A carrier disc cleaning apparatus and method

Abstract

The application provides a carrier disc cleaning device and method. The carrier disc cleaning device is used for cleaning a silicon wafer carrier disc, and comprises a circumferential groove first cleaning assembly used for cleaning the silicon wafer carrier disc. The first cleaning assembly comprises a driving assembly, a cleaning probe and a guide structure. The cleaning probe is in transmission connection with the driving assembly, so that the cleaning probe can perform circumferential movement under the driving of the driving assembly. The guide structure is used for filling a radial groove between two circumferentially adjacent convex structures of the silicon wafer carrier disc, so that the cleaning probe moves along the circumferential groove of the silicon wafer carrier disc. The carrier disc cleaning device of the embodiment of the application can drive the cleaning probe to move along the axial groove of the silicon wafer carrier disc through the driving assembly, and can ensure that the cleaning probe can move along the circumferential groove in the cleaning process through the guide structure. Therefore, the cleaning effect on the silicon powder and silicon particles on the silicon wafer carrier disc can be improved, and the influence on the subsequent silicon wafer processing can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a carrier disk cleaning apparatus and method. Background Technology

[0002] The silicon wafer manufacturing process includes cleaning and polishing processes. During these processes, the silicon wafers are typically placed on wafer carriers, which hold the wafers in place using vacuum suction and rotate them to achieve cleaning and polishing. However, the polishing and cleaning process can generate a large amount of silicon powder, which may deposit in the grooves of the carrier. Related technologies use brushes to clean the silicon powder; however, if the silicon powder accumulates over a long period, its strength becomes high, making it difficult to effectively clean the wafer with a brush. Prolonged use can also lead to brush wear. Therefore, existing cleaning methods are insufficient to thoroughly clean the wafer carrier, and the resulting silicon powder or particles may damage the wafer during subsequent use, potentially affecting wafer processing. Summary of the Invention

[0003] This invention provides a carrier disk cleaning apparatus and method to solve the problem that incomplete cleaning of silicon wafer carrier disks affects the silicon wafer processing effect.

[0004] To solve the above problems, the present invention is implemented as follows:

[0005] In a first aspect, embodiments of the present invention provide a carrier disk cleaning apparatus for cleaning silicon wafer carrier disks. The carrier disk cleaning apparatus includes a first cleaning component for cleaning the circumferential grooves of the silicon wafer carrier disk. The first cleaning component includes a driving component, a cleaning probe, and a guiding structure. The cleaning probe is convexly connected to the driving component so that the cleaning probe can perform circumferential motion under the drive of the driving component. The guiding structure is used to fill the radial groove between two circumferentially adjacent protrusions of the silicon wafer carrier disk so that the cleaning probe can move along the circumferential grooves of the silicon wafer carrier disk.

[0006] In some embodiments, the guide structure includes a positioning portion and a filling portion. The positioning portion is arc-shaped, and the filling portion is disposed laterally to the positioning portion. The shape and size of the filling portion are the same as the shape and size of the radial groove between two adjacent protrusions along the circumferential direction of the silicon wafer carrier. The filling portion is used to fill the radial groove.

[0007] In some embodiments, there are at least two guide structures corresponding to each of the circumferential grooves, and the guide structures are respectively used to fill the radial grooves on both sides of the circumferential groove.

[0008] In some embodiments, the carrier disk cleaning device further includes a second cleaning component for cleaning the radial grooves of the silicon wafer carrier disk. The second cleaning component includes a support and a cleaning line. The number of supports is two, and the two supports are arranged relatively at intervals. The distance between the two supports is greater than the diameter of the silicon wafer carrier disk. The cleaning line is connected between the two supports, and the length of the cleaning line is greater than or equal to the distance between the two supports.

[0009] In some embodiments, the second cleaning assembly further includes a take-up and release device, which is connected to the cleaning line and is used to drive the cleaning line to reciprocate along its length.

[0010] In some embodiments, a cleaning brush and an ultrasonic cleaning assembly are also included, the cleaning brush and the ultrasonic cleaning assembly being stacked together to clean the silicon wafer carrier.

