Wide ion beam (BIB) system for more efficient processing of multiple samples
By using a dual BIB source system and laser-assisted methods, the problems of long alignment time and frequent downtime in wide ion beam polishing systems have been solved, enabling continuous sample processing without downtime and improving system efficiency and throughput.
Patent Information
- Application Number
- CN202310573084.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2022-05-19
- Filing Date
- 2023-05-19
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2043-05-19
AI Technical Summary
Existing wide ion beam polishing systems suffer from long alignment times and frequent system downtime during sample preparation, resulting in low work efficiency. This is mainly due to the increased maintenance frequency caused by the rapid material removal of the high-energy wide ion beam, which leads to material redeposition.
A dual-BIB source system is employed, which cleans and maintains the second BIB source without affecting sample processing. The internal volume is isolated from the source volume using valves, ensuring continuous system operation. In addition, a laser beam is used to quickly remove most of the sample, and a wide ion beam is used to precisely process the region of interest.
It enables continuous sample processing without downtime, improves system uptime and processing efficiency, reduces system maintenance frequency, and increases sample preparation throughput.
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Figure CN117086702B_ABST
Abstract
Description
Background Technology
[0001] Wide-beam ion (BIB) polishing systems are used to prepare samples for research. Specifically, BIB polishing systems guide a high-energy, unfocused or minimally focused ion (e.g., argon ion) beam to the sample, where the beam degrades and / or otherwise removes the portion of the sample it is incident on. Because wide-beam ion beams do not require focusing or require minimal focusing, BIB polishing systems do not have the optical column limitations of other sample preparation techniques (such as focused ion beam (FIB) milling), and therefore can employ much higher master energy beam currents. Due to the higher master energy beam current, BIB systems can remove sample material more quickly to expose regions of interest than existing systems, resulting in a faster sample preparation process.
[0002] Unfortunately, while efficient in removing sample material, the processed samples require precise alignment with a special mask designed to block the beam from incident on areas of the sample the user does not intend to remove. This alignment process is time-consuming and requires precise skill, thus slowing down the sample preparation workflow. Furthermore, because the higher current, wider ion beam removes sample material more quickly, the rate of redeposition of the removed material onto the wider ion beam source also increases, forcing the user to remove the source more frequently for cleaning, resulting in system downtime. Due to these limitations in workflow efficiency, most current use of BIB polishing systems is geared towards academic and other non-commercial applications. Therefore, there is a need for new BIB polishing systems that can efficiently and accurately process large numbers of samples in shorter time periods. Summary of the Invention
[0003] This invention discloses a system and method for operating a broad ion beam (BIB) polisher with improved uptime in a sample preparation workflow. An exemplary method according to the invention for operating a broad ion beam (BIB) polisher with improved uptime includes: causing the first BIB source to fire a first broad ion beam toward the sample located within an internal volume of the BIB polisher while a first BIB source fires a first broad ion beam toward the sample; removing a second BIB source from the BIB polisher, the second BIB source being configured to fire a second broad ion beam toward the sample during use. The first broad ion beam is configured to cause a portion of the sample to be removed. The method according to the invention may further include: sealing a housing volume containing the second BIB source from the internal volume before removing the second BIB source from the BIB polisher; reinstalling the second BIB source (or another BIB source) in the housing volume; using a pump system to match at least one of the pressure and gas composition of the housing volume with at least one of the pressure and gas composition of the internal volume; and switching a valve to the open state. In this way, the second BIB source can be maintained, cleaned, or replaced, while the BIB polisher continues to use the first BIB source to process samples.
[0004] An exemplary wide ion beam (BIB) sample preparation system with improved uptime according to the present invention includes: a housing defining an internal volume; and a sample stage positioned within the internal volume, wherein the sample stage is configured to hold the sample holder during polishing of a sample held by a sample holder; the exemplary system further includes: a first BIB source configured to emit a first wide ion beam toward the sample in use, wherein the first BIB source is positioned within a first source housing; and a second BIB source configured to emit a second wide ion beam toward the sample in use, wherein the first BIB source is positioned within a second source housing. According to the present invention, the second BIB source is configured to be removed when the first BIB source emits the first wide ion beam toward the sample. Attached Figure Description
[0005] The specific embodiments are described with reference to the accompanying drawings. In the drawings, the leftmost numeral of the reference numeral indicates the drawing in which the reference numeral first appears. Identical reference numerals in different drawings indicate similar or identical items.
[0006] Figure 1 A cross-section of an exemplary BIB system according to this disclosure is depicted, the BIB system being configured to process multiple samples more efficiently.
[0007] Figure 2 An exemplary environment is shown for more efficient processing of multiple samples within a sample preparation workflow.
[0008] Figure 3 An exemplary process for processing samples via a dual BIB system, according to the present invention, is described to increase system uptime.
[0009] Figure 4 An exemplary process according to the present invention for processing samples by means of a dual-mode, optical, and BIB milling system for more efficient sample processing is described.
[0010] Figure 5 An exemplary process according to the present invention for processing multiple samples within a dual BIB system with reduced downtime is described.
[0011] Figure 6 An exemplary process for processing samples via a BIB system, according to the present invention, is described to increase system uptime.
[0012] Figure 7A and Figure 7B This is an exemplary illustration showing the sample pre-aligned with a first mask and subsequently processed by a BIB system containing a second mask.
[0013] In several views of the accompanying drawings, similar reference numerals refer to corresponding parts. Generally, in the drawings, elements that may be included in a given example are shown in solid lines, while elements that are optional for a given example are shown in dashed lines. However, elements shown in solid lines are not essential for all examples of this disclosure, and elements shown in solid lines may be omitted from certain examples without departing from the scope of this disclosure.
[0014] Detailed implementation of the implementation plan
[0015] This document discloses systems and methods for more efficiently processing multiple samples using a wide ion beam (BIB) system. More specifically, this disclosure includes a BIB system configured to receive and process one or more samples, which has increased throughput and / or uptime compared to current BIB systems.
[0016] Figure 1This illustration shows a cross-sectional view 100 of an exemplary BIB system 102 according to the present disclosure, configured to process multiple samples 104 more efficiently. The BIB system 102 includes a BIB source 106 configured to emit a broad ion beam 108 along a BIB axis 110 toward a sample stage region 112. The broad ion beam 108 is configured such that when a portion of the broad ion beam 108 is incident upwards onto the sample 104, material of the sample incident on the broad ion beam is milled or otherwise removed from the sample. For example, in some embodiments, the BIB source 106 may be an Ar ion source configured to emit an argon ion beam toward the sample stage 112.
[0017] The sample stage region 112 may include a mask 114 configured to block a portion of the wide ion beam 108 so that sample material corresponding to the region of interest is not milled or otherwise removed from the sample 104 by the incident ions. For example... Figure 1 The diagram shows a first portion of the cross-section of a wide ion beam 108(a) incident on a mask 114, and a second portion of the cross-section of the wide ion beam 108(a) partially incident on a portion of a sample 104, the material of which will be milled or otherwise removed by the wide ion beam 108. The mask 114 is composed of a hard material that is not degraded by the wide ion beam 108, thus allowing it to be used to process multiple samples.
[0018] The sample stage region 112 may also include a retainer interface configured to receive a sample retainer 116 such that it can be positioned and held relative to the mask 114 during processing of the sample 104, thereby allowing the mask to protect the portion of interest in the sample. In some embodiments, the sample stage region 112 may include a stage element capable of translating, tilting, or rotating the sample 104 / sample retainer 116. Additionally, in such embodiments, the stage element may also be configured to translate, plan, or rotate the sample 104 / sample retainer 116 as the BIB source 106 fires a wide ion beam 108 toward the sample 104. For example, the stage element may be configured to periodically or continuously rotate the sample 104 / sample retainer 116 through a series of predefined angular positions, and / or to oscillate the sample 104 / sample retainer 116 between two angular positions during wide ion beam milling. This translation / tilting / rotation may be performed at a constant or varying speed. In this way, the stage element can dynamically change the portion of the sample 104 irradiated by the wide ion beam 108 to allow for more efficient or otherwise optimized removal of sample material and / or polishing of the region of interest by the BIB system 102.
[0019] The sample holder 116 is configured to hold the sample 104 during processing and during transport of the sample 104 into, outside and / or into the BIB system 102. Figure 1 The BIB system 102 is also shown as including one or more additional samples 104(a) held by corresponding additional sample holders 116(a). In some embodiments, the BIB system 102 has one or more optional sample storage volumes / regions 118, in which the sample holders may be parked when the samples 104 held therein are not currently being processed. Figure 1 The BIB system 102 is also shown as including a storage cartridge 120 configured to hold a plurality of sample holders 116 positioned within a cartridge storage volume 122. The storage cartridge 120 is configured to allow a plurality of samples 104 and their corresponding sample holders 116 to be transported to and / or loaded into the BIB system 102.
[0020] In some embodiments, the sample holder 116 may include one or more optional adjustment elements 124 that allow the sample 104 to be translated, tilted, rotated, or otherwise repositioned relative to the sample holder 116, the wide ion beam 108, and / or the mask 114. In embodiments with such adjustment elements 118, the BIB system 112 may include one or more interface elements that allow the user to manipulate the adjustment elements or the sample holder 116 itself to achieve a desired geometric relationship between the sample 104 and the mask 114 or features of the mask (e.g., mask edge 114(a)). Although Figure 1 Adjustment element 124 is shown as a screw, but those skilled in the art will understand that there are many types of known adjustment elements that can translate, tilt, rotate or otherwise reposition the sample relative to various types of sample holders. Figure 1 Also shown is a sample holder manipulator 126 configured to reposition the sample holder 116 within the BIB system 102. For example, the sample holder manipulator 126 may be configured to move the sample holder between the sample holder storage volume 118 and the sample stage area 112. Furthermore, in some embodiments, the sample holder manipulator 126 may be further configured to engage with an adjustment element 124 to cause translation, tilting, rotation, etc., of the sample 104.
