A high-rigidity resin grinding wheel and preparation method thereof

Abstract

The present invention belongs to the field of resin grinding wheel production, and in particular relates to a preparation method and application of a high-rigidity resin grinding wheel. The present invention prepares a high-rigidity resin grinding wheel by the following steps: first, weighing the raw materials of the grinding wheel by weight, and molding and pressing to make a grinding wheel blank; placing the grinding wheel blank in a heating device to heat to obtain a pre-finished product; quickly putting the pre-finished resin grinding wheel into a quenching device composed of a mixed gas of nitrogen and carbon dioxide for quenching treatment; and then undergoing subsequent processing to obtain a finished resin grinding wheel. The quenching treatment atmosphere is a nitrogen and carbon dioxide mixed gas, the quenching process has an adjustable temperature of 185°C to 60°C, a flow rate of 10-50L / min, and a quenching time of 5-10min. The quenching process can be precisely controlled, significantly improving the rigidity, hardness, strength, and life of the resin-bonded grinding wheel.

Description

Technical Field

[0001] The present invention relates to the technical field of resin grinding wheel production, in particular to a preparation method and application of a high-rigidity resin grinding wheel. Background Art

[0002] The thickness of the integral ultra-thin resin grinding wheel is generally 0.06 mm-0.5 mm, and it has no matrix. This type of grinding wheel is mainly suitable for high-precision cutting and grooving of optical glass, ceramics, and semiconductor packaging materials. This type of grinding wheel has the advantages of good self-sharpening, high cutting efficiency, and excellent cutting quality. It is an indispensable tool for achieving efficient, energy-saving, high-precision and automated cutting processing. In fast and efficient grinding, the impact force, grinding force, and grinding heat experienced by the grinding wheel per unit time increase significantly. The performance of the resin grinding wheel will be affected by thermal damage, resulting in a decrease in its rigidity. In the precision processing of materials such as glass, ceramics, and semiconductor packaging, how to improve the rigidity, impact resistance, and high temperature resistance of diamond resin grinding wheels is a major issue facing the current grinding field.

[0003] CN105437090A enhances the rigidity and strength of resin-bonded grinding wheels by adding chopped carbon fibers, improving their impact resistance and grinding efficiency. CN104690654A improves the chip holding capacity of resin-bonded grinding wheels by increasing their porosity, reducing workpiece burns. However, these ultra-thin resin-bonded grinding wheels are prepared by naturally cooling at room temperature, and neither study examines the effect of the quenching process on their rigidity.

[0004] Quenching is a commonly used heat treatment method that can significantly improve the hardness and rigidity of metal materials. Existing resin grinding wheels are processed by cooling at room temperature or quenching in water to process thermoformed resin grinding wheels. However, these methods have drawbacks in that the cooling method is simple, the cooling rate is uncontrollable, and some special cooling process requirements cannot be met. Due to the relatively complex material composition and structure of integral ultra-thin resin grinding wheels, existing research on the improvement of grinding wheel performance through quenching is also rare. Summary of the Invention

[0005] In response to the above technical problems, the present invention proposes a high-rigidity resin grinding wheel and a preparation method thereof. To achieve the above objectives, the present invention provides an ultra-thin and ultra-hard resin grinding wheel for high-speed cutting and a preparation method thereof.

[0006] In order to achieve the above object, the technical solution of the present invention is achieved as follows:

