Semiconductor silicon wafer surface defect multi-angle visual inspection fixture

Abstract

The present invention relates to the technical field of silicon wafer detection, and specifically to a multi-angle visual inspection jig for surface defects of semiconductor silicon wafers, comprising an integral external mechanism, wherein the integral external mechanism also comprises an integral bottom plate. The present invention utilizes the characteristic that light energy can be refracted through a mirror surface. After the semiconductor silicon wafer is processed, the surface of the processed original part has mirror characteristics. At this time, the processed original part is irradiated by an external irradiation mechanism, and the light reaches a photosensitive area along a set light path. When dust exists on the surface of the processed original part or the polishing effect is poor during grinding, the refraction efficiency will be low, and the refracted light projected into the photosensitive area will be reduced. The product avoids the trouble of an operator having to hold the silicon wafer by hand for inspection, reduces the chance of the semiconductor silicon wafer coming into contact with external objects, and avoids collisions between the processed original part and other equipment.

Description

Technical Field

[0001] The invention relates to the technical field of silicon crystal detection, and in particular to a multi-viewing angle visual inspection jig for surface defects of semiconductor silicon wafers. Background Art

[0002] In semiconductor processing and manufacturing, the inspection of silicon wafer surface is very important, which affects the processing efficiency of silicon wafer. In practice, the operator needs to hold the silicon wafer by hand when inspecting it. In addition, in order to conduct a comprehensive inspection of the silicon wafer to ensure the accuracy of the inspection, the operator also needs to constantly hold the silicon wafer at various angles to inspect the silicon wafer from multiple angles.

[0003] In the market, currently, silicon wafers are mostly inspected manually. This method of inspecting silicon wafers by hand is not convenient for operators, and it is easy to make mistakes and contaminate the outer wall of the silicon wafer. On the other hand, employees are easily affected by long-term work, leading to work negligence and reduced work efficiency. Therefore, a new solution needs to be studied to address the above problems. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a multi-angle visual inspection jig for surface defects of semiconductor silicon wafers, including an integral external mechanism, which also includes an integral bottom plate, an integral bearing is rotatably connected to the middle axis of the top outer wall of the integral bottom plate, an integral outer plate 1 is fixedly connected to the outer wall of the integral bearing, an integral outer column 1 is fixedly connected to the top outer wall of the integral outer plate 1, an integral outer plate 2 is fixedly connected to the outer wall of the integral bearing, and an integral outer column 2 is fixedly connected to the middle axis of the top outer wall of the integral outer plate 2. The integral external mechanism provides an installation position for subsequent mechanisms, which has a stabilizing effect during operation, offsets the trembling and vibration generated during the operation of the mechanism, ensures the normal operation of the equipment, and avoids problems such as bumps. It also includes:

[0005] The external irradiation mechanism includes an irradiation outer wall fixedly connected to the central axis of the outer wall at the top of the overall outer column, a irradiation telescopic wall is rotatably connected to the central axis of the front end of the outer wall, and the front end of the inner wall of the irradiation telescopic wall is rotatably connected to the irradiation rear wall. During the renovation project, the equipment emits light through the irradiation light source, which acts on the silicon wafer above the overall external mechanism and turns outward.

[0006] The external fixing mechanism includes an external support plate fixedly connected to the left and right sides of the irradiated outer wall, the external support plate is rotatably connected to an external swivel one at the bottom of the outer wall, and the external swivel one is rotatably connected to the bottom of the outer wall of the external swivel one. During operation of the device, the external swivel one and the external swivel two provide a guide for the rotation, and the external irradiation mechanism moves up and down along the guide to adjust the irradiation angle, and uses the difference in reflection angles to detect whether the outer surface of the silicon wafer meets the requirements.

[0007] The light-sensing mechanism includes a light-sensing base plate fixedly connected to the middle axis of the top outer wall of the second integral outer column, a light-sensing rotator fixedly connected to the middle axis of the top outer wall of the light-sensing base plate, and a light-sensing triangular plate fixedly connected to the middle axis of the top outer wall of the light-sensing rotator. The light source reflected by the silicon wafer is used for identification by an external illumination mechanism, so that the light-sensing mechanism can identify and inspect the surface quality of the silicon wafer.