[0011] Secondly, embodiments of the present invention provide a disk cleaning method, applied to the disk cleaning apparatus described in any of the above claims, the method comprising:

[0012] The cleaning probe is controlled to move into the circumferential groove of the silicon wafer carrier, and the radial groove between two circumferentially adjacent protrusions of the silicon wafer carrier is filled using the guide structure.

[0013] The cleaning probe is driven by the driving component to move in a circular motion around the central axis of the silicon wafer carrier to clean the circumferential grooves of the silicon wafer carrier.

[0014] In some embodiments, the method further includes:

[0015] The radial groove intersects with the circumferential groove to be cleaned by a guide structure, wherein the positioning part fills the circumferential groove adjacent to the circumferential groove to be cleaned, and the filling part fills the radial groove connected to the circumferential groove to be cleaned.

[0016] In some embodiments, the method further includes:

[0017] The second cleaning component is controlled to move closer to the silicon wafer carrier to be cleaned, so that the cleaning line comes into contact with the silicon wafer carrier.

[0018] The second cleaning assembly is controlled to reciprocate so that the cleaning line falls into the radial groove of the silicon wafer carrier.

[0019] The radial grooves of the silicon wafer carrier are cleaned using the cleaning line.

[0020] In some embodiments, the method further includes:

[0021] The cleaning line is moved back and forth by the take-up and untake-down device to clean the radial groove.

[0022] The cleaning device of this invention, by setting a cleaning probe, can clean the circumferential grooves of the silicon wafer by moving the cleaning probe around the circumference. By setting a guide structure, it can be ensured that the cleaning probe can move along the circumferential grooves during the cleaning process. Compared with existing cleaning methods such as brushes, the cleaning probe can more accurately clean the silicon powder and silicon particles deposited in the grooves of the silicon wafer, which helps to improve the cleaning effect and ensure the reliability of silicon wafer processing. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1A This is a schematic diagram of the structure of a silicon wafer carrier disk in related technologies;

[0025] Figure 1B This is another structural schematic diagram of a silicon wafer carrier disk in related technologies;

[0026] Figure 2 This is a schematic diagram of the cleaning state of the first cleaning component in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the filling structure in the embodiments of this application;

[0028] Figure 4 This is a schematic diagram of the structure of the second cleaning component according to an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the cleaning state of the second cleaning component in an embodiment of this application. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In the embodiments of this invention, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices. Additionally, the use of "and / or" in this application indicates at least one of the connected objects, such as A and / or B and / or C, representing seven possibilities: including A alone, B alone, C alone, and the presence of both A and B, both B and C, both A and C, and the presence of A, B, and C.

[0032] This invention provides a carrier disk cleaning device for cleaning silicon wafer carrier disks.

[0033] like Figure 1A and Figure 1B As shown, existing silicon wafer carriers 100 typically include multiple circumferential grooves 101 and radial grooves 102. Here, the circumferential grooves 101 refer to annular grooves, while the radial grooves 102 refer to grooves along the diameter direction of the silicon wafer carrier 100. In practice, the silicon wafer carrier 100 typically uses a vacuum chuck or similar method to pick up the silicon wafers to be cleaned or processed.

[0034] In the technical solution of this embodiment, the silicon wafer cleaning device is used to clean the silicon wafer carrier 100. The silicon wafer cleaning device includes a first cleaning component 210, which is used to clean the circumferential groove 101 of the silicon wafer carrier 100.

[0035] The first cleaning component 210 includes a driving component, a cleaning probe 211, and a guide structure. The cleaning probe 211 is connected to the driving component for transmission, so that the cleaning probe 211 can perform circular motion under the drive of the driving component.

[0036] In some embodiments, the first cleaning component 210 further includes a guide structure.

[0037] It should be understood that, due to the presence of the radial groove 102, the sidewall of the circumferential groove 101 is discontinuous. In addition, the position of the cleaning probe 211 itself may have a certain deviation, such as a certain offset or deformation within a small range. That is to say, during the movement of the cleaning probe 211, it may be offset to the radial groove 102 that is connected to the circumferential groove 101 and abut against the sidewall of the radial groove 102, affecting the normal movement of the cleaning probe 211.

