Electronic device including heat dissipation structure

Abstract

An electronic device according to various embodiments of the disclosure can include a housing, a non-conductive support member disposed inside the housing, the support member including a first area, a second area spaced apart from the first area, and a third area connecting the first area and the second area, a conductive pattern portion disposed above the first area of the support member, a heat dissipation member at least a portion of which is disposed to overlap the conductive pattern portion, and an antenna including a circuit board, a conductive portion, and a ground portion. The conductive portion of the antenna can be disposed above the second area, the heat dissipation member can be formed to extend from the first area to the third area, and the ground portion of the antenna can be formed to extend from the second area to the third area so as to be disposed in contact with at least a portion of the heat dissipation member.

Description

Technical Field

[0001] One or more embodiments of this disclosure generally relate to electronic devices including heat dissipation structures. Background Technology

[0002] Cutting-edge information and communication technologies and semiconductor technologies have accelerated the widespread use of various electronic devices. Electronic devices that enable communication while remaining portable are under development.

[0003] The term "electronic device" can refer to a device that performs specific functions according to its equipped programs, such as home appliances, electronic dispatchers, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop or laptop PCs, car navigation systems, etc. For example, an electronic device can output stored information as sound or images. Due to the high integration of electronic devices and the prevalence of high-speed, high-capacity wireless communication, electronic devices such as mobile communication terminals are equipped with a variety of functions. For example, electronic devices may come with various integrated functions, including entertainment functions (e.g., video games), multimedia functions (e.g., music / video playback), communication and security functions for mobile banking, and dispatch or e-wallet functions. Such electronic devices have become small enough for users to carry conveniently.

[0004] Due to the recent demand for high integration and performance in portable electronic devices (e.g., smartphones), as well as the need for more compact and thinner designs and the application of existing antenna-related technologies, excessive heat can be generated and heat density can increase in portable electronic devices. Therefore, various heat dissipation structures are needed to efficiently dissipate the heat generated by internal heat sources in electronic devices. Summary of the Invention

[0005] Technical issues

[0006] Typically, an electronic device may include a conductive patterned portion and a broadband antenna adjacent to a back panel. Because the conductive patterned portion and the broadband antenna have different stacking structures, they cannot be designed in a single manufacturing process. For example, the broadband antenna can be designed to have a relatively large thickness compared to the conductive patterned portion.

[0007] According to embodiments, printed circuit boards (PCBs) and various electronic components are disposed inside electronic devices. Some electrical components mounted on the PCBs generate electromagnetic waves and / or heat, which may cause malfunctions and performance degradation of the electronic devices. For example, when an electrical device that generates excessive heat (e.g., an application processor (AP)) is configured to overlap with a portion of a broadband antenna, the relatively high amount of heat may concentrate on the rear surface of the electronic device compared to the front surface, potentially degrading the performance of the electrical components.

[0008] According to certain embodiments of this disclosure, when a heat dissipation component applied to a conductive pattern portion comes into contact with a ground portion of a broadband antenna, heat generated by at least one electrical component disposed adjacent to the broadband antenna can be easily dissipated.

[0009] Technical solution

[0010] According to embodiments of this disclosure, an electronic device may include: a housing comprising a front panel and a rear panel; a non-conductive support member disposed in the housing adjacent to the rear panel, the support member comprising a first region, a second region spaced apart from the first region, and a third region connecting the first region and the second region; a conductive pattern portion disposed above the first region of the support member and configured to generate a magnetic field; a heat dissipation member configured to at least partially overlap the conductive pattern portion; and an antenna comprising a circuit board, a conductive portion disposed on one surface of the circuit board, and a ground portion disposed on another surface of the circuit board. The conductive portion of the antenna may be disposed above the second region. The heat dissipation member may extend from the first region to the third region, and the ground portion of the antenna may extend from the second region to the third region to contact at least a portion of the heat dissipation member.

[0011] According to embodiments of this disclosure, an electronic device may include: a housing comprising a plate; a support member disposed in the housing and including a first region, a second region spaced apart from the first region, and a third region connecting the first region and the second region; a conductive pattern portion disposed above the first region of the support member and configured to generate a magnetic field; an antenna disposed above the second region of the support member and including a circuit board and a patch-type conductive portion disposed on a surface of the circuit board; and a heat dissipation member including a first heat dissipation portion, a second heat dissipation portion, and a third heat dissipation portion, wherein the first heat dissipation portion is disposed below the conductive pattern portion, the second heat dissipation portion is disposed below the antenna, and the third heat dissipation portion connects the first heat dissipation portion and the second heat dissipation portion and is positioned along the third region.

[0012] Beneficial effects

[0013] According to certain embodiments of this disclosure, an electronic device including a heat dissipation structure may be provided.

[0014] According to certain embodiments of this disclosure, in an electronic device, a heat dissipation member applied to a conductive pattern portion can extend to a region adjacent to an electrical component, thereby facilitating the dissipation of heat generated from the electrical component.

[0015] According to certain embodiments of this disclosure, in an electronic device, since the heat dissipation component applied to the conductive pattern portion is configured to contact a portion of the broadband antenna, heat dissipation performance can be enhanced and the need for separate additional space for the heat dissipation component can be eliminated. Thus, the internal space of the electronic device is utilized more efficiently.

[0016] This disclosure is not limited to the foregoing embodiments, but various modifications or changes can be made to this disclosure without departing from its spirit and scope. Attached Figure Description

[0017] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a view illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0019] Figure 2 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure;

[0020] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure;

[0021] Figure 4 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure;

[0022] Figure 5 This is an exploded perspective view showing the arrangement relationship between the support frame, second support member (e.g., rear housing), and antenna structure of an electronic device according to one embodiment of various embodiments of the present disclosure;

[0023] Figure 6 This is a perspective view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear housing) according to one embodiment of various embodiments of the present disclosure;

[0024] Figure 7 This is a cross-sectional view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear housing) according to one embodiment of various embodiments of the present disclosure;

[0025] Figure 8This is a cross-sectional view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear housing) according to another embodiment of various embodiments of the present disclosure; and

[0026] Figure 9 This is a cross-sectional view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear shell) according to yet another embodiment of various embodiments of the present disclosure. Detailed Implementation

[0027] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0028] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0029] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to consume less power than the main processor 121 or be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0030] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0031] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0032] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0033] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0034] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of the force caused by a touch.

[0036] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0037] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0038] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0039] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0042] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0043] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0044] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0045] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0046] Antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductor or conductive pattern on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be further formed as part of antenna module 197.

[0047] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0048] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0049] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0050] The electronic device according to the various embodiments disclosed can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0051] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0052] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0054] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0055] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0056] Figure 2 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure. Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure.