[0008] Preferably, the overall external mechanism also includes an overall top plate fixedly connected to the central axis of the top outer wall of the overall bearing, an overall external groove is opened at the outer wall of the overall top plate, an overall top groove is opened at the central axis of the top outer wall of the overall top plate, a plurality of overall external brackets are fixedly connected to the top outer wall of the overall bottom plate, and an overall power rail is fixedly connected to the central axis of the inner wall of the overall external bracket. By utilizing the characteristic that light energy can be refracted through a mirror, after the semiconductor silicon wafer is processed, the surface of the processed original part has a mirror characteristic. At this time, the external irradiation mechanism is used to irradiate the processed original part, and the light then reaches the photosensitive area along the set light path.

[0009] Preferably, the external illumination mechanism also includes an illumination rear plate fixedly connected to the central axis of the inner wall of the illumination rear wall, an illumination middle plate rotatably connected to the central axis of the outer wall of the illumination rear plate, an illumination central axis plate fixedly connected to the central axis of the outer wall of the illumination middle plate, an illumination light source fixedly connected to the central axis of the inner wall of the illumination central axis plate, and an illumination light housing fixedly connected to the outer wall of the illumination light source. When there is dust on the surface of the processed original or the polishing effect is not good during grinding, the refraction efficiency will be low, and the refracted light projected into the photosensitive area will be reduced. This product avoids the trouble of the operator having to hold the silicon wafer in his hands for inspection, reduces the chance of contact between semiconductor silicon wafers and external objects, and avoids collisions between processed originals and other equipment.

[0010] Preferably, the external irradiation mechanism also includes an irradiation inner bracket fixedly connected to the central axis of the inner wall of the irradiation outer wall, a power motor is fixedly connected to the central axis of the inner wall of the irradiation inner bracket, an irradiation power disk is rotatably connected to the central axis of the outer wall at the rear end of the power motor, an irradiation bottom groove is provided at the bottom of the inner wall of the irradiation outer wall, an irradiation rotating plate 1 is rotatably connected to the outer wall of the irradiation rotating plate 1, and the outer wall of the irradiation rotating plate 1 is meshed with the outer wall of the irradiation power disk. Through the transmission of the above-mentioned mechanical kinetic energy, the external irradiation mechanism can regularly irradiate the silicon wafer at 180 degrees, and by recording the changes in the light source after refraction, it can be judged whether the silicon wafer meets the product qualification level.

[0011] Preferably, the external illumination mechanism also includes an illumination rotating plate 2 fixedly connected to the central axis of the outer wall of the illumination rotating plate 1, an illumination belt is rotatably connected to the outer wall of the illumination rotating plate 2, the illumination belt is rotatably connected to the illumination rotating plate 3 at the end away from the illumination rotating plate 2, an illumination residual gear is rotatably connected to the central axis of the rear wall of the illumination rotating plate 3, the rear wall of the illumination residual gear is rotatably connected to the inner wall of the illumination outer wall, and the characteristic of light energy being refracted through a mirror surface is utilized. When surface protrusions, surface depressions and other problems occur on semiconductor silicon wafers during inspection, the light will be refracted and offset.

[0012] Preferably, the external fixing mechanism also includes an external sliding plate fixedly connected to an outer wall of the irradiation rotating plate, an external sliding block is slidably connected to the central axis of the inner wall of the external sliding plate, an external bracket is fixedly connected to the outer wall behind the external sliding block, an external gear is rotatably connected to the outer wall of the irradiation outer wall, a plurality of external teeth are fixedly connected to the central axis of the inner wall of the external sliding block, the outer wall of the external teeth is rotatably connected to the outer wall of the external gear, an external irradiation mechanism is arranged above as the bottom integral top plate, a light source is emitted through the external irradiation mechanism, and the surface of the processed original is irradiated from multiple directions, when the light source is affected by protrusions or depressions, the light source will deviate from the set orbit and be located on the photosensitive body, when a deviation occurs in the refracted light source, the refraction point is located in a non-set area, thereby realizing rapid identification and detection of silicon wafers.

