A LoadLock three-layer access slice scheduling system and method

Abstract

The present invention discloses a LoadLock three-layer access scheduling system and method, wherein the system includes a LoadLock divided into an upper chamber and a lower chamber, each chamber is provided with an upper, middle and lower layer, wherein the upper layer is used to place uncoated wafers, and the middle and lower layers are used to place coated wafers; the method includes three scheduling methods of an atmospheric manipulator and three scheduling methods of a vacuum manipulator; the three scheduling methods of the atmospheric manipulator are respectively: an atmospheric manipulator scheduling execution of a wafer placing and taking method, an atmospheric manipulator scheduling execution of a wafer placing method, and an atmospheric manipulator scheduling execution of a wafer taking method; the three scheduling methods of the vacuum manipulator are respectively: a vacuum manipulator scheduling execution of a wafer placing and taking method, a vacuum manipulator scheduling execution of a wafer placing method, and a vacuum manipulator scheduling execution of a wafer taking method. The atmospheric manipulator and the vacuum manipulator do not only perform a wafer taking or a wafer placing action each time, but can perform a set of actions when the LoadLock door is opened, thereby avoiding waste of resources and greatly improving work efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor coating technology, and in particular to a LoadLock three-layer access chip scheduling system and method. Background Art

[0002] The existing LoadLock will specify the entry and exit chambers, and the matching scheduling method only stores / retrieves the dedicated chambers. The disadvantage is that there are relatively few placement positions. And because the entry and exit of the chamber in the LoadLock is specified, if the atmospheric robot arm performs a film placement operation during scheduling, it is necessary to determine whether the chamber entered by the LoadLock meets the film placement requirements. Similarly, the atmospheric robot arm exit, vacuum robot arm entry, and vacuum robot arm exit all need to separately judge the chamber status of the LoadLock entry / exit before the next operation can be performed. In this case, when the atmospheric robot arm places the film, if the chamber entered by the LoadLock is being used by the vacuum robot arm, the atmospheric robot arm can only wait, resulting in a waste of resources and reduced work efficiency. Summary of the invention

[0003] The purpose of the present invention is to provide a LoadLock three-layer storage and access scheduling system and method, in which an atmospheric robot arm and a vacuum robot arm can perform a set of storage and access actions when the LoadLock door is opened, which greatly reduces the waiting situation, avoids resource waste, and improves work efficiency.

[0004] To achieve the above-mentioned objectives, in the first aspect, the present application provides a LoadLock three-layer access chip scheduling system, including LoadLock, which is divided into an upper chamber and a lower chamber, and each chamber is provided with three layers, namely, upper, middle and lower layers, wherein the upper layer is used to place uncoated wafers, and the middle and lower layers are used to place coated wafers, and the LoadLock state is Idle or Running; the LoadLock chamber environment state is atmospheric environment or vacuum environment, the LoadLock atmospheric side door state is open OPEN or closed CLOSE, and the LoadLock vacuum side door state is open OPEN or closed CLOSE.

[0005] In the second aspect, the present application provides a LoadLock three-layer access chip scheduling method, including an atmospheric robot arm scheduling execution chip placement and chip retrieval method, a vacuum robot arm scheduling execution chip placement and chip retrieval method;

[0006] The atmospheric robot arm scheduling execution wafer placing and wafer taking method is specifically as follows: after the atmospheric robot arm obtains the uncoated wafer, if the upper chamber or the upper layer of the lower chamber of LoadLock is empty, it is determined whether LoadLock is in an available state, if not, it waits for LoadLock to become available, and when LoadLock is in an available state, the atmospheric robot arm obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is a vacuum environment, it is converted to an atmospheric environment; the LoadLock atmospheric side door is opened, and then the atmospheric robot arm sends the uncoated wafer into the upper layer of the upper chamber or the lower chamber, and the LoadLock atmospheric side door is not closed and continues to maintain the Running state; if there is a wafer with a completed coating in the middle layer or the lower layer in the current chamber, and the time the wafer is in the middle layer or the lower layer is greater than the cooling time, the atmospheric robot arm takes out the wafer, closes the atmospheric side door and sets the LoadLock state to Idle;

