A silicon wafer coding method, device, system and storage medium

Abstract

The application discloses a silicon wafer coding method, device, system and storage medium. The method comprises the following steps: when a first object table of a coding machine is detected to have a silicon wafer to be coded, the coding position requirement of the silicon wafer is acquired; according to the coding position requirement of the silicon wafer, the coding position standard of the silicon wafer is determined, wherein the position standard at least defines a value interval corresponding to one of the following preset indexes: the distance between the upper left side of the coding area and the center axis of the silicon wafer, the distance between the lower left side of the coding area and the center axis of the silicon wafer, the distance between the bottom side of the coding area and the edge of the silicon wafer, and the distance between the bottom side of the coding area and the upper edge of the surface width; the coding area position in the silicon wafer to be coded is determined according to the position standard; and the silicon wafer to be coded is subjected to a coding operation according to the coding area position in the silicon wafer to be coded. By adopting the scheme, the coding area position can be automatically determined, and the coding efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a silicon wafer coding method, device, system and storage medium. BACKGROUND

[0002] In recent years, with the rapid development of terminal application fields such as 5G communication, automobile electronics and smart grid, the development of the silicon wafer industry has been greatly promoted. In the production process of silicon wafers, the silicon wafers need to be coded, that is, the laser beam is shot to the surface of the silicon wafer by a wafer laser coding device to melt and evaporate the silicon, so as to form a number composed of numbers, English letters, symbols or bar codes, so as to facilitate the identification or tracking of the silicon wafer. The position of the coding area is given by the SEMI (Semiconductor Equipment and Materials International, International Semiconductor Equipment and Materials Industry Association) standard, which gives the standard of the influencing factors of the position of the coding area. In the prior art, the position of the coding area needs to be calculated manually or adjusted according to the production experience to meet the coding position requirements and the provisions of the SEMI standard. When the coding position requirements change, the position of the coding area needs to be calculated manually again, and the coding efficiency is low.

[0003] Therefore, how to provide a silicon wafer coding method to improve the coding efficiency of the silicon wafer has become a technical problem to be solved. SUMMARY

[0004] The present application provides a silicon wafer coding method, device, system and storage medium to improve the coding efficiency of the silicon wafer.

[0005] The present application provides a silicon wafer coding method, comprising:

[0006] When a silicon wafer to be coded is detected on a first stage of a coding machine, the coding position requirement of the silicon wafer is obtained;

[0007] According to the coding position requirement of the silicon wafer, the coding position standard of the silicon wafer is determined, wherein the position standard at least specifies a value interval corresponding to one of the preset indexes of the distance between the upper left side of the coding area and the center axis of the silicon wafer, the distance between the lower left side of the coding area and the center axis of the silicon wafer, the distance between the bottom side of the coding area and the edge of the silicon wafer, and the distance between the bottom side of the coding area and the upper edge of the face width;

[0008] According to the position standard, the coding area position in the silicon wafer to be coded is determined;

[0009] According to the coding area position in the silicon wafer to be coded, the silicon wafer to be coded is coded.

[0010] The beneficial effects of the present application are that when the first carrier of the code printing machine is detected to have a silicon wafer to be printed, the code printing position requirement of the silicon wafer is obtained, and the code printing position standard of the silicon wafer is determined according to the code printing position requirement of the silicon wafer, wherein the position standard at least defines a value interval corresponding to one of the preset indexes of the distance between the upper left side of the code printing area and the center axis of the silicon wafer, the distance between the lower left side of the code printing area and the center axis of the silicon wafer, the distance between the bottom side of the code printing area and the edge of the silicon wafer, and the distance between the bottom side of the code printing area and the upper edge of the face width; then the position of the code printing area in the silicon wafer to be printed is determined according to the position standard, so that the code printing machine can determine the position of the code printing area through the preset index, and then code printing operation is performed on the silicon wafer to be printed according to the position of the code printing area in the silicon wafer to be printed. Since the present scheme can automatically determine the position of the code printing area according to the code printing position requirement, manual calculation is not required, and the efficiency of silicon wafer code printing is improved.

[0011] In one embodiment, the code printing position standard of the silicon wafer is determined according to the code printing position requirement of the silicon wafer, comprising:

[0012] The maximum value and the minimum value of the plurality of influence factors affecting the position of the silicon wafer recorded in the code printing position requirement of the silicon wafer are obtained;

[0013] The value interval of the at least one preset index is determined by the maximum value and the minimum value of the plurality of influence factors;

[0014] The code printing position standard containing the value interval of the at least one preset index is generated.

[0015] In one embodiment, the value interval of the at least one preset index is determined by the maximum value and the minimum value of the plurality of influence factors, comprising:

[0016] A plurality of sets of experimental data are generated according to the maximum value and the minimum value of the influence factors of the silicon wafer;

[0017] The index values of the preset indexes of the code printing area corresponding to the plurality of sets of experimental data are determined;

[0018] The index values of the preset indexes of the code printing area corresponding to the plurality of sets of experimental data are compared to obtain a comparison result;

[0019] The maximum value and the minimum value of the preset index corresponding to the silicon wafer are screened out through the comparison result;

[0020] The maximum value of the preset index corresponding to the silicon wafer is determined as the maximum value of the value interval of the preset index, and the minimum value of the preset index corresponding to the silicon wafer is determined as the minimum value of the value interval of the preset index, to determine the value interval of the at least one preset index.

[0021] In one embodiment, determining the preset index value of the coding area corresponding to multiple sets of experimental data includes:

[0022] Import the multiple sets of experimental data into a preset plotting software;

[0023] Obtain a schematic diagram of a silicon wafer generated by the preset drawing software based on the multiple sets of experimental data;

[0024] The silicon wafer schematic diagram is measured, and the measured values ​​of each preset index in the silicon wafer schematic diagram are used as the index values ​​of each preset index.

[0025] In one embodiment, generating multiple sets of experimental data based on the maximum and minimum values ​​of the influencing factors of the silicon wafer includes:

[0026] Construct all combinations of data corresponding to the maximum and minimum values ​​of the aforementioned multiple influencing factors;

[0027] The mutually exclusive combinations are removed from the combined data by querying a mutually exclusive combination lookup table, and the remaining combined data is used as the experimental data.

[0028] In one embodiment, determining the value range of the at least one preset indicator by using the maximum and minimum values ​​of the plurality of influencing factors includes:

[0029] Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0030] The multiple sets of experimental data are input into the preset model as input values;

[0031] Obtain the value range of at least one preset index output by the preset model based on the multiple sets of experimental data.

