A method and device for curing coatings with different thicknesses

Abstract

The present invention relates to the technical field of coating curing, and in particular to a method and device for curing coatings with differential thickness. The curing method comprises the steps of S1: inkjet printing on a substrate to form a continuous layer; S2: dividing the continuous layer into regions with differentiated curing speeds; and S3: an energy source acts on the continuous layer to cause the solute in the continuous layer to migrate from the fast-curing region to the slow-curing region. The curing device comprises: a curing heat source for providing thermal energy; a carrier plate for carrying an object to be cured, the carrier plate being arranged within the heating range of the curing heat source, and at least two curing regions with differentiated thermal conductivity being arranged on the carrier plate. The present invention can form a layer morphology with different thicknesses through the curing device itself, and the thickness varies uniformly.

Description

Technical Field

[0001] The present invention relates to the technical field of coating curing, and in particular to a curing method and device for coatings with different thicknesses. Technical Background

[0002] With the advancement of light-emitting diode (LED) light source technology, the application of LEDs as point light sources or multiple LED groups as line / surface light sources is becoming increasingly widespread. However, LEDs are single-point light sources. Due to the inevitable spacing between LED light sources in regular arrays or irregular random arrangements, it is difficult to ensure consistent luminous intensity across the entire line / surface. This has a negative impact on their application in the new energy sector.

[0003] Therefore, it's necessary to adjust the reflectivity at different locations on the substrate side of the LED light source, or add a light-blocking layer with regionally varying transmittance on the LED light-emitting side to achieve uniform light intensity. However, whether achieving uniform light intensity through a reflective layer or a light-blocking layer, the essence is to create a coating with varying reflectivity at different locations.

[0004] In the prior art, during the coating printing stage, the coating with different reflectivity is prepared by controlling the printing thickness of the coating in each area. Ordinary coating curing devices only involve curing the coating at high temperature and cannot achieve the preparation of a coating with different reflectivity during the curing step. Summary of the Invention

[0005] In order to solve the above technical problems, the inventors of this application analyzed the coating formation technology known in the prior art, found the causes of the technical problems, further optimized the coating curing method, designed and improved the curing device, and realized the preparation of coatings with different reflectivity through the curing step. The purpose of the present invention is to provide a method and device for curing coatings with different thicknesses.

[0006] The specific technical solution is described below:

[0007] A method for curing a coating with differential thickness, comprising:

[0008] S1: inkjet printing is performed on a substrate, where each ink droplet forms an ink dot with an overlapping area with adjacent ink dots to form a continuous layer;

[0009] S2: dividing the continuous layer into regions with different curing speeds;

[0010] S3: The energy source acts on the continuous layer to cause the solute in the continuous layer to migrate from the fast-curing area to the slow-curing area.

[0011] This technical solution achieves differences in solute concentration within the ink through differences in curing speed, and achieves solute migration during curing under the action of the concentration difference, thereby obtaining coatings of different thicknesses.

[0012] Preferably, the energy source is a heat source, and regions with different curing speeds are formed by distributing materials with different thermal conductivities.

[0013] In this technical solution, in the area with faster thermal conductivity, the ink solvent evaporates faster, and the concentration of its solute is relatively high, and it will migrate to the area with lower thermal conductivity.

[0014] Further preferably, the matrix solidification area is formed by arranging staggered materials with a thermal conductivity of 10~20 W / m•K on the carrier plate, which can be specifically stainless steel material; optionally, the surface of the staggered parts of the matrix solidification area is provided with a material with a thermal conductivity of 121~151 W / m•K to form the area with the fastest solidification speed, which can be specifically aluminum alloy material, and the grid formed by the staggered matrix solidification area is a hollow space, or is provided with a material with a thermal conductivity of less than 1 W / m•K, which can be specifically resin material, to form the area with the slowest solidification speed.

[0015] Preferably, the energy source is a light source, and regions with differentiated curing speeds are formed by distributing the irradiation areas of the irradiated light.

