Sealing device for chip loading tube

Abstract

The application discloses a sealing device for a chip loading tube, which comprises a placing table, a conveying mechanism, a detection mechanism and a turnover mechanism. The placing table defines a placing space. The conveying mechanism is used for conveying the chip loading tube to a preset sealing position. The detection mechanism is used for detecting the placing angle of the chip loading tube. The turnover mechanism is adapted to rotate around a rotation axis according to the placing angle of the chip loading tube to turn the chip loading tube to a preset sealing angle. The sealing mechanism is used for blocking the open end of the chip loading tube. Thus, when the chip loading tube is opposite to the sealing mechanism, the placing angle of the chip loading tube can be corrected by the cooperation of the turnover mechanism and the detection mechanism, the shape of the open end of the chip loading tube can be matched with the shape of the sealing plug output by the sealing mechanism, the sealing mechanism can directly load the sealing plug into the chip loading tube, and the user does not need to manually adjust the placing angle of the chip loading tube compared with the prior art.

Description

Technical Field

[0001] This application relates to the field of container processing, and in particular to a sealing device for chip loading tubes. Background Technology

[0002] When using gravity-fed or turret-type production equipment for automated chip screening, marking, and visual inspection, the large number and small size of the chips prevent users from directly loading them into the equipment. The chips must first be loaded into chip loading tubes, which are then inserted into the equipment. The equipment can then retrieve the chips from the loading tubes and reload the processed chips back into them. The chip loading tubes have open ends; to prevent chips from falling out during transfer, both ends must be sealed.

[0003] In related technologies, most existing loading tubes have open openings that are square, circular, or other centrally symmetrical shapes. These tubes can be sealed by existing sealing devices at any angle. However, chip loading tubes have open openings that match the chip shape and are not centrally symmetrical. When using existing sealing devices to seal chip loading tubes, at certain placement angles, the sealing device cannot insert the sealing plug, requiring the user to manually adjust the tube's angle, thus affecting the sealing efficiency. Summary of the Invention

[0004] In order to improve the sealing efficiency of chip loading tubes by eliminating the need for users to manually adjust the placement angle of the chip loading tubes before sealing, this application provides a sealing device for chip loading tubes.

[0005] The sealing device for chip loading tubes provided in this application adopts the following technical solution:

[0006] A sealing device for a chip loading tube includes: a placement platform defining a placement space for placing the chip loading tube; a conveying mechanism disposed within the placement platform for conveying the chip loading tube placed in the placement space to a preset sealing position; a detection mechanism disposed within the placement platform for detecting the placement angle of the chip loading tube at the preset sealing position; a flipping mechanism disposed within the placement platform and opposite to the preset sealing position, the flipping mechanism having a clamping member for clamping the wall of the corresponding chip loading tube, and the clamping member being adapted to rotate about a rotation axis according to the placement angle of the chip loading tube to flip the chip loading tube to the preset sealing angle; and a sealing mechanism disposed on one side of the placement platform for inserting a sealing plug into the open end of the chip loading tube to seal the open end of the chip loading tube.

[0007] By adopting the above technical solution, when the chip loading tube is opposite to the sealing mechanism, the flipping mechanism and the detection mechanism work together to correct the placement angle of the chip loading tube. This allows the open shape of the chip loading tube to match the shape of the sealing plug output by the sealing mechanism. The sealing mechanism can then directly load the sealing plug into the chip loading tube. Compared with the existing technology, users do not need to manually adjust the placement angle of the chip loading tube, thereby improving the sealing efficiency of the chip loading tube.

[0008] Preferably, the flipping mechanism includes a drive shaft, a first driving member, and a clamping member. The drive shaft is fixedly connected to the output end of the first driving member. The first driving member is used to drive the drive shaft to rotate around the rotation axis. The clamping member is eccentrically mounted on the drive shaft. The drive shaft is used to drive the clamping member to flip the chip loading tube to a preset sealing angle.

[0009] By adopting the above technical solution, the clamping member is eccentrically installed on the drive shaft, and there is a gap between the clamping member and the central axis of the drive shaft. Since the outer contour shape of the cross-section of the chip loading tube is not centrally symmetrical, this setting allows the clamping member to be opposite to the preset outer peripheral wall of the chip loading tube. The clamping member can clamp the preset outer peripheral wall of the chip loading tube and rotate around the rotation axis to accurately rotate the chip loading tube to the preset sealing angle, thereby improving the consistency of the sealing effect of the sealing device.

[0010] Preferably, the flipping mechanism is further provided with a mounting base and a second driving member. The second driving member and the first driving member are both disposed on the mounting base. The second driving member is used to drive the mounting base to move the first driving member closer to or away from the chip loading tube.

[0011] By adopting the above technical solution, the second driving component drives the mounting base to move the first driving component closer to the chip loading tube. The first driving component can drive the clamping component to move via the transmission shaft, thereby reducing the distance between the clamping component and the chip loading tube, which helps the clamping component hold the chip loading tube. Conversely, the second driving component drives the mounting base to move the first driving component away from the chip loading tube. The first driving component can then drive the clamping component to move via the transmission shaft, thereby increasing the distance between the clamping component and the chip loading tube. This minimizes interference between the clamping component and the chip loading tube, preventing the chip loading tube from being unable to move out from the preset sealing position.

[0012] Preferably, the mounting base includes a first mounting plate, a second mounting plate, and a connecting plate, with the connecting plate connected between the first mounting plate and the second mounting plate; one end of the second driving member is fixedly connected to the platform, and the other end of the second mounting plate is fixedly connected to the second driving member; the first mounting plate is fixedly connected to the first driving member; the second driving member is retractably disposed between the platform and the mounting base, and the second driving member retracts or extends to drive the mounting base to move the first driving member closer to or away from the chip loading tube.

[0013] By adopting the above technical solution, by retracting the second driving member, the length of the second driving member is reduced, and the distance between the stage and the second mounting plate is reduced. Consequently, the second mounting plate can drive the first mounting plate closer to the stage via the connecting plate, allowing the first driving member mounted on the first mounting plate to move closer to the chip loading tube. This, in turn, allows the clamping member to move closer to the chip loading tube, facilitating the clamping member's gripping of the chip loading tube. Furthermore, by extending the second driving member, the length of the second driving member is increased, and the distance between the stage and the second mounting plate is increased. Consequently, the second mounting plate can drive the first mounting plate away from the stage via the connecting plate, allowing the first driving member mounted on the first mounting plate to move away from the chip loading tube. This, in turn, allows the clamping member to move away from the chip loading tube, enabling the clamping member to separate from the chip loading tube.

[0014] Preferably, the storage platform is provided with a movable baffle group at the conveying mechanism. The baffle group is regularly distributed and divides the storage space into a pre-loading space, at least one buffer space, and a sealing space. The pre-loading space is suitable for loading chip tubes to be sealed. The buffer space is suitable for buffering the conveyed chip tubes. The preset sealing position is located in the sealing space. The chip tubes in the pre-loading space pass through multiple buffer spaces in sequence and are sealed in the sealing space. The baffle group blocks the chip tubes conveyed by the conveying mechanism in sequence, so that the chip tubes are buffered and stored in the buffer space.