[0038] This invention provides a method for cleaning a carrier disk. In one embodiment, the method includes:

[0039] The cleaning probe is controlled to move into the circumferential groove of the silicon wafer carrier, and the radial groove between two circumferentially adjacent protrusions of the silicon wafer carrier is filled using the guide structure.

[0040] The cleaning probe is driven by the driving component to move in a circular motion around the central axis of the silicon wafer carrier to clean the circumferential grooves of the silicon wafer carrier.

[0041] like Figure 2 As shown in the technical solution of this embodiment, when the silicon wafer carrier 100 needs to be cleaned, the silicon wafer probe is first controlled to move into the circumferential groove 101 of the silicon wafer. Then, the silicon wafer probe is driven by the driving device to move along the circumferential groove 101 of the silicon wafer carrier 100, so as to achieve precise and thorough cleaning of each circumferential groove 101, ensuring the removal of residual silicon powder or silicon particles deposited in the silicon wafer groove. When the cleaning probe moves into the circumferential groove 101 of the silicon wafer carrier 100, the guide structure fills the radial groove 102 connected to the circumferential groove 101, so that the circumferential groove 101 forms a continuous annular groove.

[0042] like Figure 1A As shown, the silicon wafer carrier disk 100 has multiple circumferential grooves 101, and the multiple circumferential grooves 101 are roughly distributed in concentric circles.

[0043] In the technical solution of this embodiment, the number of cleaning probes 211 can be a set, and only one circumferential groove 101 is cleaned at a time; the number of cleaning probes 211 can also be set to multiple sets. For example, a circular base plate can be set, and multiple probes with different distances from the center of the base plate can be set on the base plate. When the base plate rotates, multiple circumferential grooves 101 can be cleaned simultaneously using different probes to improve cleaning efficiency.

[0044] In some embodiments, the method further includes:

[0045] The radial groove intersects with the circumferential groove to be cleaned by a guide structure, wherein the positioning part fills the circumferential groove adjacent to the circumferential groove to be cleaned, and the filling part fills the radial groove connected to the circumferential groove to be cleaned.

[0046] In the technical solution of this embodiment, in order to improve the positioning effect of the guide structure, the guide structure includes a positioning part 212 and a filling part 213.

[0047] Please also refer to Figure 1B and Figure 3A radial groove 102 is formed between two adjacent protrusions along the silicon wafer carrier 100. The shape and size of the filling part 213 are the same as those of the radial groove 102. The filling part 213 is used to fill the radial groove 102. When the filling part 213 fills the radial groove 102, the sidewalls of each circumferential groove 101 can form a continuous structure. Thus, during the movement of the cleaning probe 211, it can be understood that it moves continuously within the continuous track formed by the circumferential groove 101, so as to ensure that the silicon powder and silicon particles in the circumferential groove 101 can be effectively removed.

[0048] like Figure 3 As shown, in this embodiment, an arc-shaped positioning part 212 is further provided. The shape of the positioning part 212 is the same as the shape of the groove adjacent to the target circumferential groove 101 to be cleaned. It should be understood that for each circumferential groove 101, the notch size formed by the radial groove 102 on its sidewall is small. Therefore, the filling part 213 may be difficult to accurately fill the radial groove 102. If the position of the filling part 213 is deviated, it may also deviate into the circumferential groove 101 and block the normal movement of the cleaning probe 211.

[0049] In this embodiment, by providing a guide structure including a positioning part 212 and a filling part 213, the radial groove 102 can be accurately and reliably filled. When the cleaning probe 211 moves to this position, the arc-shaped positioning part 212 can accurately fill the inner circumferential groove 101 and / or the outer circumferential groove 101 adjacent to the target circumferential groove 101, ensuring that the cleaning probe 211 can move along the target circumferential groove 101.

