Drive circuit for a load and control method, device and vehicle thereof

Abstract

The present disclosure provides a driving circuit for a load and a control method, device and vehicle thereof, and relates to the technical field of electronics. The driving circuit comprises: a high-side driving circuit connected between a first power supply end and a first end of the load and connected with the load through a first node; a high-side detection circuit connected between the first node and a ground end and configured to detect a voltage at the first node to output a first voltage signal; a low-side driving circuit connected between a second end of the load and the ground end and connected with the load through a second node; a low-side detection circuit connected between the second node and the ground end and configured to detect a voltage at the second node to output a second voltage signal; and a first diode with a positive electrode connected with a second power supply end and a negative electrode connected with the first node, wherein the second power supply end provides a voltage smaller than that of the first power supply end.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and more particularly to a drive circuit for a load and a control method, apparatus and vehicle thereof. Background Technology

[0002] The load can be driven by either high-side or low-side drivers.

[0003] One type of drive circuit in related technologies includes a high-side drive circuit and a low-side drive circuit. This drive circuit combines both high-side and low-side drive methods to drive the load, which can reduce the risk of the load failing to stop due to the failure of either the high-side or low-side drive circuit, thus improving safety.

[0004] This drive circuit also includes a detection circuit for detecting the circuit status, thereby enabling fault diagnosis. Summary of the Invention

[0005] However, the energy consumption of this type of drive circuit in the related technology is relatively high.

[0006] Analysis revealed that this was due to the high energy consumption of the detection circuit under certain conditions.

[0007] In view of this, the present disclosure provides the following technical solution, which can reduce the power consumption of the drive circuit.

[0008] According to one aspect of the present disclosure, a drive circuit for a load is provided, comprising: a high-side drive circuit connected between a first power supply terminal and a first terminal of the load, and connected to the load via a first node; a high-side detection circuit connected between the first node and a ground terminal, and configured to detect the voltage at the first node to output a first voltage signal; a low-side drive circuit connected between a second terminal of the load and a ground terminal, and connected to the load via a second node; a low-side detection circuit connected between the second node and the ground terminal, and configured to detect the voltage at the second node to output a second voltage signal; and a first diode, the positive terminal of which is connected to the second power supply terminal and the negative terminal of which is connected to the first node, wherein the voltage provided by the second power supply terminal is less than the voltage provided by the first power supply terminal.

[0009] In some embodiments, the voltage supplied at the second power supply terminal is 2 volts to 6 volts.

[0010] In some embodiments, the circuit further includes a second diode, the positive terminal of which is connected to a second end of the load and the negative terminal of which is connected to a first end of the load.

[0011] In some embodiments, the high-side driving circuit is connected between a first power supply terminal and a first terminal of a plurality of loads, and is connected to the plurality of loads via a first node; the driving circuit includes: a plurality of low-side driving circuits corresponding one-to-one with the plurality of loads, each low-side driving circuit being connected between a second terminal of the corresponding load and a ground terminal, and connected to the corresponding load via a corresponding second node; and a plurality of low-side detection circuits corresponding one-to-one with the plurality of loads, each low-side detection circuit being connected between a corresponding second node and a ground terminal, and configured to detect the voltage at the corresponding second node to output a second voltage signal.

[0012] In some embodiments, the circuit further includes a pin multiplexing circuit, which includes: a first input terminal connected to a high-side detection circuit and configured to receive a first voltage signal; a plurality of second input terminals connected to a plurality of low-side detection circuits and configured to receive a plurality of second voltage signals; and a plurality of selection signal input terminals configured to receive a plurality of selection signals; wherein the pin multiplexing circuit is configured to output a conversion signal based on the first voltage signal, the plurality of second voltage signals, and the plurality of selection signals.

[0013] In some embodiments, the high-side detection circuit includes: a first resistor and a second resistor connected in series between the first node and the ground terminal; and a third resistor, one end of which is connected to the first resistor and the second resistor respectively, and the other end of which is used to output a first voltage signal.

[0014] In some embodiments, the low-side detection circuit includes: a fourth resistor and a fifth resistor connected in series between the second end of the load and the ground terminal; and a sixth resistor, one end of which is connected to the fourth resistor and the fifth resistor respectively, and the other end of which is used to output a second voltage signal.

[0015] In some embodiments, the low-side driving circuit includes: an input terminal configured to receive a control signal from the low-side driving circuit; a first transistor with its first electrode grounded; a seventh resistor connected between the input terminal and the second electrode of the first transistor; an eighth resistor connected between a third power supply terminal and the third electrode of the first transistor; a ninth resistor with one end connected to the input terminal and the other end connected to the third power supply terminal; and a second transistor with its first electrode grounded, its second electrode connected to the third electrode of the first transistor, and its third electrode connected to the second terminal of a load.

[0016] According to another aspect of the present disclosure, a control method for a drive circuit for a load as described in any of the above embodiments is provided, comprising: determining the state of the load based on a first voltage signal and a second voltage signal; and controlling at least one of the high-side drive circuit and the low-side drive circuit to disconnect when the load is in an abnormal state.

[0017] In some embodiments, the high-side driving circuit is a high-side power switch chip, which is configured to output a current signal positively correlated with the load current via a current detection output pin. The current detection output pin is connected to a tenth resistor to convert the current signal into a third voltage signal. Determining the state of the load based on the first voltage signal and the second voltage signal includes determining the state of the load based on the first voltage signal, the second voltage signal, and the third voltage signal.

[0018] According to another aspect of the present disclosure, a control device for a drive circuit for a load as described in any of the above embodiments is provided, comprising: a module configured as the control method described in any of the above embodiments.

[0019] According to another aspect of the present disclosure, a control device for a drive circuit for a load as described in any of the above embodiments is provided, comprising: a memory; and a processor coupled to the memory, configured to execute the control method as described in any of the above embodiments based on instructions stored in the memory.

[0020] According to another aspect of the present disclosure, a drive system for a load is provided, comprising: a drive circuit for a load as described in any of the above embodiments; and a control device as described in any of the above embodiments.

[0021] According to another aspect of the present disclosure, a vehicle is provided, including: a drive system for load as described in any of the above embodiments.

