A press-fit power module and packaging method thereof

Abstract

The present invention discloses a press-fit power module and a packaging method thereof, wherein the press-fit power module includes a housing, a bottom plate submodule, an intermediate submodule, a metal cover plate and a pressing block structure. One or more intermediate submodules are provided, each first chip unit is connected to the metal middle plate of an adjacent intermediate submodule through a pressing block structure, each second chip unit in an intermediate submodule adjacent to the metal cover plate is connected to the metal cover plate through a pressing block structure, and each second chip unit in the remaining intermediate submodules is connected to the metal middle plate of another adjacent intermediate submodule through a pressing block structure. The bottom plate submodule and multiple intermediate submodules are connected in series in sequence, and the metal middle plate of the intermediate submodule serves as both a cover plate for the submodule on one side and a bottom plate for the submodule on the other side. The structure is more compact and simple, which is conducive to simplifying the external circuit of the series connection of adjacent submodules, thereby reducing stray inductance.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronic devices, and in particular to a press-fit power module and a packaging method thereof. Background Art

[0002] Power modules are used in rail transit, industrial control, power grid transmission, photovoltaic power generation, and other fields. Existing power modules mainly include welded power modules and press-fit power modules. Welded power modules achieve electrical connections between components through welding and wire bonding. However, when the operating voltage and current capacity of the power system increase, more chips need to be connected in parallel within the welded power module, resulting in an increase in the number of leads, which in turn increases parasitic parameters, exacerbating voltage overshoot, increasing turn-off losses, and causing module current imbalance. The application reliability of welded power modules is relatively low. Press-fit power modules, on the other hand, achieve electrical connections between chips through surface contact, eliminating the need for leads. Therefore, connecting more chips in parallel does not cause a significant increase in parasitic parameters. Press-fit power modules have advantages such as high current capacity, low stray inductance, and fast switching speed.

[0003] However, in actual use, it is usually necessary to connect multiple press-fit power modules in series. The series connection of multiple press-fit power modules makes the external structure complex, introduces more stray inductance, and affects the working performance of the press-fit power modules. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a press-fit power module with a more compact and simple structure, which helps simplify the external circuit of adjacent submodules connected in series, thereby reducing stray inductance and improving the operating performance of the press-fit power module.

[0005] The present invention also provides a compression-type power module packaging method for manufacturing the compression-type power module.

[0006] A first embodiment of the present invention provides a press-fit power module, comprising:

[0007] The housing has a first opening and a second opening at both ends;

[0008] A base submodule comprising a metal base, a first gate PCB, a plurality of first terminals, and a plurality of first chip units, wherein the metal base covers the first opening, the first terminals are connected to a side of the metal base facing the interior of the housing, the plurality of first chip units are mounted one-to-one to the plurality of first terminals, the first gate PCB is mounted on the metal base, and the plurality of first chip units are connected in parallel via the first terminals;

[0009] an intermediate submodule comprising a metal intermediate plate, a second gate PCB, a plurality of second terminals, and a plurality of second chip units, wherein the metal intermediate plate is accommodated within the housing, the second terminals are connected to a side of the metal intermediate plate facing away from the metal bottom plate, the plurality of second chip units are mounted one-to-one to the plurality of second terminals, the second gate PCB is mounted on the metal intermediate plate, and the plurality of second chip units are connected in parallel via the second terminals;

[0010] a metal cover plate, covering the second opening;

[0011] Briquetting structure;

[0012] The intermediate submodule is provided with one, each of the first chip units is connected to the metal intermediate plate of the adjacent intermediate submodule via a pressing block structure, each of the second chip units is connected to the metal cover plate via a pressing block structure, and the bottom plate submodule is connected in series with the intermediate submodule;

[0013] or,

[0014] There are multiple intermediate submodules, each of the first chip units is connected to the metal intermediate plate of the adjacent intermediate submodule through a pressing block structure, each of the second chip units in the intermediate submodule adjacent to the metal cover plate is connected to the metal cover plate through a pressing block structure, and each of the second chip units in the remaining intermediate submodules is connected to the metal intermediate plate of another adjacent intermediate submodule through a pressing block structure. The bottom plate submodule is connected in series with multiple intermediate submodules in sequence.

[0015] The press-fit power module provided by the embodiment of the first aspect of the present invention has at least the following beneficial effects: the interior of the press-fit power module provided by the embodiment of the first aspect of the present invention is formed by stacking a bottom plate sub-module and one or more intermediate sub-modules in series and sequentially connecting them. The metal intermediate plate of the intermediate sub-module serves as both a cover plate for the sub-module on one side and a bottom plate for the sub-module on the other side. Compared with the use of multiple single-layer chip devices in series, the press-fit power module provided by the embodiment of the first aspect of the present invention is formed by stacking multiple sub-modules in series into one device, and the structure is more compact and simple, which is conducive to simplifying the external circuit of adjacent sub-modules in series, thereby reducing stray inductance and improving the working performance of the press-fit power module.

[0016] In some embodiments of the present invention, the press-fit power module further includes a cooling pipe, the metal intermediate plate has a flow channel inside, the cooling pipe is passed through the outer shell and connected to the metal intermediate plate, the cooling pipe is connected to the flow channel, and the cooling pipe and the flow channel are used for the flow of cooling medium.

[0017] In some embodiments of the present invention, the base submodule further includes a plurality of first spring pins, each of which is mounted on one of the first terminals, and at least a portion of the first chip units is electrically connected to the first gate PCB board through the first spring pins; the intermediate submodule further includes a plurality of second spring pins, each of which is mounted on one of the second terminals, and at least a portion of the second chip units is electrically connected to the second gate PCB board through the second spring pins.