[0057] Reference Figure 2 and Figure 3 According to an embodiment, the electronic device 101 may include a housing 310 having a front surface 310A, a rear surface 310B, and a side surface 310C surrounding the space between the front surface 310A and the rear surface 310B. According to another embodiment (not shown), the housing 310 may represent a structure forming... Figure 2 Front surface 310A and side surface 310C and Figure 3 The structure of a portion of the rear surface 310B. According to an embodiment, at least a portion of the front surface 310A may have a substantially transparent front panel 302 (e.g., a glass or polymer panel including various coatings). The rear surface 310B may be formed of a rear panel 311. The rear panel 311 may be made of, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. The side surface 310C may be formed of a side frame structure (or “side member”) 318, which is coupled to the front panel 302 and the rear panel 311 and comprises metal and / or polymer. According to an embodiment, the rear panel 311 and the side frame structure 318 may be integrally formed together and comprise the same material (e.g., glass, a metal such as aluminum, or ceramic).

[0058] In the illustrated embodiment, the front panel 302 may include two first edge regions 310D on its two long edges, which extend seamlessly and curvedly from the first surface 310A toward the rear panel 311. (See illustrated embodiment) Figure 3 In the embodiment, the rear panel 311 may include two second edge regions 310E on its two long edges, which extend seamlessly and curvedly from the rear surface 310B to the front panel. According to an embodiment, the front panel 302 (or the rear panel 311) may include only one first edge region 310D (or only one second edge region 310E). Alternatively, the first edge region 310D or the second edge region 310E may be partially excluded. According to an embodiment, in a side view of the electronic device 101, for sides without the first edge region 310D or the second edge region 310E, the side frame structure 318 may have a first thickness (or width), and for sides with the first edge region 310D or the second edge region 310E, the side frame structure 318 may have a second thickness less than the first thickness.

[0059] According to an embodiment, electronic device 101 may include at least one of the following: display 301; audio modules 303, 307, and 314 (e.g., Figure 1 The audio module 170); the sensor module (e.g., Figure 1 Sensor module 176; camera modules 305 and 312 (e.g., Figure 1 Camera module 180); Key input device 317 (e.g., Figure 1 Input module 150); and connector holes 308 and 309 (e.g., Figure 1 (Connection terminal 178). According to an embodiment, the electronic device 101 may exclude at least one of these components (e.g., connector hole 309) or may add other components.

[0060] According to an embodiment, the display 301 can be visually exposed through, for example, a large portion of the front panel 302. According to an embodiment, at least a portion of the display 301 can be exposed through the front panel 302, wherein the front panel 302 forms a front surface 310A and a first edge region 310D. According to an embodiment, the edges of the display 301 can be formed to be substantially identical in shape to the adjacent outer edges of the front panel 302. According to another embodiment (not shown), the spacing between the outer edges of the display 301 and the outer edges of the front panel 302 can be kept substantially uniform to maximize the exposed area of ​​the display 301.

[0061] According to an embodiment, the surface of the housing 310 (or the front panel 302) may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include a front surface 310A and a first edge region 310D.

[0062] According to another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display 301 (e.g., the front surface 310A or the first edge region 310D), and at least one or more of the audio module 314, sensor module (not shown), light-emitting device (not shown), and camera module 305 may be aligned with the recess or opening. According to another embodiment (not shown), at least one or more of the audio module 314, sensor module (not shown), camera module 305, fingerprint sensor (not shown), and light-emitting device (not shown) may be included on the rear surface of the screen display area of ​​the display 301. According to an embodiment (not shown), the display 301 may be configured to be coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digital converter for detecting a magnetic field type stylus. According to an embodiment, at least a portion of the key input device 317 may be disposed in the first edge region 310D and / or the second edge region 310E.

[0063] According to an embodiment, the first camera module 305 and / or sensor module in camera modules 305 and 312 can be disposed within the internal space of the electronic device 101 and exposed to the external environment through the transmissive area of ​​the display 301. According to an embodiment, the area of ​​the display 301 facing the first camera module 305, as part of the area displaying content, can be formed as a transmissive area with a specified transmittance. According to an embodiment, the transmissive area can have a transmittance in the range of about 5% to about 20%. The transmissive area may include an area overlapping with the effective area (e.g., viewing angle area) of the first camera module 305, through which light is incident on the image sensor to generate an image. For example, the transmissive area of ​​the display 301 may include an area having a lower pixel density and / or wiring density than the surrounding area. For example, the transmissive area may replace a recess or opening.

[0064] According to embodiments, audio modules 303, 307, and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314. The microphone hole 303 may contain a microphone to receive external sound. According to embodiments, multiple microphones may be present to detect the direction of sound. Speaker holes 307 and 314 may include an external speaker hole 307 and a telephone receiver hole 314. In some embodiments, speaker holes 307 and 314 and microphone hole 303 may be implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without speaker holes 307 and 314. Audio modules 303, 307, and 314 are not limited to the structures described above. Various design changes can be made depending on the structure of electronic device 101; for example, only some of these audio modules may be installed, or another audio module may be added.

[0065] According to an embodiment, the sensor module (not shown) can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. The sensor module (not shown) may include a first sensor module (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the front surface 310A of the housing 310, and / or a third sensor module (e.g., an HRM sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the rear surface 310B of the housing 310. In an embodiment (not shown), the fingerprint sensor may be disposed on both the rear surface 310B and the front surface 310A (e.g., the display 301) of the housing 310. The electronic device 101 may include a sensor module (not shown), such as at least one of a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor. The sensor module is not limited to the above-described structure. Depending on the structure of the electronic device 101, various design changes can be made. For example, only a portion of these sensor modules can be installed, or other different sensor modules can be added.

[0066] According to an embodiment, camera modules 305 and 312 may include a first camera module 305 disposed on the front surface 310A of the electronic device 101, and a rear camera module 312 disposed on the rear surface 310B, and / or a flash (not shown). Camera modules 305 and 312 may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 101. Camera modules 305 and 312 are not limited to the above-described structure. Depending on the structure of the electronic device 101, various design changes can be made; for example, only some of these camera modules may be installed, or additional camera modules may be added.

[0067] According to embodiments, electronic device 101 may include multiple camera modules (e.g., dual-camera or triple-camera) with different attributes (e.g., viewing angles) or functions. For example, multiple camera modules 305 and 312 may be configured to include lenses with different viewing angles, and electronic device 101 may control the viewing angles of camera modules 305 and 312 based on user selection. At least one of camera modules 305 and 312 may be, for example, a wide-angle camera, and at least another of the multiple camera modules may be a telephoto camera. Similarly, at least one of camera modules 305 and 312 may be, for example, a front camera, and at least another of the multiple camera modules may be a rear camera. Furthermore, camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, and an infrared (IR) camera (e.g., a time-of-flight (TOF) camera, a structured light camera). According to embodiments, an IR camera may be used as at least part of a sensor module. For example, a TOF camera may be used as at least part of a sensor module (not shown) for detecting the distance to an object.