[0007] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0008] (1) The raw materials of the resin grinding wheel including diamond, corundum, phenolic resin powder and polycarbonate powder are weighed according to the formula, mixed evenly, and placed in a mold for molding to make a grinding wheel blank; phenolic resin is a resin binder, polycarbonate is an additive, diamond and corundum are abrasives, and polycarbonate is used to blend and modify the phenolic resin. The two have good compatibility. Phenolic resin has strong high temperature resistance and high carbonization. Polycarbonate has good heat resistance, impact resistance, oxidation resistance and other properties. After blending and modification, the strength and impact resistance of the phenolic resin-based grinding wheel are improved. Diamond has the characteristics of high hardness, high strength and strong grinding ability. Therefore, it is mainly used for grinding high and hard alloys, non-metallic materials, cutting hard and brittle cemented carbides, non-metallic minerals, etc. Corundum has good thermal stability, toughness and impact resistance. Corundum diamond resin grinding wheel has the characteristics of high strength, high hardness, high wear resistance, and is suitable for grinding in high temperature environments. Therefore, it can adapt to the grinding of various complex shapes and structures. Diamond resin grinding wheel is a grinding wheel specially used for grinding high and hard alloys, non-metallic materials and other materials.

[0009] (2) heating and heat-insulating the grinding wheel blank obtained in step (1) to obtain a primary finished product;

[0010] (3) The resin grinding wheel obtained in step (2) is quickly put into a program-controlled gas quenching device for quenching, and then post-processed to obtain a finished product.

[0011] The molding conditions in step (1) are: temperature 160-200°C, pressure 100-200 MPa, and time 5-10 min.

[0012] Preferably, the raw materials of the grinding wheel in step (1) include 20-30 parts by weight of diamond, 25-35 parts of corundum, 35-50 parts of phenolic resin powder, and 3-10 parts of polycarbonate powder.

[0013] Preferably, the diamond particle size is M10 / 20-M30 / 40, and the corundum particle size is W7-W20.

[0014] Preferably, the raw materials further comprise the following parts by weight: 5-10 parts of copper powder with a particle size of 400 mesh, and 5-10 parts of graphite powder with a particle size of 1000 mesh.

[0015] Adding copper powder to resin grinding wheels can improve the structural properties of the grinding wheel, thereby improving the performance indicators of the grinding wheel. Copper powder can promote the improvement of the thermal stability, shock resistance and grinding resistance of the grinding wheel, thereby increasing the service life of the grinding wheel. At the same time, it can also improve the structure of the grinding wheel, increase the density of the grinding wheel, and improve the wear resistance of the entire grinding wheel.

[0016] Because graphite has lubricating properties, it can reduce friction between the grinding wheel and the workpiece, avoid overheating damage, and thus extend the service life of the grinding wheel; graphite has thermal and electrical conductivity properties, which can quickly dissipate heat energy, preventing the grinding wheel from expanding and contracting due to heat and causing problems such as sticking and cracking, and further improving the accuracy and stability of the grinding wheel.

[0017] Preferably, the temperature of the heating in step (2) is 160°C-200°C, and the holding time is 5-10 minutes. The heating temperature is between the glass transition temperature and the decomposition temperature of polycarbonate. The holding time is a certain period of time so that the polymer chains inside the resin grinding wheel are fully relaxed, physically cross-linked and interpenetrated, and fused into a whole.

[0018] Preferably, the atmosphere of the quenching treatment in step (3) is a mixed gas of nitrogen and carbon dioxide, and the quenching treatment conditions are: a gas pressure of the mixed gas of 1-3 MPa, a temperature of -185°C to -60°C, a flow rate of 10-50 L / min, and a quenching time of 5-10 min.

[0019] This gas mixture has excellent cooling properties. The cooling temperature can be controlled by adjusting the ratio of nitrogen and carbon dioxide, and the cooling rate can be controlled by adjusting the airflow pressure and flow rate, achieving controlled cooling of the workpiece with greater precision, thereby achieving workpieces with specific surface textures and hardness, and improving the quenching effect. Cooling in gas is more uniform than cooling in liquid, achieving uniform cooling from the surface to the inner layers, resulting in minimal distortion during gas quenching. Furthermore, the surface cleanliness of the treated grinding wheel is high, eliminating the need for subsequent cleaning, making this a clean heat treatment technology.

[0020] Preferably, the post-processing in step (3) is to use an inner hole processing grinder and an outer cylindrical processing grinder to obtain a finished resin grinding wheel.