[0032] In one embodiment, the method further includes:

[0033] When the second stage of the testing machine detects a silicon wafer to be tested after the coding operation, the preset indicators of the silicon wafer to be tested are identified.

[0034] Determine whether the preset indicators of the silicon wafer to be tested meet the preset standards;

[0035] When the preset indicators of the silicon wafer to be tested meet the preset standards, the silicon wafer to be tested is determined to be qualified.

[0036] This application also provides a silicon wafer marking apparatus, comprising:

[0037] The acquisition module acquires the silicon wafer marking position requirement when it detects that a silicon wafer to be marked has appeared on the first loading stage of the marking machine.

[0038] The first determining module is used to determine the marking position standard of the silicon wafer according to the marking position requirements of the silicon wafer. The position standard specifies at least one of the following preset indicators: the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface.

[0039] The second determining module is used to determine the position of the marking area in the silicon wafer to be marked according to the position standard;

[0040] The coding module is used to perform coding operations on the silicon wafer to be coded according to the position of the coding area in the silicon wafer to be coded.

[0041] In one embodiment, the first determining module includes:

[0042] The acquisition submodule is used to acquire the maximum and minimum values ​​of multiple influencing factors affecting the position of the silicon wafer as recorded in the silicon wafer marking position requirement;

[0043] The first determining submodule is used to determine the value range of the at least one preset indicator by the maximum and minimum values ​​of the multiple influencing factors;

[0044] A generation submodule is used to generate a coding position standard that includes the value range of the at least one preset indicator.

[0045] In one embodiment, the first determining submodule is further configured to:

[0046] Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0047] Determine the preset index values ​​of the coding area corresponding to multiple sets of experimental data;

[0048] The index values ​​of the preset indicators of the coding area corresponding to multiple sets of experimental data are compared to obtain the comparison results.

[0049] The maximum and minimum values ​​of the preset indicators corresponding to the silicon wafer are selected based on the comparison results.

[0050] The maximum value of the preset index corresponding to the silicon wafer is determined to be the maximum value of the preset index value range, and the minimum value of the preset index corresponding to the silicon wafer is determined to be the minimum value of the preset index value range, so as to determine the value range of the at least one preset index.

[0051] In one embodiment, determining the preset index value of the coding area corresponding to multiple sets of experimental data includes:

[0052] Import the multiple sets of experimental data into a preset plotting software;

[0053] Obtain a schematic diagram of a silicon wafer generated by the preset drawing software based on the multiple sets of experimental data;

[0054] The silicon wafer schematic diagram is measured, and the measured values ​​of each preset index in the silicon wafer schematic diagram are used as the index values ​​of each preset index.

[0055] In one embodiment, generating multiple sets of experimental data based on the maximum and minimum values ​​of the influencing factors of the silicon wafer includes:

[0056] Construct all combinations of data corresponding to the maximum and minimum values ​​of the aforementioned multiple influencing factors;

[0057] The mutually exclusive combinations are removed from the combined data by querying a mutually exclusive combination lookup table, and the remaining combined data is used as the experimental data.

[0058] In one embodiment, the first determining submodule is further configured to:

[0059] Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0060] The multiple sets of experimental data are input into the preset model as input values;

[0061] Obtain the value range of at least one preset index output by the preset model based on the multiple sets of experimental data.

[0062] In one embodiment, the apparatus further includes:

[0063] The identification module is used to identify the preset indicators of the silicon wafer to be inspected when the second stage of the inspection machine detects that a silicon wafer to be inspected has been marked after the coding operation.

[0064] The judgment module is used to determine whether the preset indicators of the silicon wafer to be tested meet the preset standards;

[0065] The third determining module is used to determine that the silicon wafer under test is qualified when the preset indicators of the silicon wafer under test meet the preset standards.

[0066] This application also provides a silicon wafer marking system, including:

[0067] At least one processor; and,

[0068] A memory communicatively connected to the at least one processor; wherein,

[0069] The memory stores instructions that can be executed by the at least one processor to implement the silicon wafer marking method described in any of the above embodiments.

[0070] This application also provides a computer-readable storage medium, which, when the instructions in the storage medium are executed by a processor corresponding to the silicon wafer marking system, enables the silicon wafer marking system to implement the silicon wafer marking method described in any of the above embodiments.

[0071] Other features and advantages of this application will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings.

[0072] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0073] The accompanying drawings are provided to further illustrate the present application and form part of the specification. They are used together with the embodiments of the present application to explain the application and do not constitute a limitation thereof. In the drawings:

[0074] Figure 1 This is a flowchart of a silicon wafer marking method according to an embodiment of this application;

[0075] Figure 2 This is a schematic diagram of the structure of a silicon wafer marking device according to an embodiment of this application;

[0076] Figure 3 This is a schematic diagram of the hardware structure of a silicon wafer marking system according to one embodiment of this application. Detailed Implementation

[0077] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0078] Figure 1 This is a flowchart of a silicon wafer marking method according to an embodiment of this application, as follows: Figure 1 As shown, the method can be implemented as follows: S101-S104:

[0079] In step S101, when a silicon wafer to be marked is detected on the first stage of the marking machine, the marking position requirement of the silicon wafer is obtained.

[0080] In step S102, the marking position standard of the silicon wafer is determined according to the marking position requirements of the silicon wafer. The position standard specifies at least one of the following preset indicators: the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface.

[0081] In step S103, the position of the marking area in the silicon wafer to be marked is determined according to the position standard;

[0082] In step S104, the silicon wafer to be marked is marked according to the marking area position in the silicon wafer to be marked.

[0083] In this application, when a silicon wafer to be marked is detected on the first stage of the marking machine, the marking position requirement of the silicon wafer is obtained. Taking a 300mm silicon wafer as an example, the marking area generally includes a T7 matrix QR code and a character code. Both types of marking codes are composed of dot matrices. The T7 matrix QR code is a rectangular area formed by the dot matrix, and the character code is a matrix area formed by 12 numbers and symbols tightly combined from numerous dot matrices. The character code and the T7 matrix QR code are coaxial and closer to the center of the silicon wafer. As shown in Table 1, the SEMI standard specifies recommended values ​​and deviation ranges for various influencing factors regarding the marking area position. These influencing factors include the marking area width, marking area height, the angle between the marking area center axis and the silicon wafer center axis, the distance between the bottom of the T7 matrix QR code and the center of the silicon wafer, the distance between the bottom of the T7 matrix QR code and the bottom of the marking area, the area width, and the silicon wafer diameter. Depending on the product application or customer requirements, the silicon wafer marking position requirement can be set with different value ranges for each influencing factor within the scope of the SEMI standard.

[0084] Table 1. Value ranges for various influencing factors in the SEMI standard.