[0068] According to an embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310. According to an embodiment, the electronic device 101 may exclude all or some of the aforementioned key input devices 317, and the excluded key input devices 317 may be implemented on the display 301 in other forms, such as as soft keys. According to an embodiment, the key input device may include a sensor module 316 disposed on the second surface 310B of the housing 310.

[0069] According to one embodiment, a light-emitting device (not shown) may be disposed, for example, on the front surface 310A of the housing 310. The light-emitting device (not shown) may provide information, for example, about the status of the electronic device 101, in the form of an optical signal or visual notification. According to another embodiment, the light-emitting device (not shown) may provide a light source that interacts with, for example, a front camera module 305. The light-emitting device (not shown) may include, for example, a light-emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0070] According to an embodiment, connector holes 308 and 309 may include, for example: a first connector hole 308 for receiving a connector (e.g., a Universal Serial Bus (USB) connector) that transmits power and / or data to or receives power and / or data from an external electronic device; and / or a second connector hole (e.g., a headphone jack) 309 for receiving a connector that transmits audio signals to or receives audio signals from an external electronic device.

[0071] According to an embodiment, a first camera module 305 of some sensor modules (not shown) and / or camera modules 305 and 312 may be configured to be exposed to the outside through at least a portion of the display 301. For example, camera module 305 may include a punch-hole camera disposed within a hole or recess formed in the rear surface of the display 301. According to an embodiment, a second camera module 312 may be disposed within a housing 310 such that a lens is exposed to a second surface 310B of the electronic device 101. For example, the second camera module 312 may be disposed on a printed circuit board (e.g., Figure 4 On the printed circuit board 340.

[0072] According to an embodiment, the first camera module 305 and / or sensor module may be configured to be exposed to the external environment from the internal space of the electronic device 101 to the front panel 302 of the display 301 through a transparent area. Furthermore, some sensor modules 304 may be configured to perform their functions while being located within the internal space of the electronic device, without being visually exposed through the front panel 302.

[0073] Figure 4 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0074] Reference Figure 4 According to an embodiment, electronic device 101 (e.g., Figures 1 to 3 The electronic device 101 may include: a support frame 370; a front panel 320 (e.g., Figure 2 Front panel 302); Display 330 (e.g., Figure 2The display 301); the printed circuit board 340 (e.g., PCB, flexible PCB (FPCB) or rigid-flex PCB (RFPCB)); the battery 350 (e.g., Figure 1 The battery 189); the second support member 360 (e.g., the rear housing); the antenna 390 (e.g., Figure 1 Antenna module 197); and rear panel 380 (e.g., Figure 2 The back panel 311). The support frame 370 of the electronic device 101 according to the embodiment may include a side frame structure 371 (e.g., the back panel 311). Figure 2 The side frame structure 318) and the first support member 372.

[0075] According to embodiments, electronic device 101 may exclude at least one of these components (e.g., the first support member 372 or the second support member 360), or may add other components. At least one of these components of electronic device 101 may be associated with... Figure 2 or Figure 3 At least one of the components of the electronic device 101 is the same as or similar to the components described below.

[0076] According to an embodiment, the first support member 372 may be disposed inside the electronic device 101 to be connected to or integrated with the side bezel structure 371. The first support member 372 may be made of, for example, a metallic and / or non-metallic material (e.g., a polymer). The display 330 may be bonded to one surface of the first support member 372, and the printed circuit board 340 may be bonded to the opposite surface of the first support member 372.

[0077] According to an embodiment, the processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, application processor, graphics processing device, image signal processor, sensor hub processor, or communication processor. According to an embodiment, the printed circuit board 340 may include a flexible printed circuit board type-radio cable (FRC). For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 372 and may be connected to an antenna module (e.g., Figure 1 Antenna module 197) and communication module (e.g., Figure 1 The communication module 190 is electrically connected.

[0078] According to embodiments, the memory may include, for example, volatile memory or non-volatile memory.

[0079] According to embodiments, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, and / or an audio interface. For example, the interface may electrically or physically connect electronic device 101 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0080] According to an embodiment, battery 350 may be a means for supplying power to at least one component of electronic device 101. Battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 350 may be disposed on a plane substantially the same as printed circuit board 340. Battery 350 may be integrally or detachably disposed within electronic device 101.

[0081] According to an embodiment, a second support member 360 (e.g., a rear cover) may be disposed between the printed circuit board 340 and the antenna 390. For example, the second support member 360 may include one surface connected to at least one of the printed circuit board 340 and the battery 350, and another surface connected to the antenna 390.

[0082] According to an embodiment, antenna 390 may be disposed between rear panel 380 and battery 350. Antenna 390 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 390 may communicate with, for example, an external device over short range, or may wirelessly transmit or receive power required for charging. According to an embodiment, the antenna structure may be formed by a portion or combination of side frame structure 371 or first support member 372.

[0083] According to an embodiment, the rear plate 380 may form the rear surface of the electronic device 101 (e.g., Figure 3 At least a portion of the second surface 310B.

[0084] Figure 5 This is an exploded perspective view showing the arrangement relationship between the support frame, second support member (e.g., rear housing), and antenna structure of an electronic device according to one embodiment of the various embodiments of the present disclosure.

[0085] Figure 6 This is a perspective view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear shell) according to one embodiment of various embodiments of the present disclosure.

[0086] Figure 7This is a cross-sectional view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear shell) according to one embodiment of various embodiments of the present disclosure.

[0087] According to an embodiment, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a housing (e.g., Figure 2 and Figure 3 The housing 310), circuit board (e.g., Figure 4 The printed circuit board 340, support member 360, and antenna structure 390 disposed in housing 310. According to an embodiment, housing 310 may include a front panel (e.g., Figure 4 Front panel 320), rear panel (e.g., Figure 4 The antenna structure 390 may include a rear panel 380 and a support frame 370. The antenna structure 390 may include a first antenna assembly 500 and a second antenna assembly 600 disposed adjacent to the first antenna assembly 500.

[0088] Figures 5 to 7 The construction of the housing support frame 370, circuit board 340, support member 360, and antenna structure 390 can be consistent with... Figure 4 The support frame 370, printed circuit board 340, second support member 360 and antenna structure 390 are constructed in an integral or partial manner.

[0089] According to an embodiment, at least a portion of the support frame 370 may form the side surface of the housing and may provide space for mounting electronic components such as battery 350 and circuit board 340.

[0090] According to an embodiment, the first antenna assembly 500 and the second antenna assembly 600 of the antenna structure 390 can be disposed on one surface of the support member 360. The support member 360 can be made of a non-conductive material and can include: a first region S1 in which the first antenna assembly 500 is positioned; and a second region S2 in which the second antenna assembly 600 is positioned, and the second region S2 is spaced apart from the first region S1. The support member 360 can also include a third region S3 located between the first region S1 and the second region S2 and connecting the first region S1 and the second region S2.