[0016] In this technical solution, in the area irradiated by the radiation light, under the action of the light, the ink solvent evaporates faster, the concentration of its solute is relatively high, and it will migrate to the area that is not irradiated or is less irradiated by the light.

[0017] Further preferably, the irradiation area of the radiant light is limited by a lampshade provided with a light adjustment hole.

[0018] Preferably, the method further comprises the step of introducing ink solvent vapor into the curing area.

[0019] This technical solution can be used in conjunction with any of the above-mentioned technical solutions, and can provide vapor of the ink solvent to ensure a consistent volatilization rate during the ink curing process, thereby reducing the occurrence of the "coffee ring" effect.

[0020] Further preferably, the ink solvent vapor is saturated vapor.

[0021] A device for curing coatings of different thicknesses, comprising:

[0022] A curing heat source for providing thermal energy;

[0023] The carrier plate is used to carry the object to be cured. The carrier plate is arranged within the heating range of the curing heat source. The carrier plate is provided with at least two curing areas with different thermal conductivity properties.

[0024] The curing method corresponding to this technical solution is: during curing, the solute in the ink of the layer gathers towards the material with lower thermal conductivity under the action of concentration difference, thereby forming a raised area on the layer, and the degree of the raised area is controlled by at least the difference in thermal conductivity between the materials, and is also controlled by at least one factor among the properties of the ink material and the curing temperature.

[0025] The principle of this technical solution is as follows: materials with high thermal conductivity can transfer more heat from the curing device to the corresponding ink layer faster. In the ink of this layer, the solvent evaporates faster and the solute concentration is higher than that in other areas. Driven by the solute concentration difference, the solute diffuses toward the area with lower concentration, thereby forming a single layer with different thickness (solute content). The position of the material with high thermal conductivity can be set according to actual needs to adjust the thickness distribution of the single layer.

[0026] Preferably, the carrier plate comprises a grid-like substrate arranged in a staggered manner, and the substrate itself constitutes one of the curing areas.

[0027] Further preferably, a high-energy curing portion is provided on the surface of the intersection of the substrate, and the high-energy curing portion constitutes a curing area with higher thermal conductivity than other parts of the carrier, and the high-energy curing portion helps to form a smooth arched surface morphology of the layer.

[0028] Further preferably, the substrate is provided with a low-energy curing portion at the grid formed by the interlacing, and the low-energy curing portion constitutes a curing area with lower thermal conductivity than other parts of the carrier.

[0029] The substrate is selected from stainless steel with a thermal conductivity of 10-20 W / m•K, the high-energy curing portion is selected from aluminum alloy with a thermal conductivity of 121-151 W / m•K, and the low-energy curing portion is a hollow area or filled with resin material.

[0030] Preferably, a plurality of negative pressure fixing through holes are provided at intervals on the bearing area of the carrier plate, and negative pressure suction is applied through the negative pressure fixing through holes to fix the object to be cured on the carrier plate.

[0031] Preferably, the curing device further comprises:

[0032] A curing lamp for providing irradiated light;

[0033] A lampshade, used to limit the area irradiated by light, the lampshade is arranged between the curing lamp and the carrier plate, and is provided with a light adjustment hole, the light adjustment hole opens the light irradiation path of the curing lamp;

[0034] The corresponding curing method of this technical solution is as follows: the substrate with the printed layer is placed under the curing lamp and its lampshade in the curing device, the lampshade partially blocks the light of the curing lamp, and by assigning different curing light intensities to different areas of the substrate, the migration of solutes in the ink during the curing process is achieved, thereby forming a single layer of varying thickness;

[0035] The principle of this technical solution is as follows: the layer illuminated by the curing light absorbs light energy more easily. The solvent in the ink of this layer evaporates faster, and the solute concentration is higher than that in other areas. Driven by the solute concentration difference, the solute diffuses toward the area with lower concentration, thereby forming a single layer of varying thickness (solute content). The position of the light can be set according to actual needs to adjust the thickness distribution of the single layer.

[0036] This technical solution offers greater flexibility in adjusting the pattern shape. Single layers of varying needs can be achieved simply by changing the area and shape of the lampshade through which the curing light passes.

