Cutting device

Abstract

This application relates to a cutting device, which includes a displacement mechanism, a cutter head, a force sensing module, a control system, and a liquid supply module. The displacement mechanism includes a moving part. Both the cutter head and the force sensing module are mounted on the moving part, with the cutter head facing the object being cut and the force sensing module configured to contact the object. The force sensing module is configured to provide a sensing signal indicating the force exerted by the object being cut on the force sensing module. The control system is electrically connected to the displacement mechanism and the force sensing module and is configured to instruct the displacement mechanism to move the moving part based on the sensing signal. The liquid supply module includes a liquid conduit mounted on the cutter head and configured to supply liquid to the cutting position on the object being cut by the cutter head. Thus, the cutter head can accurately reach the target cutting depth, and any damaged film layers on the object can be repaired by the liquid supply module. Alternatively, the cutting device can also perform cutting, merging, sealing, or dispensing operations to simplify the production process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automation equipment, in particular to a cutting device. BACKGROUND

[0002] In recent years, adhesive products have been widely used in the optoelectronic, communication, computer, automobile and other industries to provide shockproof, insulation, dustproof, conductive, adhesive, shielding and other functions. Adhesive products are generally cut into specific shapes as needed. However, with the current technology, the adhesive product is easy to cut too deep and damage the release agent layer of the protective film, resulting in the adhesive product and the protective film being bonded, so that the protective film cannot be easily removed. SUMMARY

[0003] Therefore, the purpose of the present application is to provide an improved cutting device to solve the above problems.

[0004] To achieve the above purpose, according to some embodiments of the present application, a cutting device includes a displacement mechanism, a tool bit, a force sensing module, a control system and a liquid supply module. The displacement mechanism includes a moving part. The tool bit is arranged on the moving part and faces the cutting object. The force sensing module is arranged on the moving part and is configured to contact the cutting object. The force sensing module is configured to provide a sensing signal, and the sensing signal shows the force of the force sensing module pressed by the cutting object. The control system is electrically connected to the displacement mechanism and the force sensing module, and is configured to instruct the displacement mechanism to move the moving part along a first direction or a second direction according to the sensing signal. The first direction is away from the cutting object, and the second direction is opposite to the first direction. The liquid supply module includes a liquid pipeline, and the liquid pipeline is arranged on the tool bit and is configured to supply liquid to the cutting position of the cutting object cut by the tool bit.

[0005] In one or more embodiments of the present application, the control system is configured to instruct the displacement mechanism to move the moving part along the second direction until the value of the sensing signal reaches or exceeds a preset value, and the preset value corresponds to the target cutting depth of the tool bit.

[0006] In one or more embodiments of the present application, the control system is electrically connected to the liquid supply module, and when the value of the sensing signal reaches or exceeds the preset value, the control system is configured to instruct the liquid supply module to start supplying liquid and instruct the displacement mechanism to move the moving part along the first direction.

[0007] In one or more embodiments of the present application, the liquid supply module further includes a liquid storage container and a valve, the liquid pipeline is connected to the liquid storage container, and the valve is arranged on the liquid pipeline. The control system is configured to control the opening and closing of the valve.

[0008] In one or more embodiments of the present application, the supply amount of the liquid supplied by the liquid supply module is positively correlated with the value of the sensing signal.

[0009] In one or more embodiments of the present application, the liquid supply module further comprises a valve disposed in the liquid conduit, and the control system is electrically connected to the valve and configured to control the opening time of the valve or the flow rate of the valve according to the value of the sensing signal.

[0010] In one or more embodiments of the present application, the force sensing module comprises a piezoelectric sensor configured to provide a current signal or a voltage signal as the sensing signal.

[0011] In one or more embodiments of the present application, the force sensing module further comprises a contact element configured to abut against the surface of the cutting object, and an elastic element disposed between the contact element and the piezoelectric sensor.

[0012] In one or more embodiments of the present application, the cutting head has a tip and a bevel connecting the tip, and the liquid conduit has an opening at the bevel.

