Plate cooling device and stripping platform with plate cooling device

Abstract

The present invention relates to a plate cooling device for cooling a wafer carrier substrate, comprising a cooling plate and a plurality of contact pads. The cooling plate has an upper surface, wherein a cooling placement area is provided on the upper surface for placing the wafer. The plurality of contact pads are disposed on the upper surface. The plurality of contact pads protrude from the upper surface, and the total area of ​​the plurality of contact pads is less than 3% of the area of ​​the carrier substrate.

Description

Technical Field

[0001] The present invention relates to a wafer thinning operation, in particular to a plate cooling device for cooling a carrier substrate during a wafer stripping operation and a stripping platform with the plate cooling device. Background Art

[0002] Current wafer manufacturing processes are trending towards thinner wafers. However, during the current wafer thinning process, the gradually thinned wafers lack sufficient stress strength, making them prone to breakage. Therefore, before thinning, the wafers are bonded to a carrier substrate to increase mechanical strength, and then thinned using chemical mechanical polishing (CMP).

[0003] After the thinning operation, the wafer and the carrier substrate need to be heated to weaken the bonding strength, and then the carrier substrate is peeled off with a vacuum pickup device. The carrier substrate is then placed on a cooling platform for cooling before being recycled.

[0004] However, after the vacuum pickup device peels the carrier substrate off the wafer, the carrier substrate faces the cooling platform with its bonding surface. The bonding surface of the carrier substrate has adhesive that is bonded to the wafer. When the carrier substrate is placed on the cooling platform, the bonding surface makes large-area contact with the cooling platform, so that the carrier substrate is bonded to the cooling platform by the adhesive. When the carrier substrate is transferred to other equipment after the cooling operation is completed, the large-area adhesive exerts a great adhesion force on the carrier substrate. Therefore, in the process of picking up and transferring the carrier substrate, picking failure is likely to occur, resulting in interruption of the process of picking up and transferring the carrier substrate, and manual correction is required. At the same time, if the adsorption force of the vacuum pickup device is increased and the carrier substrate is forcibly peeled off from the cooling platform, the carrier substrate is likely to warp, deform, or crack. Therefore, it is necessary to improve the way the carrier substrate is placed on the cooling platform to avoid picking failure in the process of picking up and transferring the carrier substrate. Summary of the Invention

[0005] In view of the above technical problems, the present invention provides a plate cooling device and a peeling platform having the plate cooling device, which can avoid errors when the plate cooling device picks up and transfers a carrier substrate.

[0006] The present invention provides a plate cooling device for cooling a wafer carrier substrate, comprising a cooling plate and a plurality of contact pads. The cooling plate has an upper surface. The plurality of contact pads are disposed on the upper surface. The plurality of contact pads protrude from the upper surface, and the total area of ​​the plurality of contact pads is less than 3% of the area of ​​the carrier substrate.

[0007] Preferably, a cooling placement area is provided on the upper surface, and the plurality of contact pads are located in the cooling placement area.

[0008] Preferably, the front edge of the upper surface is arranged in the notch.

[0009] Preferably, a groove is provided on the upper surface, the groove extending from the notch to the rear edge of the upper surface, and the plate cooling device further comprises a fixing pad provided in the groove; the fixing pad is used for allowing the fixing member to pass through.

[0010] Preferably, the cooling plate further comprises two side recesses located on two opposite sides of the upper surface, and the plate cooling device further comprises a plurality of fixing pads arranged in the two side recesses; each fixing pad is used for allowing a fixing member to pass through.

[0011] Based on the above-mentioned plate cooling device, the present invention also proposes a peeling platform for peeling a wafer from a carrier substrate, comprising a base, a carrying device, the aforementioned plate cooling device, and a carrier substrate picking device. Two movable guides are provided on two opposite sides of the base. The carrying device is provided on the base and is located between the two movable guides. The carrying device has a carrying platform, an adsorption assembly, and a plurality of ejector pins. The carrying platform is used for placing wafers and carrier substrates thereon, and the wafers are facing the carrying platform. A peeling processing portion is provided on the top surface of the carrying platform for placing wafers and carrier substrates, and the carrier substrate is located on the outside. The adsorption assembly is provided in the peeling processing portion for adsorbing wafers. A plurality of ejector pins can be raised and lowered in the peeling processing portion, and can be lowered and completely buried in the carrying platform, or raised to push away or receive the wafers. The plate cooling device is provided on the base and is located between the two movable guides. The carrier substrate picking device includes a movable base and a picking head; wherein the movable base is movably coupled to two movable guide members; the picking head is movably arranged on the movable base for adsorbing on the wafer to peel the carrier substrate from the wafer and move the carrier substrate to the cooling placement area of ​​the plate cooling device.

