Electroless copper plating chamber and use on multi-channel fiber filaments

Abstract

The application provides a chemical copper plating sealing chamber and application on a multi-channel fiber filament, which comprises a chemical copper plating sealing chamber, a first chemical copper plating opening is formed on a first side of the chemical copper plating sealing chamber, a second chemical copper plating opening is formed on a second side of the chemical copper plating sealing chamber, a chemical copper plating channel is formed between the first chemical copper plating opening and the second chemical copper plating opening, a first sealing device is arranged outside the chemical copper plating channel, a first sealing chamber is formed between the first sealing device and the chemical copper plating channel, a second sealing device is arranged inside the chemical copper plating sealing chamber and sleeved outside the first sealing device, a second sealing chamber is formed between the inside of the second sealing device and the first sealing device, and a third sealing chamber is formed between the outside of the second sealing device and the chemical copper plating sealing chamber. The application can form multiple sealing chambers outside the fiber filament chemical copper plating, and effectively avoids the occurrence of harmful gas overflow phenomenon such as formaldehyde.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electroless copper plating, in particular to a chemical copper plating sealing chamber and its application on multi-channel fiber filaments. BACKGROUND

[0002] By plating a layer of metal on the surface of the fiber filament, the soft fiber filament surface can have good electrical conductivity to meet the electrical conductivity requirements in a specific environment. Chemical copper plating on the surface of the fiber filament is a common technology.

[0003] Copper plating on the surface of the fiber filament is to place the fiber filament in a specific chemical reagent containing copper ions. Under the action of a reducing agent, copper ions can crystallize on the surface of the fiber filament to form a dense plating layer. Formaldehyde as a common reducing agent can meet the needs of copper plating on the surface of the fiber filament.

[0004] Since the spilled formaldehyde is toxic to the human body after being inhaled, the process of electroless copper plating is usually operated in a relatively sealed sealing chamber. A negative pressure ventilation state is installed in the sealing chamber to continuously discharge the formaldehyde-containing gas in the sealing chamber to meet the needs of continuous plating of the fiber filament. However, the internal structure of the currently used sealing chamber is relatively simple, usually only a single-stage sealing state and a single-stage negative pressure ventilation device are provided, and the negative pressure ventilation device needs to be arranged at the top to bear the overall ventilation needs of the sealing chamber. In the actual ventilation process, there is a problem of low ventilation efficiency and ventilation dead angle. The formaldehyde-containing gas flow is disordered inside, which cannot effectively form an effective sealing barrier outside the chemical tank. In the actual production process, the phenomenon of formaldehyde overflow occurs from time to time. SUMMARY

[0005] To solve the above problems, the present application provides a chemical copper plating sealing chamber and its application on multi-channel fiber filaments. The present application can form multiple layers of sealing chambers outside the fiber filament chemical copper plating, effectively avoiding the occurrence of harmful gas overflow such as formaldehyde.

[0006] To solve the above problems, the technical solution adopted by the present application is:

[0007] A chemical copper plating sealing chamber includes a chemical plating sealing chamber, a first chemical plating opening on a first side, a second chemical plating opening on a second side, and a chemical plating channel formed between the first and second chemical plating openings. A first sealing device is disposed outside the chemical plating channel, forming a first sealing chamber between the first sealing device and the chemical plating channel. A second sealing device is disposed inside the chemical plating sealing chamber, sleeved on the outside of the first sealing device, forming a second sealing chamber between the inner side of the second sealing device and the first sealing device. A third sealing chamber is formed between the outer side of the second sealing device and the chemical plating sealing chamber. A first ventilation system is disposed on both sides of the first sealing device, and a second ventilation system is disposed on the top of the chemical plating sealing chamber.

[0008] Preferably, a chemical plating tank is provided in the middle of the first sealing device, and sealing partitions are provided on both sides of the chemical plating tank. An airtight buffer zone is formed on the outer side of the sealing partitions, and the first ventilation system is located in the airtight buffer zone to form an airtight barrier.