[0015] By adopting the above technical solution, the pre-loading space and the sealing space are separated, ensuring that the unsealed chip loading tubes are separated from the chip loading tubes being sealed by the sealing mechanism. This allows the sealed chip loading tubes to be output from the sealing space to the outside of the sealing device, reducing the difficulty for the sealing device to separate the sealed chip loading tubes from the unsealed ones. Furthermore, by using a baffle assembly to create multiple buffer spaces between the pre-loading space and the sealing space, the chip loading tubes in the pre-loading space can be sequentially arranged within these buffer spaces as they move towards the sealing space. This allows the chip loading tubes in the pre-loading space to move into the sealing space in an orderly manner, facilitating the sealing mechanism to seal the chip loading tubes in the sealing space according to their order. This reduces the number of chip loading tubes that are not sealed.

[0016] Preferably, the baffle group includes a first baffle, a second baffle, and a third baffle. Along the conveying direction of the conveying mechanism, the first baffle, the second baffle, and the third baffle are spaced apart in sequence. The first baffle is located between the pre-loading space and the first buffer space, the second baffle is located between the first buffer space and the second buffer space, and the third baffle is located between the second buffer space and the sealing space.

[0017] By adopting the above technical solution, two buffer spaces can be formed between the pre-loading space and the sealing space through the cooperation of the first baffle, the second baffle and the third baffle. While ensuring that the chip loading tube completes the sorting after passing through the first buffer space and the second buffer space, the number of buffer spaces can be effectively reduced, thereby reducing the size of the sealing device in the first direction. This makes the structure of the sealing device more compact and makes it easier to arrange the sealing device in a narrow space.

[0018] Preferably, the first baffle, the second baffle, and the third baffle are all adapted to move along a second direction of the sealing device, wherein the first direction and the second direction are perpendicular to each other; along the second direction, the first baffle is configured to rise when the number of chip loading tubes in the first buffer space is less than a first preset number, so as to allow the chip loading tubes in the pre-loading space to move into the first buffer space, and to fall back when the number of chip loading tubes in the first buffer space is greater than a second preset number, so as to prevent the chip loading tubes in the pre-loading space from moving into the first buffer space; the second baffle is configured to move when the number of chip loading tubes in the second buffer space is less than a second preset number. The third baffle is configured to rise when a third preset number of chip loading tubes are reached, allowing the chip loading tubes in the first buffer space to move into the second buffer space, and to fall back when the number of chip loading tubes in the second buffer space exceeds a fourth preset number, preventing the chip loading tubes in the first buffer space from moving into the second buffer space; the third baffle is configured to rise when the chip loading tubes in the sealing space are sealed, allowing the chip loading tube closest to the sealing space in the second buffer space to move into the sealing space, and to fall back when there are chip loading tubes to be sealed in the sealing space, preventing the chip loading tubes in the second buffer space from moving into the sealing space.

[0019] By adopting the above technical solution, by raising or lowering the first baffle and the second baffle according to the number of chip loading tubes in the first buffer space and the second buffer space respectively, it is possible to avoid the accumulation of chip loading tubes in the first buffer space and the second buffer space due to an excessive number of chip loading tubes. It is also possible to prevent the sealing operation of the sealing device from being halted due to an insufficient number of chip loading tubes in the first buffer space or the second buffer space. This helps to sort the chip loading tubes in the first buffer space and the second buffer space and can also improve the sealing efficiency of the sealing device.

[0020] Furthermore, by raising or lowering the third baffle according to the sealing status of the chip loading tubes in the sealing space, it can be ensured that the sealing device seals only one chip loading tube at a time. This facilitates the sealing device to detect and manage the sealing effect of the chip loading tubes, thereby further reducing the number of chip loading tubes that are not sealed among multiple chip loading tubes, and thus improving the user experience of the sealing device.

[0021] Preferably, the detection mechanism includes an angle detection element, a quantity detection element, and a sealing plug detection element. The angle detection element is used to detect the placement angle of the chip loading tube located at the preset sealing position. The quantity detection element is used to detect the number of chip loading tubes in the first buffer space, the second buffer space, and the sealing space. The sealing plug detection element is used to detect whether the chip loading tube located at the preset sealing position is sealed. The sealing device is configured such that when the sealing plug detection element detects that the chip loading tube at the preset sealing position is not sealed, it controls the sealing mechanism to insert the sealing plug into the corresponding chip loading tube.

[0022] By adopting the above technical solution and with the cooperation of multiple testing components from the testing agency, the sealing device can automatically seal the chip loading tube based on the data detected by the testing agency, reducing the manual operation required for using the sealing device, improving the ease of use of the sealing device, and increasing the sealing efficiency of the chip loading tube.

[0023] Preferably, the conveying mechanism includes a first conveyor belt and a second conveyor belt. The first conveyor belt extends into the pre-loading space, the first buffer space, and the second buffer space. The first conveyor belt is used to convey the chip loading tubes in the pre-loading space to the first buffer space, and to convey the chip loading tubes in the first buffer space to the second buffer space. The second conveyor belt extends into the second buffer space and the sealing space. The second conveyor belt is used to convey the chip loading tubes to be sealed in the second buffer space to the sealing space, and to output the sealed chip loading tubes in the sealing space.

[0024] By adopting the above technical solution, the chip loading tubes can be conveyed step-by-step from the pre-loading space into the sealing space via the cooperation of the first and second conveyor belts. The multiple conveyor belts in the conveying mechanism ensure that each conveyor belt operates independently, allowing the conveying of chip loading tubes from the pre-loading space to the first buffer space, from the first buffer space to the second buffer space, and from the second buffer space to the sealing space to be independent. This enables the conveying mechanism to transport chip loading tubes more efficiently. Furthermore, the asynchronous start-stop rhythms of the first and second conveyor belts, allowing them to operate independently, eliminate the need for the conveying mechanism to simultaneously move the chip loading tubes in the pre-loading space, the first buffer space, the second buffer space, and the sealing space, thus reducing the energy consumption of the sealing device.