[0007] The method for scheduling and executing wafer placement and retrieval by the vacuum robot arm is specifically as follows: after the vacuum robot arm obtains the wafer after coating, if there is a vacant space in at least one of the middle and lower layers of the upper chamber or the lower chamber of the LoadLock, it is determined whether the LoadLock is in an available state, and if not, it waits for the LoadLock to become available. When the LoadLock is in an available state, the vacuum robot arm obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment; the LoadLock vacuum side door is opened, and then the vacuum robot arm sends the coated wafer into the vacant space of the upper chamber or the lower chamber and records the placement time, and the LoadLock vacuum side door is not closed and continues to maintain the Running state; if there is an uncoated wafer in the upper layer of the current chamber, the vacuum robot arm takes out the wafer, closes the vacuum side door and sets the LoadLock state to Idle.

[0008] Furthermore, it also includes an atmospheric robot arm scheduling to execute a wafer placement method, specifically: after the atmospheric robot arm obtains the uncoated wafer, if the upper chamber or the upper layer of the lower chamber of LoadLock is empty, it is determined whether LoadLock is in an available state, if not, it waits for LoadLock to become available. When LoadLock is in an available state, the atmospheric robot arm obtains the right to use, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, if it is a vacuum environment, it is converted to an atmospheric environment; the LoadLock atmospheric side door is opened, and then the atmospheric robot arm sends the uncoated wafer into the upper chamber or the upper layer of the lower chamber, and the LoadLock atmospheric side door is not closed and continues to maintain the Running state; if there is no coated wafer in the middle layer or the lower layer of the current chamber, or there is a coated wafer but the placement time is less than the cooling time, the atmospheric robot arm releases the right to use, closes the atmospheric side door and sets the LoadLock state to Idle.

[0009] Furthermore, it also includes an atmospheric manipulator arm scheduling execution film taking method, specifically:

[0010] When the atmospheric robot arm does not obtain the uncoated wafer, if there is a coated wafer in at least one of the middle and lower layers of the upper chamber or the lower chamber of LoadLock, and the wafer has been placed in for longer than the cooling time, it is determined whether LoadLock is in an available state. If not, wait for LoadLock to become available. When LoadLock is in an available state, the atmospheric robot arm obtains the right to use it, and the LoadLock state is set to Running. The LoadLock chamber environment is obtained. If it is a vacuum environment, it is converted to an atmospheric environment. The atmospheric side door of LoadLock is opened, and the atmospheric robot arm takes out the cooled wafer. The atmospheric side door is closed and the LoadLock state is set to Idle.

[0011] Furthermore, it also includes a method for scheduling a vacuum robot to execute wafer placement, specifically: after the vacuum robot obtains a wafer that has been coated, if there is a vacant space in at least one of the middle and lower layers of the upper chamber or the lower chamber of the LoadLock, it is determined whether the LoadLock is in an available state, if not, it waits for the LoadLock to become available, and when the LoadLock is in an available state, the vacuum robot obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment; the LoadLock vacuum side door is opened, and then the vacuum robot sends the coated wafer into the vacant space in the upper chamber or the lower chamber and records the placement time, and the LoadLock vacuum side door is not closed and continues to maintain the Running state; if there is no uncoated wafer in the upper layer of the current chamber, the vacuum robot releases the right to use it, closes the vacuum side door and sets the LoadLock state to Idle.

[0012] Furthermore, it also includes a vacuum robot arm scheduling execution film taking method, specifically:

[0013] When the vacuum robot does not obtain the coated wafer, if there is an uncoated wafer on the upper chamber or the upper layer of the lower chamber of LoadLock, it is determined whether LoadLock is in an available state. If not, it waits for LoadLock to become available. When LoadLock is in an available state, the vacuum robot obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment; the LoadLock vacuum side door is opened, the vacuum robot takes out the wafer, closes the vacuum side door and sets the LoadLock state to Idle.