[0085]

[0086] For silicon wafers currently flowing to the coding process, the location of the coding area for this batch of wafers needs to be determined. This positional relationship includes four preset indicators: the distance between the upper left side of the coding area and the central axis of the silicon wafer, the distance between the lower left side of the coding area and the central axis of the silicon wafer, the distance between the bottom side of the coding area and the edge of the silicon wafer, and the distance between the bottom side of the coding area and the upper edge of the wafer surface. These preset indicators reflect the angle of the coding area to the central axis, and its distance from the edge of the silicon wafer and the edge of the wafer surface, representing the positional relationship of the coding area. When the coding machine obtains the values ​​of these preset indicators, it can determine the coding area for this batch of silicon wafers.

[0087] In this application, to obtain an accurate marking position, it is necessary to determine the marking position standard for the silicon wafer based on the marking position requirements. This position standard specifies at least one preset value range corresponding to the distances from the upper left side of the marking area to the central axis of the silicon wafer, the distances from the lower left side of the marking area to the central axis of the silicon wafer, the distances from the bottom side of the marking area to the edge of the silicon wafer, and the distances from the bottom side of the marking area to the upper edge of the wafer surface. Specifically, firstly, the maximum and minimum values ​​of multiple influencing factors affecting the silicon wafer position as recorded in the marking position requirements are obtained. These requirements can be the range of values ​​for multiple influencing factors proposed by the customer within the SEMI standard, or simply the range of values ​​for multiple influencing factors specified by the SEMI standard. Alternatively, they can include both the customer-proposed range of values ​​for multiple influencing factors and the range of values ​​for multiple influencing factors specified by the SEMI standard. For example, if the range of values ​​for the corresponding influencing factors in the customer's marking position requirements is missing, the SEMI standard's specification is used instead. Then, the value range of the at least one preset index is determined by the maximum and minimum values ​​of the multiple influencing factors. When determining the value range of the preset index, multiple sets of experimental data need to be generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer. For example, all combinations of the maximum and minimum values ​​of the multiple influencing factors are constructed. All obtained combinations are then queried using a mutually exclusive combination lookup table to eliminate mutually exclusive combinations, and the remaining combinations are used as the experimental data. After obtaining the experimental data, the preset index values ​​of the coding area corresponding to multiple sets of experimental data are further determined. For example, the experimental data of various influencing factors obtained through the coding position requirements of silicon wafers are imported into Solidworks software. Combined with the Solidworks planar design interface, experiments are conducted item by item to generate a silicon wafer schematic diagram. The index values ​​of four preset indicators under each set of experimental data can be calculated through the silicon wafer schematic diagram. The index values ​​of the preset indicators of the coding area corresponding to multiple sets of experimental data are compared to obtain the comparison results. The maximum and minimum values ​​of the preset indicators corresponding to the silicon wafer are selected through the comparison results. The maximum value of the preset indicator corresponding to the silicon wafer is determined to be the maximum value of the preset indicator value range, and the minimum value of the preset indicator corresponding to the silicon wafer is determined to be the minimum value of the preset indicator value range, so as to determine the value range of the at least one preset indicator. A coding position standard containing the value range of the at least one preset indicator is generated.

[0088] The location of the marking area in the silicon wafer to be marked is determined according to the location standard. The location standard is a preset range of values ​​for the marking area index. To determine the location of the marking area, the average value of the preset index is pre-set as the specific value of the marking area index. Of course, to obtain multiple combinations, multiple sets of different values ​​can be obtained within the value range based on the average value of the preset index and a preset step size.

[0089] Finally, the silicon wafer to be marked is marked according to the marking area position in the wafer.

[0090] Furthermore, the monitoring equipment in this application can also inspect silicon wafers. Specifically, when the second stage of the inspection equipment detects a silicon wafer to be inspected after a coding operation, it identifies the preset indicators of the silicon wafer to be inspected; determines whether the preset indicators of the silicon wafer to be inspected meet the preset standards; and determines that the silicon wafer to be inspected is qualified when the preset indicators meet the preset standards. This further improves the production efficiency of silicon wafers.

[0091] The beneficial effects of this application are as follows: When a silicon wafer to be marked is detected on the first stage of the marking machine, the marking position requirement of the silicon wafer is obtained, and the marking position standard of the silicon wafer is determined according to the marking position requirement. The position standard specifies at least one preset value range corresponding to the distances from the upper left side of the marking area to the central axis of the silicon wafer, the distances from the lower left side of the marking area to the central axis of the silicon wafer, the distances from the bottom side of the marking area to the edge of the silicon wafer, and the distances from the bottom side of the marking area to the upper edge of the wafer surface. Then, the marking area position in the silicon wafer to be marked is determined according to the position standard. The marking machine can then accurately determine the position of the marking area using the preset indicators, and perform marking operations on the silicon wafer to be marked according to the marking area position. Since this solution can automatically determine the position of the marking area according to the marking position requirement, no manual calculation is required, thereby improving the efficiency of silicon wafer marking.

[0092] In one embodiment, step S102 above can be implemented as steps A1-A3 as follows:

[0093] In step A1, the maximum and minimum values ​​of multiple influencing factors affecting the silicon wafer position as recorded in the silicon wafer marking position requirement are obtained;

[0094] In step A2, the value range of the at least one preset index is determined by the maximum and minimum values ​​of the multiple influencing factors;

[0095] In step A3, a coding position standard is generated that includes the value range of the at least one preset indicator.

[0096] In this embodiment, the maximum and minimum values ​​of multiple influencing factors affecting the silicon wafer position, as recorded in the silicon wafer marking position requirements, are obtained. The silicon wafer marking position requirements can be the range of values ​​for multiple influencing factors proposed by the customer within the SEMI standard; it can also be simply the range of values ​​for multiple influencing factors specified by the SEMI standard; or it can simultaneously include the range of values ​​for multiple influencing factors proposed by the customer and the range of values ​​for multiple influencing factors specified by the SEMI standard. For example, if the range of values ​​for the corresponding influencing factors in the customer's marking position requirements is missing, the SEMI standard specification is used instead. The influencing factors include the marking area width, marking area height, the angle between the marking area center axis and the silicon wafer center axis, the distance between the bottom of the T7 matrix QR code and the center of the silicon wafer, the distance between the bottom of the T7 matrix QR code and the bottom of the marking area, the area width, and the silicon wafer diameter. The range of values ​​for each influencing factor includes at least its maximum and minimum values, and may also include other statistical indicators such as the mean.