[0021] BIB system 102 also includes a housing 128 defining an internal volume 130. In some embodiments, the internal volume may be a sealed volume that prevents gases from the external environment from passing through. In such embodiments, the internal volume may include a pump system 132 configured to adjust the pressure of the internal volume 130 and / or change the gas composition of the environment within that internal volume. For example, the pump system 132 may cause the internal volume 130 to be at a lower pressure than the external environment and / or to be in a vacuum. Although Figure 1At least a portion of the pump system 132 is shown as optionally included within the internal volume, but those skilled in the art will understand that some or all of such pump system 132 may be located outside the internal volume 130. Alternatively, the pump system 132 may cause the gas composition of the environment within the internal volume 130 to consist of an inert gas (e.g., a gas that does not interact with the broad ion beam 108 and / or the sample 104 material during processing). The BIB system 102 is also shown as having a sample holder port 134 through which a sample holder 116 can be inserted into and / or removed from the BIB system 102. Furthermore, Figure 1 The BIB system 102 is also shown as having an optional box port 136 configured to allow storage box 120 to be inserted into and / or removed from the BIB system 102.
[0022] Figure 1 The BIB system 102 is also shown as including a source housing 138 that defines a source volume 140 configured to contain a BIB source 106. The source housing 138 further defines: a BIB aperture 142 that connects the source volume 140 to an internal volume 130; and a BIB source maintenance aperture 144 (e.g., a flange, door, or other type of sealable component that allows the source housing 138 to switch between a sealed and unsealed state relative to the external environment), which allows the BIB source 106 to be removed from or reinstalled within the source volume 140 (i.e., the source maintenance aperture 144 allows the BIB source 106 to be removed or accessed via the aperture 144 when unsealed). BIB system 102 may also include a valve 146 configured to switch between an open state and a sealed state. In the open state, ions emitted from BIB source 106 are allowed to pass through BIB orifice 142 from source volume 140 to inner volume 130. In the sealed state, valve 146 prevents ions or emitters from sample 104 from passing from inner volume 130 to source volume 130. Those skilled in the art will understand that valve 146 may correspond to any of a gate, valve, valve, or other sealing mechanism capable of switching between open and closed states.
[0023] Figure 1A valve 146 in the open state is shown, allowing a wide ion beam 108 to enter the internal volume for incident on sample 104 and mask 114. In some embodiments, when valve 146 is closed, source volume 140 may be open to the external environment (e.g., via BIB source maintenance port 144) without affecting the pressure within the internal volume. In this way, when valve 146 is closed, BIB source maintenance port 144 may be opened to allow BIB source 106 to be cleaned, adjusted, removed, replaced, and / or otherwise maintained without affecting the pressure or gas composition of internal volume 130. In such embodiments, source volume 140 may also include an optional pump system capable of re-establishing pressure and / or gas composition to match the pressure and / or gas composition of internal volume 130. BIB source maintenance port 144 may include a port configured to switch between an open and closed state, in which the first BIB source 106 can be removed from or reinstalled within source volume 140, and in the closed state, source volume 140 is sealed relative to the external environment.
[0024] Unlike focused ion beam (FIB) systems, BIB system 102 does not include an optical column comprising optical elements configured to focus ions emitted by BIB source 106 such that they have a small spot size in and around the sample plane of sample 104. Because such optical elements are only capable of focusing, correcting, tuning, and / or otherwise manipulating ion beams below a certain intensity threshold, and because such optical elements do not need to focus ions emitted by BIB source 106, the intensity of the wide ion beam (i.e., the main beam current) used in BIB system 102 can be much greater than in FIB systems. This increase in beam current allows BIB system 102 to remove sample material much faster than FIB systems. The applicant notes that those skilled in the art will understand that some optical elements may be included to focus a wide ion beam in BIB system 102; however, including such elements would impose a smaller beam current limitation on BIB system 102 (compared to FIB systems).
[0025] Due to the increased beam intensity of the wide ion beam 108, the material incident on the sample 104 by the wide ion beam 108 is removed at a faster rate than in a FIB milling process. Specifically, because the wide ion beam 108 has a higher beam intensity and is incident on a larger area of the sample, the rate of material removal from the sample 104 is much higher than in an FIB system. Unfortunately, due to this increased removal of sample material, material redeposition increases proportionally as portions of the sample 104 removed by the wide ion beam 108 are redeposited on surfaces within the internal volume 130 and / or source volume 140. In current BIB systems, this redeposition results in a significant reduction in efficiency because redeposition on the BIB source 106 forces the user to frequently remove and / or otherwise access the BIB source 106 for cleaning and maintenance. This cleaning and maintenance leads to high downtime in current BIB systems, where downtime cannot be used for sample processing.
[0026] Figure 1 The BIB system 102 is shown as including an optional additional BIB source 148 configured to emit an additional broad ion beam along an emission axis 150. The additional BIB source 148 is shown positioned within an additional source volume 152 defined by an additional source housing 154. The additional source housing 154 also defines an additional BIB port 156 connecting the additional source volume 148 to an internal volume 130, and an additional BIB source maintenance port 158 allowing the additional BIB source 148 to be removed from or reinstalled within the additional source volume 148.
[0027] BIB system 102 may also include an additional valve 160 configured to switch between an open state and a sealed state. In the open state, ions emitted from the additional BIB source 148 are allowed to pass through the additional BIB orifice 156 from the additional source volume 152 to the internal volume 130. In the sealed state, the additional valve 160 prevents ions or emitters from the sample 104 from passing from the internal volume 130 to the additional source volume 152. When valve 160 is closed, the additional source volume 152 can be opened to the external environment (e.g., via the additional BIB source maintenance orifice 158) without affecting the pressure within the internal volume 130. Therefore, when valve 160 is closed, the BIB source maintenance orifice 158 can be removed to allow the additional BIB source 148 to be cleaned, adjusted, removed, replaced, and / or otherwise maintained without affecting the pressure or gas composition of the internal volume 130.
[0028] Figure 1A closed valve 160 is shown, preventing sample material removed from sample 104 via the broad ion beam 108 from entering the additional source volume 152 and / or being redeposited on the additional BIB source 148. According to the invention, since no redeposition occurs on the additional BIB source 148 when BIB source 130 is used, the additional BIB source 148 can be used to process sample 104 (or an additional sample) when removal and / or access to BIB source 140 is required for cleaning and / or maintenance. Therefore, because valve 146 can be closed to seal and isolate source volume 140 from internal volume 130, valve 160 can be opened to allow the additional BIB source 148 to be used to emit an additional broad ion beam through the additional BIB aperture 156 to process the sample. Thus, in some embodiments of this disclosure, the BIB system 102 is able to process samples continuously without downtime, thereby greatly increasing its efficiency. Additionally, although not explicitly stated... Figure 1 As shown in the figure, but in various embodiments, BIB system 102 may include only one BIB source or may include three or more BIB sources.
[0029] Figure 1 The BIB system 102 is also shown as optionally including a laser source 162 located within a laser volume 164, which can be configured to emit a beam through a laser aperture 166 defined by a laser housing 168. The beam emitted by the laser source 162 has a higher beam energy and / or intensity than the wide ion beam 108, thereby allowing the beam to remove the sample material incident on the beam at a rate 10-50x greater than that achievable with a wide ion beam. For example, an optical laser can remove as much nickel or cobalt as a wide ion beam can remove in 90 minutes in less than 10 minutes. Furthermore, for harder materials such as graphite, wide ion beams currently require up to four hours to remove the same amount of material that a beam can remove in less than 10 minutes.
[0030] However, while removing sample material by beam is faster, the milling and / or processing performed by beam can also cause damage / burning to the remaining sample surface. Therefore, in embodiments of the invention, BIB system 102 can use a beam to rapidly remove an initial portion of sample 104, with the final portion of sample 104 to be removed being removed using a broad ion beam from a BIB source (e.g., BIB source 106, an additional BIB source 148, or another BIB source within BIB system 102). In this way, a large portion of sample 104 can be removed using a beam, followed by the use of a broad ion beam to expose the region of interest and / or create a smoother or undamaged surface.
[0031] Figure 1 A computing device 170 associated with the BIB system 102 is also shown. Figure 1The computing device 170 is shown as separate from the external device 112; however, in various embodiments, one or more of these components may be combined. That is, the applicant notes that the computing device 170 may be a component of the BIB system 102, a separate device communicating via a network communication interface from the BIB system 102, or a combination thereof.
[0032] Those skilled in the art will understand that Figure 1 The computing device 170 depicted herein is merely illustrative and is not intended to limit the scope of this disclosure. Computing systems and devices may include any combination of hardware or software capable of performing the indicated functions, including computers, network devices, internet infrastructure, PDAs, wireless telephones, controllers, etc. The computing device 170 may also be connected to other devices not shown, or alternatively, may operate as a stand-alone system. Furthermore, in some embodiments, the functionality provided by the illustrated components may be combined in fewer components or distributed across additional components. Similarly, in some embodiments, the functionality of some illustrated components may not be provided and / or other additional functions may be available.
[0033] Figure 1 The document also includes a schematic diagram illustrating an exemplary computing architecture 180 of computing device 170. The exemplary computing architecture 180 illustrates additional details of the hardware and software components that can be used to implement the techniques described in this disclosure. In the exemplary computing architecture 180, the computing hardware 170 of the BIB system 102 includes one or more processors 182 and memory 184 communicatively coupled to the one or more processors 182.
