A fully automated intelligent defect detection device for semiconductor chips

Abstract

This invention relates to the field of semiconductor chip inspection technology, specifically to a fully automated intelligent defect inspection device for semiconductor chips. The device includes: a mounting box, on which a darkroom is fixedly mounted, and on which an industrial camera is fixedly mounted; a refractive imaging device comprising a trapezoidal prism and a lighting mechanism for illuminating the back of the chip. The lighting mechanism illuminates the back of the chip on a mounting rack, causing reflection from the back of the chip, and the trapezoidal prism images the reflected light onto an imaging glass plate. This invention, by using a lighting mechanism to illuminate the back of the chip on a mounting rack, causing reflection from the back of the chip, and then using a trapezoidal prism to image the reflected light onto an imaging glass plate, allows the same industrial camera to simultaneously photograph and inspect the front of the chip on the mounting rack and the back of the chip projected onto the imaging glass plate, thereby improving chip inspection efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip inspection technology, specifically to a fully automated intelligent defect detection device for semiconductor chips. Background Technology

[0002] Semiconductor chip manufacturing processes include deposition, photolithography, etching, ion implantation, electroplating, and polishing, involving different chemical materials, chemical agents, and reactive gases. Each process step and even the process environment can produce defects. Therefore, defect detection must be carried out intermittently between process steps in order to detect problems in a timely manner and avoid significant economic losses.

[0003] Semiconductor chip inspection equipment includes image acquisition, image registration, image difference, and defect detection. It uses an industrial vision camera to photograph a standard chip and the chip under test. The SURF image registration algorithm (Zhang Ruijuan, Zhang Jianqi, Yang Cui. Research on Image Registration Method Based on SURF [J]. Infrared and Laser Engineering) is used to align the standard image and the image under test in spatial position. Difference operations are performed on the two images, and then the Ostu method (maximum inter-class variance) is used to binarize the difference image. After binarization, morphological removal is applied to identify false defects in the image, resulting in a defect image. Finally, the defect image is identified and classified. However, for some semiconductor chips that require inspection of both sides, the industrial vision camera installed in the chip inspection equipment can only photograph one side of the semiconductor chip at a time.

[0004] Common fully automated intelligent defect detection equipment for semiconductor chips offers two solutions to the above problems: First, the semiconductor chip detection equipment is equipped with two industrial vision cameras, making the equipment expensive. Second, during detection, a robotic arm picks up the chip and places it under the industrial camera for front-facing photography, then the robotic arm rotates the chip to photograph its back. Finally, the robotic arm rotates to place the chip face up onto the conveyor belt. This results in each semiconductor chip needing to be flipped twice during photography, severely impacting the detection efficiency of semiconductor chips.

[0005] To address this, a fully automated intelligent defect detection device for semiconductor chips is proposed, which enables the same industrial camera to simultaneously photograph and inspect the front and back of the chip, thereby improving chip detection efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a fully automated intelligent defect detection device for semiconductor chips. The device uses a lighting mechanism to illuminate the back of the chip on the placement rack, causing reflection from the back of the chip. A trapezoidal prism then images the reflected light onto an imaging glass plate. This allows the same industrial camera to simultaneously photograph and inspect both the front of the chip on the placement rack and the back of the chip projected onto the imaging glass plate, thereby improving the chip detection efficiency and solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A fully automated intelligent defect detection device for semiconductor chips includes...

[0009] The mounting box has a dark box fixedly mounted on it, an industrial camera fixedly mounted on the dark box, and a gripping device for gripping the chip mounted on one side of the mounting box.

[0010] It also includes a refractive imaging device, which is installed inside the mounting box. The refractive imaging device includes a trapezoidal prism and a lighting mechanism for illuminating the back of the chip. The top of the mounting box has two opposing mounting slots. One of the mounting slots is equipped with a chip holder, and the other mounting slot is equipped with an imaging glass plate. The lighting mechanism illuminates the back of the chip on the holder, and the back of the chip reflects the light. The trapezoidal prism images the reflected light onto the imaging glass plate, enabling the industrial camera to simultaneously photograph and inspect the front of the chip on the holder and the back of the chip projected onto the imaging glass plate.