[0050] In some embodiments, there are at least two guide structures corresponding to each circumferential groove 101, and the guide structures are respectively used to fill the radial grooves 102 on both sides of the circumferential groove 101.

[0051] In this way, when cleaning each circumferential groove 101, the radial grooves 102 on both sides of the circumferential groove 101 are filled to ensure that each circumferential groove 101 forms a continuous closed structure, thereby improving the reliability of the movement of the cleaning probe 211.

[0052] In some embodiments, the filling structure is roughly in the shape of a cross, wherein the positioning part 212 is arc-shaped and a filling part 213 is provided on each of its inner and outer sides, which can fill the radial grooves 102 on both sides. In practice, the circumferential grooves 101 located on both sides of the filling structure can be cleaned at the same time. That is, in each cleaning process, a set of circumferential grooves 101 that are spaced apart are cleaned at the same time. After the cleaning is completed, the other set of circumferential grooves 101 that have not been cleaned is cleaned again. The cleaning of all circumferential grooves 101 is completed through two cleanings.

[0053] like Figure 4 As shown, in this embodiment, a second cleaning component 220 for cleaning the radial groove 102 is further provided.

[0054] In some embodiments, the carrier disk cleaning apparatus further includes a second cleaning component 220 for cleaning the radial grooves 102 of the silicon wafer carrier disk 100. The second cleaning component 220 includes a support and a cleaning line 221. There are two supports, which are arranged relatively at intervals. The distance between the two supports is greater than the diameter of the silicon wafer carrier disk 100. The cleaning line 221 is connected between the two supports and the length of the cleaning line 221 is greater than or equal to the distance between the two supports.

[0055] In some embodiments, the method further includes:

[0056] The second cleaning component is controlled to move closer to the silicon wafer carrier to be cleaned, so that the cleaning line comes into contact with the silicon wafer carrier.

[0057] The second cleaning assembly is controlled to reciprocate so that the cleaning line falls into the radial groove of the silicon wafer carrier.

[0058] The radial grooves of the silicon wafer carrier are cleaned using the cleaning line.

[0059] like Figure 4 and Figure 5 As shown, in the technical solution of this embodiment, the second cleaning component 220 is first controlled to move towards the silicon wafer carrier 100, so that the cleaning line 221 is in a taut state after it comes into contact with the silicon wafer carrier 100. Next, the control bracket drives the cleaning line 221 to move back and forth around the central axis of the silicon wafer carrier 100. In this way, during the movement of the cleaning line 221, it can fall into the radial groove 102 of the silicon wafer carrier 100.

[0060] In practice, an image sensor can be set up to determine whether the cleaning line 221 has fallen into the radial groove 102 by detecting the relative position of the cleaning line 221 and the radial groove 102. Alternatively, a force sensor can be set up to detect the change in tension on the cleaning line 221. If the tension on the cleaning line 221 changes abruptly, it indicates that the cleaning line 221 has fallen into the radial groove 102.

[0061] In some embodiments, the second cleaning assembly 220 further includes a take-up and release device, which is connected to the cleaning line 221 and is used to drive the cleaning line 221 to move back and forth along the length of the cleaning line 221.

[0062] In some embodiments, the method further includes:

[0063] The cleaning line is moved back and forth by the take-up and untake-down device to clean the radial groove.

[0064] After confirming that the cleaning line 221 has fallen into the radial groove 102, the line is wound up and unwound by the line winding device, which drives the cleaning line 221 to move back and forth, thereby cleaning the radial groove 102.

[0065] In some embodiments, a cleaning brush and an ultrasonic cleaning assembly are also included, the cleaning brush and the ultrasonic cleaning assembly being stacked to clean the silicon wafer carrier 100.

[0066] In this embodiment, a cleaning brush and an ultrasonic cleaning assembly are further provided. During implementation, after the silicon wafer carrier 100 is cleaned by the first cleaning assembly 210 and the second cleaning assembly 220, the loose silicon powder and silicon particles can be cleaned by the cleaning brush and the ultrasonic cleaning assembly to ensure that the silicon powder and silicon particles are completely removed, thereby reducing the possibility of residual silicon powder and silicon particles damaging the silicon wafer.