[0014] Furthermore, before scheduling, the atmospheric manipulator first determines which chamber of LoadLock can realize the atmospheric manipulator scheduling to execute the film placing and film taking methods. If the upper chamber can realize it, the atmospheric manipulator enters the upper chamber for scheduling; if the lower chamber can realize it, the atmospheric manipulator enters the lower chamber for scheduling; if both the upper chamber and the lower chamber can realize it, the atmospheric manipulator first enters the upper chamber for scheduling and then enters the lower chamber for scheduling; if neither the upper chamber nor the lower chamber can realize it, then determine which chamber can realize the atmospheric manipulator scheduling to execute the film placing method or the atmospheric manipulator scheduling to execute the film taking method, and the atmospheric manipulator preferentially enters the chamber that can realize the atmospheric manipulator scheduling to execute the film placing method; if the upper chamber and the lower chamber can simultaneously realize the atmospheric manipulator scheduling to execute the film placing method or can simultaneously realize the atmospheric manipulator scheduling to execute the film taking method, the atmospheric manipulator first enters the upper chamber for scheduling and then enters the lower chamber for scheduling.

[0015] Furthermore, before scheduling, the vacuum robot arm first determines which chamber of LoadLock can realize the vacuum robot arm scheduling to execute the film placing and film taking methods. If the upper chamber can realize it, the vacuum robot arm enters the upper chamber for scheduling; if the lower chamber can realize it, the vacuum robot arm enters the lower chamber for scheduling; if both the upper chamber and the lower chamber can realize it, the vacuum robot arm first enters the upper chamber for scheduling and then enters the lower chamber for scheduling; if neither the upper chamber nor the lower chamber can realize it, then determine which chamber can realize the vacuum robot arm scheduling to execute the film placing method or the vacuum robot arm scheduling to execute the film taking method, and the vacuum robot arm preferentially enters the chamber that can realize the vacuum robot arm scheduling to execute the film taking method; if the upper chamber and the lower chamber can simultaneously realize the vacuum robot arm scheduling to execute the film placing method or can simultaneously realize the vacuum robot arm scheduling to execute the film taking method, the vacuum robot arm first enters the upper chamber for scheduling and then enters the lower chamber for scheduling.

[0016] Furthermore, the available states are divided into two types: on the atmospheric robot arm side: one is that LoadLock is in Idle state, and the other is that LoadLock is in Running state but the atmospheric side door is in OPEN state; on the vacuum robot arm side: one is that LoadLock is in Idle state, and the other is that LoadLock is in Running state but the vacuum side door is in OPEN state.

[0017] As a further step, when switching the environment, if there is no wafer in the upper chamber or the lower chamber of the LoadLock, the gas is introduced quickly, and if there is a wafer, the gas is introduced slowly.

[0018] Compared with the prior art, the above technical solution adopted by the present invention has the following advantages: the uncoated wafers are placed on the upper layer of the chamber, and the middle and lower layers provide cooling positions for the coated wafers. This arrangement can prevent the coated wafers from contaminating the new wafers below when the upper layer is cooled. The two independent upper and lower chambers do not distinguish between the entry and exit cavities, and each chamber has the possibility of entry and exit. The atmospheric manipulator and the vacuum manipulator can perform not only one wafer taking or one wafer placing action each time, but also a set of actions when the LoadLock door is opened. Also, when the traditional atmospheric robot is preparing to transfer the uncoated wafer into LoadLock, if the vacuum robot is taking the wafer in LoadLock, it must wait. Both the atmospheric robot and the vacuum robot can only interact with the corresponding layer of a chamber at the same time. This scheduling method can effectively avoid the above situation, because the atmospheric robot can put the wafer on the upper layer and then go to the middle or lower layer to take the wafer. When the vacuum robot takes the uncoated wafer from one of the chambers, the atmospheric robot has already placed the uncoated wafer from another chamber. The next time the vacuum robot can directly take the wafer from another chamber, there is a good cycle to reduce waiting, avoid waste of resources, and greatly improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A top view of a LoadLock three-layer access slice scheduling system;

[0020] Figure 2 A LoadLock three-layer access slice scheduling system structure diagram;

[0021] Figure 3 The figure is a flow chart of a LoadLock three-layer access slice scheduling method.