[0011] It should be noted that the interior of the dark box and the surface of the mounting box are coated with black light-absorbing paint to reduce the reflection caused by light hitting the surfaces of the dark box and the mounting box. Of course, a feed port is opened on one side of the dark box so that the gripping device can place the chip on the placement rack. A light-blocking door is also installed on the feed port to prevent external light from interfering with the imaging inside the dark box.

[0012] The trapezoidal prism has specific shape requirements. Its cross-section is an isosceles trapezoid with a 45° angle between its base and hypotenuse, and a 135° angle between its top and hypotenuse. The area of ​​the two inclined surfaces of the trapezoidal prism is larger than the area of ​​the mounting slot, allowing the trapezoidal prism to project the back of the chip completely. The two inclined surfaces of the trapezoidal prism are mirror-like, while the other surfaces are transparent glass. The mirror-like inclined surfaces of the trapezoidal prism refract the image onto the back of the chip, projecting it onto the imaging glass plate on the other side. The imaging glass plate is 0.2mm thick, which reduces the error generated during imaging.

[0013] In use, when the light source shines on the chip, the chip reflects the generated light onto one side of the trapezoidal prism's inclined surface. Because the inclined surface is mirror-like, it reflects the refracted light. It should be noted that the light reflected by the chip enters the trapezoidal prism perpendicularly, ensuring that the light entering another medium is not deflected. The light enters the trapezoidal prism perpendicularly and contacts its inclined surface. Because the inclined surface of the trapezoidal prism forms a 45° angle with the chip as a whole, it can reflect the light that shines on it, and the reflection angle is 90°. Since the direction of light propagation in the same medium is not deflected, it can be smoothly reflected onto the other side of the trapezoidal prism's inclined surface. The other side of the trapezoidal prism's inclined surface forms a 45° angle with the imaging glass, causing the light to be reflected perpendicularly onto the imaging glass. Of course, as described above, the light entering another medium perpendicularly does not refract, allowing the reflected light to be smoothly displayed on the imaging glass.

[0014] The mounting box contains a refraction channel that connects the two mounting slots. The trapezoidal prism is installed in the refraction channel. The dark box contains a vertically placed light-blocking plate that separates the two mounting slots. The light-blocking plate extends to the outer wall of the industrial camera lens. A light-blocking ring is installed between the light-blocking plate and the inner wall of the dark box to prevent light from interfering with each other.

[0015] Of course, light-absorbing coatings are also sprayed on the light shield, light shield ring, and refraction channel to reduce the refraction caused by light illumination. The light shield and light shield ring reduce the impact of the front illumination of the chip on the back projection of the chip. Of course, the front illumination lamp of the chip is located below the light shield. A small amount of light will diffuse in all directions in the light path formed in the trapezoidal prism. The installed refraction channel can prevent the light diffusion from affecting the brightness of the refracted light path.

[0016] It should be noted that an installation window for installing a trapezoidal prism is provided at the bottom of the refraction channel. The installation window prevents scratches on the trapezoidal prism during installation and improves the imaging effect. Of course, a locking rotating block is also fixed at the bottom of the refraction channel to close the installation window.

[0017] The lighting mechanism includes multiple lamp holders disposed on the refraction channel. The multiple lamp holders are distributed circumferentially on the four sides of the refraction channel. Two opposing support blocks are installed on each of the four sides of the refraction channel. The lamp holders are rotatably connected to the support blocks. Spotlights are rotatably connected to the lamp holders. Multiple light-transmitting windows are opened on the refraction channel. Second glass plates are installed on the light-transmitting windows. Rotating components that drive the spotlights to rotate are installed on the lamp holders. An angle adjustment component that pushes the lamp holders to change their angle is installed on the refraction channel.

[0018] The spotlight emits light that shines through the second glass plate in the refraction channel onto the bottom of the chip. Simultaneously, because the spotlight rotates on the lamp holder, it can rotate. The rotation of the lamp holder on the support block causes the spotlight to rotate, changing the direction of illumination on the chip. Since there are fixed rotating components on the lamp holder, it can only rotate 60°. It should be noted that the spotlight uses LEDs as its light source, and its overall brightness should reach at least 100,000 lux. Each LED is preceded by 3-4 different optical lenses or mirrors, using combinations of optical lenses and mirrors at different angles and heights.