[0009] Preferably, the first ventilation system includes an air supply rod and a negative pressure extraction hood. The surface of the air supply rod has an air supply opening arranged along the length direction. The air supply rod is located on the lower outer side of the negative pressure extraction hood, and the air supply opening faces the negative pressure extraction hood.

[0010] Preferably, the first sealing device includes a plurality of sealing cover plates arranged in parallel, the sealing cover plates being positioned opposite to the plating tank and being movably connected to one side of the tank, a sealing lip being provided between two adjacent sealing cover plates, a pumping pipe being provided inside the plating tank, the pumping pipe extending along the length of the plating tank, and the horizontal coverage area of ​​the plurality of sealing cover plates being larger than the horizontal projection size of the pumping pipe.

[0011] Preferably, the second sealing device includes a sealing mounting frame, the side wall of which has an observation opening, and a sealing slide plate is slidably disposed outside the observation opening.

[0012] Preferably, the second ventilation system includes a first ventilation duct and a second ventilation duct located at the top. The first ventilation duct is positioned opposite the third sealed chamber, and the second ventilation duct is positioned opposite the second sealed chamber. After the observation opening is opened, the first ventilation duct is controlled to be in a supply air state, allowing airflow to pass through the observation opening and enter the second sealed chamber.

[0013] Preferably, the first ventilation duct is externally connected to an air supply duct and an exhaust duct, and an internal control device is connected to the first ventilation duct for switching the conduction state. The control device is located on the moving path of the sealed sliding plate.

[0014] Preferably, the control device includes a control valve and a position control component. The position control component is located on the moving path of the sealing slide plate. The position control component includes a position control plate. The bottom end of the position control plate is fixedly connected to the position control rod of the control valve. An arc-shaped transition slope is opened on the outer side of the bottom end of the position control plate, and a first locking block is provided on the outer side. A second locking block that matches the first locking block is provided on the upper end of the sealing slide plate.

[0015] Preferably, the inner wall of the third sealing chamber is provided with a support partition that is fixedly connected to the electroplating sealing chamber, and a sealing door is rotatably provided on the outer side of the electroplating sealing chamber.

[0016] An application of a chemical copper plating sealing chamber on multi-channel fiber filaments: using the aforementioned chemical copper plating sealing chamber, formaldehyde is used as a reducing agent to sequentially pass multiple fiber filaments through a first chemical plating opening and a second chemical plating opening, allowing the multiple fiber filaments to be chemically plating copper within the chemical plating channel.

[0017] The beneficial effects of this invention are as follows:

[0018] By setting up a chemical plating sealed chamber, a first sealing device, and a second sealing device, a three-level sealed chamber can be formed within the chemical plating sealed chamber. By setting up a first ventilation system and a second ventilation system, a two-level ventilation system can be formed within the chemical plating sealed chamber. This effectively concentrates and seals the formaldehyde gas generated during the chemical copper plating process, while simultaneously extracting the formaldehyde gas in a gradient manner, effectively reducing the probability of formaldehyde escaping from the chemical plating sealed chamber. This fundamentally improves the working environment for workers and ensures their health. In particular, during maintenance, the first ventilation duct can be switched from a supply state to allow airflow from the third sealed chamber to the second sealed chamber, ultimately being extracted and discharged by the second ventilation duct. This effectively ensures the safety of workers in the third sealed chamber and allows for maintenance operations to be performed simultaneously with chemical copper plating, meeting the requirements for continuous copper plating of multi-channel fiber filaments. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0021] Figure 3 For the present invention Figure 2 Front view structural diagram;

[0022] Figure 4 For the present invention Figure 3 A schematic diagram of the AA-line cross-sectional structure;

[0023] Figure 5 For the present invention Figure 3A magnified structural diagram at point B;

[0024] Figure 6 This is a three-dimensional structural diagram of the first sealing device of the present invention;

[0025] Figure 7 For the present invention Figure 6 A top-view structural diagram;

[0026] Figure 8 For the present invention Figure 6 A schematic diagram of the side view structure;

[0027] Figure 9 For the present invention Figure 7 A magnified structural diagram at point C.