[0037] Preferably, an adjustment mechanism for adjusting the vertical position of the lampshade is further included to assist in adjusting the lighting range.

[0038] Preferably, the curing device further comprises:

[0039] Ink solvent storage tank, used to store ink solvent;

[0040] The steam gas path is used to release the steam generated by the ink solvent storage tank after being heated to the curing area. The steam gas path is connected to the ink solvent storage tank through a flow regulating valve.

[0041] Further preferably, the ink solvent storage tank is spaced apart from the curing heat source, and the ink solvent storage tank is heated by an independent heat source.

[0042] Preferably, the steam path is provided with solvent vapor outlets, and the solvent vapor outlets are evenly and spaced apart on the upper surface of the steam path.

[0043] The curing method of this technical solution is: introducing vapor of an ink solvent with a stable concentration into the curing area, especially introducing vapor of an ink solvent with a saturated concentration into the curing area, so as to provide saturated vapor of the ink solvent to ensure a consistent volatilization rate during the ink curing process, thereby reducing the occurrence of the "coffee ring" effect. Here, the "coffee ring" effect refers to: after the liquid phase dries, the solid phase material therein will leave a stain, and the distribution of the stain is uneven, with more at the edge than in the middle, forming a ring-shaped spot phenomenon.

[0044] In summary, the technical solution of the present invention has the following main beneficial effects:

[0045] Compared with the prior art, the present invention can form a layer morphology with thickness differences through the curing device itself, and the thickness changes evenly.

[0046] In addition, the curing device provides a curing method with an adjustable lighting range, which provides greater flexibility in adjusting the pattern shape. By simply changing the area and shape of the curing light passing through the lampshade, single layers of various requirements can be achieved.

[0047] At the same time, the curing device introduces steam of ink solvent with stable concentration into the curing area to ensure a consistent volatilization rate during the ink curing process, thereby reducing the occurrence of the "coffee ring" effect.

[0048] Further or more detailed beneficial effects will be described in conjunction with specific examples in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 This is a schematic diagram of a curing method according to an embodiment of the present application;

[0050] Figure 2 This is a schematic diagram of the internal structure of the curing device described in Example 1;

[0051] Figure 3 This is a schematic diagram of the carrier structure of the curing device described in Example 1;

[0052] Figure 4 for Figure 2 A magnified view of the structure of area A;

[0053] Figure 5 This is a schematic diagram of the surface morphology of the solidification device described in Example 1 after solidification and solute migration;

[0054] Figure 6 Schematic diagram of the vertical cross-section morphology of the surface layer after solute migration;

[0055] Figure 7 This is a schematic structural diagram of the curing equipment described in Example 2;

[0056] Figure 8 This is a schematic structural diagram of the curing device described in Example 2 from another angle;

[0057] Figure 9 Schematic diagram of the distribution of the ink solvent storage tank, steam gas line and flow control valve in the curing equipment described in Example 3;

[0058] Figure 10 This is the morphology of the ink block after the ink solvent vapor with stable concentration is introduced;

[0059] Figure 11 Schematic diagram of the "coffee ring" morphology formed when the ink block is cured under normal atmosphere;

[0060] In the picture:

[0061] 3.1-Curing heat source, 3.2-Carrier plate, 3.21-High-energy curing section, 3.22-Low-energy curing section, 3.23-Negative pressure fixing through hole, 3.3-Curing lamp, 3.4-Lampshade, 3.41-Light adjustment hole, 3.5-Ink solvent storage tank, 3.6-Steam gas line, 3.61-Solvent vapor outlet, 3.7-Flow control valve, 3.8-Substrate. DETAILED DESCRIPTION

[0062] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0063] In the description of this application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0064] Unless otherwise expressly specified or limited, the terms "connect," "fixed," and "disposed" should be interpreted broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections, direct connections, indirect connections through an intermediary, or connections within two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0065] The core technical problems faced by the technical solutions of the embodiments of this application are derived from the inventor's in-depth understanding of the technical problems in the prior art.