[0012] Preferably, a guide groove is provided on each movable guide member, and the movable seat includes two pillars and a bracket connecting the two pillars, the two pillars are respectively inserted into each guide groove so that the movable seat can be movably combined with the movable guide member, and the picking head is movably provided on the bracket.

[0013] Preferably, the peeling platform also includes a first linear drive and a second linear drive; the first linear drive is arranged on the base and connected to one of the two pillars, used to drive each of the two pillars to move along each guide groove; the pickup head is connected to the bracket through the second linear drive, used to drive the pickup head toward the base or away from the base.

[0014] Preferably, the peeling processed portion is a shallow groove.

[0015] Preferably, a heater is embedded in the carrier platform to heat the wafer and the carrier substrate placed in the stripping processing part.

[0016] By means of the plate cooling device and the peeling platform with the plate cooling device proposed in the present invention, the positive adhesive force generated by the adhesive on the bottom surface of the carrier substrate will not be too large, thereby avoiding the problem of failure in picking up the carrier substrate during the subsequent transfer of the carrier substrate, reducing the error rate of the peeling operation, and effectively improving the productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of a peeling platform with a plate cooling device in an embodiment of the present invention.

[0018] Figure 2 It is a three-dimensional diagram of a plate cooling device in an embodiment of the present invention.

[0019] Figure 3 A top view of a plate cooling device in an embodiment of the present invention.

[0020] Figure 4 It is a side view of the carrying device in an embodiment of the present invention.

[0021] Figures 5 to 11 This is a three-dimensional diagram of a peeling platform in an embodiment of the present invention, used to illustrate the peeling and cooling process of the carrier substrate.

[0022] Explanation of reference numerals: 1-peeling platform; 3-wafer; 4-carrier substrate; 4a-adhesive; 100-plate cooling device; 110-cooling plate; 110a-cooling placement area; 111-upper surface; 1111-front edge; 1112-back edge; 1113-side edge; 113-notch; 114-groove; 115-side recess; 120-contact pad; 130-fixing pad; 140-fixing member; 210-base Seat; 220-carrying device; 222-carrying platform; 222a-peeling processing part; 223-adsorption component; 224-lift rod; 225-heater; 230-carrier substrate picking device; 232-movable seat; 2321-pillar; 2322-bracket; 234-pickup head; 240-movable guide member 242-guide groove; 250-first linear drive; 260-second linear drive; G-spacing distance. DETAILED DESCRIPTION

[0023] See also Figures 1 to 3 1 and 2 , which are diagrams showing a plate cooling device 100 and a peeling platform 1 having the plate cooling device 100 according to an embodiment of the present invention.

[0024] like Figure 2 and Figure 3As shown, the plate cooling device 100 includes a cooling plate 110 and a plurality of contact pads 120. The cooling plate 110 has an upper surface 111. A cooling placement area 110a is defined on the upper surface 111. The cooling placement area 110a is generally circular, and its diameter is slightly greater than or equal to the diameter of the predetermined cooling carrier substrate 4. Specifically, the cooling placement area 110a can be an area defined by a physical structure, such as a groove, or it can be a virtual area used to set the position where the pickup device / robotic arm picks up / places the carrier substrate 4, that is, the cooling placement area 110a is an area defined only in the control program code of the pickup device / robotic arm.

[0025] like Figure 2 and Figure 3 As shown, the contact pad 120 is disposed on the upper surface 111 and located in the cooling placement area 110 a . The contact pad 120 protrudes from the cooling placement area 110 a of the upper surface 111 .

