A tooling and method for disassembling and assembling a semiconductor device support pin and counterweight.

Abstract

This invention provides a fixture and method for disassembling and assembling support pins and counterweights in a semiconductor device. The semiconductor device includes a tray for supporting semiconductor materials to be processed. Multiple support pins are threaded through the tray, and counterweights are connected to the bottom of the support pins. The fixture may include a support part and a lifting part connected to each other. The support part has pin holes and support grooves with shapes and sizes that match the support pins and counterweights, respectively. During disassembly and assembly, the support pins and counterweights are placed in the pin holes and support grooves, respectively. The lifting part then drives the fixture to move up and down, thereby realizing the disassembly and assembly of the support pins and counterweights.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment maintenance, and in particular to a tooling and method for disassembling and assembling support pins and counterweights for semiconductor equipment. Background Technology

[0002] In various semiconductor processing equipment, disassembly and maintenance are often required. In particular, trays used to support semiconductor materials to be processed, such as heating trays in thin film deposition equipment, need to be removed before disassembling and maintaining other components.

[0003] Currently, the disassembly method for the pallet support pin and counterweight in existing technologies is usually done by the operator using their bare hands. However, because the distance between the heating plate and the cavity is small after the heating plate is raised, the counterweight is easily dropped when the operator operates with both hands simultaneously, which can damage the surface and side walls of the cavity. It may also fall and get stuck between the heating plate and the cavity, increasing maintenance time and the risk of component damage. In addition, the operator may also have their hand caught during the operation, posing a safety hazard.

[0004] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for a tooling and method for disassembling and assembling support pins and counterweights in semiconductor equipment. This tooling is used to assist in the disassembly of support pins and counterweights on trays that carry semiconductor materials in semiconductor equipment, and to prevent the counterweights from moving left and right or falling and damaging the cavity equipment during disassembly and assembly. This tooling provides convenience for the disassembly and maintenance of semiconductor process equipment. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in the prior art, the present invention provides a disassembly and assembly fixture for a semiconductor device support pin and a counterweight. The semiconductor device includes a tray for supporting semiconductor materials to be processed, and a plurality of support pins are threaded through the tray. The bottom of each support pin is connected to a counterweight. The disassembly and assembly fixture may include a support portion and a lifting portion connected together. The support portion has pin holes and support grooves whose shapes and sizes respectively match the support pins and the counterweight. During disassembly and assembly, the support pins and the counterweight are placed in the pin holes and the support grooves respectively. The disassembly and assembly fixture is then raised and lowered by lifting the lifting portion, thereby realizing the disassembly and assembly of the support pins and the counterweight.

[0007] In one embodiment, preferably, in the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention, the supporting part is parallel to the horizontal plane, and the lifting part is connected to the supporting part at a vertical angle.

[0008] In one embodiment, preferably, in the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention, the pin hole and the supporting groove on the supporting part are positioned to cooperate with the positions of the support pin and the counterweight on the tray, so that when the lifting part moves from radially close to the edge of the tray to an appropriate position along the circumferential direction of the edge of the tray, the pin hole and the supporting groove are respectively located on the same vertical line as the support pin and the counterweight.

[0009] In one embodiment, preferably, in the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention, the inner wall of the lifting part is an arc surface that conforms to the shape of the edge of the tray.

[0010] In one embodiment, preferably, in the assembly and disassembly fixture for the semiconductor device support pin and the counterweight provided by the present invention, the lifting part is provided with a positioning groove or positioning hole, which is used to position the lifting part to the corresponding circumferential position of the support pin and the counterweight through the positioning groove or positioning hole when the lifting part moves circumferentially along the edge of the tray.

[0011] In one embodiment, preferably, the lifting part of the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention is also provided with a handle.

[0012] In one embodiment, preferably, in the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention, the pin hole is located at the bottom of the support groove.

[0013] In one embodiment, preferably, the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention is made of Teflon material.

[0014] Another aspect of the present invention provides a method for disassembling a semiconductor device support pin and a counterweight, employing a disassembly and assembly fixture as described above. The support portion is parallel to a horizontal plane, the lifting portion is connected to the support portion at a vertical angle, and the pin hole and the support groove on the support portion are positioned to mate with the support pin and the counterweight on the tray. The disassembly method may include: extending the support portion of the disassembly and assembly fixture into an appropriate position at the bottom of the tray; moving the disassembly and assembly fixture so that the pin hole and the support groove are respectively aligned with the support pin and the counterweight on the same vertical line; and vertically lifting the lifting portion so that the support pin and the counterweight fall into the pin hole and the support groove respectively, then continuing to lift the disassembly and assembly fixture to a certain position, and then rotating it from the top of the tray to disassemble the support pin, with the counterweight being removed along with the disassembly and assembly fixture.