[0025] Preferably, the sealing device for the chip loading tube further includes: a limiting mechanism, the limiting mechanism being disposed on the placement stage, the limiting mechanism including a first limiting component and a second limiting component; the first limiting component including a third driving member, a fourth driving member, a stop member and a limiting member, the stop member and the limiting member being spaced apart along the first direction, the third driving member being connected and cooperating with the stop member and used to drive the stop member to extend into or out of the sealing space, the fourth driving member being connected and cooperating with the limiting member and used to drive the limiting member to extend into or out of the sealing space ... fourth driving member being connected and cooperating with the limiting member and used to drive the limiting member to extend into or out of the sealing space, the fourth driving member being connected and cooperating with the limiting member and used to drive the limiting member to extend into or out of the sealing space, the fourth driving member being connected and cooperating with the limiting member and used to drive the limiting member to extend into or out of the sealing space, the fourth driving member being connected and cooperating with the limiting member and used to drive the limiting member to extend into or out of the sealing space, the fourth driving member being connected and cooperating with The limiting members are all adapted to abut against the side wall of the chip loading tube located between the stop member and the limiting member to limit the chip loading tube to the preset sealing position; the second limiting component includes a squeezing member, a fifth driving member and a squeezing plate, the squeezing plate is disposed in the second buffer space, the fifth driving member is connected and cooperates with the squeezing member and is used to drive the squeezing member to move closer to or away from the squeezing plate, and by the squeezing member moving closer to the squeezing plate, the squeezing member squeezes the chip loading tube adjacent to the chip loading tube closest to the sealing space in the second buffer space.

[0026] By adopting the above technical solution, the first limiting component is used to limit the chip loading tube in the sealing space to a preset sealing position, and the second limiting component is used to limit the number of chip loading tubes that move from the second buffer space to the sealing space each time the third baffle is raised, so that the sealing device can accurately and orderly seal multiple chip loading tubes in the storage space.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. When the chip loading tube is opposite to the sealing mechanism, the placement angle of the chip loading tube is corrected by the cooperation of the flipping mechanism and the detection mechanism. This makes the shape of the open end of the chip loading tube match the shape of the sealing plug output by the sealing mechanism. The sealing mechanism can directly load the sealing plug into the chip loading tube. Compared with the existing technology, the user does not need to manually adjust the placement angle of the chip loading tube, thereby improving the sealing efficiency of the chip loading tube.

[0029] 2. The pre-loading space and sealing space are separated to ensure that unsealed chip tubes are separated from those being sealed by the sealing mechanism. This allows sealed chip tubes to exit from the sealing space and out of the sealing device, reducing the difficulty for the sealing device to separate sealed chip tubes from unsealed ones. Furthermore, by using baffles to create multiple buffer spaces between the pre-loading space and the sealing space, the chip tubes in the pre-loading space can be sequentially arranged within these buffer spaces as they move towards the sealing space. This ensures that the chip tubes in the pre-loading space move orderly into the sealing space, facilitating the sealing mechanism to seal the chip tubes in the sealing space according to their order. This reduces the number of unsealed chip tubes among multiple chip tubes.

[0030] 3. Through the cooperation of the first and second conveyor belts, the chip loading tubes can be conveyed step by step from the pre-loading space into the sealing space. The multiple conveyor belts in the conveying mechanism ensure that each conveyor belt operates independently, allowing the conveying of chip loading tubes from the pre-loading space to the first buffer space, from the first buffer space to the second buffer space, and from the second buffer space to the sealing space to be independent. This enables the conveying mechanism to transport chip loading tubes more efficiently. Furthermore, the asynchronous start-stop rhythms of the first and second conveyor belts, allowing them to operate independently, eliminate the need for the conveying mechanism to simultaneously move the chip loading tubes in the pre-loading space, the first buffer space, the second buffer space, and the sealing space, thus reducing the energy consumption of the sealing device. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the sealing device according to an embodiment of this application;

[0032] Figure 2 This is a schematic diagram of the sealing device according to an embodiment of this application from another angle;

[0033] Figure 3 This is a schematic diagram of the sealing device according to the embodiments of this application after the fixing plate has been removed;

[0034] Figure 4 This is a top view of the sealing device according to the embodiments of this application after the fixing plate has been removed;

[0035] Figure 5 yes Figure 4 Sectional view at point AA;

[0036] Figure 6 yes Figure 5 Enlarged view of point B in the middle;

[0037] Figure 7 This is a schematic diagram of the flipping mechanism according to an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of the sealing mechanism according to an embodiment of this application;

[0039] Figure 9 This is a schematic diagram of the sealing mechanism according to an embodiment of this application from another angle.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100. Sealing device; 200. Chip loading tube;

[0042] 10. Storage platform; 101. Storage space; 102. Pre-loading space; 103. First buffer space; 104. Second buffer space; 105. Sealing space;

[0043] 20. Conveying mechanism; 201. First conveyor belt; 202. Second conveyor belt;

[0044] 30. Testing institutions; 301. Angle testing components; 302. Quantity testing components; 303. Sealing plug testing components;

[0045] 40. Tilting mechanism; 401. Clamping component; 402. Drive shaft; 403. First driving component; 404. Mounting base; 405. Second driving component; 406. First mounting plate; 407. Second mounting plate; 408. Connecting plate;

[0046] 50. Sealing mechanism; 501. Sealing assembly; 502. Feeding assembly; 503. Cutting assembly;

[0047] 60. Baffle assembly; 601. First baffle; 602. Second baffle; 603. Third baffle; 604. Fixing plate;

[0048] 70. Limiting mechanism; 710. First limiting component; 711. Stop; 712. Limiting component; 720. Second limiting component; 721. Extrusion component; 722. Fifth driving component; 723. Extrusion plate. Detailed Implementation

[0049] The following is in conjunction with the appendix Figures 1-9 This application will be described in further detail.

[0050] This application discloses a sealing device 100 for a chip loading tube 200. The sealing device 100 is used to seal the open ends of the chip loading tube 200. The chip loading tube 200 can facilitate chip storage and transfer. In some embodiments, the outer contour of the cross-section of the chip loading tube 200 can be approximately rectangular. For example, the outer contour of the cross-section of the chip loading tube 200 can be set to a "U" shape, and the shape of the open end of the chip loading tube 200 can match the shape of the chip.

[0051] Reference Figures 1-9 The sealing device 100 includes a placement platform 10, a conveying mechanism 20, a detection mechanism 30, a flipping mechanism 40, and a sealing mechanism 50. The placement platform 10 defines a placement space 101 for placing chip loading tubes 200. The conveying mechanism 20 is disposed within the placement platform 10 and is used to convey the chip loading tubes 200 placed in the placement space 101 to a preset sealing position, where the chip loading tubes 200 can be sealed. The conveying mechanism 20 can sequentially convey multiple chip loading tubes 200 from the placement space 101 to the preset sealing position, so that multiple chip loading tubes 200 are sealed sequentially. Furthermore, the conveying mechanism 20 is also used to output the sealed chip loading tubes 200 outside the sealing device 100.

[0052] The detection mechanism 30 is set on the platform 10 and is used to detect the placement angle of the chip loading tube 200 at the preset sealing position. The flipping mechanism 40 is set on the platform 10 and is opposite to the preset sealing position. The flipping mechanism 40 has a clamping member 401, which is used to clamp the tube wall of the corresponding chip loading tube 200. The clamping member 401 is adapted to rotate around the rotation axis according to the placement angle of the chip loading tube 200 to flip the chip loading tube 200 to the preset sealing angle.