[0097] Then, the value range of the at least one preset index is determined by the maximum and minimum values ​​of the multiple influencing factors. Since the influencing factors of the marking area make it difficult for the marking machine to determine the location of the marking area—for example, it is difficult for the marking machine to measure the marking angle—it is also difficult to determine the angle between the central axis of the marking area and the central axis of the silicon wafer. Therefore, this application converts the influencing factors of the marking area location into preset indices to facilitate the marking machine in determining the location of the marking area on the silicon wafer. The preset indices include the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface area. The specific determination process involves generating multiple sets of experimental data based on the maximum and minimum values ​​of the influencing factors of the silicon wafer. For example, it involves constructing all combinations of the maximum and minimum values ​​of the multiple influencing factors, then using a mutually exclusive combination lookup table to eliminate mutually exclusive combinations, and using the remaining combinations as the experimental data. Next, it involves determining the preset index values ​​for the marking area corresponding to the multiple sets of experimental data. For example, the experimental data of each influencing factor obtained from the silicon wafer marking position requirements are imported into Solidworks software, combined with Solidworks's... The interface is designed, and experiments are conducted item by item to generate a silicon wafer schematic diagram. The silicon wafer schematic diagram allows calculation of the index values ​​of four preset indicators under each set of experimental data. The index values ​​of the preset indicators in the coding area corresponding to multiple sets of experimental data are compared to obtain comparison results. The maximum and minimum values ​​of the preset indicators corresponding to the silicon wafer are selected based on the comparison results. The maximum value of the preset indicator corresponding to the silicon wafer is determined to be the maximum value of the preset indicator value range, and the minimum value of the preset indicator corresponding to the silicon wafer is determined to be the minimum value of the preset indicator value range, thereby determining the value range of at least one preset indicator.

[0098] Of course, the multiple sets of experimental data can also be input into a preset model. The preset model can be a pre-constructed mathematical relationship between influencing factors and various preset indicators. The maximum and minimum values ​​of the data obtained by inputting the multiple sets of experimental data into the mathematical relationship are then used to obtain the value range of the preset indicators. Alternatively, the preset model can be trained by inputting the values ​​of the multiple sets of influencing factors and preset indicators into a neural network model, where the influencing factors are the input values ​​and the values ​​of the preset indicators are the output values. The maximum and minimum values ​​of the data obtained by inputting the multiple sets of experimental data into the mathematical relationship are then used to obtain the value range of the preset indicators. This application does not limit the specific method for constructing the preset model.

[0099] Finally, a coding position standard is generated that includes the value range of at least one preset indicator. During coding, the value range of the preset indicators is used to generate the coding position standard for this coding, and the position standard includes the value range of at least one preset indicator.

[0100] In one embodiment, step A2 above can be implemented as steps B1-B5 as follows:

[0101] In step B1, multiple sets of experimental data are generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0102] In step B2, the preset index values ​​of the coding areas corresponding to multiple sets of experimental data are determined;

[0103] In step B3, the index values ​​of the preset indicators of the coding area corresponding to multiple sets of experimental data are compared to obtain the comparison results;

[0104] In step B4, the maximum and minimum values ​​of the preset indicators corresponding to the silicon wafer are selected based on the comparison results;

[0105] In step B5, the maximum value of the preset index corresponding to the silicon wafer is determined to be the maximum value of the preset index value range, and the minimum value of the preset index corresponding to the silicon wafer is determined to be the minimum value of the preset index value range, so as to determine the value range of the at least one preset index.

[0106] In this embodiment, multiple sets of experimental data are generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer. First, all combinations of the maximum and minimum values ​​of the multiple influencing factors are constructed. Taking the SEMI standard as an example of silicon wafer marking position requirements, for ease of illustration, only three influencing factors—marking area width, marking area height, and the angle between the marking area center axis and the silicon wafer center axis—are used to illustrate the generation process of multiple sets of experimental data. For the value range of each of the three factors, the corresponding maximum and minimum values ​​can be obtained. Therefore, as shown in Table 2, eight sets of combined data can be obtained through combination. Similarly, for the seven preset indicators, two sets of combined data can be obtained. 7 Grouped data.

[0107] Table 2. Combined Experiment Data (3 Influencing Factors)

[0108]

[0109] Note: The units for the width and height of the marking area are mm; the unit for the angle between the center axis of the marking area and the center axis of the silicon wafer is °.

[0110] Then, by consulting a mutually exclusive combination lookup table, mutually exclusive combinations in the combination data are eliminated, and the remaining combination data is used as the experimental data. Among the obtained combination data, there are combinations with contradictory data within the group. For example, since the diameter of the silicon wafer is fixed, when the bottom of the T7 matrix QR code is closest to the center of the silicon wafer, the bottom of the T7 matrix QR code must be farthest from the bottom of the coding area; neither indicator can be both closest or both farthest. Therefore, by consulting the mutually exclusive combination lookup table, combinations with contradictory data within the group are eliminated, and the remaining combination data is the experimental data. It should be noted that, to obtain experimental data, influencing factors can also be analyzed beforehand to determine their impact on the preset indicators of the coding area. Then, different influencing factors can be analyzed using DOE full factorial or partial factorial experimental designs.

[0111] Determine the preset index values ​​for the marking area corresponding to multiple sets of experimental data. For example, import the experimental data of various influencing factors obtained through the marking position requirements of silicon wafers into a preset drawing software, such as Solidworks. Combined with Solidworks' planar design interface, conduct experiments item by item to generate a silicon wafer schematic diagram. The index values ​​of four preset indicators under each set of experimental data can be calculated through the silicon wafer schematic diagram.

[0112] The preset index values ​​of the coding area corresponding to multiple sets of experimental data are compared to obtain the comparison results; the maximum and minimum values ​​of the preset index corresponding to the silicon wafer are selected through the comparison results; the maximum value of the preset index corresponding to the silicon wafer is determined to be the maximum value of the preset index value range, and the minimum value of the preset index corresponding to the silicon wafer is determined to be the minimum value of the preset index value range, so as to determine the value range of the at least one preset index.

[0113] The beneficial effect of this embodiment is that by obtaining the coding position requirements, experimental data of the combination of maximum and minimum values ​​of influencing factors are obtained, and the value range of the preset index corresponding to the coding position requirements is calculated through the experimental data, without the need for manual calculation, thus determining the position range of the coding area.

[0114] In one embodiment, step B2 above can be implemented as steps C1-C3 as follows:

[0115] In step C1, the multiple sets of experimental data are imported into a preset plotting software;

[0116] In step C2, a schematic diagram of a silicon wafer generated by the preset drawing software based on the multiple sets of experimental data is obtained;

[0117] In step C3, the silicon wafer schematic diagram is measured, and the measured values ​​of each preset index in the silicon wafer schematic diagram are used as the index values ​​of each preset index.