[0019] The spotlight is in the shape of a triangular prism, and each facet of the spotlight is equipped with an LED light. When one facet of the spotlight is illuminated for a specific duration, the rotating component drives the spotlight to rotate and switch to different faces for illumination.

[0020] One issue is that the spotlights need to be on for extended periods during chip testing because the chips are handled very quickly by a gripping device. If the spotlights need to be turned on and off constantly to follow the chip's movement, this severely impacts their lifespan. While the luminous efficiency of LEDs is only 20%–30%, a significant portion (70%–80%) of their electrical energy is not converted into usable light but rather into heat. The high temperature at the LED connector is caused by two factors: 1. Low internal efficiency. This means that when electrons combine with the aperture, photons are not generated 100%. Often, "current leakage" reduces the carrier recombination rate in the PN region. The leakage current multiplied by the voltage equals this portion of power, which is converted into heat. However, this portion doesn't consume major components because the internal photon efficiency is close to 90%. 2. The photons generated internally cannot escape the chip. The main reason for the heat conversion is that the external quantum efficiency is only about 30%, with most being converted into heat.

[0021] Meanwhile, during chip testing, different colors of spotlights need to be changed for photo comparison. In addition, the illumination needs to be carried out for a long time, which causes the temperature of the LED beads and the motherboard to rise. When the ambient temperature is high, the temperature inside the camera will also rise. The temperature rise causes dark current to be generated in the circuit, which is a major source of noise in the image sensor. Excessive noise will form discolored spots in places that should not be there on the image. It will also cause thermal deformation of related components in the vicinity. For example, the mounting bracket and the light-absorbing paint will peel off and deform, which will cause the temperature of the mounting bracket and the vicinity to rise and affect the refraction of the light path.

[0022] The triangularly arranged spotlight has three different illumination surfaces. When the LED light on one of the surfaces illuminates for too long, the rotating component on the lamp holder will drive the spotlight to rotate and change to a different illumination surface. Of course, the rotating component is controlled by a control chip. When one of the illumination surfaces of the spotlight is turned on for a specified time, the rotating component will drive the spotlight to rotate and change to a different illumination surface, reducing the impact of temperature on the detection effect.

[0023] It should be noted that the three illumination surfaces of the spotlight are set separately and independently and connected in parallel with the lighting power supply. When the light on one illumination surface is damaged, it will not affect the LED lights on the other two surfaces.

[0024] Preferably, the rotating assembly includes a rotating box fixedly mounted on the lamp holder, a ratchet fixedly mounted inside the rotating box and fixedly mounted to the rotating shaft of the spotlight, and a toothed ring sleeved on the outside of the ratchet. An electromagnet is fixedly mounted inside the rotating box, and a first rack plate that meshes with the toothed ring is fixedly mounted on one side of the electromagnet.

[0025] When the spotlight needs to be rotated and adjusted to use different illumination surfaces, the electromagnet is energized. The electromagnet pulls the connected first rack plate to move, compressing the compression spring on one side. The moving first rack plate drives the gear ring meshing with it to rotate, and the rotating gear ring drives the ratchet fixed to it to rotate. Because the ratchet is a one-way rotating component, the ratchet can drive the spotlight to rotate at this time. Of course, when the electromagnet is de-energized, the compressed spring pushes the first rack plate back to its original position. At this time, the first rack plate will also drive the gear ring to rotate. Because the ratchet is a one-way rotating component, the ratchet cannot drive the spotlight to rotate.

[0026] The rotating assembly also includes a micro motor fixedly installed inside the rotating box. The micro motor drives the spotlight to rotate. While the micro motor can precisely drive the spotlight to rotate, four spotlights require four motors, which increases the production cost of the entire device. Of course, some chip manufacturers have special requirements for the deflection angle of the spotlights and can choose to install micro motors.

[0027] The lamp holder has a circular hole, and a limiting spring is fixedly installed in the circular hole. One end of the spotlight has a groove, and the protrusion of the limiting spring cooperates with the groove.