[0053] A sealing mechanism 50 is located on one side of the storage platform 10 and is used to cut the sealing strip into a sealing plug, and to drive the sealing plug into the storage space 101 and insert the sealing plug into the open end of the chip loading tube 200 to seal the open end of the chip loading tube 200. Through the cooperation of the detection mechanism 30 and the flipping mechanism 40, the flipping mechanism 40 can correct the placement angle of the chip loading tube 200 based on the detection data from the detection mechanism 30. When the placement angle of the chip loading tube 200 is a preset sealing angle, the shape of the open end of the chip loading tube 200 matches the shape of the sealing plug output by the sealing mechanism 50. The sealing mechanism 50 can directly insert the sealing plug into the chip loading tube 200. Compared with the prior art, this eliminates the need for the user to manually adjust the placement angle of the chip loading tube 200, thereby improving the sealing efficiency of the chip loading tube 200.

[0054] It should be noted that, see Figure 8 , Figure 9 The sealing mechanism 50 may include a sealing assembly 501, a feeding assembly 502, and a cutting assembly 503. The feeding assembly 502 is used to convey the sealing strip to the sealing assembly 501. The cutting assembly 503 is disposed between the feeding assembly 502 and the sealing assembly 501. The cutting assembly 503 can cut the sealing strip that has passed through the cutting assembly 503 to cut the sealing strip into a sealing plug. The sealing assembly 501 can be disposed opposite to the open end of the chip loading tube 200 to be sealed. After the sealing plug moves to the sealing assembly 501, it is pushed into the storage space 101 by the sealing assembly 501. After the sealing plug is pushed into the storage space 101, it can be installed into the open end of the chip loading tube 200, thereby sealing the chip loading tube 200.

[0055] Additionally, the storage space 101 has a support surface for supporting the chip loading tube 200, and the support surface can be tilted. When the sealing device 100... Figure 1 When placed in the indicated direction, the support surface can refer to the bottom wall of the storage space 101, and the chip loading tube 200 can move along the support surface. From the end closest to the sealing mechanism 50 to the end furthest from the sealing mechanism 50, the support surface can be inclined downwards. When one end of the chip loading tube 200 is sealed and the chip loading tube 200 contains a chip, this arrangement can, under the action of gravity, minimize the risk of the chip falling out from the end of the chip loading tube 200 to be sealed.

[0056] Furthermore, the sealing device 100 also includes a controller, which is communicatively connected to both the detection mechanism 30 and the flipping mechanism 40. After receiving the detection data from the detection mechanism 30, the controller can determine the placement angle of the chip loading tube 200 based on the detection data. The controller can also control the clamping member 401 to rotate around the rotation axis based on the placement angle of the chip loading tube 200 to flip the chip loading tube 200 to a preset sealing angle.

[0057] See Figure 7In some embodiments of this application, the flipping mechanism 40 may further include: a drive shaft 402 and a first driving member 403. The drive shaft 402 is fixedly connected to the output end of the first driving member 403. The first driving member 403 is used to drive the drive shaft 402 to rotate around a rotation axis. The drive shaft 402 may be coaxially arranged with the output end of the first driving member 403, and the rotation axis of the drive shaft 402 may be the central axis of the drive shaft 402. A clamping member 401 is eccentrically mounted on the drive shaft 402, and the drive shaft 402 is used to drive the clamping member 401 to flip the chip loading tube 200 to a preset sealing angle. The first driving component 403 can be configured as a rotary cylinder, and the transmission shaft 402 can extend into the storage space 101. By eccentrically mounting the clamping component 401 on the transmission shaft 402, there is a gap between the clamping component 401 and the central axis of the transmission shaft 402. Since the outer contour shape of the cross-section of the chip loading tube 200 is non-centrally symmetrical, this arrangement can make the clamping component 401 face the preset outer peripheral wall of the chip loading tube 200. The clamping component 401 can clamp the preset outer peripheral wall of the chip loading tube 200 and rotate around the rotation axis to accurately rotate the chip loading tube 200 to the preset sealing angle, thereby improving the consistency of the sealing effect of the sealing device 100.

[0058] See Figure 7 In some embodiments of this application, the flipping mechanism 40 may further include a mounting base 404 and a second driving member 405. Both the second driving member 405 and the first driving member 403 are disposed on the mounting base 404. The second driving member 405 drives the mounting base 404 to move the first driving member 403 closer to or away from the chip loading tube 200. The mounting base 404 provides a mounting position for the first driving member 403, and the movement of the mounting base 404 can drive the first driving member 403 to move.

[0059] The second driving component 405 drives the mounting base 404 to move the first driving component 403 closer to the chip loading tube 200. The first driving component 403 can drive the clamping component 401 to move via the transmission shaft 402, thereby reducing the distance between the clamping component 401 and the chip loading tube 200, which helps the clamping component 401 to hold the chip loading tube 200. The second driving component 405 drives the mounting base 404 to move the first driving component 403 away from the chip loading tube 200. The first driving component 403 can drive the clamping component 401 to move via the transmission shaft 402, thereby increasing the distance between the clamping component 401 and the chip loading tube 200. This can minimize interference between the clamping component 401 and the chip loading tube 200, which could prevent the chip loading tube 200 from being removed from the preset sealing position.

[0060] See Figure 7In some embodiments of this application, the mounting base 404 includes a first mounting plate 406, a second mounting plate 407, and a connecting plate 408. The first mounting plate 406 is fixedly connected to the first driving member 403, that is, the first mounting plate 406 can provide a mounting position for the first driving member 403. The second mounting plate 407 is fixedly connected to the second driving member 405, that is, the second mounting plate 407 can provide a mounting position for the second driving member 405. The connecting plate 408 is connected between the first mounting plate 406 and the second mounting plate 407. The connecting plate 408 can transmit the displacement of the second mounting plate 407 to the first mounting plate 406, so that the mounting base 404 drives the first driving member 403 to move.

[0061] The end of the second driving member 405 furthest from the second mounting plate 407 is fixedly connected to the stage 10. The second driving member 405 is telescopically disposed between the stage 10 and the mounting base 404. By retracting or extending the second driving member 405, the mounting base 404 is driven to move the first driving member 403 closer to or away from the chip loading tube 200. The second driving member 405 can be constructed as a cylinder, and one of the cylinder body and piston rod can be fixedly connected to the stage 10 and the other can be fixedly connected to the second mounting plate 407. By retracting the second drive member 405, the length of the second drive member 405 is reduced, and the distance between the stage 10 and the second mounting plate 407 is reduced. As a result, the second mounting plate 407 can drive the first mounting plate 406 to move closer to the stage 10 through the connecting plate 408. This allows the first drive member 403 mounted on the first mounting plate 406 to move closer to the chip loading tube 200, thereby allowing the clamping member 401 to move closer to the chip loading tube 200, which facilitates the clamping member 401 clamping the chip loading tube 200.