[0015] In one embodiment, preferably, in the method for disassembling and assembling the semiconductor device support pin and the counterweight provided by the present invention, the inner wall of the lifting part of the disassembly and assembly tool is an arc surface that fits the shape of the edge of the tray, and the lifting part is provided with a positioning groove or positioning hole. Moving the disassembly and assembly tool may include: moving the disassembly and assembly tool radially so that the inner wall of the lifting part fits the edge of the tray; and moving the disassembly and assembly tool circumferentially along the edge of the tray, and positioning the disassembly and assembly tool to a circumferential position corresponding to the support pin and the counterweight through the positioning groove or positioning hole. Attached Figure Description

[0016] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0017] Figure 1 This is a cross-sectional view illustrating the structure and working principle of a tooling for assembling and disassembling semiconductor equipment support pins and counterweights, based on an example of existing technology.

[0018] Figure 2 This is a cross-sectional view illustrating the structure and working principle of a device for assembling and disassembling a semiconductor device support pin and a counterweight, according to an embodiment of the present invention.

[0019] Figure 3 This is a perspective view of a device structure for assembling and disassembling a semiconductor device support pin and a counterweight, according to an embodiment of the present invention.

[0020] Figure 4 This is an enlarged view of the inner partial structure of a fixture for assembling and disassembling a semiconductor device support pin and counterweight, according to an embodiment of the present invention; and

[0021] Figure 5 This is a schematic diagram of the outer structure of a semiconductor device support pin and counterweight assembly / disassembly fixture according to an embodiment of the present invention.

[0022] For clarity, a brief explanation of the reference numerals in the accompanying drawings is provided below:

[0023] 101 lots

[0024] 102 cavities

[0025] 103 heating plate

[0026] 104 support pin

[0027] 105 heavy hammer

[0028] 201 disassembly and assembly tooling

[0029] 202 cavity

[0030] 203 pallets

[0031] 204 support pin

[0032] 205 heavy hammer

[0033] 206 pin hole

[0034] 207 Supporting Groove

[0035] 208 Supporting Department

[0036] 209 Improvement Department

[0037] 210 positioning groove

[0038] 211 handle Detailed Implementation

[0039] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0042] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0043] Figure 1 This is a cross-sectional view illustrating the structure and working principle of a tooling for assembling and disassembling support pins and counterweights for semiconductor equipment, based on an example of existing technology.

[0044] like Figure 1 As shown, in the prior art, when disassembling and maintaining semiconductor process equipment, operators usually need to insert their hands 101 into the gap between the cavity 102 and the heating plate 103 to further lift the support pin 104 and the counterweight 105. It is easy to understand that in this process, since the operation is entirely done by the operator's bare hands, the counterweight 105 is very likely to fall and damage the surface and sidewalls of the cavity 102. It may also fall and get stuck between the heating plate 103 and the cavity 102, increasing maintenance time and the risk of component damage. In addition, the operator may also have their hands pinched during the operation, posing a safety hazard.

[0045] In order to overcome the above-mentioned defects in the prior art, the present invention provides a tooling and method for disassembling and assembling support pins and counterweights in semiconductor equipment. This tooling is used to assist in the disassembly of support pins and counterweights on trays that carry semiconductor materials in semiconductor equipment, and to prevent the counterweights from moving left and right or falling and damaging the cavity equipment during disassembly and assembly. This provides convenience for the disassembly and maintenance of semiconductor process equipment.

[0046] Figure 2 This is a cross-sectional view illustrating the structure and working principle of a device for assembling and disassembling a semiconductor device support pin and a counterweight, according to an embodiment of the present invention. Figure 3 This is a perspective view of a device structure for assembling and disassembling a semiconductor device support pin and a counterweight, according to an embodiment of the present invention.

[0047] Please refer to Figure 2 and Figure 3 The present invention provides a fixture for assembling and disassembling support pins and counterweights in a semiconductor device. The semiconductor device includes a tray 203 for supporting semiconductor materials to be processed. Multiple support pins 204 are mounted on the tray 203, and the bottom of each support pin 204 is connected to a counterweight 205. For example, in a thin film deposition apparatus, the tray 203 can be a heating plate.