[0013] In one or more embodiments of the present application, the cutting object is an adhesive product comprising an adhesive layer and a protective film covering the adhesive layer. The protective film comprises a protective layer and a release agent layer between the protective layer and the adhesive layer. The cutting head is configured to start cutting from the adhesive layer, and the liquid supplied by the liquid supply module is a release agent.

[0014] In summary, the cutting device of the present application is equipped with a force sensing module, which is disposed on the moving member together with the cutting head and abuts against the cutting object. During the cutting process of the cutting head, the sensing signal provided by the force sensing module can reflect the cutting depth of the cutting head, and the control system of the cutting device can use this sensing signal to control the displacement mechanism so that the cutting head can accurately reach the target cutting depth. In addition, the cutting device of the present application further comprises a liquid supply module, which can supply liquid to the position of the cutting object cut by the cutting head. Taking the cutting object as an adhesive product, the liquid supply module can supply a release agent to fill the release agent layer of the protective film of the adhesive product that may be damaged during the cutting process, so as to keep the release agent layer intact, thereby facilitating the tearing of the protective film. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to make the above and other purposes, features, advantages and embodiments of the present application more obvious and easy to understand, the drawings are described as follows:

[0016] Figure 1 The figure is a schematic view of the appearance of an adhesive product in the related art.

[0017] Figure 2 The figure is a schematic side view of a cutting device of an embodiment of the present application, in which the cutting device cuts a cutting object.

[0018] Figure 3 Fig. 1 shows a schematic view of a cutting object. Figure 2 Fig. 2 shows a schematic view of the cutting object after the cutting operation is completed.

[0019] Figure 4 Fig. 3 shows a flowchart of the cutting device performing the cutting operation. Figure 2 Fig. 4 shows a schematic view of the cutting device performing the cutting operation.

[0020] Figure 5 Fig. 5 shows a schematic view of the cutting device performing the cutting and edge sealing or dispensing operation. Figure 2 Fig. 6 shows a flowchart of the cutting device performing the cutting and edge sealing or dispensing operation.

[0021] Figure 6 Fig. 7 shows a schematic view of the cutting device performing the cutting and edge sealing or dispensing operation. Figure 5 Fig. 8 shows a flowchart of the cutting device performing the cutting and edge sealing or dispensing operation.

[0022] BRIEF DESCRIPTION OF DRAWINGS

[0023] 10: adhesive product

[0024] 11: adhesive layer

[0025] 12: protective film

[0026] 13: protective layer

[0027] 14: release agent layer

[0028] 17, 18: cutting object

[0029] 20: cutting device

[0030] 30: knife head

[0031] 33: tip

[0032] 35: bevel

[0033] 37: side surface

[0034] 40: displacement mechanism

[0035] 43: moving part

[0036] 44: groove

[0037] 45: fixed part

[0038] 47: motor

[0039] 50: control system

[0040] 60: force sensing module

[0041] 63: piezoelectric sensor

[0042] 65: contact element

[0043] 67: elastic element

[0044] 70: Liquid Supply Module

[0045] 73: Liquid Piping

[0046] 74: Opening

[0047] 75: Liquid storage containers

[0048] 77: Valves

[0049] 90A, 90B: Work Procedures

[0050] 91-98: Steps

[0051] D1: First Direction

[0052] D2: Second Direction

[0053] K: Part

[0054] L, L': Liquid

[0055] S1: First control signal

[0056] S2: Second control signal

[0057] SS: Sensor signal Detailed Implementation

[0058] To make the description of this application more detailed and complete, reference can be made to the accompanying drawings and the various embodiments described below. The elements in the drawings are not drawn to scale and are provided for illustrative purposes only. Many practical details are described below to provide a comprehensive understanding of this application; however, those skilled in the art should understand that this application can be implemented without one or more of these practical details, and therefore, these details should not be used to limit this application.

[0059] Please refer to Figure 1 , Figure 1 A schematic diagram of the appearance of an adhesive product 10 in the related art is shown. The adhesive product 10 includes an adhesive layer 11 (e.g., optically clear adhesive (OCA)) and a protective film 12 covering the adhesive layer 11. The protective film 12 includes a protective layer 13 and a release agent layer 14, wherein the release agent layer 14 is located between the protective layer 13 and the adhesive layer 11. The release agent layer 14 serves to prevent the protective film 12 from adhering to the adhesive layer 11. The protective film 12 is, for example, a heavy-release protective film. The adhesive product 10 is, for example, a frame adhesive for optical waveguide structures used in augmented reality (AR) or mixed reality (MR) applications.