[0022] This disclosure provides a drive circuit for a load in which a high-side detection circuit detects the voltage at a first node between the high-side drive circuit and the load to output a first voltage signal, and a low-side detection circuit detects the voltage at a second node between the load and the low-side drive circuit to output a second voltage signal. The first node is connected to a second power supply terminal whose provided voltage is lower than the voltage provided by a first power supply terminal. In this manner, when the high-side drive circuit is disconnected, the high-side detection circuit and the low-side detection circuit can perform detection based on the smaller voltage provided by the second power supply terminal, rather than based on the larger voltage provided by the first power supply terminal. This can reduce the energy consumption of the high-side detection circuit and the low-side detection circuit when performing detection when the high-side drive circuit is disconnected, thereby reducing the energy consumption of the drive circuit.

[0023] Other features, aspects, and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings form part of this specification, illustrating exemplary embodiments of the present disclosure, and together with the specification serve to explain the principles of the present disclosure.

[0025] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, in which:

[0026] Figure 1 This is a schematic diagram of the structure of a drive circuit for a load according to some embodiments of the present disclosure;

[0027] Figure 2 This is a schematic diagram of the structure of a drive circuit for a load according to other embodiments of this disclosure;

[0028] Figure 3 This is a schematic diagram of the structure of a drive circuit for a load according to some embodiments of the present disclosure;

[0029] Figure 4 This is a schematic flowchart of a control method for a drive circuit for a load according to some embodiments of the present disclosure;

[0030] Figure 5 This is a schematic diagram of the structure of a control device for a drive circuit for a load according to some embodiments of the present disclosure;

[0031] Figure 6 This is a schematic diagram of the structure of a control device for a drive circuit for a load according to other embodiments of the present disclosure.

[0032] It should be understood that the dimensions of the various parts shown in the accompanying drawings are not necessarily drawn to actual scale. Furthermore, the same or similar reference numerals denote the same or similar components. Detailed Implementation

[0033] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are in no way intended to limit the present disclosure or its application or use. The present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that the present disclosure will be thorough and complete, and will fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless specifically stated otherwise, the relative arrangement of components and steps, the composition of materials, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0034] The terms "first," "second," and similar words used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as "including" or "containing" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well. Terms such as "above" and "below" are used only to indicate relative positional relationships, and these relative positional relationships may also change accordingly when the absolute position of the described object changes.

[0035] In this disclosure, when a specific component is described as being located between a first component and a second component, an intermediary component may or may not be present between the specific component and the first or second component. When a specific component is described as connecting to other components, the specific component may be directly connected to the other components without having an intermediary component, or it may not be directly connected to the other components but may have an intermediary component.

[0036] All terms used in this disclosure (including technical or scientific terms) have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary, such as a dictionary, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.

[0037] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0038] Figure 1 This is a schematic diagram of the structure of a drive circuit for a load according to some embodiments of the present disclosure.

[0039] like Figure 1 As shown, the drive circuit 100 for the load 200 includes a high-side drive circuit 110, a high-side detection circuit 120, a low-side drive circuit 130, and a low-side detection circuit 140.

[0040] Load 200 can be, but is not limited to, resistive, inductive, and capacitive loads. For example, load 200 can be electronic components in vehicles, especially new energy vehicles.

[0041] The high-side drive circuit 110 is connected between the first power supply terminal VDD1 and the first terminal of the load 200, and the high-side drive circuit 110 is connected to the load 200 via the first node M1.

[0042] The high-side drive circuit 110 can be configured to be on or off. When the high-side drive circuit 110 is on, the load 200 is connected to the first power supply terminal VDD1. When the high-side drive circuit 110 is off, the load 200 is disconnected from the first power supply terminal VDD1.

[0043] A high-side detection circuit 120 is connected between the first node M1 and the ground terminal GND, and the high-side detection circuit 120 is configured to detect the voltage at the first node M1 to output a first voltage signal V1. The first voltage signal V1 may, for example, be positively correlated with the voltage at the first node M1.

[0044] The low-side drive circuit 130 is connected between the second terminal of the load 200 and the ground terminal GND, and the low-side drive circuit 130 is connected to the load 200 via the second node M2.

[0045] The low-side drive circuit 130 can be configured to be on or off. When the low-side drive circuit 130 is on, the load 200 is connected to ground (GND). When the low-side drive circuit 130 is off, the load 200 is disconnected from ground (GND).

[0046] The low-side detection circuit 140 is connected between the second node M2 ​​and the ground terminal GND, and is configured to detect the voltage at the second node M2 ​​to output a second voltage signal V2. The second voltage signal V2 may, for example, be positively correlated with the voltage at the second node M2.

[0047] like Figure 1 As shown, the driving circuit 100 also includes a first diode D1. The anode of the first diode D1 is connected to the second power supply terminal VDD2, and the cathode of the first diode D1 is connected to the first node M1.

[0048] For some implementation methods, see Figure 1 The negative terminal of the first diode D1 is connected to the first node M1 via resistor R11.

[0049] Here, the voltage provided by the second power supply terminal VDD2 is less than the voltage provided by the first power supply terminal VDD1.

[0050] Taking load 200 as an electronic component in a new energy vehicle as an example, the voltage provided by the first power supply terminal VDD1 can be equal to the voltage provided by the vehicle's power supply (e.g., 12V or 24V). In this case, the voltage provided by the second power supply terminal VDD2 is less than the voltage provided by the vehicle's power supply.

[0051] In other words, the high-side detection circuit 120 is not connected to the vehicle power supply, but to the second power supply terminal VDD2, which provides a voltage lower than that provided by the vehicle power supply.

[0052] It is understandable that, ignoring losses caused by factors such as circuit transmission, when the high-side drive circuit 110 is on, the voltage at the first node M1 is equal to the voltage provided by the first power supply terminal VDD1. When the high-side drive circuit 110 is off, the voltage at the first node M1 is equal to the voltage provided by the second power supply terminal VDD2 minus the voltage division of the components (e.g., the first diode D1 and resistor R11) between the second power supply terminal VDD2 and the first node M1.

