Deep cavity welding equipment for semiconductor lasers

Abstract

This invention relates to deep cavity welding equipment for semiconductor lasers, comprising a conveying platform, a preheating module, a welding module, and a cooling module. The conveying platform includes a base, a support, and a conveying tray. A carrier is mounted on the conveying tray. Three lifting components are mounted on the upper end of the support. The preheating module, welding module, and cooling module are slidably mounted on the three lifting components, each corresponding to a carrier. Each of the preheating, welding, and cooling modules includes a cover plate, one end of which is slidably connected to a lifting component, allowing the cover plate to descend. The cover plate of the preheating module has a preheating component, the cover plate of the welding module has a heating component and a vacuuming component, and the cover plate of the cooling module has an air-cooling component. This equipment meets the multi-process requirements of laser welding, achieves automated welding, and effectively improves the welding efficiency of laser chips.

Description

Technical Field

[0001] This invention relates to the field of welding equipment technology, specifically to deep cavity welding equipment for semiconductor lasers. Background Technology

[0002] Currently, semiconductor lasers employing composite substrate deep cavity structures require further soldering after the surface mount technology (SMT) process to connect the laser chip to other components. Laser chips typically consist of multiple components made of different materials, including semiconductor materials, metal electrodes, and optical fibers. Reflow soldering technology allows for the reliable connection of these components under high temperature and controlled conditions. However, existing reflow soldering equipment for semiconductor lasers suffers from problems such as complex manual operation and low efficiency, and can only solder a single laser at a time, making it unsuitable for the automated packaging and soldering requirements of lasers.

[0003] Patent No. CN202121998817.4 discloses a hot-press reflow device for micro-pitch LED chip welding, including a reflow welding device body, an upper flexible conveyor belt control device, an upper flexible conveyor belt, an upper hot-press component, a lower flexible conveyor belt control device, a lower flexible conveyor belt, and a lower hot-press component; the upper and lower hot-press components are fixedly connected to the reflow welding device body; the upper and lower hot-press components are arranged opposite each other with a gap; the upper hot-press component is located above the upper flexible conveyor belt; the lower hot-press component is located below the lower flexible conveyor belt; the upper flexible conveyor belt control device is connected to the upper flexible conveyor belt and controls the upper flexible conveyor belt to rotate cyclically; the lower flexible conveyor belt control device is connected to the lower flexible conveyor belt and controls the lower flexible conveyor belt to rotate cyclically; the upper and lower flexible conveyor belts are arranged opposite each other with a gap; the upper and lower flexible conveyor belts together clamp the body to be welded during movement, allowing the body to move through the space between the upper and lower hot-press components. The application uses a conveyor belt to achieve automatic chip soldering, but the reflow soldering device is not suitable for vacuum soldering, which makes the solder layer susceptible to oxidation and contamination, affecting the soldering quality. In addition, the device does not have a matching preheating and cooling mechanism, resulting in a single function. Summary of the Invention

[0004] To address the aforementioned problems, this invention discloses a deep cavity welding device for semiconductor lasers, which solves the problems of low automation and limited functionality in existing semiconductor laser reflow soldering equipment.

[0005] The specific technical solution is as follows:

