Soundproofing panel and its multi-stage Helmholtz acoustic metamaterial resonant structure and design method

By using a multi-cascaded Helmholtz acoustic metamaterial resonant structure, and utilizing the resonant cavity of thin films and plates to dissipate acoustic energy, the difficulties in fabrication and high costs of low-frequency noise control have been solved, achieving the effects of wideband sound insulation and simplified processing.

CN117037760BActive Publication Date: 2026-05-05XIAMEN HUANJI HI-TECH CO LTD
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Patent Information

Application Number
CN202310718425.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-16
Publication Date
2026-05-05
Estimated Expiration
2043-06-16

AI Technical Summary

Technical Problem

In existing technologies, low-frequency noise control methods suffer from difficulties in preparation, high costs, and limited application scenarios. Traditional composite materials have complex structures, making it difficult to achieve broadband sound insulation effects.

Method used

A multi-level Helmholtz acoustic metamaterial resonant structure is designed, including a thin film-Helmholtz resonant structure and a homogeneous plate. By creating stepped through holes in the plate and connecting them to the thin film, the elastic strain of the thin film and the resonant cavity are used to dissipate sound energy. The multi-level resonant structure is combined to achieve broadband sound insulation.

Benefits of technology

It achieves broadband sound insulation, simplifies the processing technology, reduces production costs, improves production efficiency, and enhances the product's designability and sound insulation performance.

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Abstract

This invention discloses a sound insulation panel and its multi-tiered Helmholtz acoustic metamaterial resonant structure and design method, achieving broadband sound insulation, enriching the product's application scenarios, and optimizing the structural design to achieve easier processing and reduced costs. The multi-tiered Helmholtz acoustic metamaterial resonant structure includes at least two stages of thin-film-Helmholtz resonant structures arranged sequentially along the sound wave incident direction, and a homogeneous plate for fixing the last stage of the thin-film-Helmholtz resonant structure. Each stage of the thin-film-Helmholtz resonant structure includes a thin film and a plate arranged sequentially along the sound wave incident direction, with the opposite surfaces of the thin film and the plate sealed together. A first through-hole and a second through-hole are coaxially arranged sequentially along the sound wave incident direction on the plate. The second through-hole communicates with the first through-hole to form the resonant cavity of the thin-film-Helmholtz resonant structure, and the size of the second through-hole is larger than that of the first through-hole. The first and second through-holes of each stage of the thin-film-Helmholtz resonant structure have a stepped shape with gradually increasing opening size in the sound wave incident direction.
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