[0060] like Figure 1 As shown, adhesive products 10 are generally cut into specific shapes as needed, for example, according to...Figure 1 The dotted lines shown indicate the cutting of adhesive layer 11. During cutting, at... Figure 1 From this perspective, the cutting head cuts the adhesive layer 11 from top to bottom. If the cutting depth is too large, it may damage the release agent layer 14 of the protective film 12, causing the adhesive layer 11 to stick to the protective film 12, making it impossible to remove the protective film 12 smoothly. For example, the adhesive layer 11 is prone to overflow when the temperature is high. The overflow of adhesive into the release agent layer 14 at the point where it is damaged during cutting causes the adhesive layer 11 to stick to the protective film 12. In addition, after the adhesive product 10 is cut into the target shape, another protective film is usually applied (for example, a light release protective film is applied above the adhesive layer 11 in the figure). The bonding pressure can also cause overflow. In view of the above problems, this application provides an improved cutting device, which is described in detail below.

[0061] Please refer to Figure 2 . Figure 2 This is a schematic side view of a cutting device 20 according to an embodiment of this application. The cutting device 20 is configured to cut a cutting object 17, such as... Figure 1 The adhesive product 10 shown is not limited to this. The cutting device 20 includes a blade 30, a displacement mechanism 40, and a control system 50. The blade 30 is configured to cut the object 17. The displacement mechanism 40 includes a moving member 43, on which the blade 30 is disposed and faces the object 17. The control system 50 is electrically connected to the displacement mechanism 40 and configured to instruct the displacement mechanism 40 to move the moving member 43, thereby moving the blade 30 disposed on the moving member 43. For example, the control system 50 may send a first control signal S1 to the displacement mechanism 40, and the displacement mechanism 40 moves the moving member 43 according to the received first control signal S1. In this embodiment, the displacement mechanism 40 may move the moving member 43 along a first direction D1 or a second direction D2, wherein the first direction D1 is away from the object 17, and the second direction D2 is opposite to the first direction D1.

[0062] like Figure 2 As shown, in some embodiments, the displacement mechanism 40 further includes a fixing member 45 and a motor 47. The fixing member 45 is fixedly disposed on one side of the cutting object 17 and extends substantially along a first direction D1. The motor 47 is disposed on the fixing member 45 and connected to the moving member 43. The motor 47 is configured to drive the moving member 43 (and the cutter head 30 disposed on the moving member 43) to move relative to the fixing member 45. The motor 47 can be actuated according to a first control signal S1.

[0063] It should be noted that, for the sake of simplicity and clarity in the accompanying drawings, the cutter head 30 is shown as a planar, sheet-like structure. However, it should be understood that the cutter head 30 is not limited to this shape; for example, if it is to conform to... Figure 1The dotted lines shown indicate that the adhesive product 10 is cut into a circle, and the cutting head 30 may be a hollow cylindrical structure. Additionally, the control system 50 may include components such as a processor for performing calculations, memory for storing data (e.g., storing setpoints), and a communication interface for transmitting and receiving signals. The control system 50 may be, for example, a microcontroller.

[0064] like Figure 2 As shown, the cutting device 20 also includes at least one force sensing module 60, which is disposed on the moving part 43 of the displacement mechanism 40 and located on one side of the cutter head 30. The force sensing module 60 is configured to contact the cutting object 17 (e.g., the force sensing module 60 may abut against the surface of the cutting object 17) and is configured to provide a sensing signal SS, which indicates the magnitude of the force exerted on the force sensing module 60 by the cutting object 17. The control system 50 is electrically connected to the force sensing module 60 and is configured to receive the sensing signal SS from the force sensing module 60. The control system 50 is also configured to instruct the displacement mechanism 40 to move the moving part 43 along a first direction D1 or a second direction D2 based on the received sensing signal SS.