[0118] In this embodiment, the multiple sets of experimental data are imported into a preset plotting software; specifically, the experimental data of each influencing factor obtained through the silicon wafer marking position requirements can be imported into the preset plotting software, such as Solidworks software.

[0119] Obtain the silicon wafer schematic diagram generated by the preset drawing software based on the multiple sets of experimental data. Combined with the Solidworks 2D design interface, conduct the experiments item by item to generate the silicon wafer schematic diagram.

[0120] The silicon wafer schematic diagram is measured, and the measured values ​​of each preset index in the silicon wafer schematic diagram are used as the index values ​​of each preset index. Using plotting software, the index values ​​of the four preset indices under each experimental data point can be calculated.

[0121] In one embodiment, step B1 above can be implemented as steps D1-D2 as follows:

[0122] In step D1, all combination data corresponding to the maximum and minimum values ​​of the multiple influencing factors are constructed;

[0123] In step D2, mutually exclusive combinations are removed from the combination data by querying the mutually exclusive combination lookup table, and the remaining combination data is used as the experimental data.

[0124] In this embodiment, all combined data corresponding to the maximum and minimum values ​​of the aforementioned multiple influencing factors are constructed. Taking the SEMI standard as the silicon wafer marking position requirement as an example, for ease of illustration, only three influencing factors—marking area width, marking area height, and the angle between the marking area center axis and the silicon wafer center axis—are used to illustrate the generation process of multiple sets of experimental data. For the value range of each of the three factors, the corresponding maximum and minimum values ​​can be obtained. Therefore, as shown in Table 2, eight sets of combined data can be obtained through combination. Similarly, for the seven preset indicators, two sets of combined data can be obtained. 7 Grouped data.

[0125] Then, by consulting a mutually exclusive combination lookup table, mutually exclusive combinations in the combination data are eliminated, and the remaining combination data is used as the experimental data. Among the obtained combination data, there are combinations with contradictory data within the group. For example, since the diameter of the silicon wafer is fixed, when the bottom of the T7 matrix QR code is closest to the center of the silicon wafer, the bottom of the T7 matrix QR code must be farthest from the bottom of the coding area; both indicators cannot be simultaneously closest or simultaneously farthest. Therefore, by consulting the mutually exclusive combination lookup table, combinations with contradictory data within the group are eliminated, and the remaining combination data is the experimental data.

[0126] In one embodiment, step A2 above can be implemented as steps E1-E3 as follows:

[0127] In step E1, multiple sets of experimental data are generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0128] In step E2, the multiple sets of experimental data are input into the preset model as input quantities;

[0129] In step E3, the value range of at least one preset index output by the preset model based on the multiple sets of experimental data is obtained.

[0130] In this embodiment, multiple sets of experimental data are generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer. First, all combination data corresponding to the maximum and minimum values ​​of the multiple influencing factors are constructed. Then, a mutually exclusive combination lookup table is queried to remove mutually exclusive combinations from the combination data, and the remaining combination data is used as the experimental data.

[0131] The multiple sets of experimental data are input into a preset model. The preset model can be a pre-constructed mathematical relationship between influencing factors and various preset indicators. The maximum and minimum values ​​of the data obtained by inputting the multiple sets of experimental data into the mathematical relationship are then used to obtain the value range of the preset indicators. Alternatively, the preset model can be trained by inputting the values ​​of the multiple sets of influencing factors and preset indicators into a neural network model, where the influencing factors are the input values ​​and the values ​​of the preset indicators are the output values. The maximum and minimum values ​​of the data obtained by inputting the multiple sets of experimental data into the mathematical relationship are then used to obtain the value range of the preset indicators. This application does not limit the specific method for constructing the preset model.

[0132] Finally, the value range of at least one preset index output by the preset model based on the multiple sets of experimental data is obtained.

[0133] In one embodiment, the method may also be implemented as steps F1-F3:

[0134] In step F1, when the second stage of the inspection machine detects the silicon wafer to be inspected after the coding operation, the preset indicators of the silicon wafer to be inspected are identified.

[0135] In step F2, it is determined whether the preset indicators of the silicon wafer to be tested meet the preset standards;

[0136] In step F3, when the preset indicators of the silicon wafer to be tested meet the preset standards, the silicon wafer to be tested is determined to be qualified.

[0137] In one specific embodiment, the Design of Experiments (DOE) method is adopted. This method can study the interaction between influencing factors, requires fewer experiments and has high precision, and allows for the selection of different types of DOE methods according to the target. It is currently widely used in modern industrial production and scientific practice, and can reform old processes, trial-produce new products, and seek optimal production conditions, thereby reducing costs, improving quality and increasing efficiency.

[0138] For example, marking on a 300mm silicon wafer typically includes a T7 matrix QR code and a character code that is independently and directly readable by humans. Both types of marking are composed of dot matrices. The T7 matrix QR code is a rectangular area formed by the dot matrix, while the character code is a matrix area formed by 12 numbers and symbols tightly combined from numerous dot matrices. The character code and the T7 matrix QR code are coaxial and closer to the center of the silicon wafer. The SEMI standard also specifies seven factors that can affect the positional relationship of the marking areas: marking area width, marking area height, the angle between the central axis of the marking area and the central axis of the silicon wafer, the distance between the bottom of the T7 matrix QR code and the center of the silicon wafer, the distance between the bottom of the T7 matrix QR code and the bottom of the marking area, the area width, and the silicon wafer diameter. The SEMI standard also specifies the acceptable range, extreme values, and recommended average values ​​for the above factors, as shown in Table 1.

[0139] Based on the SEMI standard and Table 1, regarding the factors affecting the positional relationship of the marking area, the recommended average values ​​of each factor were selected sequentially, and a planar diagram of the marking area on a 300mm silicon wafer was drawn using the highly interactive and editable Solidworks software. For silicon wafers currently flowing to the coding process, the position of the marking area for this batch of wafers needs to be determined. This positional relationship includes four preset indicators: the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the wafer surface. These preset indicators reflect the angle of the marking area to the central axis, and the distance to the edge of the silicon wafer and the edge of the wafer surface, representing the positional relationship of the marking area. The marking equipment has a parameter input area; by inputting the values ​​of the above key indicators, the marking area for this batch of silicon wafers can be obtained.

[0140] For example, a customer needs a batch of silicon wafers, where the actual marking positions only need to be within the range specified by the SEMI standard. They also want wafers with various marking positions, including those reaching extreme positions, to facilitate testing. Analyzing this customer requirement and referring to Table 1, the standard range needs to be taken into account for all influencing factors.