[0034] The exemplary computing architecture 180 may include at least a control module 188 and a sample processing module 190 stored in memory 184. The exemplary computing architecture 180 is further shown to include sample information 192 and a processing schedule 194 stored in memory 184. Sample information 192 may correspond to data describing sample characteristics, sample identification information, sample history, sample state, sample position on a sample holder, sample composition, region of interest within the sample, and surface of interest on the sample. Processing schedule 194 may include one or more methods, settings, or instructions for processing sample 104 via BIB system 102 to achieve a desired result (i.e., exposing and polishing the surface of interest within sample 104 so that it can be examined using a charged particle microscopy system). For example, processing schedule 194 may include combinations of... Figures 3 to 6The steps of one or more methods are shown and described. The sample processing schedule 194 may include laser intensity, laser milling time, a portion of the sample to be removed by the laser, BIB intensity, BIB milling time, a portion of the sample to be removed by the BIB, surface of interest, processing order, sample identification information, region of the sample to be removed, or a combination thereof. For example, the sample processing schedule 194 may be a data structure identifying multiple steps to be performed by components of the BIB system 102 in a specific order, wherein the data structure may also identify various parameters of the components and / or individual steps. In some embodiments, such a processing schedule 194 may be presented at least partially to the user of the BIB system 102 to guide the processing of the sample, may be used at least partially by the computing device 170 to automate and / or adjust settings associated with the processing of the sample, or a combination thereof.
[0035] In some implementations, sample information 192 and / or a separate processing schedule 194 may be input by a user (e.g., using a keypad, keyboard, mouse, voice command, touchscreen, etc.) into computing device 170, received via hardware connections (e.g., CD / DVD, USB, HDMI, portable storage, etc.), received via network connections (e.g., Bluetooth, Wi-Fi, Internet, etc.), received in association with a sample being inserted into BIB system 102 (e.g., accessible memory on sample holder 116), generated based on sensor information or sample information 192, or a combination thereof. For example, in an exemplary implementation, BIB system 102 may be configured to receive an identifier via RFID on sample holder 116, access sample information 192 associated with the identifier via a network connection, and then identify or generate a processing schedule 194 for sample 104 based on the identifier, sample information, or both.
[0036] As used herein, the term "module" is intended to indicate an exemplary division of executable instructions for discussion purposes, and not to indicate any type of requirement or required method, manner, or organization. Therefore, while various "modules" are described, their functionality and / or similar functionality may be arranged in different ways (e.g., combined into a smaller number of modules, broken down into a large number of modules, etc.). Furthermore, while specific functions and modules are described herein as being implemented by software and / or firmware executable on a processor, in other instances, any one or all of the modules may be implemented wholly or partially by hardware (e.g., a dedicated processing unit, etc.) to perform the described functions.
[0037] Control module 188 may be executed by processor 182 to cause computing device 170 and / or BIB system 102 to take one or more actions and / or perform sample processing scheduling steps. In some embodiments, control module 188 may be executed to adjust the settings of individual components of BIB system 102 (e.g., BIB source, laser source, etc.) to cause individual components of BIB system 102 to perform specific operations (e.g., moving a sample holder within BIB system 102, opening or closing a valve, emitting a wide ion beam, emitting a beam, aligning a sample, adjusting pressure settings or gases present in volumes 130, 140, and / or 152, etc.), or combinations thereof. For example, control module 188 may perform actions such that sample holder manipulator 126 engages a desired sample holder 116 stored within BIB system 102 (e.g., in storage cassette 120 within cassette storage volume 122, in sample holder storage volume 118, etc.), and causes the engaged sample holder 116 to translate, tilt, and / or rotate to sample stage region 112 such that it is nested with mask 114 and the sample 104 has a desired geometric relationship with mask 114. In such an example, control module 118 may further perform actions such as returning the sample holder 116 to its position within BIB system 102 once the sample 104 has been processed, and then engaging an additional sample holder 116, and then translating the additional sample holder 116 to sample stage region 112 so that the additional sample 104 can be processed.
[0038] Alternatively or otherwise, the control module 188 may cause the display 186 to present the processing protocol, information about the sample being processed, etc., to the user. For example, the control module 188 may present video / image information such as the alignment of the sample with the mask 114, the removed / polished / processed surfaces of the sample 104, etc. In some embodiments, the control module 188 may cause the display 186 to present a graphical user interface, which includes an optional interface that allows the user to input and / or change data associated with the sample 104 and / or select the protocol steps or component configurations to be used when processing the sample 104.
[0039] The sample processing module 190 can be executed by the processor 182 to at least partially automate the processing of sample 104 through the BIB system 102. For example, the sample processing module 190 can perform actions such as repositioning sample holder 116 within the BIB system 102, accessing sample information 192, determining a processing schedule 194 for sample 104, adjusting the configuration of components of the BIB system 102 driver, and / or causing components of the BIB system 102 to perform processing of sample 104. According to the invention, the sample processing module 190 can obtain sample information 192 of the sample 104 to be processed. In various embodiments, the sample processing module 190 can obtain information by receiving information from user input via hardwired or wireless connection. Alternatively or additionally, the sample processing module 190 can obtain information by determining information based on sensor information.
[0040] The sample processing module 190 can also perform actions to determine the desired component configuration of the components of the BIB system 102 based on user input, sample information 192 of sample 104, processing schedule 194 associated with sample 104, or a combination thereof. For example, based on sample information 192 indicating the composition and amount of sample material to be removed, the sample processing module 190 can determine the desired wide ion beam intensity (e.g., BIB current, accelerating voltage, stage shaking, etc.) and irradiation time with the wide ion beam required to process sample 104, and can adjust the configuration of the BIB source 106 and / or the associated processing schedule 194 accordingly.
[0041] Additionally, the sample processing module 190 can also execute to obtain a processing schedule 194 associated with the sample 104 to be processed. Obtaining the processing schedule 194 may correspond to accessing a predetermined processing schedule from an accessible data structure, modifying a predetermined processing schedule, generating a processing schedule for the sample, or a combination thereof. For example, after determining the identifier of the sample (e.g., by scanning a barcode on the sample holder 116), the sample processing module 190 can use the identifier to access sample information 192 and / or processing schedule 194 from a data structure stored in accessible memory. Alternatively or otherwise, the user may input the sample identifier, sample information 194, desired processing result, similar processing to occur, etc., which the sample processing module 190 can use to generate a customized processing schedule 194 that will cause the BIB system 102 to perform the desired sample processing. For example, based on the specifications of the processing schedule 194, the sample processing module 190 can cause the BIB system 102 to use... Figures 3 to 6Any of the methods shown may be used to process one or more samples 104. In some embodiments, the sample processing module 190 may provide a series of GUIs on the display 186, which allow the user to approve and / or give instructions to execute steps of the processing schedule 194. The sample processing module 190 may further perform some or all of the steps of the processing schedule 194 independently of user input.
[0042] The sample processing module 190 can be further executed by the processor 182 to automatically move the sample holders 116 within the BIB system 102, allowing a plurality of samples 104 to be processed continuously. For example, based on user input identifying multiple samples to be processed, the sample processing module 190 can cause the sample holder manipulator 126 to sequentially move the associated sample holders 116 between storage locations (e.g., storage cartridges 120, sample holder storage volumes 118, etc., located within cartridge storage volumes 122) and the sample stage area 112, allowing each identified sample to be processed. Because the sample processing module 190 is further configured to cause the BIB system 102 to perform some or all of the processing steps without user input, the sample processing module 190 allows the BIB system 102 to process multiple samples rapidly, continuously, and automatically without user supervision. In this way, the BIB system 102 of this disclosure allows a single user to monitor the processing of many samples across multiple BIB systems 102, and / or leave the BIB system 102 without user supervision to process a series of samples over a long period of time.
[0043] Computing device 170 includes one or more processors configured to execute instructions, applications, or programs stored in memory accessible to the one or more processors. In some examples, the one or more processors may include hardware processors, including but not limited to hardware central processing units (CPUs), graphics processing units (GPUs), etc. Although in many cases these technologies are described herein as being executed by one or more processors, in some cases these technologies may be implemented by one or more hardware logic components, such as field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), application-specific integrated circuits (ASICs), system-on-a-chip (SoCs), or combinations thereof.
[0044] One or more processor-accessible memories are instances of computer-readable media. Computer-readable media can include two types of computer-readable media: computer storage media and communication media. Computer storage media can include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, optical disc read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage devices, magnetic tape cassettes, magnetic tape, disk storage devices or other magnetic storage devices, or any other non-transfer medium that can be used to store desired information and is accessible by a computing device. Generally, computer storage media can include computer-executable instructions that, when executed by one or more processing units, cause the various functions and / or operations described herein to be performed. In contrast, communication media embody computer-readable instructions, data structures, program modules, or other data in modulated data signals (such as carrier waves) or other transmission mechanisms. As defined herein, computer storage media does not include communication media.
[0045] Those skilled in the art will also understand that, for memory management and data integrity purposes, items or portions thereof may be transferred between memory and other storage devices. Alternatively, in other embodiments, some or all of the software components may be executed in memory on another device and communicate with computing device 170. Some or all of the system components or data structures may also be stored (e.g., as instructions or structured data) on a non-transitory computer-accessible medium or portable article of manufacture for reading by a suitable drive, various examples of which have been described above. In some embodiments, instructions stored on a computer-accessible medium separate from computing device 170 may be transmitted to computing hardware and computing device 170 via a transmission medium or signal (such as an electronic, electromagnetic, or digital signal transmitted via a communication medium such as a wireless link). Various embodiments may further include receiving, transmitting, or storing instructions and / or data implemented on a computer-accessible medium as described above.
[0046] Figure 2 This is an illustration of an exemplary environment 200, in which the BIB system 102 is used to process multiple samples more efficiently within a sample preparation workflow. Specifically, Figure 2Environment 200 is shown as including sample preparation station 202, sample transport device 250, BIB system 102, and charged particle microscope 260. However, those skilled in the art will understand that different stations, components, and devices may be used to allow efficient sample processing by the BIB system 102 according to this disclosure. For example, exemplary environment 200 or its component elements / stations / devices can be used in practice. Figures 3 to 6 The methods described herein and other processes described herein.