[0065] With the above configuration, the cutting device 20 of this application can accurately achieve the target cutting depth with the blade 30. As described above, the sensing signal SS provided by the force sensing module 60 indicates the magnitude of the force exerted by the object 17 on the force sensing module 60. As the blade 30 moves downward under the drive of the moving member 43 to increase the cutting depth, the force sensed by the force sensing module 60, which is also mounted on the moving member 43, also increases. For example, the value of the sensing signal SS output by the force sensing module 60 can be positively correlated with the magnitude of the force sensed by the force sensing module 60. Therefore, as the cutting depth of the blade 30 increases, the value of the sensing signal SS output by the force sensing module 60 increases. Utilizing this characteristic, the control system 50 can instruct the displacement mechanism 40 to move the moving member 43 and the blade 30 along the second direction D2 until the value of the sensing signal SS reaches or exceeds a preset value, which corresponds to the target cutting depth of the blade 30. The preset value can be set according to the target cutting depth. For example, a preliminary test can be conducted to obtain the relationship curve between the cutting depth and the sensing signal SS output by the force sensing module 60, and the value of the sensing signal SS when the cutting depth is equal to the target cutting depth can be used as the preset value.

[0066] like Figure 2As shown, in some embodiments, the force sensing module 60 includes a piezoelectric sensor 63 configured to provide a current signal or a voltage signal as the sensing signal SS outputted by the force sensing module 60. The current signal or the voltage signal provided by the piezoelectric sensor 63 is, for example, positively correlated to the external force applied to the piezoelectric sensor 63, and thus, the piezoelectric sensor 63 outputs a greater current signal or a voltage signal as the cutting depth of the knife head 30 increases.

[0067] As shown, in some embodiments, the force sensing module 60 further includes a contact element 65 and a resilient element 67. The contact element 65 is configured to abut against the surface of the cutting object 17, and the resilient element 67 is disposed between the contact element 65 and the piezoelectric sensor 63. The resilient element 67 is, for example, a tension spring. The resilient element 67 can keep the contact element 65 abutting against the surface of the cutting object 17 by its restoring force, and the resilient element 67 can transmit the force with which the contact element 65 is pressed by the cutting object 17 to the piezoelectric sensor 63. Figure 2 As shown, in some embodiments, the moving component 43 of the displacement mechanism 40 has a recess 44 in which the piezoelectric sensor 63, the contact element 65 and the resilient element 67 are disposed, and the contact element 65 partially protrudes out of the recess 44. In some embodiments, the moving component 43 can have one or more stop structures (not shown) configured to interfere with the contact element 65 to prevent the contact element 65 from escaping from the recess 44.

[0068] Figure 2 As shown, in some embodiments, the force sensing module 60 includes a piezoelectric sensor 63 configured to provide a current signal or a voltage signal as the sensing signal SS outputted by the force sensing module 60. The current signal or the voltage signal provided by the piezoelectric sensor 63 is, for example, positively correlated to the external force applied to the piezoelectric sensor 63, and thus, the piezoelectric sensor 63 outputs a greater current signal or a voltage signal as the cutting depth of the knife head 30 increases.

[0069] As shown, in some embodiments, the force sensing module 60 further includes a contact element 65 and a resilient element 67. The contact element 65 is configured to abut against the surface of the cutting object 17, and the resilient element 67 is disposed between the contact element 65 and the piezoelectric sensor 63. The resilient element 67 is, for example, a tension spring. The resilient element 67 can keep the contact element 65 abutting against the surface of the cutting object 17 by its restoring force, and the resilient element 67 can transmit the force with which the contact element 65 is pressed by the cutting object 17 to the piezoelectric sensor 63. Figure 2 As shown, the cutting device 20 further includes a liquid supply module 70. The liquid supply module 70 includes a liquid conduit 73 disposed on the knife head 30 and configured to supply a liquid L to the cutting position of the cutting object 17 cut by the knife head 30. Taking the cutting object 17 as the adhesive product 10 for example, the liquid supply module 70 can supply a liquid L including a release agent to fill the release agent layer 14 of the protective film 12 of the adhesive product 10 that can be damaged during the cutting process, so as to keep the release agent layer 14 intact, facilitating the peeling of the protective film 12.