[0028] As described above, the first rack plate drives the meshing gear ring to rotate, and the rotating gear ring drives the fixed ratchet to rotate. Since the ratchet is a unidirectional rotating structure, it will rotate due to inertia, preventing the spotlight from rotating to the designated position. The limiting spring plate fixed in the round hole can solve this problem well, allowing the spotlight to rotate to the designated position. Because the protrusion of the limiting spring plate will abut against the top of the spotlight, the spotlight will be subjected to a certain friction force when rotating, so that the inertia generated by the rotation of the ratchet will not interfere with the rotation of the spotlight. At the same time, the top of the spotlight has three grooves that match the illumination surface, making the spotlight more stable after rotation and preventing it from shaking due to the rotation of the lamp holder.

[0029] Of course, a Maltese mechanism can also be installed inside the rotating box to allow the spotlight to rotate precisely to a specific position by rotating only at a specific angle. However, the added structure will increase the overall weight of the light fixture and also increase the cost of the equipment.

[0030] Preferably, the angle adjustment assembly includes a pusher frame that slides on the refraction channel; a small gear fixedly mounted on one side of the support block and connected to the rotating shaft of the lamp holder; multiple second rack plates meshing with the small gear fixedly mounted on the pusher frame; a limiting support block fixedly mounted on the refraction channel; multiple sliding grooves on the limiting support block; a push plate slidably connected within the sliding grooves; one side of the push plate fixedly mounted to the pusher frame; a rotating ring rotatably connected to the limiting support block; a push groove on the rotating ring; a push column fixedly mounted to the push plate slidably connected within the push groove; multiple evenly arranged locking teeth fixedly mounted on the rotating ring; a motor fixedly mounted inside the mounting box; and a large gear meshing with the locking teeth fixedly mounted on the output shaft of the motor.

[0031] When the rotation angle of the lamp holder needs to be adjusted, the motor runs, and the output shaft of the motor drives the large gear fixed on it to rotate. The rotating large gear drives the caliper meshing with it to rotate, causing the entire rotating ring to rotate. When the rotating ring rotates to one side, the rotating push groove moves away from the push column, causing the push column to move upward. The upward-moving push column drives the fixed push plate to move upward. Because there are four push grooves, push columns, and push plates, the push frame can move upward stably. The moving push frame drives the fixed second rack plate on it to move upward. The moving second rack plate drives the meshing small gear to rotate. The rotating small gear causes the lamp holder to start to rotate upward. Of course, if the lamp holder needs to rotate downward, the motor needs to rotate in the opposite direction, driving the rotating ring to rotate to the other side.

[0032] The angle adjustment assembly also includes an electric telescopic rod installed in the mounting box. The electric telescopic rod can drive the push frame to rise. Since all four spotlights need to be rotated, the push frame needs to be raised stably, which requires the installation of multiple electric telescopic rods. This not only occupies a lot of space in the equipment, but also increases the cost of the equipment. Of course, using multiple electric telescopic rods can adjust the angle of each spotlight to different angles.

[0033] The placement rack includes a first glass plate fixedly installed on its inner side, and the top and bottom of the first glass plate are provided with light-shielding rubber rings fixedly installed with the placement rack.

[0034] The placement rack can be adjusted according to the size of the chip to be tested, and different placement racks can be used. When in use, the light from below is refracted onto the back of the chip through the first glass plate on it. Of course, the multiple light-shielding rubber rings installed prevent the light from above and below from interfering with each other, thus increasing the imaging effect of refraction.

[0035] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0036] 1. The lighting mechanism illuminates the chip to be inspected. The back of the chip is illuminated and reflected. The reflected light enters the trapezoidal prism and is refracted multiple times to form an image on the imaging glass plate. This allows the same industrial camera to simultaneously photograph and inspect the front of the chip on the rack and the back of the chip projected onto the imaging glass plate, greatly improving the inspection efficiency of semiconductor chips.

[0037] 2. When the LED light on one side is illuminated for too long, the rotating component on the lamp holder will drive the spotlight to rotate and change to a different illuminating surface. Of course, the rotating component is controlled by the control chip. When one of the illuminating surfaces of the spotlight is turned on and reaches the specified time, the rotating component will drive the spotlight to rotate and change to a different illuminating surface. This ensures that the generated temperature will not cause the glass plate on the placement rack to deform and affect the light path refraction, thereby improving the detection accuracy of the fully automatic intelligent defect detection equipment for semiconductor chips.

