A special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting

Abstract

The application provides a special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting, which comprises a base and a clamping mechanism; the base comprises a groove and a support part located at the upper and lower ends of the base respectively, mounting holes for fixing and mounting the clamping mechanism are arranged on the groove and the support part, two valves are fixed on the groove wall, the two valves can be communicated with a gas circulation system or a liquid circulation system, and a groove sealing cover is installed at the opening of the groove; the clamping mechanism is detachably connected with the mounting holes on the groove or the support part to be installed on the base. The clamp can install the clamping mechanism on the groove with the groove upward or on the support part with the support part upward, and can also fill the required solution or gas into the groove or vacuumize the groove to meet the required processing environment requirements. The clamping mechanism can also be adjusted according to the size and shape of the workpiece.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor precision machining, and particularly relates to a special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting. BACKGROUND

[0002] With the gradual progress of global technology, the semiconductor industry scale in the global range basically maintains a sustained expansion trend, especially with the development of 5G, new energy vehicles and other markets, the demand scale of the third-generation semiconductor maintains a high-speed growth. With the gradual expansion of the semiconductor industry scale, the demand for semiconductor manufacturing is also growing, and higher requirements are put forward for the semiconductor manufacturing process.

[0003] Due to the advantages of laser processing such as fast processing speed, no direct contact, easy integration and the like, laser technology gradually penetrates into the field of semiconductor manufacturing, and contributes to the pursuit of a smaller and more precise micro world by the semiconductor industry. Laser processing is widely used in cutting, punching, welding, quenching, surface modification, cleaning and other industrial manufacturing processes. Ultrafast laser stealth cutting, as a precision machining process, has high requirements for auxiliary tools. Some special processing requirements need to be met in the semiconductor manufacturing process, such as vacuum processing, water cooling processing and composite processing in chemical solution. The clamp is an indispensable device in modern processing process. However, the existing clamp can only realize single processing environment, and cannot select different processing environments according to actual needs. Therefore, it is urgent to provide a special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting. SUMMARY

[0004] In view of the problem that the existing clamp can only realize single processing environment and cannot select different processing environments according to actual needs, the application provides a special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting. The clamping mechanism is installed in the groove body and the groove body is installed upward or installed in the support part and the support part is installed upward. The required solution, gas or vacuum can also be filled into the groove body to meet the required processing environment requirements.

[0005] The application achieves the above technical purpose through the following technical means.

[0006] A special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting, characterized in that it comprises a base and a clamping mechanism; the base comprises a groove body and a support part located at the upper and lower ends of the base respectively, and mounting holes for fixedly installing the clamping mechanism are arranged on the groove body and the support part; two valves are fixed on the groove wall of the groove body, and the two valves can communicate with a gas circulation system or a liquid circulation system; a groove sealing cover is installed at the opening of the groove body, and a glass plate is fixed in the middle of the groove sealing cover; the clamping mechanism is detachably connected with the mounting holes on the groove body or the support part to be installed on the base.

[0007] Further, the clamping mechanism is a left-right symmetrical structure, comprising a guide rail plate, clamping parts and clamping plates symmetrically arranged at left and right ends of the guide rail plate respectively, the guide rail plate is detachably connected to the mounting holes on the groove body or the support part to be fixedly installed on the base, at least one first guide rail is arranged on the guide rail plate, the clamping parts are slidably connected and installed on the first guide rail, at least one second guide rail perpendicular to the first guide rail is arranged on each of the clamping parts, the clamping plates are slidably connected and installed on the second guide rail, and two clamping plates are arranged on each of the clamping parts.

[0008] Further, the support part is in the shape of a "concave", and the support part is provided with a horizontal support plate at the position where the clamping mechanism is installed, and the mounting holes on the support part are arranged on the horizontal support plate.

[0009] Further, the two valves are arranged at the bottom and top of the two opposite groove walls of the groove body respectively and are used as an inlet valve and an outlet valve respectively.

[0010] Further, the temperature control device is arranged in the gas circulation system or the liquid circulation system, the temperature control system comprises a temperature sensor arranged on the pipeline outside the valve serving as the outlet of the groove body, and a temperature control device connected with the temperature sensor and used for controlling the temperature of the gas or liquid entering the groove body.

[0011] Further, the groove body sealing cover is detachably installed at the opening of the groove body through cooperation of the first bolt and the first nut.

[0012] Further, the groove body sealing cover is provided with a sealing ring at the part in contact with the opening of the groove body.

[0013] Further, the clamping part is slidably installed on the first guide rail through cooperation of the first sliding block bolt and the second nut, and the clamping plate is slidably installed on the second guide rail through cooperation of the second sliding block bolt and the third nut.