[0018] In some embodiments of the present invention, the base plate submodule further includes a plurality of first fixing blocks, a plurality of first spring pins are installed on the plurality of first fixing blocks in a one-to-one correspondence, at least some of the first terminals have a first fixing groove, and each first fixing block is correspondingly embedded in one of the first fixing grooves; the intermediate submodule further includes a plurality of second fixing blocks, a plurality of second spring pins are installed on the plurality of second fixing blocks in a one-to-one correspondence, at least some of the second terminals have a second fixing groove, and each second fixing block is correspondingly embedded in one of the second fixing grooves.

[0019] In some embodiments of the present invention, the pressing block structure includes a pressing block and a spring sheet, the pressing block is connected to the spring sheet, the spring sheet is connected to the metal intermediate plate or the metal cover plate, and the pressing block abuts against the first chip unit or the second chip unit.

[0020] In some embodiments of the present invention, the pressure block structure also includes an elastic member, the pressure block includes a connecting portion and an abutting portion that are connected to each other, the abutting portion extends toward the outside of the connecting portion, the elastic member is sleeved on the connecting portion, and the two ends of the elastic member respectively abut against the abutting portion and the metal intermediate plate or the metal cover plate.

[0021] In some embodiments of the present invention, a side of the metal intermediate plate away from the second terminal is connected to a limiting boss, and / or a side of the metal cover plate facing the interior of the shell is connected to a limiting boss; the limiting boss has a limiting blind hole and a limiting slot, the limiting blind hole extends in a direction perpendicular to the metal intermediate plate, the limiting slot is connected to the limiting blind hole in the circumferential direction of the limiting blind hole, the spring sheet is embedded in the limiting slot, the pressure block is inserted into the limiting blind hole, and the two ends of the elastic member are respectively abutted against the abutting portion and the limiting boss.

[0022] In some embodiments of the present invention, on the same metal intermediate plate or on the metal cover plate, a plurality of the pressing block structures are arranged in an array, and the arrangement directions of any two adjacent spring sheets are perpendicular to each other.

[0023] In some embodiments of the present invention, the first chip unit includes a first insulating frame, a first lower silver sheet, a first power chip, a first upper silver sheet and a first insulating pressure plate, the first insulating frame is sleeved on the first terminal, the first lower silver sheet, the first power chip, and the first upper silver sheet are stacked in sequence and clamped between the first terminal and the first insulating pressure plate, the first lower silver sheet contacts the first terminal, and the first upper silver sheet contacts the pressure block structure; the second chip unit includes a second insulating frame, a second lower silver sheet, a second power chip, a second upper silver sheet and a second insulating pressure plate, the second insulating frame is sleeved on the second terminal, the second lower silver sheet, the second power chip, and the second upper silver sheet are stacked in sequence and clamped between the second terminal and the second insulating pressure plate, the second lower silver sheet contacts the second terminal, and the second upper silver sheet contacts the pressure block structure.

[0024] A packaging method for a press-fit power module provided in an embodiment of the second aspect of the present invention is used to manufacture the press-fit power module provided in any embodiment of the first aspect of the present invention. The packaging method for the press-fit power module comprises the following steps:

[0025] The base plate submodule preparation step is performed, and the base plate submodule preparation step includes:

[0026] Taking or preparing a metal base plate, a surface of the metal base plate is connected to a plurality of first terminals;

[0027] Mounting a first gate PCB on the surface of the metal base plate having the first terminal;

[0028] Mounting a plurality of first chip units to a plurality of first terminals in a one-to-one correspondence, and electrically connecting the first chip units to the first gate PCB board, so that the plurality of first chip units are connected in parallel through the first terminals to form a bottom plate submodule;

[0029] Performing an intermediate submodule preparation step, the intermediate submodule preparation step comprising:

[0030] Taking or preparing a metal intermediate plate, a surface of which is connected to a plurality of second terminals;

[0031] Mounting the second gate PCB on the surface of the metal middle plate having the second terminal;

[0032] Mounting a plurality of second chip units to a plurality of second terminals in a one-to-one correspondence, and electrically connecting the second chip units to the second gate PCB board, so that the plurality of second chip units are connected in parallel through the second terminals to form an intermediate submodule;

[0033] Determine whether it is necessary to continue preparing the intermediate submodule, and if so, repeat the intermediate submodule preparation steps;

[0034] If the number of the intermediate submodule is one, then:

[0035] Installing a plurality of pressing block structures on a side of the metal intermediate plate away from the second terminal, and connecting the plurality of pressing block structures on the metal intermediate plate to the plurality of first chip units in a one-to-one correspondence;

[0036] Taking or preparing a metal cover plate, installing a plurality of the pressing block structures on one side of the metal cover plate, and connecting the plurality of the pressing block structures on the metal cover plate to a plurality of the second chip units in a one-to-one correspondence;

[0037] Connecting the bottom plate submodule and the middle submodule in series;

[0038] If there are multiple intermediate submodules, then:

[0039] stacking the bottom plate submodule and the plurality of intermediate submodules in sequence;

[0040] Installing a plurality of pressing block structures on a side of the metal intermediate plate closest to the bottom plate submodule, away from the second terminal connected thereto, and connecting the plurality of pressing block structures on the metal intermediate plate to the plurality of first chip units in a one-to-one correspondence;

[0041] Installing a plurality of pressing block structures on a side of the remaining metal intermediate plate away from the second terminals connected thereto, and connecting the plurality of pressing block structures on the metal intermediate plate to the plurality of second chip units of the adjacent intermediate submodules in a one-to-one correspondence;

[0042] Take or prepare a housing having a first opening and a second opening facing each other, and install the assembly of the bottom plate subunit, the intermediate subunit, and the metal cover plate into the interior of the housing so that the metal bottom plate covers the first opening and the metal cover plate covers the second opening;

[0043] The bottom plate submodule and the plurality of intermediate submodules are sequentially connected in series.