[0070] As shown, in some embodiments, the force sensing module 60 further includes a contact element 65 and a resilient element 67. The contact element 65 is configured to abut against the surface of the cutting object 17, and the resilient element 67 is disposed between the contact element 65 and the piezoelectric sensor 63. The resilient element 67 is, for example, a tension spring. The resilient element 67 can keep the contact element 65 abutting against the surface of the cutting object 17 by its restoring force, and the resilient element 67 can transmit the force with which the contact element 65 is pressed by the cutting object 17 to the piezoelectric sensor 63. Figure 2 As shown, when the cutting device 20 cuts the adhesive product 10, on the one hand, the thickness of the release agent layer 14 is generally only a few microns, and on the other hand, the target cutting depth of the knife head 30 can be set to be greater than the thickness of the adhesive layer 11 to ensure that the adhesive layer 11 can be cut off, and thus, the knife head 30 is likely to cut the release agent layer 14 and the protective layer 13, causing the release agent layer 14 and the protective layer 13 to have cuts (i.e., knife marks). Please refer to Figure 3 ​The cutting device 20 of this application is equipped with a liquid supply module 70. After the cutter head 30 reaches the target cutting depth, the liquid supply module 70 can inject the release agent into the cut of the release agent layer 14 and the protective layer 13, so that the release agent layer 14 remains intact. In this way, the adhesive layer 11 is prevented from sticking to the protective film 12, which would prevent the protective film 12 from being easily removed.

[0071] like Figure 2 As shown, in some embodiments, the control system 50 is electrically connected to the liquid supply module 70. When the control system 50 determines that the value of the sensor signal SS reaches or exceeds a preset value (that is, when the control system 50 determines that the cutter head 30 has reached the target cutting depth), the control system 50 is configured to instruct the liquid supply module 70 to start supplying liquid L and instruct the displacement mechanism 40 to move the moving part 43 along the first direction D1, so that the cutter head 30 gradually separates from the cutting object 17, allowing the liquid L (indicated by the dashed line) to flow fully into the cutting position of the cutting object 17 where it is cut by the cutter head 30.

[0072] like Figure 2 As shown, in some embodiments, the liquid supply module 70 further includes a liquid storage container 75 and a valve 77. The liquid storage container 75 is configured to store liquid L and is connected to a liquid pipeline 73. The valve 77 is disposed in the liquid pipeline 73. The valve 77 can be controlled by the control system 50. For example, the control system 50 can send a second control signal S2 to the valve 77, and the valve 77 can close the liquid pipeline 73, open the liquid pipeline 73, or regulate the flow rate of the liquid pipeline 73 according to the received second control signal S2.

[0073] like Figure 2 As shown, in some embodiments, the amount of liquid L supplied by the liquid supply module 70 is positively correlated with the value of the sensing signal SS output by the force sensing module 60. As described above, the sensing signal SS output by the force sensing module 60 can reflect the cutting depth of the cutter head 30. Therefore, under the above configuration, the greater the cutting depth of the cutter head 30, the greater the amount of liquid L supplied by the liquid supply module 70 can be, to ensure that the amount of liquid L coated on the cutting object 17 is sufficient.

[0074] like Figure 2As shown, in some embodiments, the control system 50 is electrically connected to the valve 77 of the liquid supply module 70 and configured to control the opening time or flow rate of the valve 77 based on the value of the sensing signal SS output by the force sensing module 60. For example, the control system 50 may control the valve 77 to extend its opening time or increase its flow rate (e.g., the volume or mass of liquid L allowed to flow through the valve 77 per unit time) as the value of the sensing signal SS increases. In some embodiments, the control system 50 is configured to output a second control signal S2 proportional to the sensing signal SS. The valve 77 receives the second control signal S2 and controls its own opening degree and opening time based on the second control signal S2 (e.g., a larger value of the second control signal S2 corresponds to a larger opening degree or a longer opening time of the valve 77) to control the supply of liquid L.