[0021] The high-rigidity resin grinding wheel prepared by the above method is used in the precision processing of glass, ceramics, and semiconductor packaging materials.

[0022] The present invention has the following beneficial effects:

[0023] 1. The resin grinding wheel prepared by the special quenching process of the present invention has the original characteristics of high grinding efficiency and good self-sharpening, while also improving its rigidity and hardness and other properties, thereby improving the dimensional accuracy of the cut product;

[0024] 2. The quenching process can be flexibly adjusted according to the material and size of different resin-bonded grinding wheels, and has a wide range of applications. Compared with existing liquid quenching and gas quenching processes, the advantages of the present invention are: on the one hand, the use of mixed gas as the quenching medium can adjust the quenching temperature, achieve rapid cooling of the grinding wheel, and improve the quenching effect; on the other hand, because the cooling rate of the mixed gas can be adjusted by temperature and airflow rate, it can achieve quenching treatment of the grinding wheel at different cooling rates to meet the requirements of different product performance.

[0025] 3. This resin grinding wheel has the advantages of good wear resistance, good toughness, long life, good thermal conductivity, high hardness and strength, and high cutting accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 This is an appearance diagram of the resin grinding wheel for cutting glass prepared by the present invention.

[0028] Figure 2 To adopt Figure 1 Effect picture of resin grinding wheel cutting glass.

[0029] Figure 3 This is the effect diagram of glass cutting using the resin grinding wheel in comparative example 1. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without creative work are within the scope of protection of the present invention.

[0031] The model of the phenolic resin powder is PR-56052, the model of the polycarbonate is 1300-10, and the weight content of Al2O3 in the corundum is 95%.

[0032] Example 1

[0033] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0034] 1) Weigh the raw materials according to the formula, mix them evenly, put them into the mold and press them into the grinding wheel blank. The molding process is as follows: the molding temperature is 180℃, the pressure is 100MPa, and the time is 10min;

[0035] The raw materials, by weight, include 20 parts of diamond (with a particle size of M10 / 20), 35 parts of phenolic resin, 7 parts of polycarbonate, and 30 parts of corundum raw material (with a particle size of W7).

[0036] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 160° C., and maintaining the temperature for 10 minutes to obtain a primary finished product;

[0037] 3) The primary finished resin grinding wheel obtained in step 2) is quickly placed in a mixed gas quenching device composed of nitrogen and carbon dioxide for quenching treatment. The quenching process is as follows: the mixed gas has a gas pressure of 1 MPa, a temperature of -180°C, a flow rate of 30 L / min, and a quenching time of 7.5 min.

[0038] After quenching, the inner hole processing grinder and the outer cylindrical processing grinder are used for processing to obtain the finished resin grinding wheel.

[0039] Example 2

[0040] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0041] 1) Weigh the raw materials according to the formula, mix them evenly, put them into the mold and press them into the grinding wheel blank. The molding process is as follows: the molding temperature is 160℃, the pressure is 150MPa, and the time is 5min;

[0042] The raw materials include 30 parts by weight of diamond (with a particle size of M30 / 40), 45 parts of phenolic resin, 3 parts of polycarbonate, and 30 parts of corundum (with a particle size of W14).

[0043] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 160° C., and maintaining the temperature for 10 minutes to obtain a primary finished product;

[0044] 3) The primary finished resin grinding wheel obtained in step 2) is quickly placed in a mixed gas quenching device composed of nitrogen and carbon dioxide for quenching treatment. The quenching process is as follows: the gas pressure of the mixed gas is 2 MPa, the temperature is -60°C, the flow rate is 10 L / min, and the quenching time is 5 min.

[0045] After quenching, the inner hole processing grinder and the outer cylindrical processing grinder are used for processing to obtain the finished resin grinding wheel.