[0044] A packaging method for a press-fit power module provided in an embodiment of the second aspect of the present invention has at least the following beneficial effects: the packaging method for a press-fit power module provided in an embodiment of the second aspect of the present invention can be used to manufacture the press-fit power module provided in an embodiment of the first aspect of the present invention, wherein the press-fit power module is internally formed by stacking a bottom plate submodule and one or more intermediate submodules in series, and the specific number of intermediate submodules can be designed according to actual needs. The metal intermediate plate of the intermediate submodule serves as both a cover plate for the submodule on one side and a bottom plate for the submodule on the other side. Compared with the use of multiple single-layer chip devices in series, the press-fit power module provided in an embodiment of the first aspect of the present invention is formed by stacking multiple submodules in series into one device, and the structure is more compact and simple. Therefore, the packaging process is simpler, and it is beneficial to simplify the external circuit of adjacent submodules in series, thereby reducing stray inductance and improving the working performance of the press-fit power module.

[0045] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0047] Figure 1 A three-dimensional schematic diagram of a press-fit power module provided by some embodiments of the first aspect of the present invention;

[0048] Figure 2 for Figure 1 An exploded diagram of the base submodule and the middle submodule of the press-fit power module is shown;

[0049] Figure 3 for Figure 1 The front view of the press-fit power module is shown;

[0050] Figure 4 for Figure 3 Cross-sectional view of section AA;

[0051] Figure 5 for Figure 4 Enlarged view of point C in the middle;

[0052] Figure 6 for Figure 4 Enlarged view of point D in the middle;

[0053] Figure 7 for Figure 4 Enlarged view of point E in the middle;

[0054] Figure 8 for Figure 3 Cross-sectional view of the middle BB section;

[0055] Figure 9 for Figure 1 An exploded schematic diagram of the pressing block structure in the press-fit power module shown;

[0056] Figure 10 for Figure 1 An exploded schematic diagram of the first chip unit (second chip unit) in the press-fit power module shown;

[0057] Figure 11 for Figure 1 A schematic perspective view of a metal intermediate plate in a press-fit power module is shown.

[0058] Reference numerals:

[0059] Housing 100, bottom plate submodule 200, metal bottom plate 210, first gate PCB board 220, first terminal 230, first chip unit 240, first insulating frame 241, first lower silver plate 242, first power chip 243, first upper silver plate 244, first insulating pressure plate 245, first spring pin 250, first fixing block 260, middle submodule 300, metal middle plate 310, flow channel 311, second gate PCB board 320, second terminal 330, second core Sheet unit 340, second insulating frame 341, second lower silver sheet 342, second power chip 343, second upper silver sheet 344, second insulating pressure plate 345, second spring pin 350, limiting boss 360, limiting blind hole 361, limiting slot 362, second fixed block 370, metal cover 400, pressing block structure 500, pressing block 510, connecting part 511, abutting part 512, pressing part 513, spring piece 520, elastic part 530, cooling pipe 600, ventilation pipe 700. DETAILED DESCRIPTION

[0060] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0061] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0062] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0063] In the description of the present invention, reference to terms such as "one embodiment" or "some embodiments" means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0064] Reference Figures 1 to 4 The first embodiment of the present invention provides a press-fit power module, comprising a housing 100, a base submodule 200, an intermediate submodule 300, a metal cover 400, and a pressing block structure 500. The housing 100 has a first opening and a second opening at both ends, respectively. The base submodule 200 comprises a metal base 210, a first gate PCB board 220, a plurality of first terminals 230, and a plurality of first chip units 240. The metal base 210 covers the first opening, the first terminal 230 is connected to the side of the metal base 210 facing the interior of the housing 100, and the plurality of first chip units 240 are mounted one-to-one on the plurality of first terminals 230. The first gate PCB board 220 is connected to the first terminal 230. 0 is mounted on the metal base plate 210, and multiple first chip units 240 are connected in parallel via the first terminals 230; the intermediate submodule 300 includes a metal intermediate plate 310, a second gate PCB plate 320, multiple second terminals 330, and multiple second chip units 340. The metal intermediate plate 310 is accommodated in the interior of the housing, the second terminals 330 are connected to the side of the metal intermediate plate 310 facing away from the metal base plate 210, the multiple second chip units 340 are mounted one-to-one to the multiple second terminals 330, the second gate PCB plate 320 is mounted on the metal intermediate plate 310, and the multiple second chip units 340 are connected in parallel via the second terminals 330; the metal cover plate 400 covers the second opening.

[0065] In some embodiments of the present invention, reference Figure 4There are two intermediate submodules 300, each first chip unit 240 is connected to the metal intermediate plate 310 of the adjacent intermediate submodule 300 through a pressing block structure 500, each second chip unit 340 in the intermediate submodule 300 adjacent to the metal cover plate 400 is connected to the metal cover plate 400 through a pressing block structure 500, and each second chip unit 340 in the remaining intermediate submodules 300 is connected to the metal intermediate plate 310 of another adjacent intermediate submodule 300 through a pressing block structure 500. The bottom plate submodule 200 and the two intermediate submodules 300 are connected in series in sequence.