[0047] Figure 2 Sample preparation station 202 is shown as a covered work area with controlled pressure and atmospheric gas composition. Specifically, Figure 2 The illustration shows a sample preparation station 202 including a barrier material 204 defining a working volume 206, and one or more optionally sealable orifices 208 through which components can pass between the working volume 206 and the external environment. However, those skilled in the art will understand that the sample preparation station 202 may correspond to an open environment. Additionally, while the sample preparation station 202 is in... Figure 2 While shown as separate from the BIB system 102, those skilled in the art will understand that in some embodiments, the sample preparation station 202 may be included in a chamber separate from the internal volume of the BIB system 102, such that samples can be aligned on a sample holder in the sample preparation station 202 while different samples are processed by the BIB source within the internal volume of the BIB system 102.
[0048] In some implementations, the user can select the pressure and atmospheric gas composition within the working volume 206 such that they are optimal for the preparation of the desired sample type 210. The working volume 206 is depicted as containing exemplary elements for preparing samples 210 for processing in the BIB system 102. For example, the working volume 206 is shown as including a plurality of samples 210 that have been harvested / generated and are ready for examination, a plurality of empty sample holders 212 on which the samples 210 can be positioned, exemplary aids 214 for aligning / positioning the samples on the sample holders, and a sample holder 216 containing the samples. While the exemplary aid 214 is shown as an optical microscope system, those skilled in the art will understand that different types of sample 210 / preparation workflows may require different types of aids to optimally align / position the samples on the sample holders.
[0049] In some embodiments of the invention, the preparation station further includes an additional mask 218 for aligning sample 210 onto sample holder 212. The additional mask 218 is geometrically configured such that when the sample is aligned and / or positioned such that the sample has a specific geometric relationship with the edges of the additional mask 218 when the sample holder is nested with the additional mask 218, the sample 210 will have the same specific geometric relationship with the edges of the mask 114(a) when the sample holder is nested within the BIB system 102 with the mask 114(a). This geometric similarity between the mask 114 and the additional mask 218 allows the sample to be aligned on its respective sample holder without consuming the potential time that the BIB system 102 can process the sample with wide ions and / or beams. In some embodiments, aligning the sample within the sample preparation station 202 may correspond to optically aligning the sample without using the additional mask 218. For example, by adjusting an adjustable portion of the sample holder so that the sample will be in the desired position, the sample can be optically aligned relative to the sample holder, wherein the sample holder and mask 114 are nested within the BIB system 102. Exemplary methods for optically aligning the sample in this manner include, but are not limited to, adjusting the sample edges to marked locations (e.g., using optical microscopy and / or image recognition algorithms), using laser gate sensing to determine the desired position, etc.
[0050] in addition, Figure 2 The sample preparation system is shown as including a storage cartridge 220 configured to hold a plurality of sample holders 216. The storage cartridge 220 is configured to allow a plurality of samples 204 and their corresponding sample holders 216 to be transported to and / or loaded into the BIB system 102. In this manner, a user can use an additional rod 218 to pre-align each of the plurality of samples 210 and then load them into the storage cartridge 220.
[0051] Figure 2 Optional sample transport device 204 is also shown, configured to transport sample holders 216 between sample preparation station 202 and BIB system 102 and / or between BIB system 102 and charged particle microscope 206. In some embodiments, sample transport device 204 may maintain a desired pressure and / or gas environment around sample holders 216 during transport. In such embodiments, sample transport device 204 allows samples to be prepared in sample preparation station 202, processed in BIB system 102, and studied in charged particle microscope 206 without exposure to pressures or gases other than the desired pressure and / or gas environment. Alternatively, sample holders 216 or storage cartridges 220 themselves may be transported between sample preparation station 202 and BIB system 102. In some embodiments, storage cartridges 220 may be able to maintain a plurality of sample holders 216 contained therein in a desired pressure and / or gas environment.
[0052] Figure 2 The exemplary environment 200 is also shown as including, in combination with Figure 1 The exemplary BIB system 102 described herein includes a BIB source 106 and an optional additional BIB source 148 configured to emit a broad ion beam along the BIB axis toward a sample stage region 112. The broad ion beam is configured such that when a portion of the broad ion beam is incident upwards onto a sample 210, the material of the sample on which the broad ion beam is incident is milled or otherwise removed from the sample. The sample stage region 112 may include a mask 114 configured to block a portion of the broad ion beam so that the sample material corresponding to the portion of interest is not milled or otherwise removed from the sample 210 by the incident ions. The sample stage region 112 may also include a retainer interface configured to receive a sample retainer 216 such that it can be positioned and held relative to the mask 114 during processing of the sample 210, thereby protecting the portion of interest in the sample from the mask. The BIB system 102 is also shown to include an optional laser source 162. The BIB system 102 is configured as described in Figure 1 As described in the discussion and / or according to the Figures 3 to 6 The methods described herein, as well as other procedures described herein, are used to process samples.
[0053] The exemplary environment 200 is also depicted as including a charged particle microscopy system 206 for examining a sample 210 that has been processed by the BIB system 102 according to the invention. The exemplary charged particle microscopy system 206 may include an electron microscope (EM) setup or an electron lithography setup configured to irradiate and / or otherwise bombard the sample 210 with a charged particle beam 222 (typically an electron beam or ion beam). In various embodiments, the charged particle microscopy system 206 may be or include one or more different types of EMs and / or charged particle microscopes, such as, but not limited to, scanning electron microscopes (SEM), scanning transmission electron microscopes (STEM), transmission electron microscopes (TEM), charged particle microscopes (CPM), dual-beam microscope systems, etc. Additionally, in some embodiments, a TEM can also operate as a STEM. Figure 2 An exemplary charged particle microscope system 206 is shown as a scanning electron microscope (SEM) 224.
[0054] Figure 3 An exemplary process 300 for processing samples via a dual BIB system is described, which achieves increased system uptime according to the present invention. Process 300 can be implemented in any environment (including any exemplary environment 200 for more efficient processing of multiple samples within a sample preparation workflow) via either of the BIB systems 102.
[0055] At step 302, a sample to be processed is optionally determined. For example, the sample to be processed may be determined based on input received from the user via an interface on the BIB system or via an associated computing device. Alternatively, the sample to be processed may be determined by the BIB system or an associated computing device that accesses data structures (i.e., tables, schedules, metadata, etc.) and / or executes instructions that result in determining the next sample to be processed. For example, the BIB system may be configured to sequentially access multiple sample holders stored therein, allowing a user to preload multiple samples into the BIB system for sequential, automatic processing. In such an example, the BIB system of the associated computing device will keep track of the order in which the samples to be processed will be processed next.
[0056] At step 304, a processing schedule for the sample is determined. The sample processing schedule corresponds to the BIB system configuration and workflow settings, and will be followed to achieve the desired processing outcome for the sample (e.g., BIB intensity, BIB milling time, a portion of the sample to be removed via the BIB, the surface of interest, or a combination thereof). In some embodiments, the processing schedule may be entered by the user by selecting a processing schedule from a pre-made list of processing schedules, entering / generating a new processing schedule, entering individual steps or configuration instructions, or a combination thereof. For example, the associated computer may present a graphical user interface including an optional interface that allows the user to enter and / or change data associated with the sample and / or select protocol steps or component configurations to be used when processing the sample. In another example, where the BIB system is frequently used to process specific types of samples to prepare them for a specific inspection modality, the BIB system or the associated computer may have stored associated processing schedules that the user can select (manually or via metadata associated with the sample, sample holder, etc.) to initiate frequently used processing configurations / workflows.
[0057] In some implementations, a processing schedule and sample information associated with the sample to be processed may be received. Sample information includes one or more of the following: sample identification information, sample composition, region of interest, surface of interest, associated processing schedule, etc. Alternatively or additionally, the BIB system or associated computing system may use predefined rules / instructions to determine the sample processing schedule based on the sample information. For example, a user may input a sample identifier, which the BIB system can use to access a data structure specifying the relevant sample information. The BIB system then uses predefined rules to create a custom processing schedule that will cause the BIB system to perform the desired processing of the sample. For example, the BIB system may set the beam intensity of a wide ion beam based on the composition of the material to be removed, and / or adjust the milling time based on the amount of material to be removed.
[0058] At step 306, the sample is prepared for processing. Preparing the sample for processing may include harvesting the sample from a larger sample or otherwise generating the sample (e.g., growing or depositing portions of the sample), loading the sample onto a sample holder, aligning the sample, transporting the sample to the BIB system, transporting the sample rack to a sample stage area within the BIB system, etc. For example, the BIB system may cause a component sample holder transport element to retrieve the sample holder associated with the sample to be processed from a storage area, and translate, tilt, and / or rotate the sample holder such that the geometry between the sample and the protective mask ensures that the mask will protect the desired portion of the sample during irradiation / milling.
[0059] At step 308, the BIB source is caused to emit a wide ion beam toward the sample. Figure 3 Step 310 is also shown to be performed while a broad ion beam is emitted toward the sample. At step 310, an additional BIB source is accessed. According to the invention, the additional BIB source is located within a volume that can be selectively sealed from the inside of the BIB system via a valve. In this way, when the valve is closed, milling material from the sample cannot enter the volume containing the additional BIB source. Additionally, in some embodiments, the pressure and / or gas composition is unaffected when the additional BIB source is accessed. In various embodiments, accessing the additional BIB source at 310 may include one or more of the following: removing the additional BIB source 312 from the BIB system (e.g., for cleaning, adjustment, repair, etc.), performing maintenance on the additional BIB system 314 (e.g., cleaning, alignment, etc.), replacing the additional BIB source 316 (e.g., reinstalling the BIB source after cleaning / maintenance), and / or installing a new BIB source 318 in the BIB system.