[0066] Therefore, based on an in-depth understanding of the technical issues, how to achieve uniform surface luminescence in various scenarios, especially in the application scenarios of new energy, is a technical problem that the inventors urgently need to solve.

[0067] At the same time, expanding the scope of process applications for the preparation of different types of coatings is also a technical problem that the inventors are trying to solve simultaneously.

[0068] The embodiments are described in detail as follows:

[0069] Example 1:

[0070] Reference Figure 1 , Figure 1 This is a schematic diagram of the curing method of an embodiment of the present application. The curing method is:

[0071] S1: inkjet printing is performed on a substrate, where each ink droplet forms an ink dot with an overlapping area with adjacent ink dots to form a continuous layer;

[0072] S2: One of the curing areas is formed by arranging stainless steel materials in a staggered pattern vertically and horizontally on the carrier plate. An aluminum alloy area is arranged on the surface of the staggered stainless steel materials, and its curing speed is faster than that of the stainless steel area. The grid formed by the staggered stainless steel materials is a hollow space or a resin material is arranged, and its curing speed is slower than that of the stainless steel area.

[0073] S3: a curing heat source acts on the continuous layer to cause the solute in the continuous layer to migrate from the fast curing area to the slow curing area.

[0074] Reference Attachment Figures 2-4 The curing device for the differential thickness coating used in this embodiment includes a curing heat source 3.1 for providing heat energy and a carrier plate 3.2 for carrying a substrate 3.8, wherein the carrier plate 3.2 is disposed above the curing heat source 3.1;

[0075] Wherein, the curing heat source 3.1 is a heating coil;

[0076] The carrier plate 3.2 comprises a base material that is crisscrossed to form a grid structure. The base material is made of stainless steel with a thermal conductivity of 10-20 W / m•K.

[0077] In a preferred technical solution, a cross-shaped high-energy solidification portion 3.21 is provided on the intersecting surface of the substrate, and the high-energy solidification portion 3.21 is made of an aluminum alloy material with a thermal conductivity of 121-151 W / m•K;

[0078] In the preferred technical solution, a low-energy curing portion 3.22 is provided at the grid, and the low-energy curing portion 3.22 is a hollow area or filled with a high-temperature resistant resin material. In this embodiment, the low-energy curing portion 3.22 is a hollow area.

[0079] During curing, the substrate 3.8 printed with ink is fixed on the supporting area of the carrier plate 3.2 via a plurality of negative pressure fixing through holes 3.23 arranged at intervals.

[0080] During specific curing, the high-energy curing portion 3.21 material with high thermal conductivity and the carrier 3.2 are able to transfer heat faster and more to the corresponding layer. In the ink of this layer, the solvent evaporates faster, and the solute concentration is higher than in other areas. Driven by the solute concentration difference, the solute diffuses toward the area with lower concentration, namely the low-energy curing portion 3.22 of the grid of the carrier 3.2, thereby changing the morphology of the continuous layer into a single layer of varying thickness (solute content). After the continuous layers are printed on the substrate 3.8 and subjected to the above-mentioned curing method, the surface layer forms a surface with continuously varying reflectivity due to solute migration.

[0081] The surface morphology of the coating after curing is shown in the figure below: Figure 5 As shown, its vertical cross-sectional shape can be referred to Figure 6 , Figure 6 The surface layer after solute migration Figure 5 Schematic diagram of the vertical cross-section along the a or b direction, Figure 5 The wavy line in the middle represents the outline of the layer, and the portion pointed to by A is the area corresponding to the low-energy curing portion 3.22, as shown in FIG. Figure 6 As shown, the film thickness of the ink after curing is periodically gradual and there is no step difference. Therefore, the reflectivity of the entire substrate 3.8 is excessively smooth. The obtained substrate 3.8 with a reflective surface with a smooth reflectivity transition is usually used for Mini-LED backlight diffuser plates.

