processing apparatus 1 according to Embodiment 5 will be described. Similar to Embodiment 4, the external gas flowing in from the external gas inlet 32 ​​is deflected by the deflector 41 towards the gate 23 on which the processing head 22 is fixed. However, this airflow approaches the upper surface 16, parallel to it, and therefore, after being pulled by the upper surface 16 by the wall-attachment effect, it bends downward upon encountering the restrictor 43, guiding it towards the processing point. Therefore, even with the restrictor 43 positioned perpendicular to the upper surface 16, dust and other contaminants generated at the processing point can be recovered by flowing through the exhaust port 31.

[0087] In implementation method 4 Figure 11 In the first embodiment, the exhaust gas flow EF along the upper surface 16 is bent at a gentle angle by the limiting part 43. In contrast, in embodiment 5, the limiting part 43 is arranged with a surface orthogonal to the exhaust gas flow EF, so the exhaust gas flow EF collides with the limiting part 43, forming a sedimentation area on the surface of the limiting part 43. Then, the exhaust gas flow EF flows to avoid the sedimentation area, thus not flowing along the limiting part 43, but changing direction downwards. As a result, as... Figure 14 As shown, the direction of the exhaust gas flow EF is bent at a steeper angle than in the case of embodiment 4 by means of the limiting part 43.

[0088] The exhaust gas flow EF near the processing head 22 in the situation described above will be explained. Figure 15This diagram illustrates an example of the exhaust airflow around the processing head in the laser processing apparatus according to Embodiment 4. The two single arrows EFa in the diagram, for example, indicate a flow velocity of 0.4 m / s, sufficient for dust recovery. The range between these single arrows EFa shows a flow velocity greater than or equal to 0.4 m / s, indicating a range where dust can be normally recovered. In the diagram, the intersection of each single arrow EFa and the straight line L1 (indicated by the dashed line passing through the center of the processing head 22) forms the vertical range R1 within the processing area where the airflow can normally recover dust.

[0089] Figure 16 This diagram illustrates an example of the exhaust gas flow around the processing head in the laser processing apparatus according to Embodiment 5. The two single arrows EFa in the diagram... Figure 15 The explanation is the same as in [the previous text]. For example... Figure 16 As shown, in the airflow around the processing head 22 of the laser processing apparatus 1 according to Embodiment 5, the airflow becomes an upward airflow with a larger angle relative to the processing head 22. Therefore, when the distance between the single arrows EFa is the same, the range R2 in the vertical direction where the exhaust airflow EF can also normally recover dust is greater than that of the vertical airflow. Figure 15 In this case, the range R1 is wide. Therefore, according to the structure of the laser processing apparatus 1 of embodiment 5, dust in the processing area that is wider than the upper and lower range can also be normally recovered and exhausted.

[0090] Compared to embodiment 4, in embodiment 5, the angle of the airflow relative to the machining point becomes abrupt, thus the position of the limiting part 43 relative to the machining head 22 in the X-axis direction becomes closer to the machining head 22. If the position of the limiting part 43 in the X-axis direction is too close to the machining head 22, the exhaust airflow EF will pass over the machining area. Conversely, if the position of the limiting part 43 in the X-axis direction is too far from the machining head 22, the airflow on the surface of the machining table 21 reaches near the front of the machining head 22, thus concentrating the airflow below the machining area. As a result, the advantage of the machining area being wider in the vertical direction, as described above, is not achieved. Therefore, regarding the horizontal position of the limiting part 43, there is a preferred position corresponding to the desired vertical range of the machining area.

[0091] The results of numerical fluid dynamics analysis are shown regarding the position of the limiting part 43 in the X-axis direction. Figure 17 This is a cross-sectional view showing an example of the arrangement position of the limiting part in the laser processing apparatus according to Embodiment 5. As a result, in order to form an airflow from the loading / unloading door 11a side through the processing point towards the exhaust port 31 side, such as... Figure 17As shown, the angle B formed by the straight line L1, which descends downwards from the center of the processing head 22, intersecting the processing table 21 at point P, is preferably greater than or equal to 20 degrees and less than or equal to 55 degrees, formed by the straight line L3 connecting the installation positions of the upper surface 16 of the restrictor 43 from point P. Furthermore, it is preferable to install the restrictor 43 at a position between 30 degrees and 45 degrees. By installing the restrictor 43 in the aforementioned angle range, the vertical clearance for the processing point can be expanded, and an airflow can be formed from the loading / unloading door 11a inside the frame 10 towards the exhaust port 31, thus enabling efficient recovery of dust and other contaminants generated at the processing point.