[0022] Explanation of the serial numbers in the figure: 1. Vacuum robot arm; 2. Upper chamber; 3. Atmospheric robot arm; 4. Lower chamber. Specific implementation methods

[0023] In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application, that is, the embodiments described are only part of the embodiments of the present application, not all of the embodiments.

[0024] like Figure 1-2 As shown, this embodiment provides a LoadLock three-layer access wafer scheduling system, including LoadLock, which is divided into an upper chamber and a lower chamber, and each chamber is provided with an upper, middle and lower layer, wherein the upper layer is used to place uncoated wafers, i.e., new wafers, and the middle and lower layers are used to place coated wafers, so as to avoid the coated wafers from contaminating the new wafers below when the upper layer is cooled. The current state of LoadLock is Idle / Running, the chamber environment state of LoadLock is atmospheric environment or vacuum environment, the atmospheric side door state of LoadLock is OPEN or CLOSE, and the vacuum side door state of LoadLock is OPEN or CLOSE.

[0025] Under normal operating conditions, the atmospheric robot arm needs to continuously obtain new wafers from the wafer box and transfer them to the LoadLock. The vacuum robot arm needs to receive the new wafers in the LoadLock and transfer them to the process chamber, and return the wafers coated in the process chamber to the LoadLock. Normal scheduling is based on a dedicated LoadLock for a specific chamber. Each time the atmospheric robot arm / vacuum robot arm interacts with the LoadLock, it can only enter or exit. The scheduling method of the present invention is based on a three-layer structure that allows the atmospheric robot arm or the vacuum robot arm to perform a complete entry and exit. The entry and exit here are explained using the atmospheric robot arm as an example. The atmospheric side door of the LoadLock is opened once, and the atmospheric robot arm can place a wafer, followed by taking a wafer. The traditional LoadLock can only perform one action in each chamber, either entry or exit.

[0026] like Figure 3 As shown, this embodiment provides a LoadLock three-layer storage and access chip scheduling method, including three scheduling methods for atmospheric robotic arms and three scheduling methods for vacuum robotic arms; the three scheduling methods for the atmospheric robotic arms are: atmospheric robotic arm scheduling to execute chip placement and chip retrieval method, atmospheric robotic arm scheduling to execute chip placement method, and atmospheric robotic arm scheduling to execute chip retrieval method; the three scheduling methods for the vacuum robotic arm are: vacuum robotic arm scheduling to execute chip placement and chip retrieval method, vacuum robotic arm scheduling to execute chip placement method, and vacuum robotic arm scheduling to execute chip retrieval method.

[0027] The specific method of scheduling the atmospheric robot to place and retrieve wafers is as follows: after the atmospheric robot retrieves the uncoated wafer from the wafer box, if the upper chamber or the upper layer of the lower chamber of LoadLock is empty, it is determined whether LoadLock is in an available state (there are two available states: one is that LoadLock is in an Idle state; the other is in a Running state but the atmospheric side door is Open, which requires more consideration when retrieving wafers). If not, it waits for LoadLock to become available. When LoadLock is in an available state, the atmospheric robot obtains the right to use it, and the LoadLock state is set to Running. Obtain the LoadLock chamber environment, If it is a vacuum environment, it will be switched to an atmospheric environment. When switching the environment, it is necessary to monitor whether there is a wafer in the LoadLock. If not, the gas can be passed quickly. If there is a wafer, the gas needs to be passed slowly to prevent the gas from shifting when there is a wafer. The atmospheric side door of the LoadLock is opened, and then the atmospheric robot arm sends the uncoated wafer into the upper chamber or the upper layer of the lower chamber. The atmospheric side door of the LoadLock is not closed and continues to maintain the Running state. If there is a wafer with a completed coating in the middle layer or the lower layer of the current chamber, and the time the wafer has been in the middle layer or the lower layer is greater than the cooling time, the atmospheric robot arm takes out the wafer, closes the atmospheric side door, and sets the LoadLock state to Idle.