[0082] In this embodiment, the grid pattern on the carrier 3.2 can be adaptively adjusted (or the carrier 3.2 can be replaced) according to actual needs, such as a distribution structure composed of adjacent hexagons, or the center portion of the grid of the carrier 3.2 can be replaced with a material with a thermal conductivity much lower than that of the grid line material of the carrier 3.2, such as a high-temperature resistant resin material. The elimination of the high-energy curing portion 3.21 can also result in a different pattern distribution on the continuously varying reflectivity surface formed. It is understandable that by changing the material of the carrier 3.2 with different thermal conductivities, the material of the ink, or the curing temperature, the corresponding degree of cross-sectional arching - that is, Figure 5 The angle θ in the image will change accordingly, thereby obtaining substrates 3.8 with different reflectivities.

[0083] Example 2:

[0084] The curing method is:

[0085] S1: inkjet printing is performed on a substrate, where each ink droplet forms an ink dot with an overlapping area with adjacent ink dots to form a continuous layer;

[0086] S2: limiting the irradiation area of the radiant light by opening a light adjustment hole in the lampshade, thereby forming areas with differentiated curing speeds, wherein the curing speed in the irradiation area is faster than that in other areas;

[0087] S3: A radiation light source acts on the continuous layer to cause the solute in the continuous layer to migrate from the fast-curing area to the slow-curing area.

[0088] Reference Attachment Figure 7-Figure 8 The curing device for the differential thickness coating used in this embodiment is based on the technical solution of Example 1, and a light irradiation curing structure is added:

[0089] Within the curing device, an infrared curing lamp 3.3 is positioned above a carrier plate 3.2. A lampshade 3.4 is positioned between the curing lamp 3.3 and the carrier plate 3.2. A light adjustment hole 3.41 is defined in the lampshade 3.4, providing a light path for the curing lamp 3.3. The spacing between the lampshade 3.4 and the curing lamp 3.3, as well as the spacing between the lampshade 3.4 and the base plate 3.8, are adjustable to help adjust the illumination range.

[0090] The distance between the lampshade 3.4 and the base plate 3.8 can be adjusted by, for example:

[0091] A servo motor (or a linear motor) is provided on the outer shell of the curing equipment at a height position corresponding to the lampshade 3.4. The servo motor drives a slider through a screw rod. The slider is connected to the internal lampshade 3.4 to achieve stepless adjustment within a certain spacing range.

[0092] The adjustment method can also be:

[0093] The interior of the curing device is designed with multiple layers of slot structures of different heights. According to actual process requirements, the lampshade 3.4 is set on the slots of different heights to achieve different distances between the lampshade 3.4 and the base plate 3.8.

[0094] The substrate 3.8 coated with the layer is placed on the carrier 3.1 and under the curing lamp 3.3 for curing. The curing conditions may be: curing at 150°C for 15 minutes.

[0095] In this embodiment, the layer illuminated by curing lamp 3.3 absorbs the light energy more easily. The solvent in the ink of this layer evaporates more quickly, and the solute concentration is higher than in other areas. Driven by the solute concentration difference, the solute diffuses toward the area with lower concentration, thereby forming a single layer with varying thickness (solute content). The location of the illumination can be set according to actual needs, and the thickness distribution of the single layer can be adjusted. This technical solution offers greater flexibility in adjusting the pattern shape. Simply by changing the area and shape of the lampshade through which the curing light passes, a single layer of various requirements can be achieved. There is no need to adjust the differentially heated areas of carrier plate 3.2. The result is a substrate 3.8 with a reflective surface with a smooth reflectivity transition, which is typically used in new energy Mini-LED backlight diffuser panels.

[0096] This technical solution can expand the application field of the technical solution of Example 1, and is particularly suitable for situations where the pattern shape is unconventional and difficult to process.

[0097] Example 3:

[0098] The curing method is:

[0099] S1: inkjet printing is performed on a substrate, where each ink droplet forms an ink dot with an overlapping area with adjacent ink dots to form a continuous layer;

[0100] S2: limiting the irradiation area of the radiant light by opening a light adjustment hole in the lampshade, thereby forming areas with differentiated curing speeds, wherein the curing speed in the irradiation area is faster than that in other areas;

[0101] S3: A radiation light source acts on the continuous layer to cause the solute in the continuous layer to migrate from the fast-curing area to the slow-curing area, and saturated ink solvent vapor is introduced into the curing area during the curing process.