[0013] Preferably, the external fixing mechanism also includes an external bottom body fixedly connected to the outer wall of the bottom of the irradiated outer wall, an external bottom column is rotatably connected to the central axis of the bottom outer wall of the external bottom body, the external bottom column is rotatably connected to an external support plate at the end away from the external bottom body, an external sliding body 1 is fixedly connected to the front end of the outer wall of the bottom of the irradiated outer wall, an external sliding body 2 is fixedly connected to the rear end of the outer wall of the bottom of the irradiated outer wall, and an integral limiting ring is fixedly connected to the inner wall of the external sliding body 2. The hardness of the silicon wafer is less likely to deform than metal when it is thin enough, and the surface smoothness after the semiconductor processing technology can better meet the fit with the micro-reflector, and the alignment marks on the surface of the silicon wafer with the micro-reflector array can also be aligned with high precision, so that the structural area of ​​the detected silicon wafer micro-reflector can more accurately reflect the detection error.

[0014] Preferably, the photosensitive mechanism also includes a photosensitive rotating body fixedly connected to the top of the outer wall of the photosensitive triangle plate, a photosensitive middle plate is fixedly connected to the central axis of the outer wall of the photosensitive rotating body, a photosensitive main body is fixedly connected to the central axis of the outer wall of the photosensitive middle plate, and a photosensitive outer plate is fixedly connected to the outer wall of the photosensitive bottom plate. The present invention has a simple structure, is convenient for later equipment maintenance, and is easy to operate, thus avoiding serious damage to the equipment due to employee operating errors, and to a certain extent reduces the phenomenon of employees feeling dizzy during long-term work, causing negligence in work, and reducing work efficiency.

[0015] The present invention has the beneficial effects:

[0016] 1. The present invention utilizes the characteristic that light energy can be refracted through a mirror. After the semiconductor silicon wafer is processed, the surface of the processed original part has mirror characteristics. At this time, the processed original part is irradiated by an external irradiation mechanism, and the light reaches the photosensitive area along a set light path. When there is dust on the surface of the processed original part or the polishing effect is not good during grinding, the refraction efficiency will be low, and the refracted light projected into the photosensitive area will be reduced. This product avoids the trouble of the operator holding the silicon wafer by hand for inspection, reduces the chance of semiconductor silicon wafers contacting external objects, and avoids collisions between the processed original part and other equipment.

[0017] 2. The present invention utilizes the characteristic that light can be refracted through a mirror. When a semiconductor silicon wafer has surface protrusions, surface depressions, and other problems during inspection, the light will be offset when it is refracted. Utilizing this phenomenon, an external illumination mechanism is provided on the top as an integral top plate at the bottom. A light source is emitted through the external illumination mechanism, and the surface of the processed original is illuminated from multiple directions. When the light source is affected by protrusions or depressions, the light source will deviate from the set track and be located on the light-sensitive body. When a deviation occurs in the refracted light source, the refraction point is located in a non-set area, thereby realizing rapid identification and detection of silicon wafers.

[0018] 3. The present invention utilizes the hardness of silicon wafers, which are less likely to deform than metals when they are thin enough, and the surface smoothness after semiconductor processing technology is more suitable for the fit with the micro-mirrors. The alignment marks on the surface of the silicon wafer and the micro-mirror array can also be aligned with high precision, so that the structural area of ​​the silicon wafer micro-mirrors being tested can more accurately reflect the detection errors.