[0028] In the diagram: 100, electroplating sealing chamber; 110, first electroplating opening; 120, second electroplating opening; 130, supporting partition; 140, sealing door; 200, first sealing device; 210, electroplating tank; 211, sealing partition; 220, airtight buffer zone; 230, sealing cover; 240, pumping pipeline; 300, second sealing device; 310, sealing mounting frame; 320, observation opening; 330, sealing slide plate; 400, second ventilation system. 410. First ventilation duct; 420. Second ventilation duct; 500. Fiber filament; 600. First ventilation system; 610. Air supply rod; 611. Air supply opening; 620. Negative pressure extraction hood; 700. Control device; 710. Control valve; 711. Position control rod; 712. Valve core; 713. Valve body; 714. Return spring; 720. Position control assembly; 721. Position control plate; 722. Transition slope; 723. First locking block. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] See attached document Figure 1 - Appendix Figure 9 A chemical copper plating sealed chamber includes a chemical plating sealed chamber 100. The chemical plating sealed chamber 100 has a first chemical plating opening 110 on a first side and a second chemical plating opening 120 on a second side. A chemical plating channel is formed between the first chemical plating opening 110 and the second chemical plating opening 120. By passing a wire through the chemical plating channel, continuous chemical copper plating can be performed on the surface of the wire.

[0031] Formaldehyde, a common reducing agent in chemical copper plating, produces copper grains with fine texture and excellent surface finish and conductivity on the wire surface. However, formaldehyde needs to be pumped in excess to ensure sufficient contact with the wire and maintain the effectiveness of the chemical copper plating. Since formaldehyde is toxic to humans, to prevent its leakage from affecting the workshop and workers, a first sealing device 200 is installed outside the electroplating channel. This first sealing device 200 forms a first sealed chamber with the electroplating channel. Inside the electroplating sealed chamber 100, a device is fitted onto the first sealing device. The second sealing device 300 on the outside of the first sealing device 200 forms a second sealing chamber between the inner side of the second sealing device 300 and the first sealing device 200. The outer side of the second sealing device 300 forms a third sealing chamber between the electroless plating sealing chamber 100, the electroless plating sealing chamber 100, the first sealing device 200, and the second sealing device 300. Multi-layer sealing chambers can be formed between the electroless plating sealing chamber 100, the first sealing device 200, and the second sealing device 300. The electroless copper plating is located in the middle of the multi-layer sealing chambers. The multi-layer sealing chambers can improve the overall sealing effect on the wire, prevent the disorderly flow of formaldehyde from overflowing, and facilitate the subsequent centralized collection of formaldehyde.

[0032] The inner wall of the third sealed chamber is provided with a support partition 130 that is fixedly connected to the electroplating sealed chamber 100. A sealing door 140 is rotatably provided on the outside of the electroplating sealed chamber 100. The connection of the sealing door 140 is designed with a sealing strip. After opening the sealing door 140, the staff can enter the third sealed chamber above the support partition 130 and can inspect and maintain the electroplating devices such as the second sealing device 300 and the first sealing device 200.

[0033] To improve the effectiveness of collecting excess formaldehyde and minimize its leakage, a first ventilation system 600 is installed on both sides of the first sealing device 200, and a second ventilation system 400 is installed on the top of the electroplating sealed chamber 100. These two systems form a two-stage ventilation system. The first ventilation system 600 extracts and collects formaldehyde from both sides at the source, reducing the risk of leakage and ensuring a safe working environment outside the electroplating sealed chamber 100. Simultaneously, the second ventilation system 400 on the top of the electroplating sealed chamber 100 continuously collects residual formaldehyde from the second and third sealed chambers, further reducing the probability of leakage and maintaining a low formaldehyde level within the electroplating sealed chamber 100. This allows staff to enter the electroplating sealed chamber 100 for real-time electroplating monitoring.