[0102] Reference Attachment Figures 7 to 9 The curing device for the differential thickness coating used in this embodiment is based on the technical solution of Example 2, and is additionally provided with a structure for introducing ink solvent vapor with a stable concentration into the curing area:

[0103] In addition to the curing heat source 3.1 and the carrier plate 3.2, the curing device is also equipped with an ink solvent storage tank 3.5, a steam gas line 3.6, and a flow control valve 3.7 arranged between the ink solvent storage tank 3.5 and the steam gas line 3.6;

[0104] The ink solvent storage tank 3.5 contains the same solvent as the ink on the substrate 3.8. The ink solvent storage tank 3.5 is separated from the bottom heating source 3.2 and is heated by an independent heat source for easy control. The upper surface of the steam path 3.6 is provided with a plurality of solvent vapor outlets 3.61 at intervals. The curing conditions can be: curing at 150°C for 15 minutes.

[0105] In this embodiment, saturated ink solvent vapor is introduced into the curing area through the solvent vapor outlet 3.61 to ensure a consistent volatilization rate during the ink curing process, thereby reducing the occurrence of the "coffee ring" effect.

[0106] The above-mentioned "coffee ring" effect means that after the liquid phase dries, the solid phase material inside it will leave a stain, and the distribution of the stain is uneven, with more stains on the edges than in the middle, forming a ring-shaped spot phenomenon.

[0107] In addition, the coating morphology of ink blocks printed by inkjet printing is used as an example to compare the effect of introducing ink solvent vapor with a stable concentration on the coating morphology of the ink blocks. Figure 10 and Figure 11 :

[0108] After the ink solvent vapor with stable concentration is introduced, the morphology of the ink block is shown in the attached figure. Figure 10 , as a comparison, Figure 11 This is a schematic diagram of the "coffee ring" morphology formed when the same ink is cured under normal atmosphere. Figures 10-11 All are laser height measurement maps. The length of each grid on the vertical axis is 0.0025 mm, and the length of each grid on the horizontal axis is the distance the probe moves every 500 milliseconds.

[0109] Depend on Figure 9 and Figure 10 The comparison shows that the solidified ink dots formed after the introduction of ink solvent vapor with a stable concentration have a more regular morphology, without forming coffee ring-shaped peripheral solute aggregation, and overcome the surface unevenness caused by wrinkle shrinkage. The upper surface is also relatively flat, and the light reflection effect is relatively stable.

[0110] In summary, the present invention can utilize the curing device itself in various ways to form a layer with varying thicknesses, with uniform thickness variations. Furthermore, the curing device can introduce ink solvent vapor at a stable concentration into the curing area, ensuring a consistent evaporation rate during the ink curing process, thereby reducing the occurrence of the "coffee ring" effect. This present invention is therefore highly valuable for industrial applications.

[0111] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

[0112] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form or substance. It should be pointed out that ordinary technicians in this technical field can make several improvements and supplements without departing from the method of the present invention. These improvements and supplements should also be regarded as the scope of protection of the present invention. Any equivalent changes, modifications and evolutions made by technicians familiar with this profession without departing from the spirit and scope of the present invention by using the technical content disclosed above are all equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the scope of the technical solution of the present invention.

[0113] The above examples are intended to illustrate the embodiments disclosed herein and are not to be construed as limiting the present invention. In addition, the various modifications listed herein and variations of the methods and compositions in the invention will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. Although the present invention has been specifically described in conjunction with various specific preferred embodiments of the present invention, it should be understood that the present invention should not be limited to these specific embodiments. In fact, various modifications apparent to those skilled in the art as described above to obtain the invention should be included within the scope of the present invention.