[0062] By extending the second driving member 405, the length of the second driving member 405 increases, and the distance between the stage 10 and the second mounting plate 407 increases. Consequently, the second mounting plate 407 can drive the first mounting plate 406 away from the stage 10 through the connecting plate 408. This can cause the first driving member 403 mounted on the first mounting plate 406 to move away from the chip loading tube 200, thereby causing the clamping member 401 to move away from the chip loading tube 200 and separating the clamping member 401 from the chip loading tube 200.

[0063] See Figures 1-3In some embodiments of this application, the platform 10 may be provided with a movable baffle group 60 at the conveying mechanism 20. The baffle group 60 is regularly distributed and divides the storage space 101 into a pre-loading space 102, multiple buffer spaces and a sealing space 105. The pre-loading space 102 is suitable for loading the chip loading tube 200 to be sealed. The buffer space is suitable for buffering and storing the conveyed chip loading tube 200. The user is suitable for loading the chip loading tube 200 to be sealed into the pre-loading space 102. The preset sealing position is located in the sealing space 105. The chip loading tube 200 in the pre-loading space 102 passes through multiple buffer spaces in sequence and is sealed in the sealing space 105. The pre-loading space 102 and the sealing space 105 are spaced apart to ensure that the unsealed chip loading tube 200 is separated from the chip loading tube 200 being sealed by the sealing mechanism 50. This allows the sealed chip loading tube 200 to be output from the sealing space 105 to the outside of the sealing device 100, reducing the difficulty for the sealing device 100 to separate the sealed chip loading tube 200 from the unsealed chip loading tube 200.

[0064] Furthermore, by using the baffle assembly 60 to separate multiple buffer spaces between the pre-loading space 102 and the sealing space 105, the chip loading tubes 200 in the pre-loading space 102 can be sequentially arranged in multiple buffer spaces as they move toward the sealing space 105. This allows the chip loading tubes 200 in the pre-loading space 102 to move into the sealing space 105 in an orderly manner, making it easier for the sealing mechanism 50 to seal the chip loading tubes 200 in the sealing space 105 in sequence according to their order. This can reduce the number of chip loading tubes 200 that are not sealed.

[0065] Furthermore, the baffle assembly 60 blocks the chip loading tubes 200 sequentially conveyed by the conveying mechanism 20, so that the chip loading tubes 200 are buffered and stored in the buffer space. When the sealing device 100 has one sealing mechanism 50, the number of chip loading tubes 200 to be sealed in the sealing space 105 is 1. That is, the sealing device 100 can seal one chip loading tube 200 at the same time. This facilitates the sealing device 100 to detect and manage the sealing effect of the chip loading tubes 200, thereby further reducing the number of chip loading tubes 200 that are not sealed among multiple chip loading tubes 200, and thus improving the user experience of the sealing device 100.

[0066] See Figures 1-4 In some embodiments of this application, the baffle assembly 60 includes a first baffle 601, a second baffle 602, and a third baffle 603, along the conveying direction of the conveying mechanism 20 (i.e., Figure 1In the front-back direction, the first baffle 601, the second baffle 602, and the third baffle 603 are spaced apart sequentially. The first baffle 601 is located between the pre-loading space 102 and the first buffer space 103, the second baffle 602 is located between the first buffer space 103 and the second buffer space 104, and the third baffle 603 is located between the second buffer space 104 and the sealing space 105. Thus, by cooperating, the first baffle 601, the second baffle 602, and the third baffle 603 can form two buffer spaces between the pre-loading space 102 and the sealing space 105. While ensuring that the chip loading tube 200 completes its sorting after passing through the first buffer space 103 and the second buffer space 104, the number of buffer spaces can be effectively reduced, thereby reducing the size of the sealing device 100 in the first direction. This makes the structure of the sealing device 100 more compact and easier to arrange in a confined space.

[0067] See Figures 1-3 In some embodiments of this application, the first baffle 601, the second baffle 602, and the third baffle 603 are all adapted to move along the second direction of the sealing device 100. The first direction of the sealing device 100 is perpendicular to the second direction. When the sealing device 100 moves along the second direction, the first direction of the sealing device 100 is perpendicular to the second direction. Figure 1 When placed in the indicated direction, the second direction of the sealing device 100 can refer to... Figure 1 The up and down directions in the middle.

[0068] Along the second direction of the sealing device 100, the first baffle 601 is configured to rise when the number of chip loading tubes 200 in the first buffer space 103 is less than a first preset number, allowing the chip loading tubes 200 in the pre-loading space 102 to move into the first buffer space 103, and to fall back when the number of chip loading tubes 200 in the first buffer space 103 is greater than a second preset number, preventing the chip loading tubes 200 in the pre-loading space 102 from moving into the first buffer space 103. Both the first and second preset numbers can be set by the user or calibrated by the manufacturer of the sealing device 100, with the second preset number being greater than the first preset number.

[0069] When the first baffle 601 is raised, a gap can be formed between the first baffle 601 and the support surface. The chip loading tube 200 in the pre-loading space 102 can pass through the gap between the first baffle 601 and the support surface to move into the first buffer space 103. By raising or lowering the first baffle 601 according to the number of chip loading tubes 200 in the first buffer space 103, it is possible to avoid the accumulation of chip loading tubes 200 in the first buffer space 103 due to too many chip loading tubes. It is also possible to prevent the sealing operation of the sealing device 100 from stopping due to too few chip loading tubes 200 in the first buffer space 103. This helps to sort the chip loading tubes 200 in the first buffer space 103 and also improves the sealing efficiency of the sealing device 100.

[0070] Furthermore, the second baffle 602 is configured to rise when the number of chip loading tubes 200 in the second buffer space 104 is less than a third preset number, allowing chip loading tubes 200 in the first buffer space 103 to move into the second buffer space 104; and to fall back when the number of chip loading tubes 200 in the second buffer space 104 is greater than a fourth preset number, preventing chip loading tubes 200 in the first buffer space 103 from moving into the second buffer space 104. The third and fourth preset numbers can both be set by the user or calibrated by the manufacturer of the sealing device 100, with the fourth preset number being greater than the third preset number.

[0071] When the second baffle 602 is raised, a gap can be formed between the second baffle 602 and the support surface. The chip loading tube 200 in the first buffer space 103 can pass through the gap between the second baffle 602 and the support surface to move into the second buffer space 104. By raising or lowering the second baffle 602 according to the number of chip loading tubes 200 in the second buffer space 104, it is possible to avoid the accumulation of chip loading tubes 200 in the second buffer space 104 due to too many chip loading tubes 200, and also to prevent the sealing operation of the sealing device 100 from stopping due to too few chip loading tubes 200 in the second buffer space 104. This helps to sort the chip loading tubes 200 in the second buffer space 104 and also improves the sealing efficiency of the sealing device 100.