[0053] Since the voltage provided by the second power supply terminal VDD2 is less than the voltage provided by the first power supply terminal VDD1, the voltage at the first node M1 when the high-side drive circuit 110 is turned off is less than the voltage at the first node M1 when the high-side drive circuit 110 is turned on. In this case, the energy consumption of the high-side detection circuit 120 and the low-side detection circuit 140 when the high-side drive circuit 110 is turned off is relatively small.

[0054] In the driving circuit 100 of the above embodiment, the high-side detection circuit 120 detects the voltage at the first node M1 between the high-side driving circuit 110 and the load 200 to output a first voltage signal V1, and the low-side detection circuit 140 detects the voltage at the second node M2 ​​between the load 200 and the low-side driving circuit 130 to output a second voltage signal V2. The first node M1 is connected to a second power supply terminal VDD2, whose voltage is lower than that provided by the first power supply terminal VDD1. In this way, when the high-side driving circuit 110 is disconnected, the high-side detection circuit 120 and the low-side detection circuit 140 can perform detection based on the smaller voltage provided by the second power supply terminal VDD2, instead of based on the larger voltage provided by the first power supply terminal VDD1. This can reduce the energy consumption of the high-side detection circuit 120 and the low-side detection circuit 140 when performing detection when the high-side driving circuit 110 is disconnected, thereby reducing the energy consumption of the driving circuit 100.

[0055] In addition, a first diode D1 is placed between the first node M1 and the second power supply terminal VDD2. This prevents other components in the circuit from malfunctioning due to the large voltage provided by the first power supply terminal VDD1 being transferred to the second power supply terminal VDD2 when the high-side drive circuit 110 is turned on.

[0056] The following description, in conjunction with some embodiments, further illustrates the point. Figure 1 The driving circuit 100 shown.

[0057] In some embodiments, the voltage supplied by the second power supply terminal VDD2 is 2 volts (V) to 6V, for example, 3.3V, 4.5V or 5V.

[0058] With the voltage supplied at the second power supply terminal VDD2 being only 2V to 6V, the energy consumption of the high-side detection circuit 120 and the low-side detection circuit 140 when the high-side drive circuit 110 is disconnected can be further reduced. This further reduces the energy consumption of the drive circuit 100.

[0059] In some embodiments, see Figure 1 The driving circuit 100 also includes a second diode D2. The positive terminal of the second diode D2 is connected to the second terminal of the load 200, and the negative terminal of the second diode D2 is connected to the first terminal of the load 200.

[0060] When load 200 is an inductive load, the energy stored in load 200 when the high-side drive circuit 110 and the low-side drive circuit 130 are disconnected may be released instantaneously, thereby breaking down the transistors in the high-side drive circuit 110 and / or the low-side drive circuit 130.

[0061] By incorporating a second diode D2, the likelihood of transistor breakdown in the high-side drive circuit 110 and / or the low-side drive circuit 130 can be reduced. This improves the reliability of the high-side drive circuit 110 and / or the low-side drive circuit 130, thereby enhancing the reliability of the drive circuit 100.

[0062] The following is combined Figure 2 The driving circuit 100 of some embodiments of this disclosure is further described. Figure 2 This is a schematic diagram of the structure of a drive circuit for a load according to other embodiments of this disclosure.

[0063] In some embodiments, such as Figure 2 As shown, the high-side detection circuit 120 includes a first resistor R1, a second resistor R2, and a third resistor R3.

[0064] The first resistor R1 and the second resistor R2 are connected in series between the first node M1 and the ground terminal GND. One end of the third resistor R3 is connected to the first resistor R1 and the second resistor R2 respectively, and the other end of the third resistor R3 is used to output the first voltage signal V1.

[0065] In this method, the high-side detection circuit 120 outputs the first voltage signal V1 through the third resistor R3, which acts as a current limiter, instead of directly outputting the first voltage signal V1 to the outside. This improves the reliability of the circuit receiving the first voltage signal V1.

[0066] In other embodiments, such as Figure 2 As shown, the low-side detection circuit 140 includes a fourth resistor R4, a fifth resistor R5, and a sixth resistor R6.

[0067] The fourth resistor R4 and the fifth resistor R5 are connected in series between the second terminal of the load 200 and the ground terminal GND. One end of the sixth resistor R6 is connected to both the fourth resistor R4 and the fifth resistor R5, and the other end of the sixth resistor R6 is used to output the second voltage signal V2.

[0068] In this method, the low-side detection circuit 140 outputs the second voltage signal V2 through the sixth resistor R6, which acts as a current limiter, instead of directly outputting the second voltage signal V2 to the outside. This improves the reliability of the circuit receiving the second voltage signal V2.

[0069] In some other embodiments, the high-side detection circuit 120 includes the first resistor R1, the second resistor R2 and the third resistor R3, and the low-side detection circuit 140 includes the fourth resistor R4, the fifth resistor R5 and the sixth resistor R6.

[0070] This can further improve the reliability of the circuit that receives the first voltage signal V1 and the second voltage signal V2.

[0071] In some embodiments, such as Figure 2 As shown, the low-side drive circuit 130 includes an input terminal 131, which is configured to receive a control signal from the low-side drive circuit 130. The control signal is used to control the low-side drive circuit 130 to be turned on or off.

[0072] For example, see Figure 2 Input terminal 131 can be connected to the control device of drive circuit 100. Figure 2 The Delay pin (not shown) is connected to receive control signals from the low-side drive circuit 130.

[0073] The low-side drive circuit 130 also includes, for example, Figure 2 The first transistor Q1, the second transistor Q2, the seventh resistor R7, the eighth resistor R8, and the ninth resistor R9 are shown.

[0074] The first electrode of the first transistor Q1 is grounded, and the first electrode of the second transistor Q2 is also grounded.

[0075] The seventh resistor R7 is connected between the input terminal 131 and the second electrode of the first transistor Q1, and the eighth resistor R8 is connected between the third power supply terminal VDD3 and the third electrode of the first transistor Q1. The third power supply terminal VDD3 can be configured to provide a power supply voltage to the third electrode of the first transistor Q1.