[0092] In the laser processing apparatus 1 of Embodiment 5, a limiting portion 43 perpendicular to the upper surface 16 is provided between the deflection portion 41 and the processing head 22 inside the frame 10 extending along the moving direction of the processing table 21. As a result, external gas flowing into the frame 10 from the external gas inlet 32 ​​flows along the upper surface 16, but becomes airflow towards the processing point through the limiting portion 43. Therefore, the exhaust gas flow EF can also be guided to the processing point inside the frame 10 extending in the moving direction of the processing table 21, achieving the same effect as in Embodiment 1. Furthermore, compared to the case where the limiting portion 43 is provided at an angle not perpendicular to the upper surface 16 as in Embodiment 4, airflow can be supplied over a wider vertical processing range.

[0093] Furthermore, in embodiments 1 to 5 described above, the case where the closable loading / unloading door 11a is provided on the front surface 11 of the frame 10 was explained, but the closable loading / unloading door 11a can also be provided on surfaces other than the front surface 11. Additionally, in embodiments 1 to 5 described above, the case where the frame 10 is a hollow hexahedron was explained, but the lower surface 15 can also be formed by the floor of the room where the frame 10 of the laser processing apparatus 1 is installed. Furthermore, in embodiments 1 to 5 described above, an example of a double-supported portal type 23 is given, where the beam portion 232 supporting the processing head 22 is supported by two column bases 231, but a cantilever beam portal type 23 supporting the beam portion 232 by a single column base 231 can also be used.

[0094] The structure shown in the above embodiments is an example, and it can also be combined with other known technologies, and the embodiments can be combined with each other. Without departing from the spirit of the subject, some parts of the structure can be omitted or changed.

[0095] Explanation of the label

[0096] 1. Laser processing device, 10. Frame, 11. Front surface, 11a. Loading and unloading door, 12. Rear surface, 13. Left surface, 14. Right surface, 15. Lower surface, 16. Upper surface, 21. Processing table, 21a. End face, 22. Processing head, 23. Door type, 24. Support component, 31. Exhaust port, 32. External gas intake port, 41. Deflection part, 42, 42a. Light shield, 43. Restriction part, 51. Workpiece, 231. Column base, 232. Beam, 411. Part 1, 412. Part 2.

Claims

1. A laser processing apparatus, characterized in that, have: A frame, which is disposed on the indoor floor, has three mutually orthogonal directions designated as the first direction, the second direction and the third direction, and has a first and a second surface orthogonal to the first direction, a third and a fourth surface orthogonal to the second direction, and a fifth surface orthogonal to the third direction and opposite to the ground. A processing workbench, which is disposed inside the frame, is used to set up the workpiece and has a work surface parallel to the ground; A portal frame having a column base provided on at least one side of the two sides of the machining worktable in the second direction, and a beam connected to the column base and extending above the machining worktable in the second direction. The processing head, supported by the beam, emits a laser beam. The loading and unloading door is used when moving the workpiece in and out, and can be opened and closed. An exhaust port is provided on the second side and is connected to an exhaust section that generates airflow, i.e., airflow, inside the frame. An external gas intake port, located on the upper part of the frame on the first surface side in the first direction compared to the processing head, draws in air from outside the frame, i.e., external gas; and A deflector that guides the external gas introduced from the external gas inlet toward the processing head. The processing head is located on the second side relative to the external gas inlet at all positions within its movable range.

2. The laser processing apparatus according to claim 1, characterized in that, The deflection portion is disposed on the fifth surface inside the frame.

3. The laser processing apparatus according to claim 1, characterized in that, The multiple components of the deflector extending in the second direction are arranged parallel to each other in the first direction in the region of the fifth surface inside the frame that includes the external gas inlet.

4. The laser processing apparatus according to claim 1, characterized in that, The deflector is located externally compared to the frame of the external gas inlet.

5. The laser processing apparatus according to any one of claims 2 to 4, characterized in that, The external gas intake port is located on the fifth surface.

6. The laser processing apparatus according to claim 2, characterized in that, The external gas inlet is positioned on the upper side compared to the loading / unloading door on the first surface.

7. The laser processing apparatus according to claim 2, characterized in that, The fifth surface inside the frame between the external gas inlet and the beam also has a limiting portion that changes the direction of the airflow toward the processing head.

8. The laser processing apparatus according to claim 7, characterized in that, The limiting part is opposite to the space containing the external gas inlet and has a surface that is inclined relative to the fifth surface.

9. The laser processing apparatus according to claim 7, characterized in that, The limiting part is a plate-shaped component that extends in the second direction and is perpendicular to the fifth surface.

10. The laser processing apparatus according to any one of claims 1 to 9, characterized in that, Either the machining table or the machining head is movable in the first direction.

11. The laser processing apparatus according to any one of claims 1 to 10, characterized in that, It also includes a light shield to prevent reflected or scattered laser light or processing light from the workpiece from leaking out of the external gas intake. The light shield is disposed on at least a portion of the exterior of the frame around the external gas inlet.

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