[0006] A deep cavity welding device for semiconductor lasers includes a conveying platform, a preheating module, a welding module, and a cooling module. The conveying platform includes a base, a support platform mounted on the base, and a conveyor disk rotatably mounted on the support platform. The conveyor disk has a ring-shaped structure and is driven to rotate by a rotary drive device mounted on the support platform. Several load seats for loading laser housings are evenly spaced along the circumference of the conveyor disk. Each load seat has a box-shaped structure, with a flip-top cover at the top opening. The flip-top cover is driven to flip by transmission components mounted at both ends of the load seat. A positioning component for positioning the laser housing is provided inside the load seat. A protrusion is provided on the upper end of the side wall of the load seat near the support platform. The top of the protrusion has two lower connectors, and a cooling channel is provided inside the load seat housing, with each end of the cooling channel connected to one of the two lower connectors. The support platform is connected to the other side wall. Three lifting components are arranged radially on the upper side wall of the support platform. The preheating module, welding module, and cooling module are slidably mounted on the three lifting components, and each of the three lifting modules corresponds to a carrier. Each of the three modules includes a cover plate adapted to the carrier. One end of the cover plate is provided with a lifting seat. The lifting seat is slidably connected to the lifting components, and the cover plate is driven to flip open by the transmission component after it is lowered. The cover plate of the preheating module is provided with a preheating component. The cover plate of the welding module is provided with a heating component and a vacuum component. The cover plate of the cooling module is provided with an air-cooling component and two upper connectors adapted to two lower connectors. The upper ends of the two upper connectors are connected to the coolant circulation component installed on the support platform through pipes.

[0007] Furthermore, the lifting assembly includes a lifting guide rail, a lifting drive motor, and a lifting screw. The lifting guide rail is longitudinally arranged on the side wall of the support, and the lifting seat is slidably arranged on the lifting guide rail. A through groove is opened from top to bottom in the middle of the lifting guide rail, and the lifting screw is longitudinally rotatably arranged in the through groove. The lifting screw is threadedly connected to the lifting seat, and the top end of the lifting screw is driven to rotate by the lifting drive motor installed on the top of the support.

[0008] Furthermore, the top of the protrusion is flush with the top of the carrier seat, the protrusion is provided with a protrusion, the side wall of the protrusion is set with a conical structure, a sealing ring is provided on the side wall of the protrusion, the top of the protrusion is provided with a lower mounting groove, the lower connector is installed in the lower mounting groove, the bottom of the lifting seat in the cooling module is provided with a groove that cooperates with the protrusion, and an upper mounting groove is provided on the groove, the upper connector is installed in the upper mounting groove.

[0009] Furthermore, both the preheating component and the heating component include several electric heating tubes installed on the inner wall of the cover plate. The vacuuming component includes an air extraction pipe connected to the top of the cover plate, and the other end of the air extraction pipe is connected to a vacuum extraction source. The air-cooling component includes several cooling fans installed on the top of the cover plate, and the cover plate of the cooling module has several mounting ports for installing the cooling fans. The coolant circulation component includes a storage tank and a circulation pump. The inlet and outlet of the circulation pump are respectively connected to the storage tank and one of the upper connectors through pipes. The upper end of the storage tank is connected to the other upper connector through a pipe.

[0010] Furthermore, the inner walls of adjacent ends of the upper and lower connectors are tapered. The bottom of the upper connector has a insertion groove that matches the size and shape of the upper end of the lower connector. Both the upper and lower connectors are equipped with a one-way valve assembly, which includes a compression spring and a sealing steel ball. The sealing steel ball is pressed against the tapered inner walls of the upper and lower connectors under the support of the compression spring. The bottom of the sealing steel ball of the upper connector has a guide rod longitudinally provided, and a guide sleeve is provided in the lower end of the upper connector. The guide sleeve is fitted onto the guide rod, and the side wall of the guide sleeve is connected to the inner wall of the lower end of the upper connector through a first connecting rod. The upper end of the lower connector has a support block for supporting the guide rod. The support block is connected to the inner wall of the upper end of the lower connector through a second connecting rod. When the upper and lower connectors are connected, the support block supports the guide rod and pushes the sealing steel ball in the upper connector to rise, so that the coolant in the upper connector flows into the lower connector and pushes the sealing steel ball in the lower connector to fall, thereby connecting the coolant circulation assembly with the cooling channel.