[0060] In step 320, a portion of the sample is removed using a broad ion beam. According to the invention, step 320 may include milling using a source different from the broad ion beam, such as... Figure 4 The dual optical and ion milling process described herein. In step 320, portions of the sample not covered by the protective mask are removed from the sample. In this way, the regions and / or portions of the sample undergoing additional processing can be rapidly exposed.
[0061] At step 322, it is determined whether another sample will be milled. If the answer at 322 is yes, the process returns to step 302 and the sample to be processed is determined. In this way, a large number of samples can be processed while accessing the additional BIB system. If the answer at 322 is no, process 300 can end.
[0062] Figure 4A sample process 400 according to the present invention for processing samples via a dual-mode, optical, and BIB milling system for more efficient sample processing is described. Process 400 can be implemented in any environment (including any exemplary environment 200 for more efficient processing of multiple samples within a sample preparation workflow) via any of the BIB systems 102.
[0063] At step 402, the sample to be processed is optionally determined. For example, the sample to be processed may be determined based on input received from the user via an interface on the BIB system or via an associated computing device. Alternatively, the sample to be processed may be determined by the BIB system or an associated computing device that accesses data structures (i.e., tables, schedules, metadata, etc.) and / or executes instructions that result in the determination of the next sample to be processed.
[0064] At step 404, a processing schedule for the sample is determined. The sample processing schedule corresponds to the BIB system configuration and workflow settings, and will be followed to achieve the desired processing outcome for the sample (e.g., BIB intensity, BIB milling time, a portion of the sample to be removed via the BIB, the surface of interest, or a combination thereof). In various embodiments, the processing schedule may be received by user input, along with sample information associated with the sample to be processed, or determined by the BIB system (e.g., based on sample information).
[0065] At step 406, the sample is prepared for processing. Preparing the sample for processing may include harvesting the sample from a larger sample or otherwise generating the sample (e.g., growing or depositing portions of the sample), loading the sample onto a sample holder, aligning the sample, transporting the sample to the BIB system, transporting the sample holder to a sample stage area within the BIB system, etc. For example, the BIB system may cause a component sample holder transport element to retrieve the sample holder associated with the sample to be processed from a storage area, and translate, tilt, and / or rotate the sample holder such that the geometry between the sample and the protective mask ensures that the mask will protect the desired portion of the sample during irradiation / milling.
[0066] At step 408, a laser source is directed to emit a beam (e.g., a laser) toward the sample. The beam emitted by the laser source has higher beam energy and / or intensity than a broad ion beam. In step 410, a first portion of the sample is removed by the beam. Due to the increased intensity of the beam, it can remove the sample material it is incident on at a rate 10-50x greater than that achievable with a broad ion beam. However, while removing sample material by beam is faster, the milling and / or processing performed by the beam also causes damage / burning to the remaining sample surface.
[0067] At step 412, the BIB source is directed to emit a broad ion beam toward the sample, and at step 414, a second portion of the sample is removed by the broad ion beam. Because the broad ion beam can remove sample material without damaging the sample surface, it can remove the final portion of the sample (i.e., the damaged portion) without causing further damage. In this way, once most of the material has been rapidly removed by the beam, the broad ion beam can be used to remove the final portion of the sample to expose the region of interest.
[0068] Figure 5 A sample process 500 according to the invention for processing multiple samples within a dual BIB system with reduced downtime is described. Process 500 can be implemented in any environment (including any exemplary environment 200 for more efficient processing of multiple samples within a sample preparation workflow) by any of the BIB systems 102.
[0069] At step 502, a sample to be processed is optionally determined. For example, the sample to be processed may be determined based on input received from the user via an interface on the BIB system or via an associated computing device. Alternatively, the sample to be processed may be determined by the BIB system or an associated computing device that accesses data structures (i.e., tables, schedules, metadata, etc.) and / or executes instructions that result in the determination of the next sample to be processed.
[0070] At step 504, a processing schedule for the sample is determined. The sample processing schedule corresponds to the BIB system configuration and workflow settings, and will be followed to achieve the desired processing outcome for the sample (e.g., BIB intensity, BIB milling time, a portion of the sample to be removed via the BIB, the surface of interest, or a combination thereof). In various embodiments, the processing schedule may be received by user input, along with sample information associated with the sample to be processed, or determined by the BIB system (e.g., based on sample information).
[0071] In step 506, the sample holder associated with the sample to be processed is removed from its storage location within the BIB system. For example, the BIB system may cause a component sample holder transport element (e.g., a sample holder manipulator) to retrieve the sample holder associated with the sample to be processed from a storage area within the BIB system and / or from a sample storage / transport device (e.g., a storage box).
[0072] At step 508, the sample holder is positioned in the sample stage area. Specifically, the sample holder transport element can translate, tilt, and / or rotate the sample holder such that the geometry between the sample and the protective mask ensures that the mask will protect the desired portion of the sample during irradiation / milling. In some embodiments, the sample may also be aligned with the mask based on user and / or sensor input. Alternatively or in addition, workflows (such as...) can be used. Figure 6 (The workflow described in the document) is used to realign the samples.
[0073] At step 510, the sample is processed. Specifically, the BIB source is directed to emit a broad ion beam toward the sample. The first portion of the sample incident with the broad ion beam is milled away, while the second portion of the sample blocked by the protective mask of the BIB source is not milled away. Alternatively or otherwise, other sample preparation workflows (including but not limited to the processes described herein) may be used to process the sample in the BIB system.
[0074] At step 512, the sample holder is removed from the sample stage area. That is, the sample holder transport element translates, tilts, and / or rotates the sample holder so that the sample holder is stored in a storage location, in a sample transport device, or transported outside the BIB system via a port.
[0075] At step 514, it is determined whether another sample will be processed. If the answer at 514 is yes, the process returns to step 502 and the sample to be processed is determined. If the answer at 514 is no, process 500 can end.
[0076] Figure 6 An exemplary process 300 for processing samples via a BIB system, according to the present invention, is described to increase system uptime. Process 600 can be implemented in any environment (including any exemplary environment 200 for more efficient processing of multiple samples within a sample preparation workflow) via any of the BIB systems 102.
[0077] At step 602, a sample is obtained. Specifically, the sample can be obtained by harvesting a sample from a larger sample, growing or depositing a portion of the sample, milling off a portion of the larger sample, or a combination thereof.
[0078] At step 604, the sample is secured to the sample holder, and at step 606, the sample holder is nested with the first mask. The first mask is geometrically similar to the second protective mask within the BIB system, such that a sample that is desiredly aligned with the first mask will also be desiredly aligned with the second sample. That is, when the sample is aligned with the first mask to the desired position on the sample holder, it does not need to be further aligned when the sample holder is subsequently nested within the second mask in the BIB system.
[0079] At step 608, the sample is aligned with the first mask. For example, a user may use an optical microscope, sensor, or vision to manipulate the sample alignment element on the sample holder, causing the sample to be translated, tilted, or rotated until it is in the desired alignment position. Once the sample is aligned, the sample holder may be translated into a sample storage area within the BIB system and / or from a sample storage / transport device (e.g., a storage cassette). For example, after the sample has been pre-aligned in this manner, the sample holder may be transported to a storage location within the BIB system where the sample will be processed. In some embodiments, the BIB system may have a separate sample alignment chamber in which some or all of steps 602-608 can be performed, and the sample manipulation element can transport the sample holder containing the aligned sample to the storage location within the BIB system. In this way, when the user aligns the sample with the first mask, the BIB system can use a second mask to process the pre-aligned sample.
[0080] In an alternative example, once the sample is aligned with the first mask, it can be loaded onto a sample transport device that protects the sample during transport / loading into the BIB system where it will be processed. This transport device can be configured to transport a single sample holder or multiple sample holders. In some embodiments, the transport device can maintain a pressure or gas environment around the sample during transport. In this way, the sample can be prepared in a sample preparation area with controlled pressure and / or gas composition, and then transported to the BIB system without exposing the sample to a new pressure / gas composition.
[0081] At step 610, it is determined whether another sample will be aligned. If the answer at 610 is yes, the process returns to step 602 and another sample is obtained. In this way, multiple samples can be pre-aligned and loaded into the sample storage area within the BIB system and / or loaded from the sample storage / transportation equipment. Because users can align many samples continuously, the throughput of sample preparation across multiple samples using this method can be greatly simplified.
[0082] If the answer at 610 is no, process 600 continues at step 612, where the sample holder is nested with a second mask within the BIB system. Because the sample is pre-aligned with the first mask, it does not require further alignment when the sample holder is nested with the second mask. This greatly increases the speed at which samples can be processed within the system.
[0083] At step 614, the sample is processed by the BIB system. For example, portions of the sample may be removed by a beam or wide ion beam according to any of the procedures described herein. Furthermore, since most of the user input currently required by BIB systems is related to the alignment process, by using this process to pre-align the sample, the required user input can be performed all at once during the alignment of multiple samples, and the remaining processing steps can be at least partially automated, enabling the BIB system according to the invention to process multiple pre-aligned samples with little or no user input / supervision.
[0084] At step 616, it is determined whether another sample will be processed. If the answer at 616 is yes, the process returns to step 612 and the other sample holder is nested with the second mask. If the answer at 616 is no, process 600 can end.
[0085] Figure 7A and Figure 7B This is an exemplary illustration showing sample 702 pre-aligned with a first mask 704, and subsequently processed by a BIB system including a second mask 706. Specifically, Figure 7A The image shows the alignment of sample 702 on sample holder 708 using an optical microscope 710. Figure 7B The processing of sample 704 within the BIB system using a wide ion beam 712 from BIB source 714 is illustrated. Because sample 702 is pre-aligned with first mask 704, and because second mask 706 is geometrically similar to first mask 704, sample 702 does not require alignment / positioning within the BIB system.
[0086] Embodiments of the subject matter of this invention according to this disclosure are described in the following enumerated paragraphs.