[0141] Furthermore, based on the planar diagram of the silicon wafer marking area, analysis revealed that adjusting any value within the standard range of three influencing factors—marking area width, marking area height, and the angle between the marking area's central axis and the silicon wafer's central axis—can alter the positional relationships of all four key indicators of the marking area, such as their angles and distances, thereby affecting the overall position of the silicon wafer marking area. These influencing factors are interrelated, and a full factorial experimental design from the Design of Experiments (DOE) was employed for analysis. This method involves conducting at least one experiment for all combinations of all levels of all factors, allowing for the estimation of the interaction effects between factors of different orders.

[0142] Therefore, a set of experiments was created using Minitab, named "Experiment Group 1," to conduct a Design of Experiments (DOE) full factorial design to meet the customer's coding position requirements. The experimental factors were the three influencing factors mentioned above: coding area width, coding area height, and the angle between the coding area central axis and the silicon wafer central axis. Each factor was set to two levels (1 and -1) based on the upper and lower extreme values ​​of the standard range of influencing factors. Subsequently, the parameters were set in the software, and it was selected to conduct one set of experiments, with no repetition of experiments within each group. After completion, the "Confirm" button was clicked, and the dialog box displayed a design summary, while the worksheet displayed the experimental design scheme. A total of 8 randomized experiments were conducted, as shown in Table 2.

[0143] Further analysis based on the planar diagram of the silicon wafer marking area reveals four remaining influencing factors: the distance between the bottom of the T7 matrix QR code and the center of the silicon wafer, the distance between the bottom of the T7 matrix QR code and the bottom of the marking area, the width of the marking area, and the diameter of the chamfered piece. Preliminary analysis shows that adjusting any value of these factors only alters the positional relationships of key indicators in the marking area, such as the angle or distance, or only changes the positional relationships of some key indicators. If these factors were incorporated again into a full-factor experimental design for the three influencing factors mentioned above, the number of experiments would increase exponentially. Therefore, it is necessary to analyze these four factors independently first.

[0144] Reopen Minitab and create a new experiment group named "Experiment Group 2". The experimental factors are the four influencing factors mentioned above: the distance between the bottom of the T7 matrix QR code and the center of the silicon wafer, the distance between the bottom of the T7 matrix QR code and the bottom of the coding area, the width of the area, and the diameter of the silicon wafer. Follow the same steps as "Experiment Group 1" to set the high and low levels and configure the parameters.

[0145] To reduce the number of experiments and improve analytical efficiency, partial factorial experiments can be implemented: Click "Show Available Designs," and the system will indicate that the current number of factors is 4. The resolution of 8 experiments is IV, meaning that the smallest main effects are confounded with 3-factor interactions but not with 2-factor interactions. This partial factorial experiment retains all interactions of 3 or fewer that are usually considered, ensuring a high degree of reliability in the analytical results. The 8 randomized experiments conducted in "Experimental Group 2" are shown in Table 3.

[0146] Table 3. Combined Experiment Data (4 Influencing Factors)

[0147]

[0148] Following the order in Table 3, and using the Solidworks 2D design interface, experiments were conducted item by item, and the results are summarized in Table 4.

[0149] Table 4. Experimental Data (Experiments 11-18)

[0150]

[0151]

[0152] Analyzing the experimental results in Table 4, experiments 13 and 16 yielded the maximum and minimum values ​​of the distance between the bottom side of the marking area and the edge of the silicon wafer, and the maximum and minimum values ​​of the distance between the bottom side of the marking area and the upper edge of the surface were also obtained in experiments 13 and 16.

[0153] The results were analyzed using Solidworks planar drawing. Four types of positional relationships were identified by taking extreme values ​​for the T7 matrix QR code area, the A / N character coding area, and the silicon wafer edge. Experiment 16 showed the following: the T7 matrix QR code bottom was furthest from the silicon wafer center, the T7 matrix QR code bottom was closest to the bottom of the A / N character coding area, and the coding area bottom was closest to the silicon wafer edge when the silicon wafer diameter was smallest. Experiment 13 showed the following: the T7 matrix QR code bottom was closest to the silicon wafer center, the T7 matrix QR code bottom was furthest from the bottom of the A / N character coding area, and the coding area bottom was furthest from the silicon wafer edge when the silicon wafer diameter was largest.

[0154] Based on obtaining the extreme value of the distance between the bottom side of the coding area and the edge of the silicon wafer, the A / N character coding area is placed at the extreme value position. The positional relationship between the coding area and the edge of the silicon wafer and the upper edge of the surface is analyzed. There are 4 cases: As shown in Experiment 16, when the A / N character coding area is at the lowest position and the surface width is the largest and the silicon wafer diameter is the smallest, the distance between the bottom side of the coding area and the upper edge of the surface is the shortest; As shown in Experiment 13, when the A / N character coding area is at the highest position and the surface width is the smallest and the silicon wafer diameter is the largest, the distance between the bottom side of the coding area and the upper edge of the surface is the farthest.

[0155] Furthermore, the four influencing factors from "Experimental Group 2"—distance between the bottom of the T7 matrix QR code and the center of the silicon wafer, distance between the bottom of the T7 matrix QR code and the bottom of the coding area, width of the area, and diameter of the silicon wafer—were successively merged into "Experimental Group 1" for DOE experiments, resulting in a total of seven influencing factors. The calculations were performed using Solidworks software, and the results of the calculations of the above influencing factors on the key indicators for experiments 1-8 are shown in Table 5.

[0156] Table 5. Values ​​of the preset indicators (Experiments 1-8)

[0157]

[0158] Note: Unit: mm

[0159] Furthermore, Table 6 summarizes the solution values ​​of the four key indicators for the location of the masked area when the recommended average of the seven influencing factors is obtained, as well as the solution range when the standard interval is obtained.

[0160] Table 6 Preset Indicator Value Range

[0161]

[0162] Note: Unit: mm

[0163] Further analysis of the calculation results revealed that, regarding the distance between the upper left side of the marking area and the central axis of the silicon wafer, Experiment 1 had the smallest value, while Experiment 6 had the largest; regarding the distance between the lower left side of the marking area and the central axis of the silicon wafer, Experiment 1 had the smallest value, while Experiments 2 and 6 had the largest values; regarding the distance between the bottom side of the marking area and the edge of the silicon wafer, Experiment 6 had the smallest value, while Experiment 3 had the largest; and regarding the distance between the bottom side of the marking area and the upper edge of the surface area, Experiment 6 had the smallest value, while Experiment 3 had the largest. Comparing the calculation results of "Experimental Group 1" and "Experimental Group 2" further clarifies that the two key indicators—the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface area—are only affected by factors 4–7, while factors 1–3 have no effect.