[0011] Furthermore, the positioning assembly includes a positioning seat, a slide rail, a positioning block, a displacement drive motor, and a displacement screw. The positioning seat is located at one end of the inner cavity of the carrier, and a positioning groove for accommodating the laser housing is provided on one side of the positioning seat. The slide rail is located at the other end of the inner cavity of the carrier, and the positioning block is slidably mounted on the slide rail. The displacement screw is horizontally threaded into the positioning block, and the middle part of the displacement screw is rotatably connected to the side wall of the carrier through a sealed bearing. The other end of the displacement screw is driven to rotate by a displacement drive motor mounted on a conveyor plate, so that the displacement drive motor drives the positioning block to move laterally on the slide rail through the displacement screw, thereby pressing and positioning the other end of the laser housing.

[0012] Furthermore, a sealing groove is provided at the top of the carrier, and a rubber sealing strip that matches the sealing groove is provided at the bottom of the cover plate.

[0013] Furthermore, there are two flip-top covers distributed left and right. The two ends of the two flip-top covers are connected to a transmission assembly installed in the inner wall of the carrier via pins. The inner walls at both ends of the carrier are provided with transmission grooves for installing the transmission assembly, and the pins are installed in the transmission grooves via sealed bearings. The transmission assembly includes a transmission gear set on the pin and a lifting rod meshing with the transmission gear. The lifting rod is arranged longitudinally, and tooth blocks that mesh with the transmission gear are arranged longitudinally on the side wall of the lifting rod. The bottom end of the lifting rod is elastically connected to the bottom end of the transmission groove via a return spring. The top end of the lifting rod extends upward through the transmission groove and into the sealing groove, so that the lifting rod descends after being pressed by the rubber sealing strip and drives the flip-top covers to flip downward by 90 degrees through the transmission gear.

[0014] Furthermore, the upper ends of the inner walls at both ends of the carrier are provided with limiting strips for limiting the top of the flip-top cover.

[0015] The beneficial effects of this invention are reflected in:

[0016] This invention uses a conveyor tray to move the carrier containing the laser to different processing positions in sequence. After the laser is positioned, it is preheated, reflow soldered and cooled in sequence. It can also perform different processing on multiple lasers at the same time, which meets the needs of multi-process laser welding, realizes automated welding and effectively improves the welding efficiency of laser chips.

[0017] The present invention has a flip-up sealing plate on the carrier, which can effectively prevent dust and impurities from contaminating the laser chip during transportation, and also avoid the problem of heat loss after preheating. Furthermore, when the cover plate is lowered, the lifting rod can be pressed to open it and allow for normal processing.

[0018] In this invention, each carrier seat is equipped with a cooling channel. The two ends of the cooling channel are connected to the upper connector in the cooling module through the lower connector, so that the cooling channel can be connected to the coolant circulation component, thereby realizing a high-efficiency water cooling function. Furthermore, the one-way valve assembly in the upper and lower connectors can effectively prevent coolant from overflowing when the cover plate is separated from the carrier seat, ensuring the stable operation of the cooling module. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention.

[0020] Figure 2 This is a side sectional view of the carrier in this invention.

[0021] Figure 3 This is a front sectional view of the carrier in this invention.

[0022] Figure 4 for Figure 1Enlarged diagram of point A in the middle.

[0023] Figure 5 for Figure 2 Enlarged diagram of point B in the middle.

[0024] Figure 6 This refers to the connection between the welding module and the carrier in this invention.

[0025] Figure 7 This is a schematic diagram of the structure between the cooling module and the carrier in this invention.

[0026] Figure 8 for Figure 7 Enlarged diagram of point C.

[0027] 1. Base; 2. Support; 3. Conveyor tray;

[0028] 4. Carrier seat, 401. Limiting strip, 41. Boss, 411. Lower connector, 42. Support block, 421. Second connecting rod, 422. Cooling channel, 43. Sealing groove, 44. Flip cover, 45. Pin, 451. Transmission groove, 46. Transmission gear, 461. Lifting rod, 462. Tooth block, 4621. Return spring, 463. Positioning seat, 47. Positioning groove, 471. Positioning block, 48. Slide rail, 481. Displacement drive motor, 49. Displacement screw, 491.