[0072] Meanwhile, the third baffle 603 is configured to rise when the chip loading tube 200 in the sealing space 105 is sealed, so as to allow the chip loading tube 200 closest to the sealing space 105 in the second buffer space 104 to move into the sealing space 105, and to fall back when there is a chip loading tube 200 to be sealed in the sealing space 105, so as to prevent the chip loading tube 200 in the second buffer space 104 from moving into the sealing space 105. When the third baffle 603 is raised, a gap can be formed between the third baffle 603 and the support surface. The chip loading tube 200 in the second buffer space 104 can pass through the gap between the third baffle 603 and the support surface to move into the sealing space 105. By raising or lowering the third baffle 603 according to the sealing status of the chip loading tube 200 in the sealing space 105, it can be ensured that the sealing device 100 seals only one chip loading tube 200 at the same time. This makes it easier for the sealing device 100 to detect and manage the sealing effect of the chip loading tube 200, thereby further reducing the number of chip loading tubes 200 that are not sealed and improving the user experience of the sealing device 100.

[0073] Furthermore, the controller described above can be communicatively connected to the first baffle 601, the second baffle 602, and the third baffle 603. The controller can control the corresponding first baffle 601, second baffle 602, or third baffle 603 to rise or fall according to the number of chip loading tubes 200 in the first buffer space 103, the second buffer space 104, and the sealing space 105, so as to block the chip loading tubes 200 conveyed sequentially by the conveying mechanism 20.

[0074] See Figures 3-5 In some embodiments of this application, the detection mechanism 30 includes an angle detection element 301, a quantity detection element 302, and a sealing plug detection element 303. The angle detection element 301 is used to detect the placement angle of the chip loading tube 200 located at a preset sealing position. The angle detection element 301 may include a first infrared distance sensor and a second infrared distance sensor. Both the first infrared distance sensor and the second infrared distance sensor are disposed directly below the chip loading tube 200 located at the preset sealing position.

[0075] Since the outer contour of the chip loading tube 200 is roughly rectangular, and the length dimension of the cross-section of the chip loading tube 200 is greater than its width dimension, the distance between the first infrared distance sensor and the second infrared distance sensor in the first direction of the sealing device 100 can be equal to the difference between the length dimension and the width dimension of the cross-section of the chip loading tube 200. When the first infrared distance sensor detects infrared light reflected back to the first infrared distance sensor, and the second infrared distance sensor does not detect infrared light reflected back to the second infrared distance sensor, it can be determined that the placement angle of the chip loading tube 200 is incorrect, and the flipping mechanism 40 can correct the placement angle of the chip loading tube 200 to the preset sealing angle. When both the first infrared distance sensor and the second infrared distance sensor detect infrared light reflected back to their respective infrared distance sensors, it can be determined that the placement angle of the chip loading tube 200 is correct, and the sealing mechanism 50 can insert a sealing plug into the end of the chip loading tube 200 to seal the open end of the chip loading tube 200.

[0076] The quantity detection component 302 is used to detect the number of chip loading tubes 200 in the first buffer space 103, the second buffer space 104, and the sealing space 105. The quantity detection component 302 can be a third infrared distance sensor, which can be installed at a preset position in the first buffer space 103, the second buffer space 104, and the sealing space 105. Multiple third infrared distance sensors can be set in the first buffer space 103, the second buffer space 104, and the sealing space 105 respectively. The multiple third infrared distance sensors are spaced apart along the first direction of the sealing device 100. The detection mechanism 30 can determine the number of chip loading tubes 200 in the first buffer space 103, the second buffer space 104, and the sealing space 105 by detecting whether the third infrared distance sensor receives infrared light reflected back to the third infrared distance sensor.

[0077] For example, within the first buffer space 103, when the third infrared distance sensor near the second buffer space 104 cannot receive the infrared light reflected back to the third infrared distance sensor, it proves that there are no chip loading tubes 200 in the first buffer space 103 opposite to the third infrared distance sensor near the second buffer space 104. At this time, the number of chip loading tubes 200 in the first buffer space 103 is lower than the first preset number. When the third infrared distance sensor near the pre-loading space 102 can receive the infrared light reflected back to the third infrared distance sensor, it proves that there are chip loading tubes 200 in the first buffer space 103 opposite to the third infrared distance sensor near the pre-loading space 102. At this time, the number of chip loading tubes 200 in the first buffer space 103 is higher than the second preset number. Similarly, the number of chip loading tubes 200 in the second buffer space 104 and the sealing space 105 can be determined.

[0078] The sealing plug detector 303 is used to detect whether the chip loading tube 200 located at the preset sealing position is sealed. When the chip loading tube 200 is light-transmitting, the sealing plug detector 303 can be a fourth infrared distance sensor. The fourth infrared distance sensor irradiates infrared light onto the area of ​​the chip loading tube 200 to be sealed. When the fourth infrared distance sensor can receive the reflected infrared light, it proves that the sealing plug has been installed at the area of ​​the chip loading tube 200 to be sealed. When the fourth infrared distance sensor cannot receive the reflected infrared light, it proves that the sealing plug has not been installed at the area of ​​the chip loading tube 200 to be sealed. The sealing device 100 is configured to control the sealing mechanism 50 to install a sealing plug into the corresponding chip loading tube 200 when the sealing plug detector 303 detects that the chip loading tube 200 at the preset sealing position is not sealed.

[0079] Therefore, with the cooperation of multiple testing components of the testing mechanism 30, the sealing device 100 can automatically seal the chip loading tube 200 according to the data detected by the testing mechanism 30, reducing the manual operation required to use the sealing device 100, improving the ease of use of the sealing device 100, and improving the sealing efficiency of the chip loading tube 200.

[0080] See Figure 4 In some embodiments of this application, the conveying mechanism 20 includes a first conveyor belt 201 and a second conveyor belt 202. The first conveyor belt 201 extends into the pre-loading space 102, the first buffer space 103, and the second buffer space 104. The first conveyor belt 201 is used to convey the chip loading tube 200 in the pre-loading space 102 to the first buffer space 103, and to convey the chip loading tube 200 in the first buffer space 103 to the second buffer space 104.

[0081] Furthermore, the second conveyor belt 202 extends into the second buffer space 104 and the sealing space 105. The second conveyor belt 202 is used to transport the chip loading tube 200 to be sealed in the second buffer space 104 to the sealing space 105, and to output the sealed chip loading tube 200 in the sealing space 105.

[0082] With the cooperation of the first conveyor belt 201 and the second conveyor belt 202, the chip loading tube 200 can be conveyed step by step from the pre-loading space 102 into the sealing space 105 via the first conveyor belt 201 and the second conveyor belt 202. The conveying mechanism 20 is equipped with multiple conveyor belts, which ensures that each conveyor belt operates independently. This allows the conveying of chip loading tubes 200 from the pre-loading space 102 to the first buffer space 103, from the first buffer space 103 to the second buffer space 104, and from the second buffer space 104 to the sealing space 105 to be independent of each other. This enables the conveying mechanism 20 to convey chip loading tubes 200 more efficiently. At the same time, the start and stop rhythms of the first conveyor belt 201 and the second conveyor belt 202 are not consistent. The independent operation of the first conveyor belt 201 and the second conveyor belt 202 means that the conveying mechanism 20 does not need to simultaneously drive the chip loading tubes 200 in the pre-loading space 102, the first buffer space 103, the second buffer space 104, and the sealing space 105, which can reduce the energy consumption of the sealing device 100.