[0076] One end of the ninth resistor R9 is connected to the input terminal 131, and the other end of the ninth resistor R9 is connected to the third power supply terminal VDD3.

[0077] The second electrode of the second transistor Q2 is connected to the third electrode of the first transistor Q1, and the third electrode of the second transistor Q2 is connected to the second terminal of the load 200.

[0078] The first transistor Q1 can be, for example, a bipolar transistor. In this case, the first electrode of the first transistor Q1 is the emitter of the bipolar transistor, the second electrode of the first transistor Q1 is the base of the bipolar transistor, and the third electrode of the first transistor Q1 is the collector of the bipolar transistor.

[0079] The second transistor Q2 can be, for example, a field-effect transistor (FET). In this case, the first electrode of the second transistor Q2 can be the source of the FET, the second electrode of the second transistor Q2 can be the gate of the FET, and the third electrode of the second transistor Q2 can be the drain of the FET.

[0080] In the above embodiment, the control signal of the low-side drive circuit 130 is transmitted to the second transistor Q2 via the first transistor Q1, instead of being transmitted directly to the second transistor Q2. This reduces the possibility of the second transistor Q2 being erroneously turned on by an unstable control signal, thereby improving the stability of the load 200.

[0081] In some embodiments, the drive circuit 100 further includes, for example, Figure 2 At least one of the first capacitor C1, the second capacitor C2, the third capacitor C3, and the fourth capacitor C4 shown for filtering.

[0082] One end of the first capacitor C1 is connected to the output terminal of the high-side drive circuit 110, and the other end of the first capacitor C1 is grounded.

[0083] One end of the second capacitor C2 is connected to one end of the first voltage signal V1 output through the third resistor R3, and the other end of the second capacitor C2 is grounded.

[0084] One end of the third capacitor C3 is connected to the third electrode of the second transistor Q2, and the other end of the third capacitor C3 is grounded.

[0085] One end of the fourth capacitor C4 is connected to one end of the output of the second voltage signal V2 through the sixth resistor R6, and the other end of the fourth capacitor C4 is grounded.

[0086] In some embodiments, see Figure 2 The high-side detection circuit 120 also includes a third diode D3. The third diode D3 can be a Zener diode. The anode of the third diode D3 is grounded, and the cathode of the third diode D3 is connected to one end of the first voltage signal V1 output through the fourth resistor R4. This improves the reliability of the circuit receiving the first voltage signal V1.

[0087] The inventors also noted that in some cases, there is no need for different loads to work simultaneously.

[0088] Taking a truck load as an example, since the cab lifting component used to raise and lower the cab is used when the truck is not being driven, while the brake lights are used when the truck is being driven, there is no need for the cab lifting component and the brake lights to operate simultaneously. If the circuits of the above embodiment are used to drive the cab lifting component and the brake lights separately, the circuit structure becomes complex.

[0089] In view of this, the present disclosure also provides the following embodiments, which can simplify the circuit structure.

[0090] Figure 3 This is a schematic diagram of the structure of a drive circuit for a load according to some embodiments of the present disclosure.

[0091] In such Figure 3 In the driving circuit 100 shown, the high-side driving circuit 110 is connected to the first power supply terminal VDD1 and multiple loads 200. Figure 3 The diagram schematically shows two first ends connected to a plurality of loads 200 via a first node M1. The plurality of loads 200 do not require simultaneous operation from each other.

[0092] In this case, the drive circuit 100 includes a plurality of low-side drive circuits 130 corresponding to a plurality of loads 200 and a plurality of low-side detection circuits 140 corresponding to a plurality of loads 200.

[0093] Here, each low-side drive circuit 130 is connected between the second terminal of the corresponding load 200 and the ground terminal GND, and is connected to the corresponding load 200 via the corresponding second node M2.

[0094] Each low-side detection circuit 140 is connected between the corresponding second node M2 ​​and the ground terminal GND, and is configured to detect the voltage at the corresponding second node M2 ​​to output a second voltage signal V2.

[0095] In the driving circuit 100 of the above embodiment, different loads 200 can be driven by using corresponding low-side driving circuits 130 and 140, and by using the same high-side driving circuit 110 and high-side detection circuit 120. In this way, for driving the same number of multiple loads 200, the number of required high-side driving circuits 110 and high-side detection circuits 120 can be reduced, thereby simplifying the circuit structure.

[0096] In some embodiments, see Figure 3 The driving circuit 100 also includes a pin multiplexing circuit 150.

[0097] The pin multiplexing circuit 150 includes a first input terminal connected to the high-side detection circuit 120, the first input terminal being configured to receive a first voltage signal V1.

[0098] The pin multiplexing circuit 150 also includes a plurality of second input terminals connected to a plurality of low-side detection circuits, each second input terminal being configured to receive a corresponding second voltage signal V2 among a plurality of second voltage signals V2.

[0099] The pin multiplexing circuit 150 also includes multiple selection signal inputs configured to receive multiple selection signals S. These multiple selection signals S can be controlled, for example, by the control device of the drive circuit 100. Figure 3 (Not shown in the image) is provided.

[0100] The pin multiplexing circuit 150 is configured to output a conversion signal ADC based on a first voltage signal V1, a plurality of second voltage signals V2, and a plurality of selection signals S. The conversion signal ADC may be, for example, a digital signal.

[0101] It is understandable that if any one of the first voltage signal V1, multiple second voltage signals V2, and multiple selection signals S is different, the conversion signal ADC will be different.

[0102] Multiple selection signals S can correspond one-to-one with multiple second voltage signals V2. When one of the multiple selection signals S is high and the other selection signals S are low, the pin multiplexing circuit 150 can output the corresponding conversion signal ADC according to the first voltage signal V1 and the second voltage signal V2 corresponding to the selection signal S.

[0103] For example, the pin multiplexing circuit 150 can be connected to the control device of the drive circuit 100 to provide the conversion signal ADC to the control device, thereby enabling the control device to perform fault diagnosis based on the conversion signal ADC reflecting the state of the first voltage signal V1 and a plurality of second voltage signals V2. In the case where the first voltage signal V1 and the plurality of second voltage signals V2 are directly provided to the control device of the drive circuit 100, the control device needs to have multiple pins to receive these signals.