[0029] Preheating module 5, heating element 51;

[0030] Welding module 6, air extraction pipe 61, solenoid valve 62;

[0031] Cooling module 7, cooling fan 71, mounting port 711, liquid storage tank 72, circulation pump 73;

[0032] 8. Cover plate, 81. Rubber sealing strip, 82. Lifting seat, 821. Groove, 83. Upper connector, 831. Compression spring, 832. Sealing steel ball, 833. Guide rod, 834. Guide sleeve, 835. First connecting rod, 836. Insertion groove;

[0033] Lifting assembly 9, lifting guide rail 91, through groove 911, lifting drive motor 92, lifting screw 93;

[0034] Laser housing 10. Detailed Implementation

[0035] To make the technical solution of this invention clearer and more explicit, the invention will be further described below with reference to the accompanying drawings. Any solution derived by equivalent substitution and conventional reasoning of the technical features of this invention falls within the protection scope of this invention. The fixed connections and fixing settings mentioned in this invention are all common connection methods in the mechanical field, including welding, positioning bolt and nut connections, and screw connections.

[0036] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] like Figure 1-4 As shown, the deep cavity welding equipment for semiconductor lasers includes a conveying platform, a preheating module 5, a welding module 6, and a cooling module 7. The conveying platform includes a base 1, a support 2 set on the base 1, and a conveying disk 3 rotatably set on the support 2. The conveying disk 3 has a ring structure and is driven to rotate by a rotary drive device installed on the support 2. Four carrier seats 4 for loading laser housing 10 are provided at equal intervals along the circumference on the conveying disk 3. The carrier seats 4 have a box-shaped structure. A flip-top cover 45 is provided at the top opening of the carrier seat 4. The flip-top cover 45 is driven to flip by a transmission component installed at both ends of the carrier seat 4. A positioning component for positioning the laser housing 10 is provided inside the carrier seat 4. A protrusion 41 is provided on the upper end of the side wall of the carrier seat 4 near the support 2. Two lower connectors 42 are provided on the top of the protrusion 41. A cooling channel 43 is provided inside the housing of the carrier seat 4. The cooling channel 43 extends to the bottom of the housing of the carrier seat 4. The two ends of the cooling channel 43 are respectively connected to the two lower connectors 42.

[0038] Three lifting components 9 are arranged radially on the upper side wall of the support 2. A preheating module 5, a welding module 6, and a cooling module 7 are slidably mounted on the three lifting components 9, and each of the three lifting components 9 corresponds to a carrier seat 4. Each of the three lifting components 9 includes a cover plate 8 that is adapted to the carrier seat 4. A sealing groove 44 is opened at the top of the carrier seat 4, and a rubber sealing strip 81 adapted to the sealing groove 44 is provided at the bottom of the cover plate 8, so that the cover plate 8 and the carrier seat 4 are sealed together. One end of the cover plate 8 is provided with a lifting seat 82. The lifting seat 82 is slidably connected to the lifting component 9, so that after the cover plate 8 is lowered, it is driven by the transmission component to flip the cover 45 to open. The cover plate 8 of the preheating module 5 is provided with a preheating component. The cover plate 8 of the welding module 6 is provided with a heating component and a vacuum component. The cover plate 8 of the cooling module 7 is provided with an air-cooling component and two upper connectors 83 that are adapted to the two lower connectors 42. The upper ends of the two upper connectors 83 are connected to the coolant circulation component installed on the support 2 through pipes.

[0039] Both the preheating component and the heating component include several electric heating tubes 51 installed on the inner wall of the cover plate 8, which are used to heat the interior of the carrier 4.