[0066] In other embodiments of the present invention, the intermediate submodule 300 is provided with one, each first chip unit 240 is connected to the metal intermediate plate 310 of the adjacent intermediate submodule 300 via a pressing block structure 500, each second chip unit 340 is connected to the metal cover plate 400 via a pressing block structure 500, and the bottom plate submodule 200 and the intermediate submodule 300 are connected in series;

[0067] In some other embodiments of the present invention, there are more than two intermediate sub-modules 300, each first chip unit 240 is connected to the metal intermediate plate 310 of the adjacent intermediate sub-module 300 through a pressing block structure 500, each second chip unit 340 in the intermediate sub-module 300 adjacent to the metal cover plate 400 is connected to the metal cover plate 400 through a pressing block structure 500, and each second chip unit 340 in the remaining intermediate sub-modules 300 is connected to the metal intermediate plate 310 of another adjacent intermediate sub-module 300 through a pressing block structure 500, and the bottom plate sub-module 200 and multiple intermediate sub-modules 300 are connected in series in sequence.

[0068] The interior of the press-fit power module provided by the embodiment of the first aspect of the present invention is formed by stacking a bottom plate submodule 200 and one or more intermediate submodules 300 and connecting them in series in sequence. The metal intermediate plate 310 of the intermediate submodule 300 serves as both a cover plate for the submodule on one side and a bottom plate for the submodule on the other side. Compared to the use of multiple single-layer chip devices in series, the press-fit power module provided by the embodiment of the first aspect of the present invention is formed by stacking and press-fitting multiple submodules into one device. The structure is more compact and simple, which is conducive to simplifying the external circuit of adjacent submodules in series, thereby reducing stray inductance and improving the working performance of the press-fit power module. In addition, the interior of the press-fit power module provided by the embodiment of the first aspect of the present invention has multiple submodules connected in series, which is conducive to improving the overall withstand voltage value of the press-fit power module and meeting higher withstand voltage requirements.

[0069] Further, refer to Figure 1 and Figure 8The press-fit power module also includes a cooling tube 600. A metal intermediate plate 310 has a flow channel 311 within it. The cooling tube 600 passes through the housing 100 and is connected to the metal intermediate plate 310. The cooling tube 600 communicates with the flow channel 311, allowing the cooling medium to flow. The metal intermediate plate 310 serves as both an electrical interconnect between the chips in adjacent submodules and a heat sink. This improves the heat dissipation efficiency of the press-fit power module while also making it more compact.

[0070] Further, refer to Figure 2 and Figure 6 The base submodule 200 further includes a plurality of first spring pins 250, each of which is mounted on a corresponding first terminal 230. At least a portion of the first chip unit 240 is electrically connected to the first gate PCB board 220 via the first spring pins 250. The first spring pins 250 can improve the stability of the electrical connection between the first chip unit 240 and the first gate PCB board 220 and facilitate the simplification of the design of the gate control circuit. Figure 2 and Figure 5 The intermediate submodule 300 further includes a plurality of second spring pins 350 , each of which is mounted on a corresponding second terminal 330 . At least some of the second chip units 340 are electrically connected to the second gate PCB 320 via the second spring pins 350 . The second spring pins 350 can improve the stability of the electrical connection between the second chip units 340 and the second gate PCB 320 and help simplify the design of the gate control circuit.

[0071] Further, refer to Figure 2 and Figure 6 The bottom plate submodule 200 further includes a plurality of first fixing blocks 260, and the plurality of first spring pins 250 are mounted on the plurality of first fixing blocks 260 in a one-to-one correspondence. At least some of the first terminals 230 have first fixing grooves, and each first fixing block 260 is correspondingly embedded in a first fixing groove. The inner wall of the first fixing groove can provide a stable limit for the first fixing block 260, so that the first fixing block 260 can stably support the first spring pins 250, thereby ensuring that the first spring pins 250 are accurately positioned and not easily loosened. Figure 2 and Figure 5 The intermediate submodule 300 further includes a plurality of second fixing blocks 370, and the plurality of second spring pins 350 are mounted on the plurality of second fixing blocks 370 in a one-to-one correspondence. At least some of the second terminals 330 have second fixing grooves, and each second fixing block 370 is correspondingly embedded in a second fixing groove. The inner wall of the second fixing groove can provide a stable limit for the second fixing block 370, so that the second fixing block 370 can stably support the second spring pins 350, thereby ensuring that the second spring pins 350 are accurately positioned and not easily loosened.

[0072] Further, refer to Figure 2 and Figure 9 The pressing block structure 500 includes a pressing block 510 and a spring 520. The pressing block 510 is connected to the spring 520. Figure 6 In the pressing block structure 500 located between the bottom plate submodule 200 and the middle submodule 300, the spring 520 is connected to the metal middle plate 310, and the pressing block 510 abuts against the first chip unit 240; Figure 7 , in the pressing block structure 500 located between the metal cover plate 400 and the intermediate submodule 300, the spring 520 is connected to the metal cover plate 400, and the pressing block 510 abuts against the second chip unit 340; Figure 5 In the compression block structure 500 located between the two intermediate submodules 300, the spring piece 520 is connected to the metal intermediate plate 310, and the compression block 510 abuts the second chip unit 340. The spring piece 520 forms an elastic connection between the compression block 510 and the metal cover plate 400 or the metal intermediate plate 310. After the bottom plate submodule 200 and the intermediate submodule 300 are stacked sequentially inside the housing 100 and the metal cover plate 400 is closed over the second opening of the housing 100, each laminated block structure 500 is squeezed, and the spring piece 520 deforms under the squeezing force, allowing the compression block 510 to closely contact the first chip unit 240 or the second chip unit 340 it contacts. Even if there is a height error between the chip units, the deformation of the spring piece 520 can compensate for it, which helps to balance the pressure on each chip unit.