[0091] According to an embodiment, the first antenna assembly 500 of the antenna structure 390 may include a conductive pattern portion 510, a first elastic member 520, a shielding member 530, and a heat dissipation member 540. The first antenna assembly 500 may be designed to be disposed in a region (e.g., a first region S1) of a first surface 361 of the support member 360 facing a first direction (+Z axis direction) such that the radiation direction of the antenna faces the rear plate.

[0092] According to an embodiment, the conductive pattern portion 510 may include a conductive pattern 510b formed to generate a magnetic field, and a substrate member 510a disposed parallel to at least a portion of the front panel 320 and / or the rear panel 380. According to an embodiment, the substrate member 510a may include a film made of an insulating or dielectric material and provide an area thereon on which the conductive pattern 510b is disposed. For example, the conductive pattern portion 510 may be implemented as a flexible printed circuit board. As another example, the conductive pattern portion 510 may be implemented as a combination of a flexible printed circuit board and a multilayer circuit board.

[0093] According to an embodiment, if the substrate member 510a is a multilayer circuit board, a conductive pattern 510b may be formed on a suitable layer among the layers constituting the substrate member 510a, or multiple conductive patterns 510b may each be formed on a suitable layer among the layers constituting the substrate member 510a. As another example, at least one conductive pattern 510b may be formed by etching (e.g., wet etching or dry etching) a portion of a conductive layer formed on the substrate member 510a using conductive ink by printing, deposition, spraying, and / or electroplating.

[0094] According to one embodiment, at least one conductive pattern 510b can form a loop antenna, and can be arranged in a manner such that multiple loop antennas for communication are arranged on a flexible printed circuit board. According to another embodiment, at least one conductive pattern 510b can be an antenna made of a flexible printed circuit board, and can include at least one of NFC, MST, or a loop antenna for wireless communication. For example, an antenna made of a flexible printed circuit board can be a loop antenna for wireless charging.

[0095] According to an embodiment, at least one conductive pattern 510b may be a coil comprising multiple turns, substantially parallel to one surface of the front plate and / or rear plate. For example, the conductive wire forming at least one conductive pattern 510b may comprise multiple turns wound to form a closed loop shape (the closed loop shape being formed by a combination of circles, polygons, or curves and straight lines, etc.), and when the base member 510a is mounted in the housing 310, the conductive wire may be configured to be substantially parallel to the housing 310 or the plate (e.g., Figure 4 Rear panel 380).

[0096] According to an embodiment, the first elastic member 520 may be disposed in a first direction (+Z axis direction) of the conductive pattern portion 510. The first elastic member 520 may be a structure for buffering impacts applied to the conductive pattern portion 510 and may be implemented using an elastic material (e.g., sponge, foam, or rubber). For example, the sponge may include materials such as polyurethane (PU) or polyethylene (PE).

[0097] According to an embodiment, the shielding member 530 and the heat dissipation member 540 may be disposed on a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction) of the conductive pattern portion 510. For example, the shielding member 530 may be disposed on the conductive pattern portion 510, and the heat dissipation member 540 may be stacked on the shielding member 530. As another example, when viewed from above the first antenna assembly 500, at least a portion of the heat dissipation member 540 may be configured to overlap with the conductive pattern portion 510. The shielding member 530 may provide the function of shielding electromagnetic waves that may be generated by the conductive pattern portion 510. The heat dissipation member 540 may provide thermal conduction to transfer the heat generated by the conductive pattern portion 510 to the external environment of the electronic device.

[0098] According to an embodiment, the heat dissipation member 540 has a flexible structure and may include a first heat dissipation portion 541 configured to face the shielding member 530 and a second heat dissipation portion 542 extending to the second antenna assembly 600. The first heat dissipation portion 541 may be configured to contact a first region S1 of the support member 360, and the second heat dissipation portion 542 may be disposed along at least a portion of a third region S3 of the support member 360. According to an embodiment, the second heat dissipation portion 542 of the heat dissipation member 540 may include: a second-first heat dissipation portion 542a extending from one end of the first heat dissipation portion 541; and a second-second heat dissipation portion 542b extending from the second-first heat dissipation portion 542a and configured to contact at least a portion of the second antenna assembly 600. The second heat dissipation portion 542 may be made of the same material as the first heat dissipation portion 541.

[0099] According to an embodiment, at least a portion of the heat dissipation member 540 may be connected to the second antenna assembly 600 (e.g., in physical contact with the second antenna assembly 600) to extend the path through which heat generated by the conductive pattern portion 510 diffuses. For example, heat generated from the conductive pattern 510b of the conductive pattern portion 510 can be transferred to a large area in the electronic device via the first heat dissipation portion 541 and the second heat dissipation portion 542 of the heat dissipation member 540 for faster dissipation. The material of the heat dissipation member 540 may include at least one of, for example, highly thermally conductive materials (e.g., graphite, carbon nanotubes, naturally recycled materials, silicone, silicon, or copper foil). As another example, the material of the heat dissipation member 540 may be the same material as the ground portion 610b of the second antenna assembly 600 (e.g., copper).

[0100] According to an embodiment, the second antenna assembly 600 of the antenna structure 390 may include an antenna 610, a second elastic member 620, a covering layer 630, and an adhesive member 640. The second antenna assembly 600 may be designed to be disposed in a region (e.g., a second region S2) of a first surface 361 of the support member 360 facing a first direction (+Z axis direction) such that the radiation direction of the antenna faces the rear plate.

[0101] According to an embodiment, the antenna 610 of the second antenna assembly 600 may be an ultra-wideband (UWB) antenna. The antenna 610 may be a dual-patch antenna and, for example, may include: an antenna circuit board 610a; a conductive portion (e.g., patch type) disposed on one surface of the antenna circuit board 610a (e.g., a surface facing a first direction (+Z-axis direction); and a ground portion 601b disposed on the other surface of the antenna circuit board 610a (e.g., a surface facing a second direction (-Z-axis direction)).

[0102] According to an embodiment, the grounding portion 610b of the antenna 610 may be flexible and may include a first portion 611 positioned facing the cover layer 630 and a second portion 612 extending into the first antenna assembly 500. The first portion 611 may be positioned above a second region S2 of the support member 360, and the second portion 612 may be positioned along at least a portion of a third region S3 of the support member 360. According to an embodiment, the second portion 612 of the grounding portion 610b may include: a second-1 portion 612a extending from one end of the first portion 611; and a second-2 portion 612b extending from the second-1 portion 612a and positioned to contact at least a portion of the first antenna assembly 500 (e.g., a second-2 heat dissipation portion 542b). The second portion 612 may be made of the same material as the remainder of the grounding portion 610b. The material of the second portion 612 may be different from the material of the second heat dissipation portion 542.