[0028] The atmospheric robot arm schedules the execution of the wafer placement method, specifically: after the atmospheric robot arm obtains the uncoated wafer from the wafer box, if the upper chamber or the upper layer of the lower chamber of LoadLock is empty, it determines whether LoadLock is in an available state. If not, it waits for LoadLock to become available. When LoadLock is in an available state, the atmospheric robot arm obtains the right to use, and the LoadLock state is set to Running; obtain the LoadLock chamber environment, if it is a vacuum environment, it is converted to an atmospheric environment; open the LoadLock atmospheric side door, and then the atmospheric robot arm sends the uncoated wafer into the upper chamber or the upper layer of the lower chamber, and the LoadLock atmospheric side door is not closed and continues to maintain the Running state; if there is no coated wafer in the middle layer or lower layer of the current chamber, or there is a coated wafer but the placement time is less than the cooling time, the atmospheric robot arm releases the right to use, closes the atmospheric side door and sets the LoadLock state to Idle.

[0029] The atmospheric robot arm schedules and executes the wafer retrieval method, specifically: when the atmospheric robot arm fails to obtain the uncoated wafer from the wafer box, if there is a coated wafer in at least one of the middle and lower layers of the upper chamber or the lower chamber of the LoadLock, and the wafer has been placed in for longer than the cooling time, then it is determined whether the LoadLock is in an available state. If not, then wait for the LoadLock to become available. When the LoadLock is in an available state, the atmospheric robot arm obtains the right to use it, and the LoadLock state is set to Running. The LoadLock chamber environment is obtained, and if it is a vacuum environment, it is converted to an atmospheric environment. The atmospheric side door of the LoadLock is opened, and the atmospheric robot arm takes out the cooled wafer, and the atmospheric side door is closed and the LoadLock state is set to Idle.

[0030] There are only three situations mentioned above that may occur each time the atmospheric robotic arm works, and only one of them will occur each time.

[0031] Before scheduling, the atmospheric manipulator first determines which chamber of LoadLock can realize the atmospheric manipulator scheduling to execute the film placing and film taking methods. If the upper chamber can realize it, the atmospheric manipulator enters the upper chamber for scheduling; if the lower chamber can realize it, the atmospheric manipulator enters the lower chamber for scheduling; if both the upper chamber and the lower chamber can realize it, the atmospheric manipulator first enters the upper chamber for scheduling and then enters the lower chamber for scheduling; if neither the upper chamber nor the lower chamber can realize it, then it is determined which chamber can realize the atmospheric manipulator scheduling to execute the film placing method or the atmospheric manipulator scheduling to execute the film taking method, and the atmospheric manipulator preferentially enters the chamber that can realize the atmospheric manipulator scheduling to execute the film placing method; if the upper chamber and the lower chamber can simultaneously realize the atmospheric manipulator scheduling to execute the film placing method or can simultaneously realize the atmospheric manipulator scheduling to execute the film taking method, the atmospheric manipulator first enters the upper chamber for scheduling and then enters the lower chamber for scheduling.

[0032] The method for scheduling and executing wafer placement and retrieval by the vacuum robot arm is specifically as follows: after the vacuum robot arm obtains the wafer after coating from the process chamber, if there is a vacant space in at least one of the middle and lower layers of the upper chamber or the lower chamber of the LoadLock, it is determined whether the LoadLock is in an available state, and if not, it waits for the LoadLock to become available. When the LoadLock is in an available state, the vacuum robot arm obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment; the LoadLock vacuum side door is opened, and then the vacuum robot arm sends the wafer after coating to the vacant space in the upper chamber or the lower chamber and records the placement time, and the LoadLock vacuum side door is not closed and continues to maintain the Running state; if there is an uncoated wafer in the upper layer of the current chamber, the vacuum robot arm takes out the wafer, closes the vacuum side door and sets the LoadLock state to Idle.