[0164] Furthermore, Experiment 1 yielded the minimum distances between the upper left and lower left sides of the marking area and the central axis of the silicon wafer. At this point, the influencing factors were the maximum width of the marking area, the maximum height of the marking area, and the minimum angle between the central axis of the marking area and the central axis of the silicon wafer. Experiment 6 yielded the maximum distances between the upper left and lower left sides of the marking area and the central axis of the silicon wafer. At this point, the influencing factors were the minimum width of the marking area, the minimum height of the marking area, and the maximum angle between the central axis of the marking area and the central axis of the silicon wafer. Experiment 2 also yielded the maximum distance between the lower left side of the marking area and the central axis of the silicon wafer. However, the height of the marking area did not reach its minimum value, indicating that this influencing factor had a relatively low impact on the distance between the lower left side of the marking area and the central axis of the silicon wafer.

[0165] This method was applied to a silicon wafer laser marking machine for assembly line production. To verify the effectiveness of this solution, manual sampling was performed using an inspection machine. A batch of laser-marked wafers was produced according to plan on a certain daily production line. The processed silicon wafers were placed in dark boxes, 25 wafers per box. The inspection rule was to randomly select two wafers from each dark box.

[0166] The Keyence VHX series digital microscope system was used to complete the sampling inspection: the distance between the bottom side of the marking area and the edge of the silicon wafer was measured to be 2.75 mm; the distance between the upper left side of the marking area and the central axis of the silicon wafer, and the distance between the lower left side of the marking area and the central axis of the silicon wafer were measured to be 4.316 mm and 4.452 mm, respectively. The measured results are consistent with the calculation results of this scheme.

[0167] Figure 2 This is a schematic diagram of the structure of a silicon wafer marking device according to an embodiment of this application, as shown below. Figure 2 As shown, the device includes:

[0168] The acquisition module 201 acquires the silicon wafer marking position requirement when it detects that a silicon wafer to be marked appears on the first loading stage of the marking machine.

[0169] The first determining module 202 is used to determine the marking position standard of the silicon wafer according to the marking position requirements of the silicon wafer. The position standard specifies at least one of the following preset indicators: the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface.

[0170] The second determining module 203 is used to determine the position of the marking area in the silicon wafer to be marked according to the position standard.

[0171] The coding module 204 is used to perform coding operations on the silicon wafer to be coded according to the coding area position in the silicon wafer to be coded.

[0172] In one embodiment, the first determining module includes:

[0173] The acquisition submodule is used to acquire the maximum and minimum values ​​of multiple influencing factors affecting the position of the silicon wafer as recorded in the silicon wafer marking position requirement;

[0174] The first determining submodule is used to determine the value range of the at least one preset indicator by the maximum and minimum values ​​of the multiple influencing factors;

[0175] A generation submodule is used to generate a coding position standard that includes the value range of the at least one preset indicator.

[0176] In one embodiment, the first determining submodule is further configured to:

[0177] Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0178] Determine the preset index values ​​of the coding area corresponding to multiple sets of experimental data;

[0179] The index values ​​of the preset indicators of the coding area corresponding to multiple sets of experimental data are compared to obtain the comparison results.

[0180] The maximum and minimum values ​​of the preset indicators corresponding to the silicon wafer are selected based on the comparison results.

[0181] The maximum value of the preset index corresponding to the silicon wafer is determined to be the maximum value of the preset index value range, and the minimum value of the preset index corresponding to the silicon wafer is determined to be the minimum value of the preset index value range, so as to determine the value range of the at least one preset index.

[0182] In one embodiment, determining the preset index value of the coding area corresponding to multiple sets of experimental data includes:

[0183] Import the multiple sets of experimental data into a preset plotting software;

[0184] Obtain a schematic diagram of a silicon wafer generated by the preset drawing software based on the multiple sets of experimental data;

[0185] The silicon wafer schematic diagram is measured, and the measured values ​​of each preset index in the silicon wafer schematic diagram are used as the index values ​​of each preset index.

[0186] In one embodiment, generating multiple sets of experimental data based on the maximum and minimum values ​​of the influencing factors of the silicon wafer includes:

[0187] Construct all combinations of data corresponding to the maximum and minimum values ​​of the aforementioned multiple influencing factors;

[0188] The mutually exclusive combinations are removed from the combined data by querying a mutually exclusive combination lookup table, and the remaining combined data is used as the experimental data.

[0189] In one embodiment, the first determining submodule is further configured to:

[0190] Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer;

[0191] The multiple sets of experimental data are input into the preset model as input values;

[0192] Obtain the value range of at least one preset index output by the preset model based on the multiple sets of experimental data.

[0193] In one embodiment, the apparatus further includes:

[0194] The identification module is used to identify the preset indicators of the silicon wafer to be inspected when the second stage of the inspection machine detects that a silicon wafer to be inspected has been marked after the coding operation.

[0195] The judgment module is used to determine whether the preset indicators of the silicon wafer to be tested meet the preset standards;

[0196] The third determining module is used to determine that the silicon wafer under test is qualified when the preset indicators of the silicon wafer under test meet the preset standards.

[0197] Figure 3 This is a schematic diagram of the hardware structure of a silicon wafer marking system according to an embodiment of this application, as shown below. Figure 3 As shown, the silicon wafer marking system includes:

[0198] At least one processor 320; and,

[0199] Memory 304 communicatively connected to the at least one processor 320; wherein,

[0200] The memory 304 stores instructions that can be executed by the at least one processor 320 to implement the silicon wafer marking method described in any of the above embodiments.

[0201] Reference Figure 3 The silicon wafer marking system 300 may include one or more of the following components: processing component 302, memory 304, power supply component 306, multimedia component 308, audio component 310, input / output (I / O) interface 312, sensor component 314, and communication component 316.

[0202] Processing component 302 typically controls the overall operation of the silicon wafer marking system 300. Processing component 302 may include one or more processors 320 to execute instructions to complete all or part of the steps of the method described above. Furthermore, processing component 302 may include one or more modules to facilitate interaction between processing component 302 and other components. For example, processing component 302 may include a multimedia module to facilitate interaction between multimedia component 308 and processing component 302.

[0203] Memory 304 is configured to store various types of data to support the operation of the silicon marking system 300. Examples of this data include instructions for any application or method operating on the silicon marking system 300, such as text, images, videos, etc. Memory 304 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0204] Power supply component 306 provides power to various components of the silicon wafer marking system 300. Power supply component 306 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the silicon wafer marking system 300.