[0046] Example 3

[0047] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0048] 1) Weigh the raw materials according to the formula, mix them evenly, put them into the mold and press them into the grinding wheel blank. The molding process is as follows: the molding temperature is 180℃, the pressure is 150MPa, and the time is 7.5min;

[0049] The raw materials include 25 parts by weight of diamond (particle size M10 / 20), 50 parts by weight of phenolic resin, 10 parts by weight of polycarbonate, and 35 parts by weight of corundum (particle size W20).

[0050] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 180° C., and maintaining the temperature for 8.5 minutes to obtain a primary finished product;

[0051] 3) The primary finished resin grinding wheel obtained in step 2) is quickly placed in a mixed gas quenching device composed of nitrogen and carbon dioxide for quenching treatment. The quenching process is as follows: the mixed gas has a gas pressure of 2 MPa, a temperature of -140°C, a flow rate of 30 L / min, and a quenching time of 10 min.

[0052] After quenching, use internal hole processing grinder and external cylindrical processing grinder to obtain resin grinding wheel finished products, such as Figure 1 The resin grinding wheel shown has a complete and smooth appearance, a compact and uniform texture, and no cracks.

[0053] Example 4

[0054] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0055] 1) Weigh the raw materials according to the formula, mix them evenly, put them into a mold and press them into a grinding wheel blank. The molding process is as follows: the molding temperature is 200℃, the pressure is 200MPa, and the time is 5min;

[0056] The raw materials include, by weight, 20 parts of diamond (particle size M10 / 20), 35 parts of phenolic resin, 7 parts of polycarbonate, 30 parts of corundum (particle size W20), 5 parts of copper powder (particle size 400 mesh), and 7.5 parts of graphite powder (particle size 1000 mesh).

[0057] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 180° C., and maintaining the temperature for 7 minutes to obtain a primary finished product;

[0058] 3) The primary finished resin grinding wheel obtained in step 2) is quickly placed in a mixed gas quenching device composed of nitrogen and carbon dioxide for quenching treatment. The quenching process is as follows: the mixed gas has a gas pressure of 3 MPa, a temperature of -180°C, a flow rate of 50 L / min, and a quenching time of 5 min.

[0059] After quenching, the inner hole processing grinder and the outer cylindrical processing grinder are used for processing to obtain the finished resin grinding wheel.

[0060] Example 5

[0061] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0062] 1) Weigh the raw materials according to the formula, mix them evenly, put them into a mold and press them into a grinding wheel blank. The molding process is as follows: the molding temperature is 200℃, the pressure is 150MPa, and the time is 7.5min;

[0063] The raw materials include 30 parts by weight of diamond (particle size M30 / 40), 45 parts of phenolic resin, 3 parts of polycarbonate, 25 parts of corundum (particle size W14), 10 parts of copper powder (particle size 400 mesh), and 5 parts of graphite powder (particle size 1000 mesh).

[0064] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 200° C., and maintaining the temperature for 10 minutes to obtain a primary finished product;

[0065] 3) The primary finished resin grinding wheel obtained in step 2) is quickly placed in a mixed gas quenching device composed of nitrogen and carbon dioxide for quenching treatment. The quenching process is as follows: the mixed gas has a gas pressure of 1 MPa, a temperature of -60°C, a flow rate of 10 L / min, and a quenching time of 10 min.

[0066] After quenching, the inner hole processing grinder and the outer cylindrical processing grinder are used for processing to obtain the finished resin grinding wheel.

[0067] Example 6

[0068] A method for preparing a high-rigidity resin grinding wheel comprises the following steps:

[0069] 1) Weigh the raw materials according to the formula, mix them evenly, put them into a mold and press them into a grinding wheel blank. The molding process is as follows: the molding temperature is 160℃, the pressure is 100MPa, and the time is 7.5min;

[0070] The raw materials include, by weight, 25 parts of diamond (particle size M10 / 20), 50 parts of phenolic resin, 10 parts of polycarbonate, 35 parts of corundum (particle size W20), 7.5 parts of copper powder (particle size 400 mesh), and 10 parts of graphite powder (particle size 1000 mesh).