[0019] 4. The present invention has a simple structure, is convenient for later equipment maintenance, and is easy to operate, which can avoid serious damage to the equipment caused by employee operating errors. To a certain extent, it can reduce the phenomenon of employees working for a long time, causing dizziness, negligence in work, and reduced work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic cross-sectional view of the overall structure of the present invention;

[0022] Figure 3 It is a schematic diagram of the overall external structure of the present invention;

[0023] Figure 4 It is a schematic diagram of the external irradiation mechanism of the present invention;

[0024] Figure 5 It is a cross-sectional schematic diagram of the external irradiation mechanism of the present invention;

[0025] Figure 6 For the present invention Figure 5 A magnified view of middle;

[0026] Figure 7 It is a cross-sectional schematic diagram of the external irradiation mechanism of the present invention;

[0027] Figure 8 It is a bottom schematic diagram of the external irradiation mechanism of the present invention;

[0028] Fig. 9 Schematic diagram of the light sensing mechanism of the present invention.

[0029] In the figure: 1. Overall external mechanism; 101. Overall bottom plate; 102. Overall bearing; 103. Overall outer plate 1; 104. Overall outer column 1; 105. Overall outer plate 2; 106. Overall outer column 2; 107. Overall top plate; 108. Overall outer groove; 109. Overall top groove; 110. Overall external bracket; 111. Overall power rail; 112. Overall limiting ring; 2. External irradiation mechanism; 201. Irradiation of outer wall; 202. Irradiation of telescopic wall; 203. Irradiation of rear wall; 204. Irradiation of rear plate; 205. Irradiation of middle plate; 206. Irradiation of middle axis plate; 207. Irradiation of light source; 208. Irradiation of light shell; 209. Irradiation of inner bracket; 210. Power motor; 211. Irradiation of power disk; 212. Irradiation of bottom groove; 213. Irradiate the rotating plate one; 214, irradiate the rotating plate two; 215, irradiate the belt; 216, irradiate the rotating plate three; 217, irradiate the residual gear; 3, external fixing mechanism; 301, external support plate; 302, external swivel one; 303, external swivel two; 304, external sliding plate; 305, external sliding block; 306, external bracket; 307, external gear; 308, external tooth mouth; 309, external bottom body; 310, external bottom column; 311, external support plate; 312, external sliding body one; 313, external sliding body two; 4, photosensitive mechanism; 401, photosensitive bottom plate; 402, photosensitive swivel; 403, photosensitive triangle plate; 404, photosensitive rotating body; 405, photosensitive middle plate; 406, photosensitive main body; 407, photosensitive outer plate. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0031] For example, see Figure 1 - Figure 3 The present invention is a multi-angle visual inspection jig for surface defects of semiconductor silicon wafers, comprising an integral external mechanism 1, the integral external mechanism 1 also comprising an integral bottom plate 101, an integral bearing 102 is rotatably connected at the middle axis of the top outer wall of the integral bottom plate 101, an integral outer plate 103 is fixedly connected at the outer wall of the integral bearing 102, an integral outer column 104 is fixedly connected at the top outer wall of the integral outer plate 103, an integral outer plate 2 105 is fixedly connected at the outer wall of the integral bearing 102, an integral outer column 2 106 is fixedly connected at the middle axis of the top outer wall of the integral outer plate 2 105, the integral external mechanism 1 provides an installation position for subsequent mechanisms, which plays a stabilizing effect during operation, offsets the trembling and vibration generated during the operation of the mechanism, ensures the normal operation of the equipment, and avoids problems such as bumps, and also comprises:

[0032] The external irradiation mechanism 2 includes an irradiation outer wall 201 fixedly connected to the middle axis of the outer wall at the top of the integral outer column 104, a front end of the irradiation outer wall 201 is rotatably connected to an irradiation telescopic wall 202 at the middle axis of the outer wall, and a front end of the inner wall of the irradiation telescopic wall 202 is rotatably connected to an irradiation rear wall 203. During the modification project, the device emits light through an irradiation light source 207, which acts on the silicon wafer above the integral external mechanism 1 and turns outward;