[0048] like Figure 2As shown, the disassembly and assembly fixture 201 for semiconductor device support pins and counterweights provided by the present invention may include: a support portion 208 and a lifting portion 209 connected to each other. The support portion 208 is provided with pin holes 206 and support grooves 207, which are respectively shaped and sized to match the support pin 204 and the counterweight 205. During disassembly and assembly, the disassembly and assembly fixture 201 is first placed at an appropriate position between the cavity 202 and the tray 203. Subsequently, by moving the disassembly and assembly fixture 201, the support pin 204 and the counterweight 205 are respectively placed in the pin holes 206 and the support grooves 207. Then, by raising and lowering the lifting portion 209, the disassembly and assembly fixture 201 is driven to rise and fall, thereby realizing the disassembly and assembly of the support pin 204 and the counterweight 205.

[0049] In a preferred embodiment, such as Figure 2 , 3 As shown, the supporting part 208 is parallel to the horizontal plane, and the lifting part 209 is connected to the supporting part 208 at a vertical angle.

[0050] Figure 4 This is an enlarged view of the inner partial structure of the assembly and disassembly fixture for a semiconductor device support pin and counterweight, according to an embodiment of the present invention.

[0051] Please combine Figure 4 and Figure 2 , 3 In a further preferred embodiment, the pin hole 203 and the supporting groove 207 on the supporting part 208 are positioned to cooperate with the positions of the supporting pin 204 and the counterweight 205 on the tray 203, so that when the lifting part 209 moves from radially close to the edge of the tray 203 to a suitable position along the circumferential direction of the edge of the tray 203, the pin hole 206 and the supporting groove 207 are respectively located on the same vertical line as the supporting pin 204 and the counterweight 205.

[0052] Further, preferably, such as Figure 4 As shown, the inner wall of the lifting part 209 is an arc surface that fits the edge shape of the tray 203, so that after the lifting part is positioned in the radial direction, it can closely fit the tray and move axially to the required position.

[0053] exist Figure 4 As can be seen, the pin hole 206 is located at the bottom of the support groove 207. Combined with... Figure 2 , 3 During disassembly and assembly, first align the support pin 204 with the pin hole 206, then lift it upwards and the counterweight 205 falls into the support groove 207, which provides good support for the counterweight 205 and prevents it from moving left or right or falling and thus damaging the chamber.

[0054] Figure 5This is a schematic diagram of the outer structure of a semiconductor device support pin and counterweight assembly / disassembly fixture according to an embodiment of the present invention.

[0055] Can be combined Figure 4 and Figure 5 and Figure 2 , 3 In a preferred embodiment, the disassembly and assembly fixture provided by the present invention has a positioning groove 210 on the lifting part 209. The positioning groove 210 can also be in the form of a positioning hole. When the lifting part 209 moves circumferentially along the edge of the tray 203, it is positioned to the corresponding circumferential position of the support pin 204 and the counterweight 205 through the positioning groove 210 or the positioning hole.

[0056] In addition, in a preferred embodiment, the assembly and disassembly fixture for the semiconductor device support pin and counterweight provided by the present invention, such as... Figure 4 , 5 As shown, the lifting part 209 is also provided with a handle 211, which facilitates the operator to move the disassembly and assembly tool and raise and lower it.

[0057] Preferably, the disassembly and assembly tooling provided by the present invention is made of Teflon material to prevent scratches, abrasions or other damage to the cavity, tray or heating plate during the disassembly and assembly process.

[0058] Another aspect of the present invention provides a method for disassembling a semiconductor device support pin and a counterweight, employing a disassembly and assembly fixture as described above. The support portion is parallel to a horizontal plane, the lifting portion is connected to the support portion at a vertical angle, and the pin hole and the support groove on the support portion are positioned to mate with the support pin and the counterweight on the tray. The disassembly method may include: extending the support portion of the disassembly and assembly fixture into an appropriate position at the bottom of the tray; moving the disassembly and assembly fixture so that the pin hole and the support groove are respectively aligned with the support pin and the counterweight on the same vertical line; and vertically lifting the lifting portion so that the support pin and the counterweight fall into the pin hole and the support groove respectively, then continuing to lift the disassembly and assembly fixture to a certain position, and then rotating it from the top of the tray to disassemble the support pin, with the counterweight being removed along with the disassembly and assembly fixture.