Claims

1. A method for curing a coating with a differential thickness, characterized in that: include: S1: inkjet printing is performed on a substrate, where each ink droplet forms an ink dot with an overlapping area with adjacent ink dots to form a continuous layer; S2: dividing the continuous layer into regions with different curing speeds; S3: an energy source acts on the continuous layer to cause the solute in the continuous layer to migrate from the fast-curing region to the slow-curing region; The energy source is a heat source, and regions with differentiated curing speeds are formed by distributing materials with differentiated thermal conductivities. A matrix curing region is formed by arranging staggered materials on a carrier. A high-energy curing portion is provided on the surface of the staggered portion, and the high-energy curing portion constitutes a curing region with higher thermal conductivity than other portions of the carrier. A low-energy curing portion is provided on the grid formed by the staggered portion, and the low-energy curing portion constitutes a curing region with lower thermal conductivity than other portions of the carrier. or, The energy source is a light source, and areas with differentiated curing speeds are formed by distributing the irradiation areas of the irradiation light. The irradiation areas of the irradiation light are limited by a lampshade provided with light adjustment holes.

2. The curing method according to claim 1, wherein: The thermal conductivity of the matrix solidification area is 10~20 W / m•K.

3. The curing method according to claim 2, wherein: The matrix solidification area is a hollow space formed by the grids formed by the interlacing, or is provided with a material with a thermal conductivity of less than 1 W / m·K, so as to constitute the area with the slowest solidification speed.

4. The curing method according to claim 3, wherein: The surface of the intersection of the substrate solidification areas is provided with a material with a thermal conductivity of 121-151 W / m·K, forming the area with the fastest solidification speed.

5. The curing method according to any one of claims 2 to 4, characterized in that: The method further includes the step of introducing ink solvent vapor into the curing zone.

6. The curing method according to claim 5, characterized in that: The ink solvent vapor is saturated vapor.

7. A device for curing coatings of different thicknesses, characterized in that: Includes: a curing heat source (3.1), for providing heat energy; A carrier plate (3.2) for carrying an object to be cured, the carrier plate (3.2) being arranged within the heating range of the curing heat source (3.1), and having at least two curing areas with different thermal conductivity properties; The carrier (3.2) includes a grid-shaped substrate arranged in an interlaced manner, and the substrate itself constitutes one of the curing areas. A high-energy curing portion (3.21) is provided on the surface of the interlaced portion of the substrate, and the high-energy curing portion (3.21) constitutes a curing area with a higher thermal conductivity than other parts on the carrier (3.2). The grid formed by the interlacing of the substrate is provided with a low-energy curing portion (3.22), and the low-energy curing portion (3.22) constitutes a curing area with a lower thermal conductivity than other parts on the carrier (3.2).

8. The curing device according to claim 7, characterized in that: A plurality of negative pressure fixing through holes (3.23) are arranged at intervals on the bearing area of the carrier plate (3.2).

9. The curing device according to claim 7, characterized in that: Also included are: Curing lamp (3.3), used to provide irradiated light; A lampshade (3.4) is used to limit the area irradiated by light, the lampshade (3.4) being arranged between the curing lamp (3.3) and the carrier plate (3.2), the lampshade (3.4) being provided with a light adjustment hole (3.41), the light adjustment hole (3.41) opening a light irradiation path of the curing lamp (3.3).

10. The curing device according to claim 9, characterized in that: It also includes an adjustment mechanism for adjusting the vertical position of the lampshade (3.4).

11. The curing device according to claim 7, characterized in that: Also included are: Ink solvent storage tank (3.5), used for storing ink solvent; The steam gas path (3.6) is used to release steam generated by the heated ink solvent storage tank (3.5) into the curing area. The steam gas path (3.6) is connected to the ink solvent storage tank (3.5) via a flow regulating valve (3.7).

12. The curing device according to claim 11, characterized in that: The ink solvent storage tank (3.5) is spaced apart from the curing heat source (3.1), and the ink solvent storage tank (3.5) is heated by an independent heat source.

13. The curing device according to claim 11, characterized in that: The steam gas path (3.6) is provided with solvent steam outlets (3.61), and the solvent steam outlets (3.61) are evenly and spaced apart on the upper surface of the steam gas path (3.6).

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