[0104] In the above embodiment, by providing a pin multiplexing circuit 150 in the drive circuit 100, and supplying a conversion signal ADC corresponding to the first voltage signal V1, multiple second voltage signals V2, and multiple selection signals S to the drive circuit 100 via the pin multiplexing circuit 150, the control device only needs one pin to receive the conversion signal ADC that reflects the first voltage signal V1 and the multiple second voltage signals V2. This reduces the number of pins in the control device of the drive circuit 100. Furthermore, this simplifies the operation of connecting the drive circuit 100 to the control device.

[0105] Figure 4 This is a schematic flowchart of a control method for a drive circuit for a load according to some embodiments of the present disclosure.

[0106] like Figure 4 As shown, the control method for the drive circuit includes steps 402 to 404. The drive circuit can be any of the drive circuits 100 described in the above embodiments.

[0107] In step 402, the state of the load 200 is determined based on the first voltage signal V1 and the second voltage signal V2.

[0108] It can be understood that when the driving circuit 100 includes a plurality of low-side detection circuits 140 corresponding to a plurality of loads 200, the load 200 here is any one of the plurality of loads 200, and the second voltage signal V2 is the second voltage signal V2 output by the plurality of low-side detection circuits 140 corresponding to the load 200.

[0109] The first voltage signal V1 and the second voltage signal V2 can be received from the drive circuit 100 in real time, so as to determine the current state of the load 200 in real time based on the first voltage signal V1 and the second voltage signal V2.

[0110] In step 404, if the load 200 is in an abnormal state, at least one of the high-side drive circuit 110 and the low-side drive circuit 130 is disconnected.

[0111] It is understandable that if neither the drive circuit 100 nor the load 200 is faulty, the load 200 is in a normal state; if either the drive circuit 100 or the load 200 is faulty, the load 200 is in an abnormal state.

[0112] Load 200 can be in any of a variety of abnormal states, and the causes of different abnormal states can be different.

[0113] For example, multiple abnormal states can include six abnormal states each caused by one of the following six reasons: load open circuit, load short circuit, load to power supply short circuit, load to ground short circuit, low-side output side to ground short circuit, and low-side output side to power supply short circuit.

[0114] Of these six causes, load open circuit and load short circuit are caused by a fault in load 200; and load short circuit to power supply, load short circuit to ground, low-side output short circuit to ground, and low-side output short circuit to power supply are caused by a fault in drive circuit 100.

[0115] For example, a load-to-power supply short circuit may be caused by a transistor in the high-side drive circuit 110 being broken down and constantly conducting. As another example, a load-to-ground short circuit may be caused by a transistor in the low-side drive circuit 130 being broken down and constantly conducting. Furthermore, a low-side output-to-ground short circuit or a low-side output-to-power supply short circuit may be caused by a malfunction in the low-side detection circuit 140.

[0116] As one implementation method, the voltage values ​​of the first voltage signal V1 and the second voltage signal V2 when the load 200 is in different states can be pre-calculated as reference values.

[0117] Specifically, the voltage values ​​of the first voltage signal V1 and the second voltage signal V2 when the load 200 is in a normal state can be calculated as normal reference values. Furthermore, the voltage values ​​of the first voltage signal V1 and the second voltage signal V2 when the load 200 is in different abnormal states can also be calculated as abnormal reference values.

[0118] Then, the real-time received first voltage signal V1 and second voltage signal V2 can be compared with the pre-calculated reference values ​​of the first voltage signal V1 and second voltage signal V2 when the load 200 is in different states, so as to determine the current state of the load 200.

[0119] If the first voltage signal V1 and the second voltage signal V2 received in real time match the reference values ​​of the first voltage signal V1 and the second voltage signal V2 when the load 200 is in a certain state, it is determined that the load 200 is currently in this state.

[0120] In the above embodiment, the state of the load 200 is determined based on the first voltage signal V1 and the second voltage signal V2. If the load 200 is in an abnormal state, at least one of the high-side drive circuit 110 and the low-side drive circuit 130 is disconnected. Thus, fault diagnosis can be achieved based on the low-power drive circuit 100, and the high-side drive circuit 110 and / or the low-side drive circuit 130 can be disconnected promptly when the load 200 is determined to be abnormal, thereby improving safety.

[0121] In some embodiments, an alarm message is also sent when the load 200 is in an abnormal state. This reminds the user to perform maintenance as soon as possible to eliminate the abnormal state, thereby further improving security.

[0122] In some embodiments, the alarm information carries information indicating the type of abnormal state of the load 200. This helps users quickly locate faults in the circuit and improves the efficiency of troubleshooting and maintenance.

[0123] The following is combined Figure 2The driving circuit 100 shown exemplarily illustrates how the voltage values ​​of the first voltage signal V1 and the second voltage signal V2 are calculated when the load 200 is in certain states.

[0124] First, let's explain the situation where load 200 is not operating before determining its state. In this case, load 200 can be determined to be in a normal or abnormal state.

[0125] The following explanation will first cover the case where the load is 200 under normal conditions.

[0126] When load 200 is not working and is in normal condition, both the high-side drive circuit 110 and the low-side drive circuit 130 are disconnected.

[0127] The voltage value of the first voltage signal V1 is v1 = (Vdd2 - Vd1 - Vr11) × r2 / (r1 + r2), where Vdd2 is the voltage provided by the second power supply terminal VDD2, Vd1 is the voltage division of the first diode D1, Vr11 is the voltage division of the resistor R11, r1 is the resistance value of the first resistor R1, and r2 is the resistance value of the second resistor R2.

[0128] The voltage value of the second voltage signal V2 is v2 = (Vdd2 - Vd1 - Vr11) × r5 / (rL + r4 + r5), where rL is the resistance of the load 200, r4 is the resistance of the fourth resistor R4, and r5 is the resistance of the fifth resistor R5.

[0129] The voltage drop across resistor R11 is Vr11 = Ir11 × r11, where Ir11 is the current flowing through resistor R11 and r11 is the resistance of resistor R11.