[0071] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 200° C., and maintaining the temperature for 5 minutes to obtain a primary finished product;

[0072] 3) The primary finished resin grinding wheel obtained in step 2) is quickly placed in a mixed gas quenching device composed of nitrogen and carbon dioxide for quenching treatment. The quenching process is as follows: the gas pressure of the mixed gas is 1 MPa, the temperature is -140°C, the flow rate is 30 L / min, and the quenching time is 5 min.

[0073] After quenching, the inner hole processing grinder and the outer cylindrical processing grinder are used for processing to obtain the finished resin grinding wheel.

[0074] Comparative Example 1

[0075] A method for preparing a resin grinding wheel comprises the following steps:

[0076] 1) Weigh the raw materials according to the formula, mix them evenly, put them into the mold and press them into the grinding wheel blank. The molding process is as follows: the molding temperature is 180℃, the pressure is 150MPa, and the time is 7.5min;

[0077] The raw materials include 25 parts by weight of diamond (particle size M10 / 20), 50 parts by weight of phenolic resin, 10 parts by weight of polycarbonate, and 35 parts by weight of corundum (particle size W20).

[0078] 2) placing the grinding wheel blank prepared in step 1) in a heating device, heating it to 180° C., and maintaining the temperature for 8.5 minutes to obtain a primary finished product;

[0079] 3) Cooling the pre-finished resin grinding wheel obtained in step 2) in air at room temperature.

[0080] After quenching, the inner hole processing grinder and the outer cylindrical processing grinder are used for processing to obtain the finished resin grinding wheel.

[0081] Performance testing:

[0082] Cutting test conditions:

[0083] The cutting performance of the grinding wheels manufactured by the methods in the above embodiments and comparative examples was tested;

[0084] The prepared sample was cut into 1 mm thick Schott glass using a DISCO dicing machine model DAD3350 at a rotation speed of 25000 rpm and a feed speed of 8 mm / s, and the dimensional accuracy of the cut glass was tested.

[0085] Test resin grinding wheel sample specifications: diameter 56mm*thickness 0.15mm*inner hole 40mm

[0086] Dicing machine model: Disco DAD3350

[0087] Cutting parameters:

[0088] Grinding wheel spindle speed: 25000rpm

[0089] Grinding wheel feed speed: 8mm / s

[0090] Workpiece material: Schott glass

[0091] Workpiece size: length 75mm*width 75mm*thickness 1mm

[0092] Workpiece size after cutting: 5*5*1mm

[0093] Workpiece fixing method: UV film bonding

[0094] Cutting fluid: deionized water

[0095] Cutting fluid flow: spray water flow 1.0L / min, cooling water flow 1.5L / min

[0096] The grinding wheel is used to cut the glass, and at least 100 workpiece cutting experiments are carried out to measure the width accuracy of the cutting seam and the wear data of the grinding wheel.

[0097] Service life test:

[0098] In the above-mentioned cutting process, the service life is calculated by recording the cutting length and the outer diameter consumed by the grinding wheel. For example, the service life of the grinding wheel can be calculated based on the number of microns consumed by the outer diameter of the resin grinding wheel when cutting a length of 10 meters.

[0099] Compressive strength test:

[0100] The test conditions are:

[0101] The test sample strips were prepared with a length × width × height of 41.0 mm × 6.0 mm × 4.4 mm. The flexural strength of the prepared sample strips was measured on a single-lever (three-point flexural) flexural strength tester of model KIJ5000 at a loading speed of 10 (±1) N / S.

[0102] Hardness test:

[0103] The test conditions are:

[0104] The prepared test sample strip has a length × width × height of 41.0 mm × 6.0 mm × 4.4 mm, and the prepared sample strip is tested on a Rockwell hardness tester for Rockwell hardness HRB with a load of 100 kg.