[0205] The multimedia component 308 includes a screen that provides an output interface between the silicon marking system 300 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, the multimedia component 308 may also include a front-facing camera and / or a rear-facing camera. When the silicon marking system 300 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0206] Audio component 310 is configured to output and / or input audio signals. For example, audio component 310 includes a microphone (MIC) configured to receive external audio signals when the silicon marking system 300 is in an operating mode, such as alarm mode, recording mode, voice recognition mode, and voice output mode. The received audio signals may be further stored in memory 304 or transmitted via communication component 316. In some embodiments, audio component 310 also includes a speaker for outputting audio signals.

[0207] I / O interface 312 provides an interface between processing component 302 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0208] Sensor assembly 314 includes one or more sensors for providing status assessments of various aspects of the silicon wafer marking system 300. For example, sensor assembly 314 may include a sound sensor. Additionally, sensor assembly 314 can detect the on / off state of the silicon wafer marking system 300, the relative positioning of components (e.g., the display and keypad of the silicon wafer marking system 300), and the operating state of the silicon wafer marking system 300 or one of its components, such as the operating state of the air distribution plate, structural state, the operating state of the discharge scraper, the orientation or acceleration / deceleration of the silicon wafer marking system 300, and temperature changes of the silicon wafer marking system 300. Sensor assembly 314 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 314 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 314 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, a material buildup thickness sensor, or a temperature sensor.

[0209] Communication component 316 is configured to enable the silicon marking system 300 to provide wired or wireless communication capabilities with other devices and cloud platforms. The silicon marking system 300 can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 316 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 316 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0210] In an exemplary embodiment, the silicon wafer marking system 300 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the silicon wafer marking method described in any of the above embodiments.

[0211] This application also provides a computer-readable storage medium, which, when the instructions in the storage medium are executed by a processor corresponding to the silicon wafer marking system, enables the silicon wafer marking system to implement the silicon wafer marking method described in any of the above embodiments.

[0212] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, disk storage and optical storage) containing computer-usable program code.

[0213] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0214] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0215] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0216] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A silicon wafer marking method, characterized in that, include: When a silicon wafer to be marked is detected on the first stage of the marking machine, the marking position requirement of the silicon wafer is obtained. Based on the marking position requirements of the silicon wafer, the marking position standard of the silicon wafer is determined. The position standard specifies at least one of the following preset indicators: the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface. The location of the marking area in the silicon wafer to be marked is determined according to the location standard; The silicon wafer to be marked is marked according to the position of the marking area in the silicon wafer to be marked. The step of determining the marking position standard of the silicon wafer according to the marking position requirements includes: Obtain the maximum and minimum values ​​of multiple influencing factors affecting the silicon wafer position as recorded in the silicon wafer marking position requirement; The value range of the at least one preset indicator is determined by the maximum and minimum values ​​of the multiple influencing factors. Generate a coding position standard that includes the value range of at least one preset indicator.

2. The method as described in claim 1, characterized in that, The step of determining the value range of at least one preset indicator by the maximum and minimum values ​​of the multiple influencing factors includes: Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer; Determine the preset index values ​​of the coding area corresponding to multiple sets of experimental data; The index values ​​of the preset indicators of the coding area corresponding to multiple sets of experimental data are compared to obtain the comparison results. The maximum and minimum values ​​of the preset indicators corresponding to the silicon wafer are selected based on the comparison results. The maximum value of the preset index corresponding to the silicon wafer is determined to be the maximum value of the preset index value range, and the minimum value of the preset index corresponding to the silicon wafer is determined to be the minimum value of the preset index value range, so as to determine the value range of the at least one preset index.

3. The method as described in claim 2, characterized in that, The determination of the preset index values ​​for the coding areas corresponding to multiple sets of experimental data includes: Import the multiple sets of experimental data into a preset plotting software; Obtain a schematic diagram of a silicon wafer generated by the preset drawing software based on the multiple sets of experimental data; The silicon wafer schematic diagram is measured, and the measured values ​​of each preset index in the silicon wafer schematic diagram are used as the index values ​​of each preset index.

4. The method as described in claim 2, characterized in that, The process involves generating multiple sets of experimental data based on the maximum and minimum values ​​of the influencing factors on the silicon wafer, including: Construct all combinations of data corresponding to the maximum and minimum values ​​of the aforementioned multiple influencing factors; The mutually exclusive combinations are removed from the combined data by querying a mutually exclusive combination lookup table, and the remaining combined data is used as the experimental data.

5. The method as described in claim 1, characterized in that, The step of determining the value range of at least one preset indicator by the maximum and minimum values ​​of the multiple influencing factors includes: Multiple sets of experimental data were generated based on the maximum and minimum values ​​of the influencing factors of the silicon wafer; The multiple sets of experimental data are input into the preset model as input values; Obtain the value range of at least one preset index output by the preset model based on the multiple sets of experimental data.

6. The silicon wafer marking method according to any one of claims 1-5, characterized in that, Also includes: When the second stage of the testing machine detects a silicon wafer to be tested after the coding operation, the preset indicators of the silicon wafer to be tested are identified. Determine whether the preset indicators of the silicon wafer to be tested meet the preset standards; When the preset indicators of the silicon wafer to be tested meet the preset standards, the silicon wafer to be tested is determined to be qualified.

7. A silicon wafer marking device, characterized in that, include: The acquisition module acquires the silicon wafer marking position requirement when it detects that a silicon wafer to be marked has appeared on the first loading stage of the marking machine. The first determining module is used to determine the marking position standard of the silicon wafer according to the marking position requirements of the silicon wafer. The position standard specifies at least one of the following preset indicators: the distance between the upper left side of the marking area and the central axis of the silicon wafer, the distance between the lower left side of the marking area and the central axis of the silicon wafer, the distance between the bottom side of the marking area and the edge of the silicon wafer, and the distance between the bottom side of the marking area and the upper edge of the surface. The second determining module is used to determine the position of the marking area in the silicon wafer to be marked according to the position standard; The coding module is used to perform coding operations on the silicon wafer to be coded according to the position of the coding area in the silicon wafer to be coded. The first determining module includes: The acquisition submodule is used to acquire the maximum and minimum values ​​of multiple influencing factors affecting the position of the silicon wafer as recorded in the silicon wafer marking position requirement; The first determining submodule is used to determine the value range of the at least one preset indicator by the maximum and minimum values ​​of the multiple influencing factors; A generation submodule is used to generate a coding position standard that includes the value range of the at least one preset indicator.

8. A silicon wafer marking system, characterized in that, include: At least one processor; as well as, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to implement the silicon wafer marking method as described in any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the processor corresponding to the silicon wafer marking system, the silicon wafer marking system is able to implement the silicon wafer marking method as described in any one of claims 1-6.

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