[0014] Further, the mounting holes on the groove body and the support part are threaded holes, and the clamping mechanism is detachably installed through cooperation of the second bolt and the mounting hole.

[0015] Further, the valve is connected with a vacuum pump, and the gas circulation system or the liquid circulation system comprises a gas storage tank or a liquid storage tank.

[0016] The beneficial effects of the present application are:

[0017] The base of this invention has a groove and a support at its upper and lower ends, respectively, both of which provide support for the clamping mechanism. The cavity formed by the groove and the sealing cover provides a sealed space for the clamping mechanism, which can be filled with water, a special solution, or an inert gas. On the one hand, it provides an inert environment for laser cutting, preventing oxidation of the workpiece cutting area; on the other hand, the liquid environment or flowing inert gas can accelerate heat dissipation at the cutting area. Furthermore, the liquid environment can achieve self-cleaning of the workpiece cutting area during the cutting process. Existing laser cutting fixtures do not have a sealed space and only rely on blowing inert gas into the cutting area to prevent oxidation, resulting in poor oxidation prevention. The fixture of this invention allows the clamping mechanism to be installed in the groove or the support, depending on the actual processing environment requirements. The groove can also be filled with the required solution or gas, or the groove can be evacuated to meet the required processing environment requirements. Additionally, a temperature control device can be used to control the temperature of the solution or gas filled into the groove, further satisfying the required processing environment requirements.

[0018] The clamping mechanism of the present invention has two degrees of freedom. The distance between the two clamping parts can be adjusted by the first slider bolt and the second nut. The position of the clamping plate on the clamping part can also be adjusted by the second slider bolt and the third nut to meet the size and shape of the actual workpiece. It is applicable to a variety of sizes and shapes. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the clamping mechanism described in this invention installed in the slot. Figure 1 .

[0020] Figure 2 For the present invention Figure 1 Sectional view of AA.

[0021] Figure 3 This is a front view of the clamping mechanism described in this invention.

[0022] Figure 4 For the present invention Figure 3 BB section view.

[0023] Figure 5 This is a schematic diagram of the clamping mechanism of the present invention installed on the bracket.

[0024] Figure 6 For the present invention Figure 5 CC section view.

[0025] Figure 7 This is a schematic diagram of the clamping mechanism described in this invention installed in the slot. Figure 2 .

[0026] Figure 8 For the present invention Figure 7Fig. 2 is a cross-sectional view of the base along the line D-D.

[0027] In the figure, 1. Base; 11. Groove body; 112. Valve; 113. Groove body sealing cover; 114. Glass plate; 12. Bracket part; 121. Horizontal support plate; 13. Mounting hole; 141. First bolt; 142. First nut; 15. Second bolt; 2. Clamping mechanism; 21. Guide rail plate; 211 First guide rail; 22. Clamping part; 221. Second guide rail; 23. Clamping plate; 241. First sliding block bolt; 242. Second nut; 251. Second sliding block bolt; 252. Third nut. DETAILED DESCRIPTION

[0028] The application will be further described below in conjunction with the drawings and specific embodiments, but the scope of protection of the application is not limited thereto.

[0029] The special adjustable clamp for third-generation semiconductor ultrafast laser stealth cutting comprises a base 1, a clamping mechanism 2, such as Figure 1 , Figure 2As shown, the upper and lower ends of the base 1 are respectively provided with a bracket part 12 and a groove body 11, the groove body 11 and the bracket part 12 are both provided with mounting holes 13 for fixed installation with the clamping mechanism 2, two valves 112 are fixed on the groove wall of the groove body 11, the two valves 112 are respectively arranged at the bottom and top of the two opposite groove walls of the groove body 11 and are respectively used as an inlet valve and an outlet valve, which is beneficial to the entry or discharge of gas with different densities, the two valves 112 can be communicated with a gas circulation system or a liquid circulation system, the gas circulation system or the liquid circulation system includes a gas storage tank or a liquid storage tank, the valve 112 can also be externally connected with a vacuum pump to meet the requirements of various working environments. A temperature control device is arranged in the gas circulation system or the liquid circulation system, the temperature control system includes a temperature sensor arranged on the pipeline outside the valve 112 serving as the outlet of the groove body 11, and a temperature control device connected with the temperature sensor and used for controlling the temperature of the gas or liquid entering the groove body 11, the temperature of the required solution or gas filled in the groove body can be controlled through the temperature control device, further meeting the requirements of the required processing environment. The groove body sealing cover 113 is detachably installed at the opening of the groove body 11 through the cooperation of the first bolt 141 and the first nut 142, the glass plate 114 is fixed in the middle of the groove body sealing cover 113, and the groove body sealing cover 113 is provided with a sealing ring at the opening contact part with the groove body 11, so as to realize the sealing of the opening contact part of the groove body sealing cover 113 with the groove body 11. The bracket part 12 is concave in shape, and the bracket part 12 is provided with a horizontal support plate 121 at the position where the clamping mechanism 2 is installed, and the mounting holes 13 on the bracket part 12 are arranged on the horizontal support plate 121, so that the clamping mechanism 2 can be installed on the horizontal support plate 121. The clamping mechanism 2 is detachably connected with the mounting holes 13 on the groove body 11 or the bracket part 12 to realize installation on the base 1, the mounting holes 13 on the groove body 11 and the bracket part 12 are threaded holes, the clamping mechanism 2 is detachably installed through the cooperation of the second bolt 15 and the mounting holes 13, and the working mode can be switched according to requirements.