[0130] When the load 200 is not working and is in normal condition, the current Ir11 flowing through the resistor R11 can be calculated based on the following formula (1):

[0131]

[0132] Based on the above formula (1), we can obtain the following formula (2):

[0133]

[0134] The following explains the situation where load 200 is in an abnormal state.

[0135] When load 200 is not operating and is in an abnormal state caused by a short circuit to ground, the high-side output is short-circuited to ground. At this time, the voltage value of the first voltage signal V1 is v1 = 0, and the voltage value of the second voltage signal V2 is v2 = 0.

[0136] When load 200 is not operating and is in an abnormal state caused by a short circuit to the power supply, the high-side output is short-circuited to the power supply. At this time, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), where Vdd1 is the voltage supplied by the first power supply terminal VDD1. The voltage value of the second voltage signal V2 is v2 = Vdd1 × r5 / (rL + r4 + r5).

[0137] When load 200 is not working and is in an abnormal state caused by load open circuit, the voltage value of the first voltage signal V1 is v1 = (Vdd2-Vd1)×r2 / (r1+r2+r11), and the voltage value of the second voltage signal V2 is v2 = 0.

[0138] When load 200 is not working and is in an abnormal state caused by a load short circuit, the voltage value of the first voltage signal V1 is v1 = (Vdd2 - Vd1 - Vr11) × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = (Vdd2 - Vd1 - Vr11) × r5 / (r4 + r5).

[0139] When load 200 is not working and is in an abnormal state caused by a load short circuit, the current Ir11 flowing through resistor R11 can be calculated based on the following formula (3):

[0140]

[0141] Based on the above formula (3), the following formula (4) can be obtained:

[0142]

[0143] When load 200 is not working and is in an abnormal state caused by a short circuit to ground on the low-side output side, the voltage value of the first voltage signal V1 is v1 = (Vdd2 - Vd1 - Vr11) × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = 0.

[0144] In this case, the current Ir11 flowing through resistor R11 can be calculated based on the following formula (5):

[0145]

[0146] Based on the above formula (5), the following formula (6) can be obtained:

[0147]

[0148] When load 200 is not working and is in an abnormal state caused by a short circuit to the power supply on the low-side output side, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2 + rL), and the voltage value of the second voltage signal V2 is v2 = Vdd1 × r5 / (r4 + r5).

[0149] This concludes the explanation of how to calculate the first voltage signal V1 and the second voltage signal V2 when the load 200 is not in operation before determining its current state.

[0150] The following describes the operation of load 200 before determining its current state. In this case, load 200 can be determined to be in a normal or abnormal state.

[0151] The following explanation will first cover the case where the load is 200 under normal conditions.

[0152] When load 200 is working and in normal condition, both the high-side drive circuit 110 and the low-side drive circuit 130 are turned on. At this time, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = Vdd1 × r5 / (rL + r4 + r5).

[0153] The following explains some situations where load 200 is in an abnormal state.

[0154] When load 200 is operating and in an abnormal state caused by a short circuit to ground, the high-side output side is short-circuited to ground. At this time, the voltage value of the first voltage signal V1 is v1 = 0, and the voltage value of the second voltage signal V2 is v2 = 0.

[0155] When load 200 is operating and in an abnormal state caused by a short circuit to the power supply, the high-side output side is short-circuited to the power supply. At this time, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = Vdd1 × r5 / (rL + r4 + r5).

[0156] When load 200 is operating and is in an abnormal state caused by load open circuit, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = 0.

[0157] When load 200 is operating and is in an abnormal state caused by a load short circuit, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = Vdd1 × r5 / (r4 + r5).

[0158] When load 200 is operating and is in an abnormal state caused by a short circuit to ground on the low-side output side, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = 0.

[0159] When load 200 is operating and is in an abnormal state caused by a short circuit to the power supply on the low-side output side, the voltage value of the first voltage signal V1 is v1 = Vdd1 × r2 / (r1 + r2), and the voltage value of the second voltage signal V2 is v2 = Vdd1 × r5 / (r4 + r5).

[0160] This concludes the explanation of how to calculate the first voltage signal V1 and the second voltage signal V2 when the load 200 is in different states before its current state is determined.

[0161] Taking Vdd1 = 24V, Vdd2 = 3.3V, Vd1 = 0.7V, r11 = 10 kΩ, r1 = 75 kΩ, r2 = 10 kΩ, rL = 1 kΩ, r4 = 100 kΩ, and r5 = 10 kΩ as examples, and combining the above calculation method, the voltage values ​​v1 and v2 under different states of load 200 can be obtained as shown in Table 1 below.

[0162] Table 1

[0163]

[0164]

[0165] As can be seen from Table 1 above, when the load 200 is not in operation, the voltage values ​​of the first voltage signal V1 and the second voltage signal V2 are different in different states. Therefore, when the load 200 is not in operation, the state of the load 200 can be accurately determined based on the first voltage signal V1 and the second voltage signal V2.

[0166] However, under operating conditions, the voltage values ​​of the first voltage signal V1 and the second voltage signal V2 of the load 200 are the same in certain states, which makes it impossible to accurately determine the state of the load 200 based on the first voltage signal V1 and the second voltage signal V2.

[0167] For example, when load 200 is in an abnormal state caused by an open circuit or an abnormal state caused by a short circuit to ground on the low-side output side, the voltage value v1 is equal to 2.82V and the voltage value v2 is equal to 0V.

[0168] For example, when load 200 is in an abnormal state caused by a short circuit to the power supply on the low-side output side or an abnormal state caused by a load short circuit, the voltage value v1 is equal to 2.82V and the voltage value v2 is equal to 2.18V.

[0169] For example, when load 200 is in a normal state or in an abnormal state caused by a short circuit to the power supply, the voltage value v1 is equal to 2.82V and the voltage value v2 is equal to 2.16V.

[0170] In view of the above, this disclosure also provides the following embodiments.

[0171] In some embodiments, the high-side driving circuit 110 is as follows: Figure 2 The high-side power switch chip shown.