[0034] In summary, by using multi-stage sealing and a two-stage ventilation system to seal and collect formaldehyde in the electroplating sealed room 100 multiple times, a large amount of formaldehyde can be collected at once from both sides of the source through the first ventilation system 600. The second ventilation system 400 at the top can form a constant airflow in the electroplating sealed room 100, which can effectively collect the formaldehyde that has overflowed and remained in the electroplating sealed room 100 again, greatly improving the formaldehyde collection effect and minimizing the risk of formaldehyde overflow.

[0035] Please refer to the appendix for details. Figure 6 - Appendix Figure 9 A chemical plating tank 210 is located in the middle of the first sealing device 200. Sealing partitions 211 are located on both sides of the chemical plating tank 210, forming an airtight buffer zone 220 on the outer side of the sealing partitions 211. The first ventilation system 600 is located within the airtight buffer zone 220, forming an airtight barrier. The wire sinks into the chemical plating tank 210 for chemical copper plating. The chemical plating tank 210 contains the chemical reagents, ventilation materials, and other raw materials required for chemical copper plating. The chemical plating tank 210 is a sub-tank, with a mother tank at its bottom. This sub-tank design allows the copper plating material to circulate between the two, maintaining the concentration of the material within the chemical plating tank 210. To ensure the copper plating effect, a first ventilation system 600 is installed within the airtight buffer zone 220 formed on both sides. This first ventilation system 600 forms an airtight barrier, collecting any overflowing formaldehyde from both sides to prevent it from escaping. It should be noted that the airtight buffer zones 220 on both sides correspond to the positions of the first plating opening 110 and the second plating opening 120, respectively, forming a buffer area of ​​a predetermined length. The first ventilation system 600 can form a directional airflow through air supply and negative pressure extraction to prevent formaldehyde-containing airflow from overflowing from the openings on both sides.

[0036] As a preferred ventilation method, the first ventilation system 600 includes an air supply rod 610 and a negative pressure extraction hood 620. The surface of the air supply rod 610 has air supply openings 611 arranged along the length direction. The air supply rod 610 is located below and outside the negative pressure extraction hood 620, and the air supply openings 611 face the negative pressure extraction hood 620. Both the air supply rod 610 and the negative pressure extraction hood 620 are externally connected to air control equipment. The air supply openings 611 on the surface of the air supply rod 610 blow airflow in a directional manner toward the negative pressure extraction hood 620, forming an airflow that flows inward between the two, so as to minimize the leakage of formaldehyde from the openings on both sides. During the wire plating process, the air supply rod 610 is located at the bottom end of the wire, and the negative pressure extraction hood 620 is located above the wire.

[0037] The first sealing device 200 includes several parallel sealing covers 230. The sealing covers 230 are positioned opposite the electroless plating tank 210 and are movably connected to one side of the tank. A sealing lip is provided between two adjacent sealing covers 230. During the wire electroless copper plating process, the sealing covers 230 are rotated to close them. At this time, a continuous sealing channel can be formed between the sealing covers 230 and the electroless plating tank 210. The sealing lip can seal the gaps between adjacent sealing covers 230, preventing formaldehyde from overflowing from the middle position to the greatest extent. At the same time, the airflow direction formed by the first ventilation system 600 on both sides intersects with the direction of the sealing channel, and is close to perpendicular. The airflow velocity on both sides is large and the pressure is small, which can extract the formaldehyde gas remaining inside from the outside, thereby controlling the directional flow of formaldehyde gas and collecting it in a concentrated manner on both sides. Through the above arrangement, while preventing formaldehyde gas from overflowing from the middle position, the effect of concentrated collection on both sides can be improved, thereby preventing formaldehyde gas from overflowing to the outside of the electroless plating sealing room 100.