[0033] The external fixing mechanism 3 includes an external support plate 301 fixedly connected to the left and right sides of the irradiated outer wall 201, and the external support plate 301 is rotatably connected to an external rotating body 1 302 at the bottom of the outer wall, and the external rotating body 1 302 is rotatably connected to an external rotating body 2 303 at the bottom of the outer wall. During the operation of the device, the external rotating body 1 302 and the external rotating body 2 303 provide the guide for the rotation, and the external irradiation mechanism 2 moves up and down along the guide to adjust the irradiation angle, and uses the difference in reflection angle to detect whether the outer surface of the silicon wafer meets the requirements;

[0034] The photosensitive mechanism 4 includes a photosensitive base plate 401 fixedly connected to the middle axis of the top outer wall of the integral outer column 106, a photosensitive rotator 402 is fixedly connected to the middle axis of the top outer wall of the photosensitive base plate 401, and a photosensitive triangular plate 403 is fixedly connected to the middle axis of the top outer wall of the photosensitive rotator 402. The external illumination mechanism 2 uses the light source reflected by the silicon wafer for identification, so that the photosensitive mechanism 4 can identify and inspect the surface quality of the silicon wafer.

[0035] The overall external mechanism 1 also includes an overall top plate 107 fixedly connected to the central axis of the top outer wall of the overall bearing 102, an overall external groove 108 is opened on the outer wall of the overall top plate 107, an overall top groove 109 is opened on the central axis of the top outer wall of the overall top plate 107, a plurality of overall external brackets 110 are fixedly connected to the top outer wall of the overall bottom plate 101, and an overall power rail 111 is fixedly connected to the central axis of the inner wall of the overall external bracket 110. By utilizing the characteristic that light energy can be refracted through a mirror, after the semiconductor silicon wafer is processed, the surface of the processed original part has a mirror characteristic. At this time, the external irradiation mechanism 2 is used to irradiate the processed original part, and the light then reaches the photosensitive area along the set light path.

[0036] For example 2, please refer to Figure 4 - Fig. 9 The present invention is a multi-angle visual inspection jig for surface defects of semiconductor silicon wafers. On the basis of Example 1, the external irradiation mechanism 2 also includes an irradiation rear plate 204 fixedly connected to the central axis of the inner wall of the irradiation rear wall 203, and an irradiation middle plate 205 is rotatably connected to the central axis of the outer wall of the irradiation rear plate 204, and an irradiation middle axis plate 206 is fixedly connected to the central axis of the outer wall of the irradiation middle plate 205, and an irradiation light source 207 is fixedly connected to the central axis of the inner wall of the irradiation middle axis plate 206, and an irradiation light shell 208 is fixedly connected to the outer wall of the irradiation light source 207. When there is dust on the surface of the processed original or the polishing effect is not good during grinding, the refraction efficiency will be low, and the refracted light projected into the photosensitive area will be reduced. This product avoids the trouble of the operator holding the silicon wafer by hand for inspection, reduces the chance of semiconductor silicon wafers contacting external objects, and avoids collisions between processed originals and other equipment.

[0037] The external irradiation mechanism 2 also includes an irradiation inner bracket 209 fixedly connected to the central axis of the inner wall of the irradiation outer wall 201, a power motor 210 is fixedly connected to the central axis of the inner wall of the irradiation inner bracket 209, an irradiation power disk 211 is rotatably connected to the central axis of the outer wall at the rear end of the power motor 210, an irradiation bottom groove 212 is provided at the bottom of the inner wall of the irradiation outer wall 201, an irradiation rotating plate 213 is rotatably connected to the outer wall of the bottom of the irradiation inner bracket 209, the outer wall of the irradiation rotating plate 213 is meshed with the outer wall of the irradiation power disk 211, through the transmission of the above-mentioned mechanical kinetic energy, the external irradiation mechanism 2 can regularly irradiate the silicon wafer at 180 degrees, and by recording the changes in the light source after refraction, it can be judged whether the silicon wafer reaches the product qualification level.