[0059] Furthermore, preferably, the inner wall of the lifting part of the disassembly and assembly tool is an arc surface that fits the shape of the edge of the tray, and the lifting part is provided with a positioning groove or positioning hole. Moving the disassembly and assembly tool may include: moving the disassembly and assembly tool radially so that the inner wall of the lifting part fits against the edge of the tray; and moving the disassembly and assembly tool circumferentially along the edge of the tray, and positioning the disassembly and assembly tool to a circumferential position corresponding to the support pin and the counterweight through the positioning groove or positioning hole.

[0060] For example, in a deposition apparatus, the disassembly and assembly tooling provided by this invention can be used to disassemble and assemble the support pins and counterweights on its heating plate, which can be combined with... Figures 2-5 The operator can use handle 211 to insert the disassembly and assembly tool 201 into the cavity 202, and first radially position the inner wall of the lifting part 209 of the disassembly and assembly tool 201 with the heating plate or the tray 203 in the figure so that the two are in close contact. After ensuring that the disassembly and assembly tool 201 is concentric with the heating plate, the disassembly and assembly tool 201 is vertically moved to below the support pin 204 and the counterweight 205.

[0061] Subsequently, the disassembly and assembly fixture 201 is moved along the edge of the tray 203 to ensure that the positioning groove 210 and the support pin 204 are on the same straight line, thereby circumferentially positioning the fixture. After positioning, the fixture is moved upward. The support pin 204 first passes through the pin hole 206 of the fixture, and the counterweight 205 falls into the support groove 207, slowly moving upward with the fixture. After reaching a certain position, the support pin 204 can be rotated 90 degrees and removed. The counterweight 205 is then removed from the cavity along with the fixture, and the heating plate can then be maintained. The support groove 207 also effectively prevents the counterweight 205 from moving left and right during the movement.

[0062] The above describes the disassembly process of the support pin and the counterweight. When using the disassembly and assembly tooling provided by this invention to install the support and the counterweight, the above process can be performed in reverse order.

[0063] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0064] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fixture for disassembling and assembling support pins and a counterweight in a semiconductor device, wherein the semiconductor device includes a tray for supporting semiconductor material to be processed, a plurality of support pins are threaded through the tray, and the counterweight is connected to the bottom of each support pin; the fixture includes: The support and lifting parts are connected. The support part has pin holes and supporting grooves whose shapes and sizes are respectively matched with the support pin and the counterweight. The positions of the pin holes and supporting grooves on the support part are matched with the positions of the support pin and the counterweight on the tray. This is so that when the lifting part moves from radially close to the edge of the tray to a suitable position along the circumferential direction of the tray edge, the pin holes and supporting grooves are respectively on the same vertical line as the support pin and the counterweight. The inner sidewall of the lifting part is an arc surface that fits the shape of the tray edge and has positioning grooves or positioning holes. When the lifting part moves along the circumferential direction of the tray edge, it is positioned to the corresponding circumferential positions of the support pin and the counterweight through the positioning grooves or positioning holes. During disassembly and assembly, the support pin and the counterweight are respectively placed in the pin holes and supporting grooves. Then, by raising and lowering the lifting part, the disassembly and assembly tool is raised and lowered, thereby realizing the disassembly and assembly of the support pin and the counterweight.

2. The disassembly and assembly fixture as described in claim 1, characterized in that, The supporting part is parallel to the horizontal plane, and the lifting part is connected to the supporting part at a vertical angle.

3. The disassembly and assembly fixture as described in claim 1, characterized in that, The lifting section is also equipped with a handle.

4. The disassembly and assembly fixture as described in claim 1, characterized in that, The pin hole is located at the bottom of the support groove.

5. The disassembly and assembly fixture as described in claim 1, characterized in that, The disassembly and assembly tooling is made of Teflon material.

6. A method for disassembling a semiconductor device support pin and counterweight, comprising: The support portion of the disassembly and assembly tool as described in claim 1 is inserted into the appropriate position at the bottom of the pallet; The disassembly and assembly tool is moved radially so that the inner wall of the lifting part of the disassembly and assembly tool fits against the edge of the tray; The disassembly and assembly tool is moved circumferentially along the edge of the tray. Through the positioning groove or positioning hole of the lifting part, the disassembly and assembly tool is positioned to a circumferential position corresponding to the support pin and the counterweight, and the pin hole and the supporting groove of the disassembly and assembly tool are respectively located on the same vertical line as the support pin and the counterweight. as well as Lift the lifting part of the disassembly and assembly fixture vertically upwards, so that the support pin and the counterweight fall into the pin hole and the support groove respectively. After lifting the disassembly and assembly fixture to a certain position, rotate the top of the tray to remove the support pin and take out the counterweight together with the disassembly and assembly fixture.

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