[0026] like Figure 3 、 Figure 4 as well as Figure 5 As shown, the carrier substrate 4 to be cooled is placed on the contact pad 120, and supported by the contact pad 120, a spacing distance G is maintained between the carrier substrate 4 and the upper surface 111. In other words, the carrier substrate 4 only contacts the contact pad 120, and the total contact area between the carrier substrate 4 and the contact pad 120 is much smaller than the area of ​​the carrier substrate 4 projected on the upper surface 111.

[0027] like Figure 4 As shown, the carrier substrate 4 is in contact only with the contact pads 120, with only a small area of ​​contact between the bottom surface of the carrier substrate 4 and the contact pads 120. Therefore, the adhesive 4a on the bottom surface of the carrier substrate 4 acts only on a small area, significantly reducing the positive adhesive force (the adhesive force in the direction parallel to the normal line of the upper surface 111).

[0028] The aforementioned adhesive force can still temporarily fix the carrier substrate 4 in the cooling placement area 110a, thereby preventing the carrier substrate 4 from sliding on the upper surface 111. A cooling device can be installed inside or outside the cooling plate 110, such as a liquid cooling device for liquid cooling the cooling plate 110, or an air cooling device for providing cooling airflow to the upper surface 111, to cool the carrier substrate 4.

[0029] like Figure 3Specifically, the total area of ​​the contact pads 120 is less than 3% of the area of ​​the carrier substrate 4. This prevents the positive adhesive force (parallel to the normal direction of the upper surface 111) exerted by the contact pads 120 on the carrier substrate 4 from being excessive, thereby preventing the carrier substrate pickup device 230 from being unable to pick up and move the cooled carrier substrate 4 from the contact pads 120. The contact pads 120 can be arranged radially outward from the center of the cooling placement area 110a, evenly distributed within the cooling placement area 110a. This ensures that the adhesive force acts evenly on the bottom surface of the carrier substrate 4, resulting in evenly distributed point bonding, replacing a single, large-area bonding.

[0030] like Figure 2 and Figure 3 As shown, in one embodiment, the front edge 1111 of the upper surface 111 is disposed in the notch 113, and the upper surface 111 is provided with one or more grooves 114, which extend from the notch 113 to the rear edge 1112 of the upper surface 111. Furthermore, the cooling plate 110 further includes two side recesses 115 located on opposite side edges 1113 of the upper surface 111.

[0031] like Figure 2 and Figure 3 As shown, the plate cooling device 100 further includes a plurality of fixing pads 130 respectively disposed in the groove 114 and the side recess 115. The fixing pads 130 are used for allowing fixing members 140 (such as bolts) to pass through to fix the cooling plate 110 to the peeling platform 1 or other base 210.

[0032] like Figure 1 As shown, the peeling platform 1 includes a base 210 , a carrying device 220 , the aforementioned plate cooling device 100 , and a carrier substrate picking device 230 .

[0033] like Figure 1 As shown, two movable guides 240 are disposed on two opposite sides 1113 of the base 210 , and guide grooves 242 are disposed on the movable guides 240 . The carrying device 220 is disposed on the base 210 and located between the two movable guides 240 .

[0034] like Figure 1 and Figure 4As shown, the carrier device 220 has a carrier platform 222, an adsorption component 223 and a plurality of ejector pins 224. The carrier platform 222 is used for placing the wafer 3 to be peeled and its carrier substrate 4 thereon. A peeling processing portion 222a is provided on the top surface of the carrier platform 222, and the peeling processing portion 222a may be a shallow groove. When the wafer 3 and its carrier substrate 4 are placed into the peeling processing portion 222a, the wafer 3 is placed toward the peeling processing portion 222a so that the carrier substrate 4 is located on the outside. A heater 225 such as an electric heating tube may also be embedded in the carrier platform 222 to heat the wafer 3 and the carrier substrate 4 placed in the peeling processing portion 222a. The heater 225 is not excluded from being arranged outside the carrier platform 222 for directly heating the carrier substrate 4.