[0038] The external irradiation mechanism 2 also includes an irradiation rotating plate 214 fixedly connected to the central axis of the outer wall of the irradiation rotating plate 1 213, an irradiation belt 215 is rotatably connected to the outer wall of the irradiation rotating plate 214, the irradiation belt 215 is rotatably connected to the irradiation rotating plate 3 216 at the end away from the irradiation rotating plate 214, an irradiation residual gear 217 is rotatably connected to the central axis of the rear wall of the irradiation rotating plate 3 216, and the rear wall of the irradiation residual gear 217 is rotatably connected to the inner wall of the irradiation outer wall 201. By utilizing the characteristic that light energy can be refracted through a mirror, when surface protrusions, surface depressions and other problems occur on semiconductor silicon wafers during inspection, the light will be refracted and offset.

[0039] The external fixing mechanism 3 also includes an external sliding plate 304 fixedly connected to the outer wall of the irradiation rotating plate 213, an external sliding block 305 is slidably connected to the inner wall center axis of the external sliding plate 304, an external bracket 306 is fixedly connected to the rear outer wall of the external sliding block 305, an external gear 307 is rotatably connected to the outer wall of the irradiation outer wall 201, a plurality of external teeth 308 are fixedly connected to the inner wall center axis of the external sliding block 305, and the outer wall of the external teeth 308 is rotatably connected to the outer wall of the external gear 307. An external irradiation mechanism 2 is arranged above the bottom integral top plate 107, and a light source is emitted through the external irradiation mechanism 2, and the surface of the processed original is irradiated from multiple directions. When the light source is affected by protrusions or depressions, the light source will deviate from the set orbit and be located on the light-sensitive body 406. When a deviation occurs in the refracted light source, the refraction point is located in a non-set area, thereby realizing rapid identification and detection of silicon wafers.

[0040] The external fixing mechanism 3 also includes an external bottom body 309 fixedly connected to the bottom outer wall of the irradiated outer wall 201, an external bottom column 310 is rotatably connected to the central axis of the bottom outer wall of the external bottom body 309, and the external bottom column 310 is rotatably connected to an external support plate 311 at the end away from the external bottom body 309, an external sliding body 1 312 is fixedly connected to the front end of the bottom outer wall of the irradiated outer wall 201, an external sliding body 2 313 is fixedly connected to the rear end of the bottom outer wall of the irradiated outer wall 201, and an integral limiting ring 112 is fixedly connected to the inner wall of the external sliding body 2 313. The hardness of the silicon wafer is less likely to deform than metal when it is thin enough, and the surface smoothness after the semiconductor processing technology is more satisfactory for the fit with the micro-reflector. The alignment marks on the surface of the silicon wafer and the micro-reflector array can also be aligned with high precision, so that the structural area of ​​the detected silicon wafer micro-reflector can more accurately reflect the detection error.

[0041] The photosensitive mechanism 4 also includes a photosensitive rotating body 404 fixedly connected to the top of the outer wall of the photosensitive triangle plate 403, a photosensitive middle plate 405 is fixedly connected to the central axis of the outer wall of the photosensitive rotating body 404, a photosensitive main body 406 is fixedly connected to the central axis of the outer wall of the photosensitive middle plate 405, and a photosensitive outer plate 407 is fixedly connected to the outer wall of the photosensitive bottom plate 401. The structure of the present invention is simple, convenient for later equipment maintenance, and easy to operate, avoiding serious damage to the equipment due to employee operating errors, and to a certain extent reducing the phenomenon of employees feeling dizzy during long-term work, leading to negligence in work, and reducing work efficiency.