[0073] Further, refer to Figure 2 and Figure 9 The pressing block structure 500 further includes an elastic member 530. The pressing block 510 includes a connecting portion 511 and an abutting portion 512 connected to each other. The abutting portion 512 extends outward from the connecting portion 511. The elastic member 530 is sleeved on the connecting portion 511. Figure 5 and Figure 6 In the pressing block structure 500 between the two intermediate submodules 300 and in the pressing block structure 500 between the bottom plate submodule 200 and the intermediate submodule 300, both ends of the elastic member 530 abut against the abutting portion 512 and the metal intermediate plate 310 respectively; Figure 7In the compression block structure 500 located between the metal cover plate 400 and the intermediate submodule 300, the two ends of the elastic member 530 abut against the abutment portion 512 and the metal cover plate 400, respectively. The elastic member 530 further forms an elastic connection between the compression block 510 and the metal cover plate 400 or the metal intermediate plate 310. After the bottom plate submodule 200 and the intermediate submodule 300 are stacked sequentially within the housing 100 and the metal cover plate 400 is closed over the second opening of the housing 100, each laminated block structure 500 is squeezed, and the springs 520 and the elastic member 530 are deformed under the squeezing force, ensuring close contact between the compression block 510 and the first chip unit 240 or the second chip unit 340 it contacts. Even if there are height errors between the chip units, the deformation of the springs 520 and the elastic member 530 can compensate for this, thereby facilitating better pressure balance between the chip units.

[0074] Further, refer to Figures 4 to 7 , the side of the metal intermediate plate 310 away from the second terminal 330 is connected to the limiting boss 360, and the side of the metal cover plate 400 facing the interior of the housing 100 is connected to the limiting boss 360; Figure 11 The limiting boss 360 has a limiting blind hole 361 and a limiting slot 362. The limiting blind hole 361 extends in a direction perpendicular to the metal intermediate plate 310. The limiting slot 362 is connected to the limiting blind hole 361 in the circumferential direction of the limiting blind hole 361. The spring piece 520 is embedded in the limiting slot 362. The pressure block 510 is inserted into the limiting blind hole 361. The two ends of the elastic member 530 respectively abut against the abutting portion 512 and the limiting boss 360. During the installation of the compression block structure 500, the limiting boss 360 positions the spring piece 520 through the limiting slot 362, and positions the compression block 510 through the limiting blind hole 361, which is conducive to reducing the installation difficulty of the compression block structure 500; during the stacking and crimping of multiple sub-modules, the limiting boss 360 limits the deformation of the spring piece 520 through the limiting slot 362, and limits the movement of the compression block 510 through the limiting blind hole 361, which is conducive to limiting the direction of the clamping force provided by the compression block structure 500 and improving the structural stability inside the crimped power module.

[0075] Furthermore, the spring clip 520 is connected to the metal middle plate 310 or the metal cover plate 400 by bolts, so as to achieve a tight connection between the spring clip 520 and the metal middle plate 310 or between the spring clip 520 and the metal cover plate 400 through threads, thereby ensuring the reliability of the electrical connection.

[0076] Further, refer to Figure 2On the same metal intermediate plate 310, multiple compression block structures 500 are arranged in an array, with any two adjacent spring tabs 520 arranged perpendicularly to each other. This facilitates a more compact arrangement of the multiple compression block structures 500, thereby reducing the volume of the press-fit power module. Similarly, on the metal cover plate 400, multiple compression block structures 500 are also arranged in an array, with any two adjacent spring tabs 520 arranged perpendicularly to each other.

[0077] It is understandable that, referring to Figure 11 On the same metal intermediate plate 310, multiple limiting bosses 360 are arranged in an array, and the limiting grooves 362 of any two adjacent limiting bosses 360 extend perpendicularly to each other. This ensures that in the multiple pressing block structures 500 connected to the metal intermediate plate 310, the arrangement directions of any two adjacent spring pieces 520 are perpendicular to each other. Similarly, on the metal cover plate 400, multiple limiting bosses 360 are also arranged in an array, and the limiting grooves 362 of any two adjacent limiting bosses 360 extend perpendicularly to each other.

[0078] Further, refer to Figure 10 The first chip unit 240 includes a first insulating frame 241, a first lower silver sheet 242, a first power chip 243, a first upper silver sheet 244 and a first insulating pressure plate 245. The first insulating frame 241 is sleeved on the first terminal 230. The first lower silver sheet 242, the first power chip 243, and the first upper silver sheet 244 are stacked in sequence and clamped between the first terminal 230 and the first insulating pressure plate 245. The first lower silver sheet 242 contacts the first terminal 230, and the first upper silver sheet 244 contacts the pressure block structure 500. The first power chip 243 is electrically connected to the first terminal 230 via the first lower silver sheet 242, and the first lower silver sheet 242 can buffer the pressure between the first terminal 230 and the first power chip 243. The first power chip 243 is electrically connected to the pressing block structure 500 via the first upper silver sheet 244, and the first upper silver sheet 244 can buffer the pressure between the pressing block structure 500 and the first power chip 243, which can reduce the pressure on the first power chip 243 while ensuring reliable electrical connection between the first power chip 243 and other components. The first insulating frame 241 is used to limit the positions of the first lower silver sheet 242, the first power chip 243, and the first upper silver sheet 244 in the circumferential direction, and the first insulating pressure plate 245 is used to press the first lower silver sheet 242, the first power chip 243, and the first upper silver sheet 244 onto the first terminal 230 in the thickness direction, so that the first lower silver sheet 242, the first power chip 243, and the first upper silver sheet 244 are insulated from other components in the circumferential direction, and electrical connection is achieved only in the thickness direction, thereby ensuring the stability of the electrical connection and the stability of the structure.