[0087] A1. A wide ion beam (BIB) sample preparation system with improved uptime, the BIB sample preparation system comprising: a housing defining an internal volume; a sample stage positioned within the internal volume, wherein the sample stage is configured to hold the sample holder during polishing of a sample held by a sample holder; a first BIB source configured to emit a first wide ion beam toward the sample in use, wherein the first BIB source is positioned within a first source housing; and a second BIB source configured to emit a second wide ion beam toward the sample in use, wherein the first BIB source is positioned within the first source housing, wherein the second BIB source is configured to be removed when the first BIB source emits the first wide ion beam toward the sample.
[0088] A2. The BIB sample preparation system according to paragraph A1, wherein the second source is further configured to be reinstalled when the first BIB source fires the first wide ion beam toward the sample.
[0089] A2.1. The BIB sample preparation system according to paragraph A2, wherein the first source is configured to be removed when the second source emits the second wide ion beam toward the sample.
[0090] A2.2. The BIB sample preparation system according to any one of paragraphs A2-A2.2, wherein the first source is configured to be reinstalled when the second BIB source emits the second wide ion beam toward the sample.
[0091] A3. The BIB sample preparation system according to any one of paragraphs A1-A2.2, wherein the first source housing and the second source housing are each at least partially located within the internal volume.
[0092] A4. The BIB sample preparation system according to any one of paragraphs A1-A3, wherein the first source housing at least partially defines: a first volume, the first volume including the first BIB source; and a first aperture connecting the first volume to the internal volume.
[0093] A4.1. The BIB sample preparation system according to paragraph A4 further includes a first valve configured to switch between: an open state, wherein the ions emitted from the first BIB source are allowed to pass through the first orifice from the first volume to the inner volume; and a sealed state, wherein the first valve prevents ions or emitters from the sample from passing from the inner volume to the first volume.
[0094] A4.1.1. The BIB sample preparation system according to paragraph A4.1, wherein when the first valve is in the sealed state, the first volume can be opened to the external environment without affecting the pressure within the internal volume.
[0095] A4.1.2. The BIB sample preparation system according to any one of paragraphs A4.1-A4.1.1, wherein when the first valve is in the sealed state, the first volume can be opened to the external environment without affecting the gas composition within the internal volume.
[0096] A4.1.3. The BIB sample preparation system according to any one of paragraphs A4.1-A4.1.2, wherein when the first valve is in the sealed state, the first BIB source can be removed from and reinstalled from the BIB sample preparation system without affecting the pressure or gas composition within the internal volume.
[0097] A4.1.4. The BIB sample preparation system according to any one of paragraphs A4.1-A4.1.3, wherein when the first valve is in the sealed state, the first volume is capable of opening to the external environment without disrupting the vacuum in the internal volume.
[0098] A4.1.5. The BIB sample preparation system according to any one of paragraphs A4.1-A4.1.4, wherein the first valve corresponds to one of a gate, valve, or valve.
[0099] A4.2. The BIB sample preparation system according to any one of paragraphs A4-A4.1.5, wherein the first housing further defines a first BIB source maintenance hole, the first BIB source maintenance hole allowing the first BIB source to be removed from or reinstalled within the first volume.
[0100] A4.2.1. The BIB sample preparation system according to paragraph A4.1 further includes a first proximity port configured to switch between: an open state, wherein the first BIB source can be removed from or reinstalled within the first volume; and a closed state, wherein the first volume is sealed and isolated from the external environment.
[0101] A4.2.2. The BIB sample preparation system according to paragraph A4.2.1, wherein the first housing is configured to allow the first volume to be pressurized independently of the internal volume or the second volume when the first valve and the first proximity port are each in the closed state.
[0102] A5. The BIB sample preparation system according to any one of paragraphs A1-A4.2.2, wherein the second source housing at least partially defines: a second volume including the second BIB source; and a second aperture connecting the second volume to the internal volume.
[0103] A5.1. The BIB sample preparation system according to paragraph A5 further includes a second valve configured to switch between: an open state, wherein the ions emitted from the second BIB source are allowed to pass through the second orifice from the second volume to the inner volume; and a sealed state, wherein the second valve prevents ions or emitters from the sample from passing from the inner volume to the second volume.
[0104] A5.1.1. The BIB sample preparation system according to paragraph A5.1, wherein when the first valve is in the sealed state, the first volume can be opened to the external environment without affecting the pressure within the internal volume.
[0105] A5.1.2. The BIB sample preparation system according to any one of paragraphs A5.1-A5.1.1, wherein when the first valve is in the sealed state, the first volume can be opened to the external environment without affecting the gas composition within the internal volume.
[0106] A5.1.3. The BIB sample preparation system according to any one of paragraphs A5.1-A5.1.21, wherein when the first valve is in the sealed state, the first BIB source can be removed from and reinstalled from the BIB sample preparation system without affecting the pressure or gas composition within the internal volume.
[0107] A5.1.4. The BIB sample preparation system according to any one of paragraphs A5.1-A5.1.3, wherein when the first valve is in the sealed state, the first volume is capable of opening to the external environment without disrupting the vacuum in the internal volume.
[0108] A5.1.5. The BIB sample preparation system according to any one of paragraphs A5.1-A5.1.4, wherein the second valve corresponds to one of a gate, valve, or valve.
[0109] A5.2. The BIB sample preparation system according to any one of paragraphs A5-A5.1.5, wherein the second housing further defines a second BIB source maintenance hole, the second BIB source maintenance hole allowing the second BIB source to be removed from or reinstalled within the second volume.
[0110] A5.2.1. The BIB sample preparation system according to paragraph A5.1 further includes a second proximity port configured to switch between: an open state, wherein the second BIB source can be removed from or reinstalled within the second volume; and a closed state, wherein the second volume is sealed and isolated from the external environment.
[0111] A5.2.2. The BIB sample preparation system according to paragraph A5.2.1, wherein the second housing is configured to allow the second volume to be pressurized independently of the internal volume or the first volume when the second valve and the second proximity port are each in the closed state.
[0112] A6. The BIB sample preparation system according to any one of paragraphs A1-A5.2.2 further includes one or more additional BIB sources.
[0113] A7. The BIB sample preparation system according to any one of paragraphs A1-A5.2.2, wherein the first BIB source emits the first wide ion beam toward the sample along a first axis, the second BIB source emits the second wide ion beam toward the sample along a second axis, and the angle between the first source and the second source is between 60 degrees and 120 degrees.
[0114] A8. The BIB sample preparation system according to any one of paragraphs A1-A7, further comprising: a processor; and a memory storing computer-readable instructions that, when executed on the processor, cause the processor to initiate execution of the method according to any one of paragraphs B1-B7.2.1.
[0115] B1. A method for operating a wide ion beam (BIB) polisher with improved uptime, the method comprising: causing a first BIB source to fire a first wide ion beam toward a sample positioned within an internal volume of the BIB polisher, wherein the first wide ion beam causes a portion of the sample in which the first wide ion beam was incident to be removed; and removing a second BIB source from the BIB polisher while the first BIB source fires the first wide ion beam toward the sample, wherein the second BIB source is configured to fire a second wide ion beam toward the sample when the second BIB source is in use.
[0116] B2. The method described in paragraph B1 further includes reinstalling the second BIB source into the BIB polishing system.
[0117] B2.1. The method described in paragraph B2, wherein the second BIB source is reinstalled when the first BIB source emits the first wide ion beam.
[0118] B2.1.1. The method according to paragraph B2.1, wherein the second BIB source is reinstalled when the first BIB source emits the first wide ion beam toward the sample.
[0119] B2.1.2. The method according to paragraph B2.1, wherein the second BIB source is reinstalled when the first BIB source emits the first wide ion beam toward a different sample.
[0120] B3. The method according to any one of paragraphs B1-B2.1 further includes causing the second BIB source to emit the second broad ion beam.
[0121] B3.1. The method according to paragraph B3, wherein the second wide ion beam is emitted toward the sample.
[0122] B3.2. The method described in paragraph B3, wherein the second wide ion beam is emitted toward different samples.
[0123] B4. The method according to any one of paragraphs B1-B3.2 further includes installing a third BIB source into the BIB polishing system.
[0124] B4.1. The method according to paragraph B4, wherein the third BIB source is installed while the first BIB source is emitting the first wide ion beam.
[0125] B4.1.1. The method according to paragraph B4.1, wherein the third BIB source is installed when the first BIB source emits the first wide ion beam toward the sample.
[0126] B4.1.2. The method according to paragraph B4.1, wherein the third BIB source is installed when the first BIB source emits the first wide ion beam toward different samples.
[0127] B4.2. The method according to any one of paragraphs B4-B4.1.2 further includes: causing the third BIB source to emit a third wide ion beam; and removing the first BIB source from the BIB polisher when the third BIB source emits the third wide ion beam.
[0128] B5. The method according to any one of paragraphs B1-B4.2, further comprising: causing the second BIB source to emit the second wide ion beam toward a new sample positioned within the internal volume of the BIB polisher, wherein the second wide ion beam causes a portion of the new sample in which the second wide ion beam is incident to be removed; and removing the first BIB source from the BIB polisher when the second BIB source emits the second wide ion beam toward the new sample.
[0129] B6. The method according to any one of paragraphs B4.2-B5 further includes reinstalling the first BIB source into the BIB polishing system.
[0130] B6.1. The method described in paragraph B6, wherein the first BIB source is reinstalled when the second BIB source emits the second wide ion beam.
[0131] B6.1.1. The method according to paragraph B6.1, wherein the first BIB source is reinstalled when the second BIB source emits the second wide ion beam toward the sample.
[0132] B6.1.2. The method according to paragraph B6.1, wherein the first BIB source is reinstalled when the second BIB source emits the second wide ion beam toward a different sample.
[0133] B7. The method according to any one of paragraphs B1-B6.1.2, wherein the BIB polisher includes a source housing defining a housing volume and an aperture between the housing volume and the internal volume of the BIB polisher.