[0033] The vacuum robot scheduling executes the wafer placing method, specifically: after the vacuum robot obtains the coated wafer from the process chamber, if there is at least one vacant space in the middle and lower layers of the upper chamber or the lower chamber of LoadLock, it is determined whether LoadLock is in an available state. If not, it waits for LoadLock to become available. When LoadLock is in an available state, the vacuum robot obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment; the LoadLock vacuum side door is opened, and then the vacuum robot sends the coated wafer to the vacant space in the upper chamber or the lower chamber and records the placement time. The LoadLock vacuum side door is not closed and continues to maintain the Running state; if there is no uncoated wafer on the upper layer of the current chamber, the vacuum robot releases the right to use, closes the vacuum side door and sets the LoadLock state to Idle.

[0034] The vacuum robot scheduling executes the wafer taking method, specifically: when the vacuum robot does not obtain the coated wafer from the process chamber, if there is an uncoated wafer in the upper chamber or the upper layer of the lower chamber of LoadLock, it is determined whether LoadLock is in an available state. If not, wait for LoadLock to become available. When LoadLock is in an available state, the vacuum robot obtains the right to use it, and the LoadLock state is set to Running; obtain the LoadLock chamber environment, if it is an atmospheric environment, it is converted to a vacuum environment; open the LoadLock vacuum side door, the vacuum robot takes out the wafer, closes the vacuum side door and sets the LoadLock state to Idle.

[0035] There are only three situations mentioned above that will occur each time the vacuum robot arm works, and only one of them will occur each time.

[0036] Before scheduling, the vacuum robot arm first determines which chamber of LoadLock can realize the vacuum robot arm scheduling to execute the film placing and film taking methods. If the upper chamber can realize it, the vacuum robot arm enters the upper chamber for scheduling; if the lower chamber can realize it, the vacuum robot arm enters the lower chamber for scheduling; if both the upper chamber and the lower chamber can realize it, the vacuum robot arm first enters the upper chamber for scheduling and then enters the lower chamber for scheduling; if neither the upper chamber nor the lower chamber can realize it, it is determined which chamber can realize the vacuum robot arm scheduling to execute the film placing method or the vacuum robot arm scheduling to execute the film taking method, and the vacuum robot arm preferentially enters the chamber that can realize the vacuum robot arm scheduling to execute the film taking method; if the upper chamber and the lower chamber can simultaneously realize the vacuum robot arm scheduling to execute the film placing method or can simultaneously realize the vacuum robot arm scheduling to execute the film taking method, the vacuum robot arm first enters the upper chamber for scheduling and then enters the lower chamber for scheduling.