[0103] According to an embodiment, at least a portion of the grounding portion 610b may be connected to the heat dissipation member 540 of the first antenna assembly 500 (e.g., in physical contact with the heat dissipation member 540) to extend the path through which heat diffuses generated by the conductive pattern portion 510. The second-second portion 612b of the grounding portion 610b and the second-second heat dissipation portion 542b of the heat dissipation member 540 may be configured to contact each other. For example, when viewed from above the third region S3 of the support member 360, the second-second portion 612b of the grounding portion 610b and the second-second heat dissipation portion 542b of the heat dissipation member 540 may be configured to overlap each other. As another example, the second-second portion 612b of the grounding portion 610b and the second-second heat dissipation portion 542b of the heat dissipation member 540 may be bonded together by a conductive adhesive 750 to maintain heat diffusion. The conductive adhesive 750 may include at least one material capable of heat diffusion. For example, the conductive adhesive 750 may be a thermally conductive adhesive or a metal double-sided tape. The grounding portion 610b may be designed as a copper plate.

[0104] According to the embodiment, the grounding portion 610b and the heat dissipation component 540 can be designed as a single piece. For example, the grounding portion 610b and the heat dissipation component 540 can be manufactured as a single copper plate and can be configured to span the first region S1, the third region S3 and the second region S2 of the support component 360 without separate contact portions.

[0105] In an electronic device, electrical components (e.g., APs) may be positioned in the second direction (-Z-axis direction) of the third region S3 of the support member 360. Therefore, the heat dissipation structure of the rear surface of the second antenna assembly 600 (e.g., a surface facing the second direction (-Z-axis direction)) may be weak. According to embodiments of this disclosure, heat generated by electrical components (e.g., APs) disposed adjacent to the second antenna assembly 600 can be transferred to the heat dissipation member 540 via the grounding portion 610b, and the heat transferred to the heat dissipation member 540 can diffuse and be rapidly discharged to the outside of the electronic device.

[0106] Table 1 below shows the temperature measurements before and after at least a portion of the heat dissipation component 540 extends to the vicinity of the antenna 610.

[0107] [Table 1]

[0108]

[0109] Prior to the application of embodiments of this disclosure, electrical components (e.g., APs) were disposed adjacent to the rear surface of an electronic device. Therefore, heat generated by the electrical components could raise the temperature of the rear surface. For example, it can be confirmed that the temperature of the rear surface of the electronic device is approximately 1.5 degrees Celsius higher than the temperature of the front surface. According to embodiments of this disclosure, when a heat dissipation member (e.g., graphite material) extends adjacent to the electrical components, heat generated in the electrical components can be rapidly dissipated through the heat dissipation member. Therefore, it can be confirmed that the temperature difference between the front and rear surfaces of the electronic device is substantially reduced by approximately 1.3 degrees Celsius compared to conventional techniques.

[0110] According to an embodiment, the second elastic member 620 may be disposed in a first direction (+Z axis direction) of the antenna 610. The second elastic member 620 may be a structure for absorbing impacts applied to the antenna 610 and may include an elastic material (e.g., sponge, foam, or rubber). For example, the sponge may be made of a material such as polyurethane (PU) or polyethylene (PE).

[0111] According to an embodiment, the cover layer 630 and the adhesive member 640 can be disposed on the antenna 610 in a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). For example, the cover layer 630 can be disposed on the antenna 610, and the adhesive member 640 can be stacked on the cover layer 630. The cover layer 630 can cover a surface of the antenna 610 facing the second direction (-Z-axis direction) and can protect the internal circuit layers of the antenna circuit board 610a even without additional bonding tabs. For example, the cover layer 630 can be a cover film and a cover resin layer stacked on one or both surfaces of the cover film. The cover resin layer can be a polyimide resin configured as an electrically insulating layer. The adhesive member 640 is flexible and can bond the second antenna assembly 600 and the support member 360. The adhesive member 640 can securely mount the second antenna assembly 600 to the second region S2 of the support member 360, and when implemented using an elastic material, can ensure the stability of the second antenna assembly 600.

[0112] Figure 8 This is a cross-sectional view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear shell) according to another embodiment of various embodiments of the present disclosure.

[0113] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a housing (e.g., Figure 2 and Figure 3 The housing 310) and the support member 360 and antenna structure disposed in the housing 310.

[0114] Figure 8The configuration of the support member 360 and antenna structure 390 in the housing can be consistent with... Figures 5 to 7 The configuration of the support member 360 and the antenna structure 500 or 600 is generally or partially the same.

[0115] According to various embodiments, the antenna structure may include a first antenna assembly 500 and a second antenna assembly 600 disposed adjacent to the first antenna assembly 500. The first antenna assembly 500 and the second antenna assembly 600 of the antenna structure 390 may be disposed on one surface of a support member 360. The support member 360 may be made of a non-conductive material and may include: a first region S1 in which the first antenna assembly 500 is positioned; and a second region S2 in which the second antenna assembly 600 is positioned, and the second region S2 is spaced apart from the first region S1. The support member 360 may also include a third region S3, which is positioned between the first region S1 and the second region S2 and connects the first region S1 and the second region S2.

[0116] According to various embodiments, the first antenna assembly 500 of the antenna structure 390 may include a conductive pattern portion 510, a first elastic member 520, a shielding member 530, and a heat dissipation member 550. The heat dissipation member 550, the shielding member 530, the conductive pattern portion 510, and the first elastic member 520 may be stacked sequentially about a surface of the support member 360 facing a first direction (+Z axis direction).

[0117] According to an embodiment, the conductive pattern portion 510 may include at least one conductive pattern, and the conductive pattern may include a loop antenna for wireless communication. The first elastic member 520 may be a structure for absorbing impacts applied to the conductive pattern portion 510, and may be made of an elastic material. The shielding member 530 may provide the function of shielding electromagnetic waves that may be generated by the conductive pattern portion 510.

[0118] According to an embodiment, the second antenna assembly 600 of the antenna structure 390 may include an antenna 610, a second elastic member 620, a covering layer 630, and an adhesive member 640. The adhesive member 640, the covering layer 630, the antenna 610, and the second elastic member 620 may be stacked sequentially about a surface of the support member 360 facing a first direction (+Z axis direction).

[0119] According to an embodiment, antenna 610 may be an ultra-wideband (UWB) antenna. The second elastic member 620 may be a structure for buffering impacts applied to antenna 610 and may be made of an elastic material. A cover layer 630 may cover a surface of antenna 610 facing a second direction (-Z-axis direction). An adhesive member 640 may have a flexible structure and adhesively bonds the second antenna assembly 600 and the support member 360.

