A method, device, storage medium and terminal for femtosecond laser processing of photonic crystals

Abstract

The application relates to a method and device for femtosecond laser processing of a photonic sieve, a storage medium and a terminal. The method comprises the following steps: collecting the size of a small hole of the photonic sieve; according to the size of the small hole and a preset beam spot size of processing laser, selecting whether to turn on or not to turn on modulation laser of the photonic sieve; if the modulation laser is not turned on, according to the intensity of the processing laser and a two-photon polymerization threshold of the photonic sieve, processing the photonic sieve to meet a first-level preset size; if the modulation laser is turned on, according to the modulation laser, the intensity of the processing laser and the two-photon polymerization threshold of the photonic sieve, processing the photonic sieve to meet a second-level preset size. The application can meet the demand of processing small holes with different sizes in a large-size photonic sieve, and has the characteristics of high efficiency and high precision.

Description

Technical Field

[0001] This invention relates to the field of photon sieve technology, and more specifically, to a method, apparatus, storage medium, and terminal for processing photon sieves using femtosecond lasers. Background Technology

[0002] A photon sieve is a novel diffractive optical imaging device. Its basic structure consists of a large number of small holes of different sizes distributed in a certain pattern on a planar substrate.

[0003] Currently, photolithography is the primary technology used in the fabrication of photonic sieves. However, with the continuous increase in the size of photonic sieves, femtosecond laser processing is increasingly being applied. The advantage of femtosecond laser processing for photonic sieves lies in its ability to process large-sized sieves. Its disadvantage is that the minimum aperture of femtosecond laser processing is larger than that of photolithography, limiting the lower limit of the processed size. Furthermore, because femtosecond laser processing requires machining each hole of the photonic sieve individually, it also demands high processing efficiency. Summary of the Invention

[0004] This application provides a method, apparatus, storage medium, and terminal for femtosecond laser processing of photonic sieves. To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general description, nor is it intended to identify key / important components or describe the scope of protection of these embodiments. Its sole purpose is to present some concepts in a simple form as a prelude to the detailed description that follows.

[0005] In a first aspect, embodiments of this application provide a method for processing photonic sieves using femtosecond lasers, the method comprising:

[0006] The aperture size of the photon sieve;

[0007] Based on the aperture size and the preset beam size of the processing laser, select whether to turn on or off the modulated laser of the photon sieve;

[0008] If the modulated laser is not turned on, the photonic sieve that meets the first-level preset size is processed according to the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; if the modulated laser is turned on, the photonic sieve that meets the second-level preset size is processed according to the intensity of the modulated laser, the processing laser and the two-photon aggregation threshold of the photonic sieve.

[0009] Optionally, the step of selecting whether to turn on or off the modulated laser of the photon sieve based on the aperture size and the preset beam size of the processing laser includes:

[0010] When the aperture size is not smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is not turned on;

[0011] When the aperture size is smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is turned on.

[0012] Optionally, the preset beam size of the processing laser includes: the minimum beam size for the two-photon effect of the processing laser.

[0013] Optionally, the aperture size is not smaller than the preset beam size of the processing laser, including:

[0014] The aperture size is greater than or equal to the minimum beam size for processing single-photon effects with laser; and / or

[0015] The aperture size is greater than or equal to the minimum beam size of the processing laser two-photon effect, and less than the minimum beam size of the processing laser single-photon effect.

[0016] Optionally, if the modulated laser is not activated, the photon sieve that meets the first-level preset size is processed according to the intensity of the processing laser and the two-photon aggregation threshold of the photon sieve, including:

[0017] If the modulated laser is not turned on, adjust the intensity of the processing laser;

[0018] When the intensity of the processing laser is less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the first layer is processed.

[0019] When the intensity of the processing laser is not less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the second layer is processed.

[0020] The preset dimensions of the first layer and the preset dimensions of the second layer are used as the preset dimensions of the first level.

[0021] Optionally, if the modulated laser is activated, processing the photon sieve to meet the second-level preset size according to the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photon sieve includes:

[0022] If the modulated laser is turned on, the intensity of the processing laser is adjusted;

[0023] When the intensity of the processing laser is greater than the two-photon polymerization threshold of the photonic sieve, the modulated laser causes the excited molecules in the annular region to reverse transition to a stable state, thereby processing the photonic sieve that meets the second-level preset size.