[0038] Furthermore, a pumping pipe 240 is installed inside the electroless plating tank 210. The pumping pipe 240 extends along the length of the electroless plating tank 210, and several sealing covers 230 with a horizontal coverage area larger than the horizontal projection size of the pumping pipe 240. The pumping pipe 240 can pump the raw materials required for electroless copper plating into the electroless plating tank 210 and circulate them in the mother and daughter tanks. At the same time, the pumping openings are located on both sides, which can agitate the copper powder in the electroless plating tank 210, allowing the copper powder to flow fully in the electroless plating tank 210 to effectively convert it into copper ions, maintain the concentration of copper ions in the electroless plating tank 210 within the threshold, and ensure the effect of electroless copper plating on the wire surface.

[0039] Please refer to the appendix for details. Figure 3The second sealing device 300 includes a sealing mounting frame 310, with an observation opening 320 on its side wall. A sealing slide plate 330 is slidably disposed outside the observation opening 320. The sealing slide plate 330 is mounted on the outside of the sealing mounting frame 310 via a sealing slide rail. By sliding the sealing slide plate 330 to overlap with the observation opening 320, the observation opening 320 can be sealed, thus sealing the second sealing chamber formed between the second sealing device 300 and the first sealing device 200, keeping its interior in a relatively sealed state to prevent formaldehyde from entering. Harmful gases are allowed to escape into the third sealed chamber to ensure the safety of personnel outside. The observation opening 320 and the sealing slide plate 330 can be arranged in two or more sets in parallel, depending on the length of the chemical copper plating production line. Under normal conditions, the observation opening 320 is sealed by the sealing slide plate 330. When it is necessary to adjust the internal chemical copper plating equipment, the sealing slide plate 330 and the sealing cover plate 230 are opened in sequence, and the personnel can directly inspect and perform other operations on the internal structure of the chemical plating tank 210 to meet the maintenance needs of wire chemical copper plating.

[0040] Please refer to the appendix for details. Figure 4 The second ventilation system 400 includes a first ventilation duct 410 and a second ventilation duct 420 located at the top. The first ventilation duct 410 is positioned opposite the third sealed chamber, and the second ventilation duct 420 is opposite the second sealed chamber. The second ventilation duct 420 is in a normal negative pressure intake state. The state of the first ventilation duct 410 can be adjusted to switch between intake and exhaust. Specifically, after the observation opening 320 is opened, the first ventilation duct 410 is controlled to be in an exhaust state, allowing airflow to pass through the observation opening 320 into the second sealed chamber. After the observation opening 320 is inspected, gas is pumped out through the first ventilation duct 410. The second ventilation duct 420 is normally in an intake state. During this process, the gas in the third sealed chamber corresponding to the first ventilation duct 410 flows towards the second sealed chamber corresponding to the second ventilation duct 420. This creates an effective airflow circulation between the two, allowing the gas to flow directionally between them. This effectively avoids the impact of gas overflow from the second sealed chamber after the observation opening 320 is opened on the personnel in the third sealed chamber. It also allows for the inspection of the internal structure to be completed while chemically plating copper.

[0041] It should be noted that the top of the second sealing device 300 is sealed to the electroplating sealing chamber 100, which can keep the top of the second and third sealing chambers sealed and isolated. At the same time, the first ventilation duct 410 is located at the top, and during the air supply process, it can supply air from the top towards the head of the staff, forming an airflow from top to bottom in the third sealing chamber. After the airflow passes through the observation opening 320, it is drawn up by the second ventilation duct 420 under negative pressure, which can realize the directional flow of gas, so as to minimize the inhalation of harmful gases such as formaldehyde by the staff.