[0038] 3. Meanwhile, the spotlight is in the shape of a triangular prism, with LED lights installed on each face. The three illumination faces of the spotlight are set up independently and connected in parallel with the lighting power supply. The LED lights on the three faces will not interfere with each other. When a light on one illumination face is damaged, it will not affect the operation of the LED lights on the other two faces. This ensures that the chip inspection equipment will not stop operating due to light damage during normal operation, thus not affecting the detection efficiency of the fully automatic intelligent defect inspection equipment for semiconductor chips. Attached Figure Description

[0039] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0040] Figure 2 This is a schematic diagram of the internal structure of the dark box in this invention;

[0041] Figure 3 This is a schematic diagram of the internal structure of the mounting box in this invention;

[0042] Figure 4 This is an enlarged structural schematic diagram of the placement rack in this invention;

[0043] Figure 5 This is an enlarged schematic diagram of the rotating ring in this invention;

[0044] Figure 6 for Figure 5 Enlarged structural diagram at point A;

[0045] Figure 7 This is an enlarged structural schematic diagram of the limiting support block in this invention;

[0046] Figure 8 This is a schematic diagram of the optical path of the refraction channel in this invention;

[0047] Figure 9 This is an enlarged structural schematic diagram of the trapezoidal prism in this invention;

[0048] Figure 10 This is a schematic diagram of the internal structure of the rotating box in this invention;

[0049] Figure 11 This is a side view of the limiting spring in this invention.

[0050] In the diagram: 1. Dark box; 2. Mounting box; 3. Industrial camera; 4. Placement rack; 401. Light-shielding rubber ring; 402. First glass plate; 5. Light-blocking plate; 6. Light-blocking ring; 7. Imaging glass plate; 8. Refraction channel; 9. Motor; 10. Large gear; 11. Rotating ring; 12. Spotlight; 13. Pusher frame; 14. Pusher plate; 15. Rotating box; 16. Lamp holder; 161. Limiting spring; 17. Second glass plate; 18. Pushing column; 19. Ratchet; 20. First rack plate; 21. Trapezoidal prism; 22. Limiting support block; 23. Small gear; 24. Second rack plate. Detailed Implementation

[0051] The technical solutions of the present invention will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.

[0052] Example 1:

[0053] Please see Figure 1 , Figure 2 , Figure 8 , Figure 9The refraction channel 8 is connected to the inner wall of the mounting box 2 by screws. Of course, there will be a certain gap between the mounting box 2 and the refraction channel 8. A sealing strip can be installed to reduce light leakage at the gap. A rubber ring is also installed at the mounting port of the trapezoidal prism 21. It should be noted that the entire refraction channel 8 is made of 5mm thick stainless steel. The mounting box 2, the dark box and the refraction channel 8 are all sprayed with matte asphalt alkyd paint or asphalt phenolic paint during production. Both of these are black light-absorbing coatings to reduce light refraction.

[0054] Of course, the dark box 1 will also be installed on the mounting box 2 by bolts. When the equipment inside the dark box 1 is damaged or the internal parts are worn out, the dark box 1 can be opened to facilitate its internal maintenance.

[0055] Both the light-blocking plate 5 and the light-blocking ring 6 are glued to the inside of the dark box 1, and adhesive strips are installed at the connection between the light-blocking plate 5 and the light-blocking ring 6 and the dark box 1 to prevent light from leaking out.

[0056] The gripping device picks up the chip to be inspected and places it on the placement rack 4. The lighting mechanism illuminates the back of the chip. When the light shines on the chip, it reflects the light onto one side of the trapezoidal prism 21. Because the slope is mirror-like, it reflects the refracted light. It should be noted that the light reflected by the chip enters the trapezoidal prism 21 perpendicularly, so that the light entering another medium is not deflected. The light enters the trapezoidal prism 21 perpendicularly and contacts its slope. Because the slope of the trapezoidal prism 21 forms a 45° angle with the chip, it can reflect the light that shines on it, and the reflection angle is 90°. Since the direction of light propagation in the same medium is not deflected, it can be smoothly reflected onto the other side of the trapezoidal prism 21. The angle between the other side of the trapezoidal prism 21 and the imaging glass is 45°, causing the light to be reflected perpendicularly onto the imaging glass. Of course, as described above, the light entering another medium perpendicularly is not refracted, so the reflected light can be smoothly displayed on the imaging glass.