[0120] According to an embodiment, the antenna 610 may include: an antenna circuit board 610a; a conductive portion (e.g., a patch type) disposed on one surface of the antenna circuit board 610a (e.g., a surface facing a first direction (+Z-axis direction); and a heat dissipation member 553 (e.g., a third heat dissipation portion 553) disposed on another surface of the antenna circuit board 610a (e.g., a surface facing a second direction (-Z-axis direction)). The heat dissipation member may also be the ground of the antenna 610.

[0121] According to an embodiment, the heat dissipation component 550 can be designed as a single component that, while serving as the antenna ground for the second antenna assembly 600, provides a structure for dissipating heat from the first antenna assembly 500. The heat dissipation component 550 may include: a first heat dissipation portion 551 located in a first region S1 of the support member 360; a third heat dissipation portion 553 located in a second region S2 of the support member 360; and a second heat dissipation portion 552 located in a third region S3 of the support member 360. Because the first antenna assembly 500 (excluding the heat dissipation component 550) is located in the first region S1 of the support member 360, and the second antenna assembly 600 (excluding the heat dissipation component 550) is located in the second region S2 of the support member 360, the first antenna assembly 500 (excluding the heat dissipation component 550) and the second antenna assembly 600 (excluding the heat dissipation component 550) can be spaced apart from each other. The heat dissipation component 550 can extend the heat dissipation path by connecting the first antenna assembly 500 and the second antenna assembly 600 to each other.

[0122] According to one embodiment, as heat generated by the conductive pattern portion 510 of the first antenna assembly 500 diffuses along the first heat dissipation portion 551, the second heat dissipation portion 552, and the third heat dissipation portion 553 of the heat dissipation member 550, the heat can reach the second antenna assembly 600, where relatively less heat is generated, thereby providing an enhanced heat transfer effect. According to another embodiment, heat generated by an electrical component (e.g., an application processor (AP)) disposed adjacent to the second antenna assembly 600 can be transferred to the third heat dissipation portion 553 and / or the second heat dissipation portion 552 of the heat dissipation member 550, and then diffuse to the first heat dissipation portion 551, thereby providing an enhanced heat transfer effect.

[0123] Figure 9 This is a cross-sectional view showing the arrangement relationship between a first antenna assembly and a second antenna assembly disposed on a second support member (e.g., a rear shell) according to another embodiment of various embodiments of the present disclosure.

[0124] According to various embodiments, electronic devices (e.g., Figures 1 to 4 The electronic device 101 may include a housing (e.g., Figure 2 and Figure 3 The housing 310) and the support member 360 and antenna structure disposed in the housing 310.

[0125] Figure 9 The configuration of the support members 360 and the antenna structure in the housing can be related to Figures 5 to 7 The configuration of the support member 360 and the antenna structure 500 or 600 is generally or partially the same.

[0126] According to various embodiments, the antenna structure 390 may include a first antenna assembly 500 and a second antenna assembly 600 disposed adjacent to the first antenna assembly 500. The first antenna assembly 500 and the second antenna assembly 600 of the antenna structure 390 may be disposed on one surface of the support member 360. The support member 360 may be made of a non-conductive material and may include: a first region S1 in which the first antenna assembly 500 is positioned; and a second region S2 in which the second antenna assembly 600 is positioned, and the second region S2 is spaced apart from the first region S1. The support member 360 may also include a third region S3 positioned between the first region S1 and the second region S2 and connecting the first region S1 and the second region S2. The third region S3 may have a structure in which at least one side of the support member 360 is open, and at least a portion of the heat dissipation member 550 may be disposed in the open structure. For example, the third region S3 may have an opening through which the heat dissipation member 550 passes through the interior of the support member 360. As another example, an open structure can have a portion of one side edge of the supporting member 360 open (e.g., a C-shaped structure).

[0127] According to an embodiment, the first antenna assembly 500 of the antenna structure 390 may include a conductive pattern portion 510, a first elastic member 520, a shielding member 530, and a heat dissipation member 550. The heat dissipation member 550, the shielding member 530, the conductive pattern portion 510, and the first elastic member 520 may be stacked sequentially about a first surface 361 of the support member 360 facing a first direction (+Z axis direction).

[0128] According to an embodiment, the conductive pattern portion 510 may include at least one conductive pattern, and the conductive pattern may include a loop antenna for wireless communication. The first elastic member 520 may be a structure for absorbing impacts applied to the conductive pattern portion 510, and may be made of an elastic material. The shielding member 530 may provide shielding against electromagnetic waves that may be generated by the conductive pattern portion 510.

[0129] According to an embodiment, the second antenna assembly 600 of the antenna structure 390 may include an antenna 610, a second elastic member 620, a covering layer 630, and an adhesive member 640. The adhesive member 640, the covering layer 630, the antenna 610, and the second elastic member 620 may be sequentially stacked about a first surface 361 of the support member 360 facing a first direction (+Z-axis direction). The electrical component 710 and the heat transfer component 720 may be positioned on a second surface 362 of the support member 360 facing a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). For example, the heat transfer component 720 and the electrical component 710 may be sequentially stacked about the second surface 362.

[0130] According to an embodiment, multiple electrical components may be disposed on a circuit board (e.g., disposed in the second direction (-Z axis direction)) located below the support member 360. Figure 4 The electrical components 710 are located on at least one side surface of the circuit board 340. Some of the multiple electrical components 710 are heat sources that generate heat, and may be, for example, at least one chip disposed on at least one side surface of the circuit board 340, and may include at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP), a communication processor (CP), a charger integrated circuit (IC), or a DC converter. In the illustrated embodiment, the electrical component 710 may be an AP or a PMIC.

[0131] According to an embodiment, the heat transfer member 720 may be made of a carbon fiber thermal interface material (TIM) capable of transferring heat generated by the electrical component 710. However, the heat transfer member 720 is not limited to carbon fiber TIM and may include various heat dissipation materials or components for transferring heat generated by the electrical component 710 to the exterior or cover of the electronic device. For example, the heat transfer member 720 may include at least one of a thermal interface material (TIM), a heat pipe, a vapor chamber, a heat sink, or a heat dissipation coating. As another example, the carbon fiber TIM may include at least one of a liquid phase thermal interface material (TIM) and / or a solid phase thermal interface material (TIM). According to an embodiment, multiple heat transfer members 720 may be configured. For example, if multiple electrical components 710 are configured, the heat transfer members 720(s) may be individually configured to contact the electrical components 710.

[0132] According to an embodiment, antenna 610 may be an ultra-wideband (UWB) antenna. The second elastic member 620 may be a structure for buffering impacts applied to antenna 610 and may be made of an elastic material. A cover layer 630 may cover a surface of antenna 610 facing a second direction (-Z-axis direction). An adhesive member 640 may be flexible and adhesively bonds the second antenna assembly 600 and the support member 360.