[0042] An air supply duct and an exhaust duct are connected to the outside of the first ventilation duct 410. A control device 700 is connected inside the first ventilation duct 410 to switch the conduction state. The control device 700 is located on the moving path of the sealing slide plate 330. After the sealing slide plate 330 slides to one side, the opening 320 is observed to be in the open state. After the sealing slide plate 330 slides to one side, a signal can be sent to the control device 700 to adjust the control device 700 to the first conduction state, so that the first ventilation duct 410 is connected to the air supply duct, and gas is blown out from the first ventilation duct 410. When the sealing slide plate 330 is closed, the control device 700 is switched to the second conduction state, so that the first ventilation duct 410 is connected to the air supply duct. At this time, the first ventilation duct 410 and the second ventilation duct 420 are in the same state, both in a negative pressure state to absorb formaldehyde, so as to reduce the content of formaldehyde harmful gas inside the electroplating sealing room 100 and prevent it from overflowing to the outside of the electroplating sealing room 100, thus avoiding the impact on the production workshop.

[0043] Referring specifically to the attached drawings, the preferred control method is as follows: the control device 700 includes a control valve 710 and a position control component 720. The control valve 710 includes a position control rod 711, a valve core 712, a valve body 713, and a return spring 714. The position control component 720 is located on the moving path of the sealing slide plate 330. The position control component 720 includes a position control plate 721. The bottom end of the position control plate 721 is fixedly connected to the position control rod 711 of the control valve 710. An arc-shaped transition slope 722 is opened on the outer side of the bottom end of the position control plate 721, and a first locking block 723 is provided on the outer side. A second locking block adapted to the first locking block 723 is provided on the upper end of the sealing slide plate 330. After the sealing slide plate 330 slides to the outer position, it can engage with the position control component 720. The transition slope 722 on the surface cooperates with the movement along the inclined surface, thereby pressing the position control plate 721 upward. The position control plate 721 is fixedly connected to the position control rod 711 of the control valve 710, which can change the position of the valve core 712 in the control valve 710, thereby realizing the switching of the conduction channel. After the sealing slide plate 330 moves to the outer moving position, the first locking block 723 and the second locking block cooperate to be in a locked state, and at the same time, they can limit the sealing slide plate 330 to ensure the stability of the connection position of the two. In the opposite state, the sealing slide plate 330 moves in the opposite direction. At this time, the position control plate 721 can be reset downward, allowing the valve core 712 to return to the initial state, so as to realize the switching of the pipeline channel again.