[0024] Optionally, the processing laser includes a Gaussian spot, and the modulated laser includes a ring-shaped spot.

[0025] Secondly, embodiments of this application provide an apparatus for processing photonic sieves using femtosecond lasers, the apparatus comprising:

[0026] Size acquisition module, used to acquire the aperture size of the photon sieve;

[0027] The analysis module is used to select whether to turn on or off the modulated laser of the photon sieve based on the aperture size and the preset beam size of the processing laser.

[0028] The processing module is configured to, when the modulated laser is not turned on, process the photonic sieve to meet the first-level preset size according to the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; and when the modulated laser is turned on, process the photonic sieve to meet the second-level preset size according to the intensity of the modulated laser, the processing laser and the two-photon aggregation threshold of the photonic sieve.

[0029] Thirdly, embodiments of this application provide a computer storage medium storing multiple instructions adapted for loading and execution of the above-described method steps by a processor.

[0030] Fourthly, embodiments of this application provide a terminal that may include: a processor and a memory; wherein the memory stores a computer program adapted to be loaded by the processor and executed by the above-described method steps.

[0031] The technical solutions provided in this application embodiment may include the following beneficial effects:

[0032] In this embodiment, the method for processing a photonic sieve using a femtosecond laser involves: acquiring the aperture size of the photonic sieve; selecting whether to turn on or off the modulated laser of the photonic sieve based on the aperture size and the preset beam size of the processing laser; if the modulated laser is not turned on, processing a photonic sieve that meets a first-level preset size based on the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; if the modulated laser is turned on, processing a photonic sieve that meets a second-level preset size based on the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photonic sieve. This embodiment can meet the need to process apertures of different sizes in large-size photonic sieves, and the processing has the characteristics of high efficiency and high precision.

[0033] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0035] Figure 1 This is a schematic flowchart of a method for processing photonic sieves using femtosecond lasers, provided in an embodiment of this application.

[0036] Figure 2 This is a schematic diagram illustrating the principle of a femtosecond laser processing method for photonic sieves provided in an embodiment of this application;

[0037] Figure 3 This is a schematic diagram of the two-photon polymerization effect of a femtosecond laser processing method for photonic sieves provided in an embodiment of this application;

[0038] Figure 4 This is a schematic diagram illustrating the modulated laser effect principle of a femtosecond laser processing method for photonic sieves provided in this application embodiment;

[0039] Figure 5 This is a schematic diagram of an apparatus for processing photonic sieves using a femtosecond laser, as provided in an embodiment of this application.

[0040] Figure 6 This is a schematic diagram of a terminal provided in an embodiment of this application.

[0041] Figure Labels

[0042] 1. Laser processing

[0043] 2 Modulated laser

[0044] 3 Modulated laser phase plate

[0045] 4 detectors

[0046] 5 lenses

[0047] 6 workpieces Detailed Implementation

[0048] The following description and accompanying drawings fully illustrate specific embodiments of the invention to enable those skilled in the art to practice them.

[0049] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0050] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of systems and methods consistent with some aspects of the invention as detailed in the appended claims.

[0051] In the description of this invention, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances. Furthermore, in the description of this invention, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0052] The following will be combined with the appendix Figure 1 -Appendix Figure 4 This application provides a detailed description of a method for processing photonic sieves using femtosecond lasers.

[0053] Please see Figure 1-4 This document provides a schematic flowchart of a method for processing photonic sieves using femtosecond lasers, as described in an embodiment of this application. Figure 1-4 As shown, the method in this application embodiment may include the following steps:

[0054] The femtosecond laser processing method for photonic sieves proposed in this application addresses both processing efficiency and the lower limit of processing size. It utilizes a processing laser and a modulation laser operating simultaneously. By controlling the on / off state of the modulation laser and the two-photon convergence effect of the processing laser, the spot size of the processing laser can be adjusted over a wide range. When the spot size is large, it efficiently processes large-sized holes in the photonic sieve; when the spot size is small, it exceeds the diffraction limit to process small-sized holes, achieving efficient and high-precision processing of large-sized photonic sieves. Specifically:

[0055] This application embodiment utilizes two lasers simultaneously acting on the surface of the photonic sieve to be processed: one is a processing laser, and the other is a modulation laser; wherein, the processing laser includes a Gaussian spot, and the modulation laser includes a hollow annular spot, and the two lasers have different wavelengths.