[0042] A specific application of this embodiment is: when the present invention is in operation, the power supply of the power motor 210 is turned on, and the power motor 210 provides power for the whole mechanism to operate, and drives the irradiation power disk 211 to rotate, and the irradiation power disk 211 drives the irradiation rotating plate 1 213 to rotate, wherein the irradiation rotating plate 1 213 moves along the irradiation power disk 211, and drives the external irradiation mechanism 2 to perform a circular motion, and the irradiation rotating plate 3 216 drives the external fixing mechanism 3 to move up and down. At this time, the characteristic of light energy being refracted through a mirror is utilized. After the semiconductor silicon wafer is processed, the surface of the processed original part has a mirror characteristic. At this time, the external irradiation mechanism 2 is used to irradiate the processed original part, and the light then reaches the photosensitive area along the set light path. When there is dust on the surface of the processed original part or the polishing effect is poor during grinding, the refraction efficiency will be low, and the projection The refracted light in the photosensitive area will be reduced. By utilizing the characteristic that light energy can be refracted through a mirror, when a semiconductor silicon wafer has surface protrusions, surface depressions, and other problems during inspection, the light will be refracted with an offset. By utilizing this phenomenon, an external irradiation mechanism 2 is provided on the top, and the bottom integral top plate 107 is used to emit a light source through the external irradiation mechanism 2, and the surface of the processed original is irradiated from multiple directions. When the light source is affected by protrusions or depressions, the light source will deviate from the set track and be located on the photosensitive body 406. When a deviation occurs in the refracted light source, the refraction point is located in a non-set area, thereby realizing rapid identification and detection of silicon wafers. The present invention has a simple structure, is convenient for later equipment maintenance, and is easy to operate, thereby avoiding serious damage to the equipment caused by employee operating errors, and to a certain extent reduces the phenomenon of employees working for a long time, feeling dizzy, neglecting work, and reducing work efficiency.

[0043] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A multi-angle visual inspection jig for surface defects of semiconductor silicon wafers, comprising an integral external structure (1), wherein the integral external structure (1) further comprises an integral bottom plate (101), wherein an integral bearing (102) is rotatably connected to the central axis of the top outer wall of the integral bottom plate (101), an integral outer plate 1 (103) is fixedly connected to the outer wall of the integral bearing (102), an integral outer column 1 (104) is fixedly connected to the top outer wall of the integral outer plate 1 (103), an integral outer plate 2 (105) is fixedly connected to the outer wall of the integral bearing (102), and an integral outer column 2 (106) is fixedly connected to the central axis of the top outer wall of the integral outer plate 2 (105), characterized in that: Also includes: An external irradiation mechanism (2), the external irradiation mechanism (2) comprising an irradiation outer wall (201) fixedly connected to the center axis of the outer wall at the top of the integral outer column (104), an irradiation telescopic wall (202) rotatably connected to the center axis of the outer wall at the front end of the irradiation outer wall (201), and an irradiation rear wall (203) rotatably connected to the front end of the inner wall of the irradiation telescopic wall (202); An external fixing mechanism (3), the external fixing mechanism (3) comprising an external support plate (301) fixedly connected to the left and right sides of the irradiated outer wall (201), the outer wall bottom of the external support plate (301) being rotatably connected to an external rotating body 1 (302), and the outer wall bottom of the external rotating body 1 (302) being rotatably connected to an external rotating body 2 (303); A light sensing mechanism (4), the light sensing mechanism (4) comprising a light sensing base plate (401) fixedly connected to the middle axis of the top outer wall of the integral outer column 2 (106), a light sensing rotating body (402) fixedly connected to the middle axis of the top outer wall of the light sensing base plate (401), and a light sensing triangular plate (403) fixedly connected to the middle axis of the top outer wall of the light sensing rotating body (402); The integral external mechanism (1) further comprises an integral top plate (107) fixedly connected to the center axis of the top outer wall of the integral bearing (102); an integral outer groove (108) is provided on the outer wall of the integral top plate (107); an integral top groove (109) is provided on the center axis of the top outer wall of the integral top plate (107); a plurality of integral outer brackets (110) are fixedly connected to the top outer wall of the integral bottom plate (101); and an integral power rail (111) is fixedly connected to the center axis of the inner wall of the integral outer bracket (110); The external irradiation mechanism (2) further comprises an irradiation rear plate (204) fixedly connected to the center axis of the inner wall of the irradiation rear wall (203); an irradiation middle plate (205) is rotatably connected to the center axis of the outer wall of the irradiation rear plate (204); an irradiation middle axis plate (206) is fixedly connected to the center axis of the outer wall of the irradiation middle plate (205); an irradiation light source (207) is fixedly connected to the center axis of the inner wall of the irradiation middle axis plate (206); and an irradiation light housing (208) is fixedly connected to the outer wall of the irradiation light source (207).