[0044] Taking the chemical copper plating of multiple fiber filaments as an example, using the aforementioned chemical copper plating sealed chamber, formaldehyde is used as a reducing agent. Multiple fiber filaments 500 are sequentially passed through the first plating opening 110 and the second plating opening 120, allowing the multiple fiber filaments 500 to be chemically plating copper within the plating channel. During the chemical copper plating process, the sealing cover 230 and the sealing slide plate 330 are kept closed. The sealing cover 230 can form a mutually sealed area with the first sealing device 200, achieving a primary seal. Furthermore, formaldehyde can be absorbed from both sides through the first ventilation system 600 on both sides, thus achieving the goal of maximizing formaldehyde absorption. Formaldehyde gas is extracted; simultaneously, after the sealing slide plate 330 is closed, a second sealing chamber can be formed outside the first sealing device 200, achieving a two-stage seal and further preventing the leakage of formaldehyde gas; at the same time, a third sealing chamber can be formed between the second sealing device 300 and the electroless copper plating sealing chamber 100, achieving a three-stage seal, which can achieve a sealing effect on the outermost layer, so as to effectively avoid the leakage of formaldehyde gas during the electroless copper plating process. At the same time, a second ventilation system 400 is installed at the top of the electroless copper plating sealing chamber 100, which can extract formaldehyde gas in the second and third sealing chambers to ensure that the internal environment meets the safety requirements.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chemical copper plating sealing chamber, comprising a chemical plating sealing chamber (100), wherein the chemical plating sealing chamber (100) has a first chemical plating opening (110) on a first side and a second chemical plating opening (120) on a second side, and a chemical plating channel is formed between the first chemical plating opening (110) and the second chemical plating opening (120), characterized in that: A first sealing device (200) is provided on the outside of the electroplating channel, and a first sealing chamber is formed between the first sealing device (200) and the electroplating channel. A second sealing device (300) is provided inside the electroplating sealing chamber (100) and sleeved on the outside of the first sealing device (200). A second sealing chamber is formed between the inner side of the second sealing device (300) and the first sealing device (200), and a third sealing chamber is formed between the outer side of the second sealing device (300) and the electroplating sealing chamber (100). The first sealing device (200) is provided with a first ventilation system (600) on both sides, and the chemical plating sealing chamber (100) is provided with a second ventilation system (400) on the top. The first sealing device (200) has a plating tank (210) in the middle, and sealing partitions (211) are provided on both sides of the plating tank (210). An airtight buffer zone (220) is formed on the outside of the sealing partitions (211), and the first ventilation system (600) is located in the airtight buffer zone (220) to form an airtight barrier. The first ventilation system (600) includes an air supply rod (610) and a negative pressure extraction hood (620). The air supply rod (610) has an air supply opening (611) arranged along the length direction on its surface. The air supply rod (610) is located on the lower outer side of the negative pressure extraction hood (620), and the air supply opening (611) faces the negative pressure extraction hood (620). The second sealing device (300) includes a sealing mounting frame (310), the side wall of which has an observation opening (320), and a sealing slide plate (330) is slidably disposed outside the observation opening (320). The second ventilation system (400) includes a first ventilation duct (410) and a second ventilation duct (420) located at the top. The first ventilation duct (410) is positioned opposite the third sealed chamber, and the second ventilation duct (420) is positioned opposite the second sealed chamber. The state of the first ventilation duct can be adjusted to switch between inhalation and blowing. After the observation opening (320) is opened, the first ventilation duct (410) is controlled to be in the air supply state, allowing the airflow to pass through the observation opening (320) and enter the second sealed chamber. The gas is pumped out through the first ventilation duct, and the second ventilation duct is normally in the air intake state. During this process, the gas in the third sealed chamber corresponding to the first ventilation duct flows toward the second sealed chamber corresponding to the second ventilation duct, thus forming an effective airflow circulation between the two, allowing the gas to flow directionally between them. The first ventilation duct (410) is connected to an air supply duct and an exhaust duct. The first ventilation duct (410) is internally connected to a control device (700) for switching the conduction state. The control device (700) is located on the moving path of the sealing slide plate (330).

2. The chemical copper plating sealing chamber according to claim 1, characterized in that, The first sealing device (200) includes several sealing cover plates (230) arranged in parallel. The sealing cover plates (230) are positioned opposite to the electroplating tank (210) and are movably connected to one side of the surface of the tank. A sealing lip is provided between two adjacent sealing cover plates (230). A pumping pipe (240) is provided inside the electroplating tank (210). The pumping pipe (240) extends along the length of the electroplating tank (210), and the horizontal coverage area of ​​the several sealing cover plates (230) is larger than the horizontal projection size of the pumping pipe (240).

3. The chemical copper plating sealing chamber according to claim 1, characterized in that, The control device (700) includes a control valve (710) and a position control component (720). The position control component (720) is located on the moving path of the sealing slide plate (330). The position control component (720) includes a position control plate (721). The bottom end of the position control plate (721) is fixedly connected to the position control rod (711) of the control valve (710). An arc-shaped transition slope (722) is opened on the outer side of the bottom end of the position control plate (721). A first locking block (723) is provided on the outer side. A second locking block that matches the first locking block (723) is provided on the upper end of the sealing slide plate (330).

4. The chemical copper plating sealing chamber according to claim 1, characterized in that, The inner wall of the third sealed chamber is provided with a support partition (130) that is fixedly connected to the electroplating sealed chamber (100), and a sealing door (140) is rotatably provided on the outside of the electroplating sealed chamber (100).

5. An application of a chemical copper plating sealing chamber on multi-channel fiber filaments, using the chemical copper plating sealing chamber of any one of claims 1-4, using formaldehyde as a reducing agent, passing multiple fiber filaments (500) sequentially through a first chemical plating opening (110) and a second chemical plating opening (120), so that the multiple fiber filaments (500) are chemically copper plated in the chemical plating channel.

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