[0105] Heat resistance test:

[0106] The test conditions are as follows: in a thermogravimetric analyzer, under a nitrogen atmosphere, a nitrogen flow rate of 50 mL / min, a heating rate of 20°C / min, and a test temperature range of 30-800°C.

[0107] Table 1 Cutting performance comparison data of resin grinding wheel of embodiment and comparative example are shown in Table

[0108]

[0109] It can be seen from the above table that: compared with comparative example 1, under the process conditions of the present invention, especially under the quenching process conditions, Examples 1 and 3 not only have higher cutting accuracy and longer service life, but also have higher compressive strength, higher hardness and heat resistance, can meet the cutting requirements of brittle and hard materials, will not cause the grinding wheel to deform due to long-term heating, and are ideal tools for grinding hard and brittle materials.

[0110] The resin grinding wheel prepared by the method described in Example 3 has the following effect on cutting glass: Figure 2 As shown, the cutting marks are straight and smooth without burrs; the glass cutting effect of the resin grinding wheel prepared by the method described in Comparative Example 1 is as follows Figure 3 As shown, the cutting path is curved and the traces are burred. This shows that the quenching process of the present invention is a program-controlled quenching process. By carefully controlling the cooling rate of the resin grinding wheel, a higher surface hardness and structure are achieved, thereby improving its cutting accuracy. Rapid cooling can reduce the thermal stress within the resin grinding wheel, thereby reducing its deformation and cracking risks, and improving the strength, heat resistance, and durability of the grinding wheel, so that it can withstand the grinding heat of long-term use of the resin grinding wheel, thereby increasing its service life.

[0111] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for preparing a high-rigidity resin grinding wheel, characterized in that: The following steps are involved: (1) Weigh the raw materials of the resin grinding wheel including diamond, corundum, phenolic resin powder and polycarbonate powder according to the formula, mix them evenly, put them into a mold and press them into a grinding wheel blank; (2) heating and heat-insulating the grinding wheel blank obtained in step (1) to obtain a primary finished product; (3) The resin grinding wheel obtained in step (2) is quickly put into a program-controlled gas quenching device for quenching, and then post-processed to obtain a finished product; The atmosphere for the quenching treatment in step (3) is a mixed gas of nitrogen and carbon dioxide; the gas pressure of the mixed gas is 1-3 MPa, the temperature is -185°C to -60°C, the flow rate is 10-50 L / min, and the quenching time is 5-10 min.

2. The method for preparing a high-rigidity resin grinding wheel according to claim 1, wherein: The molding conditions in step (1) are: temperature 160-200°C, pressure 100-200 MPa, and time 5-10 min.

3. The method for preparing a high-rigidity resin grinding wheel according to claim 2, wherein: The raw materials of the grinding wheel in step (1) include 20-30 parts of diamond, 25-35 parts of corundum, 35-50 parts of phenolic resin powder, and 3-10 parts of polycarbonate powder, in parts by weight.

4. The method for preparing a high-rigidity resin grinding wheel according to claim 3, wherein: The diamond particle size is M10 / 20-M30 / 40, and the corundum particle size is W7-W20.

5. The method for preparing a high-rigidity resin grinding wheel according to claim 4, wherein: The raw materials further comprise the following parts by weight: 5-10 parts of copper powder and 5-10 parts of graphite powder.

6. The method for preparing a high-rigidity resin grinding wheel according to any one of claims 1 to 5, characterized in that: The temperature of the heating in step (2) is 160°C-200°C, and the time of the heat preservation treatment is 5-10 minutes.

7. The method for preparing a high-rigidity resin grinding wheel according to claim 6, wherein: The post-processing in step (3) is to use an internal hole processing grinder and an external cylindrical processing grinder to obtain a finished resin grinding wheel.

8. Application of the high-rigidity resin grinding wheel prepared by the method according to claim 7 in the precision processing of glass, ceramics and semiconductor packaging materials.

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