[0075] like Figure 2 As shown, in some embodiments, the blade 30 has a tip 33 and a bevel 35 connecting to the tip 33, and the liquid conduit 73 has an opening 74 at the bevel 35. In this way, after the liquid L flows out from the opening 74, it can flow along the bevel 35 to the tip 33 and accurately drip into the object being cut 17. In some embodiments, the blade 30 also has a side surface 37 connecting to the bevel 35, and the liquid conduit 73 extends along the side surface 37 to the end of the bevel 35 away from the tip 33, forming the opening 74 at the end of the bevel 35 away from the tip 33.

[0076] Please refer to the above as well. Figure 4 , Figure 4 It shows Figure 2 The flowchart shown illustrates the cutting device 20 performing a cutting operation. The operation process 90A can be executed by the control system 50 of the cutting device 20. The operation process 90A includes steps 91, 92, 96, 97, and 98.

[0077] like Figure 2 and Figure 4As shown, in step 91, the control system 50 instructs the displacement mechanism 40 to move the moving component 43 along the second direction D2. In step 92, while the moving component 43 is moving, the control system 50 confirms whether the value of the sensing signal SS provided by the force sensing module 60 reaches or exceeds the preset value. Specifically, at the beginning of the cutting, the moving component 43 at the initial position starts to move the blade head 30 and the force sensing module 60 along the second direction D2 towards the cutting object 17. After moving a distance, the blade head 30 and the contact element 65 of the force sensing module 60 contact the surface of the cutting object 17 at the same time. At this time, the blade head 30 can cut the cutting object 17 and continue to descend, while the contact element 65 with a blunt end (e.g., the end of the contact element 65 can have a flat surface) is blocked from continuing to descend and transmits the resistance to the piezoelectric sensor 63 through the elastic element 67, so that the piezoelectric sensor 63 outputs the sensing signal SS. The control system 50 receives the sensing signal SS and confirms whether the value of the sensing signal SS reaches or exceeds the preset value.

[0078] As shown in FIG. 9A, the control system 50 instructs the displacement mechanism 40 to move the moving component 43 along the second direction D2. In step 92, while the moving component 43 is moving, the control system 50 confirms whether the value of the sensing signal SS provided by the force sensing module 60 reaches or exceeds the preset value. Specifically, at the beginning of the cutting, the moving component 43 at the initial position starts to move the blade head 30 and the force sensing module 60 along the second direction D2 towards the cutting object 17. After moving a distance, the blade head 30 and the contact element 65 of the force sensing module 60 contact the surface of the cutting object 17 at the same time. At this time, the blade head 30 can cut the cutting object 17 and continue to descend, while the contact element 65 with a blunt end (e.g., the end of the contact element 65 can have a flat surface) is blocked from continuing to descend and transmits the resistance to the piezoelectric sensor 63 through the elastic element 67, so that the piezoelectric sensor 63 outputs the sensing signal SS. The control system 50 receives the sensing signal SS and confirms whether the value of the sensing signal SS reaches or exceeds the preset value. Figure 2 Figure 4 As shown, if the determination in step 92 is no, i.e., the control system 50 determines that the blade head 30 has not reached the target cutting depth, the operation flow 90A returns to step 91 and instructs the displacement mechanism 40 to continue moving the moving component 43 along the second direction D2. If the determination in step 92 is yes, i.e., the control system 50 determines that the blade head 30 has reached the target cutting depth, the operation flow 90A proceeds to step 96, in which the control system 50 instructs the displacement mechanism 40 to stop moving the moving component 43 and instructs the liquid supply module 70 to start supplying the liquid L.

[0079] As shown in FIG. 9A, the control system 50 instructs the displacement mechanism 40 to move the moving component 43 along the second direction D2. In step 92, while the moving component 43 is moving, the control system 50 confirms whether the value of the sensing signal SS provided by the force sensing module 60 reaches or exceeds the preset value. Specifically, at the beginning of the cutting, the moving component 43 at the initial position starts to move the blade head 30 and the force sensing module 60 along the second direction D2 towards the cutting object 17. After moving a distance, the blade head 30 and the contact element 65 of the force sensing module 60 contact the surface of the cutting object 17 at the same time. At this time, the blade head 30 can cut the cutting object 17 and continue to descend, while the contact element 65 with a blunt end (e.g., the end of the contact element 65 can have a flat surface) is blocked from continuing to descend and transmits the resistance to the piezoelectric sensor 63 through the elastic element 67, so that the piezoelectric sensor 63 outputs the sensing signal SS. The control system 50 receives the sensing signal SS and confirms whether the value of the sensing signal SS reaches or exceeds the preset value. Figure 2 Figure 4 As shown, in step 97, the control system 50 instructs the displacement mechanism 40 to move the moving component 43 along the first direction D1 (e.g., to move back to the initial position). In this way, the blade head 30 gradually separates from the cutting object 17, and the liquid L can fully flow into the position of the cutting object 17 that is cut by the blade head 30.