[0040] like Figure 6 As shown, the vacuum assembly includes an air extraction pipe 61 connected to the top of the cover plate 8. The other end of the air extraction pipe 61 is connected to a vacuum pumping source on the support 2. The vacuum pumping source can be a vacuum pumping pump. The cover plate 8 is also equipped with a solenoid valve 62 for controlling the connection between the vacuum system inside the carrier 4 and the atmosphere.

[0041] like Figure 7 As shown, the air-cooled assembly includes several cooling fans 71 mounted on the top of the cover plate 8, and the cover plate 8 of the cooling module 7 has several mounting ports 711 for mounting the cooling fans 71. The coolant circulation assembly includes a storage tank 72 and a circulation pump 73. The inlet and outlet of the circulation pump 73 are respectively connected to the storage tank 72 and one of the upper connectors 83 through pipes. The upper end of the storage tank 72 is connected to another upper connector 83 through a pipe to form a circulation loop. A cooling fan is provided on the top of the storage tank 72 for cooling the coolant.

[0042] The lifting assembly 9 includes a lifting guide rail 91, a lifting drive motor 92, and a lifting screw 93. The lifting guide rail 91 is longitudinally arranged on the side wall of the support 2. A lifting seat 82 is slidably arranged on the lifting guide rail 91. A through groove 911 is opened from top to bottom in the middle of the lifting guide rail 91. The lifting screw 93 is longitudinally rotatably arranged in the through groove 911. The lifting screw 93 is threadedly connected to the lifting seat 82. The top of the lifting screw 93 is driven to rotate by the lifting drive motor 92 installed on the top of the support 2. The lifting drive motor 92 drives the screw to rotate, so that the lifting seat 82 drives the cover plate 8 to rise and fall, thereby realizing the closing and separation of the cover plate 8 and the carrier seat 4.

[0043] The top of the protrusion 41 is flush with the top of the carrier 4. The protrusion 41 is provided with a protrusion 411. The side wall of the protrusion 411 is set with a conical structure. A sealing ring is provided on the side wall of the protrusion 411. The top of the protrusion 411 is provided with a lower mounting groove. The lower connector 42 is installed in the lower mounting groove. The bottom of the lifting seat 82 in the cooling module 7 is provided with a groove 821 that cooperates with the protrusion 411. The groove 821 is provided with an upper mounting groove. The upper connector 83 is installed in the upper mounting groove.

[0044] like Figure 8As shown, the inner walls of adjacent ends of the upper connector 83 and the lower connector 42 are both tapered. The bottom of the upper connector 83 has a insertion groove 836 that matches the size and shape of the upper end of the lower connector 42. Both the upper connector 83 and the lower connector 42 are equipped with a one-way valve assembly, which includes a compression spring 831 and a sealing steel ball 832. The sealing steel ball 832, supported by the compression spring 831, presses against the tapered inner walls of the upper connector 83 and the lower connector 42. The bottom of the sealing steel ball 832 of the upper connector 83 has a longitudinally extending guide rod 833. A guide sleeve 834 is provided in the lower end of the upper connector 83, and the guide sleeve 834 is fitted onto the guide rod 833. The side wall of the guide sleeve 834 is connected to the inner wall of the lower end of the upper connector 83 via the first connecting rod 835. The upper end of the lower connector 42 is provided with a support block 421 for supporting the guide rod 833. The support block 421 is connected to the inner wall of the upper end of the lower connector 42 via the second connecting rod 422. When the upper connector 83 and the lower connector 42 are connected, the support block 421 supports the guide rod 833 and pushes the sealing steel ball 832 in the upper connector 83 to rise, so that the coolant in the upper connector 83 flows into the lower connector 42 and pushes the sealing steel ball 832 in the lower connector 42 to fall, thereby connecting the coolant circulation assembly with the cooling channel 43.