[0056] like Figure 2As shown, processing laser 1 and modulated laser 2 are simultaneously applied to workpiece 6, which represents the surface of the photonic sieve being processed. The maximum aperture diameter of the photonic sieve can be set to 215 μm, the minimum aperture diameter to 5.3 μm, the wavelength of processing laser 1 to 343 nm, and the wavelength of modulated laser 2 to 642 nm; alternatively, the maximum aperture diameter can be set to 168 μm, the minimum aperture diameter to 5.6 μm, the wavelength of processing laser 1 to 515 nm, and the wavelength of modulated laser 2 to 642 nm; furthermore, the maximum aperture diameter can be set to 290 μm, the minimum aperture diameter to 9 μm, the wavelength of processing laser 1 to 1028 nm, and the wavelength of modulated laser 2 to 642 nm.

[0057] The modulated laser 2 achieves phase control through the modulated laser phase plate 3. The detector 4 is used to detect parameters such as the energy and phase difference of the processing laser 1 and the modulated laser 2, and the lens 5 is used to focus the processing laser 1 and the modulated laser 2.

[0058] S100, the aperture size of the photon sieve.

[0059] S200: Based on the aperture size and the preset beam size of the processing laser, select whether to turn on or off the modulated laser of the photon sieve. Step S200 includes:

[0060] When the aperture size is not smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is not turned on; wherein, the aperture size not smaller than the preset beam size of the processing laser includes:

[0061] The aperture size is greater than or equal to the minimum beam size for processing single-photon effects with laser; and / or

[0062] The aperture size is greater than or equal to the minimum beam size of the processing laser two-photon effect, and less than the minimum beam size of the processing laser single-photon effect.

[0063] For example, if the minimum beam size of the processing laser single-photon effect is 15μm and the minimum beam size of the processing laser two-photon effect is 10μm, the modulated laser is not turned on when the aperture size of the processed photon sieve is greater than or equal to 15μm, and the modulated laser is still not turned on when the aperture size of the processed photon sieve is greater than or equal to 10μm and less than 15μm.

[0064] If the minimum beam size of the processing laser single-photon effect is 20μm and the minimum beam size of the processing laser two-photon effect is 14μm, the modulated laser is not turned on when the aperture size of the processed photon sieve is greater than or equal to 20μm, and the modulated laser is still not turned on when the aperture size of the processed photon sieve is greater than or equal to 14μm and less than 20μm.

[0065] If the minimum beam size of the processing laser single-photon effect is 30μm and the minimum beam size of the processing laser two-photon effect is 21μm, the modulated laser is not turned on when the aperture size of the processed photon sieve is greater than or equal to 30μm, and the modulated laser is still not turned on when the aperture size of the processed photon sieve is greater than or equal to 21μm and less than 30μm.

[0066] When the aperture size is smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is turned on.

[0067] The preset beam size of the processing laser includes: the minimum beam size for the two-photon effect of the processing laser.

[0068] For example, when the minimum beam size of the laser two-photon effect is 10 μm, if the aperture size of the photon sieve being processed is less than 10 μm, the modulated laser of the photon sieve is turned on; when the minimum beam size of the laser two-photon effect is 14 μm, if the aperture size of the photon sieve being processed is less than 14 μm, the modulated laser of the photon sieve is turned on; when the minimum beam size of the laser two-photon effect is 21 μm, if the aperture size of the photon sieve being processed is less than 21 μm, the modulated laser of the photon sieve is turned on.

[0069] In the embodiments of this application, the minimum beam size of the processed laser single-photon effect refers to the minimum beam size obtained after focusing the processed laser optical path; the minimum beam size of the processed laser two-photon effect refers to the minimum beam size that can be obtained when the processed laser exhibits a two-photon convergence effect.

[0070] S300, if the modulated laser is not turned on, the photonic sieve that meets the first-level preset size is processed according to the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; if the modulated laser is turned on, the photonic sieve that meets the second-level preset size is processed according to the intensity of the modulated laser, the processing laser and the two-photon aggregation threshold of the photonic sieve.