[0057] At this time, the same industrial camera 3 can simultaneously capture images of the front of the chip on the placement rack and the back of the chip projected onto the imaging glass plate 7, thereby improving the detection efficiency of the fully automated intelligent defect detection equipment for semiconductor chips.

[0058] Example 2:

[0059] Please see Figure 3 , Figure 5 , Figure 7The spotlight 12 has multiple heat dissipation holes at its bottom to increase its heat dissipation effect. The support block has a round hole in which a ball bearing is installed to support the rotating shaft of the lamp holder 16. The ball bearing makes the rotation of the lamp holder 16 more stable. A temperature sensor is installed in the mounting box 2 near the placement rack 4.

[0060] Please see Figure 10 , Figure 11 The electromagnet installed inside the rotating box 15 is a round tube electromagnet X-SFT-2437L-01, which is 37×27×24.5mm in size and has a force ≥210g. Of course, because there is a certain friction between the limiting spring 161 and the spotlight 12, a certain pushing force is required to drive the spotlight 12 to rotate. If other types of electromagnets are used, their force needs to be ≥200g.

[0061] Please see Figure 5 The motor 9 that drives the rotating ring 11 to rotate is a Deyue two-phase stepper motor 928HS34. The rotating ring 11 and the limiting support block 22 are provided with ball grooves. Half of the ball grooves are opened on the rotating ring 11 and the other half of the ball grooves are opened on the limiting support block 22. The ball grooves are used for rolling connection balls. The rotation of the rotating ring 11 is more stable through the balls and the ball grooves. The balls are quenched and tempered to improve their strength and wear resistance. The ball obtained by heat treatment has a microstructure composed of martensite, retained austenite and retained carbides.

[0062] The motor 9 is fixedly mounted with a support frame, which is fixedly installed on the inner wall of the mounting box 2 by means of screw connection. The motor 9 connected by screws is easy to disassemble and maintain.

[0063] The limiting support block 22 is connected to the refraction channel 8 by welding. The limiting support block 22 connected by welding is more stable, and the rotating ring 11 on it is smoother.

[0064] When the spotlight 12 needs to be rotated to adjust its different irradiation surfaces and reduce the internal temperature of the detection equipment, the electromagnet is energized. The electromagnet pushes the connected first rack plate 20 to move and compresses the compression spring on one side. The moving first rack plate 20 drives the gear ring meshing with it to rotate. The rotating gear ring drives the ratchet 19 fixed to it to rotate. Because the ratchet 19 is a one-way rotating component, it can drive the spotlight 12 to rotate at this time. It should be noted that the inertia generated by the rotation of the ratchet 19 cannot be controlled. Therefore, the resistance to the rotation of the spotlight 12 is increased by installing the limiting spring 161, so that the inertia of the ratchet 19 can be controlled. Of course, when the electromagnet is de-energized, the compressed spring pushes the first rack plate 20 back to its original position. At this time, the first rack plate 20 will also drive the gear ring to rotate. Because the ratchet 19 is a one-way rotating component, it cannot drive the spotlight 12 to rotate.

[0065] Please see Figure 10 , Figure 11 The fixed limiting spring 161 is made of 0.02mm steel plate after quenching, and it has a certain elasticity. The overall brightness of each side of the spotlight 12 should reach more than 100,000 lux. Each LED is equipped with 3-4 different optical lenses or mirrors. The brightness is achieved by combining optical lenses and mirrors with different angles and heights.

[0066] Please see Figure 2 , Figure 3 It should be noted that a protective box is installed on the refraction channel 8 to protect the spotlight 12 and gears. Of course, the protective box is also connected to the mounting box 2 by screws, and a maintenance window is installed on the protective box to facilitate the maintenance and replacement of the lighting mechanism.

[0067] Please see Figure 4 The light-shielding rubber ring 401 is made of vulcanized rubber material with a Shore hardness of less than 10°. This allows the chip to be placed on it, separating the back and front of the chip so that the two types of light illuminating the front and back do not interfere with each other.