[0080] As shown in FIG. 9A, the control system 50 instructs the displacement mechanism 40 to move the moving component 43 along the second direction D2. In step 92, while the moving component 43 is moving, the control system 50 confirms whether the value of the sensing signal SS provided by the force sensing module 60 reaches or exceeds the preset value. Specifically, at the beginning of the cutting, the moving component 43 at the initial position starts to move the blade head 30 and the force sensing module 60 along the second direction D2 towards the cutting object 17. After moving a distance, the blade head 30 and the contact element 65 of the force sensing module 60 contact the surface of the cutting object 17 at the same time. At this time, the blade head 30 can cut the cutting object 17 and continue to descend, while the contact element 65 with a blunt end (e.g., the end of the contact element 65 can have a flat surface) is blocked from continuing to descend and transmits the resistance to the piezoelectric sensor 63 through the elastic element 67, so that the piezoelectric sensor 63 outputs the sensing signal SS. The control system 50 receives the sensing signal SS and confirms whether the value of the sensing signal SS reaches or exceeds the preset value. Figure 2 Figure 4 As shown, in step 98, the control system 50 instructs the liquid supply module 70 to stop supplying the liquid L, completing the cutting operation. For example, the control system 50 can instruct the liquid supply module 70 to stop supplying the liquid L after the liquid supply module 70 supplies the liquid L for a predetermined time, or the control system 50 can instruct the liquid supply module 70 to stop supplying the liquid L after the moving component 43 moves a predetermined distance along the first direction D1.

[0081] ​​​To ensure product quality, a sample of the adhesive product 10 can be taken after the cutting operation is completed to confirm whether the release film 12 of the adhesive product 10 can be successfully removed. Another embodiment of the present disclosure provides a method for detecting the adhesive product 10, which includes detecting the silicon (Si) content of the release agent layer 14. When the silicon content is sufficient (for example, when the silicon content is greater than or equal to a threshold value), it is determined that the release agent layer 14 is effective, and the adhesive product 10 is of good quality and has no film-removing failure problem. Otherwise, it is determined that the release agent layer 14 is not good. The detection of the silicon content can be performed by any method capable of detecting solid elements, such as EDS element analysis, atomic spectroscopy, and X-ray diffraction.

[0082] Whether the adhesive product 10 can successfully remove the film mainly depends on the integrity of the release agent layer 14, and the silicon content can reflect the integrity of the release agent layer 14. Therefore, the detection method provided by the present disclosure can provide more accurate detection results than traditional methods (for example, tensile test of the protective film).

[0083] Please refer to Figure 5 and Figure 6 . In addition to performing the aforementioned cutting operation of the adhesive product 10, the cutting device 20 can also perform a cutting and edge sealing or dispensing operation to simplify the production process. When the cutting device 20 performs the cutting and edge sealing or dispensing operation, the liquid L' supplied by the liquid supply module 70 is ink for edge sealing, liquid adhesive for dispensing, or other suitable materials. The operation process 90B of the cutting device 20 starts from the aforementioned step 91 and step 92, that is, the control system 50 instructs the displacement mechanism 40 to move the moving part 43 along the second direction D2 until it is determined that the cutting head 30 has reached the target cutting depth. In this embodiment, the cutting device 20 is configured to cut off the cutting object 18, and the target cutting depth is greater than or equal to the thickness of the cutting object. However, the target cutting depth is not limited to being greater than or equal to the thickness of the cutting object, but can also be less than the thickness of the cutting object to cut part of the film layer of the cutting object having multiple layers of materials.