[0037] In this application, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements that are inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A LoadLock three-layer access slice scheduling method, characterized in that: Including atmospheric robot arm scheduling execution of film placing and film taking method, vacuum robot arm scheduling execution of film placing and film taking method; The atmospheric robot arm scheduling execution wafer placing and wafer taking method is specifically as follows: after the atmospheric robot arm obtains the uncoated wafer, if the upper chamber or the upper layer of the lower chamber of LoadLock is empty, it is determined whether LoadLock is in an available state, if not, it waits for LoadLock to become available, and when LoadLock is in an available state, the atmospheric robot arm obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is a vacuum environment, it is converted to an atmospheric environment; the LoadLock atmospheric side door is opened, and then the atmospheric robot arm sends the uncoated wafer into the upper layer of the upper chamber or the lower chamber, and the LoadLock atmospheric side door is not closed and continues to maintain the Running state; if there is a wafer with a completed coating in the middle layer or the lower layer in the current chamber, and the time the wafer is in the middle layer or the lower layer is greater than the cooling time, the atmospheric robot arm takes out the wafer, closes the atmospheric side door and sets the LoadLock state to Idle; The method for scheduling and executing wafer placement and retrieval by the vacuum robot arm is specifically as follows: after the vacuum robot arm obtains the wafer after coating, if there is at least one vacant space in the middle layer or lower layer of the upper chamber or the lower chamber of the LoadLock, it is determined whether the LoadLock is in an available state, and if not, it waits for the LoadLock to become available. When the LoadLock is in an available state, the vacuum robot arm obtains the right to use it, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment; the LoadLock vacuum side door is opened, and then the vacuum robot arm sends the coated wafer into the vacant space of the upper chamber or the lower chamber and records the placement time, and the LoadLock vacuum side door is not closed and continues to maintain the Running state; if there is an uncoated wafer in the upper layer of the current chamber, the vacuum robot arm takes out the wafer, closes the vacuum side door and sets the LoadLock state to Idle; The above method is implemented in a LoadLock three-layer access chip scheduling system, which includes a LoadLock. The LoadLock is divided into an upper chamber and a lower chamber. Each chamber is provided with three layers, namely, an upper, middle and lower layers. The upper layer is used to place uncoated wafers, and the middle and lower layers are used to place coated wafers. The LoadLock state is Idle or Running; the LoadLock chamber environment state is an atmospheric environment or a vacuum environment, the LoadLock atmospheric side door state is OPEN or CLOSE, and the LoadLock vacuum side door state is OPEN or CLOSE.

2. According to claim 1, a LoadLock three-layer access slice scheduling method is characterized in that: It also includes an atmospheric robot arm scheduling method for executing wafer placement, specifically: after the atmospheric robot arm obtains the uncoated wafer, if the upper chamber or the upper layer of the lower chamber of LoadLock is empty, it is determined whether LoadLock is in an available state. If not, it waits for LoadLock to become available. When LoadLock is in an available state, the atmospheric robot arm obtains the right to use, and the LoadLock state is set to Running; the LoadLock chamber environment is obtained, and if it is a vacuum environment, it is converted to an atmospheric environment; the LoadLock atmospheric side door is opened, and then the atmospheric robot arm sends the uncoated wafer into the upper chamber or the upper layer of the lower chamber, and the LoadLock atmospheric side door is not closed and continues to maintain the Running state; if there is no coated wafer in the middle layer or the lower layer of the current chamber, or there is a coated wafer but the placement time is less than the cooling time, the atmospheric robot arm releases the right to use, closes the atmospheric side door and sets the LoadLock state to Idle.

3. According to claim 1, a LoadLock three-layer access slice scheduling method is characterized in that: It also includes an atmospheric robot arm scheduling method for executing wafer retrieval, specifically: when the atmospheric robot arm fails to obtain an uncoated wafer, if there is a coated wafer in at least one of the middle and lower layers of the upper chamber or the lower chamber of the LoadLock, and the wafer has been placed in for a longer time than the cooling time, then it is determined whether the LoadLock is in an available state, if not, then wait for the LoadLock to become available, when the LoadLock is in an available state, the atmospheric robot arm obtains the right to use it, and the LoadLock state is set to Running; obtain the LoadLock chamber environment, if it is a vacuum environment, then convert it to an atmospheric environment; open the atmospheric side door of the LoadLock, the atmospheric robot arm takes out the cooled wafer, closes the atmospheric side door and sets the LoadLock state to Idle.

4. According to claim 1, a LoadLock three-layer access slice scheduling method is characterized in that: It also includes a method for scheduling a vacuum robot to execute wafer placement, specifically: after the vacuum robot obtains a wafer that has been coated, if there is a vacant space in at least one of the middle and lower layers of the upper chamber or the lower chamber of the LoadLock, it is determined whether the LoadLock is in an available state. If not, it waits for the LoadLock to become available. When the LoadLock is in an available state, the vacuum robot obtains the right to use it, and the LoadLock state is set to Running. The LoadLock chamber environment is obtained, and if it is an atmospheric environment, it is converted to a vacuum environment. The LoadLock vacuum side door is opened, and then the vacuum robot sends the coated wafer to the vacant space in the upper chamber or the lower chamber and records the placement time. The LoadLock vacuum side door is not closed and continues to maintain the Running state. If there is no uncoated wafer on the upper layer of the current chamber, the vacuum robot releases the right to use it, closes the vacuum side door and sets the LoadLock state to Idle.