[0079] Similarly, refer to Figure 10The second chip unit 340 includes a second insulating frame 341, a second lower silver sheet 342, a second power chip 343, a second upper silver sheet 344 and a second insulating pressure plate 345. The second insulating frame 341 is sleeved on the second terminal 330. The second lower silver sheet 342, the second power chip 343, and the second upper silver sheet 344 are stacked in sequence and clamped between the second terminal 330 and the second insulating pressure plate 345. The second lower silver sheet 342 contacts the second terminal 330, and the second upper silver sheet 344 contacts the pressure block structure 500. The second power chip 343 is electrically connected to the second terminal 330 via the second lower silver sheet 342, and the second lower silver sheet 342 can buffer the pressure between the second terminal 330 and the second power chip 343. The second power chip 343 is electrically connected to the pressing block structure 500 via the second upper silver sheet 344, and the second upper silver sheet 344 can buffer the pressure between the pressing block structure 500 and the second power chip 343, which can ensure reliable electrical connection between the second power chip 343 and other components while reducing the pressure on the second power chip 343. The second insulating frame 341 is used to limit the positions of the second lower silver sheet 342, the second power chip 343, and the second upper silver sheet 344 in the circumferential direction, and the second insulating pressure plate 345 is used to press the second lower silver sheet 342, the second power chip 343, and the second upper silver sheet 344 onto the second terminal 330 in the thickness direction, so that the second lower silver sheet 342, the second power chip 343, and the second upper silver sheet 344 are insulated from other components in the circumferential direction, and electrical connection is achieved only in the thickness direction, thereby ensuring the stability of the electrical connection and the stability of the structure.

[0080] Further, refer to Figure 10 The first insulating plate 245 has a through hole for exposing the first upper silver sheet 244, and the second insulating plate 345 has a through hole for exposing the second upper silver sheet 344. Figure 9 The pressing block 510 in the pressing block structure 500 further includes a pressing portion 513, which is located at one end of the pressing block 510 away from the spring 520. Figure 6 In the pressing block structure 500 between the bottom plate submodule 200 and the middle submodule 300, the pressing portion 513 is accommodated in the through hole of the first insulating pressing plate 245 and abuts against the first upper silver sheet 244. Figure 5 and Figure 7 , located in the pressure block structure 500 between the two intermediate sub-modules 300, or located in the pressure block structure 500 between the metal cover plate 400 and the intermediate sub-module 300, the clamping portion 513 is accommodated in the through hole of the second insulating pressure plate 345 and abuts against the second upper silver sheet 344.

[0081] Furthermore, in order to further improve the structural stability, insulating glue can be encapsulated between the first insulating frame 241 and the first insulating pressure plate 245, and between the second insulating frame 341 and the second insulating pressure plate 345, so that the first chip unit 240 and the second chip unit 340 have better insulation performance.

[0082] Furthermore, in order to improve the appearance of the first chip unit 240 and the second chip unit 340 , the upper surface of the first insulating plate 245 can be set flush with the upper surface of the first insulating frame 241 , and the upper surface of the second insulating plate 345 can be set flush with the upper surface of the second insulating frame 341 .

[0083] Furthermore, in order to ensure the insulation performance inside the press-fit power module, an inert gas may be filled into the internal space of the press-fit power module defined by the housing 100, the metal base plate 210 and the metal cover plate 400. Figure 1 The press-fit power module further includes a vent pipe 700, which is connected to the housing 100 and communicates with the internal space of the press-fit power module defined by the housing 100, the metal base plate 210 and the metal cover plate 400, for introducing inert gas into the internal space.

[0084] A packaging method for a press-fit power module provided in an embodiment of the second aspect of the present invention is used to manufacture the press-fit power module provided in any embodiment of the first aspect of the present invention. The packaging method for the press-fit power module comprises the following steps:

[0085] The bottom plate submodule 200 preparation step is performed, and the bottom plate submodule 200 preparation step includes:

[0086] Take or prepare a metal base plate 210 , wherein a plurality of first terminals 230 are connected to the surface of the metal base plate 210 ;

[0087] The first gate PCB board 220 is mounted on the surface of the metal base plate 210 having the first terminal 230;

[0088] Mounting a plurality of first chip units 240 to a plurality of first terminals 230 in a one-to-one correspondence, and electrically connecting the first chip units 240 to the first gate PCB board 220, so that the plurality of first chip units 240 are connected in parallel through the first terminals 230 to form a bottom plate submodule 200;

[0089] The intermediate submodule 300 preparation step is performed, and the intermediate submodule 300 preparation step includes:

[0090] Take or prepare a metal intermediate plate 310 , wherein a plurality of second terminals 330 are connected to the surface of the metal intermediate plate 310 ;

[0091] The second gate PCB board 320 is mounted on the surface of the metal middle board 310 having the second terminal 330;

[0092] Mounting multiple second chip units 340 to multiple second terminals 330 in a one-to-one correspondence, and electrically connecting the second chip units 340 to the second gate PCB 320, so that the multiple second chip units 340 are connected in parallel through the second terminals 330 to form an intermediate submodule 300;

[0093] Determine whether it is necessary to continue preparing the intermediate submodule 300. If so, repeat the steps of preparing the intermediate submodule 300.