[0035] like Figure 4 As shown, the suction assembly 223 and the ejector pins 224 are disposed in the stripping section 222a. The suction assembly 223 can be a vacuum suction hole connected to an exhaust device and an air guide groove connected to the vacuum suction hole, thereby generating negative pressure to absorb the wafer 3. The plurality of ejector pins 224 are arranged in the stripping section 222a in a traversable manner. They can be lowered to be completely buried in the carrier 222, or raised to push or receive the wafer 3.

[0036] like Figure 1 As shown, the plate cooling device 100 is disposed on the base 210 and is located between the two movable guide members 240 and adjacent to the carrying device 220 .

[0037] like Figure 1 As shown, the carrier substrate pickup device 230 includes a movable base 232 and a pickup head 234. The movable base 232 includes two pillars 2321 and a bracket 2322 connecting the two pillars 2321. The two pillars 2321 are respectively inserted into two guide slots 242, allowing the movable base 232 to be movably coupled to the movable guide member 240, allowing the movable base 232 to move along a longitudinal axis relative to the base 210. The peeling platform 1 also includes a first linear actuator 250, which is disposed on the base 210 and connected to the movable base 232, specifically to one of the two pillars 2321.

[0038] like Figure 1 As shown, the pickup head 234 is movably mounted on a bracket 2322 of the movable base 232 and connected to the bracket 2322 via a second linear actuator 260. The pickup head 234 is configured to adhere to the carrier substrate 4. The second linear actuator 260 is configured to drive the pickup head 234 toward (descend) or away from (ascend) the base 210. Simultaneously, the first linear actuator 250 drives the second support 2321 along the guide slot 242, thereby driving the pickup head 234 along its longitudinal axis.

[0039] See also Figure 6 The figure shows the process of peeling the carrier substrate 4. The wafer 3 is first temporarily bonded to the carrier substrate 4. The carrier substrate 4 can be, but is not limited to, a glass substrate. The carrier substrate 4 is used to enhance the mechanical strength of the wafer 3 from its backside. The wafer 3 is then placed in a thinning machine, where its surface is polished using methods such as chemical mechanical polishing to reduce its thickness and flatten its surface. The carrier substrate 4 enhances the mechanical strength of the wafer 3 and prevents warping during the thinning process.

[0040] like Figure 6 and Figure 7 As shown, the multiple push rods 224 of the carrier device 220 first rise and protrude from the stripping processing part 222a, and the wafer 3 to be stripped and its carrier substrate 4 are moved by a robot arm or other handling equipment, placed on the push rods 224, and the wafer 3 is facing the stripping processing part 222a.

[0041] like Figure 8 As shown, the ejector pin 224 then descends and becomes fully embedded in the carrier platform 222, placing the carrier substrate 4 and the wafer 3 to be debonded in the debonding section 222a. The suction assembly 223 begins applying negative pressure to attract and secure the wafer 3, while the heater 225 begins heating the wafer 3 and carrier substrate 4, weakening the bonded structure, for example, by softening the adhesive used for bonding.

[0042] like Figure 9 and Figure 10 As shown, the second linear actuator 260 drives the pickup head 234 downward to contact the carrier substrate 4, and the pickup head 234 vacuum-absorbs the carrier substrate 4. The second linear actuator 260 drives the pickup head 234 upward to peel the carrier substrate 4 from the wafer 3.

[0043] like Figure 9 and Figure 10 As shown, the second driving support 2321 of the first linear actuator 250 moves along the guide slot 242, moving the pickup head 234 and the carrier substrate 4 to the plate cooling device 100, thereby placing the carrier substrate 4 in the cooling placement area 110a. Through the small contact area of ​​the contact pad 120, the adhesive 4a on the bottom surface of the carrier substrate 4 generates a viscous fixing force, temporarily securing the carrier substrate 4 in the cooling placement area 110a, preventing horizontal movement.

[0044] like Figure 11 As shown, at this time, the carrier substrate 4 is cooled by a cooling device provided inside or outside the cooling plate 110 , such as a liquid cooling device for liquid cooling the cooling plate 110 , or an air cooling device for providing cooling airflow to the upper surface 111 .