[0172] The high-side power switch chip is configured to output a current signal positively correlated with the load current via the current-sensing output pin IS. In some implementations, the current signal output by the high-side power switch chip via the current-sensing output pin IS is proportional to the load current and less than the load current. For example, the current signal output via the current-sensing output pin IS is 1 / 1500 of the load current.

[0173] High-side power switch chips can also have Figure 2 Some other pins are shown below. A brief explanation of these pins follows.

[0174] The voltage source pin VS of the high-side power switch chip is configured to be connected to the first power supply terminal VDD1. The output pin OUT of the high-side power switch chip is configured to be connected to the first terminal of the load 200 via the first node M1. The ground pin GND and the unused pin NC of the high-side power switch chip are configured to be grounded.

[0175] The enable pin DEN and input pin IN of the high-side power switch chip are configured to receive signals used to control the high-side power switch chip to turn on or off.

[0176] For some implementation methods, see Figure 2 The enable pin DEN is connected to the control device of the drive circuit 100. Figure 2 The HSD_SEN pin (not shown) is connected, and the IN pin is connected to the HSD_IN pin of the control device to receive the signal provided by the control device for controlling the high-side power switch chip to turn on or off.

[0177] In this case, the drive circuit 100 may further include resistors R12 and R13. One end of resistor R12 is connected to the control device pin HSD_SEN and the enable pin DEN of the high-side power switch chip, respectively, and the other end of resistor R12 is grounded. One end of resistor R13 is connected to the control device pin HSD_IN and the input pin IN of the high-side power switch chip, respectively, and the other end of resistor R13 is grounded.

[0178] In other words, in these embodiments, the high-side drive circuit 110 is a high-side power switch chip with current detection function. The high-side power switch chip may also have other functions, such as over-temperature protection and over-voltage protection, which will not be described in detail here.

[0179] In this case, the drive circuit 100 may also include Figure 2 The tenth resistor, R10, is shown. One end of the tenth resistor R10 is connected to the current detection output pin IS, and the other end is grounded. In this case, the current signal output from the current detection output pin IS is converted into the third voltage signal V3.

[0180] For example, see Figure 2 The tenth resistor R10, one end of which is connected to the current detection output pin IS, can be connected to the control device pin HSD_IS_ADC of the drive circuit 100 to provide the control device with the third voltage signal V3.

[0181] In these embodiments, in step 302, the state of the load 200 can be determined based on the first voltage signal V1, the second voltage signal V2, and the third voltage signal V3.

[0182] The third voltage signal V3, which is the load 200 operating and in a normal state, can be used as the reference voltage.

[0183] When the resistance of the tenth resistor R10 is in kΩ, the reference voltage can be in millivolts (mV). For example, if the resistance of the tenth resistor R10 is 1kΩ, the reference voltage is 20mV.

[0184] When the load 200 is operating and is in an abnormal state caused by a short circuit to ground, the third voltage signal V3 is greater than the reference voltage, for example, equal to 5000mV.

[0185] When the load 200 is operating and is in an abnormal state caused by a short circuit between the load and the power supply, the third voltage signal V3 is greater than 0 and less than the reference voltage, for example, equal to 10mV.

[0186] When the load 200 is operating and is in an abnormal state caused by an open circuit in the load, the third voltage signal V3 is equal to 0.

[0187] When the load 200 is operating and is in an abnormal state caused by a load short circuit, the third voltage signal V3 is greater than the reference voltage, for example, equal to 5000mV.

[0188] When the load 200 is operating and is in an abnormal state caused by a short circuit to ground on the low-side output side, the third voltage signal V3 is equal to the reference voltage, for example, equal to 20mV.

[0189] When the load 200 is operating and in an abnormal state caused by a short circuit to the power supply on the low-side output side, the third voltage signal V3 is greater than 0 and less than the reference voltage, for example, equal to 10mV.

[0190] It can be seen that, based on the first voltage signal V1 and the second voltage signal V2, the third voltage signal V3 can be added to accurately distinguish different states when the load 200 is working, thereby more accurately determining the state of the load 200.

[0191] In the above embodiment, the drive circuit 100 also outputs a third voltage signal V3, enabling the control device to more accurately determine the state of the load 200 based on the first voltage signal V1, the second voltage signal V2, and the third voltage signal V3. Thus, more accurate fault diagnosis can be achieved based on the low-power drive circuit 100, thereby further improving safety.

[0192] As one implementation, a third voltage signal V3 is also provided to the pin multiplexing circuit 150. In this case, the pin multiplexing circuit 150 is configured to output a conversion signal ADC based on the first voltage signal V1, a plurality of second voltage signals V2, a plurality of selection signals S, and the third voltage signal V3. In this case, fault diagnosis can be achieved based on the conversion signal ADC reflecting the state of the first voltage signal V1, the plurality of second voltage signals V2, and the third voltage signal V3.

[0193] In this way, more accurate fault diagnosis can be achieved based on the low-power drive circuit 100, while reducing the number of pins of the control device of the drive circuit 100 and simplifying the operation of connecting the drive circuit 100 and the control device.

[0194] This disclosure also provides a control device for a drive circuit of a load.

[0195] The control device can be, for example, a microcontroller unit (MCU). A microcontroller unit can also be called a single-chip microcomputer.

[0196] The control device can be connected to the drive circuit 100 of any of the above embodiments to receive a first voltage signal V1 and a second voltage signal V2. In some embodiments, the control device can also receive a third voltage signal V3.

[0197] In some implementations, the control device can receive a conversion signal ADC that reflects the first voltage signal V1, the second voltage signal V2, and the third voltage signal V3, without directly receiving the first voltage signal V1, the second voltage signal V2, and the third voltage signal V3.

[0198] The control device can also output signals for controlling the high-side drive circuit 110 to be turned on or off, and signals for controlling the low-side drive circuit 130 to be turned on or off.

[0199] In some embodiments, the control device may include a module configured to perform the control method of any of the above embodiments.

[0200] In other embodiments, the control device may include a memory and a processor coupled to the memory. The processor is configured to execute the control method of any of the above embodiments based on instructions stored in the memory.