[0071] In step S300, if the modulated laser is not activated, then processing the photon sieve to meet the first-level preset size according to the intensity of the processing laser and the two-photon aggregation threshold of the photon sieve includes:

[0072] If the modulated laser is not turned on, adjust the intensity of the processing laser;

[0073] When the intensity of the processing laser is less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the first layer is processed.

[0074] When the intensity of the processing laser is not less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the second layer is processed.

[0075] The preset dimensions of the first layer and the preset dimensions of the second layer are used as the preset dimensions of the first level.

[0076] In this embodiment, when it is determined in S200 that the aperture size of the processing photon sieve is greater than or equal to the minimum beam size of the processing laser single-photon effect, the modulated laser is not turned on. In step S300, the processing laser works alone. The appropriate peak power of the processing laser can be determined according to the two-photon aggregation threshold of the processed material. The appropriate peak power makes the light intensity of the processing laser less than the two-photon aggregation threshold of the processed material, so that the two-photon aggregation effect does not occur during processing, thereby processing the photon sieve that meets the preset size of the first layer.

[0077] In this embodiment, when it is determined in S200 that the aperture size of the photonic sieve being processed is greater than or equal to the minimum beam size of the processing laser's two-photon effect and less than the minimum beam size of the processing laser's single-photon effect, the modulated laser is not activated. In step S300, the processing laser operates independently. A suitable peak power for the processing laser is determined based on the two-photon aggregation threshold of the material being processed. The suitable peak power ensures that the light intensity of the processing laser is not less than the two-photon aggregation threshold of the material being processed. The minimum beam size of the processing laser's single-photon effect is reduced by utilizing the two-photon aggregation effect, thereby processing the photonic sieve that meets the preset size of the second layer.

[0078] The two-photon polymerization threshold of the processed material is the same as the two-photon polymerization threshold of the photon sieve.

[0079] In step S300, if the modulated laser is turned on, then processing the photon sieve to meet the second-level preset size according to the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photon sieve includes:

[0080] If the modulated laser is turned on, the intensity of the processing laser is adjusted;

[0081] When the intensity of the processing laser is greater than the two-photon polymerization threshold of the photonic sieve, the modulated laser causes the excited molecules in the annular region to reverse transition to a stable state, thereby processing the photonic sieve that meets the second-level preset size.

[0082] In this embodiment, when the aperture size of the photon sieve to be processed in S200 is smaller than the minimum beam size of the processing laser's two-photon effect, the modulated laser is activated, and the processing laser is activated in step S300. At this time, the modulated laser and the processing laser can be activated simultaneously. The peak power of the processing laser is adjusted so that the light intensity of the processing laser is greater than the two-photon polymerization threshold of the processed material. The modulated laser causes the excited molecules in the annular region to reverse transition to a stable state, thereby suppressing the photopolymerization reaction in the annular focal spot. Under the combined effect of the two-photon polymerization effect of the processing laser and the modulated laser, the effective exposure area of ​​the processing laser (i.e., the minimum beam size of the processing laser's single-photon effect) is further reduced, achieving high-resolution processing beyond the diffraction limit.

[0083] The photon sieve that meets the first layer preset size, the photon sieve that meets the second layer preset size, and the photon sieve that meets the second level preset size are all photon sieves that have been processed and have small hole sizes that meet the pre-design requirements.

[0084] In one possible implementation, the preset size of the first layer is larger than the preset size of the second layer, and the preset size of the second layer is larger than the preset size of the second level.

[0085] In the embodiments of this application, the processed material may be polyimide, chromium film, or silver film, etc.

[0086] When the photonic sieve is a transparent polyimide photonic sieve, the two-photon polymerization threshold of the photonic sieve, which is also the two-photon polymerization threshold of the processed material, is the two-photon polymerization threshold of the polyimide; when the photonic sieve is a glass substrate with a silver-plated film, the two-photon polymerization threshold of the photonic sieve is the two-photon polymerization threshold of the silver film; when the photonic sieve is a glass substrate with a chromium-plated film, the two-photon polymerization threshold of the photonic sieve is the two-photon polymerization threshold of the chromium film.