[0030] As Figure 3 , Figure 4As shown, the clamping mechanism 2 is a left-right symmetrical structure, including a guide rail plate 21, clamping parts 22 and clamping plates 23 symmetrically arranged at the left and right ends of the guide rail plate 21. The guide rail plate 21 can be fixedly installed on the base 1 through detachable connection with the mounting hole 13 on the groove body 11 or the support part 12. The guide rail plate 21 is provided with at least one first guide rail 211. The clamping part 22 is slidably installed on the first guide rail 211, and specifically, the clamping part 22 is slidably arranged on the first guide rail 211 through cooperation of the first sliding block bolt 241 and the second nut 242, so as to adjust the distance between the two clamping parts 22. The two clamping parts 22 are each provided with at least one second guide rail 221 perpendicular to the first guide rail 211. The clamping plate 23 is slidably installed on the second guide rail 221, and specifically, the clamping plate 23 is slidably arranged on the second guide rail 221 through cooperation of the second sliding block bolt 251 and the third nut 252. Each clamping part 22 is provided with two clamping plates 23. The distance between the two clamping plates 23 on the same clamping part 22 can be adjusted by sliding the clamping plates 23 on the second guide rail 221. Therefore, the clamping mechanism has two degrees of freedom, and can be appropriately adjusted according to the size and shape of the workpiece, and can be suitable for various sizes and shapes.

[0031] When water or other solutions are needed as environmental medium conditions during the machining process, for example, Figures 1-2 As shown, the clamping mechanism 2 is installed on the groove body 11 and the groove body 11 is installed upward. At this time, the groove sealing cover 113 and the glass plate 114 can be disassembled according to the needs. Then the workpiece is clamped by the four clamping plates 23. The clamping mechanism can be appropriately adjusted according to the size and shape of the workpiece. The valve 112 at the bottom end of the groove body 11 is connected with a liquid storage tank storing the required solution. The solution is added into the groove body 11 to meet the required environmental conditions. Then the machining is carried out.

[0032] When water or other solutions are not needed as environmental medium conditions and no vacuum condition is needed during the machining process, for example, Figures 5-6 As shown, the clamping mechanism 2 is installed on the support part 12 and the support part 12 is installed upward. Then the workpiece is clamped by the four clamping plates 23. The clamping mechanism can be appropriately adjusted according to the size and shape of the workpiece. Then the machining is carried out.

[0033] When a vacuum environment is needed during the machining process, for example, Figures 7-8 As shown, the clamping mechanism 2 is installed on the groove body 11 and the groove body 11 is installed upward. Then the workpiece is clamped by the four clamping plates 23. The groove sealing cover 113 provided with the glass plate 114 is installed at the opening of the groove body 11 for sealing. The valve 112 is connected with a vacuum pump. The groove body 11 is vacuumized by the vacuum pump to meet the required vacuum environmental conditions. Then the machining is carried out.

[0034] When a specific gas environment is needed during processing, as shown in Figures 7-8 The clamping mechanism 2 is installed on the groove body 11 and the groove body 11 is installed upwardly, then the workpiece is clamped by four clamping plates 23, and then the groove sealing cover 113 with the glass plate 114 is installed on the opening of the groove body 11 to seal, one valve 112 is connected with a vacuum pump, and the other valve 112 is connected with a gas storage tank storing the required gas, the groove body 11 is first vacuumized by the vacuum pump, and then the required gas is filled into the groove body 11 by the gas storage tank to meet the required vacuum environment condition, and then processing is carried out; or one valve 112 is connected with a gas storage tank storing the required gas, and the other valve 112 is connected with a waste gas bottle, when the density of the required gas is greater than the density of air, the gas storage tank is connected with the valve 112 on the groove wall at the bottom end of the groove body 11, when the density of the required gas is less than the density of air, the gas storage tank is connected with the valve 112 on the groove wall at the top end of the groove body 11, the required gas is directly filled into the groove body 11 by the gas storage tank, and the original air in the groove body 11 is discharged into the waste gas bottle, so as to meet the required vacuum environment condition, and then processing is carried out.