[0133] According to an embodiment, the antenna 610 may include: an antenna circuit board 610a; a conductive portion (e.g., a patch type) disposed on one surface of the antenna circuit board 610a (e.g., a surface facing a first direction (+Z-axis direction); and a heat dissipation member 550 (e.g., a third heat dissipation portion 553) disposed under another surface of the antenna circuit board 610a (e.g., a surface facing a second direction (-Z-axis direction)). The heat dissipation member 550 (e.g., the third heat dissipation portion 553) may be disposed on a second surface 362 of the support member 360 facing a second direction (-Z-axis direction) opposite to the first direction (+Z-axis direction). The heat dissipation member 550 may serve as a ground for the antenna 610.

[0134] According to one embodiment, the heat dissipation component 550 may be designed as a single component that provides a structure for dissipating heat from the first antenna assembly 500 while serving as an antenna ground for the second antenna assembly. The heat dissipation component 550 may include: a first heat dissipation portion 551 located in a first region S1 of the support member 360; a third heat dissipation portion 553 located in a second region S2 of the support member 360; and a second heat dissipation portion 552 located in a third region S3 of the support member 360. Because the first antenna assembly 500, excluding the heat dissipation component 550, is located in the first region S1 of the support member 360, and the second antenna assembly 600, excluding the heat dissipation component 550, is located in the second region S2 of the support member 360, the first antenna assembly 500 (excluding the heat dissipation component 550) and the second antenna assembly 600 (excluding the heat dissipation component 550) may be spaced apart from each other. The heat dissipation component 550 can extend the heat dissipation path by connecting the first antenna assembly 500 and the second antenna assembly 600 to each other.

[0135] According to an embodiment, a first heat dissipation portion 551 of the heat dissipation member 550 may be disposed between the shielding member 530 and the first surface 361 of the support member 360. A second heat dissipation portion 552 may extend from the first heat dissipation portion 551 and may be configured to pass through an open structure of the support member 360 and be formed to reach the second surface 362 of the support member 360. A third heat dissipation portion 553 of the heat dissipation member 540 may extend from the second heat dissipation portion 552 and may be disposed on the second surface 362 of the support member 360, thereby being configured to face (or contact) the electrical component 710 and / or the heat transfer member 720.

[0136] According to one embodiment, as heat generated by the conductive pattern portion 510 of the first antenna assembly 500 diffuses along the first heat dissipation portion 551, the second heat dissipation portion 552, and the third heat dissipation portion 553 of the heat dissipation member 550, the heat can reach the second antenna assembly 600, generating relatively less heat at the second antenna assembly 600, thereby providing an enhanced heat transfer effect. According to another embodiment, heat generated from the electrical component 710 disposed adjacent to the second surface 362 of the support member 360 can be transferred along the third heat dissipation portion 553 and the second heat dissipation portion 552 disposed on the second surface 362 of the support member 360, and then diffuse to the first heat dissipation portion 551, thereby providing an enhanced heat transfer effect. Because the heat dissipation member 550 is disposed adjacent to the electrical component 710, heat generated from the electrical component 710 can be rapidly diffused to the outside of the electronic device through the heat transfer member 720 and the heat dissipation member 550, thereby reducing the temperature of the area surrounding the electrical component 710.

[0137] According to various embodiments of this disclosure, electronic devices (e.g., Figures 1 to 4 101) may include: a housing (e.g., Figure 2 and Figure 3 The housing 310 includes a front panel (e.g., Figure 4 320) and rear plate (e.g., Figure 4 380); non-conductive support components (e.g., Figure 6 (360), the support member is disposed in the housing adjacent to the rear plate, the support member including a first region (e.g., Figure 6 S1), and a second region separated from the first region (e.g., Figure 6 S2), and a third region connecting the first and second regions (e.g., Figure 6 S3); conductive patterned portion (e.g., Figure 6 510), which is disposed above the first region of the support member and configured to generate a magnetic field; heat dissipation member (e.g., Figure 6 540), which is configured to at least partially overlap with the conductive pattern portion; and an antenna (e.g., Figure 6 610), which includes a circuit board (e.g., Figure 6 610a), a conductive portion disposed on one surface of the circuit board, and a grounding portion disposed on the other surface of the circuit board (e.g., Figure 6 (610b). The conductive portion of the antenna may be disposed in the second region. A heat dissipation component may extend from the first region to the third region, and the grounding portion of the antenna may extend from the second region to the third region to contact at least a portion of the heat dissipation component.

[0138] According to various embodiments, the heat dissipation component and the grounding portion can be formed integrally.

[0139] According to various embodiments, the electronic device may further include: a main circuit board (e.g., Figure 4 (340), the main circuit board is disposed in the housing, between the support member and the front panel; and the electrical component is disposed on the main circuit board and is configured to at least partially overlap with the second region of the support member.

[0140] According to various embodiments, the heat dissipation component and the grounding portion can provide a path through which heat generated from electrical components is diffused to the heat dissipation component via the grounding portion.

[0141] According to various embodiments, the conductive portion of the antenna can be patch-type and can realize an ultra-wideband (UWB) antenna.

[0142] According to various embodiments, the electronic device may also include a shielding member disposed between the conductive pattern portion and the heat dissipation member.

[0143] According to various embodiments, the heat dissipation member may be flexible and may include a first heat dissipation portion configured to face the shielding member (e.g., Figure 6 (541) and a second heat dissipation section extending to the antenna (e.g., Figure 6 (542). The second heat dissipation section may include: the 2-1 heat dissipation section (e.g., Figure 6 (542a), the second-1 heat dissipation portion extends from the end of the first heat dissipation portion and is at least partially spaced from the third region of the support member; and the second-2 heat dissipation portion (e.g., Figure 6 (542b) The second-2 heat dissipation portion extends from the second-1 heat dissipation portion and is formed to overlap with a region of the grounding portion.

[0144] According to various embodiments, the electronic device may also include a conductive adhesive disposed between a second-second heat dissipation portion of the heat dissipation member and a region of the grounding portion to bond the second-second heat dissipation portion and the region of the grounding portion and provide a heat transfer path.

[0145] According to various embodiments, the heat dissipation component may include at least one high thermal conductivity material, including graphite, carbon nanotubes, natural recycled materials, silicone, silicon, or copper foil.

[0146] According to various embodiments, the conductive pattern portion may include a conductive pattern configured to generate an electromagnetic field (e.g., Figure 5 510b), and a base member configured to be parallel to at least a portion of the front and / or rear plates (e.g., Figure 5 (510a).

[0147] According to various embodiments, the conductive pattern may be a wireless charging antenna, which includes a plurality of turns substantially parallel to a surface of the rear panel and / or the front panel.

[0148] According to various embodiments, the electronic device may also include a first elastic member (e.g., Figure 6 (520) The first elastic member is disposed between the rear plate and the conductive pattern portion to absorb the impact applied to the conductive pattern portion.