[0087] like Figure 3 The diagram shows a comparison of the linewidths of two-photon (polymerization) exposure and single-photon exposure. If the effects of linear absorption and higher-order nonlinearities are ignored, the probability of two-photon absorption is proportional to the intensity of the excitation light. When the peak power density of the incident laser exceeds a certain value (threshold), for a Gaussian-type beam, by controlling the incident light intensity, the two-photon absorption effect can be controlled within a small region equivalent to the cube of the incident light wavelength. Therefore, compared to single-photon absorption, the two-photon absorption effect has better spatial resolution. In the embodiments of this application, the excitation light and the incident laser can be processing lasers, the incident light intensity can be the intensity of the processing laser, and the threshold can be the two-photon polymerization threshold of the processed material.

[0088] like Figure 4As shown, in a laser processing system based on the two-photon polymerization effect, one excitation beam initiates the photoreaction (corresponding to the initial focal point in the figure), while another modulated beam with a specific wavelength and a circular focal spot shape inhibits the photoreaction. When the initiator molecules of the processed material are excited to an excited state by the excitation beam, the modulated beam causes the excited molecules in the circular region to undergo a reverse transition to a stable state, thereby compressing the diffusion function of the photopolymerization point, suppressing the photopolymerization reaction within the circular focal spot, and reducing the effective exposure area (corresponding to the effective focal point in the figure). The modulated beam can be a modulated laser beam.

[0089] The method for processing a photonic sieve using a femtosecond laser involves acquiring the aperture size of the photonic sieve; selecting whether to turn on or off the modulated laser of the photonic sieve based on the aperture size and the preset beam size of the processing laser; if the modulated laser is not turned on, processing a photonic sieve that meets a first-level preset size is performed based on the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; if the modulated laser is turned on, processing a photonic sieve that meets a second-level preset size is performed based on the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photonic sieve. This embodiment of the application can meet the need to process apertures of different sizes in large-size photonic sieves, and the processing has the characteristics of high efficiency and high precision.

[0090] The following are embodiments of the apparatus of the present invention, which can be used to execute embodiments of the method of the present invention. For details not disclosed in the embodiments of the apparatus of the present invention, please refer to the embodiments of the method of the present invention.

[0091] Please see Figure 5 The diagram illustrates a femtosecond laser processing apparatus for photon sieves according to an exemplary embodiment of the present invention. The apparatus includes a size acquisition module 10, an analysis module 20, and a processing module 30.

[0092] Size acquisition module 10 is used to acquire the aperture size of the photon sieve;

[0093] Analysis module 20 is used to select whether to turn on or off the modulated laser of the photon sieve based on the aperture size and the preset beam size of the processing laser.

[0094] The processing module 30 is used to process a photonic sieve that meets a first-level preset size based on the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve when the modulation laser is not turned on; and to process a photonic sieve that meets a second-level preset size based on the intensity of the modulation laser, the processing laser, and the two-photon aggregation threshold of the photonic sieve when the modulation laser is turned on.

[0095] It should be noted that the femtosecond laser processing photonic sieve apparatus provided in the above embodiments is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the equipment can be divided into different functional modules to complete all or part of the functions described above. Furthermore, the femtosecond laser processing photonic sieve apparatus and the femtosecond laser processing photonic sieve method embodiments provided in the above embodiments belong to the same concept, and their implementation process is detailed in the method embodiments, which will not be repeated here.

[0096] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0097] The apparatus for processing photonic sieves using femtosecond lasers acquires the aperture size of the photonic sieve; based on the aperture size and the preset beam size of the processing laser, it selects whether to turn on or off the modulated laser of the photonic sieve; if the modulated laser is not turned on, the photonic sieve meeting a first-level preset size is processed based on the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; if the modulated laser is turned on, the photonic sieve meeting a second-level preset size is processed based on the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photonic sieve. This embodiment of the application can meet the need to process apertures of different sizes in large-size photonic sieves, and the processing has the characteristics of high efficiency and high precision.

[0098] The present invention also provides a computer-readable medium having program instructions stored thereon, which, when executed by a processor, implement the femtosecond laser processing photonic sieve method provided in the above-described method embodiments.

[0099] The present invention also provides a computer program product containing instructions that, when run on a computer, cause the computer to perform the femtosecond laser processing photonic sieve method described in the various method embodiments above.