[0035] The embodiments are preferred embodiments of the present application, but the present application is not limited to the above embodiments, and any obvious improvement, replacement or modification made by those skilled in the art without departing from the essential content of the present application shall fall within the protection scope of the present application.

Claims

1. A dedicated adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors, characterized in that, The system includes a base (1) and a clamping mechanism (2). The base (1) includes a groove (11) and a support (12) located at the upper and lower ends of the base (1). The groove (11) and the support (12) are provided with mounting holes (13) for fixed installation with the clamping mechanism (2). Two valves (112) are fixed on the groove wall of the groove (11). The valves can be connected to a vacuum pump or to a gas circulation system or a liquid circulation system. The gas circulation system includes a gas storage tank, and the liquid circulation system includes a liquid storage tank. A groove sealing cover (113) is installed at the opening of the groove (11), and a glass plate (114) is fixed in the middle of the groove sealing cover (113). The clamping mechanism (2) is installed on the base (1) by being detachably connected to the mounting holes (13) on the groove (11) or the support (12). The two valves (112) are respectively located at the bottom and top of the two opposite tank walls of the tank body (11), and are used as inlet valves and outlet valves respectively; The gas circulation system or liquid circulation system is equipped with a temperature control device, which includes a temperature sensor installed on the pipe outside the valve (112) of the tank (11) as the outlet, and a temperature control device connected to the temperature sensor and used to control the temperature of the gas or liquid entering the tank (11). When water or solution is required as an environmental medium during the processing, the clamping mechanism (2) is installed on the tank (11) with the tank (11) facing upwards. The valve (112) at the bottom of the tank (11) is connected to a storage tank containing the required water or solution, and the required water or solution is added into the tank (11). When a vacuum environment is required during processing, the clamping mechanism (2) is installed on the tank (11) with the tank (11) facing upwards, and the tank sealing cover (113) containing the glass plate (114) is installed at the opening of the tank (11) for sealing. The valve (112) is connected to an external vacuum pump. When a specific gas environment is required during the processing, the clamping mechanism (2) is installed on the tank (11) with the tank (11) facing upwards. The tank sealing cover (113) containing the glass plate (114) is installed at the opening of the tank (11) for sealing. One valve (112) is connected to a vacuum pump, and the other valve (112) is connected to a gas storage tank containing the required gas. Alternatively, one valve (112) is connected to a gas storage tank containing the required gas, and the other valve (112) is connected to a waste gas cylinder. When water or solution is not required as an environmental medium and vacuum conditions are not required during the processing, the clamping mechanism (2) is installed on the bracket (12) with the bracket (12) facing upwards.

2. The specialized adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors according to claim 1, characterized in that, The clamping mechanism (2) is a left-right symmetrical structure, including a guide rail plate (21), clamping parts (22) and clamping plates (23) symmetrically arranged at the left and right ends of the guide rail plate (21). The guide rail plate (21) is detachably connected to the mounting holes (13) on the groove (11) or the bracket part (12) to be installed on the base (1). At least one first guide rail (211) is provided on the guide rail plate (21). The clamping parts (22) are slidably connected to the first guide rail (211). At least one second guide rail (221) perpendicular to the first guide rail (211) is provided on each of the two clamping parts (22). The clamping plates (23) are slidably connected to the second guide rail (221), and each clamping part (22) is provided with two clamping plates (23).

3. The specialized adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors according to claim 1, characterized in that, The bracket part (12) is concave in shape. A horizontal support plate (121) is provided at the mounting clamping mechanism (2) of the bracket part (12). The mounting hole (13) on the bracket part (12) is provided on the horizontal support plate (121).

4. The specialized adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors according to claim 1, characterized in that, The trough sealing cover (113) is detachably installed at the opening of the trough (11) by means of a first bolt (141) and a first nut (142).

5. The dedicated adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors according to claim 1, characterized in that, A sealing ring is provided at the contact part between the sealing cover (113) of the groove and the opening of the groove (11).

6. The dedicated adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors according to claim 2, characterized in that, The clamping part (22) is slidably mounted on the first guide rail (211) by the cooperation of the first slider bolt (241) and the second nut (242); the clamping plate (23) is slidably mounted on the second guide rail (221) by the cooperation of the second slider bolt (251) and the third nut (252).

7. The dedicated adjustable fixture for ultrafast laser stealth cutting of third-generation semiconductors according to claim 1 or 2, characterized in that, The mounting holes (13) on the groove (11) and the bracket (12) are threaded holes. The clamping mechanism (2) can be detached and installed by cooperating with the mounting holes (13) through the second bolt (15).

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