[0045] The positioning assembly includes a positioning seat 47, a slide rail 481, a positioning block 48, a displacement drive motor 49, and a displacement screw 491. The positioning seat 47 is located at one end of the inner cavity of the carrier 4. A positioning groove 471 for accommodating the laser housing 10 is provided on one side of the positioning seat 47. The slide rail 481 is located at the other end of the inner cavity of the carrier 4. The positioning block 48 is slidably mounted on the slide rail 481. The displacement screw 491 is horizontally threadedly connected to the positioning block 48. The middle part of the displacement screw 491 is rotatably connected to the side wall of the carrier 4 through a sealed bearing. The sealed bearing plays a sealing role. The other end of the displacement screw 491 is driven to rotate by the displacement drive motor 49 mounted on the conveyor plate 3. This causes the displacement drive motor 49 to drive the positioning block 48 to move laterally on the slide rail 481 through the displacement screw 491, thereby pressing and positioning the other end of the laser housing 10.

[0046] There are two flip-top covers 45, arranged left and right. The two ends of each flip-top cover 45 are connected to a transmission assembly installed in the inner wall of the carrier 4 via pins 451. Each end of the inner wall of the carrier 4 has a limiting strip 401 at its upper end to limit the top of the flip-top cover 45 in a horizontal position. Figure 5As shown, both ends of the carrier 4 have transmission grooves 46 for installing transmission components on their inner walls. The pin 451 is installed in the transmission groove 46 through a sealed bearing. The transmission component includes a transmission gear 461 set on the pin 451 and a lifting rod 462 meshing with the transmission gear 461. The lifting rod 462 is arranged longitudinally, and tooth blocks 4621 that mesh with the transmission gear 461 are arranged longitudinally on the side wall of the lifting rod 462. The bottom end of the lifting rod 462 is elastically connected to the bottom end of the transmission groove 46 through a return spring 463. The top end of the lifting rod 462 extends upward through the transmission groove 46 and into the sealing groove 44, so that the lifting rod 462 descends after being pressed by the rubber sealing strip 81 and drives the flip cover 45 to flip downward by 90 degrees through the transmission gear 461.

[0047] The working principle of this invention is as follows: During welding, the laser is first loaded into the carrier 4. Then, the positioning block 48 is driven by the displacement drive motor 49 to position the laser housing 10. Subsequently, the rotation drive device drives the rotating disk to rotate, causing the carrier 4 to rotate to the position below the cover plate 8 of the preheating module 5. After the cover plate 8 descends and closes with the carrier 4, the lifting rod 462 is pressed to open and flip the closed position. Then, the electric heating tube 51 is used for preheating. After preheating, the cover plate 8 is reset, and the rotating disk drives the carrier 4 to rotate to the position below the cover plate 8 of the welding module 6. Then, the cover plate 8 of the welding module 6 descends. First, the vacuum pump is used to evacuate the carrier 4 to a vacuum, and then the electric heating tube 51 is used for heating to perform reflow soldering, so that the laser chip and the circuit are welded together. After welding, the solenoid valve 62 is opened. The vacuum system is connected to the atmospheric environment. Then, the cover plate 8 is reset, and the rotating disk drives the carrier 4 to rotate to the area below the cover plate 8 of the cooling module 7. The cover plate 8 of the cooling module 7 moves down and closes with the carrier 4, so that the upper connector 83 and the lower connector 42 are connected. Then, the cooling fan 71 starts heat dissipation, and the circulation pump 73 drives the coolant to be delivered to the inside of the carrier 4 for coolant circulation, thereby cooling the carrier 4 and the laser. After the cooling process is completed, the cover plate 8 is reset, and the carrier 4 returns to the initial position under the drive of the rotating disk for unloading and reloading, and the process is repeated in this cycle.