[0100] Please see Figure 6 This is a schematic diagram of the structure of a terminal provided in an embodiment of this application. Figure 6 As shown, terminal 1000 may include: at least one processor 1001, at least one network interface 1004, user interface 1003, memory 1005, and at least one communication bus 1002.

[0101] The communication bus 1002 is used to realize the connection and communication between these components.

[0102] The user interface 1003 may include a display screen and a camera. Optionally, the user interface 1003 may also include a standard wired interface and a wireless interface.

[0103] The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface).

[0104] The processor 1001 may include one or more processing cores. The processor 1001 connects to various parts within the electronic device 1000 using various interfaces and lines. It executes various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 1005, and by calling data stored in the memory 1005. Optionally, the processor 1001 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 1001 may integrate one or more of the following: a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and a modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the content to be displayed on the screen; and the modem handles wireless communication. It is understood that the modem may also be implemented as a separate chip without being integrated into the processor 1001.

[0105] The memory 1005 may include random access memory (RAM) or read-only memory. Optionally, the memory 1005 may include a non-transitory computer-readable storage medium. The memory 1005 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 1005 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the above-described method embodiments, etc.; the data storage area may store data involved in the above-described method embodiments, etc. Optionally, the memory 1005 may also be at least one storage device located remotely from the aforementioned processor 1001. Figure 6 As shown, the memory 1005, which serves as a computer storage medium, may include an operating system, a network communication module, a user interface module, and a femtosecond laser processing photon sieve application program.

[0106] exist Figure 6 In the terminal 1000 shown, the user interface 1003 is mainly used to provide an input interface for the user and to obtain the user's input data; while the processor 1001 can be used to call the femtosecond laser processing photon sieve application stored in the memory 1005 and specifically perform the following operations:

[0107] The aperture size of the photon sieve;

[0108] Based on the aperture size and the preset beam size of the processing laser, select whether to turn on or off the modulated laser of the photon sieve;

[0109] If the modulated laser is not activated, the photon sieve that meets the first-level preset size is processed according to the intensity of the processing laser and the two-photon aggregation threshold of the photon sieve; if the modulated laser is activated, the photon sieve that meets the second-level preset size is processed according to the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photon sieve; the processing laser includes a Gaussian spot, and the modulated laser includes a circular spot.

[0110] In one embodiment, when the processor 1001 selects whether to turn on or off the modulated laser of the photon sieve based on the aperture size and the preset beam size of the processing laser, it specifically performs the following operations:

[0111] When the aperture size is not less than the preset beam size of the processing laser, the modulated laser of the photon screen is not turned on; the preset beam size of the processing laser includes: the minimum beam size of the processing laser for two-photon effect; the aperture size not less than the preset beam size of the processing laser specifically means: the aperture size is greater than or equal to the minimum beam size of the processing laser for single-photon effect; and / or the aperture size is greater than or equal to the minimum beam size of the processing laser for two-photon effect, and less than the minimum beam size of the processing laser for single-photon effect;

[0112] When the aperture size is smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is turned on.

[0113] In one embodiment, when the processor 1001 executes the step of processing a photosieve that meets the first-level preset size based on the intensity of the processing laser and the two-photon aggregation threshold of the photon sieve if the modulated laser is not activated, the processor 1001 specifically performs the following operations:

[0114] If the modulated laser is not turned on, adjust the intensity of the processing laser;

[0115] When the intensity of the processing laser is less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the first layer is processed.

[0116] When the intensity of the processing laser is not less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the second layer is processed.

[0117] The preset dimensions of the first layer and the preset dimensions of the second layer are used as the preset dimensions of the first level.

[0118] In one embodiment, when the processor 1001 executes the step of processing a photosieve that meets a second-level preset size based on the intensity of the modulated laser, the intensity of the processing laser, and the two-photon aggregation threshold of the photosieve, if the modulated laser is activated, the processor 1001 specifically performs the following operations:

[0119] If the modulated laser is turned on, the intensity of the processing laser is adjusted;

[0120] When the intensity of the processing laser is greater than the two-photon polymerization threshold of the photonic sieve, the modulated laser causes the excited molecules in the annular region to reverse transition to a stable state, thereby processing the photonic sieve that meets the second-level preset size.