[0094] If the number of the intermediate submodule 300 is one, then:

[0095] A plurality of pressing block structures 500 are installed on a side of the metal intermediate plate 310 away from the second terminal 330 , and the plurality of pressing block structures 500 on the metal intermediate plate 310 are connected to the plurality of first chip units 240 in a one-to-one correspondence;

[0096] Take or prepare a metal cover plate 400, install a plurality of pressing block structures 500 on one side of the metal cover plate 400, and connect the plurality of pressing block structures 500 on the metal cover plate 400 to the plurality of second chip units 340 in a one-to-one correspondence;

[0097] Connecting the bottom plate submodule 200 and the middle submodule 300 in series;

[0098] If there are multiple intermediate submodules 300, then:

[0099] Stacking the bottom plate submodule 200 and the plurality of middle submodules 300 in sequence;

[0100] A plurality of pressing block structures 500 are installed on a side of the metal intermediate plate 310 closest to the bottom plate submodule 200 away from the second terminal 330 to which it is connected, and the plurality of pressing block structures 500 on the metal intermediate plate 310 are connected one-to-one to the plurality of first chip units 240;

[0101] A plurality of pressing block structures 500 are installed on a side of the remaining metal intermediate plate 310 away from the second terminals 330 to which they are connected, and the plurality of pressing block structures 500 on the metal intermediate plate 310 are connected one-to-one to the plurality of second chip units 340 of the adjacent intermediate submodules 300;

[0102] Prepare or prepare a housing 100 having a first opening and a second opening facing each other, and install the assembly of the bottom plate subunit, the intermediate subunit, and the metal cover 400 into the interior of the housing 100 so that the metal bottom plate 210 covers the first opening and the metal cover 400 covers the second opening.

[0103] The bottom plate submodule 200 and the plurality of middle submodules 300 are sequentially connected in series.

[0104] The packaging method of the press-fit power module provided by the embodiment of the second aspect of the present invention can manufacture the press-fit power module provided by the embodiment of the first aspect of the present invention. The interior of the press-fit power module is formed by stacking a bottom plate sub-module 200 and one or more intermediate sub-modules 300 and connecting them in series in sequence. The specific number of intermediate sub-modules 300 can be designed according to actual needs. The metal intermediate plate 310 of the intermediate sub-module 300 serves as both a cover plate for the sub-module on one side and a bottom plate for the sub-module on the other side. Compared with the use of multiple single-layer chip devices in series, the press-fit power module provided by the embodiment of the first aspect of the present invention is formed by stacking and press-fitting multiple sub-modules into one device, and the structure is more compact and simple. Therefore, the packaging process is simpler, and it is conducive to simplifying the external circuit of adjacent sub-modules in series, thereby reducing stray inductance and improving the working performance of the press-fit power module.

[0105] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. A press-fit power module, characterized in that: include: The housing has a first opening and a second opening at both ends; A base submodule comprising a metal base, a first gate PCB, a plurality of first terminals, and a plurality of first chip units, wherein the metal base covers the first opening, the first terminals are connected to a side of the metal base facing the interior of the housing, the plurality of first chip units are mounted one-to-one to the plurality of first terminals, the first gate PCB is mounted on the metal base, and the plurality of first chip units are connected in parallel via the first terminals; The intermediate submodule includes a metal intermediate plate, a second gate PCB, a plurality of second terminals, and a plurality of second chip units. The metal intermediate plate is accommodated within the housing. The second terminals are connected to a side of the metal intermediate plate facing away from the metal bottom plate. The plurality of second chip units are mounted one-to-one to the plurality of second terminals. The second gate PCB is mounted on the metal intermediate plate. The plurality of second chip units are connected in parallel via the second terminals. The metal intermediate plate has a flow channel inside. a metal cover plate, covering the second opening; Briquetting structure; cooling pipes; There are multiple intermediate submodules, each of the first chip units is connected to the metal intermediate plate of the adjacent intermediate submodule via a pressing block structure, each of the second chip units in the intermediate submodule adjacent to the metal cover plate is connected to the metal cover plate via a pressing block structure, and each of the second chip units in the remaining intermediate submodules is connected to the metal intermediate plate of another adjacent intermediate submodule via a pressing block structure, and the bottom plate submodule and the multiple intermediate submodules are connected in series in sequence; The base submodule further includes a plurality of first spring pins, each of which is mounted on one of the first terminals, and at least a portion of the first chip units is electrically connected to the first gate PCB via the first spring pins. The intermediate submodule further includes a plurality of second spring pins, each of which is mounted on one of the second terminals, and at least a portion of the second chip units is electrically connected to the second gate PCB via the second spring pins. The bottom plate submodule further includes a plurality of first fixing blocks, a plurality of first spring pins are mounted on the plurality of first fixing blocks in a one-to-one correspondence, at least some of the first terminals have a first fixing groove, and each first fixing block is correspondingly embedded in one of the first fixing grooves; the intermediate submodule further includes a plurality of second fixing blocks, a plurality of second spring pins are mounted on the plurality of second fixing blocks in a one-to-one correspondence, at least some of the second terminals have a second fixing groove, and each second fixing block is correspondingly embedded in one of the second fixing grooves.