[0045] The carrier substrate 4 that has completed cooling can be picked up by other robotic arms or pickup devices and moved to the transfer plate. Similarly, the wafer 3 located in the stripping processing section 222a can be picked up by other robotic arms or pickup devices and moved to its transfer plate. As mentioned above, the total area of ​​the multiple contact pads 120 is less than 3% of the area of ​​the carrier substrate 4. Through the small area contact of the contact pads 120, the positive adhesive force (parallel to the normal direction of the upper surface 111) generated by the adhesive 4a on the bottom surface of the carrier substrate 4 will not be too large, and the pickup head 234 can easily pick up the carrier substrate 4 without causing a pickup failure or damage to the carrier substrate 4. The adhesion between the carrier substrate 4 and the contact pads 120 can still provide sufficient shear direction adhesive force to prevent the carrier substrate 4 from horizontal displacement on the cooling plate 110.

[0046] By means of the plate cooling device 100 and the peeling platform 1 having the plate cooling device 100 proposed in the present invention, the positive adhesive force generated by the adhesive 4a on the bottom surface of the carrier substrate 4 will not be too large, thereby avoiding the problem of failure in picking up the carrier substrate 4 during the subsequent transfer of the carrier substrate 4, reducing the error rate of the peeling operation, and effectively improving the productivity.

[0047] The above is only a preferred embodiment of the present invention and is not intended to limit the scope of protection requested by the present invention. That is, all equivalent changes and modifications made in accordance with the shape, structure, characteristics and spirit defined in the claims of the present invention should be included in the scope of protection requested by the present invention.

Claims

1. A peeling platform for peeling a wafer from a carrier substrate, characterized in that: Includes: A base having two movable guide members disposed on two opposite sides thereof; A carrying device is provided on the base and is located between the two movable guide members; the carrying device has: A carrier platform for placing the wafer and the carrier substrate thereon; a peeling processing portion is provided on the top surface of the carrier platform for placing the wafer and the carrier substrate, with the carrier substrate located on the outside; An adsorption component, provided in the stripping processing part, for adsorbing the wafer; as well as A plurality of ejector pins are escalably disposed in the stripping portion, and can be lowered to be completely buried in the carrier, or raised to push off or receive the wafer; a plate cooling device disposed on the base and located between the two movable guides, the plate cooling device comprising a cooling plate and a plurality of contact pads, the cooling plate having an upper surface, the plurality of contact pads disposed on the upper surface, wherein the plurality of contact pads protrude from the upper surface, and a total area of ​​the plurality of contact pads is less than 3% of an area of ​​the carrier substrate; and The carrier substrate picking device includes a movable base and a picking head; wherein the movable base is movably coupled to the two movable guide members; the picking head is movably arranged on the movable base, and is used to adsorb on the carrier substrate to peel the carrier substrate from the wafer and move the carrier substrate to the upper surface of the plate cooling device.

2. The peeling platform according to claim 1, characterized in that The front edge of the upper surface is arranged in the notch.

3. The peeling platform according to claim 2, characterized in that: A groove is provided on the upper surface, and the groove extends from the notch to the rear edge of the upper surface. The plate cooling device also includes a fixing pad, and the fixing pad is provided in the groove; the fixing pad is used for a fixing member to pass through.

4. The peeling platform according to claim 1, characterized in that: The cooling plate further comprises two side recesses located on two opposite sides of the upper surface, and the plate cooling device further comprises a plurality of fixing pads disposed on the two side recesses; each fixing pad is used for allowing a fixing member to pass through.

5. The stripping platform according to claim 1, characterized in that: A guide groove is provided on each of the movable guide members, and the movable base includes two pillars and a bracket connecting the two pillars. The two pillars are respectively inserted into each of the guide grooves so that the movable base can be movably combined with the movable guide member, and the pickup head can be movably provided on the bracket.

6. The peeling platform according to claim 5, characterized in that: It also includes a first linear drive and a second linear drive; the first linear drive is arranged on the base and connected to one of the two pillars, and is used to drive each of the two pillars to move along each of the guide grooves; the pickup head is connected to the bracket through the second linear drive, and is used to drive the pickup head toward or away from the base.

7. The peeling platform according to claim 1, characterized in that: The peeling processed portion is a shallow groove.

8. The stripping platform according to claim 1, characterized in that: A heater is embedded in the carrier platform to heat the wafer and the carrier substrate placed in the stripping processing part.

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