[0121] The method and apparatus for processing photonic sieves using femtosecond lasers acquire the aperture size of the photonic sieve; based on the aperture size and a preset beam size of the processing laser, select whether to turn on or off the modulated laser of the photonic sieve; if the modulated laser is not turned on, then based on the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve, process the photonic sieve to meet a first-level preset size; if the modulated laser is turned on, then based on the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photonic sieve, process the photonic sieve to meet a second-level preset size. The embodiments of this application can meet the need to process apertures of different sizes in large-size photonic sieves, and the processing has the characteristics of high efficiency and high precision.

[0122] Those skilled in the art will understand that implementing all or part of the processes in the above embodiments can be accomplished by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory, or random access memory, etc.

[0123] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. A method for processing photonic sieves using femtosecond laser, characterized in that, Includes the following steps: The aperture size of the photon sieve; Based on the aperture size and the preset beam size of the processing laser, select whether to turn on or off the modulated laser of the photon sieve; If the modulated laser is not turned on, the photonic sieve that meets the first-level preset size is processed according to the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; if the modulated laser is turned on, the photonic sieve that meets the second-level preset size is processed according to the intensity of the modulated laser, the processing laser and the two-photon aggregation threshold of the photonic sieve.

2. The method for processing a photon sieve according to claim 1, characterized in that, The step of selecting whether to turn on or off the modulated laser of the photon sieve based on the aperture size and the preset beam size of the processing laser includes: When the aperture size is not smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is not turned on; When the aperture size is smaller than the preset beam size of the processing laser, the modulated laser of the photon sieve is turned on.

3. The method for processing a photon sieve according to claim 2, characterized in that, The preset beam size of the processing laser includes: the minimum beam size for the two-photon effect of the processing laser.

4. The method for processing a photon sieve according to claim 3, characterized in that, The aperture size is not smaller than the preset beam size of the processing laser, including: The aperture size is greater than or equal to the minimum beam size for processing single-photon effects with laser; and / or The aperture size is greater than or equal to the minimum beam size of the processing laser two-photon effect, and less than the minimum beam size of the processing laser single-photon effect.

5. The method for processing a photon sieve according to claim 1, characterized in that, If the modulated laser is not activated, the photon sieve that meets the first-level preset size is processed according to the intensity of the processing laser and the two-photon aggregation threshold of the photon sieve, including: If the modulated laser is not turned on, adjust the intensity of the processing laser; When the intensity of the processing laser is less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the first layer is processed. When the intensity of the processing laser is not less than the two-photon polymerization threshold of the photon sieve, the photon sieve that meets the preset size of the second layer is processed. The preset dimensions of the first layer and the preset dimensions of the second layer are used as the preset dimensions of the first level.

6. The method for processing a photon sieve according to claim 1, characterized in that, If the modulated laser is activated, the photon sieve meeting the second-level preset size is processed according to the intensity of the modulated laser, the processing laser, and the two-photon aggregation threshold of the photon sieve, including: If the modulated laser is turned on, the intensity of the processing laser is adjusted; When the intensity of the processing laser is greater than the two-photon polymerization threshold of the photonic sieve, the modulated laser causes the excited molecules in the annular region to reverse transition to a stable state, thereby processing the photonic sieve that meets the second-level preset size.

7. The method for processing a photon sieve according to claim 1, characterized in that, The processing laser includes a Gaussian spot, and the modulated laser includes a ring-shaped spot.

8. An apparatus for processing photonic sieves with femtosecond laser, characterized in that, include: Size acquisition module, used to acquire the aperture size of the photon sieve; The analysis module is used to select whether to turn on or off the modulated laser of the photon sieve based on the aperture size and the preset beam size of the processing laser. The processing module is configured to, when the modulated laser is not turned on, process the photonic sieve to meet the first-level preset size according to the intensity of the processing laser and the two-photon aggregation threshold of the photonic sieve; and when the modulated laser is turned on, process the photonic sieve to meet the second-level preset size according to the intensity of the modulated laser, the processing laser and the two-photon aggregation threshold of the photonic sieve.

9. A computer storage medium, characterized in that, The computer storage medium stores a plurality of instructions adapted for loading by a processor and executing the method steps as claimed in any one of claims 1-7.

10. A terminal, characterized in that, include: A processor and a memory; wherein the memory stores a computer program adapted to be loaded by the processor and executed the method steps as claimed in any one of claims 1-7.

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