[0084] As shown in Figure 5 and Figure 6 , then the operation process 90B proceeds to step 93, in which the control system 50 instructs the displacement mechanism 40 to stop moving the moving part 43. Then, in step 94, corner material removal is performed, for example, the portion K of the cutting object 18 that is cut off is removed. Then, in step 95, the control system 50 instructs the liquid supply module 70 to start supplying the liquid L', so that the liquid L' is coated on the side of the cutting position. Then, in step 97, the control system 50 instructs the displacement mechanism 40 to move the moving part 43 along the first direction D1. Then, in step 98, the control system 50 instructs the liquid supply module 70 to stop supplying the liquid L', and the cutting and edge sealing or dispensing operation is completed.

[0085] In summary, the cutting device of the present application is equipped with a force sensing module, which is arranged on the moving part together with the cutter head and abuts against the cutting object. During the cutting process of the cutter head, the sensing signal provided by the force sensing module can reflect the cutting depth of the cutter head, and the control system of the cutting device can use this sensing signal to control the displacement mechanism so that the cutter head can accurately reach the target cutting depth. In addition, the cutting device of the present application also includes a liquid supply module, which can supply liquid to the position of the cutting object cut by the cutter head. Taking the cutting object as an adhesive product as an example, the liquid supply module can supply release agent to fill the release agent layer that may be damaged in the cutting process of the protective film of the adhesive product, so that the release agent layer remains intact, facilitating the tearing of the protective film.

[0086] Although the present application has been disclosed in the embodiments as above, it is not intended to limit the present application, and those skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present application, and therefore the protection scope of the present application shall be subject to the scope defined by the claims.​

Claims

1. A cutting apparatus characterized by comprising: The application relates to a cutting device, comprising: a displacement mechanism, comprising a moving part; a cutter head, arranged on the moving part and facing a cutting object; a force sensing module, arranged on the moving part and configured to contact the cutting object, the force sensing module being configured to provide a sensing signal, the sensing signal indicating a force with which the force sensing module is pressed by the cutting object; the force sensing module comprising a piezoelectric sensor, the piezoelectric sensor being configured to provide a current signal or a voltage signal as the sensing signal; the force sensing module further comprising a contact element and an elastic element, the contact element being configured to abut against a surface of the cutting object, and the elastic element being arranged between the contact element and the piezoelectric sensor; a control system, electrically connected to the displacement mechanism and the force sensing module, and configured to instruct the displacement mechanism to move the moving part in a first direction or a second direction according to the sensing signal, wherein the first direction is away from the cutting object, and the second direction is opposite to the first direction; and a liquid supply module, comprising a liquid pipeline, the liquid pipeline being arranged on the cutter head and configured to supply liquid to a cutting position of the cutting object which is cut by the cutter head; the cutter head having a tip and a slope connected to the tip, the liquid pipeline having an opening at the slope; the cutting object being an adhesive product, the adhesive product comprising an adhesive layer and a protective film covering the adhesive layer, the protective film comprising a protective layer and a release agent layer, the release agent layer being located between the protective layer and the adhesive layer; wherein the control system is configured to instruct the displacement mechanism to move the moving part in the second direction until a value of the sensing signal reaches or exceeds a preset value, the preset value corresponding to a target cutting depth of the cutter head, wherein the control system is electrically connected to the liquid supply module, and when the value of the sensing signal reaches or exceeds the preset value, the control system is configured to instruct the liquid supply module to start supplying the liquid, and instruct the displacement mechanism to move the moving part in the first direction; the cutter head is configured to start cutting from the adhesive layer, and the liquid supplied by the liquid supply module is a release agent. The liquid supply module further comprises a liquid storage container and a valve, the liquid pipeline is connected to the liquid storage container, and the valve is arranged on the liquid pipeline; the control system is configured to control the valve.

2. The cutting apparatus of claim 1, wherein, The supply amount of the liquid supplied by the liquid supply module is positively correlated with the value of the sensing signal.

3. The cutting apparatus of claim 1, wherein, The liquid supply module further comprises a valve, the valve being arranged on the liquid pipeline, the control system being electrically connected to the valve and being configured to control an opening time of the valve or a flow rate of the valve according to the value of the sensing signal.

4. The cutting apparatus of claim 3, wherein ​

Images