[0067] The cleaning device of this invention, by setting a cleaning probe 211, can clean the circumferential groove 101 of the silicon wafer by moving the cleaning probe 211 around the circumference. Compared with existing cleaning methods such as brushes, the cleaning probe 211 can more accurately clean the silicon powder and silicon particles deposited in the groove of the silicon wafer, which helps to improve the cleaning effect and ensure the reliability of silicon wafer processing.

[0068] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A carrier disk cleaning apparatus for cleaning silicon wafer carrier disks, characterized in that, The carrier disk cleaning device includes a first cleaning assembly for cleaning the circumferential grooves of the silicon wafer carrier disk. The first cleaning assembly includes a driving assembly, a cleaning probe, and a guide structure. The cleaning probe is driven by the driving assembly so that the cleaning probe can perform circumferential motion under the drive of the driving assembly. The guide structure is used to fill the radial groove between two circumferentially adjacent protrusions of the silicon wafer carrier disk so that the cleaning probe can move along the circumferential grooves of the silicon wafer carrier disk. The guide structure includes a positioning part and a filling part. The positioning part is arc-shaped, and the filling part is disposed on the side of the positioning part. The shape and size of the filling part are the same as the shape and size of the radial groove between two adjacent protrusions along the circumferential direction of the silicon wafer carrier. The filling part is used to fill the radial groove.

2. The carrier plate cleaning device as described in claim 1, characterized in that, There are at least two guide structures corresponding to each of the circumferential grooves, and the guide structures are respectively used to fill the radial grooves on both sides of the circumferential groove.

3. The tray cleaning apparatus as described in claim 1, characterized in that, The carrier disk cleaning device further includes a second cleaning component for cleaning the radial grooves of the silicon wafer carrier disk. The second cleaning component includes a support and a cleaning line. There are two supports, which are arranged relatively at intervals. The distance between the two supports is greater than the diameter of the silicon wafer carrier disk. The cleaning line is connected between the two supports and the length of the cleaning line is greater than or equal to the distance between the two supports.

4. The carrier plate cleaning device as described in claim 3, characterized in that, The second cleaning assembly further includes a take-up and release device, which is connected to the cleaning line and is used to drive the cleaning line to move back and forth along the length of the cleaning line.

5. The tray cleaning apparatus according to any one of claims 1 to 4, characterized in that, It also includes a cleaning brush and an ultrasonic cleaning assembly, which are stacked together to clean the silicon wafer carrier.

6. A method for cleaning a carrier disk, characterized in that, The method, applied to the tray cleaning apparatus according to any one of claims 1 to 5, comprises: The cleaning probe is controlled to move into the circumferential groove of the silicon wafer carrier, and the radial groove between two circumferentially adjacent protrusions of the silicon wafer carrier is filled using the guide structure. The cleaning probe is driven by the driving component to move in a circular motion around the central axis of the silicon wafer carrier to clean the circumferential grooves of the silicon wafer carrier.

7. The method as described in claim 6, characterized in that, The method further includes: The radial groove intersects with the circumferential groove to be cleaned by a guide structure, wherein the positioning part fills the circumferential groove adjacent to the circumferential groove to be cleaned, and the filling part fills the radial groove that communicates with the circumferential groove to be cleaned.

8. The method as described in claim 7, characterized in that, When applied to the tray cleaning apparatus of claim 3, the method further includes: The second cleaning component is controlled to move closer to the silicon wafer carrier to be cleaned, so that the cleaning line comes into contact with the silicon wafer carrier. The second cleaning assembly is controlled to reciprocate so that the cleaning line falls into the radial groove of the silicon wafer carrier. The radial grooves of the silicon wafer carrier are cleaned using the cleaning line.

9. The method as described in claim 8, characterized in that, When applied to the tray cleaning apparatus of claim 4, the method further includes: The cleaning line is moved back and forth by the take-up and untake-down device to clean the radial groove.

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