[0201] Figure 5 This is a schematic diagram of the structure of a control device for a drive circuit for a load according to some embodiments of the present disclosure.

[0202] like Figure 5 As shown, the control device 500 includes a determination module 501 and a control module 502.

[0203] The determination module 501 can be configured to determine the state of the load 200 based on the first voltage signal V1 and the second voltage signal V2.

[0204] The control module 502 can be configured to disconnect at least one of the high-side drive circuit 110 and the low-side drive circuit 130 when the load 200 is in an abnormal state.

[0205] Figure 6 This is a schematic diagram of the structure of a control device for a drive circuit for a load according to other embodiments of the present disclosure.

[0206] like Figure 6 As shown, the control device 600 includes a memory 601 and a processor 602 coupled to the memory 601. The processor 602 is configured to execute the control method described in any of the above embodiments based on instructions stored in the memory 601.

[0207] The memory 601 may include, for example, system memory, fixed non-volatile storage media, etc. The system memory may store, for example, an operating system, application programs, a boot loader, and other programs.

[0208] The control device 600 may also include an input / output interface 603, a network interface 604, and a storage interface 605. These interfaces 603, 604, and 605, as well as the memory 601 and processor 602, can be connected, for example, via a bus 606. The input / output interface 603 provides a connection interface for input / output devices such as displays, mice, keyboards, and touchscreens. The network interface 604 provides a connection interface for various networked devices. The storage interface 605 provides a connection interface for external storage devices such as SD cards and USB flash drives.

[0209] This disclosure also provides a drive system for a load, including a drive circuit for a load according to any of the above embodiments, and a control device for the drive circuit according to any of the above embodiments.

[0210] This disclosure also provides a vehicle including a drive system for a load according to any of the above embodiments. The vehicle may further include the load according to any of the above embodiments.

[0211] The vehicle can be, but is not limited to, automobiles, especially new energy vehicles. The load can be electronic components on the vehicle. The drive system can be, but is not limited to, the vehicle's overall controller or battery management system controller.

[0212] Using the drive system of the embodiments of this disclosure to drive the load on a vehicle can reduce energy consumption and improve energy-saving performance. Furthermore, the drive systems of some embodiments of this disclosure can achieve accurate fault diagnosis, and using these drive systems to drive the load on a vehicle can improve vehicle safety.

[0213] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0214] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A drive circuit for a load, comprising: The high-side drive circuit is connected between the first power supply terminal and the first terminals of multiple loads, and is connected to the multiple loads via the first node; A high-side detection circuit is connected between the first node and the ground terminal and is configured to detect the voltage at the first node to output a first voltage signal; Multiple low-side drive circuits are associated with multiple loads one by one. Each low-side drive circuit is connected between the second terminal of the corresponding load and the ground terminal, and is connected to the corresponding load through the corresponding second node. Multiple low-side detection circuits corresponding to multiple loads, each low-side detection circuit is connected between the corresponding second node and the ground terminal, and is configured to detect the voltage at the corresponding second node to output a second voltage signal; A first diode has its anode connected to a second power supply terminal and its cathode connected to a first node, wherein the voltage supplied by the second power supply terminal is less than the voltage supplied by the first power supply terminal; and Pin multiplexing circuitry includes: The first input terminal is connected to the high-side detection circuit and is configured to receive the first voltage signal; Multiple second input terminals are connected to multiple low-side detection circuits and configured to receive multiple second voltage signals; and Multiple selection signal input terminals are configured to receive multiple selection signals; The pin multiplexing circuit is configured to output a conversion signal based on a first voltage signal, multiple second voltage signals, and multiple selection signals.

2. The circuit according to claim 1, wherein, The voltage supplied by the second power supply terminal is 2 volts to 6 volts.

3. The circuit according to claim 1 further includes: The second diode has its positive terminal connected to the second end of the load and its negative terminal connected to the first end of the load.

4. The circuit according to any one of claims 1-3, wherein, The high-side detection circuit includes: The first resistor and the second resistor are connected in series between the first node and the ground terminal; and The third resistor has one end connected to the first resistor and the second resistor respectively, and the other end is used to output the first voltage signal.

5. The circuit according to any one of claims 1-3, wherein, The low-side detection circuit includes: The fourth and fifth resistors are connected in series between the second terminal of the load and the ground terminal; and The sixth resistor has one end connected to the fourth and fifth resistors respectively, and the other end is used to output the second voltage signal.

6. The circuit according to any one of claims 1-3, wherein, The low-side drive circuit includes: The input terminal is configured to receive control signals from the low-side drive circuit. The first transistor has its first electrode grounded. The seventh resistor is connected between the input terminal and the second electrode of the first transistor; The eighth resistor is connected between the third power supply terminal and the third electrode of the first transistor. The ninth resistor has one end connected to the input terminal and the other end connected to the third power supply terminal; and The second transistor has its first electrode grounded, and its second electrode connected to the third electrode of the first transistor, with the third electrode connected to the second terminal of the load.

7. A control method for a drive circuit for a load according to any one of claims 1-6, comprising: The state of the load is determined based on the first voltage signal and the second voltage signal; and When the load is in an abnormal state, at least one of the high-side drive circuit and the low-side drive circuit is disconnected.

8. The method according to claim 7, wherein, The high-side drive circuit is a high-side power switch chip. The high-side power switch chip is configured to output a current signal that is positively correlated with the load current through the current detection output pin. The current detection output pin is connected to the tenth resistor to convert the current signal into a third voltage signal. Determining the load state based on the first voltage signal and the second voltage signal includes: The state of the load is determined based on the first voltage signal, the second voltage signal, and the third voltage signal.

9. A control device for a drive circuit for a load according to any one of claims 1-6, comprising: A module configured to perform the control method of claim 7 or 8.

10. A control device for a drive circuit for a load according to any one of claims 1-6, comprising: Memory; as well as A processor coupled to the memory is configured to execute the control method of claim 7 or 8 based on instructions stored in the memory.

11. A drive system for a load, comprising: The drive circuit for a load according to any one of claims 1-6; and The control device according to claim 9 or 10.

12. A vehicle comprising: The drive system for a load as described in claim 11.

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