[0048] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A deep cavity welding device for semiconductor lasers, characterized in that, The system includes a conveying platform, a preheating module (5), a welding module (6), and a cooling module (7). The conveying platform includes a base (1), a support (2) mounted on the base (1), and a conveying disk (3) rotatably mounted on the support (2). The conveying disk (3) has a ring-shaped structure and is driven to rotate by a rotary drive device mounted on the support (2). The conveying disk (3) has several circumferentially spaced carriers (4) for loading laser housings. The carriers (4) have a box-shaped structure. A flip-top cover (45) is provided at the top opening. The flip-top cover (45) is driven to flip by transmission components installed at both ends of the carrier (4). The carrier (4) is provided with a positioning component for positioning the laser housing. A protrusion (41) is provided on the upper end of the side wall of the carrier (4) near the support (2). Two lower connectors (42) are provided on the top of the protrusion (41). A cooling channel (43) is provided inside the housing of the carrier (4). The two ends of the cooling channel (43) are respectively connected to the two lower connectors (42). The support (2) is located on the upper end of the carrier (2). Three lifting components (9) are arranged radially on the end sidewall. The preheating module (5), welding module (6), and cooling module (7) are slidably mounted on the three lifting components (9). The preheating module (5), welding module (6), and cooling module (7) each correspond to a carrier (4). The preheating module (5), welding module (6), and cooling module (7) each include a cover plate (8) adapted to the carrier (4). One end of the cover plate (8) is provided with a lifting seat (82). The lifting seat (82) is connected to the lifting... The lowering component (9) is slidably connected and the cover plate (8) is lowered and then driven by the transmission component to flip the cover (45) open; the cover plate (8) of the preheating module (5) is provided with a preheating component, the cover plate (8) of the welding module (6) is provided with a heating component and a vacuum component, the cover plate (8) of the cooling module (7) is provided with an air cooling component and two upper connectors (83) adapted to the two lower connectors (42), and the upper ends of the two upper connectors (83) are connected to the coolant circulation component installed on the support (2) through pipelines.

2. The deep cavity welding equipment for semiconductor lasers according to claim 1, characterized in that, The lifting assembly (9) includes a lifting guide rail (91), a lifting drive motor (92), and a lifting screw (93). The lifting guide rail (91) is longitudinally arranged on the side wall of the support (2). The lifting seat (82) is slidably arranged on the lifting guide rail (91). A through groove (911) is opened from top to bottom in the middle of the lifting guide rail (91). The lifting screw (93) is longitudinally rotatably arranged in the through groove (911). The lifting screw (93) is threadedly connected to the lifting seat (82). The top end of the lifting screw (93) is driven to rotate by the lifting drive motor (92) installed on the top of the support (2).

3. The deep cavity welding equipment for semiconductor lasers according to claim 1, characterized in that, The top of the protrusion (41) is flush with the top of the carrier (4). The protrusion (41) is provided with a protrusion (411). The side wall of the protrusion (411) is set with a conical structure. A sealing ring is provided on the side wall of the protrusion (411). The top of the protrusion (411) is provided with a lower mounting groove. The lower connector (42) is installed in the lower mounting groove. The bottom of the lifting seat (82) in the cooling module (7) is provided with a groove (821) that cooperates with the protrusion (411). An upper mounting groove is provided on the groove (821). The upper connector (83) is installed in the upper mounting groove.

4. The deep cavity welding equipment for semiconductor lasers according to claim 1, characterized in that, The preheating component and the heating component both include several electric heating tubes (51) installed on the inner wall of the cover plate (8). The vacuuming component includes a suction pipe (61) connected to the top of the cover plate (8). The other end of the suction pipe (61) is connected to a vacuum pumping source. The air-cooling component includes several cooling fans (71) installed on the top of the cover plate (8). The cover plate (8) of the cooling module (7) has several mounting ports (711) for installing the cooling fans (71). The coolant circulation component includes a storage tank (72) and a circulation pump (73). The inlet and outlet of the circulation pump (73) are connected to the storage tank (72) and one of the upper connectors (83) through pipelines, respectively. The upper end of the storage tank (72) is connected to another upper connector (83) through a pipeline.