[0083] See Figures 3-5 In some embodiments of this application, the sealing device 100 may further include a limiting mechanism 70, which may be disposed on the platform 10. The limiting mechanism 70 includes a first limiting component 710 and a second limiting component 720. The first limiting component 710 is used to limit the chip loading tube 200 in the sealing space 105 to a preset sealing position, and the second limiting component 720 is used to limit the number of chip loading tubes 200 that move from the second buffer space 104 to the sealing space 105 each time the third baffle 603 is raised.

[0084] Specifically, the first limiting component 710 may include a third driving member, a fourth driving member, a stop member 711, and a limiting member 712. In some preferred embodiments, the third and fourth driving members can both be constructed as cylinders, but the present invention is not limited thereto; for example, the third and fourth driving members can also be constructed as drive motors, etc. The stop member 711 and the limiting member 712 are along the first direction of the sealing device 100 (i.e., Figure 1 The stop members 711 are spaced apart in the front and back directions. The stop members 711 can be structures such as stop protrusions or stop posts. The third drive member is connected and cooperates with the stop members 711 and is used to drive the stop members 711 to extend into or out of the sealing space 105. When the third baffle 603 is raised, the stop members 711 are driven into the sealing space 105 by the third drive member. When the chip loading tube 200 in the second buffer space 104 moves into the sealing space 105, the chip loading tube 200 can stop against the stop members 711. The interference between the chip loading tube 200 and the stop members 711 can limit the chip loading tube 200 from continuing to move toward the stop members 711. At this time, the chip loading tube 200 can stop at the preset sealing position.

[0085] The fourth driving member is connected and cooperates with the limiting member 712 and is used to drive the limiting member 712 to extend into or out of the sealing space 105, see [link / reference]. Figure 3 The limiting member 712 can be a limiting block. Both the stop member 711 and the limiting member 712 are adapted to abut against the side wall of the chip loading tube 200 located between the stop member 711 and the limiting member 712 to limit the chip loading tube 200 to a preset sealing position. When the chip loading tube 200 is stopped at the preset sealing position, by driving the limiting member 712 into the sealing space 105 by the fourth driving member, the chip loading tube 200 is located in the space between the limiting member 712 and the stop member 711. Since both the stop member 711 and the limiting member 712 abut against the side wall of the chip loading tube 200, the chip loading tube 200 can be clamped by the limiting member 712 and the stop member 711. Thus, the limiting member 712 and the stop member 711 can jointly restrict the movement of the chip loading tube 200, thereby limiting the chip loading tube 200 to the preset sealing position.

[0086] After the chip loading tube 200 is sealed, the sealed chip loading tube 200 can be output to the outside of the sealing device 100 by the second conveyor belt 202 by extending the stop member 711 out of the sealing space 105. Furthermore, the stop member 711 can extend back into the sealing space 105, and the limiting member 712 can extend out of the sealing space 105. After the chip loading tube 200 to be sealed in the second buffer space 104 is conveyed into the sealing space 105, the limiting mechanism 70 can repeat the above process to limit the chip loading tube 200 to the preset sealing position.

[0087] Furthermore, a fixing plate 604 can be installed on the third baffle 603. The fixing plate 604 can extend into the sealing space 105. When the third baffle 603 falls back, the fixing plate 604 can press the chip loading tube 200 against the support surface. The fixing plate 604 can further restrict the movement of the chip loading tube 200 at the preset sealing position, thereby preventing the chip loading tube 200 from shifting when it is sealed, and improving the sealing effect of the chip loading tube 200.

[0088] See Figure 4 , Figure 5 The second limiting component 720 includes an extruder 721, a fifth driving component 722, and an extrusion plate 723. The extruder 721 can be an extrusion shaft, and the fifth driving component 722 can be a cylinder or a drive motor, etc. The extrusion plate 723 can be disposed within the second buffer space 104. The fifth driving component 722 is connected and cooperates with the extruder 721 and is used to drive the extruder 721 to move closer to or away from the extrusion plate 723. There is a gap between the extruder 721 and the extrusion plate 723. The chip loading tubes 200 in the second buffer space 104 can all pass through the gap between the extruder 721 and the extrusion plate 723 and move toward the sealing space 105.

[0089] By moving the extruder 721 closer to the extrusion plate 723, the extruder 721 can compress the chip loading tube 200 adjacent to the chip loading tube 200 closest to the sealing space 105 within the second buffer space 104. This ensures that when the third baffle 603 rises, only one chip loading tube 200 moves from the second buffer space 104 to the sealing space 105. Specifically, by compressing the chip loading tube 200 with the extruder 721, the friction between the chip loading tube 200 and the extruder 721, and between the chip loading tube 200 and the extrusion plate 723, increases. This prevents the second conveyor belt 202 from conveying the chip loading tube 200 adjacent to the chip loading tube 200 closest to the sealing space 105 into the sealing space 105. Simultaneously, the chip loading tube 200 adjacent to the chip loading tube 200 closest to the sealing space 105 can block the corresponding upstream chip loading tube 200 from moving towards the sealing space 105. The chip loading tubes 200 located upstream of the chip loading tube 200 closest to the sealing space 105 cannot enter the sealing space 105. That is, the chip loading tube 200 closest to the sealing space 105 can enter the sealing space 105. This achieves the technical effect that when the third baffle 603 is raised, the number of chip loading tubes 200 moving from the second buffer space 104 to the sealing space 105 is 1. This can minimize the accumulation of chip loading tubes 200 in the sealing space 105 and minimize the possibility of chip loading tubes 200 leaking during sealing.

[0090] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A sealing device for a chip loading tube, characterized in that, include: A shelf (10) defines a storage space (101) for placing the chip loading tube (200). A conveying mechanism (20) is provided in the storage platform (10) and is used to convey the chip loading tube (200) placed in the storage space (101) to a preset sealing position; The detection mechanism (30) is located on the platform (10) and is used to detect the placement angle of the chip loading tube (200) at the preset sealing position; A flipping mechanism (40) is provided on the platform (10) and opposite to the preset sealing position. The flipping mechanism (40) has a clamping member (401) for clamping the wall of the corresponding chip loading tube (200). The clamping member (401) is adapted to rotate around the rotation axis according to the placement angle of the chip loading tube (200) to flip the chip loading tube (200) to the preset sealing angle. A sealing mechanism (50) is provided on one side of the platform (10) and is used to insert a sealing plug into the open end of the chip loading tube (200) to seal the open end of the chip loading tube (200). The storage platform (10) is provided with a movable baffle group (60) at the conveying mechanism (20). The baffle group (60) is regularly distributed and divides the storage space (101) into a pre-loading space (102), at least one buffer space, and a sealing space (105). The pre-loading space (102) is suitable for loading chip loading tubes (200) to be sealed. The buffer space is suitable for buffering the conveyed chip loading tubes (200). The preset sealing position is located in the sealing space (105). The chip loading tubes (200) in the pre-loading space (102) pass through multiple buffer spaces in sequence and are sealed in the sealing space (105). The baffle group (60) blocks the chip loading tubes (200) conveyed by the conveying mechanism (20) in sequence so that the chip loading tubes (200) are buffered in the buffer space.