2. The multi-view visual inspection jig for semiconductor silicon wafer surface defects according to claim 1, characterized in that: The external irradiation mechanism (2) further comprises an irradiation inner bracket (209) fixedly connected to the center axis of the inner wall of the irradiation outer wall (201); a power motor (210) is fixedly connected to the center axis of the inner wall of the irradiation inner bracket (209); an irradiation power disk (211) is rotatably connected to the center axis of the outer wall at the rear end of the power motor (210); an irradiation bottom groove (212) is provided at the bottom of the inner wall of the irradiation outer wall (201); an irradiation rotating plate (213) is rotatably connected to the outer wall of the bottom of the irradiation inner bracket (209); and the outer wall of the irradiation rotating plate (213) is meshed with the outer wall of the irradiation power disk (211).

3. The multi-view visual inspection jig for semiconductor silicon wafer surface defects according to claim 2, characterized in that: The external irradiation mechanism (2) further comprises an irradiation rotating plate 2 (214) fixedly connected to the central axis of the outer wall of the irradiation rotating plate 1 (213); an irradiation belt (215) is rotatably connected to the outer wall of the irradiation rotating plate 2 (214); the irradiation belt (215) is rotatably connected to the irradiation rotating plate 3 (216) at one end away from the irradiation rotating plate 2 (214); an irradiation residual gear (217) is rotatably connected to the central axis of the rear wall of the irradiation rotating plate 3 (216); and the rear wall of the irradiation residual gear (217) is rotatably connected to the inner wall of the irradiation outer wall (201).

4. The multi-view visual inspection jig for semiconductor silicon wafer surface defects according to claim 3, characterized in that: The external fixing mechanism (3) also includes an external sliding plate (304) fixedly connected to the outer wall of the irradiation rotating plate (213), an external sliding block (305) is slidably connected to the central axis of the inner wall of the external sliding plate (304), an external bracket (306) is fixedly connected to the rear outer wall of the external sliding block (305), an external gear (307) is rotatably connected to the outer wall of the irradiation outer wall (201), a plurality of external teeth (308) are fixedly connected to the central axis of the inner wall of the external sliding block (305), and the outer wall of the external teeth (308) is rotatably connected to the outer wall of the external gear (307).

5. The multi-view visual inspection jig for semiconductor silicon wafer surface defects according to claim 4, characterized in that: The external fixing mechanism (3) also includes an external bottom body (309) fixedly connected to the bottom outer wall of the irradiated outer wall (201); an external bottom column (310) is rotatably connected to the central axis of the bottom outer wall of the external bottom body (309); an external bottom column (310) is rotatably connected to an external support plate (311) at one end away from the external bottom body (309); an external sliding body 1 (312) is fixedly connected to the front end of the bottom outer wall of the irradiated outer wall (201); an external sliding body 2 (313) is fixedly connected to the rear end of the bottom outer wall of the irradiated outer wall (201); and an integral limiting ring (112) is fixedly connected to the inner wall of the external sliding body 2 (313).

6. The multi-view visual inspection jig for semiconductor silicon wafer surface defects according to claim 5, characterized in that: The light sensing mechanism (4) further comprises a light sensing rotating body (404) fixedly connected to the top of the outer wall of the light sensing triangle plate (403); a light sensing middle plate (405) is fixedly connected to the middle axis of the outer wall of the light sensing rotating body (404); a light sensing main body (406) is fixedly connected to the middle axis of the outer wall of the light sensing middle plate (405); and a light sensing outer plate (407) is fixedly connected to the outer wall of the light sensing bottom plate (401).

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