[0149] According to various embodiments, the electronic device may also include a second elastic member (e.g., Figure 6 (620) The second elastic member is disposed between the rear plate and the antenna to absorb the impact applied to the antenna.

[0150] According to various embodiments, the electronic device may further include: a main circuit board disposed within the housing, between the support member and the front panel; and an electrical component disposed on the main circuit board and configured to at least partially overlap with at least a portion of the antenna. A third region of the support member may include an open structure. At least a portion of the heat dissipation member may be configured to pass through the open structure.

[0151] According to various embodiments, a first heat dissipation portion of the heat dissipation member may be disposed in a first region on a surface of the support member facing a first direction, and a second heat dissipation portion of the heat dissipation member may be disposed in the second region on a surface of the support member facing a second direction opposite to the first direction, in a manner adjacent to the electrical component.

[0152] According to various embodiments of this disclosure, electronic devices (e.g., Figures 1 to 4 101) may include: a housing (e.g., Figure 2 and Figure 3 (310), the housing includes a plate; support members (e.g., Figure 6 (360), the support member is disposed in the housing and includes a first region, a second region spaced apart from the first region, and a third region connecting the first region and the second region; conductive pattern portion (e.g., Figure 6 (510), the conductive pattern portion is disposed above the first region of the support member and configured to generate an electromagnetic field; antenna (e.g., Figure 6(610), the antenna is disposed above the second region of the support member and includes a circuit board and a patch-type conductive portion disposed on one surface of the circuit board; and a heat dissipation member, which includes a first heat dissipation portion, a second heat dissipation portion and a third heat dissipation portion, wherein the first heat dissipation portion is disposed below the conductive pattern portion, the second heat dissipation portion is disposed below the antenna, and the third heat dissipation portion connects the first heat dissipation portion and the second heat dissipation portion and is positioned along the third region.

[0153] According to various embodiments, the second heat dissipation portion of the heat dissipation component can be configured as the ground surface of the antenna.

[0154] According to various embodiments, the third heat dissipation portion may include: a fourth heat dissipation portion (e.g., Figure 6 (542), the fourth heat dissipation part is made of the same material as the first heat dissipation part; and the fifth heat dissipation part (e.g., Figure 6 (612), the fifth heat dissipation part is made of the same material as the second heat dissipation part but different from the first heat dissipation part.

[0155] According to various embodiments, the electronic device may also include a conductive adhesive disposed between a fourth heat dissipation portion and a fifth heat dissipation portion of a heat dissipation member to bond the fourth heat dissipation portion and the fifth heat dissipation portion and provide a heat transfer path.

[0156] According to various embodiments, the electronic device may further include: a main circuit board disposed within a housing below a heat dissipation member; and an electrical component disposed on the main circuit board and configured to at least partially overlap with at least a portion of the antenna. Heat generated from the electrical component can be transferred to the first heat dissipation member through a second and a third heat dissipation member.

[0157] It will be apparent to those skilled in the art that electronic devices including the heat dissipation structures according to various embodiments of the present invention as described above are not limited to those shown in the above embodiments and figures, and various changes, modifications or alterations can be made thereto without departing from the scope of the present invention.

Claims

1.An electronic device comprising: a housing including a front plate and a rear plate; a non-conductive support member disposed in the housing adjacent to the rear plate, the support member including a first area, a second area spaced apart from the first area, and a third area connecting the first area and the second area; a conductive pattern portion disposed over the first area of the support member and configured to generate a magnetic field; a heat dissipation member disposed to at least partially overlap the conductive pattern portion; and an antenna including a circuit board, a conductive portion disposed on one surface of the circuit board, and a ground portion disposed on another surface of the circuit board, wherein the conductive portion of the antenna is disposed over the second area, and wherein the heat dissipation member extends from the first area to the third area, and the ground portion of the antenna extends from the second area to the third area to contact at least a portion of the heat dissipation member. 2.The electronic device of claim 1, wherein, The heat dissipation member and the ground portion are integrally formed. 3.The electronic device of claim 1, further comprising: a main circuit board disposed in the housing between the support member and the front plate; and an electrical component disposed on the main circuit board and disposed to at least partially overlap the second area of the support member. The heat dissipation member and the ground portion provide a path via which heat generated from the electrical component is diffused to the heat dissipation member through the ground portion. 4.The electronic device of claim 3, wherein, The conductive portion of the antenna is of a patch type and implements an ultra-wideband (UWB) antenna. 5.The electronic device of claim 2, wherein 6.The electronic device of claim 1, further comprising a shielding member disposed between the conductive pattern portion and the heat dissipation member. The heat dissipation member is flexible and includes a first heat dissipation portion disposed to face the shielding member and a second heat dissipation portion extending to the antenna, and 7.The electronic device of claim 6, wherein, wherein the second heat dissipation portion includes a 2-1 heat dissipation portion extending from an end of the first heat dissipation portion and at least partially spaced apart from the third area of the support member, and a 2-2 heat dissipation portion extending from the 2-1 heat dissipation portion and formed to overlap one area of the ground portion. 8.The electronic device of claim 7, further comprising a conductive adhesive disposed between the 2-2 heat dissipation portion of the heat dissipation member and the one area of the ground portion to bond the 2-2 heat dissipation portion and the one area of the ground portion and provide a heat transfer path. ​ 9.The electronic device of claim 7, wherein The heat dissipation member includes at least one high thermal conductive material, wherein the at least one high thermal conductive material includes at least one of graphite, carbon nanotube, natural regenerated material, silicone, silicon, and copper foil. 10.The electronic device of claim 1, wherein, The conductive pattern portion includes a conductive pattern configured to generate a magnetic field and a base member disposed parallel to at least a portion of the front plate and / or the rear plate. 11.The electronic device of claim 10, wherein The conductive pattern is an antenna for wireless charging including a plurality of turns substantially parallel to one surface of the rear plate and / or the front plate. 12.The electronic device of claim 1, further comprising a first elastic member disposed between the rear plate and the conductive pattern portion to absorb an impact applied to the conductive pattern portion. 13.The electronic device of claim 1, further comprising a second elastic member disposed between the rear plate and the antenna to absorb an impact applied to the antenna. 14.The electronic device of claim 1, further comprising: a main circuit board disposed in the housing between the support member and the front plate; and an electrical component disposed on the main circuit board and disposed to at least partially overlap at least a portion of the antenna, wherein the third area of the support member includes an open structure, and wherein at least a portion of the heat dissipation member is disposed to pass through the open structure. The heat dissipation member includes a first heat dissipation portion disposed on one surface of the support member facing a first direction in the first area and a second heat dissipation portion disposed on one surface of the support member facing a second direction opposite to the first direction in the second area adjacent to the electrical component. 15.The electronic device of claim 14, wherein, ​

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