2. The sealing device for a chip loading tube according to claim 1, characterized in that, The flipping mechanism (40) includes a drive shaft (402), a first drive member (403), and a clamping member (401). The drive shaft (402) is fixedly connected to the output end of the first drive member (403). The first drive member (403) is used to drive the drive shaft (402) to rotate around the rotation axis. The clamping member (401) is eccentrically mounted on the drive shaft (402). The drive shaft (402) is used to drive the clamping member (401) to flip the chip loading tube (200) to a preset sealing angle.

3. A sealing device for a chip loading tube according to claim 2, characterized in that, The flipping mechanism (40) is further provided with a mounting base (404) and a second driving member (405). The second driving member (405) and the first driving member (403) are both disposed on the mounting base (404). The second driving member (405) is used to drive the mounting base (404) to move the first driving member (403) closer to or away from the chip loading tube (200).

4. A sealing device for a chip loading tube according to claim 3, characterized in that, The mounting base (404) includes a first mounting plate (406), a second mounting plate (407), and a connecting plate (408), wherein the connecting plate (408) is connected between the first mounting plate (406) and the second mounting plate (407); One end of the second driving member (405) is fixedly connected to the platform (10), and the other end of the second mounting plate (407) is fixedly connected to the second driving member (405). The first mounting plate (406) is fixedly connected to the first driving member (403). The second driving member (405) is telescopically disposed between the platform (10) and the mounting base (404). By contracting or extending the second driving member (405), the mounting base (404) is driven to move the first driving member (403) closer to or away from the chip loading tube (200).

5. A sealing device for a chip loading tube according to claim 1, characterized in that, The baffle assembly (60) includes a first baffle (601), a second baffle (602), and a third baffle (603). Along the conveying direction of the conveying mechanism (20), the first baffle (601), the second baffle (602), and the third baffle (603) are spaced apart in sequence. The first baffle (601) is located between the pre-loading space (102) and the first buffer space (103). The second baffle (602) is located between the first buffer space (103) and the second buffer space (104). The third baffle (603) is located between the second buffer space (104) and the sealing space (105).

6. A sealing device for a chip loading tube according to claim 5, characterized in that, The first baffle (601), the second baffle (602) and the third baffle (603) are all adapted to move along the second direction of the sealing device (100), and the first direction is perpendicular to the second direction. Along the second direction, the first baffle (601) is configured to rise when the number of chip loading tubes (200) in the first buffer space (103) is less than a first preset number, so as to allow the chip loading tubes (200) in the pre-loading space (102) to move into the first buffer space (103), and to fall back when the number of chip loading tubes (200) in the first buffer space (103) is greater than a second preset number, so as to prevent the chip loading tubes (200) in the pre-loading space (102) from moving into the first buffer space (103); The second baffle (602) is configured to rise when the number of chip loading tubes (200) in the second buffer space (104) is less than a third preset number, so as to allow the chip loading tubes (200) in the first buffer space (103) to move into the second buffer space (104), and to fall back when the number of chip loading tubes (200) in the second buffer space (104) is greater than a fourth preset number, so as to prevent the chip loading tubes (200) in the first buffer space (103) from moving into the second buffer space (104); The third baffle (603) is configured to rise when the chip loading tube (200) in the sealing space (105) is sealed, so as to allow the chip loading tube (200) closest to the sealing space (105) in the second buffer space (104) to move into the sealing space (105), and to fall back when there is a chip loading tube (200) to be sealed in the sealing space (105), so as to prevent the chip loading tube (200) in the second buffer space (104) from moving into the sealing space (105).

7. A sealing device for a chip loading tube according to claim 6, characterized in that, The detection mechanism (30) includes an angle detection component (301), a quantity detection component (302), and a sealing plug detection component (303). The angle detection component (301) is used to detect the placement angle of the chip loading tube (200) located at the preset sealing position. The quantity detection device (302) is used to detect the quantity of the chip loading tubes (200) in the first buffer space (103), the second buffer space (104), and the sealing space (105); The sealing plug detection element (303) is used to detect whether the chip loading tube (200) located at the preset sealing position is sealed. The sealing device (100) is configured to control the sealing mechanism (50) to insert the sealing plug into the corresponding chip loading tube (200) when the sealing plug detection element (303) detects that the chip loading tube (200) at the preset sealing position is not sealed.

8. A sealing device for a chip loading tube according to claim 6, characterized in that, The conveying mechanism (20) includes a first conveyor belt (201) and a second conveyor belt (202). The first conveyor belt (201) extends into the pre-loading space (102), the first buffer space (103), and the second buffer space (104). The first conveyor belt (201) is used to convey the chip loading tube (200) in the pre-loading space (102) to the first buffer space (103) and to convey the chip loading tube (200) in the first buffer space (103) to the second buffer space (104). The second conveyor belt (202) extends into the second buffer space (104) and the sealing space (105). The second conveyor belt (202) is used to transport the chip loading tube (200) to be sealed in the second buffer space (104) to the sealing space (105), and to output the sealed chip loading tube (200) in the sealing space (105).

9. A sealing device for a chip loading tube according to claim 6, characterized in that, Also includes: A limiting mechanism (70) is provided on the shelf (10), and the limiting mechanism (70) includes a first limiting component (710) and a second limiting component (720); The first limiting component (710) includes a third driving member, a fourth driving member, a stop member (711), and a limiting member (712). The stop member (711) and the limiting member (712) are spaced apart along the first direction. The third driving member is connected and cooperates with the stop member (711) and is used to drive the stop member (711) to extend into or out of the sealing space (105). The fourth driving member is connected and cooperates with the limiting member (712) and is used to drive the limiting member (712) to extend into or out of the sealing space (105). The stop member (711) and the limiting member (712) are both adapted to abut against the side wall of the chip loading tube (200) located between the stop member (711) and the limiting member (712) to limit the chip loading tube (200) to the preset sealing position. The second limiting component (720) includes an extruder (721), a fifth driving component (722), and an extrusion plate (723). The extrusion plate (723) is disposed in the second buffer space (104). The fifth driving component (722) is connected and cooperates with the extruder (721) and is used to drive the extruder (721) to move closer to or away from the extrusion plate (723). By moving the extruder (721) closer to the extrusion plate (723), the extruder (721) extrudes the chip loading tube (200) adjacent to the chip loading tube (200) closest to the sealing space (105) in the second buffer space (104).

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