[0068] Of course, the overall thickness of the first glass plate 402 is 0.05mm to prevent the glass from being too thick and affecting the illumination of the chip by the spotlight 12. The placement rack 4 can be replaced according to the size of the chip to be tested, so that the chip to be tested is consistent with the shape of the glass on the placement rack 4, and the side of the chip to be tested needs to contact the light-shielding rubber ring 401 on the placement rack 4. When the side of the chip to be tested cannot contact the light-shielding rubber ring 401, it needs to be replaced.

[0069] When the illumination angle of the spotlight 12 needs to be adjusted, the Deyue two-phase stepper motor 928HS34 starts. The motor 9 drives the rotating ring 11 to rotate. When the rotating ring 11 rotates to one side, the rotating push groove moves away from the push column 18, causing the push column 18 to move upward. The upward-moving push column 18 drives the fixed push plate 14 to move upward. Because there are four push grooves, push columns 18 and push plates 14, the push frame 13 can move upward stably. The moving push frame 13 drives the fixed second rack plate 24 on it to move upward. The moving second rack plate 24 drives the meshing pinion 23 to rotate. The rotating pinion 23 causes the lamp holder 16 to start to flip upward. Of course, if the lamp holder 16 needs to flip downward, the motor 9 needs to rotate in the opposite direction, driving the rotating ring 11 to rotate to the other side.

[0070] When the temperature sensor detects that the LED on one of the facets of the spotlight 12 has reached the specified temperature, the control system of the detection equipment controls the circular tube electromagnet X-SFT-2437L-01 to be energized, so that it pulls the first rack plate 20 to move and compresses the compression spring on one side. The moving first rack plate 20 drives the toothed ring meshing with it to rotate. The rotating toothed ring drives the ratchet 19 fixed with it to rotate. Because the ratchet 19 is a unidirectional rotating component, the ratchet 19 can drive the spotlight to rotate at this time, so that the spotlight 12 can rotate to change different irradiation surfaces, so that the generated temperature will not cause the glass plate on the placement rack to deform and affect the light path refraction.

[0071] By adjusting the illumination angle of the spotlight 12, the refraction effect of light produced by different types of chips can be made the same. Adjusting the illumination surface of the spotlight 12 reduces the working environment temperature and prevents the glass plate on the placement rack from deforming and affecting the light path refraction. At the same time, when a lamp on one illumination surface is damaged, the other two illumination surfaces can be replaced for use. This ensures that the chip inspection equipment will not stop operating due to lamp damage during normal operation, thereby indirectly improving the detection efficiency of the fully automatic intelligent defect inspection equipment for semiconductor chips.

[0072] Example 3:

[0073] Of course, for manufacturers who have precise requirements for the angle of light illumination, the following parts can be used as alternatives: A micro motor is installed inside the rotating box 15, which drives the spotlight 12 to rotate. The micro motor can precisely drive the spotlight 12 to rotate, and the deflection angle of the spotlight 12 can be precisely controlled by the control chip. An electric telescopic rod is installed inside the mounting box 2, which drives the push frame 13 to rise. Since all four spotlights 12 need to be flipped, four electric telescopic rods connected to the spotlights 12 need to be installed. Using multiple electric telescopic rods, the angle of each spotlight 12 can be adjusted.