5. The deep cavity welding equipment for semiconductor lasers according to claim 4, characterized in that, The inner walls of adjacent ends of the upper connector (83) and the lower connector (42) are tapered. The bottom of the upper connector (83) is provided with a plug groove (836) that matches the size and shape of the upper end of the lower connector (42). Both the upper connector (83) and the lower connector (42) are provided with a one-way valve assembly. The one-way valve assembly includes a compression spring (831) and a sealing steel ball (832). The sealing steel ball (832) is supported by the compression spring (831) and presses against the tapered inner walls of the upper connector (83) and the lower connector (42). The bottom of the sealing steel ball (832) of the upper connector (83) is provided with a guide rod (833) longitudinally. The lower end of the upper connector (83) is provided with a guide sleeve (834) which is fitted onto the guide rod (833). The guide sleeve (834) sidewall is connected to the inner wall of the lower end of the upper connector (83) via the first connecting rod (835); the upper end of the lower connector (42) is provided with a support block (421) for supporting the guide rod (833). The support block (421) is connected to the inner wall of the upper end of the lower connector (42) via the second connecting rod (422). When the upper connector (83) and the lower connector (42) are connected, the support block (421) supports the guide rod (833) and pushes the sealing steel ball (832) in the upper connector (83) to rise, so that the coolant in the upper connector (83) flows into the lower connector (42) and pushes the sealing steel ball (832) in the lower connector (42) to fall, thereby realizing the connection between the coolant circulation component and the cooling channel (43).

6. The deep cavity welding equipment for semiconductor lasers according to claim 1, characterized in that, The positioning assembly includes a positioning seat (47), a slide rail (481), a positioning block (48), a displacement drive motor (49), and a displacement screw (491). The positioning seat (47) is located at one end of the inner cavity of the carrier (4). A positioning groove (471) for accommodating the laser housing is provided on one side of the positioning seat (47). The slide rail (481) is located at the other end of the inner cavity of the carrier (4). The positioning block (48) is slidably arranged on the slide rail (481). The displacement screw (491) is horizontally threaded in the positioning block (48). The middle part of the displacement screw (491) is rotatably connected to the side wall of the carrier (4) through a sealed bearing. The other end of the displacement screw (491) is driven to rotate by the displacement drive motor (49) installed on the conveyor plate (3). The displacement drive motor (49) drives the positioning block (48) to move laterally on the slide rail (481) through the displacement screw (491), thereby pressing and positioning the other end of the laser housing.

7. The deep cavity welding equipment for semiconductor lasers according to claim 1, characterized in that, The top of the carrier (4) has a sealing groove (44), and the bottom of the cover plate (8) has a rubber sealing strip (81) that matches the sealing groove (44).

8. The deep cavity welding equipment for semiconductor lasers according to claim 7, characterized in that, The number of flip-top covers (45) is two, arranged left and right. The two ends of the two flip-top covers (45) are connected to the transmission assembly installed in the inner wall of the carrier (4) by pins (451). The inner walls at both ends of the carrier (4) are provided with transmission grooves (46) for installing the transmission assembly, and the pins (451) are installed in the transmission grooves (46) by sealed bearings. The transmission assembly includes a transmission gear (461) and a lifting rod (462) set on the pins (451). The lifting rod (461) 2) The lifting rod (462) is arranged longitudinally on the side wall, and the tooth block (4621) meshes with the transmission gear (461). The bottom end of the lifting rod (462) is elastically connected to the bottom end of the transmission groove (46) through the return spring (463). The top end of the lifting rod (462) extends upward through the transmission groove (46) and into the sealing groove (44), so that the lifting rod (462) descends after being pressed by the rubber sealing strip (81) and drives the flip cover (45) to flip downward by 90 degrees through the transmission gear (461).

9. The deep cavity welding equipment for semiconductor lasers according to claim 8, characterized in that, The upper end of the inner wall of both ends of the carrier (4) is provided with a limiting strip (401) for limiting the top of the flip-top cover (45).

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