5. A LoadLock three-layer access slice scheduling method according to claim 1, characterized in that: It also includes a method for scheduling a vacuum robot to execute a wafer retrieval method, specifically: when the vacuum robot fails to obtain a coated wafer, if there is an uncoated wafer in the upper chamber or the upper layer of the lower chamber of LoadLock, it is determined whether LoadLock is in an available state, if not, wait for LoadLock to become available, and when LoadLock is in an available state, the vacuum robot obtains the right to use it, and the LoadLock state is set to Running; obtain the LoadLock chamber environment, if it is an atmospheric environment, convert it to a vacuum environment; open the LoadLock vacuum side door, the vacuum robot takes out the wafer, closes the vacuum side door and sets the LoadLock state to Idle.

6. A LoadLock three-layer access slice scheduling method according to claim 1, characterized in that: Before scheduling, the atmospheric manipulator first determines which chamber of LoadLock can realize the atmospheric manipulator scheduling to execute the film placing and film taking methods. If the upper chamber can realize it, the atmospheric manipulator enters the upper chamber for scheduling; if the lower chamber can realize it, the atmospheric manipulator enters the lower chamber for scheduling; if both the upper chamber and the lower chamber can realize it, the atmospheric manipulator first enters the upper chamber for scheduling and then enters the lower chamber for scheduling; if neither the upper chamber nor the lower chamber can realize it, then it is determined which chamber can realize the atmospheric manipulator scheduling to execute the film placing method or the atmospheric manipulator scheduling to execute the film taking method, and the atmospheric manipulator preferentially enters the chamber that can realize the atmospheric manipulator scheduling to execute the film placing method; if the upper chamber and the lower chamber can simultaneously realize the atmospheric manipulator scheduling to execute the film placing method or can simultaneously realize the atmospheric manipulator scheduling to execute the film taking method, the atmospheric manipulator first enters the upper chamber for scheduling and then enters the lower chamber for scheduling.

7. A LoadLock three-layer access slice scheduling method according to claim 1, characterized in that: Before scheduling, the vacuum robot arm first determines which chamber of LoadLock can realize the vacuum robot arm scheduling to execute the film placing and film taking methods. If the upper chamber can realize it, the vacuum robot arm enters the upper chamber for scheduling; if the lower chamber can realize it, the vacuum robot arm enters the lower chamber for scheduling; if both the upper chamber and the lower chamber can realize it, the vacuum robot arm first enters the upper chamber for scheduling and then enters the lower chamber for scheduling; if neither the upper chamber nor the lower chamber can realize it, it is determined which chamber can realize the vacuum robot arm scheduling to execute the film placing method or the vacuum robot arm scheduling to execute the film taking method, and the vacuum robot arm preferentially enters the chamber that can realize the vacuum robot arm scheduling to execute the film taking method; if the upper chamber and the lower chamber can simultaneously realize the vacuum robot arm scheduling to execute the film placing method or can simultaneously realize the vacuum robot arm scheduling to execute the film taking method, the vacuum robot arm first enters the upper chamber for scheduling and then enters the lower chamber for scheduling.

8. A LoadLock three-layer access slice scheduling method according to claim 1, characterized in that: The available states are divided into two types. On the atmospheric robot arm side, one is that LoadLock is in the Idle state, and the other is that LoadLock is in the Running state but the atmospheric side door is in the OPEN state; on the vacuum robot arm side, one is that LoadLock is in the Idle state, and the other is that LoadLock is in the Running state but the vacuum side door is in the OPEN state.

9. A LoadLock three-layer access slice scheduling method according to claim 1, characterized in that: When switching environments, if there is no wafer in the upper chamber or lower chamber of LoadLock, gas is introduced quickly; if there is a wafer, gas is introduced slowly.

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