[0074] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fully automated intelligent defect detection device for semiconductor chips, comprising a mounting box (2), wherein a dark box (1) is fixedly mounted on the mounting box (2), an industrial camera (3) is fixedly mounted on the dark box (1), and a gripping device for gripping chips is mounted on one side of the mounting box (2); characterized in that, It also includes a refractive imaging device, which is installed inside the mounting box (2). The refractive imaging device includes a trapezoidal prism (21) and a lighting mechanism for illuminating the back of the chip. The top of the mounting box (2) has two opposing mounting slots. One of the mounting slots is equipped with a chip holder (4) in a ring shape, and the other mounting slot is equipped with an imaging glass plate (7). A refractive channel (8) connecting the two mounting slots is fixedly installed inside the mounting box (2). The trapezoidal prism (21) is installed inside the refractive channel (8). The dark box (1) An internally fixed light-blocking plate (5) is vertically placed to separate the two mounting slots, and the light-blocking plate (5) extends to the outer wall of the lens of the industrial camera (3). A light-blocking ring (6) is installed between the light-blocking plate (5) and the inner wall of the dark box (1) to prevent the light from the two sides from interfering with each other. The cross section of the trapezoidal prism (21) is an isosceles trapezoid, and the angle between its base and the hypotenuse is 45°, and the angle between its top and the hypotenuse is 135°. The area of ​​the two inclined surfaces of the trapezoidal prism (21) is larger than the area of ​​the mounting slot. The two inclined surfaces of the trapezoidal prism (21) are mirror-like, and the other surfaces are transparent glass. The placement frame (4) includes a fixed A first glass plate (402) is fixedly installed on its inner side. The top and bottom of the first glass plate (402) are provided with light-shielding rubber rings (401) that are fixedly installed with the placement frame (4). The lighting mechanism includes multiple lamp holders (16) set on the refraction channel (8). The multiple lamp holders (16) are distributed in a circumferential direction on the four sides of the refraction channel (8). Two opposing support blocks are installed on each of the four sides of the refraction channel (8). The lamp holders (16) are rotatably connected to the support blocks. Spotlights (12) are rotatably connected to the lamp holders (16). Multiple light-shielding rubber rings (401) are opened on the refraction channel (8). A light-transmitting window is provided, on which a second glass plate (17) is installed. A rotating assembly for driving the spotlight (12) to rotate is installed on the lamp holder (16). An angle adjustment assembly for pushing the lamp holder (16) to change its angle is installed on the refraction channel (8). The spotlight (12) is a triangular prism in shape. Each facet of the spotlight (12) is equipped with an LED light. When a temperature sensor installed in the mounting box (2) near the placement rack (4) detects that the LED light on one facet of the spotlight (12) has reached a specified temperature, the rotating assembly drives the spotlight (12) to rotate and change to different facets for illumination.The rotating assembly includes a rotating box (15) fixedly mounted on the lamp holder (16). A ratchet (19) fixedly mounted to the rotating shaft of the spotlight (12) is fixedly installed inside the rotating box (15), and a toothed ring is fitted around the ratchet (19). An electromagnet is fixedly installed inside the rotating box (15), and a first rack plate (20) meshing with the toothed ring is fixedly installed on one side of the electromagnet. A circular hole is opened on the lamp holder (16), and a limiting spring (161) is fixedly installed inside the circular hole. A groove is opened at one end of the spotlight (12), and the protrusion of the limiting spring (161) engages with the groove. The lighting mechanism illuminates the back of the chip on the placement rack (4), causing reflection from the back of the chip. The trapezoidal prism (21) images the reflected light onto the imaging glass plate (7), enabling the industrial camera (3) to simultaneously photograph and inspect the front of the chip on the placement rack (4) and the back of the chip projected onto the imaging glass plate (7).

2. The fully automated intelligent defect detection device for semiconductor chips according to claim 1, characterized in that: The angle adjustment assembly includes a pusher (13) that slides on the refraction channel (8). A small gear (23) is fixedly mounted on one side of the support block and is fixedly installed on the rotating shaft of the lamp holder (16). Multiple second rack plates (24) meshing with the small gear (23) are fixedly mounted on the pusher (13). A limiting support block (22) is fixedly mounted on the refraction channel (8). The limiting support block (22) has multiple sliding grooves, and a pusher plate (14) is slidably connected within each groove. One side of the device is fixedly installed with the push frame (13). The limiting support block (22) is fitted with a rotating ring (11) that is rotatably connected to it. The rotating ring (11) has a push groove. The push groove is slidably connected with a push column (18) that is fixedly installed with the push plate (14). The rotating ring (11) is fixedly installed with a plurality of evenly arranged teeth. The installation box (2) is fixedly installed with a motor (9). The output shaft of the motor (9) is fixedly installed with a large gear (10) that meshes with the teeth.

3. A fully automated intelligent defect detection device for semiconductor chips according to claim 1 or 2, characterized in that: The bottom of the spotlight (12) has multiple heat dissipation holes, and the overall brightness of each side of the spotlight (12) reaches more than 100,000 lux. Each LED is equipped with 3-4 different optical lenses or lenses.

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