[0134] B7.1. The method according to paragraph B7, wherein the second BIB source is located within the housing volume.
[0135] B7.2. The method according to any one of paragraphs B7-B7.1, wherein the BIB polisher further comprises a valve configured to switch between: an open state, wherein the ions emitted from the second BIB source are allowed to pass through the orifice from the housing volume to the inner volume; and a sealed state, wherein the valve prevents ions or emitters from the sample from passing from the inner volume to the housing volume.
[0136] B7.2.1. The method according to paragraph B7.2 further includes causing the valve to switch to the sealed state before removing the second BIB source from the BIB polisher.
[0137] C1. A method for preparing a sample using a combination of a broad ion beam (BIB) and a laser sample preparation system, the method comprising the steps of: positioning the sample within the internal volume of the combined sample preparation system; causing a laser source component of the combined sample preparation system to emit a light beam toward the sample, wherein the light beam causes a first portion of the sample in which the light beam is incident to be removed; and causing a BIB source component of the combined sample preparation system to emit a broad ion beam toward the sample, wherein the broad ion beam causes a second portion of the sample in which the broad ion beam is incident to be removed to expose a region of interest.
[0138] C2. The method according to paragraph C1, wherein the sample is irradiated by each of the beam and the wide ion beam without removing the sample from the internal volume.
[0139] C2.1. The method according to paragraph C2, wherein the sample is irradiated by each of the beam and the wide ion beam without repositioning the sample.
[0140] C2.2. The method according to any one of paragraphs C2-C2.1, wherein the sample is irradiated by each of the beam and the wide ion beam without repositioning the laser source.
[0141] C2.3. The method according to any one of paragraphs C2-C2.2, wherein the sample is irradiated by each of the beam and the wide ion beam without repositioning the BIB source.
[0142] C3. The method according to any one of paragraphs C1-C2.3, wherein the laser source is configured to irradiate the sample with the beam for a first time period, and the BIB source is configured to irradiate the sample with the beam for a first time period.
[0143] C3.1. The method according to paragraph C2, wherein at least one of the first time period and the second time period is a predetermined time period.
[0144] C3.2. The method according to any one of paragraphs C3-C3.1, wherein at least one of the first time period and the second time period is provided via user input.
[0145] C3.3. The method according to any one of paragraphs C3-C3.2, wherein at least one of the first time period and the second time period is determined by accessing sample information associated with the sample.
[0146] C3.4. The method according to any one of paragraphs C3-C3.3, wherein at least one of the first time period and the second time period is determined based on the material of the first portion of the sample.
[0147] C3.5. The method according to any one of paragraphs C3-C3.4, wherein at least one of the first time period and the second time period is determined based on information received by one or more sensors indicating that the first portion of the sample has been removed.
[0148] C3.6. The method according to any one of paragraphs C3-C3.5, wherein at least one of the first time period and the second time period is determined based on information received by one or more sensors indicating that the second portion of the sample has been removed.
[0149] C3.7. The method according to any one of paragraphs C3-C3.6, wherein at least one of the first time period and the second time period is determined based on information received by one or more sensors indicating that the region of interest has been exposed.
[0150] C3.8. The method according to any one of paragraphs C3-C3.7, wherein at least one of the first time period and the second time period is determined based on one or more of the following: laser intensity, a portion of the sample to be removed by the laser, BIB intensity, a portion of the sample to be removed by the BIB, the surface of interest, or a combination thereof.
[0151] C4. The method according to any one of paragraphs C1-C3.8, wherein the method further includes receiving sample information.
[0152] C4.1. The method according to paragraph C4, wherein the sample information is received via user input.
[0153] C4.2. The method according to paragraph C4, wherein the sample information is received by accessing a data file associated with the sample.
[0154] C4.3. The method according to any one of paragraphs C4-C4.2, wherein the sample information includes one or more of sample composition, region of interest, and surface of interest.
[0155] C4.4. The method according to any one of paragraphs C4-C4.3, wherein the sample information includes one or more processing schedules.
[0156] C4.4.1. The method according to paragraph C4.4, wherein the method further includes determining one or more processing schedules based on the sample information.
[0157] C4.4.2. The method according to paragraph C4.4, wherein the one or more processing schedules include one or more of the following: laser intensity, laser milling time, a portion of the sample to be removed by the laser, BIB intensity, BIB milling time, a portion of the sample removed by the BIB, a surface of interest, or combinations thereof.
[0158] C5. The method according to any one of paragraphs C1-C4.4.2, further comprising: positioning an additional sample within the internal volume of the combined sample preparation system; causing the laser source component of the combined sample preparation system to emit an additional beam toward the additional sample, wherein the additional beam causes the additional beam incident on the additional sample to be removed in a first portion; and causing the BIB source component of the combined sample preparation system to emit an additional broad ion beam toward the additional sample, wherein the additional broad ion beam causes the additional broad ion beam incident on the additional sample to be removed in a second portion to expose an additional region of interest.
[0159] C6. The method according to any one of paragraphs C1-C5, wherein the beam removes sample material 20x, 30x, 50x or faster than the wide ion beam.
[0160] D1. A combined wide ion beam (BIB) and laser sample preparation system with improved polishing throughput, the combined sample preparation system comprising: a housing defining an internal volume; a sample stage positioned within the internal volume, wherein the sample stage is configured to hold the sample holder during polishing of a sample held by a sample holder; a laser source configured to emit a beam toward the sample in use, wherein the beam causes a first portion of the sample in which the beam is incident to be removed; and a BIB source configured to emit a wide ion beam toward the sample in use, wherein at least a second portion of the sample in which the wide ion beam is incident to be removed to expose a region of interest.
[0161] D2. The combined sample preparation system according to paragraph D1 further includes: a processor; and a memory storing computer-readable instructions that, when executed on the processor, cause the processor to initiate execution of the method according to any one of paragraphs C1-C6.
[0162] E1. A storage cassette for storing multiple samples for wide ion beam (BIB) polishing, the storage cassette comprising: a housing at least partially defining an internal storage volume; a plurality of sample holder housings located within the internal storage volume, wherein each individual sample holder housing is configured to receive a sample holder comprising a corresponding sample for polishing in a BIB system; and wherein the storage cassette is configured to be inserted into the BIB system, and each of the sample holder housings is further configured to allow its corresponding sample holder to be removed from the cassette when the cassette is inserted into the BIB system, such that the corresponding sample can be polished by the BIB system.
[0163] F1. A wide ion beam (BIB) system for efficiently processing multiple samples, the BIB system comprising: a housing defining an internal volume; a sample stage positioned within the internal volume, wherein the sample stage is configured to hold the sample holder during polishing of a sample held by a sample holder; a BIB source configured to emit a first wide ion beam toward the sample in use, wherein the first BIB source is positioned within a first source housing; a cartridge housing configured to receive and hold a storage cartridge according to any one of paragraphs E1 and EXX; and a sample holder manipulator configured to: remove a separate sample holder from the storage cartridge; load the separate sample holder onto the sample stage to enable processing of the corresponding sample; remove the separate sample holder from the sample stage after the corresponding sample has been processed; and load the separate sample holder back into the storage cartridge.
[0164] F2. The BIB system according to paragraph F1 further includes: a processor; and a memory storing computer-readable instructions that, when executed on the processor, cause the processor to initiate execution of the method according to any one of paragraphs G1-G6.4.2.
[0165] G1. A method for efficiently processing multiple samples using a wide ion beam (BIB) system, the method comprising the steps of: removing a separate sample holder containing the samples from a storage cassette; loading the separate sample holder onto a sample stage configured to hold the sample holder during polishing of the corresponding sample held by the separate sample holder; causing a BIB source to emit a wide ion beam toward the samples, wherein the wide ion beam removes at least a portion of the sample from which the wide ion beam was incident; removing the separate sample holder from the sample stage after the corresponding sample has been processed; and loading the separate sample holder back into the storage cassette.
[0166] G1.1. The method according to paragraph G1 further includes receiving a storage box according to paragraph E1 for processing in the BIB system.
[0167] G2. The method according to any one of paragraphs G1-G1.1, wherein the storage box stores a plurality of sample holders, each containing a corresponding sample.
[0168] G2.1. The method according to paragraph G2 further includes: removing another separate sample holder containing another sample from the storage cassette; loading the other separate sample holder onto the sample stage; causing the BIB source to emit another broad ion beam toward the sample, wherein the other broad ion beam removes at least a portion of the other sample from which the other broad ion beam was incident; after the corresponding sample has been processed, removing the other separate sample holder from the sample stage; and loading the other separate sample holder back into the storage cassette.
[0169] G2.2. The method according to any one of paragraphs G2-G2.1 further includes repeating the steps of the method according to paragraph G2.1 for one or more additional sample holders stored in the storage box.
[0170] G3. The method according to any one of paragraphs G2-G2.2, wherein the sample in the sample holder stored in the storage box is pre-aligned.
[0171] G3.1. The method according to paragraph G2, wherein the sample is pre-aligned in its respective sample holder using the method according to any one of paragraphs H1-H9.
[0172] G4. The method according to any one of paragraphs G1-G3.1, wherein the steps according to any one of paragraphs G1-G3.1 are at least partially performed automatically by the BIB system.
[0173] G4.1. The method according to paragraph G3.1, wherein the steps described in any one of paragraphs G1-G3.1 are performed without user input.
[0174] G5. The method according to any one of paragraphs G1-C4.1, wherein the BIB source is configured to irradiate the sample with the wide ion beam for a certain period of time.
[0175] G5.1. The method described in paragraph G5, wherein the first time period is a predetermined time period.
[0176] G5.2. The method according to any one of paragraphs G5-G5.1, wherein the time period is provided via user input.
[0177] G5.3. The method according to any one of paragraphs G5-G5.2, wherein the time period is determined by accessing sample information associated with the sample.
[0178] G5.4. The method according to any one of paragraphs G5-G5.3, wherein the first time period is determined based on the material of the portion of the sample.