2. The press-fit power module according to claim 1, characterized in that: The cooling pipe is passed through the outer shell and connected to the metal intermediate plate. The cooling pipe is communicated with the flow channel. The cooling pipe and the flow channel are used for cooling medium to flow.

3. The press-fit power module according to claim 1, wherein: The pressing block structure includes a pressing block and a spring sheet, the pressing block is connected to the spring sheet, the spring sheet is connected to the metal middle plate or the metal cover plate, and the pressing block abuts against the first chip unit or the second chip unit.

4. The press-fit power module according to claim 3, characterized in that: The pressure block structure also includes an elastic member, and the pressure block includes a connecting portion and an abutting portion that are connected to each other. The abutting portion extends to the outside of the connecting portion. The elastic member is sleeved on the connecting portion, and the two ends of the elastic member respectively abut against the abutting portion and the metal intermediate plate or the metal cover plate.

5. The press-fit power module according to claim 4, characterized in that: The side of the metal intermediate plate away from the second terminal is connected to a limiting boss, and / or the side of the metal cover plate facing the interior of the housing is connected to a limiting boss; The limiting boss has a limiting blind hole and a limiting slot. The limiting blind hole extends in a direction perpendicular to the metal intermediate plate. The limiting slot is connected to the limiting blind hole in the circumferential direction of the limiting blind hole. The spring piece is embedded in the limiting slot. The pressure block is inserted into the limiting blind hole. The two ends of the elastic member are respectively abutted against the abutting portion and the limiting boss.

6. The press-fit power module according to claim 3, characterized in that: On the same metal intermediate plate, or on the metal cover plate, a plurality of the pressing block structures are arranged in an array, and the arrangement directions of any two adjacent spring sheets are perpendicular to each other.

7. The press-fit power module according to claim 1, wherein: The first chip unit includes a first insulating frame, a first lower silver sheet, a first power chip, a first upper silver sheet and a first insulating pressure plate. The first insulating frame is sleeved on the first terminal. The first lower silver sheet, the first power chip and the first upper silver sheet are stacked in sequence and clamped between the first terminal and the first insulating pressure plate. The first lower silver sheet contacts the first terminal, and the first upper silver sheet contacts the pressure block structure. The second chip unit includes a second insulating frame, a second lower silver sheet, a second power chip, a second upper silver sheet and a second insulating pressure plate. The second insulating frame is sleeved on the second terminal. The second lower silver sheet, the second power chip and the second upper silver sheet are stacked in sequence and clamped between the second terminal and the second insulating pressure plate. The second lower silver sheet contacts the second terminal, and the second upper silver sheet contacts the pressure block structure.

8. A packaging method for a press-fit power module, used for manufacturing the press-fit power module according to any one of claims 1 to 7, characterized in that: The packaging method of the press-fit power module comprises the following steps: The base plate submodule preparation step is performed, and the base plate submodule preparation step includes: Taking or preparing a metal base plate, a surface of the metal base plate is connected to a plurality of first terminals; Mounting a first gate PCB on the surface of the metal base plate having the first terminal; Mounting a plurality of first chip units to a plurality of first terminals in a one-to-one correspondence, and electrically connecting the first chip units to the first gate PCB board, so that the plurality of first chip units are connected in parallel through the first terminals to form a bottom plate submodule; Performing an intermediate submodule preparation step, the intermediate submodule preparation step comprising: Taking or preparing a metal intermediate plate, a surface of which is connected to a plurality of second terminals; Mounting the second gate PCB on the surface of the metal middle plate having the second terminal; Mounting a plurality of second chip units to a plurality of second terminals in a one-to-one correspondence, and electrically connecting the second chip units to the second gate PCB board, so that the plurality of second chip units are connected in parallel through the second terminals to form an intermediate submodule; Determine whether it is necessary to continue preparing the intermediate submodule, and if so, repeat the intermediate submodule preparation steps; If the number of the intermediate submodule is one, then: Installing a plurality of pressing block structures on a side of the metal intermediate plate away from the second terminal, and connecting the plurality of pressing block structures on the metal intermediate plate to the plurality of first chip units in a one-to-one correspondence; Taking or preparing a metal cover plate, installing a plurality of the pressing block structures on one side of the metal cover plate, and connecting the plurality of the pressing block structures on the metal cover plate to a plurality of the second chip units in a one-to-one correspondence; Connecting the bottom plate submodule and the middle submodule in series; If there are multiple intermediate submodules, then: stacking the bottom plate submodule and the plurality of intermediate submodules in sequence; Installing a plurality of pressing block structures on a side of the metal intermediate plate closest to the bottom plate submodule, away from the second terminal connected thereto, and connecting the plurality of pressing block structures on the metal intermediate plate to the plurality of first chip units in a one-to-one correspondence; Installing a plurality of pressing block structures on a side of the remaining metal intermediate plate away from the second terminals connected thereto, and connecting the plurality of pressing block structures on the metal intermediate plate to the plurality of second chip units of the adjacent intermediate submodules in a one-to-one correspondence; Obtain or prepare a housing having a first opening and a second opening facing each other, and install the assembly of the base submodule, the intermediate submodule, and the metal cover into the interior of the housing so that the metal base covers the first opening and the metal cover covers the second opening; The bottom plate submodule and the plurality of intermediate submodules are sequentially connected in series.

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