[0179] G5.5. The method according to any one of paragraphs G5-C3.4, wherein the time period is determined based on information received by one or more sensors indicating that the portion of the sample has been removed.
[0180] G5.7. The method according to any one of paragraphs G5-C3.6, wherein the time period is determined based on information received by one or more sensors indicating that the region of interest has been exposed.
[0181] G5.8. The method according to any one of paragraphs G5-C3.7, wherein the time period is determined based on one or more of the following: BIB intensity, a portion of the sample to be removed by the BIB, the surface of interest, or a combination thereof.
[0182] G6. The method according to any one of paragraphs G1-G5.8, wherein the method further includes receiving sample information.
[0183] G6.1. The method according to paragraph G6, wherein the sample information is received via user input.
[0184] G6.2. The method according to paragraph G6, wherein the sample information is received by accessing a data file associated with the corresponding sample.
[0185] G6.2.1. The method according to paragraph G6.2, wherein the data file is stored on the memory component of the storage box.
[0186] G6.3. The method according to any one of paragraphs G6-G6.2, wherein the sample information includes one or more of sample composition, region of interest, and surface of interest.
[0187] G6.4. The method according to any one of paragraphs G6-G6.3, wherein the sample information includes one or more processing schedules.
[0188] G6.4.1. The method according to paragraph G6.4, wherein the method further includes determining one or more processing schedules based on the sample information.
[0189] G6.4.2. The method according to paragraph G6.4, wherein the one or more processing schedules include one or more of BIB intensity, BIB milling time, a portion of the sample removed by the BIB, a surface of interest, or a combination thereof.
[0190] H1. A method for pre-aligning samples to more efficiently process multiple samples through a wide ion beam (BIB) system, the method comprising the steps of: securing the sample to an adjustable portion of a sample holder; nesting the sample holder with a first mask having a first mask edge, wherein the first mask is positioned outside the wide ion beam (BIB) system; aligning the sample such that it has a desired geometric relationship with the first mask edge; and nesting the sample holder with a second mask having a second mask edge, wherein the second mask is positioned within the BIB system, and wherein the first mask and the second mask are geometrically similar such that the geometric relationship between the first mask edge and the sample when the sample holder is nested with the first mask is the same as the geometric relationship between the second mask edge and the sample when the sample holder is nested with the second mask.
[0191] H2. The method according to paragraph H1, wherein when the sample holder is nested with the second mask, the sample has the desired geometric relationship with the second edge without any alignment of the sample within the BIB system.
[0192] H3. The method according to any one of paragraphs H1-H2 further includes removing a portion of the sample by irradiating a portion of the second mask and a portion of the sample with a wide ion beam.
[0193] H3.1. The method according to paragraph H3.1, wherein the second mask is made of a hard material that will not be degraded by the wide ion beam.
[0194] H3.2. The method according to any one of paragraphs H3-H3.1, wherein the second mask blocks a portion of the broad ion beam such that the portion of interest of the sample is not removed from the sample.
[0195] H4. The method according to any one of paragraphs H1-H3.2, wherein the alignment corresponds to adjusting the adjustable portion of the sample holder so that the sample is positioned such that it has a desired geometric relationship with the edge of the first mask.
[0196] H5. The method according to any one of paragraphs H1-H4, wherein the first mask and the second mask are geometrically identical.
[0197] H6. The method according to any one of paragraphs H1-H5, wherein the sample is fixed to the sample and aligned within a closed environment.
[0198] H6.1. The method according to paragraph H6, wherein the closed environment has an inert gas atmosphere.
[0199] H6.2. The method according to any one of paragraphs H6-H6.1, wherein the closed environment has reduced pressure.
[0200] H6.3. The method according to any one of paragraphs H6-H6.2, wherein the closed environment has a vacuum pressure level.
[0201] H7. The method according to any one of paragraphs H1-H6.3 further includes transferring the sample holder and the aligned sample from the preparation station to the BIB system.
[0202] H7.1. The method according to paragraph H7, wherein the BIB system is a BIB system according to any one of A1-A8, D1-D2 and / or F1-F2.
[0203] H7.2. The method according to any one of paragraphs H7-H7.1, wherein the preparation station is a closed environment according to paragraphs H6-H6.3.
[0204] H7.3. The method according to any one of paragraphs H7-H7.2, wherein transferring the sample comprises loading the sample into a transfer device configured to be connected to both the sample preparation area and the BIB system.
[0205] H7.3.1. The method according to paragraph H7.3, wherein the transfer device is a sealed compartment for holding the sample holder so as to seal it off from the environment.
[0206] H7.3.1.1. According to the method described in paragraph H7.3.1, the sealed compartment contains an inert gas.
[0207] H7.3.2. The method according to any one of paragraphs H7.3-H7.3.1.1, wherein the transfer device is the storage box according to paragraph E1.
[0208] H8. The method according to any one of paragraphs H1-H7.3.2 further includes repeating the method for a plurality of samples on the corresponding sample holder.
[0209] H9. The method according to any one of paragraphs H1-H8, further comprising processing the sample using the method according to any one of paragraphs C1-C6 and / or G1-G6.4.2.
[0210] I1. Perform the method according to any one of paragraphs C1-C6, G1-G6.4.2 and / or H1-H9 using the system according to any one of paragraphs A1-A8, D1-D2, E1 and / or F1-F2.
[0211] J1. A non-transitory computer-readable medium storing instructions that, when executed on a processor, cause the processor to initiate execution of a method according to any one of paragraphs C1-C6, G1-G6.4.2 and / or H1-H9.
Claims
1. A wide ion beam (BIB) sample preparation system with improved uptime, the BIB sample preparation system comprising: A housing that defines an internal volume; A sample stage, located within the internal volume, wherein the sample stage is configured to hold the sample holder during polishing of a sample held by a sample holder; A first BIB source, configured to emit a first wide ion beam toward the sample when in use, wherein the first BIB source is located within a first source housing; and A second BIB source, configured to emit a second wide ion beam toward the sample during use, wherein the second BIB source is located within a second source housing, and wherein the second BIB source is configured to be removed when the first BIB source emits the first wide ion beam toward the sample.
2. The BIB sample preparation system of claim 1, wherein the second source is further configured to be reinstalled when the first BIB source emits the first wide ion beam toward the sample.
3. The BIB sample preparation system of claim 1, wherein the first source is configured to be removed when the second source emits the second wide ion beam toward the sample.
4. The BIB sample preparation system of claim 1, wherein the first source housing at least partially defines: A first volume, the first volume including the first BIB source; and The first hole connects the first volume to the internal volume.
5. The BIB sample preparation system of claim 4, further comprising a first valve configured to switch between: In the open state, ions emitted from the first BIB source are allowed to pass through the first pore from the first volume to the inner volume; and In a sealed state, wherein the first valve prevents ions or emitters from the sample from being transferred from the internal volume to the first volume.
6. The BIB sample preparation system according to claim 5, wherein when the first valve is in the sealed state, the first volume can be opened to the external environment without affecting the gas composition within the internal volume.
7. The BIB sample preparation system of claim 5, wherein when the first valve is in the sealed state, the first BIB source can be removed from and reinstalled from the BIB sample preparation system without affecting the pressure or gas composition within the internal volume.
8. The BIB sample preparation system of claim 5, wherein the first source housing further comprises a pump system configured to match at least one of the pressure and gas composition of the first volume with at least one of the pressure and gas composition of the internal volume.
9. A method for operating a wide ion beam (BIB) polisher with improved uptime, the method comprising: This causes the first BIB source to emit a first wide ion beam toward a sample positioned within the internal volume of the BIB polisher, wherein the first wide ion beam causes the portion of the sample in which the first wide ion beam was incident to be removed. While the first BIB source is emitting the first wide ion beam toward the sample, a second BIB source is removed from the BIB polisher, wherein the second BIB source is configured to emitting a second wide ion beam toward the sample when the second BIB source is in use.
10. The method of claim 9, further comprising reinstalling the second BIB source into the BIB polishing system.
11. The method of claim 10, wherein the second BIB source is reinstalled when the first BIB source emits the first wide ion beam toward the sample.
12. The method of claim 10, wherein the second BIB source is reinstalled when the first BIB source emits the first wide ion beam toward a different sample.
13. The method of claim 9, further comprising: This causes the second BIB source to emit the second wide ion beam toward an additional sample positioned within the internal volume of the BIB polisher, wherein the second wide ion beam causes the portion of the additional sample where the second wide ion beam was incident to be removed. as well as When the second BIB source emits the second wide ion beam toward the sample, the first BIB source is removed from the BIB polisher.
14. The method of claim 9, wherein the BIB polisher includes a source housing defining: Casing volume, and An aperture located between the housing volume and the internal volume of the BIB polisher, wherein the second BIB source is positioned within the housing volume.
15. The method of claim 14, wherein the BIB polisher further comprises a valve configured to switch between: In the open state, ions emitted from the second BIB source are allowed to pass through the pore from the housing volume to the internal volume; and In a sealed state, wherein the valve prevents ions or emitters from the sample from being transferred from the internal volume to the housing volume.
16. The method of claim 15, wherein the valve is in the sealed state, and the housing volume is open to the external environment without affecting at least one of the composition and pressure of the gas within the internal volume.
17. The method of claim 15, further comprising causing the valve to switch to the sealed state before removing the second BIB source from the BIB polisher.
18. The method of claim 17, wherein the housing volume further comprises a pump system configured to match at least one of the pressure and gas composition of the housing volume with at least one of the pressure and gas composition of the internal volume.
19. The method of claim 18, further comprising: Before removing the second BIB source from the BIB polisher, switch the valve to the sealed state; The second BIB source is reinstalled within the housing volume; The pump system is used to match at least one of the pressure and gas composition of the housing volume with at least one of the pressure and gas composition of the internal volume. and Switch the valve to the open state.
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